CN107124834A - A kind of scattered component attaching method gathered based on area image - Google Patents

A kind of scattered component attaching method gathered based on area image Download PDF

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Publication number
CN107124834A
CN107124834A CN201710161586.3A CN201710161586A CN107124834A CN 107124834 A CN107124834 A CN 107124834A CN 201710161586 A CN201710161586 A CN 201710161586A CN 107124834 A CN107124834 A CN 107124834A
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CN
China
Prior art keywords
component
attachment
information
attaching method
region
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Pending
Application number
CN201710161586.3A
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Chinese (zh)
Inventor
赵永先
张延忠
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Taimurui (beijing) Precision Technology Co Ltd
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Taimurui (beijing) Precision Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Taimurui (beijing) Precision Technology Co Ltd filed Critical Taimurui (beijing) Precision Technology Co Ltd
Priority to CN201710161586.3A priority Critical patent/CN107124834A/en
Publication of CN107124834A publication Critical patent/CN107124834A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/002Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process

Abstract

The invention discloses a kind of scattered component attaching method gathered based on area image, by the way that the component to be mounted of bulk cargo state is arbitrarily placed in region to be mounted, pass through the comparative analysis taken pictures with later image of the camera in region to be mounted, draw the distribution situation and situation information of each component to be mounted in the region, confirm after the component to be mounted that can use, complete follow-up accurate pickup and mount.This method realizes quick, the accurate attachment of bulk cargo, it is to avoid relies on manual, simplifies charging process, improve attachment efficiency.

