CN107108104B - Container, packaging body and the method for closing container - Google Patents
Container, packaging body and the method for closing container Download PDFInfo
- Publication number
- CN107108104B CN107108104B CN201580072808.3A CN201580072808A CN107108104B CN 107108104 B CN107108104 B CN 107108104B CN 201580072808 A CN201580072808 A CN 201580072808A CN 107108104 B CN107108104 B CN 107108104B
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- China
- Prior art keywords
- aforementioned
- container
- soldered ball
- interior piston
- main body
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D41/00—Caps, e.g. crown caps or crown seals, i.e. members having parts arranged for engagement with the external periphery of a neck or wall defining a pouring opening or discharge aperture; Protective cap-like covers for closure members, e.g. decorative covers of metal foil or paper
- B65D41/02—Caps or cap-like covers without lines of weakness, tearing strips, tags, or like opening or removal devices
- B65D41/04—Threaded or like caps or cap-like covers secured by rotation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
- B65D53/04—Discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
Abstract
The present invention prevents the soldered ball of storage to be subject to crushing.The soldered ball container of the present invention（10）Have：The container body of bottomed tube（20）；Cap（40）, there is covering container body（20）Opening portion（23）Flat part（41）With covering container body（20）Peripheral surface at least part of side（42）；And flat interior piston part（50）, it is configured at cap（40）Inside.Flat part（41）With the projecting strip part being arranged along its periphery（44、45）.Interior piston part（50）It is configured to, is utilizing cap（40）By container body（20）When closing, it is sandwiched into projecting strip part（44、45）With container body（20）Edge（24）Between, and towards container body（20）Opening portion（23）It is deformed into convex.
Description
Technical field
The present invention relates to soldered ball container and soldered ball preservation packaging bodies.
Background technology
In recent years, due to the miniaturization of electronic equipment, being used in the electronic unit of electronic equipment also becomes very small-sized.And
And the electronic unit is the multipurpose multifunctional operating system for having multiple functions.As multipurpose multifunctional operating system, there is BGA（Ball Grid Array：
Ball grid array）And CSP（Chip Size Package：Chip size packages body）Deng being provided on these multipurpose multifunctional operating systems more
A electrode.When by multipurpose multifunctional operating system actual installation in printed board, the joint surface of electrode and printed board is welded.
In addition, in QFP（Quad Flat Package：Four row flat package bodies）And SOIC（Small Outlined
Integrated Circuit：Small Scale Integration）In such electronic unit, it is being internally provided with the naked of multiple electrodes
The substrate of chip, these electrodes and electronic unit welds.
In welding as described above, solder is individually supplied for multiple setting positions and very small electrode, very
It is bothersome.And, it is difficult to it is accurately-supplied solder to each small weld part.Therefore, related in multipurpose multifunctional operating system and bare chip
Welding in, so that solder attachment is formed solder projection in electrode in advance, welding when by by the solder projection melt come into
Row welding.
Formation for the solder projection utilizes the method for using soldering paste and the method etc. for using soldered ball.Make mostly in the past
It is the low-cost method using soldering paste.However, since the convex block that requires to be formed is 30~200 μm small like that convex
Block and the convex block formed by soldered ball can ensure the height of actual installation, therefore the use of with required bump height be identical
The method of the soldered ball of diameter is widely used.In particular, electrode and components interior for the external terminal of BGA and CSP
The electrode of naked core chip bonding, it is ensured that the height of actual installation is important, and the use of soldered ball is essential.
When loading on a plurality of electrodes soldered ball, put into being formed on the pallet with the hole smaller than the diameter of soldered ball
Soldered ball simultaneously makes pallet swing, to make soldered ball be arranged on the hole of pallet.Then, it loads head to soldered ball and loads soldered ball.Therefore,
If the transverse and longitudinal size ratio of soldered ball is big, grain size has error, then cannot be loaded to electrode.In order to ensure strict amount of solder and ensure reality
The height of border installation, it is important that the grain size of each soldered ball is without error.
