CN107107250B - Method and apparatus for characterizing electron beam - Google Patents
Method and apparatus for characterizing electron beam Download PDFInfo
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- CN107107250B CN107107250B CN201680006743.7A CN201680006743A CN107107250B CN 107107250 B CN107107250 B CN 107107250B CN 201680006743 A CN201680006743 A CN 201680006743A CN 107107250 B CN107107250 B CN 107107250B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
- H01J37/3045—Object or beam position registration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0013—Positioning or observing workpieces, e.g. with respect to the impact; Aligning, aiming or focusing electronbeams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/31—Calibration of process steps or apparatus settings, e.g. before or during manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/90—Means for process control, e.g. cameras or sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/002—Devices involving relative movement between electronbeam and workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0026—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
- B23K15/0086—Welding welding for purposes other than joining, e.g. built-up welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/02—Control circuits therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
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- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/0063—Control arrangements
- B28B17/0081—Process control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/364—Conditioning of environment
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
- G01T1/2914—Measurement of spatial distribution of radiation
- G01T1/2921—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
- G01T1/295—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using coded aperture devices, e.g. Fresnel zone plates
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- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
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- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
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- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/55—Two or more means for feeding material
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- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
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- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2445—Photon detectors for X-rays, light, e.g. photomultipliers
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- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
- H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
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Abstract
It is a kind of for detecting the device of the X-ray given off from substrate surface, described device includes at least one X-ray detector, resolver grating and modulator grating, and there is the resolver grating towards at least one opening of the X-ray detector to be disposed in front of the X-ray detector.Between the resolver grating and the substrate, it is apart at preset distance that the modulator grating, which is provided at the resolver grating and the substrate, wherein the modulator grating has multiple openings at least first direction, the modulator grating and resolver grating are wherein utilized, spatial modulation is carried out to the x-ray from the surface.
Description
Technical field
The present invention relates to a kind of for characterizing the improved method of electron beam.
Background technique
Free forming makes (freeform fabrication) or increasing material manufacturing (additive manufacturing)
It is a kind of for forming three by selected portion continuous (successive) fusion to the powder bed for being applied to working plate
The method for tieing up object (article).The method according to this technology is disclosed in U.S. Patent No. 7,713,454 and is set
It is standby.
Such equipment may include: workbench, on the workbench, form three-dimensional object;Powder distributor
(dispenser), it is arranged to and lays thin powder bed on the table, is used to form powder bed;Energy-beam source, for energy
Amount beam spot (spot) is delivered to powder, and the fusion of powder thus occurs;Unit (element), for being controlled on powder bed
Energy beam spot, to form the section of three-dimensional object by each section for fusing powder bed;And control computer, in the control
The information in coherent section (consecutive) about three-dimensional object is stored in computer processed.By consistently fusing by powder
The section of the coherent formation for the powder bed that last dispenser is continuously laid forms three-dimensional object.
In order to melt dusty material in specific location, need accurately to control energy beam, such as control deflection speed, position
It sets and shape.
Currently, optical correction is carried out to electron beam using shine (glow) of metal.There are several defects in such calibration side.
Firstly, since needing to take some time just metal can be made to start to shine, so such calibration method is time-consuming.Secondly,
In order to make metal start the relatively high beam power of lighting requirements.Third, luminous metal may be damaged locally,
Or at least locally having changed its material property.Finally, for calibration optical equipment may during calibration process or
It is metallized in process steps later.In addition, material shine the power of electron beam between be not present it is straightforward
Relationship.
Therefore, need that a kind of characteristic for electron beam calibrated and/or verified in the art simple and
Efficient method.
Summary of the invention
The invention aims to provide it is a kind of for electron beam carry out calibration/verification method, this method eliminate or
Person at least reduces problem mentioned above.Above mentioned purpose be via the feature quoted from the claims hereof and
It realizes.
In the first aspect of the invention, a kind of method for being calibrated to electron beam, the method packet are provided
Include following steps: before at least one X-ray detector, arranging has the figuratum aperture resolver of at least one opening
(patterned aperture resolver), wherein at least one opening is just towards at least one described X-ray detection
Device;It between figuratum aperture resolver and substrate, and is apart being predetermined with figuratum aperture resolver and substrate
At distance, figuratum aperture modulator (patterned aperture modulator) is arranged, wherein described figuratum
Aperture modulator has multiple openings at least first direction;On substrate at least first direction scanning beam, use
It will be by the received X-ray of at least one X-ray detector in generating;Utilize figuratum aperture modulator and figuratum
Aperture resolver, the X-ray issued from the surface that detection is generated by the scanning beam, wherein by utilizing use
In control electron beam setting the intensity modulated for the X-ray signal for carrying out self-detector is mapped, realize electron beam position,
The mapping graph (map) of size and shape;If the shape and/or size of electron beam just with corresponding reference beam shape and/
Or reference beam dimensional discrepancy exceeds predetermined value, then adjusts the setting for controlling electron beam;And step c-e is repeated, directly
Shape and/or size to electron beam are just being less than predetermined value with reference beam shape and/or reference beam dimensional discrepancy.
The exemplary advantage of this method is, can execute the calibration of electron beam at any time.It is in calibration power
May it is excessively high or may too low aspect, can there is no limit because scanning speed can be sufficiently high, not influence X-ray just
The material surface issued from it.Another advantage is that this calibration method may be insensitive for possible material deposition, because
The deposition can be collected by the adequate shielding plate in face in front of the detector.
In another example embodiment, the method also includes following steps: for different beam powers, repeating step
c-f.At least this embodiment is unrestricted and illustrative the advantage is that can complete for all beam powers
All calibrations, the risk of material property for being damaged or locally changing without having any part.This embodiment
Another advantage is that can choose will use which type of pattern, i.e. 1 dimension pattern or 2 tie up patterns.Obviously
That 1 dimension pattern may only verify the deflection speed of 1 dimension, if cannot if, rotate on the table and reuse number
The secondary 1 dimension pattern.
In also another example embodiment, wherein the setting is the input signal to beam shaping and positioning unit.
The beam shaping and positioning unit may include at least one deflection coil, at least one focus coil and at least one picture
Dissipate (astigmatism) coil.At least this embodiment unrestricted and it is illustrative the advantage is that can by
Scanning beam calibrates the size and shape of electron beam at least two different directions.
In another aspect of the invention, provide it is a kind of for detecting the device of the X-ray given off from substrate surface,
Described device includes: at least one first X-ray detector, figuratum aperture resolver and the modulation of figuratum aperture
Device;Before figuratum aperture resolver at least one opening towards X-ray detector is disposed in X-ray detector
Face;Between figuratum aperture resolver and substrate, figuratum aperture modulator is provided to be solved with figuratum aperture
Parser and substrate are apart at preset distance;Wherein figuratum aperture modulator has multiple open at least first direction
Mouthful, wherein before detecting the x-ray from the surface by X-ray detector, using figuratum aperture modulator and
Figuratum aperture resolver carries out intensity modulated to the x-ray from the surface.
At least this embodiment is unrestricted and illustrative the advantage is that such device can be used for
Any electron beam equips alignment electron beam, the electron beam equipment such as electron beam welding equipment, electron beam increasing material manufacturing dress
Standby or scanning electron microscope.
In example embodiment, the opening in figuratum aperture modulator and/or figuratum aperture resolver is by cloth
It is set to 1 dimension or 2 dimension patterns.At least this embodiment is unrestricted and illustrative the advantage is that modulator structure can
To be designed on one or several directions carry out calibration/verification to electron beam.
Of the invention there are also in another example embodiment, 1 dimension or 2 dimension patterns are periodic or aperiodicity
's.Non-periodic pattern unrestricted and illustrative the advantage is that the non-periodic pattern can make on detector
The central peak of X-ray signal more clearly protruded from each secondary lobe of the X-ray signal on equality detector.This is having
It may be more in the case where using the very big opening of number in the aperture modulator of pattern and/or figuratum aperture resolver
What exacerbation was wanted.
Of the invention there are also in another example embodiment, figuratum aperture modulator and/or figuratum aperture are solved
The opening at first position of parser is arranged to micro- pattern with the first kind, and figuratum aperture modulator
And/or the opening in the second place of figuratum aperture resolver is arranged to micro- pattern with Second Type.
At least this embodiment is unrestricted and illustrative the advantage is that can receive from single scanning direction
To the more information about beam specification.
Of the invention there are also in another example embodiment, micro- pattern of the first kind is in a first direction multiple
Slot, and micro- pattern of Second Type is multiple slots in a second direction.At least this embodiment unrestricted and
Illustratively the advantage is that X-ray signal intensity can be improved while maintaining X-ray signal resolution ratio.
