CN107021449A - Prepare the preparation method and applications at ordered micro-configuration and controllable chemical composition interface - Google Patents
Prepare the preparation method and applications at ordered micro-configuration and controllable chemical composition interface Download PDFInfo
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- CN107021449A CN107021449A CN201610244160.XA CN201610244160A CN107021449A CN 107021449 A CN107021449 A CN 107021449A CN 201610244160 A CN201610244160 A CN 201610244160A CN 107021449 A CN107021449 A CN 107021449A
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- 239000000243 solution Substances 0.000 claims description 30
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 26
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Silicon Compounds (AREA)
Abstract
The present invention provides a kind of method at the interface for preparing ordered micro-configuration and controllable chemical composition, the interface with microstructure and controllable chemical composition orderly by preparing carries out liquid phase bubbling behaviour control method, can eliminate in terms of the electrode adverse effect of bubble generation in terms of either pipeline transportation, medical treatment.
Description
Technical field
The present invention relates to new energy and energy-efficient field, more particularly to one kind prepare ordered micro-configuration and
Controllable chemical composition substrate interface is applied to the regulation and control of liquid phase bubbling behaviour.
Background technology
In aqueous media bubble be very it is common be also it is inevitable, have very wide in agricultural and industrial process
General application.Such as mineral floating, ocean heat transfer and pollution-preventing isolator etc..Equally, the presence of bubble
Bring some to negatively affect.In liquid conveying system, bubble causes the corrosion and blocking of pipeline, and reduction is set
In the standby life-span, cause the wasting of resources.Such as oil-gas gathering and transferring pipeline by runner due to being vibrated, runner is narrow,
The vortex of seawater, diffusion, cause it to be formed a low-pressure area in a fluid.In seawater and oil gas collection
On the interface of the metal pipe-wall of defeated pipeline, due to the presence of low-pressure area, the original diaphragm of tube wall can be by
The continuous rupture of numerous bubbles and cause generation mechanical damage, so as to form cavitation erosion, if things go on like this, oil gas
Gathering line tube wall is just etched into air marks, in hornet's nest shape.In elctro-catalyst, electrode surface bubble
Impeded electrode and electrolyte contact are adhered to, so as to reduce electrolytic efficiency.Therefore, control bubble behavior and
Characteristic is vital for the application of bubble.
Produced for bubble, growth, the manipulation of the behavior such as merging and release causes the concern of many scientists.
In terms of boiling heat transfer, surface roughness and period boiling heat transfer, coarse structure are introduced into, to provide
More nucleation sites, wellability compares for the influence of boiling heat transfer between reduction substrate and vapor bubbles
Significantly.The microstructure of rough surface helps to increase the delay of nucleation site density and gas, so as to reduce
The initial degree of superheat and the nuclear boiling degree of superheat, and then improve boiling heat transfer efficiency.The wellability of this outer surface
The behaviors such as the generation, growth and release of bubble can be influenceed.Bubble will in the free energy required for hydrophobic surface
Than in the low of water-wetted surface, therefore bubble is easier to produce in hydrophobic surface.When hydrophilic interface and hydrophobic boundary
In face infiltration solution, moisture film and air film can be formed respectively.The moisture film on surface hinders bubble and hydrophilic solid circle
The contact in face, causes small bubble to discharge.On the contrary, the air film formed can increase bubble in hydrophobic interfaces
Adhesion, can with the growth of bubble and merge provide time enough allow.It is well known that wellability is
One key character of the surface of solids, it is total to by the chemical composition and micro-geometry of material surface
With what is determined.It is therefore believed that gas can be realized by the microstructure and chemical composition for coordinating interface
Effective manipulation of bubble.
In nature, the micro-/micro-nano structure and chemical composition of many biological surfaces are realized in aqueous phase to be realized to bubble
Reliable and effective manipulation.Covered in lotus leaf surface in the mastoid process structure of large area, mastoid process covered with big
Measure equally distributed nanometer wax brilliant.Water droplet can not fill up the groove of rough surface, be formed in lotus leaf surface
" air cushion ", when extraneous macroscopical bubble and air film contact, causes bubbles burst.The sky of lotus leaf front trapping
Gas air cushion and the multiple dimensioned structure of lotus leaf graduation are the principal elements of bubbles burst.The belly of water spider
There is substantial amounts of waterproof fine hair, when pulling the plug, own abdomen fine, soft fur can store bubble, to ensure its energy
Long-term security is survived in residence under water.