In addition, due to becoming small with soldered ball, the surface area of soldered ball increases relative to the ratio of whole amount of solder, therefore
The surface of soldered ball is easy to aoxidize and generates xanthochromia.Xanthochromia is that soldered ball is exposed to the atmosphere and make the Sn in soldered ball by the oxygen in air
Caused by oxidation.Since the oxidation film of Sn is yellow, if oxidation film thickens, soldered ball integrally seems discoloration for Huang
Color.
In this regard, it has been known that there is a kind of preservation packaging body of tiny soldered balls, is constituted using aeration material and store small weldering
The container of ball will be accommodated in bag portion part together with the deoxidation drying agent for the outside for being configured at the container and container, and be sealed into gas
Close state（Referring to patent document 1）.Thereby, it is possible to prevent the oxidation of solder ball surface and xanthochromia.
Patent document 1：Japanese Patent Publication No. 4868267.
However, in soldered ball container disclosed in patent document 1, in storage compared with small particle（For example, 0.1mm or less）Weldering
In the case of ball, there is the possibility in the minim gap that soldered ball is sandwiched between the edge and cover of the container body of soldered ball container.
If soldered ball is sandwiched into aforementioned gap, there are following problems：Such as when conveying soldered ball container, cover is relative to container master
The edge of body moves, and to which soldered ball is subject to crushing, the sphericity of soldered ball is impaired.
Invention content
The present invention has been made in view of the above problems, and one of its goals is to provide a kind of weldering that can prevent storage
The soldered ball container and soldered ball preservation packaging body that ball is subject to crushing.
The soldered ball container for being related to the mode of the present invention has：The container body of bottomed tube；Cap, before there is covering
State at least part of side of the flat part of the opening portion of container body and the peripheral surface of covering aforesaid receptacle main body；And it is flat
The interior piston part of plate is configured in the inside of aforementioned cap, and aforementioned flat part has dashes forward along what the periphery of the flat part was arranged
Item portion, aforementioned interior piston part are configured to, and when closing aforesaid receptacle main body using aforementioned cap, are sandwiched into aforementioned projecting strip part with before
Between the edge for stating container body, and convex is deformed into towards the aforementioned opening portion of aforesaid receptacle main body.
In the soldered ball container of a mode, aforesaid receptacle main body has the 1st thread groove on its peripheral surface, aforementioned cap
Aforesaid side portions have the 2nd thread groove in inner circumferential surface, and aforementioned cap is configured to, by by aforementioned 2nd thread groove relative to preceding
It states the 1st thread groove to be threadedly engaged, to close aforesaid receptacle main body, aforementioned interior piston part is kept by aforementioned 2nd thread groove
In the inside of aforementioned cap.
In the soldered ball container of a mode, aforementioned interior piston part is conductive.
In the soldered ball container of a mode, the side surface part that aforesaid receptacle main body has bottom and extends from afore-mentioned bottom is preceding
The axial length for stating side surface part is configured to bigger than the diameter of afore-mentioned bottom.
In the soldered ball container of a mode, aforementioned projecting strip part is formed as cyclic annular along the periphery of aforementioned flat part, aforementioned ridge
The diameter in portion is smaller than the internal diameter of the aforementioned edge of aforesaid receptacle main body.
In the soldered ball container of a mode, aforesaid solder balls container is configured to, and is that 0.1mm soldered balls below are received to grain size
It receives.
The soldered ball preservation for being related to the mode of the present invention has with packaging body：Holding member has aforementioned for receiving
The incorporating section of soldered ball container；Deoxidation drying agent is configured in the outside of aforesaid solder balls container；And the bag portion of non-ventilating property
Aforesaid solder balls container, aforementioned holding member and aforementioned deoxidation drying agent are stored and are sealed into air-tight state by part.
In accordance with the invention it is possible to which providing a kind of can prevent the soldered ball container that is subject to crushing of soldered ball of storage and soldered ball preservations from sealing
Fill body.
Description of the drawings
Fig. 1 is the stereogram of the soldered ball container of present embodiment.
Fig. 2 is the sectional view of cap.
Fig. 3 is the upward view of cap.
Fig. 4 is the zoom side sectional view of the part A1 of cap.
Fig. 5 is the side view of container body.
