CN107037236A - Accelerometer - Google Patents

Accelerometer Download PDF

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Publication number
CN107037236A
CN107037236A CN201610918721.XA CN201610918721A CN107037236A CN 107037236 A CN107037236 A CN 107037236A CN 201610918721 A CN201610918721 A CN 201610918721A CN 107037236 A CN107037236 A CN 107037236A
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CN
China
Prior art keywords
component
accelerometer
detection quality
magnet
athletic
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Pending
Application number
CN201610918721.XA
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Chinese (zh)
Inventor
P.W.德怀尔
S.F.贝卡
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Honeywell International Inc
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Honeywell International Inc
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Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to CN201610918721.XA priority Critical patent/CN107037236A/en
Publication of CN107037236A publication Critical patent/CN107037236A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up

Abstract

The present invention relates to accelerometer.Accelerometer disclosed herein includes detection quality component and accelerometer support member.In some instances, the combined altitudes of the material of accelerometer support member and combined thermal expansion coefficient（CTE）It is configured to substantially match with the CTE of the material of non-athletic component, wherein the material of the non-athletic component carries the height for the combined altitudes for being substantially similar to accelerometer support member.In some instances, accelerometer support member is configured to be connected to the central protuberance pad of detection quality component and maintains to detect the capacitance gap between the part of capacitor board and non-athletic component in the detection quality of quality component.

Description

Accelerometer
Technical field
This disclosure relates to accelerometer.
Background technology
Some accelerometers include capacitive pickoff system.For example, conductive material（For example, condenser armature）Inspection can be deposited on Mass metering（proof mass）Upper surface on, and similar conductive material can be deposited on detection quality lower surface on.Edge The acceleration or power that the sensitive axis of accelerometer applies cause detection quality or upwardly or downwardly deflected, and are picked up so as to cause Take（pick-off）The distance between capacitor board and upper and lower part non-athletic component（For example, capacitive gaps）Change.Electric capacity Property gap this change cause capacitive element electric capacity change, it represents the displacement along sensitive axis of detection quality.Electricity The change of appearance can be used as shift signal, and shift signal can be applied to including one or more electromagnets（For example, power releveling line Circle）Servo-drive system so that detection quality return-to-zero position or resting position.
Film lead on the surface of accelerometer（For example, line bonding connection）There is provided electric to conductive material and electromagnet Connection.Electronic installation can the electric capacity based on relative to condenser armature change or electromagnet in maintain detection quality be in The driving current increase of zero-bit come determine apply to accelerometer acceleration.
The content of the invention
Disclosure description can help to reduce the instable technology of deviation and deviation in accelerometer, device and be System, its large deviations is in no input power（For example, input acceleration or other power）In the case of accelerometer output.Accelerate Acceleration evaluation can be determined based on accelerometer output and deviation by spending the processor of meter systems.In some cases, can be with Model using the performance of accelerometer carrys out determination deviation.As described herein, in some instances, due to fuel factor Error in the model of generation（Herein referred to as " thermal model error "）Can be with least partially due to the construction of accelerometer It is reduced.For example, the sluggishness of the one-component of thermal model error can be referred to as（That is, the change of the zero-bit of detection quality）Can be with It is reduced.
In one example, detection quality component includes：Detect quality；Around the inner ring of the detection quality；Around institute State the outer shroud of inner ring；One or more ring bending sections, wherein one or more of ring bending sections flexibly connect the inner ring It is connected to the outer shroud；Center pad bending section, it is included in the central protuberance pad of the remote end part of the center pad bending section, its In, the central protuberance pad is flexibly connected to the inner ring by the center pad bending section；And two or more detection matter Bending section is measured, wherein the detection quality is flexibly connected to the inner ring simultaneously by described two or multiple detection quality bending sections The detection mass motion is allowed to go out the plane limited by the inner ring.
In another example, accelerometer support meanss include non-athletic component；Magnet including recess, wherein the magnetic Body is positioned on the first side of a part for the non-athletic component；Pole piece including hole, wherein the pole piece be positioned at it is described On first side of magnet, wherein the hole of the pole piece is alignd with the recess of the magnet；And it is positioned at the magnetic Pin in the recess of body and the hole of the pole piece, wherein the pin extended to from the recess of the magnet it is described The first side top of pole piece, the wherein combined altitudes of the material of accelerometer support member and the thermal coefficient of expansion of combination（CTE）Quilt It is configured to substantially match with the CTE of the material of the non-athletic component, wherein the material of the non-athletic component is with essence The height of the upper combined altitudes similar to the accelerometer support member.
In another example, a kind of accelerometer includes：Quality component is detected, it includes detection quality and including middle cardiac prominence Multiple raised pads of pad are played, wherein the detection quality is configured in response to applying to the acceleration of the detection quality component And shift；And accelerometer support member, it includes non-athletic component；Magnet including recess, wherein the magnet is positioned at On first side of a part for the non-athletic component；Pole piece including hole, wherein the pole piece is positioned at the of the magnet On side, wherein the hole of the pole piece is alignd with the recess of the magnet；And it is positioned at the described of the magnet Pin in the hole of recess and the pole piece, wherein the pin from the recess of the magnet be extended to connect to it is described in Heart raised pads；The combined altitudes of the material of wherein described accelerometer support member and the thermal coefficient of expansion of combination（CTE）It is constructed Substantially matched into the CTE with the material of the non-athletic component, wherein the material of the non-athletic component is with essence The height of the upper combined altitudes similar to the accelerometer support member, and wherein, the accelerometer support member The combined altitudes of the material and the combination CTE are configured to maintain the capacitor board and the non-fortune of the detection quality Capacitance gap between the Part II of dynamic component.
The disclosure also includes following technical scheme：
A kind of detection quality component of scheme 1., including：
Detect quality；
Around the inner ring of the detection quality；
Around the outer shroud of the inner ring；
One or more ring bending sections, wherein the inner ring is flexibly connected to outside described by one or more of ring bending sections Ring；
Center pad bending section, it is included in the central protuberance pad of the remote end part of the center pad bending section, wherein, the center The central protuberance pad is flexibly connected to the inner ring by pad bending section；And
Two or more detection quality bending sections, wherein described two or more are detected quality bending sections by the detection matter Amount is flexibly connected to the inner ring and allows the detection mass motion to go out the plane limited by the inner ring.
Detection quality component of the scheme 2. according to scheme 1, in addition to it is attached to the detection quality and the center The coil of bending section is padded, wherein, the detection quality includes condenser armature, and wherein, the electric capacity center of the condenser armature Positioned at the inclination center of the detection quality component.
Detection quality component of the scheme 3. according to scheme 1, in addition to multiple pad bending sections, wherein, the multiple pad Bending section is configured to multiple raised pads being flexibly connected to the outer shroud.
Detection quality component of the scheme 4. according to scheme 3, wherein, the multiple pad bending section isolation is by non-athletic Thermal coefficient of expansion between the material of the material of component and the outer shroud（CTE）Heating power caused by mismatch and strain.
Detection quality component of the scheme 5. according to scheme 3, wherein, each pad in the multiple pad bending section is curved The size and arrangement of pars convoluta maintain two KHzs（kHz）The resonance mode of the detection quality above.
Detection quality component of the scheme 6. according to scheme 3, wherein, the outer shroud includes annular, and wherein, institute Radial direction of each pad bending section along the outer shroud stated in multiple pad bending sections is flexible, and circumferentially direction and hang down It is straight in the direction of the plane of the outer shroud be rigid.
Detection quality component of the scheme 7. according to scheme 1, wherein, it is every in one or more of ring bending sections The size and arrangement of individual ring bending section maintain two KHzs（kHz）The resonance mode of the detection quality above.
Detection quality component of the scheme 8. according to scheme 1, wherein, the center pad bending section isolation is by acceleration Count heating power and strain caused by the CTE mismatch between the material of support member and the material of the inner ring.
Detection quality component of the scheme 9. according to scheme 1, wherein, one or more of ring bending sections are constructed Isolate into by the detection quality and the inner ring with the power of the outer shroud and thermal strain, and wherein, it is described two or more Individual detection quality bending section is configured to isolate the detection quality with the power of the inner ring and thermal strain.
Detection quality component of the scheme 10. according to scheme 1, wherein, the mass centre of the detection quality is positioned Into the geometric center substantially close to the detection quality component.
A kind of accelerometer support means of scheme 11., it includes：
Non-athletic component；
Magnet including recess, wherein the magnet is positioned on the first side of a part for the non-athletic component；
Pole piece including hole, wherein the pole piece is positioned on the first side of the magnet, wherein the hole of the pole piece with The recess alignment of the magnet；And
The pin in the hole of the recess of the magnet and the pole piece is positioned at, wherein institute of the pin from the magnet Recess is stated to extend to above the first side of the pole piece；
Wherein, the height of the combination of the material of the accelerometer support member and the thermal coefficient of expansion of combination（CTE）It is configured to Substantially matched with the CTE of the material of the non-athletic component, wherein the material of the non-athletic component carry substantially like In the height of the height of the combination of the accelerometer support member.
Device of the scheme 12. according to scheme 11, wherein, the combination of the material of the accelerometer support member Height and the combination CTE including the non-athletic component a part of, the described magnet and the pin height And CTE.
Device of the scheme 13. according to scheme 11, wherein, the recess of the magnet is hole, the accelerometer Support member also includes：
Second magnet；With
Adhesive phase, wherein, second magnet is attached to the second side of the magnet and by described the by described adhesive layer Two magnets are attached to a part of first side of the non-athletic component.
Device of the scheme 14. according to scheme 13, wherein, the material of the accelerometer support member it is described The height of combination and the CTE of the combination include a part of, the described adhesive layer of the non-athletic component, described second The height and CTE of magnet and the pin.
Device of the scheme 15. according to scheme 11, wherein, the part of the non-athletic component includes invar At least one of or superinvar.
Device of the scheme 16. according to scheme 11, wherein, the material of the pin includes quartz（SiO2）.
Device of the scheme 17. according to scheme 11, wherein, the material of the pin, which has, is less than the minimum of return path CTE CTE.
A kind of accelerometer of scheme 18., including：
Quality component is detected, it includes：
Detect quality；With
Multiple raised pads including central protuberance pad,
Wherein, the detection quality is configured to shift in response to applying to the acceleration of the detection quality component；With
Accelerometer support member, it includes：
Non-athletic component；
Magnet including recess, wherein, the magnet is positioned on the first side of a part for the non-athletic component；
Pole piece including hole, wherein, the pole piece is positioned on the first side of the magnet, wherein, the hole of the pole piece Alignd with the recess of the magnet；And
The pin in the hole of the recess of the magnet and the pole piece is positioned at, wherein, the pin is from the magnet The recess is extended to connect to the central protuberance pad；
Wherein, the height of the combination of the material of the accelerometer support member and the thermal coefficient of expansion of combination（CTE）It is configured to Substantially matched with the CTE of the material of the non-athletic component, and the material of the non-athletic component is carried substantially Similar to the height of the height of the combination of the accelerometer support member, and wherein, the accelerometer support member The height of the combination of the material and the CTE of the combination are configured to maintain the capacitor board for detecting quality and described Capacitance gap between the Part II of non-athletic component.
