CN107036323B - Switching device for heating/cooling mode - Google Patents
Switching device for heating/cooling mode Download PDFInfo
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- CN107036323B CN107036323B CN201710379435.5A CN201710379435A CN107036323B CN 107036323 B CN107036323 B CN 107036323B CN 201710379435 A CN201710379435 A CN 201710379435A CN 107036323 B CN107036323 B CN 107036323B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Temperature (AREA)
- Control Of Resistance Heating (AREA)
Abstract
The present invention provides a switching device of heating/cooling mode, which comprises: the voltage distribution assembly comprises N parallel voltage distribution sub-assemblies and is used for distributing the control voltage into distribution voltages matched with each voltage distribution sub-assembly after receiving the control voltage output by the control voltage generation assembly; the control voltage comprises a control voltage in a heating mode and a control voltage in a refrigerating mode; the distribution voltage includes a distribution voltage in a heating mode and a distribution voltage in a cooling mode; the thermoelectric sheet assembly comprises N layers of thermoelectric sheets, is correspondingly connected with the N voltage distribution subassemblies and is used for transmitting generated heat into a target object layer by layer under the drive of distribution voltage in a heating mode; or the heat in the environment where the target is located is conducted away layer by layer under the drive of the distribution voltage in the refrigeration mode. The invention realizes higher heating and refrigerating efficiency, and simultaneously enables the heating and refrigerating processes to be continuously and seamlessly switched.
Description
Technical Field
The invention belongs to the technical field of thermoelectric assemblies, relates to a switching device, and particularly relates to a heating/cooling mode switching device.
Background
By utilizing the thermoelectric effect, the current can be converted into the temperature difference, so that the heating and the refrigeration can be realized. In engineering applications, a semiconductor thermoelectric sheet is generally used to realize a device capable of heating and refrigerating, and a forward current is applied to the thermoelectric sheet to realize heating and a reverse current is applied to realize refrigerating. If a single thermoelectric sheet cannot generate enough temperature difference, the thermoelectric sheets need to be used in series. After being connected in series, even if the temperature difference generated by each thermoelectric sheet is smaller, the total temperature difference generated by all thermoelectric sheets can be larger.
In the prior art, a heating and refrigerating device generally distinguishes a heating mode and a refrigerating mode, and a thermoelectric sheet voltage distribution mode under the two modes is switched by a switch or a relay. However, this manner of thermoelectric sheet voltage distribution does not allow for continuous, seamless switching of heating and cooling, and is difficult to accommodate to varying ambient temperatures.
Therefore, how to provide a switching device for heating/cooling modes, so as to solve the technical problems that the prior art adopts a switch or a relay to switch the thermoelectric sheet voltage distribution mode under two modes, but the thermoelectric sheet voltage distribution mode cannot realize continuous and seamless switching of heating and cooling, is difficult to adapt to changing environmental temperature and the like, and is a technical problem to be solved urgently by practitioners in the art.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a switching device for heating/cooling modes, which is used to solve the problems that in the prior art, a thermoelectric sheet voltage distribution mode is switched by a switch or a relay, but the thermoelectric sheet voltage distribution mode cannot realize continuous and seamless switching of heating and cooling, and is difficult to adapt to a changing environmental temperature.
To achieve the above and other related objects, according to one aspect of the present invention, there is provided a heating/cooling mode switching device for heating or cooling a target object attached to the heating/cooling mode switching device; the heating/cooling mode switching device includes: the voltage distribution assembly comprises N parallel voltage distribution sub-assemblies and is used for distributing the control voltage output by the control voltage generation assembly into distribution voltages matched with each voltage distribution sub-assembly after receiving the control voltage; wherein the control voltage comprises a control voltage in a heating mode and a control voltage in a refrigerating mode; the distribution voltage comprises a distribution voltage in a heating mode and a distribution voltage in a refrigerating mode; the thermoelectric sheet assembly comprises N layers of thermoelectric sheets which are respectively connected with the N voltage distribution subassemblies in a one-to-one correspondence manner and are used for transmitting generated heat into the target object layer by layer under the drive of distribution voltage in the heating mode; or under the drive of the distribution voltage in the refrigeration mode, conducting heat in the environment where the target object is located layer by layer; wherein N is a positive integer greater than or equal to 2.
