CN107034493A - A kind of nickel plating solution - Google Patents

A kind of nickel plating solution Download PDF

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Publication number
CN107034493A
CN107034493A CN201710461450.4A CN201710461450A CN107034493A CN 107034493 A CN107034493 A CN 107034493A CN 201710461450 A CN201710461450 A CN 201710461450A CN 107034493 A CN107034493 A CN 107034493A
Authority
CN
China
Prior art keywords
acid
plating solution
nickel plating
nickel
solution according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710461450.4A
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Chinese (zh)
Inventor
易欣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Futekate Material Technology Co Ltd
Original Assignee
Nanjing Futekate Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Futekate Material Technology Co Ltd filed Critical Nanjing Futekate Material Technology Co Ltd
Priority to CN201710461450.4A priority Critical patent/CN107034493A/en
Publication of CN107034493A publication Critical patent/CN107034493A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16Acetylenic compounds

Abstract

The invention discloses a kind of nickel plating solution, with quality(g)Proportioning is as follows:Main 90 ~ 110g of salt, 100 ~ 125g of complexing agent, 5 ~ 30g of auxiliary complex-former, stress reduction 0 ~ 2g of agent, 0 ~ 0.5g of active additive and water 500g.The product of the present invention has good nickel coating, and nickel coating is combined with workpiece, and intensity is high, good corrosion resistance, environment-protecting and non-poisonous evil.

Description

A kind of nickel plating solution
Technical field
The invention belongs to electroplate liquid technical field, and in particular to a kind of nickel plating solution.
Background technology
Plating is chemically to deposit the process of one layer of thin metal, alloy or composite on conductive solids surface, is A kind of special point solution preocess.Plating is as a kind of important process for treating surface, in material protection, finish and acquisition functional plating There is important effect in terms of layer.But, current electroplating industry has used a large amount of strong acid, highly basic, heavy metal solution, even Including harmful chemicals such as cyanide, cadmiums, the waste gas of hostile environment and human health, waste water and useless have been discharged in technical process Slag.In consideration of it, being necessary to improve existing electroplate liquid.
The content of the invention
To solve the deficiencies in the prior art, there is good nickel coating it is an object of the invention to provide a kind of, with workpiece Combination very well, and intensity is high, the nickel plating solution of good corrosion resistance and environment-protecting and non-poisonous evil.
In order to realize above-mentioned target, the present invention is adopted the following technical scheme that:
A kind of nickel plating solution, it is as follows with quality proportioning:90 ~ 110g of nickel sulfate, the g of ammonium nickel sulfate 50 ~ 70, complexing agent 50 ~ 85g are auxiliary 2 ~ 10g of auxiliary agent, naphthalene trisulfonic acid 0.4 ~ 2 g, 1 ~ 3g of butynediols, 1 ~ 2g of active additive and water 400g.
Preferably, foregoing complexing agents are one kind in glycolic, citric acid, tartaric acid, salicylic acid and malic acid.
More preferably, foregoing auxiliary complex-former is one kind in formic acid, acetic acid, propionic acid, oxalic acid and succinic acid.
It is highly preferred that aforementioned surfactants are the oxysalt of boron or the oxysalt of silicon.
The present invention is advantageous in that:The product of the present invention has good nickel coating, and nickel coating is combined with workpiece, And intensity is high, good corrosion resistance and environment-protecting and non-poisonous evil.
Embodiment
Make specific introduce to the present invention below in conjunction with specific embodiment.
Embodiment 1
A kind of nickel plating solution, it is as follows with quality proportioning:Nickel sulfate 90g, ammonium nickel sulfate 50g, complexing agent 85g, adjuvant 10g, naphthalene Trisulfonic acid 0.4 g, butynediols 1g, active additive 2g and water 400g.
Embodiment 2
A kind of nickel plating solution, it is as follows with quality proportioning:Nickel sulfate 110g, ammonium nickel sulfate 70 g, complexing agent 50g, adjuvant 2g, naphthalene Trisulfonic acid 2 g, butynediols 3g, active additive 1g and water 400g.
After testing, product of the invention has good nickel coating, and nickel coating is combined with workpiece, and intensity is high, corrosion resistant Corrosion is good and environment-protecting and non-poisonous evil.
In order to preferably illustrate the present invention, the nickel plating process of product of the present invention is specifically described below:
Certain gap is kept between positive and negative pole, anode uses insoluble material, such as graphite, stainless steel and platinum;Anode electricity Current density is 80 ~ 250A/dm2, pH value 6 ~ 10;Can be with relative motion between negative and positive level, but keep relative distance constant;Nickel plating is molten Liquid is suctioned out by pump from liquid holding box, injection to negative electrode;The anodic current density and pH value of the nickel plating process of product of the present invention are most Good scope is pH value 7 ~ 9, and anodic current density is 100.5 ~ 150A/dm2
The basic principles, principal features and advantages of the present invention have been shown and described above.The technical staff of the industry should Understand, the invention is not limited in any way for above-described embodiment, it is all to be obtained by the way of equivalent substitution or equivalent transformation Technical scheme, all falls within protection scope of the present invention.

Claims (4)

1. a kind of nickel plating solution, it is characterised in that as follows with quality proportioning:90 ~ 110g of nickel sulfate, the g of ammonium nickel sulfate 50 ~ 70, network 50 ~ 85g of mixture, 2 ~ 10g of adjuvant, naphthalene trisulfonic acid 0.4 ~ 2 g, 1 ~ 3g of butynediols, 1 ~ 2g of active additive and water 400g.
2. a kind of nickel plating solution according to claim 1, it is characterised in that the complexing agent is glycolic, citric acid, wine One kind in stone acid, salicylic acid and malic acid.
3. a kind of nickel plating solution according to claim 1, it is characterised in that the auxiliary complex-former is formic acid, acetic acid, third One kind in acid, oxalic acid and succinic acid.
4. a kind of nickel plating solution according to claim 1, it is characterised in that the surfactant is the oxysalt of boron Or the oxysalt of silicon.
CN201710461450.4A 2017-06-19 2017-06-19 A kind of nickel plating solution Pending CN107034493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710461450.4A CN107034493A (en) 2017-06-19 2017-06-19 A kind of nickel plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710461450.4A CN107034493A (en) 2017-06-19 2017-06-19 A kind of nickel plating solution

Publications (1)

Publication Number Publication Date
CN107034493A true CN107034493A (en) 2017-08-11

Family

ID=59541936

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710461450.4A Pending CN107034493A (en) 2017-06-19 2017-06-19 A kind of nickel plating solution

Country Status (1)

Country Link
CN (1) CN107034493A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680757A (en) * 2020-12-11 2021-04-20 浙江华晶整流器有限公司 Electroplating nickel plating process of electrode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680757A (en) * 2020-12-11 2021-04-20 浙江华晶整流器有限公司 Electroplating nickel plating process of electrode

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Application publication date: 20170811