Accelerometer of the scheme 19. as described in scheme 18, wherein, the recess of the magnet is hole, the acceleration Meter support member also includes：
Second magnet；With
Adhesive phase, wherein, second magnet is attached to the second side of the magnet and by described the by described adhesive layer Two magnets are attached to a part of first side of the non-athletic component.
Accelerometer of the scheme 20. as described in scheme 19, wherein, the institute of the material of the accelerometer support member State the height of combination and the CTE of the combination includes the part of the non-athletic component, described adhesive layer, described the The height and CTE of two magnets and the pin.
Illustrated in the details of one or more examples of disclosure accompanying drawing below and description.Other spies of the disclosure Levy, objects and advantages will become apparent from description and accompanying drawing and from claim.
Brief description of the drawings
Fig. 1 is conceptual figure of the diagram according to the top view of the detection quality component of techniques described herein.
Fig. 2 is block diagram of the diagram according to another top view of the detection quality component of techniques described herein.
Fig. 3 is block diagram of the diagram according to another top view of the detection quality component of techniques described herein.
Fig. 4 is structure of the diagram with the cross section view of caused power and/or the example accelerometer of strain during construction The property thought figure.
Fig. 5 is cross section view of the diagram with caused power and/or another example accelerometer of strain during construction Conceptual figure.
Fig. 6 is non-athletic component and the example bottom view of accelerometer support member of the diagram according to techniques described herein Block diagram.
Fig. 7 is the match height of magnet of the diagram according to techniques described herein for calculating accelerometer support member The flow chart of exemplary operations.
Embodiment
For example in airborne vehicle, autonomous vehicle（Such as " unmanned plane "）, satellite, use in guided missile or other accurate guidance systems Navigation system and alignment system by accelerometer accuracy come perform such as position determine, navigation, height above sea level determine, course It is determined that, flying surface（flight surface）Active control and Function for Automatic Pilot operation.Due to will below more Deviation is presented in the factor being discussed in detail, accelerometer, and this is referred in no input power（For example, input acceleration or other power） In the case of accelerometer output.Accelerometer deviation is referred to applies acceleration in the sensitive axis not along accelerometer In the case of the offset error represented is exported by the accelerometer observed.In other words, deviation is referred to when true acceleration is zero, Difference between indicated acceleration and true acceleration.In order to improve the accuracy of acceleration magnitude determination, the deviation can be with Model is built up during fabrication, enabling corrected acceleration meter reading is to consider deviation.Error in model can potentially shadow The accuracy that deviation is determined is rung, this can reduce the accuracy that acceleration magnitude is determined using accelerometer.
The a type of modeling error that the accuracy of deviation determination can be influenceed is thermal model error, and this is referred to due to adding The material of speedometer is changed the error for being influenceed and being introduced into model by temperature.Thermal model error can cause what deviation was determined Error, this can cause the error of accelerometer readings.In aerospace applications, these errors can result in such as payload Inaccurate transmission is gone off course from desired flight path.
Accelerometer measures detect acceleration of the quality component relative to inertial reference system.In some instances, acceleration Meter can be included in the top non-athletic component above detection quality component.Top non-athletic component and detection quality component can be with It is collectively form top capacitive pickoff system（For example, the first variable condenser）Part.For example, when the acceleration of accelerometer When degree shifts detection quality, top non-athletic component and the capacitance gap between condenser armature on the top of quality is detected The change of electric capacity is used as the instruction of the amount of the displacement to detecting quality.The amount that detection quality is shifted from electrical null position with it is attached Size with the acceleration of accelerometer is proportional.Therefore, by measuring the electricity between top non-athletic component and condenser armature The change of appearance, accelerometer can determine the acceleration that detection quality is undergone.
Additionally or alternatively, in some instances, under accelerometer can be included in below detection quality component Portion's non-athletic component.Bottom non-athletic component and detection quality component can be collectively form bottom capacitive pickoff system（For example, Second variable condenser）Part.For example, when the acceleration of accelerometer shifts detection quality, bottom non-athletic component Detect quality bottom on condenser armature between capacitance gap electric capacity change can be used for with above with respect to The similar mode of mode described by the capacitive pickoff system of top determines acceleration.The amount that detection quality is shifted from electrical null position Can be proportional to the size of the acceleration of subsidiary accelerometer.Therefore, by measuring bottom non-athletic component and condenser armature Between electric capacity change, accelerometer can determine the acceleration that is undergone of detection quality.
In some instances, top capacitive pickoff system and bottom capacitive pickoff system are used as the electricity of combination Capacitive picking up system.In these examples, the picking up system of combination can provide linearisation for the determination of acceleration magnitude（For example, with With the simplification of the algorithm of the acceleration that determines accelerometer）.Although capacitive pickoff system have described as " top " and " under Portion ", but these terms only mean difference between capacitive pickoff system and are not used in any physical relation of restriction, unless separately There is statement.
In some instances, in the non-athletic component of detection quality component above and or below and positioned at detection quality Power releveling coil on first side and/or the second side can form the part of power rebalancing system.When the acceleration of accelerometer When causing the power that will be applied to that detection quality；In order to help to maintain to detect quality position（For example, preventing detection quality due to this Power and shift）, the electric current in servo control mechanism increase power releveling coil is to drive the difference of the capacitive pickoff system from combination Dynamic condenser reaches zero, and therefore maintains the electrical null position of detection quality.In power releveling coil electric current increase provide with by The relative power of power of acceleration formation.The relative to force maintains the electrical null position of detection quality.The increase of electric current and adding for being applied Speed is proportional, and therefore, maintains to detect that the amount of the electric current needed for the electrical null position of quality can be used in calculating accelerometer The acceleration undergone.Although the example describes the differential capacitor using the capacitive pickoff system from combination, should manage Solution, the electric capacity from any one of top capacitive pickoff system or bottom capacitive pickoff system also can be by servo Structure is used alone to maintain the zero-bit of detection quality.
Detection quality has both mechanical zero and electrical null position.The mechanical zero of detection quality is to work as no acceleration quilt It is applied to detection quality or otherwise affected（Such as servo-drive system）When detect quality physical location.Detect the electric of quality Zero-bit is when no acceleration is applied to detection quality, but when being influenceed by servo-drive system, to detect the physical location of quality. In idealized system, mechanical zero is equal to electrical null position.However, in real world system, due to the influence of servo-drive system, electricity Gas zero-bit can be differently configured from mechanical zero.In other words, electrical null position can not be located at mechanical zero, because servo-drive system makes inspection Mass metering moves to electrical null position.Detecting this species diversity of the position between the electrical null position and mechanical zero of quality can cause Detect quality bending so as to detection quality applying power, this can be the part source of the deviation of accelerometer.
If for example, the capacitance variations of the capacitor in detection quality, servo-drive system will set up different electrical null positions. The new electrical null position is new deviation, and it causes to determine that the new deviation of acceleration magnitude is missed by the processor of accelerometer system Difference.Similarly, in another example, if the bending of detection quality changes due to thermal expansion, different machineries will be set up Zero-bit.The new mechanical zero is new deviation, and it causes new offset error.Techniques described herein and device pass through anti- Only or minimize the change of electrical null position and mechanical zero of detection quality and reduce new offset error.
As described herein, sluggishness generally refers to that power and/or strain are being applied into detection quality and moved Except after, detection quality does not return to previous zero-bit（For example, mechanical zero and/or electrical null position）Trend.Due to using and The change of the physical property of accelerometer part caused by temperature change, detects that the mechanical zero and/or electrical null position of quality can Change over time.For example, detection quality mechanical zero and/or electrical null position can by power and/or thermal strain apply to Accelerometer and then change after removal.
In addition, the non-ideal condition during the construction of accelerometer can also cause the error of buggy model.For example, Under ideal conditions, the material of quality component is detected in accelerometer（For example, quartz or silicon）With the material of non-athletic component（Example Such as, invar（invar）Or superinvar）It is perfect ground level, so as to cause during assembly when by non-athletic component and detection Strain is not generated when quality component forces together.However, under normal manufacturing condition, detection quality component and non-athletic component Material can limit surface modification.Therefore, non-athletic component can be with compressed detected quality group during the construction of accelerometer Part, this can apply strain in detection quality component.In addition, when abdominal belt is applied to non-athletic component, due to abdominal belt compression Detection quality component and non-athletic component are to form accelerometer, therefore these compression stresses are retained in detection quality component.
During fabrication, accelerometer can be subjected to calibration procedure with the thermal model for the thermal behavior for building accelerometer, so as to Assist in deviation present in accelerometer readings.Although the thermal model can be relatively accurate, hot-die during fabrication The accuracy of the accuracy of type and therefore accelerometer is reduced such as use.For example, error in thermal model can be Just start to occur after calibration process.The heating and cooling of accelerometer after thermal model determination can cause detection quality The change in location of detection quality position and/or cause electric capacity between the detection quality of accelerometer and non-athletic component in component The change in gap.For example, non-athletic component, magnet, pole piece, abdominal belt and the epoxy resin of accelerometer can have and detection matter Measure the different thermal coefficient of expansion of the material of component（CTE）, so as to cause non-athletic component, magnet, pole piece, abdominal belt and asphalt mixtures modified by epoxy resin Material of the fat relative to detection quality component after being heated and/or cooling down changes its physical arrangement.
Additionally or alternatively, the power being applied to during construction on accelerometer and/or strain can cause acceleration The physical arrangement for spending meter changes with outside time amount.The stress being applied to during construction on accelerometer can be slow with the time Ground is eliminated.Therefore, the initial thermal model determined during fabrication for accelerometer is because these stress eliminations can anaplasia at any time Obtain more inaccurate.In order to reduce thermal model error, disclosed herein is can prevent or minimize during construction and during use The power and/or the technology of strain and device being applied on accelerometer, it can cause detection quality position and capacitance gap not Change dependent on acceleration.In other words, techniques disclosed herein, device and system can increase the thermal model of accelerometer With the stability of temperature and time.
Multiple raised pads may include according to the detection quality component of the technical construction of the disclosure, it includes being located at accelerometer Geometric center central protuberance pad.As will be explained in more detail below, multiple raised pads can be configured to by Non-athletic component（For example, similar to " stator " of variable condenser）Strain with abdominal belt is isolated with detection quality component.