Description

A kind of scattered component attaching method gathered based on area image
Technical field
It is more particularly to a kind of to meet scattered component attachment, base the present invention relates to a kind of attaching method of chip mounter The attaching method gathered in area image, belongs to surface mounting technology field.
Background technology
In surface mount field, the attachment process of component mainly includes:The IMAQ of component to be mounted, knowledge Not, pick up, mount the IMAQ of position, judge, and the position compensation in attachment and last attachment.Wherein, IMAQ Refer to that absorbing optical imagery by video camera, camera etc. is sent to image pick-up card, is sticked into by IMAQ with identification technology Digitized processing, forms digital image data, is used for downstream process and provides help.In pick process, first device to be mounted Part is fed in the way of material strip, and feed position is single, fixed, and component to be mounted is put neatly, is not in crooked, positive and negative The problems such as anisotropy, mounting head IMAQ when picking up component to be mounted is a point target, and kind is unique, and target is special Levy consistent, pick process need to only carry out simple point target image collection and position judgment, you can complete component to be mounted Pickup.This mode, is adapted to single variety, high-volume, the attachment for concentrating the component being fed, attachment efficiency high, placement speed It hurry up.
With the increase of mounted board application, in some special industries, such as batch test less, more than species and Model is drawn a design industry, and attachment is required and in component stability requirement very high military industry, its mainly for Bulk cargo is mounted.Existing chip mounter when bulk cargo is mounted except using by hand one by one, by the way of fixed point puts component to be mounted Outside, it can only use and first be arranged on bulk cargo in material strip, be then fed, mounted by material strip again, both modes are not only grasped Make cumbersome, efficiency is low, and inconvenient for use, it is impossible to give full play to chip mounter it is efficient, accurately mount performance, it is impossible to meet increasingly The bulk cargo attachment of expansion needs.
Process is mounted for convenience of bulk cargo, component disperse in a region, the irregular distribution in locus is realized IMAQ, identification, pickup and attachment, design a kind of scattered component attaching method of novel concept, just think as the present invention The problem of solving.
The content of the invention
In view of the deficiency that above-mentioned prior art is present, the present invention is intended to provide one kind can be in a region, to irregular The scattered component put carries out sharp picture collection and position identification, and realizes on the basis of based on chip mounter scattered first device Efficient, the accurate attachment of part, to meet quick attachment needs of some industries to scattered component.
To solve the above problems, the key of the present invention is the figure in certain area to the irregular scattered component put As collection and position identification, its technical problem to be solved includes two:First, how to collect and clearly scheme in a region Picture, and the identification needs of later stage component can be met;2nd, the component that how to judge, can mount in identification region, and accurately obtain The positional information of component can be mounted by obtaining.
In order to identification demand, it is necessary to different image capture environments be designed on scattered component mounting device, if not Same light-source brightness, different light-source angles, light source of different colours etc..In area image gatherer process, according to different members The identification demand of device, it is therefore possible to use the light source of same brightness difference angle is repeatedly taken pictures, also can be using different brightness not Taken pictures with light-source angle, in a word by the brightness of light source, angle, any combination of color, realize different identification demands.
To judge, identification can mount component, it is necessary to dimension information, appearance color information, pole to component to be mounted Property information even reflect information etc. and carry out advance typing and storage, provide help for later stage contrast, identification process.
The present invention is achieved through the following technical solutions:
A kind of scattered component attaching method gathered based on area image, specific steps are included:
Step 1, on the mounting head of chip mounter set the camera of different colours to take pictures secondary light source, and secondary light source is subjected to square Configuration or annular array.
Step 2, the control that the essential information typing of the component to be mounted of all categories or program are imported into chip mounter Center.
Step 3, different, bulk cargo state component to be mounted is put into a region to be mounted;Or, by bulk cargo The component to be mounted of state is respectively put into by species in different regions to be mounted.
