CN212258908U - High-frequency-band gallium arsenide amplifier - Google Patents
High-frequency-band gallium arsenide amplifier Download PDFInfo
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- CN212258908U CN212258908U CN202021392602.3U CN202021392602U CN212258908U CN 212258908 U CN212258908 U CN 212258908U CN 202021392602 U CN202021392602 U CN 202021392602U CN 212258908 U CN212258908 U CN 212258908U
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- gallium arsenide
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- heating panel
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Abstract
The utility model discloses a gallium arsenide amplifier of high band belongs to the technical field of amplifier, specifically is a gallium arsenide amplifier of high band, including the bottom plate, bottom plate upside fixedly connected with base plate, base plate upside fixedly connected with heating panel, install gallium arsenide drive power amplifier, directional coupler, radio frequency analog attenuator, isolation filter, power detection temperature compensation circuit and signal transmitter on the heating panel, gallium arsenide drive power amplifier output is connected with the directional coupler input, the directional coupler output is connected with radio frequency analog attenuator input, radio frequency analog attenuator output is connected with isolation filter input, isolation filter is connected with power detection temperature compensation circuit input, power detection temperature compensation circuit output is connected with signal transmitter input, the fan is installed in the bottom plate left side, through the setting of fan, blow away the heat of heating panel, reduce the temperature on the heating panel, the heating panel heat absorption of being convenient for.
Description
Technical Field
The utility model relates to an amplifier technical field specifically is a gallium arsenide amplifier of high band.
Background
The amplifier is a device capable of amplifying the voltage or power of an input signal and is composed of a tube or a transistor, a power transformer and other electrical components. The device is used in various devices such as communication, broadcasting, radar, television, automatic control and the like. The high-frequency power amplifier is used in the final stage of the transmitter and is used for amplifying the power of the high-frequency modulated wave signal to meet the requirement of transmission power, and then radiating the high-frequency modulated wave signal to the space through the antenna, so that a receiver in a certain area can receive a satisfactory signal level and the communication of an adjacent channel is not interfered.
The existing gallium arsenide amplifier is inconvenient to fix and has general heat dissipation when being installed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a gallium arsenide amplifier of high frequency channel to when solving the current gallium arsenide amplifier installation that proposes in the above-mentioned background art, inconvenient fixed, and the general problem of thermal diffusivity.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a gallium arsenide amplifier of high band, includes the bottom plate, bottom plate upside fixedly connected with base plate, base plate upside fixedly connected with heating panel, install gallium arsenide drive power amplifier, directional coupler, radio frequency analog attenuator, isolation filter, power detection temperature compensation circuit and signal transmitter on the heating panel, gallium arsenide drive power amplifier output is connected with the directional coupler input, the directional coupler output is connected with radio frequency analog attenuator input, radio frequency analog attenuator output is connected with the isolation filter input, isolation filter is connected with power detection temperature compensation circuit input, power detection temperature compensation circuit output is connected with the signal transmitter input, the fan is installed in the bottom plate left side.
Preferably, the middle part of the heat dissipation plate is provided with a through hole.
Preferably, the edge of the bottom plate is provided with a mounting hole.
Preferably, the number of the mounting holes is four, and the four mounting holes are uniformly distributed.