In the technology of the disclosure and some examples of device, outer shroud（hoop）Multiple raised pads can will support detection matter The inner ring of amount is mechanically isolated with power and/or strain as caused by heating and cool down the bending of caused non-athletic component. In some examples, central protuberance pad and accelerometer support member can be in zero gauge length constructions by support detection quality Ring and power caused by the heating as non-athletic component and the bending of the caused non-athletic component of cooling and/or strain mechanically every From.In some instances, accelerometer support member can allow the suspender of dimension compensation（suspension）.For example, size is mended The suspender repaid can be the different materials of the substantially height of the material of matching non-athletic component and CTE accelerometer support member The combined altitudes and combination CTE of material.
Fig. 1 is the conceptual figure of the top view for the detection quality component that diagram is constructed according to techniques described herein. In Fig. 1 example, detection quality component 1 includes outer shroud 2, raised pads 4A-4C（Jointly " raised pads 4 "）, it is ring bending section 6, interior Ring 8, center pad bending section 10, detection quality 12, detection quality bending section 14A and 14B（Jointly " detect quality bending section 14”）, coil 16, central protuberance pad 18 and condenser armature 20.
In some instances, outer shroud 2, raised pads 4, ring bending section 6, inner ring 8, center pad bending section 10, detection quality 12, Detection quality bending section 14 and central protuberance pad 18 can be all manufactured from the same material（For example, by single-piece（monolithic） Material is made）.In some instances, the single piece of material can be amorphous glass（For example, vitreous silica, Pyrex or Zerodor®）.In some instances, the single piece of material can be crystalline solid（For example, silicon, titanium or elgiloy）. In other examples, only outer shroud 2, raised pads 4, ring bending section 6, inner ring 8, center pad bending section 10, detection quality 12, detection matter A part for amount bending section 14 and central protuberance pad 18 is manufactured from the same material（For example, being made up of single piece of material）.Another In example, outer shroud 2, raised pads 4, ring bending section 6, inner ring 8, center pad bending section 10, detection quality 12, detection quality bending section 14 and central protuberance pad 18 can be made from a different material.
Outer shroud 2 provides flexible support by ring bending section 6 to inner ring 8, provides support to raised pads 4, and can also wrap Containing the strain that can shift detection quality 12.In some instances, outer shroud 2, which can be limited, detects that quality 12, raised pads 4 and ring are curved Plane residing for pars convoluta 6.In some instances, outer shroud 2 can be a single piece of material, and it carries to be eclipsed and carves to form inspection Multiple features of mass metering component 1.In some instances, outer shroud 2 can be made up of quartz or silicon.Although outer shroud 2 figure 1 illustrates For annular shape, it is envisioned that arriving, outer shroud 2 can be any shape（For example, square, rectangle, avette etc.）.
Raised pads 4 will detect that quality 12 is separated with non-athletic component, as following article is described in figures 4 and 5.One In a little examples, the height of raised pads 4 can limit the capacitive gaps between non-athletic component and detection quality 12（It is not shown）. In some examples, the height of raised pads 4 can be in one foot of two one thousandths between an one thousandth.In some instances, Raised pads 4 can be on the both sides of outer shroud 2.In some instances, raised pads 4 can be received is drawn by the construction or environment of accelerometer The power from non-athletic component risen and/or strain.
In some instances, raised pads 4 may be such that detection quality 12 can be with caused driving force and/or heat during construction Strain is mechanically isolated.In some instances, raised pads 4 can be to non-athletic component（It is not shown）Frictional force is provided and prevents non- Moving link is moved or slided during the construction of accelerometer, as described in Figure 4 and 5.
Outer shroud 2 is flexibly connected to inner ring 8 by ring bending section 6.In some instances, ring bending section 6 can circumferentially direction Be perpendicular to the direction of the plane limited by outer shroud 2 it is rigid, this can enable ring bending section 6 by inner ring 8 and detection matter 12 strain with being applied in the raised pads 4 of outer shroud 2 of amount is mechanically isolated.In some instances, the height of ring bending section 6 can be with Be about one foot 30/1000ths（For example, 0.030 foot）.
Inner ring 8 is by detecting quality bending section 14 to the detection offer support of quality 12, by center pad bending section 10 in Heart raised pads 18 provide support, and can include the strain that can also shift detection quality 12.In some instances, inner ring 8 can limit certain plane, and detection quality 12, detection quality bending section 14 and center pad bending section 10 also are located in the plane. In some instances, inner ring 8 can be a single piece of material, and it carries to be eclipsed and carves to form many of detection quality component 1 Individual feature.In some instances, inner ring 8 is substantially made up of quartz or silicon.Although inner ring 8 is shown in Figure 1 for annular shape, It is envisioned that arriving, inner ring 8 can be any shape（For example, square, rectangle, avette etc.）.
Central protuberance pad 18 is flexibly connected to inner ring 8 by center pad bending section 10, and in the inner support central protuberance of inner ring 8 Pad 18.In some instances, center pad bending section 10 can circumferentially direction and along the direction perpendicular to the plane limited by outer shroud 2 It is rigid, this can enable center pad bending section 10 by inner ring 8 and detection quality 12 and be applied on central protuberance pad 18 Strain be mechanically isolated.In some instances, the height of center pad bending section 10 can be about one foot 3/1000ths Ten（For example, 0.030 foot）.
Detection quality 12 is flexibly connected to inner ring 8 with detection quality bending section 14, and is configured in response to detection matter The acceleration of amount component 1 goes out from the plane motion limited by inner ring 8.In some instances, detection quality 12 can be in detection quality C-shaped condenser armature is included on 12 top and bottom（It is not shown）, it can provide the center of electric capacity, and be moved in detection quality 12 During position, increase and reduction and non-athletic component（It is not shown）Capacitive gaps at electric capacity.
Detection quality 12 is flexibly connected to inner ring 8 and detects matter in the inner support of inner ring 8 by detection quality bending section 14 Amount 12.In some instances, due to the acceleration of detection quality component 1, detection quality bending section 14 can enable detection quality 12 Enough in the plane peripheral motor limited by inner ring 8.For example, detection quality bending section 14 can be radially rigidity with circumferential direction , and be flexible along the direction perpendicular to the plane limited by outer shroud 2, and detect that quality bending section 14 can allow to detect matter Amount 12 is shifted out the plane limited by inner ring 8 and/or outer shroud 2.In other words, detection quality bending section 14 is configurable to detect Quality 12 is substantially isolated with the power of inner ring 8 and/or thermal strain.In some instances, detection quality bending section 14 can be about One millimeters thick.
Coil 16 can be attached to the power releveling coil of the side of detection quality component 1.In some instances, coil 16 can be connected to electronic installation（It is not shown）, it can be used for detect at the zero-bit that quality 12 is positioned in magnet assembly. In some examples, electronic installation may include one or more processors, such as one or more digital signal processors（DSP）、 General purpose microprocessor, application specific integrated circuit（ASIC）, field programmable logic array（FPGA）It is other of equal value integrated or from Scattered logic circuit.
When by acceleration apply to including detection quality component 1 and magnet assembly accelerometer when, electronic installation can increase Electric current in ledger line circle 16 is to maintain detection quality 12 to be in zero-bit.The increase of electric current can be with applying to the acceleration of accelerometer Amount it is proportional.In some instances, the electric current in coil 16 can be by electronic installation（For example, servo control mechanism）Increase, to pass through Differential capacitor between the condenser armature and magnet assembly that detect quality 12 is driven to zero to maintain the zero-bit of detection quality 12. In these examples, the electric current increase in coil 16 can provide the relative to force required for the zero-bit for maintaining detection quality 12.Electric current Increase it is proportional to the acceleration applied of accelerometer, and therefore, electric current can be used in the electronic installation of accelerometer Measurement result determine the amount of acceleration.
Accelerometer support member is connected in the central protuberance pad 18 of the remote end part of center pad bending section 10, following article exists As described in Figure 4 and 5.In some instances, the height of central protuberance pad 18 can limit non-athletic component and detection matter The condenser armature of amount 12（It is not shown）Between capacitive gaps（It is not shown）.In some instances, the height of central protuberance pad 18 Degree can be in one foot of two one thousandths between an one thousandth.In some instances, central protuberance pad 18 can be located at center On the both sides for the remote end part for padding bending section 10.In some instances, central protuberance pad 18 can receive the construction by accelerometer Caused power and/or strain from accelerometer support member, as following article is described in figures 4 and 5.Show at some In example, central protuberance pad 18 can realize the zero standard of accelerometer away from construction（zero gauge configuration）.
In some instances, central protuberance pad 18 can enable detection quality 12 with it is caused during construction or come from The power of the environment of accelerometer and/or strain are mechanically isolated.In some instances, central protuberance pad 18 can be to accelerometer branch Support member provides frictional force and prevents non-athletic component from moving or sliding during the construction of accelerometer, and following article is in Figure 4 and 5 Described in as.
In some instances, the feature of detection quality component 1 can pass through laser（For example, carbon dioxide laser）In list Cutting gap is formed in part formula material.In these examples, gap can be about one foot of 2/1000ths thickness.For example, Gap between outer shroud 2 and inner ring 8 can be cut out by laser under one foot of 2/1000ths thickness.
Condenser armature 20 is the conductive material being located on one or more sides of detection quality 12.In some instances, Condenser armature 20 can be vapor-deposited to detection quality 12.In some instances, during condenser armature 20 can also be accelerometer Picking up system part, wherein condenser armature 20 and accelerometer non-athletic component formation capacitive gaps.Show at these In example, condenser armature 20 can provide signal to electronic installation, to allow electronic installation by increaseing or decreasing electric current come servo line set Circle 16, this can maintain detection quality 12 to be in zero-bit, and increased or reduction electric current is with applying to detection quality group The acceleration of part 1 is proportional.In some instances, the center line of condenser armature may pass through the center of central protuberance pad, and this can be with Accelerometer is reduced to inclined sensitiveness.In some instances, condenser armature 20 can be similar to the rotor of variable condenser.
In the example of fig. 1, raised pads 4 are located on outer shroud 2 between the outside of inner ring 8 and outer shroud 2.Although not in Fig. 1 In show, but in some instances, non-athletic component can be attached to around detection quality component 1 and by raised pads 4 outer Ring 2.In some instances, outer shroud 2 can be configured to more soft than inner ring 8 so that be applied by raised pads 4 to outer shroud 2 Power and thermal strain can be reduced and/or with inner ring 8 and detection quality 12 isolate.