In an embodiment of the present invention, the N-layer thermoelectric sheets include a first layer thermoelectric sheet, a second layer thermoelectric sheet, …, and an nth layer thermoelectric sheet that are stacked in sequence and adhered to each other; wherein, the first layer thermoelectric sheet is attached to the target.
In an embodiment of the invention, the switching device of the heating/cooling mode further includes a radiator attached to the nth layer of thermoelectric sheets for exchanging heat transferred from the nth layer of thermoelectric sheets to the external environment layer by layer or conducted layer by layer.
In an embodiment of the invention, the switching device of heating/cooling modes further includes N power amplifiers connected to the N voltage distribution subassemblies in a one-to-one correspondence manner, for amplifying the distribution voltage in the heating mode or the distribution voltage in the cooling mode; the N power amplifiers comprise a first power amplifier, a second power amplifier, … and an Nth power amplifier.
In one embodiment of the present invention, each power amplifier includes one output terminal and two output terminals; the two output ends of the power amplifier are connected with the two ends of the corresponding thermoelectric chip, and the input end of the power amplifier is connected with the corresponding voltage distribution subassembly.
In one embodiment of the present invention, the N voltage distribution subassemblies include: a first voltage distribution sub-assembly corresponding to the first layer of thermoelectric chips and connected to the first power amplifier; the first voltage distribution subassembly comprises a first input unit and a first negative unit; when the first input unit receives control voltage in a refrigerating mode, the first negative unit distributes the control voltage in the refrigerating mode into distribution voltage matched with the first negative unit, and the distribution voltage matched with the first negative unit is amplified by the first power amplifier in the refrigerating mode so as to minimize the heat transfer power of the first-layer thermoelectric chip; when the first input unit receives a control voltage in a heating mode, the first negative unit cuts off a current generated by the control voltage in the heating mode, and amplifies the control voltage in the heating mode through the first power amplifier so as to maximize heat transfer power of the first layer thermoelectric sheet; an nth voltage distribution subassembly juxtaposed with the first voltage distribution subassembly, corresponding to the nth layer of thermoelectric chips, and connected to the nth power amplifier; the nth voltage distribution subassembly comprises an nth input unit and an nth forward unit; when the N-th input unit receives the control voltage in the refrigerating mode, the N-th forward unit cuts off the current generated by the control voltage in the refrigerating mode, and amplifies the control voltage in the refrigerating mode through the N-th power amplifier so as to maximize the heat transfer power of the N-th thermoelectric chip; when the N-th input unit receives the control voltage in the heating mode, the N-th forward unit distributes the control voltage in the heating mode to be matched with the N-th forward unit, the distribution voltage in the heating mode is amplified by the N-th power amplifier, and therefore the heat transfer power of the N-th thermoelectric chip is minimized.
In an embodiment of the present invention, when N is greater than or equal to 3, the N voltage distribution subassemblies further include: a second/third/…/nth-1 voltage distribution sub-assembly respectively juxtaposed with the first and nth voltage distribution sub-assemblies, corresponding to the second/third/…/nth-1 layer thermoelectric chips respectively, and connected to the second/third/…/nth-1 power amplifier; the second/third/…/nth-1 voltage distribution subassembly includes a second/third/…/nth-1 input unit, a second/third/..cndot./nth-1 positive unit, and a second/third/…/nth-1 negative unit in parallel with the second/third/…/nth-1 positive unit; when the second/third/…/N-1 input unit receives the control voltage in the heating mode, the second/third/…/N-1 negative unit cuts off the current generated by the control voltage in the heating mode, the second/third/…/N-1 positive unit distributes the control voltage in the heating mode to be matched with the second/third/…/N-1 thermoelectric chip, and the distribution voltage in the heating mode is amplified by the second/third/…/N-1 power amplifier so as to gradually reduce the heat transfer power of the second/third/…/N-1 thermoelectric chip; when the second/third/. Cndot/N-1 input unit receives the control voltage in the cooling mode, the second/third/…/N-1 positive unit cuts off the current generated by the control voltage in the cooling mode, the second/third/…/N-1 negative unit distributes the control voltage in the cooling mode to match the second/third/…/N-1 thermoelectric chip, and the distribution voltage in the cooling mode is amplified by the second/third/…/N-1 power amplifier to gradually increase the heat transfer power of the second/third/…/N-1 thermoelectric chip.
