CN107012434A - A kind of evaporation source and vacuum deposition apparatus - Google Patents

A kind of evaporation source and vacuum deposition apparatus Download PDF

Info

Publication number
CN107012434A
CN107012434A CN201710388172.4A CN201710388172A CN107012434A CN 107012434 A CN107012434 A CN 107012434A CN 201710388172 A CN201710388172 A CN 201710388172A CN 107012434 A CN107012434 A CN 107012434A
Authority
CN
China
Prior art keywords
evaporation
heater block
evaporation source
exit direction
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710388172.4A
Other languages
Chinese (zh)
Inventor
杨育青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Tianma Microelectronics Co Ltd
Original Assignee
Wuhan Tianma Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Tianma Microelectronics Co Ltd filed Critical Wuhan Tianma Microelectronics Co Ltd
Priority to CN201710388172.4A priority Critical patent/CN107012434A/en
Publication of CN107012434A publication Critical patent/CN107012434A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention discloses a kind of evaporation source and vacuum deposition apparatus, evaporation source includes being provided with evaporation material in evaporation part and at least one heater block, heater block;Evaporation part is connected with heater block, including evaporation outlet, and positioned at evaporation part one end relative with heater block link position, evaporation material is in the direction of evaporation outlet outgoing perpendicular to plane where substrate to be deposited;Angle between evaporation part and each heater block is all higher than being equal to 90 °, and less than 180 °.By technical scheme, the extension for evaporating material on substrate to be deposited around position to be filmed is reduced, shadow effect is improved, improves the display quality of organic electroluminescence device.

