CN107122329B

CN107122329B - General high-integration computer processing module

Info

Publication number: CN107122329B
Application number: CN201710305110.2A
Authority: CN
Inventors: 徐晓云; 何刚; 史培; 李路; 王再兴; 钱乐
Original assignee: Beijing Siasun Jiahe Control Co ltd
Current assignee: Beijing Siasun Jiahe Control Co ltd
Priority date: 2017-05-03
Filing date: 2017-05-03
Publication date: 2020-10-09
Anticipated expiration: 2037-05-03
Also published as: CN107122329A

Abstract

The embodiment of the invention discloses a general high-integration computer processing module. The high integration computer processing module comprises a printed circuit board; a CPU chip and a random access memory on the front side of the printed circuit board; wherein the width of the printed circuit board is 80 mm. The high-integration computer processing module provided by the embodiment of the invention has high size and universality and is suitable for various industrial control carrier plates.

Description

General high-integration computer processing module

Technical Field

The invention relates to the technical field of computers, in particular to a general high-integration computer processing module.

Background

The degree of integration of existing integrated circuits is becoming higher and higher. It is a goal of integrated circuit development to implement as many functions as possible in as little space as possible. For example, COM Express modules are such high integration computer processing modules. In order to address different application carrier boards, a high-integration computer processing module with the same function is developed into multiple versions. Also taking COM Express modules as an example, there are 4 versions of COM Express modules with the same function. However, many versions pose problems for developers of highly integrated computer processing modules. Developers need to develop 4 different versions of highly integrated computer processing modules for the same function. This increases the development cost and is also easily wasteful.

Disclosure of Invention

The invention aims to provide a general high-integration computer processing module.

According to an aspect of an embodiment of the present invention, there is provided a high-integration computer processing module including a printed circuit board; and the CPU chip and the random access memory are arranged on the front surface of the printed circuit board. In an embodiment of the invention, the width of the printed circuit board is 80 mm.

In an alternative embodiment of the invention the length of the printed circuit board is in the range of 90-140 mm. In a preferred embodiment, the length of the printed circuit board is in the range of 90-115 mm. In a further preferred embodiment the length of the printed circuit board is in the range of 90-95 mm. In one embodiment, the length of the printed circuit board is 90 mm.

In an alternative embodiment of the invention, the printed circuit board includes wiring lines that provide only a 5V supply voltage and supply to functional chips on the printed circuit board that require the supply voltage.

In an alternative embodiment of the invention, the high integration computer processing module further comprises an inter-board connector disposed on a back side of the printed circuit board. The board-to-board connector receives a 5V power supply voltage and supplies it to wiring lines of the printed circuit board.

In an alternative embodiment of the invention, the processing module further comprises a power supply module integrated on the front side of the printed circuit board, the power supply module being configured to generate a supply voltage of 5V and to supply the supply voltage to the wiring lines of said printed circuit board.

According to another aspect of the embodiments of the present invention, there is also provided a processor board card, including: a high integration computer processing module, the processing module comprising a printed circuit board; a CPU chip and a random access memory, which are arranged on the front surface of the printed circuit board; and an inter-board connector provided on a back surface of the printed circuit board; wherein the width of the printed circuit board is 80 mm. In addition, the processing module further comprises an application carrier board which is provided with a connecting interface and is electrically connected with the connector between boards.

In an alternative embodiment of the present invention, the application carrier includes: a power module configured to generate a system power supply; and a voltage conversion circuit configured to convert the system power supply provided by the power supply module into a 5V power supply voltage and provide the 5V power supply voltage to the connection interface; wherein the inter-board connector receives a 5V power supply voltage from the connection interface and supplies the same to the wiring lines of the printed circuit board.

In an alternative embodiment of the invention, the processing module further comprises a power supply module arranged on said front side of said printed circuit board and configured to generate a 5V supply voltage. The general high-integration computer processing module can replace various conventional COM Express modules to be applied to various industrial control carrier plates, so that the development cost of industrial application using the computer processing module can be reduced, and the development efficiency can be improved.

Drawings

Various aspects of the disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It is noted that, in accordance with standard practice in the industry, various components are not drawn to scale.

FIG. 1 shows a front view of a highly integrated computer processing module according to one embodiment of the invention.

FIG. 2 is a schematic diagram of a back side structure of the high-integration computer processing module of one embodiment shown in FIG. 1.

Fig. 3 is an embodiment of the high-density computer processing module shown in fig. 1 and 2 applied to an industrial control carrier according to an embodiment of the present invention.