In also another example embodiment of the invention, figuratum aperture modulator and figuratum aperture resolver
Basic material be designed, to shield X-ray radiation.At least unrestricted and illustrative advantage of this embodiment
It is, X-ray radiation only may reach inspection via the opening in figuratum aperture modulator and figuratum aperture resolver
Survey device.
In also another example embodiment of the invention, between X-ray detector and figuratum aperture resolver,
Perhaps it is modulated between figuratum aperture resolver and figuratum aperture modulator or in substrate and figuratum aperture
Between device, protecting window is arranged.At least this embodiment is unrestricted and illustrative the advantage is that partly or entirely
Detector can be disposed in the outside of vacuum chamber.This embodiment another advantage is that detector for material deposit
It can be insensitive.
It can be workbench equipped with reference pattern in also another example embodiment.At least this embodiment is non-
It is restrictive and illustrative the advantage is that before starting calibration/verification process, in figuratum aperture modulator and base
It can be between plate and at a distance from figuratum aperture modulator is between figuratum aperture resolver unknown.This
Reference pattern can determine the scale (scale) of detected signal.
Of the invention there are also in another example embodiment, figuratum aperture resolver is disposed in and X-ray detection
Device is apart at a distance.At least this embodiment unrestricted and it is illustrative the advantage is that detector relative to
The layout of figuratum aperture resolver and the functionality of the device are relatively independent.
In another example embodiment of the invention, figuratum aperture resolver is replaced by figuratum detector.Extremely
This embodiment is unrestricted and illustrative the advantage is that eliminating figuratum aperture resolver and having pattern less
Aperture modulator and detector any alignment regulation (procedure) when manufacturing described device.
In also another example embodiment of the invention, described device further includes at least one second X-ray detector,
At least one described second X-ray detector is arranged to figuratum aperture resolver and the modulation of figuratum aperture
Device;Figuratum aperture resolver at least one opening towards at least one second X-ray detector is by cloth
It sets before at least one described second X-ray detector;Between figuratum aperture resolver and substrate, figuratum hole
It is apart at preset distance, wherein figuratum aperture tune that diameter modulator, which is provided at figuratum aperture resolver and substrate,
Device processed at least first direction have multiple openings, wherein by least one described second X-ray detector detect Lai
From before the x-ray on the surface, using figuratum aperture modulator and figuratum aperture resolver, to from the table
The x-ray in face carries out intensity modulated, wherein at least one described first X-ray detector and at least one second X-ray detection
It is at preset distance, for detecting the height change in substrate surface that device, which is disposed in apart,.
At least this embodiment is unrestricted and illustrative the advantage is that can carry out school with to electron beam
Substrate topography is detected while standard/verifying.
In yet another embodiment embodiment of the invention, the first and second x-ray detectors are disposed in and substrate-parallel
In plane, and elevation information is determined by triangulation.At least this embodiment is unrestricted and illustrative
The advantage is that receiving time difference and the first and second x-ray detectors between X-ray signal by the first and second detectors
The sequence for having received x-ray signal can provide the instruction of surface topography.From same position issue X-ray between it is longer
Time interval indicate biggish relative height differential.It can be provided by the sequence that the first and second detectors receive signal from nominal
Apparent height increases or the instruction of recess (cavity).At nominal surface, the first and second detectors just receive X-ray simultaneously
Signal.
In yet another embodiment embodiment, it is described at least one first and at least one second detector be disposed in single list
In member.At least this embodiment is unrestricted and illustrative the advantage is that two detectors may be by each other
Calibration.
There are also in another example embodiment, it is described at least one first and at least one second detector be disposed in point
In the unit opened.At least this embodiment is unrestricted and illustrative the advantage is that the first and second detectors can
To be arranged to the electron beam equipment that wherein there is sufficient space.
In another aspect of the invention, it provides a kind of for forming 3 by each section for continuously fusing powder bed
The method for tieing up object, the part correspond to the continuous section of 3 dimension objects, the described method comprises the following steps: providing 3 dimension objects
Model;Apply the first powder bed on the table;Electron beam from electron beam source is guided the electron beam on workbench
Guidance cause the first powder bed to be fused according to the model in the first selected location, to form the section of the three-dimensional object
First part;And using figuratum aperture modulator and figuratum aperture resolver to from powder bed or from dry
The X-ray of net workbench carries out intensity modulated, wherein by the detected X-ray signal by intensity modulated and institute
The referential data of preservation is compared, and is realized at least one of the size of electron beam, position, scanning speed and/or shape
Verifying.At least this embodiment is unrestricted and illustrative the advantage is that three-dimensional object can be further improved
Manufacture because can any given time during manufacture execute the verifying and adjusting of electron beam.
In yet another aspect of the invention, a kind of method for being verified to electron beam, the side are provided
Method arranges that the figuratum aperture at least one opening solves the following steps are included: before at least one X-ray detector
Parser, wherein at least one opening is just towards at least one described X-ray detector;Figuratum aperture resolver with
It between substrate, and is apart being to arrange figuratum aperture tune at preset distance with figuratum aperture resolver and substrate
Device processed, wherein the figuratum aperture modulator has multiple openings at least first direction;At least on substrate
Scanning beam on one direction, will be by the received X-ray of at least one X-ray detector for generating;And by X
The intensity modulated as detected by detector of ray signal is compared with corresponding referential data, verifies the position of electron beam
It sets, at least one of size and shape, wherein if the deviation of detected signal and referential data is less than predetermined value,
Then the electron beam is it is said that be verified.At least this method unrestricted and illustrative the advantage is that can be for
Any kind of electron beam equipment executes the verifying of any electron beam.
It can be used together above with increasing material manufacturing equipment in calibration described herein and/or verification method, described
In increasing material manufacturing equipment, energy beam spot be used to fuse dusty material layer by layer, to form three-dimensional object.
In another aspect of the invention, a kind of method for being calibrated to electron beam, the method packet are provided
Include following steps: before at least one X-ray detector, positioning, there is the figuratum aperture of at least one opening to parse
Device, so that at least one opening is just towards at least one described X-ray detector;In figuratum aperture resolver and base
It between plate, and is apart being to position figuratum aperture modulation at preset distance with figuratum aperture resolver and substrate
Device, wherein the figuratum aperture modulator has the multiple openings being upwardly oriented at least first party;Extremely on substrate
Scanning beam on few first direction, will be by the received X-ray of at least one X-ray detector for generating;Using having
The aperture modulator of pattern and figuratum aperture resolver, detection by the scanning beam generate from the surface
The X-ray of sending, wherein by utilizing intensity modulated of the setting for controlling electron beam to the X-ray signal for carrying out self-detector
It is mapped, realizes the position of electron beam, the mapping graph of size and shape;If at least one in the shape or size of electron beam
A at least one deviation just and in corresponding reference beam shape or reference beam size exceeds predetermined value, then adjusts use
In the setting of control electron beam;And the scanning, detection and regulating step are repeated, until in the shape or size of electron beam
At least one at least one deviation just and in reference beam shape or reference beam size is less than predetermined value.
In another aspect of the invention, provide it is a kind of for detecting the device of the X-ray given off from substrate surface,
Described device includes: at least one first X-ray detector;Figuratum aperture resolver;And figuratum aperture modulation
Device, in which: figuratum aperture resolver includes at least one opening towards X-ray detector, and is positioned in X-ray
Before detector;Between figuratum aperture resolver and substrate, figuratum aperture modulator is positioned in and has pattern
Aperture resolver and substrate be apart at preset distance, wherein figuratum aperture modulator has at least first direction
Multiple openings;And before detecting the x-ray from the surface by X-ray detector, figuratum aperture tune is utilized
Device processed and figuratum aperture resolver carry out intensity modulated to the x-ray from the surface.
In another aspect of the invention, a kind of program unit is provided, when described program unit executes on computers
It is configured and is arranged to implement a kind of method for calibrating electron beam, the described method comprises the following steps:
Before at least one X-ray detector, arranging has the figuratum aperture resolver of at least one opening, wherein it is described at least
One opening is just towards at least one described X-ray detector;Between figuratum aperture resolver and substrate, and with
Figuratum aperture resolver and substrate are apart to arrange figuratum aperture modulator at preset distance, wherein described have figure
The aperture modulator of case has multiple openings at least first direction;On substrate at least first direction scanning electron
Beam, will be by the received X-ray of at least one X-ray detector for generating;Using figuratum aperture modulator and have
The aperture resolver of pattern carries out intensity modulated to the X-ray issued from the surface, wherein by utilizing for controlling electronics
The setting of beam to mapping by the X-ray signal of intensity modulated for self-detector is carried out, realize the position of electron beam, size and
The mapping graph of shape;If the shape and/or size of electron beam just with corresponding reference beam shape and/or reference beam ruler
Very little deviation exceeds predetermined value, then adjusts the setting for controlling electron beam;And repeat the scanning, intensity modulated and adjusting
Step, until the shape of electron beam is just being less than predetermined value with reference beam shape and/or dimensional discrepancy.
