CN107030448B - Titanium vacuum cup and its manufacturing method - Google Patents
Titanium vacuum cup and its manufacturing method Download PDFInfo
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- CN107030448B CN107030448B CN201610076136.XA CN201610076136A CN107030448B CN 107030448 B CN107030448 B CN 107030448B CN 201610076136 A CN201610076136 A CN 201610076136A CN 107030448 B CN107030448 B CN 107030448B
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- titanium
- vacuum
- cup body
- capping
- manufacturing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2205—Drinking glasses or vessels
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2288—Drinking vessels or saucers used for table service with means for keeping liquid cool or hot
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Table Devices Or Equipment (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a kind of titanium vacuum cup and its manufacturing methods; it mainly selects titanium material tentatively to be produced integrally formed inside and outside cup body and capping; and allow outer cup body bottom that there is open end corresponding with capping; there is stainless steel metal dielectric layer then at closure surface sputter; recycle back cover protection weldering processing that capping is incorporated at outer cup body open end; later; vacuum will be extracted between inside and outside cup body again to be brazed simultaneously; it will be extracted at vacuum and be sealed with soldering processing; bottom cover finally is pressed in inside and outside cup body bottom, and completes titanium vacuum cup.Through the above steps, reach and save equipment used in process, and yield rate can be improved.
Description
Technical field
The invention relates to a kind of titanium vacuum cup and its manufacturing method, espespecially a kind of selection titanium material and through spy
The high-quality vacuum cup and its application that different coating is processed into.
Background technique
The container for keeping the beverages such as the water installed to reach a few hours in their original temperature is to belong to known article, this beverage
Container is known as vacuum cup.And anti-corrosion container, tableware, furniture, railing, Medical treatment device (are generally applicable in using stainless steel material in the industry
304 stainless steel of model of material) commodity such as vacuum cup, bottle, tank are made, certainly, also have in industry using the stainless steel of SUS 316
At, it is known as industry rs most acid and alkali-resistance, corrosion-resistant, oxidation resistance has anion design again, it is tool heat preservation, cold insulation, anti-scald, anti-overflow
Vacuum insulation bottle, the vacuum cup designed out, this is also steel most excellent in all stainless steel materials.
However, vacuum cup, bottle production can be used in metal material than stainless steel, also there are other high-quality
The metal material of characteristic, such as titanium, in metallic element, the specific strength of titanium is very high, it is a kind of high-intensitive but low-quality metal,
And there is fairly good ductility (especially in the environment of anaerobic), its fusing point is relatively high (more than 1,649 DEG C), so
It is good piece of refractory metal material, while titanium has paramagnetism, conductivity and thermal conductivity are low.Since titanium has stable change
Learn property, good high temperature resistant, low temperature resistant, anti-strong acid, anti-highly basic, and high intensity, low-density, can microwave heating etc. function
Effect, and it is also used in production surgical set and implantation material in medical industry, therefore titanium is considered advantageous over the thermal insulation article of stainless steel
Substrate.
Titanium is a kind of rare metal, and since it has dispersion and is difficult to extract in nature, therefore titanium is very expensive,
Because titanium fusing point is quite high (more than 1,649 DEG C), so that applying to make, vacuum cup, the process equipment on bottle be many and diverse and technology difficulty
It is high extremely to expend working hour.The soldering process of titanium thermal cup vacuum sealing need to make in high temperature furnace, please refer to Fig. 9 institute
Show, carries out suction hydrogen, oxygen uptake, the vacuum drawn for inhaling nitrogen respectively between 250~600 DEG C, melt solder between 800~930 DEG C
It is molten, stop extracting vacuum at this time, and allow solder to seal with in-furnace temperature cooling, then input nitrogen N2It is cooling, and by above-mentioned processing
Process extremely expends the time.In addition, (882 DEG C) will be from the α type of hexagon at high temperature especially in the dimorphism titanium of allotrope
It is transformed into the β type of body-centered cubic (lattice).Before reaching critical-temperature, the specific heat of α type can explode with heating, but after arrival
It can decline, no matter then keeping substantially constant to temperature under β type.Similar with hafnium with zirconium, there is also a kind of ω states for titanium, in high pressure
When Thermodynamically stable, it is also possible to existing under normal pressure with metasable state.This state is usually that hexagon (ideal) or triangle (are turned round
It is bent), cause β type (111) atomic plane that can be observed when collapsing in soft longitudinal wave audio frequency photon.The comprehensive mistake entirely to heat up
Journey, the subsequent secondary heat treatment temperature of titanium work as titanium all in 700 DEG C or so or even general PVD program is also completed in 200 DEG C
When being warming up to the β type of body-centered cubic (lattice), furnace temperature is cooling with working curve, has become the titanium of the higher hardness of acicular structure,
It will be unable to processing and forming once again.