Fig. 4 is a block diagram of an embodiment in which the high-density computer processing module shown in fig. 1 and 2 is applied to a 3UCPCI/VPX carrier board according to an embodiment of the present invention.

Fig. 5 is a schematic diagram illustrating the principle of supplying power to a computer processing module through an inter-board connector by using a carrier board according to an embodiment of the present invention.

Detailed Description

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and method steps are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. It should be appreciated that the subject matter disclosed herein is capable of being applied in a wide variety of forms and that any specific structure and/or function disclosed herein is merely illustrative. Based on the teachings herein one skilled in the art should appreciate that an aspect disclosed herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways.

The invention integrates the characteristics of the existing different types of high-integration computer processing modules, carries out brand-new design on the high-integration computer processing modules, and provides a universal high-integration computer processing module suitable for different types of carrier plates. The general high-integration computer processing module can replace all the existing high-integration computer processing modules.

The technical scheme of the invention is detailed below by taking the COM Express module as a comparison. Those skilled in the art will appreciate that the solution of the invention is suitable for general purpose highly integrated computer processing modules.

FIG. 1 shows a front view of a highly integrated computer processing module according to one embodiment of the invention. As shown in fig. 1, the computer processing module 10 includes a printed circuit board 12, a CPU chip 14 integrated on a front side of the printed circuit board, and a memory stick 16 integrated on the front side of the printed circuit board.

Also integrated on the printed circuit board 12 is a power module 18 configured to provide operating voltages to the devices on the printed circuit board 12. Other devices integrated on the printed circuit board 12, such as a chipset 11, a sound card 13, and a power management module 17, may also be included on the processing module 10.

FIG. 2 is a schematic diagram of a back side structure of a high-integration computer processing module according to one embodiment shown in FIG. 1. As shown in fig. 2, the processing module 10 may also include a board-to-board connector 20 that is typically integrated on the back side of the printed circuit board 12. In an alternative embodiment, the board-to-board connector may also be integrated on the front side of the printed circuit board 12. In one embodiment, the board-to-board connectors 20 may be selected from the model number TE 3-6318490-6 connectors manufactured by Thailand corporation and have a pin count of 220. The pins of the board-to-board connector may be divided into a plurality of functional areas including, but not limited to, a high-speed signal area, an analog display area, a digital display area, a user-defined I/O area, and a power supply area. According to an example of the present invention, the functional area of the board-to-board connector 20 may vary depending on the particular application environment. For example, the number of the defined pins of the power supply area can be increased or decreased according to specific situations. The high-speed signal area, the display signal area and the user-defined I/O area can redefine the functions of the pins according to the practical application condition. In another embodiment, the board-to-board connectors may be selected from the SFE/TFM family of connectors manufactured by SAMTEC corporation. It will be appreciated by a person skilled in the art that the specific types of board-to-board connectors described above are given only to facilitate a better understanding of embodiments of the invention and are not limited to the above described board-to-board connectors, but that other types of board-to-board connectors may be used. In an embodiment of the present invention, the processing module is electrically connected to the application carrier board through the inter-board connector, and the application carrier board is provided with an I/O port electrically connected to an I/O area of the inter-board connector and a display port electrically connected to a display area of the inter-board connector.

The heat dissipation performance of the COM Express module is also a critical factor in considering whether the COM Express module is available. The COM Express module has the heat dissipation problem when the size and the device density are not suitable, the space size is small, the heat dissipation space is necessarily limited, and therefore the performance of a CPU is affected due to the fact that heat cannot be dissipated, and the use of an end user is further affected. Therefore, to ensure heat dissipation and proper operation of the module, both the size of the COM Express module and the arrangement of devices on the COM Express module are often of particular concern.

The general-purpose high-integration computer processing module is completely new in size. Furthermore, on the basis of brand-new size design, the invention adopts brand-new design in the aspect of power supply, thereby not only solving the problems of power supply and heat dissipation under limited size, but also keeping the flexibility of the device arrangement on the processing module.

Firstly, in the aspect of size design:

according to one embodiment of the present invention, the general-purpose high-integration computer processing module provided by the embodiment of the present invention has a width of 80mm and a length of 90mm to 140mm (i.e. 80mm x 90mm to 140 mm). According to a preferred embodiment of the present invention, the general-purpose high-integration computer processing module is sized to be 80mm x 90mm to 115 mm; more preferably 80mmx 90mm to 95 mm; most preferably 80mm x 90 mm.