In another aspect of the invention, a kind of non-transient computer program product is provided, the non-transient computer journey
Sequence product includes at least one computer-readable storage media with the computer readable program code part wherein embodied, institute
State computer readable program code part include: be configured on substrate at least first direction scanning beam can
Execution part, will be by the received X-ray of at least one X-ray detector for generating;It is configured for utilizing and has pattern
Aperture modulator and figuratum aperture resolver the executable portion of intensity modulated is carried out to the X-ray that issues from the surface
Point, wherein by utilizing the setting for controlling electron beam to carry out the X-ray signal by intensity modulated for carrying out self-detector
Mapping, realizes the position of electron beam, the mapping graph of size and shape;If being configured for the shape and/or size of electron beam
Just then adjusted for controlling electron beam with corresponding reference beam shape and/or reference beam dimensional discrepancy beyond predetermined value
Setting executable part;And be configured for repeating the executable part of the scanning, intensity modulated and regulating step,
Until the shape of electron beam is just being less than predetermined value with reference beam shape and/or dimensional discrepancy.
In another aspect of the invention, a kind of method for being verified to electron beam, the method packet are provided
It includes following steps: before at least one X-ray detector, arranging that the figuratum aperture at least one opening parses
Device, wherein at least one opening is just towards at least one described X-ray detector;In figuratum aperture resolver and base
It between plate, and is apart being to arrange figuratum aperture modulation at preset distance with figuratum aperture resolver and substrate
Device, wherein the figuratum aperture modulator has multiple openings at least first direction;At least first on substrate
Scanning beam on direction, will be by the received X-ray of at least one X-ray detector for generating;And by the way that X is penetrated
The intensity modulated as detected by detector of line signal is compared with corresponding referential data, verifies the position of electron beam
It sets, at least one of size and shape, wherein if the deviation of detected signal and referential data is less than predetermined value,
Then the electron beam is it is said that be verified.
In another aspect of the invention, it provides a kind of for forming 3 by each section for continuously fusing powder bed
The method for tieing up object, the part correspond to the continuous section of 3 dimension objects, the described method comprises the following steps: providing 3 dimension objects
Model;Apply the first powder bed on the table;Electron beam from electron beam source is guided the electron beam on workbench
Guidance cause the first powder bed to be fused according to the model in the first selected location, to form the section of the three-dimensional object
First part;And figuratum aperture modulator and figuratum aperture resolver are utilized, to from powder bed or coming from
The X-ray of clean workbench carries out intensity modulated, wherein by the detected X-ray signal by intensity modulated with
The referential data saved is compared, and is realized at least one in the size of electron beam, position, scanning speed and/or shape
A verifying.
In another aspect of the invention, a kind of program unit is provided, when described program unit executes on computers
It is configured and is arranged to implement a kind of method for verifying electron beam, the described method comprises the following steps:
Before at least one X-ray detector, arranging has the figuratum aperture resolver of at least one opening, wherein it is described at least
One opening is just towards at least one described X-ray detector;Between figuratum aperture resolver and substrate, and with
Figuratum aperture resolver and substrate are apart to arrange figuratum aperture modulator at preset distance, wherein described have figure
The aperture modulator of case has multiple openings at least first direction;On substrate at least first direction scanning electron
Beam, will be by the received X-ray of at least one X-ray detector for generating;And by X-ray signal by detecting
Intensity modulated detected by device is compared with corresponding referential data, verifies the position of electron beam, in size and shape
At least one, wherein if the deviation of detected signal and referential data be less than predetermined value, the electron beam it is said that
It is verified.
In another aspect of the invention, a kind of non-transient computer program product is provided, the non-transient computer journey
Sequence product includes at least one computer-readable storage media with the computer readable program code part wherein embodied, institute
Stating computer readable program code part includes: to be configured for having at least at least one X-ray detector arranged in front
The executable part of the figuratum aperture resolver of one opening, wherein at least one opening is just towards described at least one
A X-ray detector;It is configured between figuratum aperture resolver and substrate and is solved with figuratum aperture
Parser and substrate are apart the executable part that figuratum aperture modulator is arranged at preset distance, wherein described figuratum
Aperture modulator has multiple openings at least first direction;It is configured on substrate scanning up at least first party
The executable part of electron beam, will be by the received X-ray of at least one X-ray detector for generating;And it is configured
For being tested and the intensity modulated as detected by detector of X-ray signal is compared with corresponding referential data
The executable part for demonstrate,proving at least one of position, size and shape of electron beam, wherein if detected signal and ginseng
The deviation for examining numerical value is less than predetermined value, then the electron beam is it is said that be verified.
Herein and throughout herein, is describing exemplary embodiment or identifying the place of its advantage, such example
Property embodiment and advantage be considered and be intended to it is substantially exemplary and not restrictive, so as not to otherwise limiting or
Constrain the range and essence of disclosed invention design.
Detailed description of the invention
Hereinafter the present invention will be further described with reference to the accompanying drawings by unrestricted mode.Throughout several width of attached drawing
Figure, corresponding similar portions are indicated using identical reference character:
Fig. 1 depicts the schematic side elevational of the first example embodiment of the device for carrying out calibration/verification to electron beam
Figure;
Fig. 2A and 2B depict for electron beam carry out calibration/verification device in figuratum aperture modulator and
The schematic side elevation of two example embodiments of figuratum aperture resolver setting;
Fig. 3 depicts the equipment that can be implemented within apparatus and method of the present invention;
Fig. 4 depicts the schematic flow chart of the method for the present invention of embodiment according to the present invention;
Fig. 5 depicts the first example embodiment of two detector means for carrying out calibration/verification to electron beam
Schematic side elevation;
Fig. 6 depicts the first example embodiment of the detector array array apparatus for carrying out calibration/verification to electron beam
Schematic side elevation;
Fig. 7, which is depicted, how to be modulated using X-ray detector, figuratum aperture resolver and figuratum aperture
Device carries out the schematic side elevation of calibration/verification to the size and shape of electron beam;
Fig. 8 is the block diagram of exemplary system 1020 according to various embodiments;
Fig. 9 A is the schematic block diagram of server 1200 according to various embodiments;And
Fig. 9 B is the schematic block diagram of exemplary mobile device 1300 according to various embodiments.
Specific embodiment
Now, various example embodiments of the invention are described in more detail below below with reference to appended attached drawing,
In show some but not all embodiments of the invention.Really, implementation of the invention can be embodied in many different forms
Example, and the embodiment of the present invention should not be interpreted as being limited to embodiment set forth herein.On the contrary, these embodiments are provided,
So that present disclosure will meet applicable law requirement.Unless otherwise defined, otherwise used herein all
Technical and scientific term has the meaning for usually knowing and understanding with a those of ordinary skill in field according to the present invention
Identical meaning.Unless otherwise indicated, art otherwise is used in replaceable and both meanings of connection function herein
Language "or".From beginning to end, similar number refers to similar unit.
In order to promote the understanding of the present invention, multiple terms are defined below.The term being defined herein have such as with
Invent the normally understood meaning of those of ordinary skill in relevant field.The term of such as " one ", "one" and "the" etc
It is not intended to refer to odd only entity, but including general category, the specific example of the general category can be used for illustrating.Herein
In proper noun specific embodiment for describing the present invention, still, in addition to as summarized in the claims, it
Use delimit boundary of the invention.
Term " three-dimensional structure " as used in this article etc. generally refer to the intention production for being intended for specific purpose or
Actual fabrication (for example, one or more structural materials) three-dimensional configuration.Such structure etc. can be for example by means of three-dimensional
CAD system is designed.
As the term " electron beam " used in various embodiments herein refers to any charged particle beam.Charged particle beam
Source may include electron gun, linear accelerator etc..
Fig. 3 depicts the example embodiment of free forming production or increasing material manufacturing equipment 300, makes in the free forming
Or in increasing material manufacturing equipment 300, it is possible to implement calibration/verification method and calibration/verification device of the invention.School of the invention
Standard/verification method and device can also be embodied in scanning electron microscope (SEM), electronic welding equipment or other scanning electricity
In beamlet equipment.