In addition, above-mentioned adopted high temperature furnace apparatus is expensive, nor the general process equipment that people can buy in the industry, relatively,
In the case where material is rare, making apparatus is expensive and technique is cumbersome, the non-generic consumer of thermal insulation article made by titanium
The disadvantages of acceptable purchase, therefore, holds at high price for quality product, and not easy to manufacture, this is to be badly in need of what research was broken through
One of project.
Inventor adheres to the abundant of the relevant industries for many years and designs and develops and actual fabrication experience, again for existing structure
Improvement is studied, a kind of titanium vacuum cup and its manufacturing method are provided, to achieve the purpose that more preferably practical value.
Summary of the invention
The main purpose of the present invention is to provide a kind of titanium vacuum cup and its manufacturing methods, refer in particular to a kind of selection titanium
It metal material and is processed through special coating and a kind of high-quality vacuum cup is made.
Titanium vacuum cup and its manufacturing method of the invention is reached by technological means in detail below:
It mainly selects titanium material tentatively to be produced integrally formed inside and outside cup body and a capping, and allows outer cup
Body bottom has open end corresponding with capping, has stainless steel metal dielectric layer then at closure surface sputter, back cover is recycled to protect
Capping is incorporated at outer cup body open end by shield weldering processing, and then carries out pricker simultaneously for vacuum is extracted between inside and outside cup body
Weldering will be extracted at vacuum with soldering processing and be sealed, and finally press a bottom cover in inside and outside cup body bottom, and be prepared into titanium heat preservation
Cup.Through the above steps, reach and save equipment used in process, and yield rate can be improved.
In the preferred embodiment of titanium vacuum cup and its manufacturing method of the invention, wherein dielectric layer selection nickel,
Chromium, zinc or zirconium.
In the preferred embodiment of titanium vacuum cup and its manufacturing method of the invention, wherein the medium thickness of institute's sputter
Degree is 30nm (nanometer)~2 μm (micron) and is best with 1.6~2.0 microns.
In the preferred embodiment of titanium vacuum cup and its manufacturing method of the invention, wherein the setting of argon welding processing temperature
At 1000~1200 DEG C.
In the preferred embodiment of titanium vacuum cup and its manufacturing method of the invention, wherein soldering processing temperature is 500
~600 DEG C.
In the preferred embodiment of titanium vacuum cup and its manufacturing method of the invention, wherein the soldering processing program is used
Solder to seal is solid-oxide glass sealing of hole material.
By above-mentioned content and embodiment it is found that the present invention and the prior art in comparison, the present invention has below excellent
Point:
1. titanium vacuum cup of the invention and its manufacturing method select titanium as vacuum cup, pass through titanium itself
Characteristic, and reach that vacuum cup is light, rigidity is good, heat transfer is low, heat resistance is high, resistance to low temperature and corrosion-resistant and other effects, and most
It is important that having the advantages that affinity " bio-compatibility, nontoxic and do not repelled by human body " with human body.
2. titanium vacuum cup of the invention and its manufacturing method, using sputter dielectric layer in closure surface, the dielectric layer is allowed
Easy soldering can be used in sealing processing after vacuum, and need to pass through titanium-based or silver-base solder pricker without such as background technique
Material, and the cost of process equipment must be saved in carrying out vacuum-pumping and sealing in high temperature furnace；The techniques journeys such as soldering are significantly simplified simultaneously
Sequence, and high temperature titanium is avoided to convert the advantages that recrystallizing or influencing product strength.