It is an object of the invention to provide a kind of substrate interface for preparing ordered micro-configuration and controllable chemical composition
Method, by the way that microstructure and surface wettability are combined, it is possible to achieve transported in microfluid and pipeline
The manipulation of bubbling behaviour in terms of defeated and health care, and cost of manufacture relatively economical, will not increase production
Cost.
The content of the invention
Bubble is brought in terms of the existing pipeline transportation of present invention solution, health care and battery efficiency
Negative effect, and drag reduction capability prepares ordered micro-configuration and controllable chemistry there is provided one kind under water for raising
The substrate interface of composition.The orderly substrate interface with microstructure and controllable chemical composition by preparing,
The behaviors such as the nucleation of bubble, growth, merging and release can be realized and manipulated.
In order to solve the above technical problems, the present invention, which provides one kind, prepares ordered micro-configuration and controllable chemical group
Into substrate interface method, pass through and prepare the orderly substrate with microstructure and controllable chemical composition
Interface, realizes to behaviors such as the nucleation of bubble, growth, merging and releases and manipulates.
Prepare the orderly substrate interface with microstructure and controllable chemical composition and use smooth silicon chip
Or mask plate etches the silicon micron base for post bottom that smooth silicon chip is obtained.
The method that what the present invention was provided prepare ordered micro-configuration and the substrate interface of controllable chemical composition, tool
Body includes：
The first step, the cleaning of silicon chip；
Second step, the preparation of surface texture；
3rd step, the structure of hydrophobic surface.
Wherein, the first step is specially further by smooth silicon chip (p-type, crystal orientation 100) or with micro-
The silicon chip of rice structure (utilizes mask plate etching P, crystal orientation using mask plate Beijing University's micro-nano technology laboratory
100 smooth silicon are obtained) ultrasound 15min in acetone, ethanol is immersed successively, after being rushed with water, it is then immersed in
98% sulfuric acid is 3 with dioxygen water volume ratio：In 1 solution, 30min is heated at 80 DEG C, is taken out with big
Measure water to rinse, now silicon chip is hydrophilic.
Wherein, nano-wire array surface texture or micro-nano compound matrices list can be built in the second step
The silicon chip of face structure.
Wherein, second step is specially further：
Prepare silicon nanowire array：The mixed reaction solution of HF and silver nitrate is configured, polytetrafluoroethylene (PTFE) is poured into
In reactor, the smooth silicon of first step cleaning is added, capping is placed in heating response 20 in 50 DEG C of baking ovens
min.Because polytetrafluoro reactor kettle wall is thicker, to ensure reaction effect, add silicon chip before, should in advance by
Reaction solution is put into 50 DEG C of baking ovens and preheats 10min.Silicon chip is taken out after reaction 20min, nitric acid dousing is used
Then 15s or so is rinsed, High Purity Nitrogen with removing the silver-colored film of the grey of sample surfaces covering with a large amount of water
Air-blowing is done.
Prepare micron and nanometer composite structure：The mixed reaction solution of HF and silver nitrate is configured, polytetrafluoroethyl-ne is poured into
In alkene reaction kettle, the silicon micron post piece of first step cleaning is added, it is anti-that capping is placed in heating in 50 DEG C of baking ovens
Answer 20min.,, should before silicon chip is added to ensure reaction effect because polytetrafluoro reactor kettle wall is thicker
Reaction solution is put into 50 DEG C of baking ovens in advance and preheats 10min.Reaction time controls hydrogen to be 10min, otherwise
Etching time is long, can be etched away micron post.Silicon chip is taken out, with nitric acid dousing 15s or so to go
Except the silver-colored film for the grey that sample surfaces are covered, then rinsed with a large amount of water, high pure nitrogen drying.