Equipment 300 includes: electron gun 302;Two powder hoppers 306,307;Starting sheet 316;Build storage tank (build
Tank) 312;Powder dispenser 310;Construct platform 314;Vacuum chamber 320, control unit 350 and calibrating installation 360.
Vacuum chamber 320 can maintain vacuum environment by vacuum system, and the system may include turbomolecular pump, whirlpool
Rotation pump, ionic pump and one or more valve, these it is well known to those skilled in the art., and therefore in sheet
It does not need hereinafter to be explained further.The vacuum system can be controlled by control unit 350.
Electron gun 302 just generates electron beam 370, and the electron beam 370 can be used to melt offer on starting sheet 316
Dusty material 318 or the dusty material 318 is fused together.Electron gun 302 may be provided in vacuum chamber 320
In.Control unit 350 can be used to control and manage the electron beam projected from electron beam gun 302.At least one focus coil
It is single that (not shown), at least one deflection coil (not shown) and electron beam power supply unit (not shown) may be electrically connected to control
Member 350.In example embodiment of the invention, electron gun 302 generates the electron beam that can be focused as follows: the electronics focused
Beam is with the acceleration voltage for about 60kV and with the beam power in the range of 0 to 10kW.When by utilizing energy
When amount beam successively fuses powder and builds three-dimensional object, the pressure in vacuum chamber may be at 1x10-3To 1x10-6The model of mBar
In enclosing.
Powder hopper 306,307 includes being provided at the dusty material built on the starting sheet 316 in storage tank 312.
The dusty material for example can be pure metal or metal alloy, such as titanium, titanium alloy, aluminium, aluminium alloy, stainless steel, Co-Cr-W
Alloy etc..
Powder dispenser 310, which is arranged on starting sheet 316, lays thin layer of powder material.During working cycles,
Construct platform 314 will continuously be reduced after the layer of powder material of each addition about ray gun.In order to make this movement
It is possibly realized, in one embodiment of the invention, construct platform 314 is arranged to be moveable in vertical direction,
That is being moveable on the direction indicated by arrow P.This means that construct platform 314 starts from initial position,
The first layer of powder material with necessary thickness is laid in the initial position on starting sheet 316.The first of dusty material
Layer can be thicker than other layers applied.The reason of starting from the first layer than other layer thicker is to be not intended to melt first layer
Through on starting sheet.Hereafter, in conjunction with new layer of powder material is laid, construct platform is reduced, is cut with forming the new of three-dimensional object
Face.It for example can be the servo engine by being equipped with gear, adjusting screw rod etc. for reducing the device of construct platform 314.
The model of three-dimensional object can be via CAD(CAD) tool generation.
After completing first layer, that is to say, that after fusing first layer of the dusty material to obtain three-dimensional object,
Second powder bed is provided on workbench 316.The second powder bed is distributed advantageously according to in front layer identical mode.But
In identical increasing material manufacturing machine, it is understood that there may be the method for the replacement for powder being assigned on workbench.For example,
First layer can be provided by the first powder dispenser, the second layer can be provided by another powder dispenser.According to carrying out automatic control
The instruction of unit processed automatically changes the design of powder dispenser.Powder dispenser has single rake pin (single rake) system
Form, that is to say, that a rake pin is just being stopped from left side powder hopper 306 and right side powder hopper 307 and both is all being fallen
Under powder, such a rake pin can change design.
After the second powder bed is assigned on workbench 316, energy beam is guided on workbench, to draw
It plays the second powder bed to fuse in selected location, to form the second section of three-dimensional object.The part fused in the second layer can
To be engaged to the part of first layer fused.By not only melting the powder in top layer, but also melt directly most upper
One layer of at least part thickness below layer, the part fused in first layer and the second layer can be melted in together.
Fig. 1 depicts the signal of the first example embodiment of the device 100 for carrying out calibration/verification to electron beam 110
Property side view.Device 100 includes the figuratum aperture 130 of modulator, the figuratum aperture 140 of resolver and at least one X
Ray detector 150.
It is apart preset distance B that the figuratum aperture 130 of modulator, which is provided at the figuratum aperture 140 of resolver,
Place.The figuratum aperture 130 of modulator includes multiple opening 131-137.These openings may be provided as regular pattern or not
Regular pattern.The specification of the opening is in the range of 1 to 10000 μm.The opening can have circular shape, rectangle shape
Shape or shape of slit.The opening can be arranged 1 dimension or 2 dimensions.
The different openings in figuratum aperture 130 can be equipped with different types of micro- pattern.First opening can have
Micro- pattern of the first kind, and the second opening can have micro- pattern of Second Type.Micro- pattern of the first kind can be
Multiple slits on first direction.Micro- pattern of Second Type can be multiple slits in a second direction.
The figuratum aperture 140 of resolver includes at least one opening 145.At least one opening 145 can have
Specification in 1 to 10000 μ m.At least one opening 145 can have circular shape, rectangular shape or slit
Shape.
In the case where multiple openings in the figuratum aperture 140 of resolver, the opening can be arranged 1 dimension or
2 dimensions.
Opening in the figuratum aperture 140 of resolver can be equipped with micro- pattern.Micro- pattern can be it is circular,
1 dimension of rectangle or shape of slit opening or 2 dimension patterns.
The different openings in the figuratum aperture 140 of resolver can be equipped with different types of micro- pattern.First opening can
With micro- pattern with the first kind, and the second opening can have micro- pattern of Second Type.Micro- pattern of the first kind can
To be multiple slits in a first direction.Micro- pattern of Second Type can be multiple slits in a second direction.
The figuratum aperture 130 of modulator may be provided in substrate 170 at a distance of at preset distance A.It is in distance A
In the case where unknown, reference pattern can be provided on substrate 170, for realizing the different tested locations on substrate 170
The correct scale the distance between set.In the case where distance A is to explicitly define, the reference pattern may be become unnecessary,
Because the scale is true by the specification of distance A, B and the figuratum aperture 130 of modulator and the figuratum aperture 140 of resolver
It is fixed.Distance B can be 100 between 500mm.Distance A can be 300 to 1000mm.Distance D can be 10 to 100mm, and
Distance C can be 100 to 1000mm.
X-ray radiation 120 will be created by impinging upon the electron beam on substrate 170, and the X-ray radiation 120 is all reversed
It is radiated on direction, that is to say, that enter spoke on the direction in ambient enviroment (vacuum chamber) leaving the top surface of substrate 170
It penetrates.In Fig. 1, it is illustrated as striking the institute of that first position 171 using in the electron beam 110 around substrate 170
There is the small arrow on direction, illustrates this reradiation.
Being allowed through modulator from the X-ray that the first position of substrate 170 171 issues within small angular interval has
The first opening 131 in the aperture 130 of pattern is passed via at least one of figuratum aperture 140 of resolver opening 145
To X-ray detector 150.
By electron beam being moved to the second position 172 of substrate 170, from substrate 170 within small angular interval
The X-ray that the second position 172 issues is allowed through the second opening 132 in the figuratum aperture 130 of modulator via parsing
At least one of figuratum aperture 140 of device opening 145 and pass to X-ray detector 150.
In the same fashion, be allowed to from the third on substrate 170 to the X-ray that the 7th position 173-177 is issued through
By figuratum aperture resolver 140 and via figuratum aperture modulator 130 corresponding opening 133-137 and reach
X-ray detector 150.
By being detected by X-ray detector come the modulated of at least two different location 171-177 in self-reference substrate 170
X-ray signal can calibrate electron-beam position.If being known and having pattern in the front distance A of calibration process
Aperture modulator 130 in the distance between each individual opening be it is known, then detected x-ray and beam at
The setting of shape and positioning unit, which is combined, will determine the physical location of electron beam.
Beam shaping and positioning unit may include at least one deflection coil, at least one focus coil and at least one
Astigmatism soil (astigmatism soil).
It is predetermined by detecting two issued from two different location 131-137 on figuratum aperture modulator 130
Time between signal can determine scanning speed.It is equipped with constant signal if it is deflection coil, and due to figuratum
In the modulator of aperture it is each it is individual opening the distance between be it is known, then can readily calculate scanning speed.
