CN107066765B - Bionic heat flow channel design method - Google Patents
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Abstract
The invention relates to a bionic heat flow channel design method, which is characterized in that a volume-point analysis model for design is established according to the overall dimension of a design object, and the method comprises the steps of applying a heat source and a heat boundary condition to a design domain, applying a temperature condition to a heat sink point and endowing a low-heat-conduction material to the design domain according to the actual working condition; and then according to the growth mechanism of the branch system form in nature, such as a plant root system, simulating the growth process of the plant root system in the design process of laying the heat flow channel, thereby designing the optimal heat flow channel layout. The invention directly simulates the growth principle of a natural branch system and designs the distribution of the heat flow channels with the minimum thermal resistance, thereby achieving the effect of improving the heat transfer performance. Compared with the common heat flow channel layout design method, the method has the advantages of simple algorithm, convenience in manufacturing and suitability for the problem of complex heat conditions.
Description
Technical Field
The invention relates to an electronic device heat dissipation technology, in particular to a bionic heat flow channel design method in an electronic device.
Background
With the development of technology, the volume of electronic products is reduced, the number of internal components is increased, and the amount of heat generated when electronic devices operate is increased sharply. Whether the heat generated during working can be dissipated in time or not determines the reliability and the service life of the product, so that the high-efficiency heat dissipation is the key of the further development of the product. Because the heat generation quantity is large and the heat dissipation space is limited, the traditional mode of carrying out forced convection heat dissipation on electronic products can not meet the actual heat dissipation requirement, and the effective way for solving the problem is to lay the heat flow channel formed by the high heat conduction material on the surface of the electronic component or directly embed the electronic component, so as to quickly conduct the heat to the external environment, thereby effectively solving the problems of space limitation and heat dissipation efficiency. The reasonable design of the heat flow channel layout is the key for improving the heat conduction efficiency. Therefore, it is necessary to research the reasonable layout of the heat flow channels to improve the heat conduction performance.
At present, the traditional heat flow channel layout basically adopts empirical design and analog design, and the optimal layout under the complex thermal boundary condition is difficult to realize. The layout obtained by using various topological optimization methods is too complex and is very difficult in practical application and processing.
Disclosure of Invention
The invention provides a bionic heat flow channel design method aiming at the problems of heat flow channel layout design in an electronic device under complex heat conditions, and the design process of laying a heat flow channel is made to simulate the growth process of a plant root system according to the morphological growth mechanism of a natural branch system, such as the plant root system, so that the optimal heat flow channel layout is designed.
The technical scheme of the invention is as follows: a bionic heat flow channel design method specifically comprises the following steps:
1) establishing a volume-point analysis model for design according to the overall dimension of a design object, wherein the volume-point analysis model comprises the steps of applying a heat source and a heat boundary condition to a design domain, applying a temperature condition to a heat sink point and endowing a low-heat-conduction material to the design domain according to actual working conditions;
2) growing a main heat flow channel: forming a main heat flow channel along the maximum direction of the temperature gradient by taking the heat sink point as a starting point, and filling the main heat flow channel with a material with high heat conductivity coefficient;
3) and a successive growth sub-heat flow channel: performing finite element thermal analysis on a design object with a grown thermal flow channel, finding a point with the highest temperature in a design domain, taking the point as the center of a circle and taking a certain value as a radius to serve as a spherical surface, selecting a certain channel in the spherical surface as a candidate parent branch, ensuring that a candidate child branch connected with the highest temperature point on the parent branch does not intersect with the existing channel, taking two golden section points on the candidate parent branch as the starting points of the candidate of the secondary thermal flow channel, respectively taking the two golden section points as 0.618l and 0.382l, respectively, taking l as the length of the candidate parent branch, taking the highest temperature point of the design domain as the terminal point of the secondary thermal flow channel, respectively calculating the total thermal resistance of the structure under each candidate channel according to the following formula, and selecting the golden section point with the smallest total thermal resistance of the structure as the actual,
in the formula, n represents the number of the heat flow channels; diAnd LiThe width and the length of the ith heat flow channel respectively;
4) updating the width of the previous stage from the last branch according to the following formula, updating the first stage until the width of all the generated heat flow channels is updated,
in the formula, D1j、D2jWidth, D, of two sub-branches representing the j-th branch3jthe width of the parent branch corresponding to the two child branches is represented, lambda is a width coefficient, v is the total volume of the current structure, α is a volume given value, and the updated secondary heat flow channel is filled with high heat conduction materials;
5) and when the volume of all generated heat flow channels reaches an upper limit value phi or the ratio of the difference of the highest temperatures of the two steps before and after generation of the branches to the highest temperature of the current step is less than a given value, stopping secondary branch growth, and otherwise, repeating the steps 3) -4).
in the step 4), the given value alpha of the volume is 5 percent smaller than phi which is the upper limit of the volume of the total heat flow channel of the preset structure.