In an embodiment of the present invention, the second forward unit, …, the N-1 forward unit, the N forward unit is a nonlinear electronic element, and the impedance values of the second forward unit, …, the N-1 forward unit, and the N forward unit decrease sequentially; the first negative unit, the second negative unit, … and the N-1 negative unit are nonlinear electronic elements, and the impedance values of the first negative unit, the second negative unit, … and the N-1 negative unit are sequentially increased.
In an embodiment of the present invention, the second forward unit, …, the N-1 forward unit, the N forward unit respectively include a resistor, and a diode connected to the resistor and conducting in a forward direction; the resistance values of the resistors in the second forward unit, …, the N-1 forward unit and the N forward unit decrease in sequence; the first negative unit, the second negative unit and …, and the N-1 negative unit comprises a resistor and a negative-conducting diode connected with the resistor; and the resistance value of the resistor in the first negative unit, the second negative unit and the … N-1 negative unit is sequentially increased.
In an embodiment of the present invention, when the switching device of the heating/cooling mode needs to heat the target object, the control voltage in the heating mode output by the control voltage generating component is a forward control voltage; when the heating/cooling mode switching device is required to cool the target object, the control voltage in the cooling mode output by the control voltage generating component is negative control voltage.
As described above, the heating/cooling mode switching device of the present invention has the following advantageous effects:
the heating/cooling mode switching device can realize higher heating and cooling efficiency, and simultaneously can continuously and seamlessly switch the heating and cooling processes.
Drawings
Fig. 1 is a schematic structural diagram of a switching device of heating/cooling modes applied to a target object according to the present invention.
Fig. 2 is a schematic structural diagram of a switching device for heating/cooling modes according to an embodiment of the present invention.
Description of element reference numerals
1. Switching device for heating/cooling mode
11. Control voltage generating assembly
12. Voltage distribution assembly
13. Power amplifier
14. Thermoelectric sheet assembly
15. Radiator
121. First voltage distribution subassembly
122. Second voltage distribution sub-assembly
123. Third voltage distribution sub-assembly
124. Fourth voltage distribution sub-assembly
……
12N voltage distribution subassembly
131. First power amplifier
132. Second power amplifier
133. Third power amplifier
134. Fourth power amplifier
……
13N power amplifier
141. First layer thermoelectric sheet assembly
142. Second layer thermoelectric sheet assembly
143. Third layer thermoelectric sheet assembly
144. Fourth layer thermoelectric sheet assembly
……
14N (N) th layer thermoelectric sheet assembly
121A first input unit
122A second input unit
……
12NA N input unit
122B second forward unit
……
12NB N forward unit
121C first negative going unit
12 (N-1) C N-1 negative going unit
2. Target object
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
The switching device of the heating/cooling mode utilizes a plurality of thermoelectric sheets which are sequentially stacked and attached together from an object positioned at the inner layer to the outer layer. When the target is required to be refrigerated, the voltage applied to the thermoelectric sheets is sequentially increased from inside to outside so as to ensure that the thermoelectric sheets at the outer layer are enough to transfer out the total heat generated and transferred by the inner layer; when the target is required to be heated, the voltage applied to the thermoelectric sheets is gradually decreased from inside to outside so as to avoid the temperature increase of the thermoelectric sheets at the outer layer, thereby improving the heating efficiency.
The embodiment provides a heating/cooling mode switching device, which is characterized in that the switching device is used for heating or cooling a target object attached to the control device; the heating/cooling mode switching device includes:
the voltage distribution assembly comprises N parallel voltage distribution sub-assemblies and is used for distributing the control voltage output by the control voltage generation assembly into distribution voltages matched with each voltage distribution sub-assembly after receiving the control voltage; wherein the control voltage comprises a control voltage in a heating mode and a control voltage in a refrigerating mode; the distribution voltage comprises a distribution voltage in a heating mode and a distribution voltage in a refrigerating mode;
the thermoelectric sheet assembly comprises N layers of thermoelectric sheets, and is correspondingly connected with the N voltage distribution subassemblies one by one and used for transmitting generated heat into the target object layer by layer under the drive of distribution voltage in the heating mode; or under the drive of the distribution voltage in the refrigeration mode, conducting heat in the environment where the target object is located layer by layer; wherein N is a positive integer greater than or equal to 3.