Wherein, HF concentration is 5mol/L in mixed reaction solution, and the concentration of silver nitrate is 0.02mol/L,
The specific preparation method of mixed reaction solution is：Weigh silver nitrate 0.1699g to be put into plastic beaker, with note
Emitter draws 10ml hydrofluoric acid, adds water and is made into 50ml mixed solutions.
Wherein, the 3rd step can prepare hydrophobic surface and super thin by controlling the time of vapour deposition
Water surface.
Prepared by the silicon chip and second step that the 3rd step further specially cleans up the first step has table
The silicon chip of face structure, is dried up with high pure nitrogen, and silicon chip is put into vacuum desiccator at once, is instilled one and is dripped
Silicon fluoride, is vacuumized, and keeps vacuum condition 2h, hydroxylated silicon chip is under silicon fluoride steam atmosphere in table
Face forms the monolayer of silicon fluoride, so as to form hydrophobic surface.When preparing super hydrophobic surface, take out true
Time that is empty and keeping is 12h, herein it should be noted that smooth silicon face is smoother, even across
After silicon fluoride vapour deposition 12h, it is also not possible to reach super-hydrophobic state.
Beneficial effects of the present invention:
The present invention, which is provided, a kind of prepares the orderly substrate interface with microstructure and controllable chemical composition
Method, can manipulate to the realization of the behaviors such as the nucleation of liquid phase bubble, growth, merging and release, disappear
Except in terms of the electrode either in terms of pipeline transportation, medical treatment bubble generation adverse effect；And cost of manufacture
Relatively economical, will not increase production cost.
Brief description of the drawings
Fig. 1 is Experimental equipment；
Fig. 2 is the SEM figures of silicon micron post array, post is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 3 is the SEM figures of silicon micron post array side, post is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 4 schemes for the SEM on silicon nanowire array surface；
Fig. 5 schemes for the SEM of silicon nanowire array side；
Fig. 6 schemes for the SEM on silicon micro-nano composite array surface, and post is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 7 schemes for the SEM of silicon micro-nano composite array side, and post is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 8 is hydrophobic substrate and CO2The test chart of the adhesion of bubble；
Fig. 9 is hydrophobic substrate and CO2The test chart of the adhesion of bubble；
Figure 10 is super hydrophobic base and CO2The test chart of the adhesion of bubble.
Embodiment
The present invention prepares the orderly substrate interface with microstructure and controllable chemical composition, realizes to gas
Manipulation is realized in the behaviors such as nucleation, growth, merging and the release of bubble.The substrate use smooth silicon chip with
And mask plate etches the silicon micron base for post bottom that smooth silicon chip is obtained.
What the present invention was provided prepare ordered micro-configuration and the method for chemical composition substrate interface is specifically included：
The first step, the cleaning of silicon chip；
Second step, the preparation of surface texture；
3rd step, the structure of hydrophobic surface.
The first step is specially further by smooth silicon chip (p-type, crystal orientation 100) or with micrometer structure
Silicon it is (smooth using mask plate etching P, crystal orientation 100 using mask plate Beijing University's micro-nano technology laboratory
Silicon is obtained) immerse ultrasound 15min in acetone, ethanol successively respectively, after being rushed with water, it is then immersed in 98%
Sulfuric acid is 3 with dioxygen water volume ratio：In 1 solution, 30min is heated at 80 DEG C, is taken out with a large amount of
Water is rinsed.Now silicon chip is hydrophilic.
When using smooth silicon chip, prepared by the first step is nano-wire array surface texture, in second step
The silicon chip of nano-wire array surface texture can be built, when using the silicon with micrometer structure, the first step
What is prepared is micro-nano nanowire arrays surface texture, and prepared by second step is micro-nano composite array surface texture
Silicon chip.