The invention has the beneficial effects that: the bionic heat flow channel design method directly simulates the growth principle of a natural branch system and designs the heat flow channel distribution with the minimum thermal resistance, thereby achieving the effect of improving the heat transfer performance. Compared with the common heat flow channel layout design method, the method has the advantages of simple algorithm, convenience in manufacturing and suitability for the problem of complex heat conditions.
Drawings
FIG. 1 is a flow chart of a method for designing a bionic heat flow channel according to the present invention;
FIG. 2 is a schematic diagram of the design domain of the present invention;
FIG. 3 is a diagram of one half of the design domain of the present invention;
FIG. 4 is a topological diagram of the heat flow channel when φ is 0.3;
fig. 5 is a topological diagram of the heat flow channel when phi is 0.3 obtained by the conventional design method for comparing the design effects of the present invention.
Detailed Description
As shown in fig. 1, the technical scheme of the invention specifically includes the following steps:
(1) firstly, a volume-point analysis model for design is established according to the external dimension of a design object. According to the actual working condition, a heat source and a heat boundary condition are applied to a design domain (body), a temperature condition is applied to a heat sink (point), and a low-heat-conduction material is endowed to the design domain.
(2) Growing the main heat flow channel: the main heat flow channel is formed along the direction of the maximum temperature gradient with the heat sink as the starting point, and the main heat flow channel is filled with a material having a high thermal conductivity.
(3) Gradually growing the secondary heat flow channel: carrying out finite element thermal analysis on a design object with a grown thermal channel, finding a point with the highest temperature in a design domain, taking the point as the center of a circle and a certain value as a radius to make a spherical surface, selecting a certain channel in the spherical surface as a candidate mother branch, and ensuring that the point on the mother branch and the candidate daughter branch connected with the highest temperature point do not intersect with the existing channel. Two golden section points (0.618 l and 0.382l respectively, l is the length of the candidate parent branch) on the candidate parent branch are taken as the starting points of the secondary heat flow channel candidate, and the highest point of the design domain temperature is taken as the end point of the secondary heat flow channel. And (3) respectively calculating the total structural thermal resistance under each candidate channel according to the formula (1), and selecting a golden section point with the minimum total structural thermal resistance as an actual starting point.
In the formula, n represents the number of the heat flow channels; diAnd LiRespectively the width and length of the ith heat flow channel.
(4) According to the formula (2), the width of the previous stage is updated from the end branch, and the updating of the previous stage is carried out until the widths of all the generated heat flow channels are updated.
In the formula, D1j、D2jWidth, D, of two sub-branches representing the j-th branch3jRepresenting the width of the parent branch corresponding to the two child branches; λ is a width coefficient; v is the total volume of the current structure (including all heat flow channels already deployed); volume supplythe constant α is 5 percent less than phi which is the preset volume upper limit of the total heat flow channel of the structure.
The updated secondary heat flow channels are filled with a high thermal conductivity material.
(5) And (4) stopping the growth of the secondary branches when the volumes of all generated heat flow channels reach an upper limit value phi or the ratio of the difference of the highest temperatures of the two steps before and after generation of the branches to the highest temperature of the current step is less than a given value, otherwise, repeating the steps (3) - (4).
The applicability of the invention is illustrated by taking four sides as an example for heat insulation and heat dissipation in the middle of the bottom edge.
Fig. 2 is a design model of a bottom-side middle heat dissipation structure. Design domain omegasIs a square of 100mm × 100mm, and has a uniform heat generation rate Q of 3 × 103W/m3. A heat dissipation boundary exists at the bottom boundary, the boundary length L is 10mm, and the boundary temperature T is00 deg.c, the rest of the boundary is adiabatic. Since this problem is a symmetry problem, half of the design domain is designed as shown in fig. 3.
By applying the layout design method of the invention, a corresponding analysis model is established first, and the model is dispersed into 50 multiplied by 100 units. All units are given a low thermal conductivity material. The corresponding heat source and boundary conditions are applied to the design domain. A temperature boundary condition is imposed for the bottom heatsink boundary.
The main thermal flow channel is grown first. The heat sink center point is used as a starting point, a main heat flow channel is formed along the maximum direction of the temperature gradient, and a material with high heat conductivity coefficient is filled in the main heat flow channel.