When step 4, attachment, according to the essential information of component to be mounted, using secondary light source to prepare attachment wait paste Fill the component to be mounted in region and carry out 3-dimensional irradiation, camera carries out region to the region to be mounted for preparing attachment and taken pictures, and Image information is sent in image pick-up card and handled, the digital picture image of each component to be mounted needed for being formed Information.
Step 5, control centre are basic according to the digital picture image information after processing and the component to be mounted of typing Information is compared, and the component to be mounted for meeting similarity requirement is confirmed to be workable component to be mounted and marked It is fixed.
Step 6, control centre carry out position calculating to demarcation, workable component to be mounted, show that this is to be mounted The center position coordinates of component, and be correspondingly deposited into control centre.
Step 7, mounting head are believed according to demarcation, workable component title to be mounted and the center position coordinates of storage Breath carries out the pickup of corresponding component to be mounted, is taken pictures through circuit board position with after component locations to be mounted compensation, attachment is arrived On the correspondence position of circuit board, completion once mounts process.
Step 8, repeat the above steps 7, until all demarcation, workable components attachment to be mounted completes.
Step 9, such as there is next region to be mounted, go to next region to be mounted and repeat the above steps 4-8, until Demarcation, workable component attachment to be mounted is completed.
A kind of scattered component attaching method gathered based on area image, in addition to step 10-1, removing area to be mounted The component to be mounted that can not be used in domain, repeat the above steps 3-9, until all attachment process is completed.
A kind of scattered component attaching method gathered based on area image, in addition to step 10-2, using vibrating, shake Put, reappose or turning device treats the component to be mounted that can not be used in pasting area and carries out Position disturbance, make its position The 4-9 that repeated the above steps after redistribution is put, until all attachment process is completed.
The essential information includes:The species of component to be mounted, title, apparent size, whether polarized and outward appearance face Color information, and the contour similarity of component to be mounted is set.
In the step 4, larger different bright of contrast is selected according to the appearance color information of the component to be mounted of typing Degree light source carries out repeatedly irradiation and taken pictures;Or taken pictures using the light source of different colours, the color of light source is more than one.
In the step 4, control centre controls the secondary light source of different angles to carry out the 3-dimensional irradiation of multi-angle combination simultaneously Take pictures;The mode of the 3-dimensional irradiation is more than one.
In the step 4, correspondence is carried out according to the mode of 3-dimensional irradiation and the color of light source and taken pictures;The camera is taken pictures Number of times for more than once.
The step 5 is specifically included:
Step 501, control centre draw the outer of wherein each component to be mounted according to the digital picture image information after processing Overall size information, and be compared with the apparent size information in the component essential information to be mounted of typing, meet wheel The progress of wide similarity requirement is recorded.
Step 502, meet having recorded contour similarity requirement component to be mounted handle after image light and shade Degree judges, determines the positive and negative direction of the component to be mounted, records positive component to be mounted.
Step 503, according in the component essential information to be mounted of typing whether the feature of polarized, to positive The judgement of image polarities characteristic point after component to be mounted is handled, polar character point is judicious confirm as it is workable Component to be mounted is simultaneously calibrated.
The bottom that the region to be mounted of component to be mounted is put into the step 3 is made up of extinction transparent material.
A kind of beneficial effect of scattered component attaching method gathered based on area image of the present invention is included:
1st, gathered by area image, the component to be mounted for realizing a variety of, multiple bulk cargo states is accurately identified, and is the later stage It is convenient that quick pick-up and attachment are provided.
2nd, simplifying conventional attachment process needs feed by hand, or, using the cumbersome, poorly efficient of the charging attachment of material strip again Process, improves attachment efficiency, it is ensured that mounting quality.
3rd, it is combined with the irradiation of many color secondary light sources and a variety of 3-dimensional irradiation modes, multiple effects is formed by repeatedly taking pictures The pictorial information of fruit, for the identification of component to be mounted is provided and is effectively ensured one by one in picture.
4th, by storing the essential information of all categories component to be mounted, as basis is compared, after collection, processing Component information to be mounted in picture is compared, it is convenient to realize species and the position identification of component to be mounted, shape Into effective, reliable center position coordinates information and outer profile size information, foundation is provided for accurate pickup.