For example, by with ring bending section 6, outer shroud 2 can with the power in isolation detection quality component 1 and thermal strain, wherein It is radially thin that ring bending section 6, which can be,（For example, flexible）And circumferentially direction and limited perpendicular to by outer shroud 2 The direction of plane be rigid.In some instances, ring bending section 6 can isolate inner ring 8 with raised pads 4, to allow non-fortune Dynamic component is radially expanded with temperature, while less strain is transmitted to inner ring 8, wherein straining the electric capacity by detection quality 12 is caused Device plate moves and forms deviation.In some instances, during the construction of accelerometer, raised pads 4 can support non-athletic structure Part, this prevents non-athletic component due to more closely being bent together by the compression stress that abdominal belt applies, as retouched in Figure 4 and 5 State.In some instances, compression stress can be caused by the CTE of the abdominal belt of the CTE higher than quartz/invar stacking, and wherein abdominal belt is attached It is connected to the quartz/invar stacking.For example, when elevated solidification temperature cooling of the abdominal belt from epoxy resin, abdominal belt is than quartz/Yin Steel layer overlapping is contracted more, and is compressed quartz/invar stacking.
Quality component 1 can be detected according to the technical construction of the disclosure to reduce thermal model error, this can cause electronics to fill Put the acceleration that can preferably determine to detect quality component 1.Generally, accelerometer includes power and/or strain, different CTE And epoxy resin, this will change the state of accelerometer with time and temperature, so that construction and/or environment in accelerometer Heating and cooling period cause sluggishness（That is, the change of the mechanical zero and/or electrical null position of detection quality）.Add however, working as During the state change of speedometer, raised pads 4 can help to reduce thermal model error, including cause during the construction of accelerometer Sluggishness.By providing raised pads 4 for outer shroud 2, wherein outer shroud 2 is flexibly coupled to inner ring 8 with ring bending section 6, and inner ring 8 is used Detection quality bending section 14 is flexibly connected to detect quality 12, after construction and over time must calibrating accolerometer Influence will reduce.Moreover, raised pads 4 can prevent non-athletic component from changing accelerometer support member and the electric capacity of detection quality 12 Capacitive gaps between property plate, this can provide the more preferable determination of more accurately capacitive gaps and actual acceleration.Change Yan Zhi, the outer shroud 2 with raised pads 4 of inner ring 8 is connected to ring bending section 6, and flexibly connected by detection quality bending section 14 The inner ring 8 of detection quality 12 is connected to, can be reduced to as applying to the electricity of accelerometer caused by the power of accelerometer and thermal strain The need for the compensation of the change of capacitive gaps.
In the example of fig. 1, central protuberance pad 18 is located at the remote end part of center pad bending section 10, substantial proximity detection The center of quality 12.Central protuberance pad 18 can be for example in the periphery limited by coil 16 and/or by detection quality 12 In the periphery that outward flange is limited.Although not shown in FIG. 1, in some instances, accelerometer support member may be at inspection Above and below mass metering component 1 and inner ring 8 can be connected to by central protuberance pad 18.In some instances, center Pad bending section 10 can be configured to flexibility so that being applied by central protuberance pad 18 can be with to the power of inner ring 8 and thermal strain It is reduced and/or isolates with inner ring 8 and detection quality 12.
For example, by with center pad bending section 10, inner ring 8 can with the power in isolation detection quality component 1 and thermal strain, It is radially thin that wherein the center pad bending section 10, which can be,（For example, flexible）And circumferentially direction and perpendicular to by The direction for the plane that inner ring 8 is limited is rigid.In some instances, center pad bending section 10 can be by inner ring 8 and central protuberance Pad 18 is isolated, to allow accelerometer support member to be radially expanded with temperature, and transmits less strain to inner ring 8 simultaneously, wherein Strain and the condenser armature for causing detection quality 12 is moved and deviation is formed.In some instances, central protuberance pad 18 can be propped up Support accelerometer support member.In these examples, accelerometer support member can support non-athletic component, and this can prevent non-fortune Dynamic component by the compression stress that abdominal belt applies due to more closely being bent together, as described in Figure 4 and 5.One In a little examples, compression stress can be caused by the CTE of the abdominal belt for the CTE being laminated higher than accelerometer support member.For example, working as abdominal belt And/or non-athletic component, from during the elevated solidification temperature cooling of epoxy resin, abdominal belt and/or non-athletic component compare accelerometer Support member stacking is shunk more, and can be compressed the stacking of accelerometer support member.In some instances, in non-fortune In the case that dynamic component does not have accelerometer support member, include the affixed plane of different capacitors（ground plane）It is non- Moving link can be bent, so as to produce deviation.
Quality component 1 can be detected according to the technical construction of the disclosure to reduce thermal model error, this can fill electronics Put the acceleration that can preferably determine to detect quality component 1.Normally, accelerometer includes power and/or strain, difference CTE And epoxy resin, it will change the state of accelerometer with time and temperature, so that construction and/or environment in accelerometer Heating and cooling period cause sluggishness（That is, the change of the machinery and/or electrical null position of detection quality）.However, working as acceleration During the state change of meter, central protuberance pad 18 can help to reduce thermal model error, including during construction and/or by detection quality It is sluggish caused by the environment of component 1.It is flexibly connected to by the remote end part provided in center pad bending section 10 in inner ring 8 Heart raised pads 18（The inner ring 8 is flexibly connected to detect quality 12 with detection quality bending section 14）, will reduce after construction With the influence with time necessary calibrating accolerometer.Moreover, central protuberance pad 18 and accelerometer support member can prevent non-fortune Dynamic component changes the capacitive gaps between non-athletic component and the capacitive plates for detecting quality 12, and this can be provided more accurately Capacitive gaps and the more preferable determination to actual acceleration.In other words, the center of inner ring 8 is connected to center pad bending section 10 Raised pads 18, and by detection quality bending section 14 be flexibly connected to detect quality 12 inner ring 8, can reduce to by apply to The need for the compensation of the change of the capacitive gaps of accelerometer caused by the power of accelerometer and thermal strain.In the disclosure It is contemplated to, raised pads 4 and central protuberance pad 18 can be located at and/or be orientated in the detection quality component 1 for expecting strain isolating Any position at.
In some instances, detection quality component 1 may include line bonding connection.In these examples, two line bondings connect Electric current can be provided to coil 16 by connecing.In these examples, three extra line bonding connections can be used to detect matter with servo Component 1 is measured, signal that wherein two in these three extra line bonding connections can be to provide the measurement for realizing electric capacity is picked up Take device（pick off）, and the 3rd additional lines bonding connection can be ground（ground）.
Fig. 2 is diagram according to the conceptual of another example top view of the detection quality component 41 of techniques described herein Figure.In the figure 2 example, detection quality component 41 includes outer shroud 42, raised pads 44A-44D（Jointly " raised pads 44 "）, ring Bending section 46A-46C（Jointly " ring bending section 46 "）, inner ring 48, center pad bending section 50, detection quality 52, detection quality it is curved Pars convoluta 54A and 54B（Jointly " detect quality bending section 54 "）, coil 56, central protuberance pad 58 and condenser armature 60, it can Respectively to correspond to outer shroud 2, raised pads 4A-4C（Jointly " raised pads 4 "）, ring bending section 6, inner ring 8, center pad bending section 10th, detection quality 12, detection quality bending section 14A and 14B（Jointly " detect quality bending section 14 "）, coil 16, middle cardiac prominence Pad 18 and condenser armature 20 are played, as depicted in figure 1.
Outer shroud 42 can be flexibly connected to inner ring 48 by each in ring bending section 46.In some instances, ring is curved Pars convoluta 46 can circumferentially direction and be rigid along the direction perpendicular to the plane limited by outer shroud 42, this can cause ring to bend Inner ring 48 and detection quality 52 can be mechanically isolated by portion 46 with the strain that is applied in the raised pads 44 of outer shroud 42.At some In example, when compared with ring bending section 6 and inner ring 8, ring bending section 46 can provide extra support to inner ring 48.Show at some In example, when compared with ring bending section 6 and inner ring 8, ring bending section 46 can provide more symmetrical support to inner ring 48.At these In example, the symmetric support of ring bending section 46 can reduce power and/or thermal strain is transferred to inner ring 48.
Condenser armature 60 is the conductive material being located on one or more sides of detection quality 52.In some instances, Condenser armature 60 can be by vapour deposition to detection quality 52.In these examples, condenser armature 60 can be configured to be located at Detect the center of gravity of quality component 41 or tilt center（tilt center）The electric capacity center at place.In other words, condenser armature 60 It can be formed in specific location with more or less conductive materials, the ad-hoc location is in the gravity of detection quality component 41 The electric capacity center of condenser armature 60 is provided at the heart.For example, when compared with the condenser armature 20 with Fig. 1, condenser armature 60 is in detection Formed in the case of having extra conductive material by quality bending section 54, this enables condenser armature 60 to have closer to detection The electric capacity center of the center of gravity of quality component 41.In some instances, condenser armature 60 can be similar to variable condenser Rotor.
When in the figure 2 example, compared with the detection quality 12 with Fig. 1, detection quality 52 can have proximity detection matter The additional materials of bending section 54 are measured, this can allow the substantial proximity detection quality component 41 of mass centre for detecting quality 52 Center.In other words, detection quality 52 can be configured to the center for being positioned to substantial proximity detection quality component 41 Mass centre.In some instances, the inspection of the mass centre with the center for being positioned to substantial proximity detection quality component 41 Mass metering 52 can allow the electric capacity for detecting the condenser armature in quality 52 to be centrally located at the inclination center of detection quality component 41 Place.In some instances, the detection quality of the mass centre with the center for being positioned to substantial proximity detection quality component 41 52 can allow non-athletic component to be symmetrical and easily flat stacked（lap）.In other words, it is positioned adjacent to detect quality The additional materials of bending section 54 can make electric capacity center and the magnetic circuit of detection quality 52（It is not shown）Non-magnetic center it is consistent.
In some instances, in the case of consistent not with the non-magnetic center of magnetic circuit at the electric capacity center of detection quality 52, magnetic The a part of of road must may be deleted, to make non-magnetic center and electric capacity center alignment.In some instances, by neighbouring inspection The electric capacity center of the detection quality 52 that the additional materials of mass metering bending section 54 the are provided situation consistent with the non-magnetic center of magnetic circuit Under, magnetic circuit can not need any deletion, and its can also be made symmetrical.In some instances, in the electric capacity of detection quality 52 In the case that center is consistent with the non-magnetic center of symmetrical magnetic circuits, detection quality component 41 can be increased and with detection quality component The accuracy of 41 accelerometer.