Fig. 6 is the vertical view of interior piston part.
Fig. 7 is the side view of interior piston part.
Fig. 8 is the side partial cross-sectional of the soldered ball container in the state of the opening portion for closing container body with cap.
Fig. 9 is the figure of the state of the soldered ball preservation packaging body before indicating closed.
Figure 10 be it is closed after soldered ball preservation packaging body longitudinal section view.
Specific implementation mode
Hereinafter, with reference to attached drawing, the embodiment of soldered ball container and soldered ball preservation packaging body to the present invention illustrates.
In attached drawing described below, identical reference numeral is marked to identical or comparable inscape, and omit repetition
Explanation.
Fig. 1 is the stereogram of the soldered ball container of present embodiment.Soldered ball container 10 has the container body of bottomed cylindrical
20 and for by the cap 40 of the opening portion (not shown) of container body 20 closing.Container body 20 have can store soldered ball
Inner space, cap 40 close opening portion, to close the inner space.Cap 40 is not by the inside of container body 20 sky
Between be completely closed.Hereinafter, explaining the container body 20 for constituting soldered ball container 10, cap 40 in detail and set on cap 40
The construction of internal interior piston part.
First, cap 40 shown in FIG. 1 is illustrated.Fig. 2 is the sectional view of cap 40, and Fig. 3 is looking up for cap 40
Figure, Fig. 4 is the zoom side sectional view of the part A1 of cap 40 shown in Fig. 2.In addition, in fig. 2, it for convenience, will be a part of
It is indicated as side view.
In one embodiment, cap 40 is conductive.Specifically, cap 40 is formed by conductive material,
Or surface coating can be formed using conductive material.As shown in Fig. 2, cap 40 has flat part 41 and side 42, it is preceding
It states flat part 41 to be constituted in a manner of covering the opening portion of container body 20 shown in FIG. 1, aforesaid side portions 42 are to cover container master
At least part of mode of the peripheral surface of body 20 is constituted.Side 42 is to prolong from the peripheral part of flat part 41 to generally vertical direction
The substantially cylindric component stretched.
Inner peripheral surface in side 42 forms 3 thread grooves 43（It is equivalent to an example of the 2nd thread groove）.Cap 40 is constituted
To pass through 3 thread grooves 25 by thread groove 43 relative to the peripheral surface for being formed in container body 20（With reference to Fig. 5）Carry out screw thread
Engagement, to close the opening portion of container body 20.
Peripheral surface in side 42 forms straight knurling 44.Straight knurling 44 threadingly engages in cap 40 in user
Container body 20（Referring to Fig.1）And when holding and rotating cap 40, the frictional force of the hand and cap 40 that make user improves.
As shown in Figure 3 and 4, flat part 41 has is set as cricoid 1st projecting strip part 45 along its periphery（It is equivalent to ridge
One example in portion）And the 2nd projecting strip part 46（It is equivalent to an example of projecting strip part）.The diameter of 1st projecting strip part 45 is set as
Diameter than the 2nd projecting strip part 46 is small.In addition, the diameter of the 1st projecting strip part 45 is designed to the opening portion than forming container body 20
Edge 24（With reference to Fig. 5）Internal diameter it is small.Moreover, the height of the 1st projecting strip part 45 is designed to the height than the 2nd projecting strip part 46
It is high.
Next, being illustrated to container body 20 shown in FIG. 1.Fig. 5 is the side view of container body 20.Implement one
In example, container body 20 is conductive.Specifically, container body 20 is formed by conductive material, or can
Surface coating is formed using conductive material.As illustrated, container body 20 have circular plate bottom 21 and from
The substantially cylindric side surface part 22 that bottom 21 extends substantially vertically.The end of side surface part 22 constitutes the edge to form opening portion 23
Portion 24.The axial length of side surface part 22 is configured to the diameter than bottom 21（Outer diameter）Greatly.
Container body 20 has 3 thread grooves 25 on the peripheral surface of side surface part 22（It is equivalent to an example of the 1st thread groove
Son）.By 21 side of bottom flange 26 is formed in the ratio thread groove 25 of the peripheral surface of side surface part 22 and from flange 26 to axially extending
Multiple ribs 27.