Second step is specially further：
Prepare silicon nanowire array：The mixed reaction solution of HF and silver nitrate is configured, polytetrafluoroethylene (PTFE) is poured into
In reactor, the smooth silicon of first step cleaning is added, capping is placed in heating response 20 in 50 DEG C of baking ovens
min.Because polytetrafluoro reactor kettle wall is thicker, to ensure reaction effect, add silicon chip before, should in advance by
Reaction solution is put into 50 DEG C of baking ovens and preheats 10min.Silicon chip is taken out after reaction 20min, nitric acid dousing is used
Then 15s or so is rinsed, High Purity Nitrogen with removing the silver-colored film of the grey of sample surfaces covering with a large amount of water
Air-blowing is done,
Prepare micron and nanometer composite structure：The mixed reaction solution of HF and silver nitrate is configured, polytetrafluoroethyl-ne is poured into
In alkene reaction kettle, the silicon micron post piece of first step cleaning is added, it is anti-that capping is placed in heating in 50 DEG C of baking ovens
Answer 20min.,, should before silicon chip is added to ensure reaction effect because polytetrafluoro reactor kettle wall is thicker
Reaction solution is put into 50 DEG C of baking ovens in advance and preheats 10min.Silicon chip is taken out after reaction 10min, nitric acid is used
Then immersion 15s or so is rinsed with removing the silver-colored film of the grey of sample surfaces covering with a large amount of water, high
Pure nitrogen gas is dried up.
Wherein, HF concentration is 5mol/L in mixed reaction solution, and the concentration of silver nitrate is 0.02mol/L,
Specifically preparation method is：Weigh silver nitrate 0.1699g to be put into plastic beaker, 10ml is drawn with syringe
Hydrofluoric acid, adds water and is made into 50ml mixed solutions.
Prepared by the silicon chip and second step that the 3rd step further specially cleans up the first step has table
The silicon chip of face structure, is dried up with high pure nitrogen, and silicon chip is put into vacuum desiccator at once, is instilled one and is dripped
Silicon fluoride, is vacuumized, and keeps vacuum condition 2h, hydroxylated silicon chip is under silicon fluoride steam atmosphere in table
Face forms the monolayer of silicon fluoride, so as to form hydrophobic surface.When preparing super hydrophobic surface, take out true
Time that is empty and keeping is 12h.Herein it should be noted that smooth silicon face is smoother, even across
After silicon fluoride vapour deposition 12h, it is also not possible to reach super-hydrophobic state.
The present invention realizes the principle of liquid phase bubbling behaviour manipulation：In the substrate modified without silicon fluoride, substrate
It is smaller to the adhesion of bubble, therefore the release radius of bubble is smaller on hydrophobic substrate.By hydrogen fluorine
Silicon chip after acid corrosion, nanostructured can provide more nucleation sites.The increase of hydrophobic substrate roughness,
Wellability can be increased, the adhesion to bubble is reduced, many microbubbles can be produced.Repaiied by vapour deposition
Material after decorations, strengthens, the interaction between substrate and hydrone weakens with the hydrophobicity of substrate,
Hydrone, which is ostracised, to come, and causes gas molecule to be easier to escape on hydrophobic surface, substrate is glued to bubble
Attached power increase.The volume of bubble great talent can must have larger buoyancy to overcome the adhesion of substrate enough
Flee from substrate surface.Smooth silicon face after modification, the release of the release radius ratio hydrophobic substrate of bubble
Radius is big.For hydrophobic substrate, the increase of roughness, it will the hydrophobicity of increase substrate, increase bubble
Adhesion.Bubble can be merged during growth with neighbouring bubble, produce it is discontinuous or
Continuous air film.
The present invention by the way that microstructure and surface wettability are combined, prepare it is orderly have microstructure and
Realize that liquid phase bubbling behaviour is manipulated in the interface of controllable chemical composition, it is possible to achieve transport in microfluid and pipeline
The manipulation of bubbling behaviour in terms of defeated and health care, eliminates the adverse effect that bubble is produced.
Present invention also offers above-mentioned interface application during supercavity drag reduction.
Describe embodiments of the present invention in detail using embodiment and accompanying drawing below, whereby to the present invention such as
What application technology means solves technical problem, and reaches the implementation process of technique effect and can fully understand simultaneously
Implement according to this.