Fig. 3 is diagram according to the conceptual of another example top view of the detection quality component 71 of techniques described herein Figure.In the example of fig. 3, detection quality component 71 includes outer shroud 72, raised pads 74A-74C（Jointly " raised pads 74 "）, ring Bending section 76A-76C（Jointly " ring bending section 76 "）, inner ring 78, center pad bending section 80, detection quality 82, detection quality it is curved Pars convoluta 84A and 84B（Jointly " detect quality bending section 84 "）, coil 86, central protuberance pad 88 and condenser armature 90, it can To correspond respectively to outer shroud 2, raised pads 4A-4C（Jointly " raised pads 4 "）, ring bending section 6, inner ring 8, center pad bending section 10th, detection quality 12, detection quality bending section 14A and 14B（Jointly " detect quality bending section 14 "）, coil 16, middle cardiac prominence Rise pad 18 and condenser armature 20, as depicted in figure 1 as.In the example of fig. 3, detection quality component 71 can be wrapped also Include pad bending section 75A-75F（Jointly " pad bending section 75 "）.
Each padded in bending section 75 is the thin section point of the quartz material at the edge for being positioned adjacent to raised pads 74, its Raised pads 74 can be flexibly connected to outer shroud 72.In some instances, it is radially soft that pad bending section 75, which can be, Property and circumferentially direction and be rigid perpendicular to the direction of the plane limited by outer shroud 72.In some instances, depend on The degree of isolation required for for acceptable performance, pad bending section 75 can have about one millimeter of thickness. In some examples, pad bending section 75 can be the bending section of the laser cutting around raised pads 74, to allow the inspection of accelerometer Coefficient of thermal expansion mismatch between mass metering component 71 and non-athletic component, as following article is described in figures 4 and 5.
Outer shroud 72 can be flexibly connected to inner ring 78 by each in ring bending section 76.In some instances, ring Bending section 76 can be circumferentially direction and be rigid perpendicular to the direction of the plane limited by outer shroud 72, and this can make ring curved Inner ring 78 and detection quality 82 can be mechanically isolated by pars convoluta 76 with the strain that is applied in the raised pads 74 of outer shroud 72.One In a little examples, when compared with ring bending section 6 and inner ring 8, ring bending section 76 can provide extra support to inner ring 78.At some In example, when compared with ring bending section 6 and inner ring 8, ring bending section 76 can provide more symmetrical support to inner ring 78.At these In example, the symmetric support of ring bending section 76 can reduce power and/or thermal strain is transferred to inner ring 78.In some instances, ring Bending section 76 can be the bending section of the laser cutting between outer shroud 72 and inner ring 78, and it can be by by the way that non-athletic component be consolidated The power and/or strain being sandwiched in caused by outer shroud 72 are isolated with inner ring 78 and detection quality 82.
Fig. 4 is structure of the diagram with the cross section view of caused power and/or the example accelerometer of strain during construction The property thought figure.In the example of fig. 4, accelerometer 100 includes detection quality component 101, raised pads 104A -104D（It is jointly " convex Play pad 104 "）, power releveling coil 116A -116B（Jointly " power releveling coil 116 "）, and central protuberance pad 118A and 118B（Jointly " central protuberance pad 118 "）, it can correspond respectively to detect quality component 1,41 and 71, raised pads 4,44 and 74, coil 16 and central protuberance pad 18, as described in Fig. 1-3.In the example of fig. 4, accelerometer 100 is also wrapped Include non-athletic component 106A and 106B（Jointly " non-athletic component 106 "）, abdominal belt 108, capacitive gaps 110, magnet 112A And 112B（Jointly " magnet 112 "）, pole piece 114A and 114B（Jointly " pole piece 114 "）And pin 120A and 120B（Jointly Ground " pin 120 "）.In the example of fig. 4, accelerometer 100 can include accelerometer support member 122A and 122B（Jointly " accelerometer support member 122 "）, it can be formed by the combination of non-athletic component 106, magnet 112, pole piece 114 and pin 120. For example, accelerometer support member 122A can be with right and wrong moving link 106A substrate, magnet 112A, pole piece 114A and pin 120A Combination.In another example, accelerometer support member 122B can be with right and wrong moving link 106B substrate, magnet 112B, pole Piece 114B and the combination for selling 120B.
Non-athletic component 106 is to be attached to（For example it is sandwiched in admittedly）Detect the raised pads 104 and middle cardiac prominence of quality component Play the non-athletic component of pad 118.In some instances, non-athletic component 106 is bimetallic part, and it can provide magnetic flux and return Loop footpath（magnetic return path）.In some instances, non-athletic component 106 can be similar to variable condenser Stator.
Abdominal belt 108 is single metal part, and it is the cyclic structure for carrying slit wherein, and around non-athletic component 106 Outside.In some instances, when folder to the detection quality component admittedly of non-athletic component 106, abdominal belt 108 can be attached to（Example Such as, adhering with epoxy resin is used）Non-athletic component 106.
Capacitive gaps 110 are detection quality（For example, the detection quality 12,52 or 82 as described in Fig. 1-3）On Condenser armature（For example, the condenser armature 20,60 or 90 as described in Fig. 1-3）With by raised pads 104 and central protuberance pad 118 Gap between the non-athletic component 106 of restriction, it is the height of raised pads 104 and central protuberance pad 118（For example, in detection About one mil on every side of quality）.In some instances, capacitive gaps 110 can have capacitance.At this In a little examples, other capacitive gaps between detection quality and non-athletic component 106 can have capacitance.Electronic installation （It is not shown）The capacitance of capacitive gaps 110 and/or other capacitive gaps can be detected, it can be in closed-loop path （loop）By electronic installation in differential capacitor construction（It is not shown）It is detected and used, to determine the acceleration of accelerometer 100.Example Such as, the increase of capacitive gaps 110 and the reduction of the other capacitive gaps relative with capacitive gaps 110 can indicate to apply In the acceleration of accelerometer 100.Differently, the reduction of capacitive gaps 110 and the other electricity relative with capacitive gaps 110 The increase of capacitive gaps can indicate to put on the acceleration of accelerometer 100.
Magnet 112 is to be used to provide magnetic field with driving magnet 112, pole piece 114, power releveling coil 116 and non-athletic The magnet of the magnetic circuit of component 106.In some instances, magnet 112 can by alnico alloy, SmCo, neodymium iron boron or it is other so Material be made.In some instances, magnet 112 can be received as caused by the construction of accelerometer 100 from non-athletic component The power of 106 transmission and/or strain.In some instances, magnet 112 can be part of the zero standard away from construction of accelerometer 100.
Pole piece 114 is the magnetic field of magnet 112 is concentrated and driving magnet 112, pole piece 114, power releveling line The magnetic texure of the magnetic circuit of circle 116 and non-athletic component 106.For example, pole piece 114 can be that the magnetic field for enabling magnet is turned And flow through the magnetic texure of power releveling coil 116.In these examples, by allowing the magnetic field of magnet 112 to be put down again through exertin Weigh coil 116, and the magnetic field of magnet 112 can enter non-athletic component 106 and pass through the phase of the circulation of non-athletic component 106 to magnet Offside, and pole piece is reached back up through magnet, so as to complete magnetic circuit.
In some instances, pole piece 114 can be received as caused by the construction of accelerometer 100 from non-athletic component 106 The power transmitted with magnet 112 and/or strain.In some instances, pole piece 114 can be the zero standard of accelerometer 100 away from construction Part.In some instances, pole piece 114 can be by permeable material（Such as invar, mu-metal, permalloy or other such Material）It is made.
Pin 120 is located in the recess of magnet 112 and magnet 112 is connected to the central protuberance pad of detection quality component 101 118.In some instances, pin 120 can be received as caused by the construction of accelerometer 100 by magnet 112 from non-athletic structure Power and/or strain that part 106 is transmitted.In some instances, pin 120 can be part of the zero standard away from construction of accelerometer 100.
In some instances, pin 120 can be made up of the material with the CTE similar to the CTE of non-athletic component 106. The material selected for return path can influence the material selected for pin 120.In some instances, pin 120 can make inspection Mass metering component 101 can in zero gauge length construction with caused by environment during construction or from accelerometer 100 Power and/or strain are mechanically isolated.In some instances, pin 120 can provide frictional force to central protuberance pad 118 and prevent non- Moving link 106 is moved or slided during the construction of accelerometer 100.Support member is layered in center can with the expansion of temperature , the outer side ring of fused silica part substantially the same with the expansion of the material for magnetic flux return path to be selected to Admittedly it is sandwiched on the magnetic flux return path.If for example, a part for center stack is by the magnet material structure with higher CTE Into, then the remainder of center stack can by the CTE lower CTE with the material than constituting magnetic flux return path material It is made, height is changed with temperature with magnetic flux return path identical mode to cause central supported to be laminated.
In some instances, accelerometer 100 can include the power releveling coil being attached on every side of detection quality 116.In some instances, accelerometer 100 may include electronic installation（It is not shown）, its servo force releveling coil l16 is with general Detection quality is positioned at zero-bit.In some instances, when applying acceleration to accelerometer 100, electronic installation can increase The electric current in releveling coil 116 is reinforced to maintain detection quality to be at zero-bit.In this example, the increase and application of electric current Amount to the acceleration of accelerometer 100 is proportional.
In the example of fig. 4, produced during the construction of accelerometer 100 as the power indicated by unidirectional arrow and/or Strain（For example, chucking power and/or thermal strain）.For example, non-athletic component 106 can be held in detection quality component 101, This can in raised pads 104 and central protuberance pad 118 applying power, and raised pads 104 and central protuberance pad 118 it is sustainable by Power indicated by four-headed arrow.In this example, can be by after by non-athletic component 106 admittedly folder to detection quality component 101 Abdominal belt 108 is attached（For example, by adhering with epoxy resin）It is appropriate to keep non-athletic component 106 to be in non-athletic component 106 Position.
In the example of fig. 4, detection quality component 101 is clipped on overall diameter admittedly by non-athletic component 106, and this allows with temperature Degree, which changes, occurs higher radial stress, and this can change performance, because detection quality component 101 and non-athletic component 106 Material has different thermal coefficient of expansions.However, in some instances, detecting the central protuberance pad 118 of quality component 101 and adding Speedometer support member 122 can be connected in zero gauge length construction.By this way, zero gauge length construction is by reducing away from adding The difference of the length change at the center of speedometer 100 minimizes higher radial stress.In some instances, zero standard is away from construction It can be expressed as equation 1.
ΔL=LαΔT （1）.