To meet the requirements suitable for mounting to different types and sizes of application boards, existing COM Express modules include the following dimensions:

(1) mini type (55mm x84 mm);

(2) compact type (95mm x95 mm);

(3) basic (95mm x125mm) type; and

(4) the Extended model (110mm x115mm) is expanded into 4 sizes.

In practical use, the basic COM Express module is most widely used. However, the basic type COMExpress module cannot be applied to the 3U CPCI main board and the 3U VPX main board. The 3U CPCI motherboard size is 100mmx160 mm. The actual width is far from 100mm and only 84mm according to the conventional consideration of plate edge reinforcement. The width of the compact COM Express module is consistent with that of the basic COM Express module, so that the compact COM Express module cannot be applied to a 3U CPCI mainboard and a 3U VPX mainboard.

The size of the mini COM Express module is dominant in a narrow space, and it can be applied to 3UCPCI motherboard and 3U VPX motherboard. However, the selection of the CPU is greatly limited by various factors such as heat dissipation. The mini COM Express module is not substantially selected unless the particular application. Taking Intel's CPU as an example, building a minimum computer system requires three blocks, namely CPU, memory, and power. However, the 55mm x84mm of mini COM Express modules are already not enough space for CPU and memory only, and even more, the board-to-board connector of the COM Express modules itself occupies a part of the space.

The width of the universal high density computer processing module of the present invention is defined as 80mm after considering the size of the inter-board connector, the structural member installation, the manufacturability, and the maximum use of space. In terms of length, the length of the general-purpose high-density computer processing module of the present invention is defined as a minimum of 90 mm. In the case of a DDR3 memory socket of 78.5mm in length, the 90mm length leaves the necessary space for structural aperture reinforcement and manufacturing redundancy for high density computer processing modules.

Taking an embodiment of 80mm x 90-95mm as an example, the general high-integration computer processing module can completely replace Compact type, Basic type and Extended type COM Express modules, and can also be completely applied to a 3U CPCI mainboard and a 3U VPX mainboard; moreover, the performance of the CPU in the COM Express module is not affected.

Fig. 3 is an embodiment of the high-density computer processing module shown in fig. 1 and 2 applied to an industrial control carrier according to an embodiment of the present invention. In the present embodiment, as shown in fig. 3, a high density computer processing module 10 is secured to an application carrier board using fasteners such as 4 studs. The high-density computer processing module 10 is connected to an industrial control carrier board 40 by means of a board-to-board connector 20 integrated thereon. To provide a better visual understanding of the example of the mounting of the high density computer processing modules of the present embodiments to an industrial control board, the inter-board connectors 20 are schematically shown in phantom. In practice, the board-to-board connectors 20 integrated on the back side of the printed circuit board 12 should be located between the printed board 12 of the process module 10 and the industrial control carrier board 40 in a position that is not visible.

Fig. 4 is a diagram illustrating an embodiment in which a high-density computer processing module according to an embodiment of the present invention is applied to a 3U CPCI/VPX carrier. As shown in fig. 4, the high-density computer processing module 10 is connected to a CPCI/VPX carrier board 50 through a board-to-board connector 20 integrated thereon. The board-to-board connector 20 is schematically shown in order to provide a better visual understanding of the example of the mounting of the computer processing module of the present embodiment onto a 3U CPCI/VPX carrier board by those skilled in the art. In practice, the board-to-board connector 20 integrated on the back side of the printed circuit board 12 should be located between the printed board 12 of the processing module 10 and the CPCI/VPX carrier board 50 in a position that is not visible.

Secondly, power supply design:

for COM Express modules, heat dissipation issues are an important factor to consider. For example, in summer outdoor environments, there is essentially no way to effectively dissipate heat. In outdoor sunlight, the temperature in the exposed equipment case can reach over 55 ℃, and the temperature of the computer module can also continue to rise after working. In this case, even in the basic COM Express module having a larger area, the temperature rise of the board reaches 30 degrees or more, and the temperature is hardly lowered. In this case, it is difficult for the system to operate normally.

In order to be used in more narrow environments, the smaller the size of the COM Express module, the better. Considering that the heat dissipation problem needs to be further solved under the condition that the CPU selection is not limited in the 80mmx 90mm space, the embodiment of the present invention further provides a power supply that does not have particularly high power consumption in power supply, so as to limit the heat generated during the operation of the processing module.

