CN107046440A - Optical power monitoring component and optical module - Google Patents
Optical power monitoring component and optical module Download PDFInfo
- Publication number
- CN107046440A CN107046440A CN201610082200.5A CN201610082200A CN107046440A CN 107046440 A CN107046440 A CN 107046440A CN 201610082200 A CN201610082200 A CN 201610082200A CN 107046440 A CN107046440 A CN 107046440A
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- China
- Prior art keywords
- photodetector
- circuit board
- optical
- laser
- fixing device
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
Abstract
This application discloses a kind of optical power monitoring component and optical module, the optical power monitoring component includes：Laser, the laser at least exports the positive light for transmitting optical signal and the dorsad light for monitoring luminous power；Photodetector, the photodetector is corresponded with laser and set, and for receiving the dorsad light of laser transmission, and is translated into electric signal；Fixing device, the photodetector is fixedly installed in fixing device；Circuit board, the fixing device is fixedly installed on circuit board, is electrically connected and is set between the circuit board, fixing device and photodetector, the electric signal in board receiver photodetector.The dorsad light that optical power monitoring component is sent by laser in the application monitors the luminous power of laser, and its is simple in construction, component stability is higher；By substrate or multiple contact pins, the integrated monitoring of multiple path laser can be achieved, the installation accuracy of photodetector is high.
Description
Technical field
The application belongs to technical field of photo communication, and in particular to a kind of optical power monitoring component and optical module.
Background technology
Optical module is made up of opto-electronic device, functional circuit and optical port end etc..Wherein, opto-electronic device includes launching and receiving two parts.Briefly, the major function of optical module is exactly to realize opto-electronic conversion, and optical signal is converted the electrical signal in transmitting terminal, after being transmitted by optical fiber, and electric signal is converted optical signals into again in receiving terminal, so as to realize the transmission of information.
In optical module, luminous power that generally need to be as the case may be to laser is adjusted, and this requires the luminous power first to laser to be monitored.In the optical power monitoring component of existing laser, light beam splitting eyeglass is generally used, laser that laser is sent is divided into two-way using it, all the way for normal work, be used to be monitored luminous power in addition all the way.However, the optical power monitoring component constituted using light beam splitting eyeglass, structure is more complicated, the required precision to light path is higher, and the less stable of optical power monitoring component.
Therefore in view of the above-mentioned problems, being necessary to provide a kind of optical power monitoring component and optical module.
The content of the invention
The embodiment of the application one provides a kind of optical power monitoring component, and the optical power monitoring component includes：
Laser, the laser at least exports the positive light for transmitting optical signal and the dorsad light for monitoring luminous power；
Photodetector, the photodetector is corresponded with laser and set, and for receiving the dorsad light of laser transmission, and is translated into electric signal；
Fixing device, the photodetector is fixedly installed in fixing device；
Circuit board, the fixing device is fixedly installed on circuit board, is electrically connected and is set between the circuit board, fixing device and photodetector, the electric signal in board receiver photodetector.
In one embodiment, the fixing device is substrate, and the substrate is electrically connected with circuit board, and the photodetector is electrically connected with substrate.
In one embodiment, the substrate is fixed using viscose glue with circuit board, photodetector and substrate and mounted.
In one embodiment, the fixing device is contact pin, and the circuit board is provided with jack, and the contact pin is electrically connected by jack and circuit board.
In one embodiment, the photodetector is fixed using viscose glue and is mounted on contact pin.
In one embodiment, the fixing device and circuit board right angle setting.
In one embodiment, the photodetector that the optical power monitoring component is independently arranged including one or multiple arrays are set, the laser is corresponded with photodetector and set.
In one embodiment, the circuit board is rigid circuit board or flexible PCB.
Another embodiment of the application also provides a kind of optical module, the optical module includes optical table and the circuit board being adhesively fixed with optical table, the circuit board is provided with fixing device, photodetector is fixed with the fixing device, laser is installed with optical table, the photodetector is corresponded with laser and set, also integrated on the optical table to be provided with optical port, optical port lens, isolator, wavelength-division multiplex element and collimation lens.
In one embodiment, the fixing device be substrate or contact pin, wherein：
The substrate is electrically connected with circuit board, and the photodetector is electrically connected with substrate；
The circuit board is provided with jack, and the contact pin is electrically connected by jack and circuit board.
Compared with prior art, in the technical scheme of the application：
The dorsad light that optical power monitoring component is sent by laser monitors the luminous power of laser, and its is simple in construction, component stability is higher；
By substrate or multiple contact pins, the integrated monitoring of multiple path laser can be achieved, the installation accuracy of photodetector is high.