Compared with the prior art, the beneficial effects of the utility model are that:
1) through the arrangement of the fan, the heat of the heat dissipation plate is blown away, the temperature on the heat dissipation plate is reduced, and the heat absorption of the heat dissipation plate is facilitated;
2) through the arrangement of the through holes, the contact area of the heat dissipation plate and air is increased, and the heat dissipation effect is further improved;
3) through the setting of mounting hole, be convenient for install fixedly the device.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: the device comprises a base plate 1, a mounting hole 2, a substrate 3, a through hole 4, a heat dissipation plate 5, a signal transmitter 6, a power detection temperature compensation circuit 7, an isolation filter 8, a radio frequency analog attenuator 9, a directional coupler 10, a gallium arsenide drive power amplifier 11 and a fan 12.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
referring to fig. 1, the present invention provides a technical solution: a gallium arsenide amplifier with high frequency band comprises a bottom plate 1, wherein a substrate 3 is fixedly connected to the upper side of the bottom plate 1, a heat dissipation plate 5 is fixedly connected to the upper side of the substrate 3, a gallium arsenide driving power amplifier 11, a directional coupler 10, a radio frequency analog attenuator 9, an isolation filter 8, a power detection temperature compensation circuit 7 and a signal transmitter 6 are installed on the heat dissipation plate 5, the heat dissipation plate 5 is connected with the input end of the directional coupler 10 through welding with the gallium arsenide driving power amplifier 11, the directional coupler 10, the radio frequency analog attenuator 9, the isolation filter 8, the power detection temperature compensation circuit 7 and the signal transmitter 6, the output end of the gallium arsenide driving power amplifier 11 is connected with the input end of the directional coupler 10, signals are received through the gallium arsenide driving power amplifier 11, the output end of the directional coupler 10 is connected with the input end of the radio frequency analog attenuator 9, the, the isolation filter 8 is connected with the input end of the power detection temperature compensation circuit 7, the output end of the power detection temperature compensation circuit 7 is connected with the input end of the signal transmitter 6, signals are transmitted to an external device through the signal transmitter 6, and the fan 12 is installed on the left side of the bottom plate 1.
Through-hole 4 has been seted up at heating panel 5 middle part, through the setting of through-hole 4, improves the area of contact of heating panel 5 and air, improves the radiating effect.
Mounting hole 2 has been seted up to 1 edge of bottom plate, through the setting of mounting hole 2, is convenient for install fixedly the device.
The number of the mounting holes 2 is four, and the four mounting holes 2 are uniformly distributed.
The working principle is as follows: high frequency signal transmits for gallium arsenide drive power amplifier 11, gallium arsenide drive power amplifier 11 transmits the signal for directional coupler 10 in proper order, radio frequency analog attenuator 9, isolation filter 8, power detection temperature compensation circuit 7, signal transmission device 6 transmits the signal after amplifying for external device, setting through fan 12, blow away the heat of heating panel 5, reduce the temperature on the heating panel 5, the heating panel 5 of being convenient for absorbs heat, setting through-hole 4, improve the area of contact of heating panel 5 and air, further improve the radiating effect, setting through mounting hole 2, be convenient for install fixedly to the device.
Having shown and described the basic principles and principal features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A high-band gallium arsenide amplifier comprising a base plate (1), characterized in that: the bottom plate (1) upside fixedly connected with base plate (3), base plate (3) upside fixedly connected with heating panel (5), install gallium arsenide drive power amplifier (11), directional coupler (10), radio frequency analog attenuator (9), isolation filter (8), power detection temperature compensation circuit (7) and signal transmitter (6) on heating panel (5), gallium arsenide drive power amplifier (11) output is connected with directional coupler (10) input, directional coupler (10) output is connected with radio frequency analog attenuator (9) input, radio frequency analog attenuator (9) output is connected with isolation filter (8) input, isolation filter (8) are connected with power detection temperature compensation circuit (7) input, power detection temperature compensation circuit (7) output is connected with signal transmitter (6) input, and a fan (12) is arranged on the left side of the bottom plate (1).
2. The high band gallium arsenide amplifier of claim 1 wherein: the middle part of the heat dissipation plate (5) is provided with a through hole (4).
3. The high band gallium arsenide amplifier of claim 1 wherein: the edge of the bottom plate (1) is provided with a mounting hole (2).
4. A high band gaas amplifier according to claim 3, wherein: the number of the mounting holes (2) is four, and the four mounting holes (2) are uniformly distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021392602.3U CN212258908U (en) | 2020-07-15 | 2020-07-15 | High-frequency-band gallium arsenide amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021392602.3U CN212258908U (en) | 2020-07-15 | 2020-07-15 | High-frequency-band gallium arsenide amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212258908U true CN212258908U (en) | 2020-12-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021392602.3U Active CN212258908U (en) | 2020-07-15 | 2020-07-15 | High-frequency-band gallium arsenide amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212258908U (en) |
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2020
- 2020-07-15 CN CN202021392602.3U patent/CN212258908U/en active Active
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