The heating/cooling mode switching device provided in this embodiment will be described in detail with reference to the drawings. Referring to fig. 1, a schematic structural diagram of a switching device of heating/cooling modes applied to a target is shown. The heating/cooling mode switching device 1 according to the present embodiment is used for heating or cooling a target object 2 attached to the heating/cooling mode switching device. As shown in fig. 1, the heating/cooling mode switching device 1 includes a power supply assembly 11, a voltage distribution assembly 12, a power amplifier 13, a thermoelectric sheet assembly 14, and a heat sink 15. The voltage distribution assembly 12 includes N parallel voltage distribution subassemblies 121-12N, namely a first voltage distribution subassembly 121, a second voltage distribution subassembly 122, …, and an nth voltage distribution subassembly 12N; the power amplifier 13 is a first power amplifier 131, a second power amplifier 132, …, and an nth power amplifier 13N, which are respectively connected to the N voltage distribution subassemblies 121 to 12N in a one-to-one correspondence manner, so as to amplify the distribution voltage in the heating mode or the distribution voltage in the cooling mode. Each power amplifier comprises an input end and two output ends; the two output ends of the power amplifier are connected with the two ends of the corresponding thermoelectric chip, and the input end of the power amplifier is connected with the corresponding voltage distribution subassembly. In this embodiment, the power amplifier is constituted by a class D amplifier. The thermoelectric sheet assembly 14 includes a first layer of thermoelectric sheet assemblies 141 proximate to the target, a second layer of thermoelectric sheet assemblies 142, … stacked and bonded to the first layer of thermoelectric sheet assemblies 141, and an nth layer of thermoelectric sheet assemblies 14N stacked and bonded to the nth-1 layer of thermoelectric sheet assemblies 14 (N-1). The heat sink 15 is attached to the nth layer thermoelectric sheet assembly 14N. In this embodiment, the heat sink 15 includes a soaking plate, a heat sink and a fan, so as to exchange heat transferred into the N thermoelectric sheets layer by layer or conducted from layer to layer with the external environment.
The control voltage generating component 11 is configured to output a control voltage. The control voltage is an input signal of the switching device 1 in the heating/cooling mode, the positive and negative polarities of the control voltage determine the heating or cooling of the component, and the magnitude of the control voltage determines the heating and cooling intensity of the whole switching device 1 in the heating/cooling mode. In this embodiment, the control voltage includes a control voltage in a heating mode and a control voltage in a cooling mode; when the heating/cooling mode switching device 1 needs to heat the target object, the control voltage generating component 11 outputs a forward control voltage. When the heating/cooling mode switching device 1 needs to cool the target object, the control voltage generating component outputs a negative control voltage.
And the N parallel voltage distribution sub-assemblies 121-12N are connected with the control voltage generating assembly 11 and are used for distributing the control voltage into distribution voltages matched with each voltage distribution sub-assembly after receiving the control voltage output by the control voltage generating assembly 11. The voltage distribution component carries out nonlinear distribution processing on the control voltage output by the control voltage generation component 11, so that the refrigeration voltage value of the outer thermoelectric sheet is higher and the heating voltage value is lower; the refrigerating voltage value of the inner thermoelectric sheet is lower, and the heating voltage value is higher; the refrigeration voltage and the heating voltage of the middle thermoelectric plate are centered. The response of the nonlinear distribution circuit is continuous for negative to positive control voltages in order to achieve continuous, seamless switching of the heating and cooling processes.
The first voltage distribution sub-assembly 121 corresponds to the first layer thermoelectric sheet 141 and is connected to the first power amplifier 131. Specifically, the first voltage distribution sub-assembly 121 is connected to an input terminal of the first power amplifier 131. In the present embodiment, the first voltage distribution sub-assembly 121 includes a first input unit 121A and a first negative unit 121C. When the first input unit 121A receives the control voltage in the cooling mode, the first negative unit 121C distributes the control voltage in the cooling mode to be matched with the first negative unit, and amplifies the distribution voltage in the cooling mode matched with the first negative unit through the first power amplifier 131 to drive the first thermoelectric sheet 141 so as to minimize the heat transfer power of the first thermoelectric sheet 141; when the first input unit 121A receives the control voltage in the heating mode, the first negative unit 121C cuts off the current generated by the control voltage in the heating mode and divides the control voltage in the heating mode, and amplifies the control voltage in the heating mode by the first power amplifier 131 to drive the first thermoelectric sheet 141 so as to maximize the heat transfer power of the first thermoelectric sheet 141.