Equation 1 may be defined as the change of length（ΔL）Equal to length（L）It is multiplied by thermal coefficient of expansion（α）With the change of temperature （ΔT）.Due to vitreous silica（For example, the material of detection quality）With invar（For example, the material of non-athletic component）Thermal expansion Coefficient is different, then the change of detection quality and the length of non-athletic component 106 is also by difference.By this way, due to system Length（L）Increase, stress will increase with the increase of temperature.In some instances, the central protuberance pad of quality component 101 is detected 118 and accelerometer support member 122 can reduce the length of system（For example, the length between raised pads）, this will reduce from non-fortune Dynamic component 106 puts on the strain of detection quality component 101.In other words, central protuberance pad 118 and accelerometer support member 122 The center by being positioned at accelerometer 100 can be configured to and produce zero standard away from construction to reduce from non-athletic component 106 are transferred to the thermal strain of detection quality component 101.By this way, in addition to raised pads 104, central protuberance pad 118 is made Being positioned at the center of accelerometer 100 with accelerometer support member 122 minimizes the length in equation 1, therefore makes length Change minimize.However, in the case of no central protuberance pad 118 and/or accelerometer support member 122, being only located at inspection Raised pads 104 on the outer shroud of mass metering component 101 will be attached to non-athletic component 106, and this can make the length of equation most Bigization, therefore also maximize the change for making length.
In some instances, accelerometer 100 can be heated to certain temperature so that non-athletic component 106 and abdominal belt 108 Between epoxy resin cure.In these examples, abdominal belt 108, non-athletic component 106, epoxy resin and accelerometer 100 In other materials between CTE be different.CTE mismatch causes different materials to be expanded and shunk with different rates.At some In example, carrying out the thermal strain of self-heating accelerometer 100 can cause non-athletic component 106 to be radially expanded.In non-athletic component 106 when being radially expanded, and non-athletic component 106 is radially expanded the applying power in raised pads 104.In some instances, raised pads 104 can be by making ring bending section bending as described in Figure 1 isolate and/or reduce power, while maintaining detection quality component Capacitive gaps 110 between 101 and non-athletic component 106.In some instances, central protuberance pad 118 can by make as Center pad bending section described in Fig. 1 bends to isolate and/or reduce power, while maintaining detection quality component 101 and non-fortune Capacitive gaps 110 between dynamic component 106.
In some instances, accelerometer 100 can be cooled down after the temperature of cured epoxy resin is heated to. In these examples, between the other materials in abdominal belt 108, non-athletic component 106, epoxy resin and accelerometer 100 not The different parts that can cause accelerometer 100 with CTE are compressed with different rates.In some instances, by cooling accelerometer 100 Caused strain can compress non-athletic component 106.In these examples, specifically, abdominal belt 108 can be by non-athletic component 106 are pressed in raised pads 104, as shown in the unidirectional arrow by abdominal belt 108.In these examples, abdominal belt 108 will can also add Speedometer support member 122 is pressed on central protuberance pad 118, as shown in the unidirectional arrow by accelerometer support member 122.Non- When moving link 106 is compressed in together, cooling period is compressed in applying power on raised pads 104 and central protuberance pad 118, this It can be indicated by the unidirectional arrow in non-athletic component 106 and accelerometer support member 122.In some instances, raised pads 104 Compression stress can be supported, this can be indicated by four-headed arrow, while maintaining between detection quality component 101 and non-athletic component 106 Capacitive gaps 110.In some instances, central protuberance pad 118 can support compression stress, and this can be indicated by four-headed arrow, The capacitive gaps 110 between detection quality component 101 and non-athletic component 106 are maintained simultaneously.
In some instances, in the case of no central protuberance pad 118 and accelerometer support member 122, raised pads 104 The cantilever on non-athletic component 106 can be act as, so as to allow non-athletic component 106 to be bent inwards towards detection quality. In these examples, in the case of no central protuberance pad 118 and accelerometer support member 122, it is applied to during construction non- Power and/or strain on moving link 106 can cause non-athletic component 106 somewhat to bend when accelerometer 100 is cooled down. In some examples, the bending in non-athletic component 106 can change capacitive gaps 110, so as to cause adding for accelerometer 100 The error of the determination of speed.In some instances, the bending in non-athletic component 106 can need to calibrate after construction and accelerate Degree meter 100.
In some instances, non-athletic component 106 and abdominal belt 108 can be made up of invar, and wherein invar has every degree Celsius 2/1000000ths（2 ppm）CTE.However, it is possible to which constituting the quartz of detection quality component 101 has every degree Celsius of 0.55 ppm CTE.When temperature is raised, the differentia influence accelerometer 100 of the CTE between invar and quartz, so as to cause including magnetic flux Measure the metal parts of return path（For example, non-athletic component 106, condenser armature etc.）Obtained faster than quartz expansion, so as to pass through Raised pads 104 apply strain on the outer shroud of detection quality component 101.In some instances, if detecting quality component 101 not Realign, then when applying strain, raised pads 104 can be slided, so as to cause sluggishness（That is, the mechanical zero of quality is detected And/or the change of electrical null position）.In some instances, raised pads 104 are being attached to the outer shroud of detection quality component 101 While being deflected on pad bending section, raised pads 104 be able to can be bent relative to non-athletic component 106, therefore raised pads 104 can advance together with non-athletic component 106, and detect that the outer shroud of quality component 101 continues to keep.In some instances, The expansion that can allow non-athletic component 106 using raised pads 104 causes less stress in detection quality component 101, and It can prevent because CTE difference causes the change of capacitive gaps 110.
In some instances, relative to accelerometer support member 122, non-athletic component 106 can be made up of invar, and it has There is every degree Celsius 2/1000000ths（2 PPM/C）CTE.Non-athletic component can also be made up of superinvar.In some instances, Detection quality component 101 and pin 120 can be made up of the quartz of the CTE with 0.55 PPM/C.In some instances, magnet 112 It can be made up of the alnico alloy of the CTE with 11 PPM/C.When temperature is raised, material（For example, invar and quartz）Between CTE difference may influence accelerometer 100, so as to cause the metal parts including magnetic flux return path（For example, non-fortune Dynamic component 106, condenser armature, magnet 112 etc.）Obtained faster than quartz expansion, so that by central protuberance pad 118 in detection quality Apply strain in the inner ring of component 101.In some instances, central protuberance pad 118 is being attached to detection quality component 101 While being deformed on the center pad bending section of inner ring, central protuberance pad 118 can be relative to accelerometer support member 122 bend, therefore central protuberance pad 118 can advance together with accelerometer support member 122, and detect quality component 101 Inner ring continues to keep.In some instances, the expansion that can allow accelerometer support member 122 using central protuberance pad 118 exists Cause less stress in detection quality component 101, and can prevent because CTE difference causes capacitive gaps 110 Change.In some instances, can be with using central protuberance pad 118 compared to the situation that raised pads 104 are used only during construction More stable capacitance measurement is provided after construction.In some instances, central protuberance pad 118 and accelerometer support member 122 Extra support and friction is added to prevent the slip associated with only having raised pads 104 on the outer shroud for detecting quality component 101.
In some instances, accelerometer support member 122 can be configured to substantially match the top of raised pads 104 with The CTE of the non-athletic component 106 of side so that the power and/or strain substantially matching for putting on central protuberance pad 118 put on convex Play power and/or the strain of pad 104.In other words, accelerometer support member 122 to central protuberance pad 118 except mechanically providing volume Outside outer support and friction, the CTE and height of substantially one magnetic material of matching can also be configured to.For example, with non- The height of CTE, the CTE of magnet 112 of the substrate of moving link 106 and the CTE of pin 120 accelerometer support member 122 and CTE combination, can substantially match the height and CTE of non-athletic component 106 above and below raised pads 104.At some In example, the height of magnet 112 and pin 120 can be selected, substantially to match the non-athletic above and below raised pads 104 The height and CTE of component 106.Be contemplated in Fig. 4, accelerometer support member 122 may further include adhesive phase or its Its layer of adhesive material, its with associated height and different from accelerometer support member 122 other materials CTE CTE, It can be by comprising substantially to match the height and CTE of the non-athletic component 106 above and below raised pads 104.
In some instances, condenser armature（It is not shown）It is C-shaped and detection matter can be deposited to via vapour deposition Measure the top and bottom of the detection quality of component 101, and electronic installation（It is not shown）With capacitor board（It is not shown）Closure is formed Loop.In some instances, the C-shaped geometry of condenser armature provides electric capacity center, so if condenser armature is tilted, then it is electric Container panel is more insensitive, because electric capacity increases at the first end of C-shaped and reduced at the second end of C-shaped.Show at some In example, the electricity of condenser armature can be provided in the inclination center of detection quality component 101 by detecting the geometry of quality component 101 Appearance center, so if accelerometer is tilted, then condenser armature is more insensitive, because electric capacity increases at the first end of C-shaped And reduce at the second end of C-shaped.In some instances, the displacement of detection quality causes top capacitor plate and bottom capacitor The change of electric capacity between device plate.In some instances, the change of the electric capacity between top capacitor plate and bottom capacitor plate The acceleration for determining accelerometer 100 can be used for by electronic installation.
In addition, the coil form with strong releveling coil 116 can be arranged on the detection quality of detection quality component 101 On either side.In some instances, electronic installation can change the electric current in power releveling coil with servo detection quality to tie up Hold zero-bit.Any acceleration of accelerometer 100 is extremely limited the detection mass motion for making detection quality component 101 by inner ring Plane outside, and maintain to detect the acceleration that increase and the accelerometer 100 of the electric current that quality is in needed for zero-bit are undergone Amount it is proportional.
In some instances, accelerometer may include detection quality component and accelerometer support member.In these examples, Detection quality component can include：Detection quality including condenser armature, and multiple raised pads including central protuberance pad, wherein Detection quality is configured to shift in response to applying to the acceleration of detection quality component.In these examples, accelerometer Support member can include a part for non-athletic component；With recess and it is positioned on the first side of the part of non-athletic component Magnet；Including hole and the pole piece that is positioned on the first side of magnet, the wherein hole of pole piece is alignd with the recess of magnet；And it is fixed Pin of the position in the recess of magnet and the hole of pole piece, central protuberance pad is extended to connect to wherein selling from the recess of magnet, wherein The combined altitudes and combination CTE of the material of accelerometer support member are configured to substantially match the material of non-athletic component CTE, the material of the non-athletic component carries the height for the combined altitudes for being substantially similar to accelerometer support member, and wherein The combined altitudes and combination CTE of the material of accelerometer support member are configured to maintain the capacitor board and non-athletic structure of detection quality Capacitance gap between the Part II of part.For example, the combined altitudes of the material of accelerometer support member 122 and combination CTE quilts Be configured to the CTE of the substantially material of matching non-athletic component 106, the material of the non-athletic component 106 carry substantially like In the height of the combined altitudes of accelerometer support member 122.In the background, substantially matching may refer in metal parts Matched in typical surface curvature, element is accompanied admittedly in the metal parts（For example, element of fused silica）, it is in desired temperature In the range of can be for example in 75 microinch.
