CN107120547A - LED bulb - Google Patents

LED bulb Download PDF

Info

Publication number
CN107120547A
CN107120547A CN201710400104.5A CN201710400104A CN107120547A CN 107120547 A CN107120547 A CN 107120547A CN 201710400104 A CN201710400104 A CN 201710400104A CN 107120547 A CN107120547 A CN 107120547A
Authority
CN
China
Prior art keywords
led
cavity
radiating fin
wick column
negative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710400104.5A
Other languages
Chinese (zh)
Inventor
黄明华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HAINING ZHIHUI OPTOELECTRONIC Co Ltd
Original Assignee
HAINING ZHIHUI OPTOELECTRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAINING ZHIHUI OPTOELECTRONIC Co Ltd filed Critical HAINING ZHIHUI OPTOELECTRONIC Co Ltd
Priority to CN201710400104.5A priority Critical patent/CN107120547A/en
Publication of CN107120547A publication Critical patent/CN107120547A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to bulb field, disclose a kind of LED bulb, including wick column (2) and multiple LED encapsulation (3), the center of wick column (2) is provided with core cavity (21), ring cavity (22) is additionally provided with wick column (2), the core cavity (21), graphite is filled with ring cavity (22), the positive pole pin (31) of each LED encapsulation (3) inserts wick column (2) and stretched into core cavity (21), the negative pin (32) of each LED encapsulation (3) inserts wick column (2) and stretched into ring cavity (22).The present invention is connected in parallel between each LED encapsulation as a result of above technical scheme, while not having solder joint to further reduce the resistance of bulb between adjacent LED encapsulation；LED encapsulation is installed using inserted mode, substantially increases the production efficiency of bulb；Radiator structure is also provided with, the service life of bulb is substantially prolongs.