According to one embodiment of the present invention, in the general-purpose high-integration computer processing module of the present invention, a 5V power supply voltage is supplied to each functional chip requiring a power supply voltage, such as a CPU chip, a chipset, etc., on the processing module via wiring lines in a printed circuit board. That is, the circuitry associated with the 12V power supply is eliminated in the processing module of an embodiment of the present invention, and only the 5V supply voltage is provided.

The supply voltage, as commonly defined today, may be 12V or 5V. The 12V supply voltage provides more power with the same current. For example, 8 pins are used, each pin can pass 1A of current, and the whole can provide power consumption as high as 96W. For a power of 5V supply voltage, also taking 8 pins as an example, the overall power consumption will be 40W, which can greatly reduce the heat generated by the COM Express module.

In addition, the supply voltage is defined as 5V, so that the general high-integration computer processing module provided by the embodiment of the invention can be applied to more application scenes. For example, the main power supply voltage defined in the CPCI and cpce specifications of the industrial PICMG association is 5V, and COM Express of the existing 12V power supply voltage cannot be applied to CPCI and cpce.

Considering the use of a 5V supply voltage and eliminating a 12V supply voltage may present 2 problems. First, whether the reduced power is sufficient for use; second, circuit changes, particularly power circuit changes, can easily create cross talk and leakage in the limited space of a high density computer processing module, causing other problems.

For power issues, the CPU power consumption of the ARM architecture is low, while the CPU power consumption of the X86 architecture will be higher. Taking Intel embedded products as an example, the power consumption of the Intel Atom series CPU is mostly several watts (W). The latest Apollo Lake has the highest CPU power consumption of E3950, and the power consumption is only 12W. The highest power consumption CPU of the Atom series of the early 2010 Intel product is D525, and the maximum power consumption is only 13W. The power consumption of Intel is generally 25W when the embedded Core series CPU is applied. Therefore, the power supply with the 5V power supply voltage is not used. In addition, if power needs to be increased in some special application environments, power consumption can be increased by adding pins.

Taking the conventional COM Express module powered by 12V power voltage as an example, in order to ensure the adaptability and the universality of the COM Express module, in the case of providing 12V power voltage to the COM Express module, an additional voltage conversion circuit needs to be arranged on the COM Express module 10 to convert 12V into 5V power for use. Due to the limited space on the COMexpress module, the additional voltage conversion circuitry is very likely to cause timing skews; the risk of electrical leakage is also easily created. On the other hand, some interfaces and chips on the application carrier board may also use a 5V power supply voltage. Therefore, a voltage conversion circuit for converting 12V to 5V is also required to be arranged on the application carrier board to be specially used for chips and interfaces on the application carrier board. This causes duplication of the voltage conversion circuit and may also cause timing disorder and a potential for leakage.

According to an embodiment of the invention, a power supply voltage of 5V is provided to the general-purpose high-integration computer processing module through the application carrier board, and then a working voltage is provided to other functional chips requiring the power supply voltage on the general-purpose high-integration computer processing module through the wiring line on the general-purpose high-integration computer processing module. Specifically, in one example of the invention, a 5V supply voltage is provided to the processing module through the inter-board connector.

FIG. 5 illustrates a power supply schematic of a high density computer processing module according to one embodiment of the present invention. As shown in fig. 5, the application board 60 includes a power module 62 thereon, which provides a system power supply voltage. In the embodiment of the present invention, the system power supply voltage may be 5V, 12V or 24V, etc., and the power supply voltage is determined by the system configuration. The application carrier 60 further includes a voltage conversion circuit 64, which converts the system power supply voltage provided by the power module 62 into a 5V power supply voltage, and provides the 5V power supply voltage to the chip and the interface on the application carrier 60; and a connection interface (e.g., connection socket) 66 connected to the voltage conversion circuit 64 to obtain a supply voltage of 5V and to supply the supply voltage of 5V to the high-density computer processing module 10 connected thereto. The voltage conversion circuit 64 can be saved if the system power supply voltage provided by the power module 62 is 5V.

Referring to fig. 5, the high density computer processing module 10 includes an inter-board connector 20. The board-to-board connector 20 is electrically connected to the connection interface 66 to obtain a supply voltage of 5V. The board-to-board connector 20 provides a 5V power supply voltage to other components on the high density computer processing module 10, including but not limited to CPU chips, memory, sound cards, etc., through wiring lines on the high density computer processing module 10.

The high-density computer processing module directly uses the 5V power supply voltage provided by the application carrier plate, so that a voltage conversion circuit of the high-density computer processing module is omitted, the problems of crosstalk and electric leakage possibly caused by power supply voltage adjustment are avoided, and the limited space of the high-density computer processing module is saved.