5th, this method can effectively recognize the letters such as the direction of the component to be mounted at random put, positive and negative, crooked, polarity direction Breath, meets the pickup requirement of component to be mounted.
6th, by vibrating, waving or turning device treats the component to be mounted that can not be used in pasting area and carries out position Interference, can also re-start the spatial arrangements of component to be mounted, simplify charging process, improve attachment efficiency.
Embodiment
The center of the present invention is:By the way that the component to be mounted of bulk cargo state is arbitrarily placed in region to be mounted, lead to The comparative analysis taken pictures with later image of the camera in region to be mounted is crossed, the distribution situation of each component to be mounted is drawn With situation information, confirm after the component to be mounted that can use, complete follow-up accurate pickup and mount.And can not pick up Take or positional information mistake bulk cargo then by replacing or Position disturbance after, re-start and take pictures, pick up, facilitate the fast of bulk cargo Fast attachment process.
A kind of scattered component attaching method gathered based on area image of the present invention, specific steps are included:
Step 1, on the mounting head of chip mounter set the camera of different colours to take pictures secondary light source, and secondary light source is subjected to square Configuration is arranged.
Secondary light source can use the LED of bull, and it can form different illumination colors by the color control of itself, such as Red, yellow, white, blueness, green etc..To form 3-dimensional irradiation effect, secondary light source is carried out using the matrix-style of rule Arrangement, or can also be arranged using irregular matrix-style, circular pattern, to form omnirange, multi-angle auxiliary irradiation.
Step 2, the control centre that the essential information of the component to be mounted of all categories is entered into chip mounter.
Because the later stage needs to recognize every class component to be mounted one by one, to establish criterion of identification, needed before attachment The component essential information to be mounted of all categories is entered into control centre.Wherein, essential information includes:Member to be mounted The species of device, title, apparent size, whether polarized, appearance color information and similar to the profile of component to be mounted Degree setting.Appearance color information is used to determine the color of secondary light source during irradiation, to form good contrast effect, makes shooting Image content it is apparent.Whether the setting of polarized can for distinguishing the species of component to be mounted, meanwhile, can also be to sentence The direction of disconnected component to be mounted provides help.And the setting of contour similarity is an empirical value, the size of its value by with It is finally to confirm to wait to paste in the profile similarity degree for judging certain component to be mounted of component to be mounted and typing in picture Fill component and valuable help is provided.
Step 3, the component to be mounted of bulk cargo state is respectively put into by species in different regions to be mounted.
Multiple regions to be mounted can once carry out putting for a variety of components to be mounted, add feed species, simplify Renewal process, meanwhile, identification process is simple.Certainly, different, bulk cargo state component to be mounted can be also put into simultaneously Into a region to be mounted, by the taking pictures of later stage, recognize, to distinguish various components to be mounted.
To be formed to ensure in good effect of taking pictures, this example, the bottom for being put into the region to be mounted of component to be mounted is Extinction transparent material is made, such as:Extinction hyaline membrane or extinction semi-transparent film etc..It is to be mounted when making to take pictures by extinction process Component surface produces good shaded effect, forms clearly appearance profile image.
When step 4, attachment, according to the essential information of component to be mounted, using secondary light source to prepare attachment wait paste Fill the component to be mounted in region and carry out 3-dimensional irradiation, camera carries out region to the region to be mounted for preparing attachment and taken pictures, and Image information is sent in image pick-up card and handled, the digital picture image of each component to be mounted needed for being formed Information.
To reach good effect of taking pictures, provide convenient for later stage comparison process, in specific take pictures in the following ways The image effect enhancing in material direction is carried out, is specifically included:
1st, it is irradiated according to the larger secondary light source color of the appearance color information of the component to be mounted of typing selection contrast Take pictures, when specifically taking pictures, a kind of light source colour can be selected to be taken pictures as needed, can also be carried out using the light source of multiple color Repeatedly take pictures, to form good image comparison effect.