The second voltage distribution subassembly 122/third voltage distribution subassembly 123/·/N-1 voltage distribution subassembly 12 (N-1) respectively juxtaposed to the first voltage distribution subassembly 141 and the N-th voltage distribution subassembly 14N corresponds to the second thermoelectric sheet 142/third thermoelectric sheet 143/…/N-1 layer thermoelectric sheet 14 (N-1) respectively and is connected to the second power amplifier 132/third power amplifier 133/…/N-1 power amplifier 13 (N-1). Specifically, the second voltage distribution subassembly 122 corresponds to the second layer thermoelectric sheet 142 and is connected to the second power amplifier 132, and specifically, the second voltage distribution subassembly 122 is connected to an input terminal of the second power amplifier 132. The third voltage distribution sub-assembly 123 corresponds to the third thermoelectric chip 143 and is connected to the third power amplifier 133, and in particular, the third voltage distribution sub-assembly 123 is connected to an input terminal of the third power amplifier 133. …. The nth-1 voltage distribution sub-assembly 12 (N-1) corresponds to the nth-1 layer thermoelectric chip 14 (N-1) and is connected to the nth-1 power amplifier 13 (N-1), and specifically, the nth-1 voltage distribution sub-assembly 12 (N-1) is connected to an input terminal of the nth-1 power amplifier 13 (N-1).
In the present embodiment, the second voltage distribution sub-assembly 122/third voltage distribution sub-assembly 123/…/nth-1 voltage distribution sub-assembly 12 (N-1) includes a second input unit 122A/third input unit 123A/…/nth-1 input unit 12 (N-1) a, a second positive unit 122B/third positive unit 123B/…/nth-1 positive unit 12 (N-1) B, and a second negative unit 122C/third negative unit 123C/…/nth-1 positive unit 12 (N-1) C connected in parallel with the second positive unit 122B/third positive unit 123B/…/nth-1 positive unit 12 (N-1) B; when the second/third/…/N-1 input unit receives the control voltage in the heating mode, the second/third/…/N-1 negative unit cuts off the current generated by the control voltage in the heating mode and divides the control voltage in the heating mode, the second/third/…/N-1 positive unit distributes the control voltage in the heating mode to be matched with the second/third/…/N-1 layer thermoelectric sheet, and the distribution voltage in the heating mode is amplified by the second/third/…/N-1 power amplifier so as to gradually decrease the heat transfer power of the second/third/…/N-1 layer thermoelectric sheet; when the second/third/…/N-1 input unit receives the control voltage in the cooling mode, the second/third/…/N-1 positive unit cuts off the current generated by the control voltage in the cooling mode, and the second/third/…/N-1 negative unit distributes the control voltage in the cooling mode to be matched with the second/third/…/N-1 thermoelectric sheet, and the distribution voltage in the cooling mode is amplified by the second/third/…/N-1 power amplifier to gradually increase the heat transfer power of the second/third/…/N-1 thermoelectric sheet.
An nth voltage distribution sub-assembly 12N juxtaposed with the first voltage distribution sub-assembly 121/second voltage distribution sub-assembly 122/third voltage distribution sub-assembly 123/…/nth-1 voltage distribution sub-assembly 12 (N-1) corresponds to the nth layer thermoelectric chip 14N and is connected to the nth power amplifier 13N. Specifically, the nth voltage distribution subassembly 12N is connected to the output terminal of the nth power amplifier 13N. The nth voltage dividing subassembly 12N includes an nth input unit 121N and an nth forward unit 12NB; when the nth input unit 121N receives the control voltage in the cooling mode, the nth forward unit 12NB cuts off the current generated by the control voltage in the cooling mode and divides the control voltage in the cooling mode, and the nth power amplifier amplifies the control voltage in the cooling mode to maximize the heat transfer power of the nth thermoelectric sheet 14N; when the nth input unit 121N receives the control voltage in the heating mode, the nth forward unit 12NB distributes the control voltage in the heating mode to be matched with the nth forward unit 12NB, the distribution voltage in the heating mode is amplified by the nth power amplifier to minimize the heat transfer power of the nth thermoelectric sheet 14N.