Brief description of the drawings
Fig. 1 is the side structure schematic view of optical power monitoring component in the application first embodiment；
Fig. 2 is the positive structure diagram of optical power monitoring component in the application first embodiment；
Fig. 3 is the side structure schematic view of optical power monitoring component in the application second embodiment；
Fig. 4 is the positive structure diagram of optical power monitoring component in the application second embodiment；
Fig. 5 is the positive structure diagram of optical module in the embodiment of the application the 3rd；
Fig. 6 is the side structure schematic view of optical module in the embodiment of the application the 3rd.
Embodiment
The application is described in detail below with reference to embodiment shown in the drawings.But these embodiments are not intended to limit the application, structure that one of ordinary skill in the art is made according to these embodiments, method or conversion functionally are all contained in the protection domain of the application.
In each diagram of the application, for the ease of diagram, therefore structure or partial some sizes, can be only used for illustrating the basic structure of the theme of the application relative to other structures or partial enlargement.
It is used herein such as " on ", " top ", " under ", the term of representation space relative position " lower section " is in order at and is easy to the purpose of explanation to describe a unit as shown in the drawings or feature relative to another unit or the relation of feature.The term of relative space position can be intended to include different azimuth of the equipment in use or work in addition to orientation shown in figure.If for example, by figure equipment overturn, be described as being located at other units or feature " lower section " or " under " unit will be located at other units or feature " top ".Therefore, exemplary term " lower section " can include above and below both orientation.Equipment can be otherwise directed（It is rotated by 90 ° or other directions）, and correspondingly explain used herein and space correlation description language.
When element or layer be referred to as another part or layer " on ", with another part or layer " connection " when, its can directly on another part or layer, be connected to another part or layer, or there may be intermediary element or layer.On the contrary, when part is referred to as " directly on another part or layer ", " being connected directly between on another part or layer ", it is impossible to there is intermediate member or layer.
Join shown in Fig. 1, Fig. 2, introduce the optical power monitoring component 100 in the application first embodiment, the optical power monitoring component 100 includes：Laser 110, photodetector 120, substrate 130 and circuit board 140, wherein：
Laser 110, laser 110 at least exports the positive light for transmitting optical signal and the dorsad light for monitoring luminous power, it is preferable that present embodiment includes the laser 110 that four horizontal arrays are set；
Photodetector 120, photodetector 120 is corresponded with laser 110 and set, including the photodetector that four horizontal arrays are set, and each photodetector 120 is used to receive the dorsad light that corresponding laser 110 is transmitted, and is translated into electric signal；
Use substrate 130 for fixing device in substrate 130, present embodiment, photodetector 120 is fixedly installed on substrate 130；
Circuit board 140, substrate 130 is fixedly installed on circuit board 140, is electrically connected and is set between circuit board 140, substrate 130 and photodetector 120, circuit board 140 can receive the electric signal in photodetector 120.
Further, substrate is fixed using viscose glue with substrate 130 and mounted with circuit board 140, photodetector 120 in present embodiment, and substrate and circuit board right angle setting, photodetector are mounted on substrate towards laser side.
Substrate can be pcb board or other substrates that can be electrically connected, and such as be illustrated by taking pcb board as an example, some signal transmssion lines can be provided with pcb board, for transmitting the electric signal that photodetector 120 is sent.
Circuit board is rigid circuit board or flexible PCB, wherein, rigid circuit board is including PCBA board etc., and flexible PCB includes FPC plates etc..
Deforming obtained embodiment by above-mentioned embodiment also includes：
An independent photodetector is only pasted with substrate, provided with a laser corresponding with photodetector；
Or, the photodetector that some longitudinal arrays are set is pasted with substrate, photodetector is corresponded with laser and set；
Or, some photodetectors transversely set with longitudinal two-dimensional array are pasted with substrate, photodetector is corresponded with laser and set.