Certainly, it is the larger photo that presents a contrast, also can be irradiated and take pictures using the secondary light source of different brightness, with Form significantly bright contrast effect.
2nd, control centre forms multi-angle knot by controlling matrix arrangement, different angles secondary light source to be irradiated The 3-dimensional irradiation effect of conjunction, improves the comparative of picture shading or reflecting effect, for further determine that bulk cargo state, it is to be mounted The space of component and position relationship provide help.Wherein, the mode of 3-dimensional irradiation can be one or more, take pictures accordingly Number of times is also to be one or many.
The processing of image pick-up card is mainly completed in a software form, and it includes common enhancing processing, normalization, contrast Degree processing etc. conventional picture processing mode, simply final result need to obtain the digital picture of each component to be mounted in picture Image information, help is provided for the comparison one by one in later stage.
Step 5, control centre are basic according to the digital picture image information after processing and the component to be mounted of typing Information is compared, and the component to be mounted for meeting similarity requirement is confirmed to be workable component to be mounted and marked It is fixed.Its detailed process includes:
Step 501, control centre draw the outer of wherein each component to be mounted according to the digital picture image information after processing Overall size information, and be compared with the apparent size information in the component essential information to be mounted of typing, meet wheel The progress of wide similarity requirement is recorded, and does not meet contour similarity requirement, then it is assumed that its position is crooked or is superimposed, and is not belonging to Workable component to be mounted.
Step 502, meet having recorded contour similarity requirement component to be mounted handle after image light and shade Degree judges, determines the positive and negative direction of the component to be mounted, records positive component to be mounted, and reverse member to be mounted Device is finally abandoned due to that can not mount.
Step 503, according in the component essential information to be mounted of typing whether the feature of polarized, to positive The judgement of image polarities characteristic point after component to be mounted is handled, polar character point is judicious confirm as it is workable Component to be mounted is simultaneously calibrated.
Polar character point is fixed and with reflective due to position, so, it can be treated according to this feature in picture Mount component and carry out the judgement of polarity and polar orientation, so as to be finally completed the judgement of workable component to be mounted.
Step 6, control centre carry out position calculating to demarcation, workable component to be mounted, show that this is to be mounted The center position coordinates of component, and be correspondingly deposited into control centre.
Because the outer profile size information of demarcation, workable component to be mounted has been drawn, so according to simple Geometry is calculated, so that it may draw the center position coordinates of the component to be mounted, is to carry out component pickup according to this coordinate in the later stage There is provided foundation.
Step 7, mounting head are believed according to demarcation, workable component title to be mounted and the center position coordinates of storage Breath carries out the pickup of corresponding component to be mounted, is taken pictures through circuit board position with after component locations to be mounted compensation, attachment is arrived On the correspondence position of circuit board, completion once mounts process.
During this, position compensation is based primarily upon position compensation function of the existing Placement head when being mounted, Required with meeting final attachment, eliminate the position deviation that pick process is produced, it is ensured that the accurate attachment with circuit board.
Step 8, repeat the above steps 7, until prepare it is in the region to be mounted of attachment, all demarcation, it is workable Component attachment to be mounted is completed.
Step 9, such as there is next region to be mounted, go to next region to be mounted and repeat the above steps 4-8, until Demarcation, workable component attachment to be mounted is completed.
To realize that industrial serialization is carried out, and solve actual attachment and need, it is that attachment is required, no to not meeting The component to be mounted in region to be mounted that can be used can also carry out following steps:
The component to be mounted that can not be used in step 10, removing region to be mounted, repeat the above steps 3-9, until all patches Dress process is completed.Or, using vibrating, wave, reappose or turning device is treated waiting of can not being used in pasting area and pasted Fill component and carry out Position disturbance, make the 4-9 that repeated the above steps after the redistribution of its position, until all attachment processes are completed.
So far, the component to be mounted of whole bulk cargo state is completed by attachment, and its mode realizes the quick patch of chip mounter Dress, simplifies attachment process, improves attachment efficiency.