In this embodiment, the second forward units 122B, …, the N-1 forward unit 12 (N-1) B, the N-th forward unit 12N B are nonlinear electronic elements, and the impedance values of the second forward units 122B, …, the N-1 forward unit 12 (N-1) B, and the N-th forward unit 12N B decrease in sequence; the first negative unit 121C, the second negative units 122C, …, the N-1 negative unit 12 (N-1) C are nonlinear electronic elements, and the impedance values of the first negative unit 121C, the second negative units 122C, …, the N-1 negative unit 12 (N-1) C are sequentially increased.
In this embodiment, N is optimally 3 or 4. Referring to fig. 2, a schematic structural diagram of an embodiment of a switching device for heating/cooling modes is shown. As shown in fig. 2, the first input unit 121A of the first voltage distribution subassembly 121 is a resistor R 1 The first negative going cell 121C includes a resistor R 1 And the resistance R 1 Connected negatively conductive diode D 1 I.e. R 1 Is connected to one end of the control voltage generating component 11, R 1 And R' 1 Is connected with one end of R 1 And diode D' 1 The negative electrode of which is connected with a diode D 1 The positive electrode of (2) is grounded. The second input unit 122A of the second voltage distribution sub-assembly 122 is a resistor R 2 The second forward unit 122B includes a resistor R' 2 And a resistor R' 2 Connected diode D 'conducting positively' 2 I.e. R 2 Is connected to one end of the control voltage generating component 11, R 2 And R 'at the other end of (2)' 2 Is connected to one end of R' 2 And diode D' 2 The positive electrode of (D) is connected with the diode D 2 Is grounded; the second negative going element 122C includes R 2 And R' 2 Connected negatively conductive diode D 2 I.e. R 2 And R' 2 Is connected with one end of R 2 And diode D' 2 The negative electrode of which is connected with a diode D 2 The positive electrode of (2) is grounded; the third input unit 123A in the third voltage distribution sub-assembly 123 is R 3 The third forward cell 123B includes a resistor R' 3 And a resistor R' 3 Connected forward conducting diode D' 3 I.e. R 3 Is connected to one end of the power supply assembly 11, R 3 And R 'at the other end of (2)' 3 Is connected to one end of R' 3 And diode D' 3 The positive electrode of the diode D 'is connected with' 3 Is grounded; the third negative going cell 123C includes a resistance R 3 And the resistance R 3 Connected negatively conductive diode D 3 I.e. R 3 And R' 3 Is connected with one end of R 3 And diode D' 3 The negative electrode of which is connected with a diode D 3 The positive electrode of (2) is grounded; the fourth input unit 124A of the fourth voltage distribution sub-assembly 124 is a resistor R 4 The fourth forward cell 124B includes a resistor R' 4 And a resistor R' 4 Connected forward conducting diode D' 4 I.e. R 4 Is connected to one end of the power supply assembly 11, R 4 And R 'at the other end of (2)' 4 Is connected to one end of R' 4 And diode D' 4 The positive electrode of the diode D 'is connected with' 4 The negative electrode of (2) is grounded. Wherein, the resistance R' 2 ，R′ 3 ，R′ 4 The resistance value of (2) is gradually decreased; resistance R' 1 ，R″ 2 ，R″ 3 Sequentially increasing the resistance value of (a).
In this embodiment, when the control voltage generating unit 11 outputs the control voltage in the heating mode during heating the target object, the control voltage in the heating mode is distributed to distribution power matching the forward units in the first, second, third and fourth voltage distribution sub-unitsA voltage, the distribution voltage matching the first voltage distribution sub-assembly 121 is kept consistent with the control voltage in the heating mode; due to the resistance R 'in the second voltage distribution sub-assembly 122/third voltage distribution sub-assembly 123/fourth voltage distribution sub-assembly 124' 2 /R″ 3 /R′ 4 The resistance value is gradually decreased, the distribution voltage of the second voltage distribution subassembly 122/matching with the distribution voltage of the third voltage distribution subassembly 123/matching with the distribution voltage of the fourth voltage distribution subassembly 124 is gradually decreased from inside to outside (the fourth voltage distribution subassembly 124 is maximally decreased), and the heat transfer power of the thermoelectric sheet assemblies is gradually decreased from the target object to the external environment layer by layer, so as to avoid the outermost thermoelectric sheet 124 (the temperature of the fourth thermoelectric sheet is increased), thereby improving the heating efficiency; when the control voltage generating assembly 11 outputs the control voltage in the cooling mode during cooling the target object, the control voltage in the cooling mode is distributed to be distributed voltage matched with the negative unit in the first, second, third and fourth voltage distribution subassemblies, and the distributed voltage matched with the fourth voltage distribution subassembly 124 is consistent with the control voltage in the cooling mode, because of the resistance R' in the first voltage distribution subassembly 121/the second voltage distribution subassembly 122/the third voltage distribution subassembly 123 1 /R″ 2 /R″ 3 The resistance of (c) increases in sequence to ensure that the outer layer heat level is sufficient to transfer the total heat generated and transferred from the inner layer heat level.