Next, being illustrated to interior piston part possessed by soldered ball container 10 shown in FIG. 1.Fig. 6 is the vertical view of interior piston part
Figure, Fig. 7 is the side view of interior piston part.Interior piston part 50 is arranged in the flat portion of the inside of cap 40 shown in Fig. 1 to Fig. 4
Part, and be configured to cap 40 together by the opening portion 23 of container body 20（With reference to Fig. 5）It closes.In one embodiment, interior plug
Portion 50 is conductive.Specifically, interior piston part 50 is formed by conductive material, or conductive material can be utilized
Surface coating is formed.
As shown in fig. 6, interior piston part 50 has generally circular interior piston part main body 51 and is equally spaced set to interior piston part main body
Multiple fasteners 52 of 51 peripheral part.In the example in the figures, 3 fasteners 52 are located at interior piston part main body 51.Interior piston part
50 thickness for example with about 0.7mm.
Interior piston part 50 by 3 fasteners 52 by being embedded in Fig. 2 to 3 thread grooves 43 of cap 40 shown in Fig. 4, to quilt
Engage and be held in the inside of cap 40.
Fig. 8 is the partial side of the soldered ball container 10 in the state of the opening portion 23 for closing container body 20 using cap 40
Sectional view.As illustrated, cap 40 is by the way that thread groove 43 to be threadedly engaged relative to thread groove 25, thus by container body 20
It closes.Here, as described above, the 1st projecting strip part 45 of cap 40 being formed on flat part 41 is configured to than the 2nd projecting strip part 46
It is higher prominent.At this point, the interior piston part 50 for being configured at the inside of cap 40 is sandwiched into the 1st projecting strip part 45 and the 2nd projecting strip part 46
Between the edge 24 of container body 20.Further cap 40 is screwed into relative to container body 20, to utilize the 1st ridge
Portion 45 and the 2nd projecting strip part 46 apply stress with edge 24 to interior piston part 50.The opening towards container body 20 of interior piston part 50 as a result,
Oral area 23 is deformed into convex.
In addition, in the present embodiment, since the diameter of the 1st projecting strip part 45 is designed to smaller than the internal diameter of edge 24, because
This interior piston part 50 applies shear stress by the 1st projecting strip part 45 with edge 24.Opening of the interior piston part 50 towards container body 20 as a result,
Portion 23 is further deformed into convex.
Since the opening portion 23 of interior piston part 50 towards container body 20 is deformed into convex, so as to by interior piston part 50 and hold
The gap of the inner periphery of the edge 24 of device main body 20 reduces at very small.Therefore, even if in very small grain size（For example,
0.1mm or less）Soldered ball be incorporated in soldered ball container 10 in the case of, can also inhibit soldered ball to be sandwiched into the edge of container body 20
Between portion 24 and interior piston part 50.In turn, it can prevent from damaging soldered ball by pressure in the conveying of soldered ball container 10.
In addition, in the soldered ball container 10 for being related to present embodiment, interior piston part 50 is configured to the thread groove by cap 40
43 are maintained at the inside of cap 40.Therefore, even if interior piston part 50 can be prevented from cap if when soldered ball container 10 to be opened and closed
40 fall.
In soldered ball container 10 in the present embodiment, interior piston part 50 is conductive.Even if being incorporated in soldered ball as a result,
The soldered ball of container 10 charges, and soldered ball will not be attached to interior piston part 50.Furthermore, it would be desirable to container body 20 and cap 40
It is conductive.It in this case, can be via interior piston part if causing soldered ball to roll and charge even if soldered ball container 10 is tilted etc.
50, container body 20 and cap 40 and from soldered ball except electricity.Interior piston part 50, container body 20 and the cap 40 of present embodiment
The electroconductive resins such as the resin containing carbon can be used, the coating of electric conductivity can also be coated in general container and made it have
Electric conductivity is held.As a result, in the present embodiment, when the soldered ball in soldered ball container 10 is moved to pallet etc., soldered ball can be inhibited
Be attached to because of electrostatic container body 20, cap 40 and in piston part 50 and disperse.