According to one embodiment of the invention, the overall power consumption of the high-density computer processing module may exceed 40W. In case of special power requirements, a 5V power supply pin can be added to provide extra power. For example, in the example of fig. 2 showing 220 pins as the board connector, it is quite possible to increase the number of pins of the 5V power supply voltage to 10 or more than 10, thereby providing higher power. In addition, the requirement of CPCI/CPCIE standard can be met by changing the power supply voltage from 12V to 5V, so that the application of the high-density computer module provided by the invention is expanded to a CPCI/CPCIE board card.

Taking COM Express module as an example, the general purpose high density computer processing module provided by the invention can replace Compact type, Basic type and Extended type COM Express module, and partially replace Mini type COM Express module. Under the condition that the application of the Mini Mini COM Express module is very few at present, the embodiment of the invention has the advantage that a plurality of COM Express modules do not need to be developed, and only one general high-density computer processing module is needed. The method has great convenience for developers in quality control, cost control, personnel investment and secondary development and use of customers. According to partial measurement and calculation, after the general high-density computer processing module is adopted, the cost can be reduced by about 40%.

It is to be understood that the embodiments described herein may be implemented in hardware, software, firmware, middleware, code, or any suitable combination thereof. For a hardware implementation, a processor may be implemented in one or more of the following units: an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a Digital Signal Processing Device (DSPD), a Programmable Logic Device (PLD), a Field Programmable Gate Array (FPGA), a processor, a controller, a microcontroller, a microprocessor, other electronic units designed to perform the functions described herein, or a combination thereof.

The foregoing has outlined features of several embodiments so that those skilled in the art may better understand the various aspects of the disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims

1. A general purpose COM Express high integration computer processing module adapted to be mounted to different types and sizes of application boards, comprising:

a printed circuit board; and

a CPU chip and a random access memory, which are arranged on the front surface of the printed circuit board;

wherein the width of the printed circuit board is 80 mm; wherein the CPU chip is of the X86 architecture.

2. A generic COMExpress high integration computer processing module adapted to be mounted to different types and sizes of application boards as in claim 1, wherein the length of the printed circuit board is 90-140 mm; 90-115 mm; 90-95 mm; or 90 mm.

3. A universal COMExpress high integration computer processing module adapted to be mounted to different types and sizes of application boards as in claim 1, wherein said printed circuit board comprises wiring lines through which only 5V supply voltage is supplied and supplied to functional chips requiring supply voltage on said printed circuit board.

4. A universal COMExpress high integration computer processing module adapted to mount to different types and sizes of application boards as in claim 3, further comprising an inter-board connector disposed on the back side of said printed circuit board; the board-to-board connector receives a 5V power supply voltage and supplies the same to wiring lines of the printed circuit board.

5. A generic COMExpress high integration computer processing module adapted to be mounted to different types and sizes of application boards according to claim 3, further comprising a power supply module integrated on the front side of the printed circuit board, the power supply module configured to generate a 5V supply voltage and provide it to wiring traces of the printed circuit board.

6. A processor board card, comprising:

a general purpose COM Express high integration computer processing module adapted to be mounted to different types and sizes of application boards, comprising:

a printed circuit board;

a CPU chip and a random access memory, which are arranged on the front surface of the printed circuit board; and

an inter-board connector provided on a rear surface of the printed circuit board;

wherein the width of the printed circuit board is 80 mm; wherein the CPU chip is in an X86 architecture; and

and the application carrier plate is provided with a connecting interface which is electrically connected with the inter-board connector.

7. The processor board card of claim 6, wherein the length of the printed circuit board is 90-140 mm; 90-115 mm; 90-95 mm; or 90 mm.

8. The processor board card according to claim 6 or 7, wherein the printed circuit board comprises wiring lines via which only 5V supply voltage is provided and supplied to functional chips on the printed circuit board requiring supply voltage.

9. The processor board card of claim 8, wherein the application carrier board comprises thereon:

a power module configured to generate a system supply power supply voltage; and

a voltage conversion circuit configured to convert a system power supply voltage provided by the power supply module into a 5V power supply voltage and provide the 5V power supply voltage to a connection interface;

wherein the board-to-board connector receives a 5V power supply voltage from the connection interface and supplies the same to the wiring lines of the printed circuit board.

10. The processor board card of claim 8, wherein the generic COM Express high integration computer processing module adapted to mount to different types and sizes of application carrier boards further comprises a power supply module disposed on the front side of the printed circuit board and configured to generate a 5V supply voltage.