In summary, the heating/cooling mode switching device of the present invention can achieve higher heating and cooling efficiency, and simultaneously enables the heating and cooling processes to be continuously and seamlessly switched. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A switching device for heating/cooling modes, which is applied to heating or cooling a target object attached to the switching device for heating/cooling modes; the heating/cooling mode switching device includes:
the voltage distribution assembly comprises N parallel voltage distribution sub-assemblies and is used for distributing the control voltage output by the control voltage generation assembly into distribution voltages matched with each voltage distribution sub-assembly after receiving the control voltage; wherein the control voltage comprises a control voltage in a heating mode and a control voltage in a refrigerating mode; the distribution voltage comprises a distribution voltage in a heating mode and a distribution voltage in a refrigerating mode;
the thermoelectric sheet assembly comprises N layers of thermoelectric sheets which are respectively connected with the N voltage distribution subassemblies in a one-to-one correspondence manner and are used for transmitting generated heat into the target object layer by layer under the drive of distribution voltage in the heating mode; or under the drive of the distribution voltage in the refrigeration mode, conducting heat in the environment where the target object is located layer by layer; wherein N is a positive integer greater than or equal to 2.
2. The heating/cooling mode switching device according to claim 1, wherein: the N layers of thermoelectric sheets comprise a first layer of thermoelectric sheets, a second layer of thermoelectric sheets, … and an Nth layer of thermoelectric sheets which are sequentially stacked and mutually attached; wherein, the first layer thermoelectric sheet is attached to the target.
3. The heating/cooling mode switching device according to claim 2, wherein: the switching device of the heating/cooling mode further comprises a radiator attached to the Nth layer of thermoelectric sheets and used for exchanging heat transferred into the N layers of thermoelectric sheets layer by layer or conducted by layer with the external environment.
4. The heating/cooling mode switching device according to claim 2, wherein: the switching device of the heating/cooling mode further comprises N power amplifiers which are connected with the N voltage distribution subassemblies in a one-to-one correspondence manner and are used for amplifying the distribution voltage in the heating mode or the distribution voltage in the cooling mode; the N power amplifiers comprise a first power amplifier, a second power amplifier, … and an Nth power amplifier.
5. The heating/cooling mode switching device according to claim 4, wherein: each power amplifier comprises an output end and two output ends; the two output ends of the power amplifier are connected with the two ends of the corresponding thermoelectric chip, and the input end of the power amplifier is connected with the corresponding voltage distribution subassembly.
6. The heating/cooling mode switching device according to claim 4, wherein: the N voltage distribution subassemblies include:
a first voltage distribution sub-assembly corresponding to the first layer of thermoelectric chips and connected to the first power amplifier; the first voltage distribution subassembly comprises a first input unit and a first negative unit; when the first input unit receives control voltage in a refrigerating mode, the first negative unit distributes the control voltage in the refrigerating mode into distribution voltage matched with the first negative unit, and the distribution voltage matched with the first negative unit is amplified by the first power amplifier in the refrigerating mode so as to minimize the heat transfer power of the first-layer thermoelectric chip; when the first input unit receives a control voltage in a heating mode, the first negative unit cuts off a current generated by the control voltage in the heating mode, and amplifies the control voltage in the heating mode through the first power amplifier so as to maximize heat transfer power of the first layer thermoelectric sheet;
an nth voltage distribution subassembly juxtaposed with the first voltage distribution subassembly, corresponding to the nth layer of thermoelectric chips, and connected to the nth power amplifier; the nth voltage distribution subassembly comprises an nth input unit and an nth forward unit; when the N-th input unit receives the control voltage in the refrigerating mode, the N-th forward unit cuts off the current generated by the control voltage in the refrigerating mode, and amplifies the control voltage in the refrigerating mode through the N-th power amplifier so as to maximize the heat transfer power of the N-th thermoelectric chip; when the N-th input unit receives the control voltage in the heating mode, the N-th forward unit distributes the control voltage in the heating mode to be matched with the N-th forward unit, the distribution voltage in the heating mode is amplified by the N-th power amplifier, and therefore the heat transfer power of the N-th thermoelectric chip is minimized.