By analyzing the signal Jing Guo intensity modulated, the size and shape of electron beam can be determined.As electron beam is in base
It is deflected on plate, the prodefined opening and figuratum aperture resolver that will more or less pass through in figuratum aperture modulator
In prodefined opening detect the X-ray for carrying out self-reference substrate.The edge of opening can be crossed with the signal Jing Guo intensity modulated and
The information about electron beam dimensions and shape is determined according to the signal.X-ray is detected by the predetermined position on detector
The duration of signal can be proportional to the size of beam spot on deflection direction.In order to determine in the other directions
Beam spot size and shape, it has to change deflection direction.By at least two deflection Orientation detectors
On predetermined position on x-ray signal, be provided with the information of beam dimensions and shape in said two directions.By making
With more deflection directions, the accuracy of beam shape can be improved.
Fig. 7 depicts how can use X-ray detector, figuratum aperture resolver and the modulation of figuratum aperture
Device carries out the schematic side elevation of calibration/verification to the size and shape of electron beam.Electron beam in this illustration is assumed tool
There is rectangular shape.It should be evident that the electron beam of any desired shape can be used, but use the rectangular shape only
It is to simplify the explanation.With the scan rectangle beam on surface 770, from the X-ray of the impingement position sending on substrate
Signal can reach detector 750.When the scanning beam on the direction provided by the arrow in the figure, square shape
The signal of electron beam will be as the Figure 76 0 being made of point in 740 front of figuratum aperture resolver.The inclination of the figure
Part indicates the X-ray signal partly hidden by the opening 735 in pattern aperture modulator 730.By analyzing by detector
The shape of the 750 detected signals by intensity modulated received, it may be possible to determine the beam on deflection direction
Shape.
Fig. 2A depicts the figuratum aperture modulator in the device for carrying out calibration/verification to electron beam and has figure
The schematic side elevation of first example embodiment of the aperture resolver setting of case.In this embodiment, figuratum aperture
Modulator 230 includes the first aperture collection 237 and the second aperture collection 238.First aperture collection 237 includes being regularly spaced each other
3 opening 231,232,233.Second aperture collection 238 include be regularly spaced each other three openings 234,235,
236.First and second aperture collection 237,238 are disposed in apart at following distance: the distance is greater than first or the
The independent distance between two openings that an aperture in two aperture collection 237,238 is concentrated, that is to say, that opening 233 with
The distance between 234 be greater than between 231 and 232 at a distance from or greater than at a distance between 235 and 236.In certain implementations
In example, figuratum aperture resolver includes three openings 241,242,243.
As electron beam is deflected on substrate 270, create following X-ray: the X-ray will be towards detector
250 side travels upwardly.Since face is disposed with figuratum aperture modulator 230 and the parsing of figuratum aperture in front of the detector
Device, only some of X-rays will hit detector.
As electron beam hits position 271a, the fraction of the x-ray only created at this location will hit the detection
Device, this is illustrated by single dotted line.This fraction will hit the right-most position of detector 250, because of this fraction
By the third opening 243 in the opening 231 and figuratum aperture resolver 240 in figuratum aperture modulator 230.
As electron beam hits position 272a, the X-ray of slightly larger part passes through figuratum aperture modulator
230 and figuratum aperture resolver 240, this is indicated by two dotted lines from position 272a.First line will pass through
Opening 231 and opening 242 and pass to the middle position on detector 250.Article 2 line will pass through opening 232 and opening 243
Pass to the right-most position on detector 250.
As electron beam hits position 273a, the X-ray of the largest portion from first area 278 passes through figuratum
Aperture modulator 230 and figuratum aperture resolver 240, this is indicated by three dotted lines from position 273a.First
Bar line will pass to the left-most position on detector 250 by opening 231 and opening 241.Article 2 line will pass through opening 232
The middle position on detector 250 is passed to opening 242.Article 3 line will be passed to and detected by opening 233 and opening 243
Right-most position on device 250.
As electron beam hits position 274a, the quantity for reaching the X-ray of detector is reduced compared with the 273a of position.And
As electron beam hits position 275a, reach the X-ray of detector quantity be further reduced it is smaller compared with the 274a of position.
Each of position 271a-275a in first area 278 may be used to determine whether the position of electron beam, ruler
Very little, shape and speed, 273a can be main peak value there, and 271a, 272a, 274a and 275a be can or can not by with
In the secondary lobe of calibration/verification purpose.The difference between the 271a-275a of position in first area 278 is received by detector
X-ray signal quantity.
The exemplary advantage of figuratum aperture modulator and multiple openings in figuratum aperture resolver can be
To increase detected signal while maintaining the resolution ratio of detected X-ray signal.
The X-ray issued from the first area of substrate 270 278 passes through first in figuratum aperture modulator 230
Opening collection 237.
The X-ray issued from the second area 279 of substrate 270 will be allowed in figuratum aperture modulator 230
Second opening collection.In this embodiment, the first opening collection 237 is equal to the second opening collection, that is to say, that in the first collection 237
Number of openings, opening size and shape are identical with the second collection 238.For this reason, come the first area of self-reference substrate 270
The signal strength mode of the x-ray of different location 271a-275a in 278 by in the second area 279 for carrying out self-reference substrate 270
The signal strength mode of the x-ray of different location 271b-275b is identical.
Fig. 2 B depicts the figuratum aperture modulator in the device for carrying out calibration/verification to electron beam and has figure
The schematic side elevation of second example embodiment of the aperture resolver setting of case.It is figuratum in this second embodiment
Opening 241 ', 242 ', 243 ' of the aperture resolver 240 ' equipped with irregular pattern.Figuratum aperture modulator 230 ' is also matched
Have the opening 231 ', 232 ', 233 ' of irregular pattern.
It is not advised by being arranged at least one of figuratum aperture modulator and/or figuratum aperture resolver
The then opening of pattern, the signal intensity ratio between following two positions are increased: a position is that the just detection of detector 250 comes
From the position of the X-ray signal of each opening in the opening in figuratum aperture modulator 230 ', a position is wherein
Detector 250 just detects the position for some openings being only from the opening in figuratum aperture modulator 230 ';Namely
It says, arrives irregular component by the way that at least one of figuratum aperture modulator and/or figuratum aperture resolver are changed
Case rather than regular pattern, the difference between full strength signal and half full strength signal are increased.
The opening can have any kind of shape, and any kind of shape includes but not limited to rectangle, circle
Shape, ellipse, square, triangle, hexagon are formed by slot.Using irregular pattern it is intended that central peak
It is prominent from secondary lobe.This may be advantageous using a large amount of openings.
Fig. 5 illustrates the embodiment for wherein using the first detector 510 and the second detector 520.First detector
510 and second detector 520 be disposed in it is apart at preset distance M.First detector 510 has pattern equipped with first
Aperture resolver 515.Fig. 5 illustrates only single beam, and to improve the clarity of embodiment, but actual system can make
With the technology for being similar to Fig. 2A or Fig. 2 B.Second detector 520 is equipped with the second figuratum aperture resolver 525.First He
Second detector 510,520 is provided in the first plane parallel with substrate 570.First and second figuratum aperture parsings
Device 515,525 is provided in the second plane parallel with substrate 570.First and second planes can be disposed in apart
At preset distance.In example embodiment, the first and second planes are identical, that is to say, that figuratum aperture resolver
It is attached on detector or the first detector 510 and the second detector is 1 dimension or 2 dimension arrays of separated detector.
It is apart pre- that first figuratum aperture modulator 530, which is provided at the second figuratum aperture modulator 540,
At set a distance Q.First and second figuratum aperture modulators 530,540 are provided at the third plane parallel with substrate 570
It is interior.It is apart at preset distance P that third plane, which is provided at the second plane,.Third plane is provided at substrate 570 apart
At preset distance R.
It can not only be used to according to the layout with two detectors being arranged in the plane with substrate-parallel of Fig. 5
Calibration/verification is carried out to the position of electron beam, size, shape and speed in the X-Y plane at substrate surface, but also can be with
It is used to detect the pattern on the surface of substrate 570.
As indicated by the curve graph on the left of two detector setting, in the graph, X-ray signal
In Y-axis, and the time, in x-axis, the specific time difference between detector A-B can correspond to certain height.According to Fig. 5's
In setting, only has a point on substrate 570, X-ray signal can reach the first detector 510 and second simultaneously at this point
Detector 520, this can be the nominal height of substrate 570.If the first detector 510 just connects before the second detector 520
X-ray signal is received, then it is I, i.e. the instruction higher than the substrate point of nominal height.On the contrary, if the second detector 520 is just
X-ray signal is received before one detector 510, then it is less than the instruction of the substrate point of nominal height.
In order to cover the substrate regions bigger than only one position and in order to increase detected signal, Ke Yi
The opening of certain amount is provided in the first and second figuratum aperture modulators 530,540.
