CN107066765A - Bionical heat passage design method - Google Patents
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Abstract
The present invention relates to a kind of bionical heat passage design method, according to the appearance and size of design object, the body point analysis model of design is set up, including according to actual condition, apply thermal source and thermal boundary condition for design domain, be that heat sink point applies temperature conditionss, be that design domain assigns low Heat Conduction Material；Further according to the growth mechanism of branch system form in nature, such as root system of plant makes the growth course of design process simulating plant root system for laying heat passage, so as to design optimal heat passage layout.The present invention directly simulates the growing principle of nature branch system, the heat passage distribution with minimum thermal resistance is designed, so as to reach the effect of lifting heat transfer property.Of the invention algorithm is simple compared with common heat passage layout design method, and convenient manufacture is applicable to complicated heat condition problem.
Description
Technical field
The present invention relates to a kind of Cooling Technology of Electronic Device, more particularly to a kind of bionical heat passage in electronic device
Design method.
Background technology
As technology develops, electronic product volume reduces, the increase of inner member quantity, the heat that electronic device is produced when working
Amount increased dramatically.The heat produced when working can in time be dispersed, determine the reliability and working life of such product, because
And high efficiency and heat radiation is the key that such product further develops.Heat-dissipating space is limited during due to heat amount Datong District, to electronics
The traditional approach that product carries out forced convertion radiating can not meet the requirement of actual radiating, and solving the effective way of the problem is
The heat passage formed with highly heat-conductive material is laid in electronic component surface or is directly embedded into inside component, heat is fast
Speed conduction is to external environment, so that the problem of effectively solving space limitation and radiating efficiency.The reasonable design of heat passage layout
It is the key for improving heat transfer efficiency.Therefore the rational deployment of heat passage is studied, so that it is necessary to lift heat conductivility.
At present, traditional heat passage layout substantially uses Experience Design and Analogy, it is difficult to realize complicated thermal boundary
Under the conditions of optimal location.And the layout too complex obtained using all kinds of Topology Optimization Methods, in practical application and processing
It is very difficult.
The content of the invention
The problem of existing the present invention be directed to heat passage layout designs in electronic device under complicated heat condition, it is proposed that one
Bionical heat passage design method is planted, according to the form growth mechanism of nature branch system, such as root system of plant makes to lay hot-fluid
The growth course of the design process simulating plant root system of passage, so as to design optimal heat passage layout.
The technical scheme is that：A kind of bionical heat passage design method, specifically includes following steps：
1), according to the appearance and size of design object, body-point analysis model of design is set up, including according to actual condition,
Apply thermal source and thermal boundary condition for design domain, be that heat sink point applies temperature conditionss, be that design domain assigns low Heat Conduction Material；
2) main heat passage, is grown：Using heat sink point as starting point, main heat passage is formed along the maximum direction of thermograde, and
Main heat passage is filled with the high material of thermal conductivity factor；
3) time heat passage, is gradually grown：Finite element thermal analysis is carried out to the design object for having grown heat passage, found
Temperature highest point in design domain, using the point as the center of circle, sphere is made by radius of certain value, selects a certain passage in the sphere
For the female branch of candidate, female branch need to ensure that the sub- branch of candidate that point and thermal self-restraint stress thereon are connected does not intersect with existing passage,
Using two golden section points on the female branch of candidate as time starting point of heat passage candidate, two golden section points are respectively 0.618l
And the length that 0.382l, l are the female branch of candidate, using design domain thermal self-restraint stress as the terminal of time heat passage, distinguish according to the following formula
The structure entire thermal resistance under each candidate's passage is calculated, the minimum golden section point of selection structure entire thermal resistance is actual start,
In formula, n represents the number of heat passage；DiAnd LiIt is the width and length of i-th heat passage respectively；
4), according to the following formula, since last branch, upper level width is updated, one-level level updates, until updating all generated
Heat passage width,
In formula, D1j、D2jRepresent the width of two sub- branches of j-th stage branch, D3jThe width of the corresponding female branch of the sub- branch of expression two
Degree；λ is spread factor；V is the cumulative volume of current structure；α is volume set-point, and time heat after updating is filled with highly heat-conductive material
Circulation road；
5), the two step maximum temperatures before and after the volume of all heat passages of generation reaches higher limit φ or generation branch
The ratio between difference and current step maximum temperature be less than set-point, then stop time branch growth, otherwise repeat step 3) -4).
The step 4) in volume set-point α it is smaller than φ by 5%；φ is in structure total hot-fluid channel volume set in advance
Limit.
The beneficial effects of the present invention are：The bionical heat passage design method of the present invention, directly simulates system of nature branch
The growing principle of system, designs the heat passage distribution with minimum thermal resistance, so as to reach the effect of lifting heat transfer property.This hair
Bright algorithm is simple compared with common heat passage layout design method, and convenient manufacture is applicable to complicated heat condition problem.