Claims (9)

1. a kind of scattered component attaching method gathered based on area image, it is characterised in that specific steps include:
Step 1, on the mounting head of chip mounter set the camera of different colours to take pictures secondary light source, and secondary light source is subjected to square Configuration or annular array;
Step 2, the control centre that the essential information typing of the component to be mounted of all categories or program are imported into chip mounter;
Step 3, different, bulk cargo state component to be mounted is put into a region to be mounted;Or, by bulk cargo state Component to be mounted be respectively put into by species in different regions to be mounted;
When step 4, attachment, according to the essential information of component to be mounted, using to be mounted area of the secondary light source to preparation attachment Component to be mounted in domain carries out 3-dimensional irradiation, and camera carries out region to the region to be mounted for preparing attachment and taken pictures, and will figure As information transmission is handled into image pick-up card, the digital picture image letter of required each component to be mounted is formed Breath;
Step 5, control centre are according to the digital picture image information after processing and the component essential information to be mounted of typing It is compared, the component to be mounted for meeting similarity requirement is confirmed to be workable component to be mounted and is calibrated;
Step 6, control centre carry out position calculating to demarcation, workable component to be mounted, draw first device to be mounted The center position coordinates of part, and be correspondingly deposited into control centre;
Step 7, mounting head enter according to the center position coordinates information of demarcation, workable component title to be mounted and storage The pickup of the corresponding component to be mounted of row, takes pictures with after component locations to be mounted compensation, circuit is arrived in attachment through circuit board position On the correspondence position of plate, completion once mounts process;
Step 8, repeat the above steps 7, until all demarcation, workable components attachment to be mounted completes;
Step 9, such as there is next region to be mounted, go to next region to be mounted and repeat the above steps 4-8, until demarcation , workable component to be mounted attachment completes.
2. a kind of scattered component attaching method gathered based on area image according to claim 1, it is characterised in that Also include:
The component to be mounted that can not be used in step 10-1, removing region to be mounted, repeat the above steps 3-9, until all Attachment process is completed.
3. a kind of scattered component attaching method gathered based on area image according to claim 1, it is characterised in that Also include:
Step 10-2, using vibrating, wave, reappose or turning device treats the member to be mounted that can not be used in pasting area Device carries out Position disturbance, makes the 4-9 that repeated the above steps after the redistribution of its position, until all attachment processes are completed.
4. a kind of scattered component attaching method gathered based on area image according to claim 1,2 or 3, its feature It is, the essential information includes:The species of component to be mounted, title, apparent size, whether polarized and appearance color letter Breath, and the contour similarity of component to be mounted is set.
5. a kind of scattered component attaching method gathered based on area image according to claim 1,2 or 3, its feature It is, in the step 4, the larger different brightness light of contrast is selected according to the appearance color information of the component to be mounted of typing Source carries out repeatedly irradiation and taken pictures;Or taken pictures using the light source of different colours, the color of light source is more than one.
6. a kind of scattered component attaching method gathered based on area image according to claim 1,2 or 3, its feature It is, in the step 4, control centre controls the secondary light source of different angles to carry out 3-dimensional irradiation and the bat of multi-angle combination According to;The mode of the 3-dimensional irradiation is more than one.
7. a kind of scattered component attaching method gathered based on area image according to claim 1,2 or 3, its feature It is, in the step 4, correspondence is carried out according to the mode of 3-dimensional irradiation and the color of light source and taken pictures;What the camera was taken pictures Number of times is more than once.
8. a kind of scattered component attaching method gathered based on area image according to claim 1,2 or 3, its feature It is, the step 5 is specifically included:
Step 501, control centre draw the outer of wherein each component to be mounted according to the digital picture image information after processing Overall size information, and be compared with the apparent size information in the component essential information to be mounted of typing, meet wheel The progress of wide similarity requirement is recorded;
Step 502, meet having recorded contour similarity requirement component to be mounted handle after image intensities sentence It is disconnected, the positive and negative direction of the component to be mounted is determined, positive component to be mounted is recorded;
Step 503, according in the component essential information to be mounted of typing whether the feature of polarized, wait to paste to positive The judgement of image polarities characteristic point after dress component is handled, polar character point is judicious to be confirmed as workable waiting to paste Dress component is simultaneously calibrated.
9. a kind of scattered component attaching method gathered based on area image according to claim 1,2 or 3, its feature It is, the bottom that the region to be mounted of component to be mounted is put into the step 3 is made up of extinction transparent material.
CN201710161586.3A 2017-03-17 2017-03-17 A kind of scattered component attaching method gathered based on area image Pending CN107124834A (en)

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Publication number Priority date Publication date Assignee Title
CN109731793A (en) * 2018-12-17 2019-05-10 上海航天电子有限公司 A kind of small lot chip bulk cargo device intelligent sorting equipment
CN111104542A (en) * 2020-01-07 2020-05-05 成都睿琪科技有限责任公司 Part identification management method and device

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CN104768363A (en) * 2015-04-09 2015-07-08 苏州辉隆自动化设备有限公司 Component recognizing and positioning device and fully-automatic inserting machine
CN106304829A (en) * 2016-10-26 2017-01-04 中国科学院长春光学精密机械与物理研究所 A kind of scattered or short braid components and parts mount pallet automatically

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JPH10180437A (en) * 1996-12-20 1998-07-07 Fujitsu General Ltd Soldering inspection device
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CN101887025A (en) * 2009-05-12 2010-11-17 宰体有限公司 Vision inspection apparatus and visible detection method thereof
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Publication number Priority date Publication date Assignee Title
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CN111104542A (en) * 2020-01-07 2020-05-05 成都睿琪科技有限责任公司 Part identification management method and device
CN111104542B (en) * 2020-01-07 2023-04-18 成都睿琪科技有限责任公司 Part identification management method and device

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