In some instances,（In the case of fused silica substrate）Carbon dioxide laser can be used to produce inspection Mass metering component 101 is cut through（cut-through）Feature.In some instances, formed retaining part raised pads 104 and Bending section is formed by the suitable mask of application and execution chemical etching.In some instances, magnetic circuit（For example, non-athletic structure Part 106, magnet 112, the combination of pole piece 114 and power releveling coil 116）Can by construction with recess magnet 112 come Assembling, the recess causes pin 120 with certain depth size（For example, vitreous silica pin）CTE led plus the CTE of magnet 112 Cause the displacement identical with temperature and the non-athletic component expansion in the solid clamp surface in outside of the substrate up to non-athletic component 106 Displacement, wherein magnet 12 is attached at the bases of non-athletic component 106.In some instances, pole piece 114 can have centre hole （For example, hole）And magnet 112 can be bonded to the center of non-athletic component 106, it becomes the base stage of magnetic circuit（base）.At some In example, then pin 120 can be bonded to be formed in the recess in magnet/pole piece stacking, so that accelerometer support member 122 is complete It is whole.In some instances, then accelerometer support member 122 can be made to align via tool processes so that the top of pin 120 can be with Nominally the top surface copline of a part for non-athletic component 106 is simultaneously be bonded with its.In some instances, can be via suitable Material-removing process makes the surface of accelerometer support member 122 and the surface of a part for non-athletic component 106 copline each other. In some instances, can be then by adding and/or being attached any supernumerary structure（To complete pick-up part and actuated components） Detection quality component 101 is formed to detection quality.In some instances, magnetic circuit and detection quality component 101 are then assembled, and And carry out the attachment of electric and structure to form accelerometer 100.In some instances, accelerometer 100 may further include Bonded joint with will detection quality component 101 be more firmly attached to pin 120.
Although Fig. 4 illustrates accelerometer 100 and carries capacitive plates on the both sides of detection quality component 101 to form combination Capacitive pickoff system, but understand accelerometer 100 can with only detection quality component 101 side on condenser armature come rise Effect.Similarly, although Fig. 4 illustrates accelerometer 100 and non-athletic component is carried on the both sides of detection quality component 101 with shape Into the capacitive pickoff system of combination, but understand that accelerometer 100 can use the non-fortune on the phase homonymy of detection quality component 101 Component and condenser armature is moved to work.
Fig. 5 is cross section view of the diagram with caused power and/or another example accelerometer of strain during construction Conceptual figure.In the example of hgure 5, accelerometer 200 includes detection quality component 201, raised pads 204A -204D（Jointly Ground " raised pads 204 "）, non-athletic component 206A and 206B（Jointly " non-athletic component 206 "）, abdominal belt 208, capacitive gaps 210th, magnet 212A and 212B（Jointly " magnet 212 "）, pole piece 214A and 214B（Jointly " pole piece 214 "）, coil 216 with And pin 220A and 220B（Jointly " pin 220 "）, it can correspond respectively to detection quality component 101, raised pads 104, non-athletic Component 106, abdominal belt 108, capacitive gaps 110, magnet 112, pole piece 114, power releveling coil 116 and pin 120, such as Fig. 4 Described in as.In the example of hgure 5, accelerometer 200 can further comprise adhesive phase 224A and 224B（Jointly " adhesive phase 224 "）And second magnet 226A and 226B（Jointly " the second magnet 226 "）.In the example of hgure 5, accelerate Degree meter 200 may include accelerometer support member 222A and 222B（Jointly " accelerometer support member 222 "）, it can be by non-athletic Component 206, magnet 212, pole piece 214, pin 220, the combination of the magnet 226 of adhesive phase 224 and second are formed.For example, accelerating Degree meter support member 222A can be with right and wrong moving link 206A substrate, magnet 212A, pole piece 214A, pin 220A, adhesive phase 224A and the second magnet 226A combination.In another example, accelerometer support member 222B can be with right and wrong moving link 206B substrate, magnet 212B, pole piece 214B, the combination for selling 220B, adhesive layer 224A and the second magnet 226A.
In the example of hgure 5, magnet 212 has hole, rather than the magnet 112 with recess as illustrated in fig. 4. In some examples, the magnet 212 with hole rather than recess can provide the simpler installation of pin 220.In some instances, What magnet 212 can also provide the non-athletic component 206 above and below accelerometer support member 222 and raised pads 204 enters one Step more accurately matching.For example, the CTE of the substrate with non-athletic component 106, CTE, the adhesive phase of the second magnet 226 The height of 224 CTE, the CTE of magnet 212 and the CTE of pin 220 accelerometer support member 222 and CTE combination, can be with The height and CTE of non-athletic component 206 substantially above and below matching raised pads 204.In some instances, it can select Magnet 212, pin 220, the magnet 226 of adhesive phase 224 and second height so as to substantial matching raised pads 204 top and under The height and CTE of the non-athletic component 106 of side.It is contemplated in Figure 5, accelerometer support member 222 can also include adhesive Layer or other layer of adhesive material, wherein these layers are with associated height and different from the other of accelerometer support member 222 The CTE of material CTE, it can be by comprising substantially to match the height of the non-athletic component 206 above and below raised pads 204 And CTE.
In some instances, accelerometer may include detection quality component and accelerometer support member.In these examples, Detection quality component may include：Detection quality including condenser armature, and multiple raised pads including central protuberance pad, wherein examining Mass metering is configured to shift in response to applying to the acceleration of detection quality component.In these examples, accelerometer branch Support member may include a part for non-athletic component；With recess and the magnetic that is positioned on the first side of the part of non-athletic component Body；Including hole and the pole piece that is positioned on the first side of magnet, the wherein hole of pole piece is alignd with the recess of magnet；And be positioned at Pin in the recess of magnet and the hole of pole piece, central protuberance pad is extended to connect to wherein selling from the recess of magnet, wherein accelerating The combined altitudes and combination CTE of the material of degree meter support member are configured to the CTE of the substantially material of matching non-athletic component, its The material of middle non-athletic component carries the height for the combined altitudes for being substantially similar to accelerometer support member, and wherein accelerates The combined altitudes and combination CTE of the material of degree meter support member are configured to maintain the capacitor board and non-athletic component of detection quality Capacitance gap between Part II.
In some instances, in the case where the recess of magnet can be hole, accelerometer support member can be wrapped further The second magnet and adhesive phase are included, the second magnet is attached to the second side of magnet and is attached the second magnet by wherein adhesive phase To the first side of the part of non-athletic component.In these examples, the combined altitudes of the material of accelerometer support member and combination CTE includes the height and CTE of the part, adhesive phase, the second magnet and the pin of non-athletic component.
Although Fig. 5 illustrates accelerometer 200 and carries capacitive plates on the both sides of detection quality component 201 to form group The capacitive pickoff system of conjunction, but understand accelerometer 200 can with only detection quality component 201 side on condenser armature come Work.Similarly, although Fig. 5 illustrates accelerometer 200 and non-athletic component is carried on the both sides of detection quality component 201 To form the capacitive pickoff system of combination, but understand that accelerometer 200 can be with the phase homonymy of detection quality component 201 Non-athletic component and condenser armature work.
Fig. 6 is non-athletic component 206 and the example of accelerometer support member 222 of the diagram according to techniques described herein The block diagram of bottom view.Fig. 6 is described relative to Fig. 5.In the example of fig. 6, accelerometer support member 222 is located at non-athletic component At 206 geometric center, so as to provide zero gauge length construction.In the example of fig. 6, accelerometer support member 222 includes pin 220th, the substrate of pole piece 214, the first magnet, adhesive phase, the second magnet and non-athletic component 106.In some instances, One magnet, adhesive phase and the second magnet can correspond respectively to magnet 212A or 212B, adhesive phase 224A or 224B, with And second magnet 226A or 226B.In the example of fig. 6, pin 220 may be connected to the central protuberance pad of detection quality component 201 218.In the example of fig. 6, the combined altitudes and CTE of accelerometer support member 222 are configured to substantially match non-athletic structure The height and CTE of the overall diameter of part 206.
In some instances, the height of the magnet below quartz pins can be determined in the following manner：Determine magnet, invar with And the CTE of vitreous silica；Determine the distance on the size of magnet, pole piece and bonded joint and the top from pole piece to stacked surface； Determine the expansion of invar in certain height；The expansion of the stacking of the magnetic material and quartz of identical certain height is determined, wherein becoming Amount is magnet height, and quartz height is given as the difference of the height between invar size and magnet size.
The ginseng of matching so as to obtain the coefficient of expansion interested temperature within the scope of is calculated to determine size for performing Several examples include, for example, the CTE of accelerometer support member 122, the CTE of magnet 112 and capacitive gaps 110 CTE. Parameter can also include the height, the height of central protuberance pad 118, gluing from non-athletic component 106 to magnet 112 of magnet 112 The length of wiring, distance and the interior substrate from non-athletic component 106 from pole piece 114 to the top of non-athletic component 106 To the height at the top of non-athletic component 106.Parameter can also include from the interior substrate of non-athletic component 106 to non-athletic structure The expansion of the stacking of the magnet 112 and pin 120 at the top of part 106.Calculate it is also contemplated that the highest CTE of non-athletic component 106 With minimum CTE, so as to consider non-athletic component 106 minimum prediction expansion mismatch and non-athletic component 106 maximum predicted it is swollen Both swollen mismatches.Calculate it is also contemplated that the temperature range that device will be operated in it.
It should be understood that different applications can allow or need the different size of device, different materials, different operating temperature Degree and other such changes.It is understood, therefore, that size, material, temperature described in the disclosure and other Parameter is only the example of some embodiments, and the disclosure technology have beyond specific example explicitly described herein can Application.
Fig. 7 is the match height that diagram is used to calculate the magnet of the accelerometer support member according to techniques described herein Exemplary operations 350 flow chart.In the example in figure 7, processing unit can determine that associated with a part for non-athletic component CTE and height（352）.In the example in figure 7, processing unit can determine that non-athletic component and pin between magnet CTE and Multiple height（354）.In some instances, processing unit can determine that the first magnet and the second magnetic between non-athletic component and pin The CTE of body and multiple height.In these examples, processing unit can also determine the bonding between the first magnet and the second magnet The CTE and height of oxidant layer.In the example in figure 7, processing unit can determine that the pin of the CTE of pin and multiple height corresponding to magnet Multiple height（356）.In the example in figure 7, processing unit can be based on non-athletic component, magnet and pin combined altitudes with The CTE for the substantial matching being substantially similar between the height of the material of the non-athletic component of the combined altitudes is from the more of magnet Individual high computational match height（358）.