In addition, in soldered ball container 10 in the present embodiment, the axial length of container body 20 is configured to than bottom 21
Diameter it is big.User is easy to hold the container body 20 of soldered ball container 10 as a result,.Since user is easy to hold soldered ball container 10
Container body 20, so the area that the hand of user is contacted with soldered ball container 10 becomes larger, therefore direct capacitance The book of Changes of soldered ball is by user
Hand and discharge.
Next, being illustrated with packaging body to the soldered ball preservation for being related to present embodiment.Fig. 9 is the weldering before indicating closed
The figure of the state of ball preservation packaging body, Figure 10 be it is closed after soldered ball preservation packaging body longitudinal section view.
As shown in figure 9, soldered ball preservation packaging body 60 has in Fig. 1 to soldered ball container 10 illustrated in fig. 8, for keeping
The holding member 62 of soldered ball container 10, deoxidation drying agent 63 and for drying soldered ball container 10, holding member 62 and deoxidation
Agent 63 stores and is sealed to the bag portion part 64 of air-tight state.
Holding member 62 has flat board member 65, the incorporating section 61 for receiving soldered ball container 10 and is used for
Configure the recess portion 66 of deoxidation drying agent 63.In the present embodiment, holding member 62 has to keep 4 soldered ball containers 10
4 incorporating sections 61.Multiple soldered ball containers 10 are accommodated in the incorporating section 61 of holding member 62 respectively, mutual opposite to be maintained
Position.Recess portion 66 is set to the approximate centre of 4 incorporating sections 61, so that deoxidation drying agent 63 is located at and is incorporated in incorporating section 61
Each soldered ball container 10 is separated by the position of roughly equal distance.
As shown in Figure 10, it is formed in the lower part of each incorporating section 61 for mitigating the buffering bulging from external impact
Portion 67.The impact from outside in this case is, for example, the impact caused by being fallen soldered ball preservation packaging body 60.
When packing soldered ball container 10, soldered ball is filled in soldered ball container 10 first.Later, soldered ball container 10 is accommodated in
The incorporating section 61 of holding member 62, and deoxidation drying agent 63 is configured in recess portion 66.In addition it is also possible to pressing component etc. is set,
Deoxidation drying agent 63 is pressed on recess portion 66 by aforementioned pressing component etc., so that deoxidation drying agent 63 will not fall off from recess portion 66.
Then, soldered ball container 10, holding member 62 and deoxidation drying agent 63 are put into bag portion part 64.Pass through closed bag
The end of component 64, to as shown in Figure 10, soldered ball container 10, holding member 62 and deoxidation drying agent 63 are sealed into close
Closed state.
In addition, bag portion part 64 is made of the material of non-ventilating property.As the material for being used in bag portion part 64, penetrated using oxygen
Degree and the very low material of water vapor permeance.About oxygen permeability, it is expected that in 23 DEG C of temperature, humidity 0%, air pressure 1MPa
Under environment, per 1m2The oxygen amount that penetrates of sheet material one day be 10ml or less.About water vapor permeance, it is expected that in 40 DEG C of temperature, phase
In the environment of humidity 90%, per 1m2The amount of moisture that penetrates of sheet material one day be 1 gram or less.Bag portion part 64 for example can be by aluminium
Sheet material makes.Alternatively, can also by carrying out plated film with aluminium etc. on the bag portion part 64 made using aeration material, from
And assign non-ventilating property to bag portion part 64.
In addition, deoxidation drying agent 63 has deoxygenation function, and moisture is also absorbed, to prevent using oxygen and moisture as reason
Object oxidation.Moreover, as deoxidation drying agent, the RP agent for example as commercially available product can be used（Mitsubishi Gas Chemical
The trade name of Co., Ltd.'s product）.
As described above, the inner space of container body 20 is not completely closed by the cap 40 of soldered ball container 10.Therefore, lead to
It crosses and soldered ball container 10 and deoxidation drying agent 63 is accommodated in together in bag portion part 64, so as to be absorbed by deoxidation drying agent 63
The oxygen and moisture of the internal environment of soldered ball container 10, can prevent the oxidation of soldered ball.