Detailed description of the invention
Fig. 1 is production process block diagram of the invention.
Fig. 2 is cup body of the invention, capping shaping schematic view.
Fig. 3 is that present invention capping is placed in outer cup body open end schematic diagram.
Fig. 4 is back cover of the present invention protection weldering step end schematic diagram.
Fig. 5 is vacuum brazing step schematic diagram of the present invention.
Fig. 6 is that schematic diagram is completed in present invention soldering.
Fig. 7 is brazing temperature schematic diagram of the present invention.
Fig. 8 is present invention pressing bottom cover step schematic diagram.
Fig. 9 is the brazing temperature schematic diagram of the prior art.
Symbol description:
The outer cup body of cup body 2 in 1
The capping of 21 open ends 3
31 open-works 32 engage ring edge
4 dielectric layer, 5 solder
6 spaces bottom cover A
S1 cup body forming step
S2 covers making step
S3 sputter medium step
S4 back cover protection weldering step
S5 vacuum brazing step
S6 presses bottom cover step
Specific embodiment
To make technology contents of the invention, goal of the invention and its technical effect have more complete and clearly indicating, below in detail
It describes in detail bright, and please refers to correlative type and figure number.
Firstly, the technology and means of practice of the present invention, refering to Figure 1, titanium vacuum cup provided by the invention
And its production process block schematic diagram of manufacturing method, its step are as follows:
(S1) cup body forms-selects titanium as substrate, by the processed integrally formed interior cup body 1, outer of being made of substrate
Cup body 2, and space A is formed between interior cup body 1, the outer cup body 2, which is open end 21, and connected space A；
(S2) capping production-selection titanium is as substrate, and processed be made of substrate is met the opening of outer 2 bottom of cup body
The capping 3 at end 21,3 center of capping have open-work 31, and outside forms engagement ring edge 32；
(S3) sputter medium-in cover 3 surfaces externally and internally sputter dielectric layers 4, the dielectric layer 4 be can sputter stainless steel metal
Material or its metallic compound；
(S4) capping 3 is incorporated into outer 2 bottom of cup body through the welding processing under vacuum or inert gas by back cover protection weldering-,
And the dielectric layer 4 at the protection weldering work progress capping 3 engagement ring edge 32 is vaporized and is disappeared, and one in conjunction with 21 edge of open end
It rises；
(S5) vacuum brazing-, which allows, is placed under vacuum environment in conjunction with interior cup body 1, the outer cup body 2 covered and carries out vacuum drawn,
Space A is extracted into vacuum and is brazed processing simultaneously, carries out pricker in covering the placement fusing point solder 5 lower than dielectric layer 4 at 3 open-works 31
Sealing mouth；
(S6) pressing bottom cover-processes the interior cup body 1 after soldering processing, the laminating bottom cover 6 in 2 bottom of outer cup body through pressing
It is prepared into titanium vacuum cup.
It when actual fabrication, please refers to shown in Fig. 2-7, (S1) cup body forming step is first carried out, first titanium is selected to make
For substrate, integrally formed interior cup body 1, outer cup body 2 is made by titanium-based material is processed, and allow between the interior cup body 1, outer cup body 2
Space A is formed, and outer 2 bottom of cup body has open end 21, which is connected to space A；Later, (S2) capping is carried out
Making step, the capping 3 equally select titanium as substrate, and processed be made of substrate is met the opening of outer cup body bottom
The capping 3 of 21 mouthfuls of sizes is held, meanwhile, it is equipped with open-work 31 in 3 center of capping, and the corresponding 21 mouthfuls of formation in open end in its outside engage
Ring edge 32 (as shown in Figure 2).