There are also in another example embodiment, at least first and second figuratum aperture modulators are opened equipped with multiple
Mouthful, and the first and second figuratum aperture resolvers 515,525 are equipped with multiple openings.In another example embodiment,
The multiple opening at least one of figuratum aperture resolver is substituted with the array (1 dimension or 2 dimensions) of detector.
In Fig. 6, the figuratum aperture in the device 600 for carrying out calibration/verification to electron beam is illustrated
The schematic side elevation of modulator 640 and another example embodiment of figuratum aperture resolver 630 setting.In this implementation
In example, the detector is the detector array of 1 dimension or 2 dimensions.In illustrated setting, detector array 650 will be covered
Cover the radioscopic image from least two positions on substrate 670.If detector array is 1 dimension, radioscopic image
It is 1 dimension image of electron beam.If detector array is 2 dimensions, radioscopic image is 2 dimension images of electron beam.In array
The number of detector and the size of detector will determine the resolution ratio of radioscopic image.
If it is determined that deflection speed beyond specification, then can send caution signal to the operator of machine.Implement in replacement
In example, when determining deflection speed beyond specification, increasing material manufacturing machine can be cut off or increasing material manufacturing machine is placed in the free time
State.
In some embodiments it is possible to workpiece equipped with reference pattern.This reference pattern, which can be used to calibrate, to be swept
Speed and relative position are retouched, and may be utilized for detecting other deviations in energy beam string.
Electron beam source be used to generate electron beam 260, and the electron beam 260 can be by least one deflection coil (not
Show) it is deflected by workbench 250.By changing the magnetic field of deflection coil, can appoint within scheduled maximum region
Mobile electron beam 260 at what desired position.
By the magnetic field for changing deflection coil, that is to say, that by making the electric current in deflection coil by oblique at different rates
Slope increases (ramping), can change the deflection speed of electron beam, wherein compared with the lower ramp-up rate by slope, it is higher
Will lead to bigger deflection speed by slope ramp-up rate.For deflection speed verifying with previously with respect to described in Fig. 1
It is identical.Unique difference between Fig. 1 and 2 is how energy-beam source and energy beam are deflected.
Fig. 4 depicts the schematic flow chart of the method for the present invention of embodiment according to the present invention.In the method, lead to
The each section for crossing continuous fusion powder bed, forms 3 dimension objects, and the part corresponds to the continuous section of 3 dimension objects.
In the first step by 410 marks, the model of 3 dimension objects is provided.The model can pass through CAD work appropriate
Tool generates.
In the second step by 420 marks, the first powder bed is applied on the table.
In the third step by 430 marks, the electron beam from electron beam source is guided on workbench.Electron beam
Guidance cause the first powder bed to be fused according to the model in the first selected location, to form the section of the three-dimensional object
First part.
It is right using figuratum aperture modulator and figuratum aperture resolver in the four steps by 440 marks
X-ray from powder bed or from clean workbench carries out intensity modulated, wherein by detected process intensity
The X-ray signal of modulation is compared with the referential data saved, realize to the size of electron beam, position, scanning speed and/
Or the verifying of at least one of shape.The referential data saved can be created when machine was once new.The ginseng
Examining numerical value can be created in any time of the service life early stage of increasing material manufacturing machine.
In the example of explanation illustrated above, figuratum aperture modulator and/or figuratum aperture resolver can
To be manufactured with following material, the material can efficiently completely cut off X-ray radiation, for example, be lead, brass, copper or have plateau
Other metals of sub- ordinal number or the alloy being made from it.In example embodiment, figuratum aperture modulator and/or there is figure
The aperture resolver of case can be made of the material with relatively low atomic number, such as made of aluminum, and hereafter cover
There is another material with high atomic number, for example is covered with gold or copper.
In another aspect of the invention, a kind of program unit is provided, when described program unit executes on computers
It is configured and is arranged to the position to energy beam spot, size, shape and deflection speed and carries out calibration/verification.Described program
Unit can specifically be configured to execute following steps: before at least one X-ray detector, arrangement has at least one
The figuratum aperture resolver of opening, wherein at least one opening is just towards at least one described X-ray detector;?
Between figuratum aperture resolver and substrate, and with figuratum aperture resolver and substrate at predetermined distances,
Figuratum aperture modulator is arranged, wherein the figuratum aperture modulator has multiple open at least first direction
Mouthful;On substrate at least first direction scanning beam, for generate to be received by least one described X-ray detector
X-ray;Using figuratum aperture modulator and figuratum aperture resolver, to from the X-ray that the surface issues into
Row intensity modulated, wherein by utilizing the setting for controlling electron beam to the X-ray by intensity modulated for carrying out self-detector
Signal is mapped, and realizes the position of electron beam, the mapping graph of size and shape;If the shape and/or size of electron beam are just
Exceed predetermined value with corresponding reference beam shape and/or reference beam dimensional discrepancy, then adjusts for controlling electron beam
Setting;And step c-e is repeated, until the shape of electron beam is just being less than predetermined value with reference beam form variations.
Described program unit can be installed in computer-readable storage media.It is described as may expect
Computer-readable storage media can be control unit 350 or another completely different control unit.It is described computer-readable
Storage medium and program unit (described program unit may include the computer readable program code part wherein embodied) may be used also
To be comprised within non-transient computer program product.It is provided in turn below about the further thin of these features and configuration
Section.
As mentioned, various embodiments of the present invention can be implemented in various ways, which includes quilt
It is embodied as non-transient computer program product.Computer program product may include storage application, program, program module, script,
Source code, program code, object code, syllabified code, compiled code, interpretive code, machine code, executable instruction etc.
It (also referred to herein as executable instruction, the instruction for execution, program code and/or is interchangeably used herein similar
Term) non-transient computer-readable storage media.Such non-transient computer-readable storage media includes all computers
Readable medium (it includes volatile and non-volatile media).
In one embodiment, the readable storage medium of non-volatile computer may include floppy disk, flexible disk (flexible
Disk), hard disk, solid state memory (SSS) (for example, solid state drive (SSD), solid-state card (SSC), solid state module (SSM)), enterprise
Industry grade flash drive, tape or any other non-transient magnetic medium etc..The readable storage medium of non-volatile computer is also
It may include that punched card, paper tape, optical markings piece (optical mark sheet) (or have sectional hole patterns or other optics can
Recognize mark any other physical medium), compact disk read-only memory (CD-ROM), the rewritable device of compact disk compact disk
(CD-RW), digital versatile disc (DVD), Blu-ray disc (BD), any other non-transient optical medium etc..It is such non-volatile
Property computer-readable storage media can also include read-only memory (ROM), programmable read-only memory (prom), it is erasable can
Program read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory (for example, it is serial,
With it is non-or non-etc.), multimedia memory cards (MMC), secure digital (SD) memory card, smart media card, compact flash
(CF) card, memory stick etc..Further, the readable storage medium of non-volatile computer can also include that conductive bridge is deposited at random
Access to memory (CBRAM), phase change random access memory devices (PRAM), ferroelectric RAM (FeRAM), it is non-volatile with
Machine accesses memory (NVRAM), magnetoresistive RAM (MRAM), resistive random access memory storare device (RRAM), silicon oxygen
Change silicon oxynitride memory (SONOS), floating junction grid random access memory (FJG RAM), thousand-legger memory, racing track storage
Device etc..
In one embodiment, the readable storage medium of volatile computer may include random-access memory (ram), move
State random access memory (DRAM), Static Random Access Memory (SRAM), fast page mode dynamic random access memory
Device (FPM DRAM), growth data export dynamic random access memory (EDO DRAM), Synchronous Dynamic Random Access Memory
(SDRAM), double data rate Synchronous Dynamic Random Access Memory (DDR SDRAM), second generation double data rate synchronous dynamic
Random access memory (DDR2 SDRAM), third generation double data rate Synchronous Dynamic Random Access Memory (DDR3
SDRAM), Rambus dynamic random access memory (RDRAM), pair transistor RAM(TTRAM), thyristor RAM(T-RAM), zero
Capacitor (Z-RAM), Rambus embedded memory module (RIMM), double embedded memory modules (DIMM), list are embedded
Memory module (SIMM), video RAM VRAM, cache memory (including various ranks), flash storage
Device, register memory etc..It will be realized that in the case where embodiment is described as using computer-readable storage media,
Above-mentioned computer-readable storage media can be replaced with other kinds of computer-readable storage media, or removes above-mentioned computer
Other kinds of computer-readable storage media can also be used outside readable storage medium.