Gradually growing the secondary heat flow channel: and (4) growing the secondary heat flow channel according to the step (3).
And then updating the width of the parent branch according to the formula (2) from the width of the child branch, and sequentially updating the widths of all the heat flow channels. And fill the secondary heat flow channels with a highly thermally conductive material.
And continuing to grow the secondary heat flow channels, and finishing the growth of all the heat flow channels when the volume of the heat flow channels reaches the upper limit or the percentage of the maximum temperature reduction is less than a fixed value.
After 28 growth steps, the heat flow channel volume reached an upper limit of 30%, and the design was terminated. The resulting heat flow channel design results are shown in fig. 4. The whole heat flow channel is divided into two layers, the width of the main heat flow channel is thicker, the length of the main heat flow channel is longer, and two farthest corner points of the design domain are connected with the heat sink points. The secondary heat flow channel is thin and short. The heat flow channel is distributed throughout the whole design domain, and heat at each position in the design domain can be effectively conducted to the heat sink point. Due to the use of a symmetrical design, the resulting final heat flow channel distribution is also symmetrical.
The topological form of the heat transfer structure is solved by adopting the boundary conditions same as those of the application example and using the traditional variable density method, and after iteration, the volume reaches the upper limit of 30 percent. The resulting heat transfer structure topology is shown in fig. 5. The topology obtained is very similar to that of figure 4. Comparison of this method with the variable density method from temperature performance is shown in table 1. It can be seen that the maximum temperature and temperature variance are reduced by 22.9% and 35.0% respectively from the results obtained by the variable density method, resulting in a lower maximum temperature and a more uniform temperature distribution. The topological form of the heat flow channel obtained by the method is clearer and simpler, and the heat flow channel is free of fine channels and gray level units, so that the heat flow channel is convenient to actually process and apply.
TABLE 1
| Temperature performance | Method for producing a composite material | SIMP | Percentage reduction |
| Maximum temperature (. degree. C.) | 0.239 | 0.310 | 22.9％ |
| Temperature variance (. degree.C.)2) | 0.00260 | 0.00400 | 35.0％ |
Claims (2)
1. A bionic heat flow channel design method is characterized by comprising the following steps:
1) establishing a volume-point analysis model for design according to the overall dimension of a design object, wherein the volume-point analysis model comprises the steps of applying a heat source and a heat boundary condition to a design domain, applying a temperature condition to a heat sink point and endowing a low-heat-conduction material to the design domain according to actual working conditions;
2) growing a main heat flow channel: forming a main heat flow channel along the maximum direction of the temperature gradient by taking the heat sink point as a starting point, and filling the main heat flow channel with a material with high heat conductivity coefficient;
3) and a successive growth sub-heat flow channel: performing finite element thermal analysis on a design object with a grown thermal flow channel, finding a point with the highest temperature in a design domain, taking the point as the center of a circle and taking a certain value as a radius to serve as a spherical surface, selecting a certain channel in the spherical surface as a candidate parent branch, ensuring that a candidate child branch connected with the highest temperature point on the parent branch does not intersect with the existing channel, taking two golden section points on the candidate parent branch as the starting points of the candidate of the secondary thermal flow channel, respectively taking the two golden section points as 0.618l and 0.382l, respectively, taking l as the length of the candidate parent branch, taking the highest temperature point of the design domain as the terminal point of the secondary thermal flow channel, respectively calculating the total thermal resistance of the structure under each candidate channel according to the following formula, and selecting the golden section point with the smallest total thermal resistance of the structure as the actual,
in the formula, n represents the number of the heat flow channels; diAnd LiThe width and the length of the ith heat flow channel respectively;
4) updating the width of the previous stage from the last branch according to the following formula, updating the first stage until the width of all the generated heat flow channels is updated,
in the formula, D1j、D2jWidth, D, of two sub-branches representing the j-th branch3jthe width of the parent branch corresponding to the two child branches is represented, lambda is a width coefficient, v is the total volume of the current structure, α is a volume given value, and the updated secondary heat flow channel is filled with high heat conduction materials;
5) and when the volume of all generated heat flow channels reaches an upper limit value phi or the ratio of the difference of the highest temperatures of the two steps before and after generation of the branches to the highest temperature of the current step is less than a given value, stopping secondary branch growth, and otherwise, repeating the steps 3) -4).
2. the method for designing a bionic thermal flow channel according to claim 1, wherein the given volume value α in the step 4) is 5% smaller than φ, wherein φ is a preset upper limit of the total volume of the thermal flow channel.
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