It please refers to shown in Fig. 2, after capping 3 completes, implements (S3) sputter medium step, 3 inner and outer surfaces will be covered
Comprising sputter dielectric layer 4 at open-work 31, which mainly allows the processing of the sealing after vacuum, can be used easy soldering, and nothing
The advantages of must being sealed in special titanium high temperature furnace, reaching convenient processing, therefore, the dielectric layer 4 of 3 sputters of capping
The bond material of usual technological means need to be selected, therefore selects stainless steel metal material or its metallic compound, it is described further
Stainless steel metal material or its metallic compound include the metal materials such as nickel, chromium, zinc, zirconium one of which, and institute's sputter
Thickness of dielectric layers is 30nm (nanometer)~2 μm (micron) and is best with 1.6~2.0 microns.Further illustrate that the present invention is adopted
Sputtering process controls ionization grain when the coating film treatment of film deposition is that the starting the arc is handled with the level of atom or molecule
Son forms it into envelope, therefore obtains the overlay film with special tectonic and function being unable to get with thermal equilibrium state.And film
Physical vapour deposition (PVD) of the deposition according to the mechanism in deposition process, not chemically reacting (food-grade is uncomfortable)；Penetrated with vacuum, survey,
The methods such as ionization or ion beam make pure metal and alloy target material metal volatilize in inert gas, are being heated to 200~250 DEG C
On the workpiece surface of (1~2 hour), the fine granular crystal film such as plated film carbide, nitride, oxide, boride.It is not yet
It is same as being deposited, the temperature of vapor deposition is lower, and associativity is slightly worse (no diffusion bond effect), and back to the workpiece private parts of metal evaporation sources
The bad phenomenons such as vapor deposition can be generated.After alloy atom is penetrated by surface capillary hole, though it is tempered (500-700 DEG C) through high temperature,
Its high adhesion force can still be maintained.
Then, it please refers to shown in Fig. 3-4, interior cup body 1, outer cup body 2 and capping 3 is subjected to (S4) back cover protection weldering step,
In this, argon welding, shielded arc welding of tungsten electrode gas (Gas tungsten arc welding, abbreviation is can be used in back cover protection weldering
GTAW weldering), gas tungsten arc welding (Tungsten Inert Gas Welding, abbreviation TIG weldering) etc., and processing temperature
1000 DEG C~1200 DEG C are set in, capping 3 is incorporated into outer 2 bottom of cup body through protection weldering processing, and protects weldering work progress again,
Because high reviewing knowledge already acquired allows the vaporization of dielectric layer 4 at 3 engagement ring edges 32 of capping to disappear, therefore, belongs to the engagement ring edge 32 of titanium-based material and open
Putting 21 edge of end may then bond together, and outer cup body 2 is combined fixation with capping 3 through thus step.Later, it please refers to shown in Fig. 6,
(S5) semi-finished product of above-mentioned steps are placed in progress space vacuum extraction under vacuum environment in vacuum brazing step, this is in pricker
Extraction vacuum is carried out in brazier, meanwhile, also implement soldering processing together, fusing point is mainly embedded at 3 open-works 31 of capping than being situated between
The low solder 5 of matter layer 4, further solder 5 select solid-oxide glass sealing of hole material, shown referring to Figure 7 together, will soldering temperature
Degree is set in 500~600 DEG C, and weldment and solder 5 are heated to above to the fusing point of solder 5, lower than the fusion temperature of dielectric layer 4,
The gap of dielectric layer filling open-work 31 is soaked using liquid solder 5, and (S5) of connection sealing is realized with 4 phase counterdiffusion of dielectric layer
Vacuum brazing step.
Finally, please referring to shown in Fig. 8, in (S6) pressing bottom cover step, by interior cup body 1, the outer cup body 2 after soldering processing
The laminating bottom cover 6 in bottom is prepared into titanium vacuum cup through pressing processing.
However embodiment above-mentioned or schema and non-limiting product structure or usage mode of the invention, any affiliated technology
The appropriate changes or modifications of technical staff in field, all should be regarded as not departing from protection scope of the present invention.
By above-mentioned content and embodiment it is found that the present invention and the prior art in comparison, the present invention has below excellent
Point:
1. titanium vacuum cup of the invention and its manufacturing method select titanium as vacuum cup, pass through titanium itself
Characteristic, and reach that vacuum cup is light, rigidity is good, heat transfer is low, heat resistance is high, resistance to low temperature and corrosion-resistant and other effects, and most
It is important that having the advantages that affinity " bio-compatibility, nontoxic and do not repelled by human body " with human body.