As it should be recognized that as, various embodiments of the present invention can also be implemented as method, equipment, system, meter
Device, computational entity etc. are calculated, as described in herein elsewhere.It is held as such, the embodiment of the present invention can be taken
The instruction that is stored in computer-readable storage media of row by execute the equipment of certain steps or operation, system, computing device, in terms of
Calculate the form of entity etc..However, the embodiment of the present invention can also take the complete hardware for executing certain steps or operation
The form of embodiment.
It is illustrated below with reference to equipment, the block diagram of method, system and computer program product and flow chart to describe various realities
Apply example.It should be appreciated that each frame of any of block diagram and flow chart diagram respectively can be partly by computer journey
Sequence instruction is realized, such as is embodied as the logic step executed on processor in computing systems or operation.These computer journeys
Sequence instruction can be loaded into computer (such as other programmable datas of special purpose computer or the machine of generation concrete configuration
Processing equipment) on, so that the instruction executed on computer or other programmable data processing devices is implemented in one or more
The function of being specified in flow chart box.
These computer program instructions can also be stored in bootable computer or other programmable data processing devices with
In the computer-readable memory that ad hoc fashion works, so that the instruction generation being stored in computer-readable memory includes
Manufacture object for the functional computer-readable instruction for implementing to specify in one or more flow chart box.Computer journey
Sequence instruction can also be loaded into computer or other programmable data processing devices, to cause series of operation steps in terms of
It is performed on calculation machine or other programmable devices, to generate computer-implemented process, so that in computer or other are programmable
The instruction executed in equipment provides the operation of the function for implementing to specify in one or more flow chart box.
Correspondingly, the frame support of block diagram and flow chart diagram is for executing the various combinations of specified function, referring to for executing
Determine the operation of function and the combination of the program instruction for executing specified function.It is also understood that block diagram and flow chart illustrated
The combination of each frame and the frame in block diagram and flow chart diagram can be based on by executing specified the dedicated of functions or operations
The computer system of hardware is implemented by the combination of specialized hardware and computer instruction.
Fig. 8 is can be together with the block diagram for the exemplary system 1020 that various embodiments of the present invention use.At least illustrated
In the embodiment of explanation, system 1020 may include one or more central computing devices 1110, one or more distributed meters
Calculate device 1120 and one or more distributed hand-held or mobile devices 1300, these devices be all configured as via one or
Multiple networks 1130 and central server 1200(or control unit) in communicating.Although Fig. 8 says the diagram of various system entities
Bright is separated, independent entity, but various embodiments are not limited to the certain architectures.
According to various embodiments of the present invention, one or more networks 1130 can according to multiple second generations (2G),
Any one or more of 2.5G, the third generation (3G) and/or forth generation (4G) mobile communication protocol etc. are supported to communicate.More
Particularly, one or more networks 1130 can be according to 2G wireless communication protocol IS-136(TDMA), GSM and IS-95
(CDMA) it supports to communicate.Moreover, for example, one or more network 1130 can be according to 2.5G wireless communication protocol
GPRS, enhance data GSM environment (EDGE) etc. to support to communicate.In addition, for example, one or more network 1130 can
According to such as using universal mobile telephone system (UMTS) network of wideband code division multiple access (WCDMA) radio access technologies etc
3G wireless communication protocol support to communicate.Some narrowband AMPS(NAMPS) and (one or more) TACS network may also
The embodiment of the present invention is benefited from, such as bimodulus or higher mould movement station (for example, digital-to-analog or TDMA/CDMA/ analog phone)
Should as.As yet another embodiment, each of the component of system 1020 be can be configured to according to such as
Radio frequency (RF), bluetooth (Bluetooth), infrared (IrDA) or any a variety of wired or wireless networking technologies of difference (including
Wired or wireless personal area network (" PAN "), local area network (" LAN "), Metropolitan Area Network (MAN) (" MAN "), wide area network (" WAN ") etc.) etc
Technology communicates with one another.
Although (one or more) device 1110-1300 is illustrated as on identical network 1130 that in fig. 8
This communication, but these devices can equally communicate on multiple separate network.
According to one embodiment, other than receiving data from server 1200, distributed devices 1110,1120 and/or
1300 can be further configured to collect and transmit by oneself data.In various embodiments, device 1110,1120 and/or
1300 can be via such as miniature keyboard, touch tablet, barcode scanner, radio frequency identification (RFID) reader, interface card
The one or more input units or device of (such as modem etc.) or receiver etc receive data.Device 1110,
1120 and/or 1300 may be further able to store data into one or more volatibility or nonvolatile memory modules,
And the user of the device for example is operated or for example, by transmitting on one or more networks 1130 by presenting the data to
Data are come via one or more output units or device output data.
In various embodiments, server 1200 includes for executing one or more according to various embodiments of the present invention
The various systems of a function, the one or more functions include those of more particularly showing and describing herein function.However, answering
Work as understanding, without departing from the spirit and scope of the present invention, server 1200 may include for executing one or more
A variety of alternatives of a identity function.For example, in certain embodiments, server 1200 can be at least partly seated
(one or more) distributed devices 1110,1120 and/or (one or more) be hand-held or mobile device 1300 on, can such as be directed to
Specific application and it is desirable like that.As described in further detail below, at least one embodiment, (one
Or multiple) hand-held or mobile device 1300 may include the user that may be configured so that Ti Gongs for communicating with server 1200 and connect
Mouthful one or more mobile applications 1330, all as it is following equally will be further described as.
Fig. 9 A is the schematic diagram of server 1200 according to various embodiments.Server 1200 include via system interface or
The processor 1230 that bus 1235 is communicated with other units within server.It further include for connecing in server 1200
Receive and show the display/input device 1250 of data.The display/input device 1250, which can be, for example to be used with monitor combinations
Keyboard or pointing device.Server 1200 further comprises memory 1220, which generally includes read-only storage
Both device (ROM) 1226 and random-access memory (ram) 1222.The ROM 1226 of server is for storing basic input/defeated
System 1224(BIOS out), the basic input/output 1224(BIOS) it include the list facilitated within server 1200
The basic routine of information is transmitted between member.Various ROM and RAM configuration had previously had been described herein.
In addition, server 1200 includes that (such as hard disk can be removed for storing information in various computer-readable mediums
Disk or CD-ROM disk) at least one storage device or program storage 210, such as hard disk drive, floppy disk drive,
CD Rom driver or CD drive.As one with skill in the art will appreciate, in these storage devices 1210
Each is connected to system bus 1235 by appropriate interface.Storage device 1210 and associated computer-readable medium mention
For being directed to the nonvolatile storage of personal computer.Such as one of ordinary skill in the art it will be realized that, it is above-mentioned
Computer-readable medium can be replaced by the computer-readable medium of any other type as known in the art.Such medium
Including such as cassette, flash memory card, digital video disc and Bernoulli cartridges (Bernoulli cartridge).
Although being not shown, according to embodiment, the storage device 1210 and/or memory of server 1200 can be further
The function of data memory device is provided, which can store the history that can be accessed by server 1200 and/or work as
Preceding delivering data and delivering condition.In this respect, storage device 1210 may include one or more databases.Term " data
Library " refer to storage in computer systems the data (such as via relational database, hierarchical database or network data base) or
The structured set of record, and should not be construed in a limited manner like this.
Multiple programs including one or more computer readable program code parts that such as processor 1230 can be performed
Module (for example, example modules 1400-1700) can be stored by various storage devices 1210 and within RAM 1222.In this way
Program module can also include operating system 1280.In these and other embodiments, various modules 1400,1500,1600,
1700 under the auxiliary of processor 1230 and operating system 1280 operation of control server 1200 some aspects.In addition its
In his embodiment, it should be understood that in the case where not departing from the scope of the present invention and essence, can also provide one or more attached
Module add and/or replacement.
In various embodiments, program module 1400,1500,1600,1700 is executed by server 1200, and is configured to
One or more graphical user interface, report, instruction and/or notice/alarm are generated, entirely to the various users of system 1020
For can access and/or can transmit.In certain embodiments, user interface, report, instruction and/or notice/alarm can be through
It can access by one or more networks 1130, which may include internet or other viable communications
Network, as previously discussed.
In various embodiments, it is also understood that one or more of module 1400,1500,1600,1700 can
Alternatively and/or additionally be locally stored in (for example, in duplicate (in duplicate)) device 1110,1120 and/or
On one or more of 1300, and it can be executed by the one or more processors of device 1110,1120 and/or 1300.Root
According to various embodiments, module 1400,1500,1600,1700 can send data to one or more databases, from one or more
A database receives data, and using the data for including in one or more databases, which can be by
One or more separated, link and/or networking database compositions.