In addition, the quantity for the soldered ball container 10 that holding member 62 is kept is not limited to 4, can be stored by increasing and decreasing
The quantity in portion 61 makes the reasonable quantity increase and decrease of soldered ball container 10 that holding member 62 can keep.In addition, in holding member
The quantity of the 62 soldered ball containers 10 kept becomes more often, can also increase the quantity of deoxidation drying agent 63.
When using soldered ball container 10, a part for the bag portion part 64 of soldered ball preservation shown in Fig. 10 packaging body 60 is done
It is broken, take out holding member 62 from bag portion part 64.The cap 40 for removing soldered ball container 10, soldered ball therein is supplied on pallet.
Not used soldered ball container 10 is set to keep the state being accommodated in holding member 62, with not used new deoxidation drying agent 63 1
It rises and is back in bag portion part 64.Be thermally compressed etc. reliable sealing by the part staved to bag portion part 64, sealed with
So that extraneous air can not invade.In the case that soldered ball in a soldered ball container 10 does not exhaust, closed with cap 40
The soldered ball container 10 is closed, holding member 62 is returned it to and is accommodated in bag portion part 64, bag portion part 64 is again sealed off.
Embodiments of the present invention are this concludes the description of, but the embodiment of aforementioned invention is for making present invention may be readily understood,
And the non-limiting present invention.The present invention can be changed in the case where not departing from its purport, be improved, and the present invention wraps certainly
Containing its equivalent.In addition, in at least part of range that can solve aforementioned problems or at least part effect can be played
In the range of, arbitrarily combine or omit patent claims and each integral part recorded in specification.
Reference sign
10 ... soldered ball containers
20 ... container bodies
21 ... bottoms
22 ... side surface parts
23 ... opening portions
24 ... edges
25 ... thread grooves
40 ... caps
41 ... flat parts
42 ... sides
43 ... thread grooves
45 ... the 1st projecting strip parts
46 ... the 2nd projecting strip parts
50 ... interior piston parts
60 ... soldered ball preservation packaging bodies
61 ... incorporating sections
62 ... holding members
63 ... deoxidation drying agents
64 ... bag portion parts.
Claims (15)
1. a kind of soldered ball container, which is characterized in that aforesaid solder balls container has：
The container body of bottomed tube；
Cap, the peripheral surface of the flat part and covering aforesaid receptacle main body with the opening portion of covering aforesaid receptacle main body is at least
The side of a part；And
Flat interior piston part, is configured in the inside of aforementioned cap,
Aforementioned flat part has the projecting strip part being arranged along the periphery of the flat part,
Aforementioned interior piston part is configured to, and when closing aforesaid receptacle main body using aforementioned cap, is sandwiched into aforementioned projecting strip part with before
Between the edge for stating container body, and it is deformed into convex towards the aforementioned opening portion of aforesaid receptacle main body,
Aforesaid receptacle main body has the 1st thread groove on the peripheral surface of the container body,
The aforesaid side portions of aforementioned cap have the 2nd thread groove on the inner peripheral surface of the side,
Aforementioned cap is configured to, by the way that aforementioned 2nd thread groove to be threadedly engaged relative to aforementioned 1st thread groove, thus will be aforementioned
Container body is closed,
Aforementioned interior piston part is held in the inside of aforementioned 2nd thread groove.
2. soldered ball container as described in claim 1, which is characterized in that
Aforementioned interior piston part is conductive.
3. soldered ball container as claimed in claim 1 or 2, which is characterized in that
The side surface part that aforesaid receptacle main body has bottom and extends from afore-mentioned bottom,
The axial length in former side face portion is configured to bigger than the diameter of afore-mentioned bottom.
4. soldered ball container as claimed in claim 1 or 2, which is characterized in that
Aforementioned projecting strip part is formed as cyclic annular along the periphery of aforementioned flat part,
The diameter of aforementioned projecting strip part is smaller than the internal diameter of the aforementioned edge of aforesaid receptacle main body.
5. soldered ball container as claimed in claim 1 or 2, which is characterized in that
Aforesaid solder balls container is configured to, and is that 0.1mm soldered balls below are stored to grain size.