Brief description of the drawings
Fig. 1 is bionical heat passage design method flow chart of the invention；
Fig. 2 is design domain schematic diagram of the present invention；
Fig. 3 is half design domain figure of the present invention；
Fig. 4 heat passage topographic morphologies figures in φ=0.3 for the present invention；
Heat passage topology when Fig. 5 is for contrasting φ that the traditional design method of design effect of the present invention obtains=0.3
Aspect graph.
Embodiment
Bionical heat passage layout design method flow chart as shown in Figure 1, technical scheme specifically includes as follows
Step：
(1) body-point analysis model of design is set up according to the appearance and size of design object first.Including according to reality
Operating mode, is that design domain (body) applies thermal source and thermal boundary condition, is that heat sink (point) applies temperature conditionss, is that design domain assigns low lead
Hot material.
(2) main heat passage is grown：Using heat sink point as starting point, main heat passage is formed along the maximum direction of thermograde, and
Main heat passage is filled with the high material of thermal conductivity factor.
(3) time heat passage is gradually grown：Finite element thermal analysis is carried out to the design object for having grown the passage of heat, finds and sets
Temperature highest point in domain is counted, using the point as the center of circle, sphere is made by radius of certain value, selects a certain passage in the sphere to be
Candidate's mother's branch, female branch need to ensure that the sub- branch of candidate that point and thermal self-restraint stress thereon are connected does not intersect with existing passage.With
Two golden section points (being respectively the length that 0.618l and 0.382l, l be the female branch of candidate) on candidate's mother's branch are secondary type of thermal communication
The starting point of road candidate, using design domain thermal self-restraint stress as the terminal of time heat passage.Each candidate is calculated respectively according to formula (1) to lead to
Structure entire thermal resistance under road, the minimum golden section point of selection structure entire thermal resistance is actual start.
In formula, n represents the number of heat passage；DiAnd LiIt is the width and length of i-th heat passage respectively.
(4) according to formula (2), since last branch, upper level width is updated, one-level level updates, all raw until updating
Into heat passage width.
In formula, D1j、D2jRepresent the width of two sub- branches of j-th stage branch, D3jThe width of the corresponding female branch of the sub- branch of expression two
Degree；λ is spread factor；V is the cumulative volume of current structure (containing all heat passages have been arranged)；Volume set-point α is smaller than φ
5%；φ is the structure total hot-fluid channel volume upper limit set in advance.
The secondary heat passage after updating is filled with highly heat-conductive material.
(5) the two step maximum temperatures before and after the volume of all heat passages of generation reaches higher limit φ or generation branch
The ratio between difference and current step maximum temperature be less than set-point, then stop time branch growth, otherwise repeat step (3)-(4).
So that four sides are adiabatic, base middle part is radiated as an example, illustrate the applicability of the present invention.
Fig. 2 is designing a model for base middle part radiator structure.Design domain ΩsFor 100mm × 100mm square, in it
There are uniform heat generation rate Q=3 × 10 in portion3W/m3.Radiating border, boundary length L=10mm, border temperature are there are in bottom boundary
Spend T0=0 DEG C, its coboundary is adiabatic.Because the problem is AXIALLY SYMMETRIC PROBLEMS, the half of design domain is taken to be designed as shown in Figure 3.
Using the layout design method of the present invention, first set up corresponding analysis model, and by model it is discrete be 50 × 100
Unit.Low Heat Conduction Material is assigned for all units.Apply corresponding thermal source and boundary condition to design domain.Applied for the heat sink border in bottom
Plus temperature boundary condition.
Main heat passage is grown first.Using heat sink central point as starting point, main type of thermal communication is formed along the maximum direction of thermograde
Road, and fill main heat passage with the high material of thermal conductivity factor.
Gradually grow time heat passage：By above-mentioned steps (3) growth time heat passage.
The width of female branch is then updated by the width of sub- branch according to formula (2), and updates the width of all heat passages successively.
And fill time heat passage with highly heat-conductive material.
Continued growth time heat passage, when heat passage volume reaches that the upper limit or maximum temperature decline percentage and be less than definite value
Then complete the growth of all heat passages.
After 28 one-step growths, heat passage volume reaches the upper limit 30%, and design is terminated.The heat passage finally given is set
Count result as shown in Figure 4.Overall heat passage is divided into two layers, and main heat passage width is relatively thick and length is long, and connection design domain is most
Two remote angle points and heat sink point.Secondary heat passage is then thinner and short.Heat passage spreads all over whole design domain, can effectively by
Heat throughout is conducted to heat sink point in design domain.Due to having used symmetric design, the distribution of obtained final heat passage also in pair
Claim result.