2. titanium vacuum cup of the invention and its manufacturing method, using sputter dielectric layer in closure surface, the dielectric layer is allowed
Easy soldering can be used in sealing processing after vacuum, and need not be sealed in special titanium high temperature furnace, saves
The cost of process equipment and material, while having the advantages that processing is convenient.
Claims (9)
1. a kind of manufacturing method of titanium vacuum cup, its step are as follows:
(S1) cup body forms-selects titanium as substrate, and integrally formed inside and outside cup body, and institute is made by substrate is processed
It states and forms a space between inside and outside cup body, the outer cup body bottom is open end, and connected space；
(S2) capping production-selection titanium is as substrate, and processed be made of substrate is met the open end of outer cup body bottom
Capping, the capping center have open-work, and outside forms engagement ring edge；
(S3) sputter medium-in capping surfaces externally and internally sputter dielectric layer, the dielectric layer be can sputter stainless steel metal material or
Its metallic compound；
(S4) back cover protection weldering-is through the welding processing under vacuum or inert gas, and capping is incorporated into outer cup body bottom, and in
Dielectric layer at capping engagement ring edge described in protection weldering work progress, which vaporizes, to disappear, and combines with open ora terminalis；
(S5) vacuum brazing-, which allows be placed under vacuum environment in conjunction with the inside and outside cup body covered, carries out vacuum drawn, by spatial decimation
Vacuum is brazed processing simultaneously, places the fusing point solder lower than dielectric layer in capping through-hole position and carries out soldered seal；
(S6) the inside and outside laminating bottom cover in cup body bottom after soldering processing is prepared into titanium heat preservation through pressing processing by pressing bottom cover-
Cup.
2. the manufacturing method of titanium vacuum cup as described in claim 1, wherein the medium in (S3) the sputter medium step
Layer choosing nickel, chromium, zinc or zirconium.
3. the manufacturing method of titanium vacuum cup as claimed in claim 2, wherein the thickness of dielectric layers of institute's sputter is the μ of 30nm~2
m。
4. the manufacturing method of titanium vacuum cup as claimed in claim 3, wherein the thickness of dielectric layers of institute's sputter is 1.6~2.0
μm。
5. the manufacturing method of titanium vacuum cup as described in claim 1, wherein (S4) the back cover protection weldering step uses argon
Weldering, shielded arc welding of tungsten electrode gas or gas tungsten arc welding.
6. the manufacturing method of titanium vacuum cup as described in claim 1, wherein adding in (S4) the back cover protection weldering step
Work temperature is 1000~1200 DEG C.
7. the manufacturing method of titanium vacuum cup as described in claim 1, wherein the soldering in (S5) the vacuum brazing step
Processing temperature is 500~600 DEG C.
8. the manufacturing method of titanium vacuum cup as claimed in claim 7, wherein the solder in (S5) the vacuum brazing step
For solid-oxide glass sealing of hole material.
9. the manufacturing method of titanium vacuum cup as claimed in claim 7, wherein (S5) the vacuum brazing step is to be brazed
It is carried out in furnace.
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Families Citing this family (2)
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| CN109171389A (en) * | 2018-10-30 | 2019-01-11 | 江苏希诺实业有限公司 | A kind of titanium vacuum cup and preparation method thereof |
| CN112935717A (en) * | 2021-01-30 | 2021-06-11 | 浙江迪迈工贸有限公司 | Manufacturing process of vacuum cup with inner titanium and outer steel |
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| CN104586188A (en) * | 2014-12-23 | 2015-05-06 | 台州市泰澄电子科技有限公司 | Vacuum pumping structure of metal vacuum cup |
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| JP2001054477A (en) * | 1999-08-17 | 2001-02-27 | Nippon Sanso Corp | Heat-insulating container and its manufacture |
| CN1943956A (en) * | 2006-09-28 | 2007-04-11 | 山东大学 | Expansion connecting method for titanium and aluminium dissimillar non-ferrous metal |
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