Description

LED bulb
Technical field
The present invention relates to bulb field, more particularly to a kind of LED bulb.
Background technology
LED bulb of the prior art, its LED encapsulation connected mode as shown in Figure 1, each LED encapsulation between be It is cascaded, there is solder joint between adjacent LED encapsulation, solder joint can greatly increase tens of in resistance, therefore a LED bulb Individual LED encapsulation is cascaded, and there is dozens of solder joint, the electric energy consumed on solder joint is huge.Meanwhile, this each LED envelopes The mode of series connection is filled, if wherein a certain LED encapsulation is damaged, whole bulb does not all work, i.e. the service life of bulb is inside it That service life most short in all LED encapsulation, the service life of bulb is short.
Also, LED encapsulation of the prior art is needed after the artificial encapsulation human weld by each LED, then is attached to wick Post surface, the not only welding between LED encapsulation consumes the substantial amounts of production time, while LED encapsulation easily comes off after vibrations, makes Into bulb-damage.
In a LED bulb, while there is more LED encapsulation, the temperature when bulb works in glass cell-shell Higher, LED bulb relies solely on cell-shell natural heat dissipation in the prior art, causes bulb long-time high temperature, is easily caused IC constant currents The damage of driving etc., influences bulb bulk life time.
The content of the invention
The invention provides a kind of LED bulb, the electric energy that it is consumed is few, is easy to production, and service life is long.
In order to solve the above-mentioned technical problem, the present invention is addressed by following technical proposals：
LED bulb, including cell-shell, screw base, in addition to wick column and multiple LED encapsulation, each LED encapsulation have just Pole pin and negative pin, positive pole pin, which is longer than outside negative pin, positive pole pin, is additionally provided with pin insulating barrier, the center of wick column Place is provided with core cavity, wick column and is additionally provided with ring cavity, and ring cavity is looped around outside core cavity, graphite is filled with the core cavity, ring cavity, often The positive pole pin of individual LED encapsulation inserts wick column and stretched into core cavity, while the negative pin of each LED encapsulation inserts lamp Stem is simultaneously stretched into ring cavity.Pin insulating barrier will insulate between the graphite in positive pole pin and ring cavity, and wick column can be using insulation Plastic production, can also be made using glass.Core cavity can be filled in using graphite powder, in ring cavity.When installing LED encapsulation, in life While producing wick column, directly it can will can complete to install in LED encapsulation insertions wick column under the molten condition of wick column, It is easy for installation, the welding process between LED encapsulation in the prior art is eliminated, this greatly improves the production efficiency of bulb；Together When also without solder joint, reduce resistance., also will not shadow when a certain LED is encapsulated and damaged to be connected in parallel between each LED encapsulation Ring to others LED encapsulation.
Preferably, also including insulation core print seat, wick column is fixed on insulation core print seat.
Preferably, also including heat-conducting piece and radiating fin, heat-conducting piece is in bell mouth shape, and insulating core seat is located in heat-conducting piece And insulation core print seat is in contact with heat-conducting piece, heat-conducting piece is connected with radiating fin, and radiating fin is multi-disc, and each radiating fin is parallel to be set Put.The heat of heat inside cell-shell, the core print seat that insulate can be conducted to radiating fin by heat-conducting piece, and radiating fin dissipates heat Hair.
Preferably, being additionally provided with pedestal insulating barrier between radiating fin and screw base, the pedestal insulating barrier will radiate Fin is separated with screw base.It is in order to prevent radiating fin from contacting with screw base, to prevent from radiating to set pedestal insulating barrier Fin is powered, it is ensured that safety.
Driven preferably, also including constant current, the constant current driving is at the central opening of radiating fin.
Preferably, also including positive wire and negative wire, the positive wire drives the graphite in core cavity and constant current Dynamic to be connected, the graphite in ring cavity is connected by negative wire with constant current driving
Preferably, the head of positive wire, negative wire is respectively equipped with cathode metal head, negative metal head, it is described just Pole ferrule, negative metal head insert core cavity, in ring cavity respectively.Cathode metal head, negative metal head are set, be in order to core Graphite is preferably contacted in chamber, ring cavity, it is ensured that conductive effect.
The present invention is connected in parallel as a result of above technical scheme between each LED encapsulation, while adjacent LED is encapsulated Between there is no solder joint to further reduce the resistance of bulb；LED encapsulation is installed using inserted mode, substantially increases the production effect of bulb Rate；Radiator structure is also provided with, the service life of bulb is substantially prolongs.
Brief description of the drawings
Fig. 1 is the mounting structure that LED is encapsulated in LED bulb described in background technology.
Fig. 2 is the structural representation of embodiment 1.
Fig. 3 is the scheme of installation of LED encapsulation in embodiment 1.
Fig. 4 is the partial schematic diagram of embodiment 1.
Fig. 5 be I in Fig. 4 at partial schematic diagram.
Fig. 6 is the LED encapsulation schematic diagrams of embodiment 1.
Embodiment
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.
Embodiment 1
LED bulb, as shown in Fig. 2 encapsulating 3 including cell-shell 1, screw base 7, in addition to wick column 2 and multiple LED, often Individual LED encapsulation 3 has positive pole pin 31 and negative pin 32, and positive pole pin 31 is longer than negative pin 32, and positive pole pin 31 is outer also Provided with pin insulating barrier 33, the center of wick column 2, which is provided with core cavity 21, wick column 2, is additionally provided with ring cavity 22, and ring cavity 22 is looped around Outside core cavity 21, graphite is filled with the core cavity 21, ring cavity 22, the positive pole pin 31 of each LED encapsulation 3 inserts wick column 2 and stretch into core cavity 21, while the negative pin 32 of each LED encapsulation 3 inserts wick column 2 and stretched into ring cavity 22.
Also include insulation core print seat 4, wick column 2 is fixed on insulation core print seat 4.
Also include heat-conducting piece 5 and radiating fin 6, heat-conducting piece 5 is in bell mouth shape, and insulation core print seat 4 is located in heat-conducting piece 5 and exhausted Edge core print seat 4 is in contact with heat-conducting piece 5, and heat-conducting piece 5 is connected with radiating fin 6, and radiating fin 6 is multi-disc, and each radiating fin 6 is parallel Set.
It is additionally provided with pedestal insulating barrier 10 between radiating fin 6 and screw base 7, the pedestal insulating barrier 10 is by radiating fin 6 separate with screw base 7.
Also include constant current driving 9, the constant current driving 9 is located at the central opening of radiating fin 6.
Also include positive wire 81 and negative wire 82, positive wire 81, the head of negative wire 82 are respectively equipped with positive pole Ferrule 83, negative metal first 84, the cathode metal first 83, negative metal first 84 insert core cavity 21, in ring cavity 22 respectively.Institute State positive wire 81 graphite in core cavity 21 and constant current driving 9 are connected, negative wire 82 is by the graphite in ring cavity 22 and constant current Driving 9 is connected.
In a word, presently preferred embodiments of the present invention, all equalizations made according to scope of the present invention patent be the foregoing is only Change and modification, should all belong to the covering scope of patent of the present invention.