For being also seated clothes with the docking of other units of one or more networks 1130 and the network interface 1260 communicated
It is engaged within device 1200.One of ordinary skill in the art will realize that one or more of 1200 element of server can
To be seated other geographically-distant server components.In addition, one or more of 1200 component of server can be by group
It closes, and/or the add ons of execution functions described herein may also be included in that in server.
Although disclosed single processor 1230, will be recognized such as one of ordinary skill in the art that
Sample, server 1200 may include multiple processors together with being operated each other to execute functionalities described herein.Except depositing
Outside reservoir 1220, processor 1230 may be also connected at least one for showing, transferring and/or receiving data, content etc.
A interface or other devices.In this respect, (one or more) interface may include being used for transmission and/or receiving data, interior
Hold etc. at least one communication interface or other devices and may include display and/or user input interface at least one
User interface, as described in further detail below.User input interface may include allowing entity from user in turn
Receive any one of a variety of devices (such as miniature keyboard, touch display, control stick or other input units) of data.
Further, " server " 1200 while reference has been made to, but as one of ordinary skill in the art will be recognized
As, the embodiment of the present invention is not limited to the server architecture traditionally limited.Further, the embodiment of the present invention
System is not limited to individual server or similar network entity or mainframe computer systems.Implementation of the invention is not being departed from
In the case where the spirit and scope of example, it can also use including together with being operated each other to provide functionalities described herein
One or more network entities other similar framework.For example, in the spirit and scope for not departing from the embodiment of the present invention
In the case of, can also use coordination with one another with server 1200 be provided in association with two of functionalities described herein or
The mesh network of more personal computers (PC), like or handheld portable devices.
According to various embodiments, it may or may not be realized using computer system described herein and/or server
Many each independent steps of process, and computer-implemented degree can be different, it such as can be for one or more specific
As it can it is expected and/or is beneficial.
Fig. 9 B provides representative can be together with the diagram schematic diagram for the mobile device 1300 that various embodiments of the present invention use.
Mobile device 1300 can be operated by each side.As shown in fig. 9b, mobile device 1300 may include antenna 1312, transmitter
1304(is for example, radio), receiver 1306(is for example, radio) and provide signals to transmitter 1304 respectively and connect
Receipts machine 1306 and the processing unit 1308 that signal is received from transmitter 1304 and receiver 1306.
It is respectively provided to transmitter 1304 and receiver 1306 and from transmitter 1304 and the received letter of receiver 1306
Number may include the signaling data for meeting the air-interface standard of applicable wireless system, with various entity (such as servers
1200, distributed devices 1110,1120 etc.) it is communicated.In this regard, mobile device 1300 can utilize one kind
Or a variety of air interface standard, communication protocols, modulation type and access style are operated.More particularly, mobile device
1300 can be operated according to any in various wireless communication standard and agreement.In a particular embodiment, mobile dress
Set 1300 can according to such as GPRS, UMTS, CDMA2000,1xRTT, WCDMA, TD-SCDMA, LTE, E-UTRAN, EVDO,
HSPA, HSDPA, Wi-Fi, WiMAX, UWB, IR agreement, Bluetooth protocol, usb protocol and/or any other wireless protocols etc
Various wireless communication standard and agreement are operated.
Via these communication standards and agreement, mobile device 1300 can according to various embodiments, using such as non-structural
Change supplementary service data (USSD), short message service (SMS), multimedia information transferring service (MMS), dual-tone multifrequency signaling
(DTMF) and/or the design of subscriber identity module dialer (SIM dialer) etc is communicated with various other entities.It moves
Dynamic device 1300 change, plug-in unit and update can also be downloaded to such as its firmware, software (e.g., including executable instruction is answered
With, program module) and operating system.
According to one embodiment, mobile device 1300 may include position determining means and/or functionality.For example, mobile
Device 1300 may include GPS module, be adapted to obtain such as latitude, longitude, height, geocoding, course line
(course) and/or speed data.In one embodiment, GPS module passes through the number of the satellite in the identification visual field and those
The relative position of satellite obtains data, otherwise referred to as almanac data.
Mobile device 1300 can also include that (it may include the display for being coupled to processing unit 1308 to user interface
And/or user input interface (being coupled to processing unit 308) 1316).User input interface may include allowing mobile device
1300 receive any device in multiple devices of data, such as small-sized hard manual of miniature keyboard 1318(or small-sized soft keyboard),
Touch display, voice or motion interface or other input units.In the embodiment for including miniature keyboard 1318, miniature keyboard
It may include (or causing to show) conventional numerical (0-9) and relative keys (#, *) and for operating the other of mobile device 1300
Key, and may include complete one group of letter key or can be activated to provide one group of complete one group of alphanumeric key
Key.Other than providing input, user input interface can be also used for for example activating or deactivating certain functions, such as screen saver programs
And/or sleep pattern.
Mobile device 1300 can also include volatile storage or memory 1322 and/or non-volatile storage or
Memory 1324, the volatile storage or memory 1322 and/or non-volatile storage or memory 1324 can be
It is Embedded and/or can be removable.For example, nonvolatile memory can be ROM, PROM, EPROM, EEPROM, sudden strain of a muscle
Fast memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, racing track memory etc..
Volatile memory can be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM,
DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory etc..Volatibility and
Non-volatile storage or memory can store database, database instance, Database Mapping system, data, application, journey
Sequence, program module, script, source code, object code, syllabified code, compiled code, interpretive code, machine code, executable finger
Enable etc., to implement the function of mobile device 1300.
Mobile device 1300 can also include one or more of video camera 1326 and mobile application 1330.Video camera
1326 can be configured as additional and/or interchangeable data collection feature according to various embodiments, thus one or more
Project can be read, stored and/or be transmitted via video camera by mobile device 1300.Mobile application 1330 can be mentioned further
For following feature: via the feature, executing various tasks using mobile device 1300.Various configurations can be provided, such as may be used
For mobile device 1300 and system 1020 as a whole one or more users and it is desirable like that.
It will be appreciated that many deformations of the system above and method are all possible, and and above embodiment
Deviation be also possible, but still within the scope of the claims.For before benefiting from these field that the present invention belongs to
A technical staff for stating the introduction presented in description and associated attached drawing, will expect many of the invention described herein
Modification and other embodiments.Such modification can for example be related to the energy beam phase using such as laser beam etc with institute illustration
Than different beam rifle sources.The material different from metal powder, such as polymer powder and ceramic powders can be used.Therefore,
It is to be understood that the present invention should not necessarily be limited by disclosed specific embodiment, and modifies and be intended to be included in other embodiments
Within the scope of appended claims.Although concrete term is employed herein, these terms only general and
It is used in the sense that descriptive, rather than for purposes of limitation.
Claims (4)
1. a kind of method for being calibrated to electron beam, the described method comprises the following steps:
Before at least one X-ray detector, the figuratum aperture resolver at least one opening is positioned, so that institute
At least one opening is stated just towards at least one described X-ray detector;
Between the figuratum aperture resolver and substrate, and with the figuratum aperture resolver and the base
Plate is apart to position figuratum aperture modulator at preset distance, wherein the figuratum aperture modulator has extremely
Multiple openings that few first party is upwardly oriented;
The scanning beam at least first direction on the substrate, will be by least one described X-ray detection for generating
The received X-ray of device;
Using the figuratum aperture modulator and the figuratum aperture resolver, detection passes through the scanning beam
And the X-ray issued from surface generated, wherein by utilizing the setting for controlling the electron beam to from described
The intensity modulated of the X-ray signal of detector is mapped, and realizes the position of the electron beam, the mapping of size and shape
Figure;
If at least one of shape or size of the electron beam just with corresponding reference beam shape or reference beam
At least one deviation in size exceeds predetermined value, then adjusts described for controlling the setting of the electron beam;And
Repeat it is described scanning, detection and regulating step, until at least one of shape or size of the electron beam just with institute
At least one deviation stated in reference beam shape or the reference beam size is less than predetermined value.
2. according to the method described in claim 1, further including following steps: for different beam powers, the repetition scanning,
Detection adjusts and repeats step.
3. according to the method described in claim 1, wherein, the setting is the input signal to beam shaping and positioning unit.
4. according to the method described in claim 3, wherein, the beam shaping and positioning unit include at least one deflection wire
Circle, at least one focus coil and at least one astigmatism coil.
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US14/973230 | 2015-12-17 | ||
PCT/EP2016/050742 WO2016116363A1 (en) | 2015-01-21 | 2016-01-15 | Method and device for characterizing an electron beam |
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CN107107250B true CN107107250B (en) | 2019-09-17 |
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EP3247553A1 (en) | 2017-11-29 |
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