The nano-wire array surface texture of embodiment 1
Silicon chip (p-type, crystal orientation 100) is immersed into ultrasound 15min in cleaning solution, acetone, ethanol successively,
After being rushed respectively with water, it is 3 to be then immersed in sulfuric acid with dioxygen water volume ratio：In 1 solution, at 80 DEG C
10min is heated, takes out and is rinsed with a large amount of water.
Weigh silver nitrate 0.1699g to be put into plastic beaker, 10ml hydrofluoric acid is drawn with syringe, then
Add water and be made into 50ml mixed reaction solutions, be poured into polytetrafluoro reactor, add the silicon chip of cleaning,
Capping is placed in heating response 20min in 50 DEG C of baking ovens, because polytetrafluoro reactor kettle wall is thicker, to ensure
Reaction solution, should be put into 50 DEG C of baking ovens and preheat 10min by reaction effect in advance.Silicon chip is taken out after reaction,
With nitric acid dousing 15s or so with the silver-colored film for the grey for removing sample surfaces covering, then rushed with a large amount of water
Wash, high pure nitrogen drying.Fig. 4 schemes for the SEM on silicon nanowire array surface, and Fig. 5 is silicon nanowires battle array
The SEM figures of side are arranged, can reach that silicon nanowires is uniformly distributed from electromicroscopic photograph, the diameter of nano wire
About 150-200nm, the length of nano wire is about 4.82um.
The micro-nano composite array surface texture of embodiment 2
Silicon with micrometer structure (is etched using mask plate Beijing University's micro-nano technology laboratory using mask plate
P, the smooth silicon of crystal orientation 100 are obtained) (as shown in Figures 2 and 3) respectively immerse cleaning solution, acetone,
Ultrasound 15min in ethanol, after being rushed respectively with water, it is 3 to be then immersed in sulfuric acid with dioxygen water volume ratio：1
Solution in, heat 10min at 80 DEG C, take out with the flushing of a large amount of water.
Weigh silver nitrate 0.1699g to be put into plastic beaker, 10ml hydrofluoric acid is drawn with syringe, then
Add water and be made into 50ml mixed reaction solutions, be poured into polytetrafluoro reactor, what addition was cleaned has micro-
The silicon chip of rice rod structure, silicon chip pillar post is wide/pillar height/intercolumniation=10/5/10 μm, and capping is placed in 50 DEG C
Heating response 10min in baking oven, controls the etching time of hydrofluoric acid herein, and etching time is long, meeting
Micron post is etched away.Because polytetrafluoro reactor kettle wall is thicker, to ensure reaction effect, should in advance by
Reaction solution is put into 50 DEG C of baking ovens and preheats 10min.Silicon chip is taken out after reaction, 15s is soaked with concentrated nitric acid
Then left and right is rinsed, High Purity Nitrogen air-blowing with removing the silver-colored film of the grey of sample surfaces covering with a large amount of water
It is dry.Fig. 6 schemes for the SEM on silicon micro-nano composite array surface.Fig. 7 is the SEM of silicon micro-nano composite array side
Figure.It can be obtained from electromicroscopic photograph, silicon micron post by hydrofluoric acid after corroding, and only silicon column is corroded
Formation of nanostructured, rather than pillar region are not corroded as nanostructured.Obtained through excessive erosion silicon micron post
Micro-nano compound structure, the length of nano wire is about 5um.
Embodiment 3 has the silicon chip of diverse microcosmic structure and chemical composition to CO2The manipulation of bubbling behaviour.
Device is realized as shown in figure 1, building.Experiment needs first to adjust light source 1, high-speed camera before starting
The position of machine 2, substrate 3, it is ensured that three kinds on the same line, while in camera control display 4
Upper shown substrate side will be clear that.
Adjust after light path, the hydrophobic substrate and super hydrophobic base of above-mentioned preparation are placed in 50 × 50 × 30
mm3Fill CO2Saturated solution (CO herein2Saturated solution is Watson sugar-free soda water)
In quartz cell, silicon chip substrate is placed under liquid at 20mm, and the one side with microstructure is fixed upward.
Bubble is recorded in substrate with 50frame/s speed with the video cameras of OLYMPUS i-SPEED 3
The behavior on surface.