Claims (7)

1.LED bulbs, including cell-shell (1), screw base (7), it is characterised in that：Also include wick column (2) and multiple LED are encapsulated (3), each LED encapsulation (3) has positive pole pin (31) and negative pin (32), and positive pole pin (31) is longer than negative pin (32) pin insulating barrier (33), is additionally provided with outside positive pole pin (31), the center of wick column (2) is provided with core cavity (21), wick column (2) ring cavity (22) is additionally provided with, ring cavity (22) is looped around core cavity (21) outside, is filled with the core cavity (21), ring cavity (22) Graphite, the positive pole pin (31) of each LED encapsulation (3) inserts wick column (2) and stretched into core cavity (21), while each LED The negative pin (32) of encapsulation (3) inserts wick column (2) and stretched into ring cavity (22).
2. LED bulb according to claim 1, it is characterised in that：Also include insulation core print seat (4), wick column (2) is fixed on Insulate on core print seat (4).
3. LED bulb according to claim 2, it is characterised in that：Also include heat-conducting piece (5) and radiating fin (6), heat conduction Part (5) is in bell mouth shape, and insulation core print seat (4) is located in heat-conducting piece (5) and insulation core print seat (4) is in contact with heat-conducting piece (5), heat conduction Part (5) is connected with radiating fin (6), and radiating fin (6) is multi-disc, and each radiating fin (6) be arranged in parallel.
4. LED bulb according to claim 3, it is characterised in that：Also set between radiating fin (6) and screw base (7) There is pedestal insulating barrier (10), the pedestal insulating barrier (10) separates radiating fin (6) with screw base (7).
5. LED bulb according to claim 3, it is characterised in that：Also include constant current driving (9), the constant current drives (9) At the central opening of radiating fin (6).
6. LED bulb according to claim 1, it is characterised in that：Also include positive wire (81) and negative wire (82), Graphite in core cavity (21) is connected by the positive wire (81) with constant current driving (9), and negative wire (82) is by ring cavity (22) Graphite and constant current driving (9) be connected.
7. LED bulb according to claim 6, it is characterised in that：The head point of positive wire (81), negative wire (82) Not She You cathode metal head (83), negative metal head (84), the cathode metal head (83), negative metal head (84) are inserted respectively In core cavity (21), ring cavity (22).
CN201710400104.5A 2017-05-31 2017-05-31 LED bulb Pending CN107120547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710400104.5A CN107120547A (en) 2017-05-31 2017-05-31 LED bulb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710400104.5A CN107120547A (en) 2017-05-31 2017-05-31 LED bulb

Publications (1)

Publication Number Publication Date
CN107120547A true CN107120547A (en) 2017-09-01

Family

ID=59729431

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710400104.5A Pending CN107120547A (en) 2017-05-31 2017-05-31 LED bulb

Country Status (1)

Country Link
CN (1) CN107120547A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111750290A (en) * 2020-06-08 2020-10-09 常德高恒照明有限公司 Waterproof anticorrosion laser lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204201550U (en) * 2014-10-29 2015-03-11 中山市名派照明电器有限公司 A kind of LED bulb
CN204328559U (en) * 2014-12-22 2015-05-13 安徽艳阳电气集团有限公司 A kind of LEDbulb lamp
CN204573687U (en) * 2015-05-06 2015-08-19 四川华川工业有限公司 Regular polygon height transmission LED silk bulb
CN205717099U (en) * 2016-05-10 2016-11-23 深圳市酷维智联科技有限公司 The attachment structure of lamp holder and grip part in security protection formula portable power source
CN205896746U (en) * 2016-06-08 2017-01-18 谢洪 LED bulb that illuminating effect is good

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204201550U (en) * 2014-10-29 2015-03-11 中山市名派照明电器有限公司 A kind of LED bulb
CN204328559U (en) * 2014-12-22 2015-05-13 安徽艳阳电气集团有限公司 A kind of LEDbulb lamp
CN204573687U (en) * 2015-05-06 2015-08-19 四川华川工业有限公司 Regular polygon height transmission LED silk bulb
CN205717099U (en) * 2016-05-10 2016-11-23 深圳市酷维智联科技有限公司 The attachment structure of lamp holder and grip part in security protection formula portable power source
CN205896746U (en) * 2016-06-08 2017-01-18 谢洪 LED bulb that illuminating effect is good

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111750290A (en) * 2020-06-08 2020-10-09 常德高恒照明有限公司 Waterproof anticorrosion laser lamp
CN111750290B (en) * 2020-06-08 2022-06-21 广州瑞塔光电科技有限公司 Waterproof anticorrosion laser lamp

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Application publication date: 20170901

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