6. soldered ball container as claimed in claim 1 or 2, which is characterized in that
Aforementioned interior piston part has the fastener of interior piston part main body and the peripheral part set on the interior piston part main body,
Aforementioned interior piston part by aforementioned fastener by being embedded in aforementioned 2nd thread groove, to be held in aforementioned 2nd thread groove
Portion.
7. soldered ball container as claimed in claim 6, which is characterized in that
Aforementioned interior piston part has multiple aforementioned fasteners,
Aforementioned 2nd thread groove has article number of quantity identical as the quantity of aforementioned fastener,
Aforementioned interior piston part by multiple aforementioned fasteners by being embedded in aforementioned 2nd thread groove, to be held in aforementioned 2nd thread groove
Inside.
8. a kind of packaging body, which is characterized in that aforementioned encapsulation body has：
Holding member has incorporating section, receives the soldered ball container described in any one of claim 1 to 7 in aforementioned incorporating section；
Deoxidation drying agent is configured in the outside of aforesaid solder balls container；And
Aforesaid solder balls container, aforementioned holding member and aforementioned deoxidation drying agent are stored and are sealed by the bag portion part of non-ventilating property
Air-tight state.
9. a kind of method for closing soldered ball container, which is characterized in that
Aforesaid solder balls container has：
The container body of bottomed tube；
Cap, the peripheral surface of the flat part and covering aforesaid receptacle main body with the opening portion of covering aforesaid receptacle main body is at least
The side of a part；And
Flat interior piston part, is configured in the inside of aforementioned cap,
Aforementioned flat part has the projecting strip part being arranged along the periphery of the flat part,
Aforesaid receptacle main body has the 1st thread groove on the peripheral surface of the container body,
The aforesaid side portions of aforementioned cap have the 2nd thread groove on the inner peripheral surface of the side,
The aforementioned method for closing soldered ball container has following process：
The process that aforementioned interior piston part is held in the inside of aforementioned 2nd thread groove；
By the way that aforementioned 2nd thread groove to be threadedly engaged relative to aforementioned 1st thread groove, to utilize aforementioned cap by aforesaid receptacle
The process that main body is closed；And
When closing aforesaid receptacle main body using aforementioned cap, aforementioned interior piston part is sandwiched into aforementioned projecting strip part and aforesaid receptacle master
Between the edge of body, the process that makes aforementioned interior piston part be deformed into convex towards the aforementioned opening portion of aforesaid receptacle main body.
10. the method for closing soldered ball container as claimed in claim 9, which is characterized in that
Aforementioned interior piston part is conductive.
11. the method for the closing soldered ball container as described in claim 9 or 10, which is characterized in that
The side surface part that aforesaid receptacle main body has bottom and extends from afore-mentioned bottom,
The axial length in former side face portion is configured to bigger than the diameter of afore-mentioned bottom.
12. the method for the closing soldered ball container as described in claim 9 or 10, which is characterized in that
Aforementioned projecting strip part is formed as cyclic annular along the periphery of aforementioned flat part,
The diameter of aforementioned projecting strip part is smaller than the internal diameter of the aforementioned edge of aforesaid receptacle main body.
13. the method for the closing soldered ball container as described in claim 9 or 10, which is characterized in that
With by grain size be 0.1mm soldered balls below be accommodated in the process in aforesaid solder balls container.
14. the method for the closing soldered ball container as described in claim 9 or 10, which is characterized in that
Aforementioned interior piston part has the fastener of interior piston part main body and the peripheral part set on the interior piston part main body,
The process that aforementioned interior piston part is held in the inside of aforementioned 2nd thread groove includes that aforementioned fastener is embedded in aforementioned 2nd spiral shell
The process of groove.