Join shown in Fig. 3, Fig. 4, introduce the optical power monitoring component 200 in the application second embodiment, the optical power monitoring component 200 includes：Laser 210, photodetector 220, contact pin 230 and circuit board 240, wherein：
Laser 210, laser 210 at least exports the positive light for transmitting optical signal and the dorsad light for monitoring luminous power, it is preferable that present embodiment includes the laser 210 that four horizontal arrays are set；
Photodetector 220, photodetector 220 is corresponded with laser 210 and set, including the photodetector that four horizontal arrays are set, and each photodetector 220 is used to receive the dorsad light that corresponding laser 210 is transmitted, and is translated into electric signal；
Use contact pin 230 for fixing device 230 in contact pin 230, present embodiment, photodetector 220 is fixedly installed on contact pin 230；
Circuit board 240, jack 241 corresponding with contact pin 230 is offered on circuit board 240, such as the array arrangement on circuit board 240 of jack 241 in present embodiment, each contact pin 230, which is fixed, to be plugged in a jack 241 on circuit board 240, it is electrically connected and sets between circuit board 240, contact pin 230 and photodetector 220, circuit board 240 can receives the electric signal in photodetector 220.
Further, photodetector 220 fixes attachment, contact pin 230 and the right angle setting of circuit board 240 with contact pin 230 using viscose glue in present embodiment, and photodetector 220 is mounted on contact pin 230 towards the side of laser 210.
Contact pin 230 is made of an electrically conducting material, in the electric signal transmission that can send photodetector 220 to circuit board 240.
In present embodiment, in order to ensure the fixed effect of contact pin and jack, circuit board is rigid circuit board, and rigid circuit board is including PCBA board etc..
Deforming obtained embodiment by above-mentioned embodiment also includes：
Only it is fitted with circuit board on a contact pin, contact pin and is pasted with an independent photodetector, provided with a laser corresponding with photodetector；
Or, the photodetector that some longitudinal direction arrangements are pasted with a contact pin, contact pin is only fitted with circuit board, photodetector is corresponded with laser and set, and each photodetector is respectively by corresponding signal transmssion line by electric signal transmission to circuit board；
Or, the contact pin of some horizontal array arrangements is only fitted with circuit board, the photodetector of some longitudinal direction arrangements is pasted with each contact pin, photodetector is distributed in two-dimensional array, photodetector is corresponded with laser and set, and each photodetector is respectively by corresponding signal transmssion line by electric signal transmission to circuit board.
Optical power monitoring component in the respective embodiments described above can be applied in optical transceiver module, also include light emission component and light-receiving component in optical transceiver module, wherein, laser can export the positive light for transmitting optical signal and the dorsad light for monitoring luminous power, therefore laser is both applied to light emission component, is also applied to optical power monitoring component.
Join shown in Fig. 5, Fig. 6, introduce the optical module 300 in the embodiment of the application the 3rd, the optical module is to include the optical module of TOSA components, optical module 300 includes optical table 301 and the circuit board 340 being adhesively fixed with optical table, circuit board 340 is provided with substrate 330, it is fixed with substrate 330 on some photodetectors 320, optical table 301 and is installed with some lasers 310 and other photoelectric components.
Wherein, identically with first embodiment, the photodetector 320 in present embodiment is corresponded with laser 310 and set, and each photodetector 320 is used to receive the dorsad light that corresponding laser 310 is transmitted, and is translated into electric signal；Substrate 330 is fixedly installed on circuit board 340, is electrically connected and is set between circuit board 340, substrate 330 and photodetector 320, circuit board 340 can receive the electric signal in photodetector 320.
The optical power monitoring component that laser 310, photodetector 320, substrate 330 and circuit board 340 in present embodiment are formed in first embodiment after being fixedly mounted, so as to carry out the monitoring of laser optical power, in other embodiments, the optical power monitoring component in second embodiment can also be used in optical module, is no longer described in detail herein.
Further, it is also integrated on the optical table 301 of optical module in present embodiment to be provided with optical port 302, optical port lens 303, isolator 304, wavelength-division multiplex element 305 and collimation lens 306 shown in ginseng Fig. 5, Fig. 6, to form the TOSA light paths for optical signal transmission.
The TOSA light paths of optical module are specially in present embodiment：
By wavelength-division multiplex element 305 after the collimated collimation of lens 306 of forward light of laser 310, the optical signal of four wavelength is combined with each other after isolator 304, converged to light beam at optical port 302 by optical port lens 303, by external optical fiber（It is not shown）Receive the transmission for traveling optical signal of going forward side by side；
In photodetector 320 in the dorsad light normal incidence of laser 310 to the substrate 330 placed vertically, convert optical signal into electric signal, and enter the transmission of horizontal electrical signal by circuit board 340, the monitoring of laser dorsad light luminous power is completed, so as to realize the feedback function of dorsad light.
The application is had the advantages that by above-mentioned embodiment：
The dorsad light that optical power monitoring component is sent by laser monitors the luminous power of laser, and its is simple in construction, component stability is higher；
By substrate or multiple contact pins, the integrated monitoring of multiple path laser can be achieved, the installation accuracy of photodetector is high.