Using the boundary condition as application example, heat transfer structure topographic morphologies are solved using traditional density variable method,
After iteration, volume reaches the upper limit 30%.Finally give heat transfer structure topographic morphologies as shown in Figure 5.The topographic morphologies of acquisition
It is quite similar with Fig. 4.Compare this method and density variable method from temperature performance, contrast is as shown in table 1.As can be seen that maximum temperature
The result obtained respectively than density variable method with temperature variance reduces 22.9% and 35.0%, achieve lower maximum temperature with
And more uniform Temperature Distribution.And the heat passage topographic morphologies that this method is obtained are become apparent from simply, in the absence of tiny
Passage and gray shade unit, are easy to actual processing and application.
Table 1
| Temperature performance | This method | SIMP | Decline percentage |
| Maximum temperature (DEG C) | 0.239 | 0.310 | 22.9% |
| Temperature variance (DEG C2) | 0.00260 | 0.00400 | 35.0% |
Claims (2)
1. a kind of bionical heat passage design method, it is characterised in that specifically include following steps：
1), according to the appearance and size of design object, body-point analysis model of design is set up, including according to actual condition, to set
Count domain and apply thermal source and thermal boundary condition, be that heat sink point applies temperature conditionss, be that design domain assigns low Heat Conduction Material；
2) main heat passage, is grown：Using heat sink point as starting point, main heat passage is formed along the maximum direction of thermograde, and with leading
The high material of hot coefficient fills main heat passage；
3) time heat passage, is gradually grown：Finite element thermal analysis is carried out to the design object for having grown heat passage, design is found
Temperature highest point in domain, using the point as the center of circle, sphere is made by radius of certain value, selects a certain passage in the sphere to wait
The female branch of choosing, female branch need to ensure that the sub- branch of candidate that point and thermal self-restraint stress thereon are connected does not intersect with existing passage, to wait
Two golden section points on the female branch of choosing are time starting point of heat passage candidate, two golden section points be respectively 0.618l and
0.382l, l are the length of the female branch of candidate, using design domain thermal self-restraint stress as the terminal of time heat passage, are counted respectively according to the following formula
The structure entire thermal resistance under each candidate's passage is calculated, the minimum golden section point of selection structure entire thermal resistance is actual start,
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In formula, n represents the number of heat passage；DiAnd LiIt is the width and length of i-th heat passage respectively；4), under
Formula, since last branch, updates upper level width, one-level level updates, the width until updating all heat passages generated,
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In formula, D1j、D2jRepresent the width of two sub- branches of j-th stage branch, D3jThe width of the corresponding female branch of the sub- branch of expression two；λ
For spread factor；V is the cumulative volume of current structure；α is volume set-point, and the secondary type of thermal communication after updating is filled with highly heat-conductive material
Road；
5), when the volume of all heat passages of generation reach higher limit φ or generation branch before and after two step maximum temperatures difference
It is less than set-point with current the ratio between the maximum temperature that walks, then stops time branch growth, otherwise repeat step 3) -4).
2. bionical heat passage design method according to claim 1, it is characterised in that the step 4) in volume set-point
α is smaller than φ by 5%；φ is the structure total hot-fluid channel volume upper limit set in advance.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109344460A (en) * | 2018-09-14 | 2019-02-15 | 上海理工大学 | A kind of bionical multi ANN method of heat transfer structure |
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|---|---|---|---|---|
| CN101146981A (en) * | 2005-01-20 | 2008-03-19 | 基督教技术学院慈善基金会 | Heat energy recapture and recycle and its new applications |
| CN104617062A (en) * | 2015-02-05 | 2015-05-13 | 哈尔滨工程大学 | Impacted water cooling chip radiator with imitated vegetation vein fractal micro-channel |
| US20170024497A1 (en) * | 2015-07-23 | 2017-01-26 | Caterpillar Inc. | Product design considering cost and structural performance |
-
2017
- 2017-05-24 CN CN201710373075.8A patent/CN107066765B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146981A (en) * | 2005-01-20 | 2008-03-19 | 基督教技术学院慈善基金会 | Heat energy recapture and recycle and its new applications |
| CN104617062A (en) * | 2015-02-05 | 2015-05-13 | 哈尔滨工程大学 | Impacted water cooling chip radiator with imitated vegetation vein fractal micro-channel |
| US20170024497A1 (en) * | 2015-07-23 | 2017-01-26 | Caterpillar Inc. | Product design considering cost and structural performance |
Non-Patent Citations (1)
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| 吴龙文 等: "芯片散热微通道仿生拓扑结构研究", 《电子学报》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109344460A (en) * | 2018-09-14 | 2019-02-15 | 上海理工大学 | A kind of bionical multi ANN method of heat transfer structure |
| CN109344460B (en) * | 2018-09-14 | 2023-04-14 | 上海理工大学 | Bionic layering growth method of heat transfer structure |
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