Check experiment is used as using the silicon base that is vapor-deposited without process silicon fluoride again simultaneously.Recorded.
Compare the action process of bubble after above-mentioned various substrate immersion carbonated waters.
Hydrophilic interface CO2Bubble nucleating and growth in situ, bubble release spherical in shape, and CO2The release of bubble
Radius has functional relation with roughness, and the diameter of bubble reduces with the increase of roughness.Hydrophobic base
Basal surface, CO2Bubble is in coronal growth, and can merge, merge with neighbouring bubble；Increase
The roughness at interface can increase the adhesion to bubble, and the last release radius of bubble can increase.And
Super-hydrophobic surface, forms continuous air film, can effectively capture the gas molecule in liquid phase.
The test of the adhesion curve map of embodiment 4
Bubble and substrate are measured from German daterphysics DCAT21 dynamic contact angular measurements instrument
Adhesion.Dynamic contact angular measurement software is opened, measurement parameter is set.Photography software is opened, adjustment is regarded
It is wild clear, the needle cycle by specially treated is found, and adjust clear.The silicon chip of preparation is attached to rack
On, it is put into the quartz cell equipped with water, it is ensured that needle cycle is immersed in the water and directly over sample.To needle cycle
On squeeze into the bubble of certain volume, and adjust the height of sample, it is determined that every time test to the extruding of bubble away from
From identical, start to measure adhesion force curve of the sample to bubble.The data of measurement carry out computing with Origin
It is figure such as Fig. 8, Fig. 9 and Figure 10.
Fig. 8 is the adhesion side view of hydrophobic substrate.Fig. 8 a are adhesion of the hydrophilic smooth substrate to bubble
Curve map.Fig. 8 b are adhesion curve map of the silicon micrometer structure to bubble；Fig. 8 c are hydrophilic silicon nanowires
To the adhesion curve map of bubble；Fig. 8 d are adhesion curve map of the hydrophilic micro-nano compound structure to bubble.
It will be seen that hydrophobic substrate is very weak to the adhesion of bubble from figure.
Fig. 9 is the adhesion side view of hydrophobic substrate.Fig. 9 a are adhesion of the hydrophobic smooth substrate to bubble
Curve map.Fig. 9 b are adhesion curve map of the hydrophobic silicon micrometer structure to bubble；Fig. 9 c are that hydrophilic silicon is received
Adhesion curve map of the rice noodles to bubble；Fig. 9 d are adhesion force curve of the hydrophobic micro-nano compound structure to bubble
Figure.It will be seen that hydrophobic substrate has stronger adhesion to bubble from figure.
Figure 10 is the adhesion side view of super hydrophobic base.Figure 10 a are super-hydrophobic silicon nano wires to bubble
Adhesion curve map.Figure 10 b are adhesion curve map of the super-hydrophobic silicon micrometer structure to bubble；Figure 10 c
It is adhesion curve map of the super-hydrophobic micro-nano compound structure to bubble；Fig. 8 d are the hydrophilic adhesions to bubble
Curve map.It will be seen that super hydrophobic base has very strong adhesion to bubble from figure.
Table 1 is under water in the silicon base with diverse microcosmic structure and structure of chemical composition and chemical composition
Contact angle.
Table 1
All above-mentioned this intellectual properties of primarily implementation, the implementation of setting limitation other forms this
Plant new product and/or new method.Those skilled in the art will utilize this important information, and the above is changed,
To realize similar implementation status.But, all modifications or transformation belong to reservation based on new product of the present invention
Right.
The above described is only a preferred embodiment of the present invention, being not to make other forms to the present invention
Limitation, any those skilled in the art are changed possibly also with the technology contents of the disclosure above
Or it is modified as the equivalent embodiment of equivalent variations.But it is every without departing from technical solution of the present invention content, according to
Any simple modification, equivalent variations and the remodeling made according to the technical spirit of the present invention to above example,
Still fall within the protection domain of technical solution of the present invention.