It should be understood that, although the present specification is described in terms of embodiments, but not each embodiment is only comprising an independent technical scheme, this narrating mode of specification is only for clarity, the skilled in the art should refer to the specification as a whole, technical scheme in each embodiment may also be suitably combined to form that other embodiments which can be understood by those skilled in the art.
A series of detailed description the illustrating only for the feasibility embodiment of the application of those listed above; they and be not used to limit the application protection domain, all equivalent implementations made without departing from the application skill spirit or change should be included within the protection domain of the application.
Claims (10)
1. a kind of optical power monitoring component, it is characterised in that the optical power monitoring component includes：
Laser, the laser at least exports the positive light for transmitting optical signal and the dorsad light for monitoring luminous power；
Photodetector, the photodetector is corresponded with laser and set, and for receiving the dorsad light of laser transmission, and is translated into electric signal；
Fixing device, the photodetector is fixedly installed in fixing device；
Circuit board, the fixing device is fixedly installed on circuit board, is electrically connected and is set between the circuit board, fixing device and photodetector, the electric signal in board receiver photodetector.
2. optical power monitoring component according to claim 1, it is characterised in that the fixing device is substrate, the substrate is electrically connected with circuit board, and the photodetector is electrically connected with substrate.
3. optical power monitoring component according to claim 2, it is characterised in that the substrate is fixed using viscose glue with circuit board, photodetector and substrate and mounted.
4. optical power monitoring component according to claim 1, it is characterised in that the fixing device is contact pin, the circuit board is provided with jack, and the contact pin is electrically connected by jack and circuit board.
5. optical power monitoring component according to claim 4, it is characterised in that the photodetector is fixed using viscose glue and is mounted on contact pin.
6. optical power monitoring component according to claim 1, it is characterised in that the fixing device and circuit board right angle setting.
7. optical power monitoring component according to claim 1, it is characterised in that the photodetector that the optical power monitoring component is independently arranged including one or multiple arrays are set, the laser is corresponded with photodetector and set.
8. optical power monitoring component according to claim 1, it is characterised in that the circuit board is rigid circuit board or flexible PCB.
9. a kind of optical module, it is characterized in that, the optical module includes optical table and the circuit board being adhesively fixed with optical table, the circuit board is provided with fixing device, photodetector is fixed with the fixing device, laser is installed with optical table, the photodetector is corresponded with laser and set, it is also integrated on the optical table to be provided with optical port, optical port lens, isolator, wavelength-division multiplex element and collimation lens.
10. optical module according to claim 9, it is characterised in that the fixing device is substrate or contact pin, wherein：
The substrate is electrically connected with circuit board, and the photodetector is electrically connected with substrate；
The circuit board is provided with jack, and the contact pin is electrically connected by jack and circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610082200.5A CN107046440A (en) | 2016-02-05 | 2016-02-05 | Optical power monitoring component and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610082200.5A CN107046440A (en) | 2016-02-05 | 2016-02-05 | Optical power monitoring component and optical module |
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| Publication Number | Publication Date |
|---|---|
| CN107046440A true CN107046440A (en) | 2017-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610082200.5A Pending CN107046440A (en) | 2016-02-05 | 2016-02-05 | Optical power monitoring component and optical module |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1655479A (en) * | 2004-02-12 | 2005-08-17 | 深圳飞通光电股份有限公司 | Single optical fibre duplex transmission tipple-port optical module |
| CN201293853Y (en) * | 2008-11-20 | 2009-08-19 | 青岛海信宽带多媒体技术股份有限公司 | Optical module capable of transmitting multipath optical signals |
| CN104348553A (en) * | 2013-08-01 | 2015-02-11 | 深圳新飞通光电子技术有限公司 | Cfp optical transceiver module |
-
2016
- 2016-02-05 CN CN201610082200.5A patent/CN107046440A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1655479A (en) * | 2004-02-12 | 2005-08-17 | 深圳飞通光电股份有限公司 | Single optical fibre duplex transmission tipple-port optical module |
| CN201293853Y (en) * | 2008-11-20 | 2009-08-19 | 青岛海信宽带多媒体技术股份有限公司 | Optical module capable of transmitting multipath optical signals |
| CN104348553A (en) * | 2013-08-01 | 2015-02-11 | 深圳新飞通光电子技术有限公司 | Cfp optical transceiver module |
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Application publication date: 20170815 |