15. the method for closing soldered ball container as claimed in claim 14, which is characterized in that
Aforementioned interior piston part has multiple aforementioned fasteners,
Aforementioned 2nd thread groove has article number of quantity identical as the quantity of aforementioned fastener,
The process that aforementioned interior piston part is held in the inside of aforementioned 2nd thread groove includes that multiple aforementioned fasteners are embedded in aforementioned the
The process of 2 thread grooves.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-003127 | 2015-01-09 | ||
| JP2015003127 | 2015-01-09 | ||
| PCT/JP2015/085999 WO2016111179A1 (en) | 2015-01-09 | 2015-12-24 | Solder ball container and package for storing solder ball |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107108104A CN107108104A (en) | 2017-08-29 |
| CN107108104B true CN107108104B (en) | 2018-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580072808.3A Active CN107108104B (en) | 2015-01-09 | 2015-12-24 | Container, packaging body and the method for closing container |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101833905B1 (en) |
| CN (1) | CN107108104B (en) |
| TW (1) | TWI597218B (en) |
| WO (1) | WO2016111179A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108100405A (en) * | 2018-02-06 | 2018-06-01 | 浙江万纳核电检修有限公司 | A kind of nuclear fuel passage sealing-plug special container |
| FR3130259B1 (en) * | 2021-12-13 | 2023-11-10 | Langlet Eric | Screw cover whose two parts are joined by a bayonet mechanism |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000335633A (en) * | 1999-03-24 | 2000-12-05 | Senju Metal Ind Co Ltd | Container for solder ball |
| JP2003312744A (en) * | 2002-04-26 | 2003-11-06 | Hitachi Metals Ltd | Packing method for solder ball and packing container for solder ball |
| CN1493507A (en) * | 2002-10-30 | 2004-05-05 | 山东瑞阳制药有限公司 | Packaging method of hygroscopic medicine |
| JP2005206199A (en) * | 2004-01-23 | 2005-08-04 | Key Tranding Co Ltd | Airtight container |
| CN102245482A (en) * | 2008-12-01 | 2011-11-16 | 千住金属工业株式会社 | Package for storing minute solder ball and method for storing minute solder ball |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49123263U (en) * | 1973-02-22 | 1974-10-22 | ||
| US4620640A (en) * | 1985-12-16 | 1986-11-04 | Owens-Illinois, Inc. | Lined child-resistant closure for widemouth liquid container |
| GB9907338D0 (en) * | 1999-03-31 | 1999-05-26 | Rexam Containers Ltd | Container and closure cap |
| FR2862290B1 (en) * | 2003-11-17 | 2006-09-08 | Tetra Laval Holdings & Finance | DEVICE FOR CLOSING A CONTAINER COLLAR AND CONTAINER HAVING SUCH A DEVICE |
| JP2007230613A (en) * | 2006-03-01 | 2007-09-13 | Nippon Steel Materials Co Ltd | Solder ball container |
-
2015
- 2015-12-24 CN CN201580072808.3A patent/CN107108104B/en active Active
- 2015-12-24 KR KR1020177018059A patent/KR101833905B1/en active IP Right Grant
- 2015-12-24 WO PCT/JP2015/085999 patent/WO2016111179A1/en active Application Filing
- 2015-12-29 TW TW104144184A patent/TWI597218B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000335633A (en) * | 1999-03-24 | 2000-12-05 | Senju Metal Ind Co Ltd | Container for solder ball |
| JP2003312744A (en) * | 2002-04-26 | 2003-11-06 | Hitachi Metals Ltd | Packing method for solder ball and packing container for solder ball |
| CN1493507A (en) * | 2002-10-30 | 2004-05-05 | 山东瑞阳制药有限公司 | Packaging method of hygroscopic medicine |
| JP2005206199A (en) * | 2004-01-23 | 2005-08-04 | Key Tranding Co Ltd | Airtight container |
| CN102245482A (en) * | 2008-12-01 | 2011-11-16 | 千住金属工业株式会社 | Package for storing minute solder ball and method for storing minute solder ball |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016111179A1 (en) | 2016-07-14 |
| JPWO2016111179A1 (en) | 2017-04-27 |
| JP6108191B2 (en) | 2017-04-05 |
| CN107108104A (en) | 2017-08-29 |
| KR101833905B1 (en) | 2018-04-13 |
| TW201636283A (en) | 2016-10-16 |
| TWI597218B (en) | 2017-09-01 |
| KR20170084333A (en) | 2017-07-19 |
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