7. The heating/cooling mode switching device according to claim 6, wherein: when N is greater than or equal to 3, the N voltage distribution subassemblies further include:
a second/third/…/nth-1 voltage distribution sub-assembly respectively juxtaposed with the first and nth voltage distribution sub-assemblies, corresponding to the second/third/…/nth-1 layer thermoelectric chips respectively, and connected to the second/third/…/nth-1 power amplifier; the second/third/…/nth-1 voltage distribution subassembly includes a second/third/…/nth-1 input unit, a second/third/…/nth-1 positive unit, and a second/third/…/nth-1 negative unit in parallel with the second/third/. Cndot./nth-1 positive unit; when the second/third/…/N-1 input unit receives the control voltage in the heating mode, the second/third/…/N-1 negative unit cuts off the current generated by the control voltage in the heating mode, the second/third/…/N-1 positive unit distributes the control voltage in the heating mode to be matched with the second/third/…/N-1 thermoelectric chip, and the distribution voltage in the heating mode is amplified by the second/third/…/N-1 power amplifier so as to gradually reduce the heat transfer power of the second/third/…/N-1 thermoelectric chip; when the second/third/…/N-1 input unit receives the control voltage in the cooling mode, the second/third/…/N-1 positive unit cuts off the current generated by the control voltage in the cooling mode, and the second/third/…/N-1 negative unit distributes the control voltage in the cooling mode to match the second/third/…/N-1 thermoelectric sheet, and the distribution voltage in the cooling mode is amplified by the second/third/…/N-1 power amplifier to gradually increase the heat transfer power of the second/third/…/N-1 thermoelectric sheet.
8. The heating/cooling mode switching device according to claim 7, wherein: the impedance values of the second forward unit, …, N-1 forward unit and N forward unit are sequentially decreased, and the second forward unit, …, N-1 forward unit and N forward unit are nonlinear electronic elements; the first negative unit, the second negative unit, … and the N-1 negative unit are nonlinear electronic elements, and the impedance values of the first negative unit, the second negative unit, … and the N-1 negative unit are sequentially increased.
9. The heating/cooling mode switching device according to claim 8, wherein: the second forward unit, …, the N-1 forward unit, the N forward unit includes resistors respectively, and forward conducting diodes connected with the resistors; the resistance values of the resistors in the second forward unit, …, the N-1 forward unit and the N forward unit decrease in sequence; the first negative unit, the second negative unit and …, and the N-1 negative unit comprises a resistor and a negative-conducting diode connected with the resistor; and the resistance value of the resistor in the first negative unit, the second negative unit and the … N-1 negative unit is sequentially increased.
10. The heating/cooling mode switching device according to claim 1, wherein: when the heating/cooling mode switching device needs to heat the target object, the control voltage in the heating mode output by the control voltage generating component is a forward control voltage; when the heating/cooling mode switching device is required to cool the target object, the control voltage in the cooling mode output by the control voltage generating component is negative control voltage.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8421347D0 (en) * | 1983-09-06 | 1984-09-26 | Gen Electric | Reverse-phase-control power switching circuits |
| CN2754024Y (en) * | 2004-11-11 | 2006-01-25 | 杨义根 | Refrigerating assembly temperature control additional device |
| CN207262761U (en) * | 2017-05-25 | 2018-04-20 | 上海锴衡仪器科技有限公司 | The switching device of heating/refrigerating pattern |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8421347D0 (en) * | 1983-09-06 | 1984-09-26 | Gen Electric | Reverse-phase-control power switching circuits |
| CN2754024Y (en) * | 2004-11-11 | 2006-01-25 | 杨义根 | Refrigerating assembly temperature control additional device |
| CN207262761U (en) * | 2017-05-25 | 2018-04-20 | 上海锴衡仪器科技有限公司 | The switching device of heating/refrigerating pattern |
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