Claims (9)
1. a kind of method at the interface for preparing ordered micro-configuration and controllable chemical composition, it is characterised in that：
Prepare the orderly substrate interface with microstructure and controllable chemical composition, to the nucleation of bubble, growth,
Manipulation is realized in the behavior such as merging and release.
2. the side at the interface as claimed in claim 1 for preparing ordered micro-configuration and controllable chemical composition
Method, it is characterised in that：The silicon that the substrate is obtained using smooth silicon chip or the smooth silicon chip of mask plate etching is micro-
Meter Zhu Ji bottoms.
3. the interface as claimed in claim 1 or 2 for preparing ordered micro-configuration and controllable chemical composition
Method, it is characterised in that：Specifically include,
The first step, the cleaning of silicon chip；
Second step, the preparation of surface texture；
3rd step, the structure of hydrophobic surface.
4. the interface for preparing ordered micro-configuration and controllable chemical composition as described in claims 1 to 3
Method, it is characterised in that：The first step is specially further by smooth silicon chip (p-type, crystal orientation 100)
(mask plate etching P, crystal orientation 100 are utilized with silicon micron post using mask plate Beijing University's micro-nano technology laboratory
Smooth silicon is obtained) immerse ultrasound 15min in acetone, ethanol successively respectively, after being rushed with water, it is then immersed in
98% sulfuric acid is 3 with dioxygen water volume ratio：In 1 solution, 30min is heated at 80 DEG C, is taken out with big
Measure water to rinse, now silicon chip is hydrophilic.
5. the interface for preparing ordered micro-configuration and controllable chemical composition as described in Claims 1-4
Method, it is characterised in that：Nano-wire array surface texture or micro-nano multiple can be built in the second step
Close the silicon chip of array surface structure.
6. the interface for preparing ordered micro-configuration and controllable chemical composition as described in claim 1 to 5
Method, it is characterised in that：Second step further specifically,
The mixed reaction solution of HF and silver nitrate is configured, is poured into ptfe autoclave, first is added
The silicon chip of cleaning is walked, capping is placed in heating response 20min in 50 DEG C of baking ovens.Because of polytetrafluoro reactor kettle
Wall is thicker, to ensure reaction effect, before silicon chip is added, reaction solution should be put into 50 DEG C of baking ovens in advance
Middle preheating 10min.Silicon chip is taken out after reaction 20min, with nitric acid dousing 15s or so to remove sample table
The silver-colored film of the grey of face covering, is then rinsed with a large amount of water, high pure nitrogen drying.Wherein, preparation is worked as
The silicon chip of micro-nano composite array surface texture, the etching time that hydrofluoric acid is controlled herein is 10min,
Otherwise etching time is long, can be etched away micron post.
7. the interface for preparing ordered micro-configuration and controllable chemical composition as described in claim 1 to 6
Method, it is characterised in that：HF concentration is 5mol/L in mixed reaction solution, and the concentration of silver nitrate is 0.02
Mol/L, the specific preparation method of mixed reaction solution is：Weigh silver nitrate 0.1699g and be put into plastic beaker
In, 10ml hydrofluoric acid is drawn with syringe, adds water and is made into 50ml mixed solutions.
8. the interface for preparing ordered micro-configuration and controllable chemical composition as described in claim 1 to 7
Method, it is characterised in that：3rd step can be by controlling the time of vapour deposition to prepare hydrophobic table
Face and super hydrophobic surface.
9. the interface for preparing ordered micro-configuration and controllable chemical composition as described in claim 1 to 8
Method, it is characterised in that：3rd step is specially further the silicon chip that will be cleaned up, and uses High Purity Nitrogen air-blowing
It is dry, silicon chip is put into vacuum desiccator at once, one is instilled and drips silicon fluoride, vacuumize, keep vacuum bar
Part 2h, hydroxylated silicon chip forms the monolayer of silicon fluoride under silicon fluoride steam atmosphere on surface, from
And form hydrophobic surface.When preparing super hydrophobic surface, the time for vacuumizing and keeping is 12h, at this
In it should be noted that smooth silicon face is smoother, be vapor-deposited even across silicon fluoride after 12h, also not
It is likely to be breached super-hydrophobic state.
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