In some instances, processing unit may further determine that the CTE and height of one or more adhesives.At this In a little examples, a part for non-athletic component can be attached to magnet by one or more adhesives, and magnet is attached to Pin.In some instances, processing unit can the combination based on non-athletic component, magnet, pin and one or more adhesives The substantial CTE matched between height and the height of the material of the non-athletic component that is substantially similar to the combined altitudes is from magnetic Multiple high computational match heights of body.
Outer shroud 2,42 and can be included according to the detection quality component 1,41,71,101 and 201 of the technical construction of the disclosure 72, it has multiple raised pads 4,44,74,104 and 204 in detection quality component 1,41,71,101 and 201, to isolate Inner ring 8,48 and 88.In some instances, inner ring 8,48 and 88 can be configured to will detection quality 12,52 and 82 and outer shroud 2, 42 and 72 and non-athletic component 106 and 206 isolate.In some instances, outer shroud 2,42 and 72 can be configured to than inner ring 8, 48 and 88 is more soft, and this can allow outer shroud 2,42 and 72 to isolate inner ring 8,48 and 88, so as to be reduced to detection quality 12,52 With the strain transfer of 82 detection quality bending section 14,54 and 84.
In some instances, the raised pads 4,44,74,104 and 204 of outer shroud 2,42 and 72 can be configured with padding bending section 75.In these examples, the size and arrangement of pad bending section 75 can maintain two KHzs（kHz）Resonance mode above, and And be adjustable in terms of quantity, size and arrangement.In some instances, pad bending section 75 can be cut by laser non-to compensate Thermal expansion mismatch between the material and outer shroud 2,42 and 72 material of moving link 106 and 206.In some instances, outer shroud 2nd, 42 and 72 raised pads 4,44,74,104 and 204 can be configured to symmetrically, to reduce the bending with temperature.In construction Period uses the and of detection quality component 1,41,71,101 of multiple raised pads 4,44,74,104 and 204 on outer shroud 2,42 and 72 201 due to the reduction of thermal model error, and more accurate acceleration analysis can be provided after construction.
In some instances, inner ring 8,48 and 78 can be configured to by one or more ring bending sections 6,46 and 76 from outer Ring 2,42 and 72 is hung.In these examples, the size and arrangement of one or more ring bending sections 6,46 and 76 can maintain two KHz（2 kHz）Resonance mode above, and be adjustable in terms of quantity, size and arrangement.In some instances, One or more ring bending sections 6,46 and 76 can be cut by laser with by the strain of the material from outer shroud 2,42 and 72 and inner ring 8th, 48 and 78 and detection quality 12,52 and 82 isolate.Using one or more ring bending sections 6,46 and 76 with from outer shroud 2,42 and 72 suspension inner ring 8,48 and 78 detection quality component 1,41,71,101 and 201, due to reduce be transferred to detection quality 12, The thermal strain of 52 and 82 bending section 14,54 and 84 and more accurately acceleration analysis can be provided after construction.
In some instances, the size of detection quality 12,52 and 82 can be constructed such that detection quality 12,52 and 82 Mass centre alignd with the geometric center of accelerometer support member 122 and 222.In these examples, detection quality 12,52 and Aliging between 82 mass centre and accelerometer support member 122 and 222 geometric center can allow accelerometer 100 and 200 magnetic circuit is symmetrical, and it is substantially planar that this also enables accelerometer support member 122 and 222 to be constructed as.
In some instances, the central protuberance pad 18,58,88,118 and 218 for being flexibly connected to inner ring 8,48 and 78 can To be configured to provide zero gauge length construction when being connected to accelerometer support member 122 or 222.In other words, central protuberance Pad 18,58,88,118 and 218 and accelerometer support member 122 or 222 may be constructed such that to be constructed in zero gauge length, is made Obtain central protuberance pad 18,58,88,118 and 218 and accelerometer support member 122 or 222 is located at accelerometer 100 or 200 Center, and the total power for detecting quality component 1,41,71,101 and 201 and/or thermal strain are transferred to by reduction.
In some instances, accelerometer 100 and 200 can also have the suspender of dimension compensation.For example, dimension compensation Suspender can be accelerometer support member（For example, accelerometer support member 122 or 222）Combination of different materials height Or CTE is combined, the combined altitudes or combination CTE substantially match the height and CTE of the material of non-athletic component.For example, accelerating The accelerometer support member 122 or 222 of the centre of degree meter 100 and 200 includes the pin 120 for being installed on the center of magnet 112 or 212 Or 220.In some instances, when the temperature is changed, due to the suspender of dimension compensation, quality component 1,41,71,101 is detected With 201 plane and indeformable.Because the material of accelerometer support member 122 and 222 does not have identical thermal coefficient of expansion, because This must determine size cause by accelerometer support member 122 and 222 produce expansion be equal to detection quality component 1,41,71, The expansion of non-athletic component 106 and 206 on 101 and 201 overall diameter.If accelerometer support member 122 or 222 and detection The both of which of non-athletic component 106 or 206 on the overall diameter of quality component 1,41,71,101 and 201 is simultaneously with temperature expansion, then The stress in accelerometer 100 and 200 is minimized, and accelerometer 100 and 200 provides more accurately acceleration analysis.
According to the outer shroud 2,42 and 72 of the technical construction of the disclosure, inner ring 8,48,78 and detection quality component 1,41,71, 101 and 201 detection quality 12,52 and 82 can be formed by single material, and this can reduce heating and cooling technique during construction Influence because single-piece（For example, single material）Structure has a CTE.That is, when the equivalence compared to conventional accelerometer During part, outer shroud 2,42 and 72, inner ring 8,48,78 and detection quality 12,52 and 82 can be subjected to less deviation unstability, and And can more stablize.In addition, the technology of the disclosure can allow the cost with smaller profile and reduction（Because for anti- Significantly reduced the need for power and/or strain only from construction and other materials）More accurately accelerometer.
, can be with the function described by hardware, software, firmware or its any combination realization in one or more examples Some.If implemented in software, function can be stored or be transmitted in computer as one or more instructions or code On computer-readable recording medium, and performed by hardware based processing unit.Computer-readable medium can include computer-readable storage Medium, it corresponds to tangible medium（Such as data storage medium）；Or communication media, including promote computer program from one Position transfer is to another location（For example, according to communication protocol）Any medium.By this way, computer-readable medium is overall On can correspond to：（1）Non-transient tangible computer readable storage medium, or（2）The communication media of such as signal or carrier wave. Data storage medium can be accessed by one or more computers or one or more processors to fetch instruction, generation Code and/or data structure are to realize any usable medium of the technology described in the disclosure.Computer program product can be with Including computer-readable medium.
In an illustrative manner, it is and nonrestrictive, such computer-readable recording medium can include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, flash memory, or can be used in referring to The form of order or data structure stores desired program code and any other medium that can be accessed by computer.Moreover, Any connection is properly called computer-readable medium.If for example, using coaxial cable, fiber optic cables, twisted-pair feeder, number Word subscribers' line（DSL）, or wireless technology（Such as infrared ray, radio and microwave）From website, server or other long-range Source transmission is instructed, then coaxial cable, fiber optic cables, twisted-pair feeder, DSL or wireless technology（Such as infrared ray, radio and micro- Ripple）Just it is included in the definition of medium.However, it should be understood that computer-readable recording medium and data storage medium are not Including connector, carrier wave, signal or other transitory state mediums, and differently it is related to non-transient, tangible media.As made herein As, disk（disk）And CD（disc）Including compact disk（CD）, laser disk, optical disc, digital multi-purpose disk （DVD）, floppy disk and Blu-ray Disc, wherein disk generally magnetically reproduce data, while CD laser optics reproduce number According to.Combinations of the above should also be as being included within the scope of computer readable media.
Instruction can be by one or more processors（For example, " processing unit "）Perform, such as one or more data signals Processor（DSP）, general purpose microprocessor, application specific integrated circuit（ASIC）, field programmable logic array（FPGA）Or other etc. The integrated or discrete logic circuit of valency.Therefore, it is as used herein such, term " processor " and/or " processing dress Put " arbitrary structures in aforementioned structure are may refer to, or it is suitable for any other knot of the realization of techniques described herein Structure.In addition, in some respects, can be provided in the specialized hardware and/or software module for being configured for encoding or decoding Functionality described herein, or be contained in combined code.Moreover, can be in one or more circuits or logic element Fully realize the technology.
The technology of the disclosure can be in diversified device or equipment, integrated circuit（IC）Or one group of IC（For example, chip Group）It is middle to realize.Various parts, module or unit are described in the disclosure with the device of the technology disclosed in emphasizing to be configured to perform Function aspects, but not necessarily need to be realized by different hardware cells.Moreover, as described above, can be by mutually The hardware cell of effect（Including one or more processors as described above）Set, with reference to suitable software and/or Firmware provides various units.
The various examples of the disclosure have been described.These examples and other examples are in the scope of following claims It is interior.

Claims (3)

1. a kind of accelerometer, including：
Quality component is detected, it includes：
Detect quality；With
Multiple raised pads including central protuberance pad,
Wherein, the detection quality is configured to shift in response to applying to the acceleration of the detection quality component；With
Accelerometer support member, it includes：
Non-athletic component；
Magnet including recess, wherein, the magnet is positioned on the first side of a part for the non-athletic component；
Pole piece including hole, wherein, the pole piece is positioned on the first side of the magnet, wherein, the hole of the pole piece Alignd with the recess of the magnet；And
The pin in the hole of the recess of the magnet and the pole piece is positioned at, wherein, the pin is from the magnet The recess is extended to connect to the central protuberance pad；
Wherein, the height of the combination of the material of the accelerometer support member and the thermal coefficient of expansion of combination（CTE）It is configured to Substantially matched with the CTE of the material of the non-athletic component, and the material of the non-athletic component is carried substantially Similar to the height of the height of the combination of the accelerometer support member, and wherein, the accelerometer support member The height of the combination of the material and the CTE of the combination are configured to maintain the capacitor board for detecting quality and described Capacitance gap between the Part II of non-athletic component.
2. accelerometer as claimed in claim 1, wherein, the recess of the magnet is hole, the accelerometer support Part also includes：
Second magnet；With
Adhesive phase, wherein, second magnet is attached to the second side of the magnet and by described the by described adhesive layer Two magnets are attached to a part of first side of the non-athletic component.
3. accelerometer as claimed in claim 2, wherein, the combination of the material of the accelerometer support member Height and the combination CTE include the non-athletic component it is described a part, described adhesive layer, second magnet with And the height and CTE of the pin.
CN201610918721.XA 2016-10-21 2016-10-21 Accelerometer Pending CN107037236A (en)

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Application publication date: 20170811