Description

A kind of evaporation source and vacuum deposition apparatus
Technical field
The present embodiments relate to display device manufacturing technology field, more particularly to a kind of evaporation source and vacuum evaporation dress Put.
Background technology
Each film layer for constituting organic electroluminescence device is general by the way that formation is deposited, at present, using wider during evaporation General evaporation source includes point-like evaporation source and linear evaporation source, and evaporation source has the crucible for enclosing evaporation material and sprays evaporation material The nozzle of material, evaporation material evaporates or distilled from the crucible of heating, and the evaporation material of gasification is from nozzle to being arranged at vacuum chamber Film layer needed for injection is formed on indoor substrate to be deposited or film layer, can also be patterned by the mask plate formation of different pattern Film layer.
But, the evaporation material of the nozzle injection by being arranged on crucible is general in divergent shape, that is, the evaporation material gasified The exit direction of material is along all directions in space so that direction of the evaporation material of gasification when by mask plate through hole is also each Differ, evaporation material, which is formed, has evaporation material around the shape of similar covering of the fan, the position to be filmed on substrate to be deposited Extension, cause shadow effect.Using the direction perpendicular to plane where substrate to be deposited as reference direction, evaporation material, which is reached, to be covered The angle that injection direction during diaphragm plate deviates the reference direction is bigger, the steaming extended on substrate to be deposited around position to be filmed Hair material is more, and shadow effect is more serious, and shadow effect can have a strong impact on the increase of mask plate aperture opening ratio, causes different luminous Occur mixed color phenomenon between colored pixels region, and then influence the display quality of organic electroluminescence device.
The content of the invention
The present invention provides a kind of evaporation source and vacuum deposition apparatus, and the outgoing side of evaporation material is defined by the way that part is deposited To so that evaporation material, perpendicular to plane where substrate to be deposited, reduces substrate to be deposited in the exit direction that outlet is deposited The extension of material is evaporated around upper position to be filmed, shadow effect is substantially improved, the aobvious of organic electroluminescence device is improved Show quality.
On the one hand, the embodiments of the invention provide a kind of evaporation source, including:
Evaporation material is provided with least one heater block, the heater block;
Part is deposited, the evaporation part is connected with the heater block, including evaporation outlet, positioned at the evaporation part One end relative with the heater block link position, the evaporation material is in the direction of the evaporation outlet outgoing perpendicular to treating Plane where substrate is deposited;
Angle between the evaporation part and each heater block is all higher than being equal to 90 °, and less than 180 °.
On the other hand, the embodiment of the present invention additionally provides a kind of vacuum deposition apparatus, including foregoing evaporation source.
The embodiments of the invention provide a kind of evaporation source and vacuum deposition apparatus, by that will be deposited in part and at least one Portion is provided with the heater block connection of evaporation material, sets the evaporation outlet of evaporation part to be located at evaporation part and connects with heater block The relative one end in position is connect, and the angle between evaporation part and each heater block is more than or equal to 90 °, less than 180 °, phase For making the directly outgoing after heating and gasifying in heater block of evaporation material in the prior art, the embodiment of the present invention makes heater block In the gasification of evaporation material after be introduced into evaporation part be connected with heater block, and cause evaporation material that the steaming of part is being deposited Plate the exit direction of the outlet plane where the substrate to be deposited, i.e., using the direction perpendicular to substrate to be deposited place plane as Reference direction, substantially reduces the angle that exit direction of the evaporation material in evaporation outlet deviates the reference direction, reduces The extension of material is evaporated on substrate to be deposited around position to be filmed, and then improves shadow effect, organic electroluminescence hair is improved The display quality of optical device.
Brief description of the drawings
Fig. 1 is a kind of structural representation of evaporation source provided in an embodiment of the present invention;
Fig. 2 is the cross-sectional view of evaporation source shown in Fig. 1;
Fig. 3 is the cross-sectional view of another evaporation source provided in an embodiment of the present invention;
Fig. 4 is the cross-sectional view of another evaporation source provided in an embodiment of the present invention;
Fig. 5 is a kind of structural representation that part is deposited provided in an embodiment of the present invention;
Fig. 6 is another structural representation that part is deposited provided in an embodiment of the present invention;
Fig. 7 is another structural representation that part is deposited provided in an embodiment of the present invention;
Fig. 8 is another structural representation that part is deposited provided in an embodiment of the present invention;
Fig. 9 is another structural representation that part is deposited provided in an embodiment of the present invention;
Figure 10 is another structural representation that part is deposited provided in an embodiment of the present invention;
Figure 11 is a kind of structural representation of evaporation source provided in an embodiment of the present invention;
Figure 12 is a kind of structural representation of evaporation source provided in an embodiment of the present invention;
Figure 13 is a kind of structural representation of vacuum deposition apparatus provided in an embodiment of the present invention.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just Part related to the present invention rather than entire infrastructure are illustrate only in description, accompanying drawing.
The embodiments of the invention provide a kind of evaporation source, including at least one heater block and evaporation part, heater block Evaporation material is inside provided with, evaporation part includes evaporation and exported, is connected with heater block, the evaporation outlet of evaporation part, which is located at, steams Part one end relative with heater block link position is plated, evaporation material is in the direction of evaporation outlet outgoing perpendicular to base to be deposited Plane where plate, the angle between evaporation part and each heater block is all higher than being equal to 90 °, and less than 180 °.
The evaporation source that vacuum evaporation is used has the crucible for enclosing evaporation material and the nozzle for spraying evaporation material, carries out true During sky evaporation, evaporation material evaporates or distilled from the crucible of heating, from nozzle to the substrate to be deposited being arranged in vacuum chamber Or the evaporation material of injection caburation forms required film layer in film layer, the mask plate formation patterning of different pattern can also be passed through Film layer.Due to gasification evaporation material pass through nozzle when exit direction along along space different directions, formed covering of the fan shape, that is, steam Send out material not vertical with substrate to be deposited by direction during mask plate, therefore needing into around film location, also can shape Into the film layer of evaporation material formation, i.e., there is the extension of evaporation material around position to be filmed, cause shadow effect.To hang down The direction of the straight plane where substrate to be deposited is reference direction, evaporation material by exit direction during evaporation outlet relative to The deviation angle of reference direction is bigger, into film location around the evaporation material that extends it is more, shadow effect is more serious.
The embodiment of the present invention is connected by the way that part will be deposited with least one heater block for being internally provided with evaporation material, Set the evaporation outlet of evaporation part to be located at evaporation part one end relative with heater block link position, and make evaporation part and Angle between each heater block is more than or equal to 90 °, less than 180 °, relative to evaporation material in the prior art directly in heating Outgoing after heating and gasifying in part, after the evaporation material gasification in heater block, do not make directly the evaporation material of gasification from In heater block outgoing for evaporation, but make evaporation material be introduced into heater block in [90 °, 180 °) angle connection Part is deposited, the exit direction for evaporating material is limited using part is deposited, and evaporation material is set in evaporation part Evaporation outlet exit direction where the substrate to be deposited plane, evaporation material warp is so ensure that to the full extent Injection direction when crossing mask plate through hole reduces greatly position to be filmed on substrate to be deposited perpendicular to plane where substrate to be deposited The extension for around evaporating material is put, and then improves shadow effect, the display quality of organic electroluminescence device is improved.
Above is the core concept of the present invention, below in conjunction with the accompanying drawing in the embodiment of the present invention, to the embodiment of the present invention In technical scheme be clearly and completely described.Based on the embodiment in the present invention, those of ordinary skill in the art are not having Make under the premise of creative work, the every other embodiment obtained belongs to the scope of protection of the invention.
Fig. 1 is a kind of structural representation of evaporation source provided in an embodiment of the present invention, and Fig. 2 cuts open for evaporation source shown in Fig. 1 Face structural representation.With reference to Fig. 1 and Fig. 2, evaporation source includes heater block 10 and evaporation part 11, exemplary, and part is deposited 11 can be an evaporation pipeline, and heater block 10 is connected with evaporation part 11, and evaporation material 101 is provided with heater block 10, Part 11, which is deposited, includes evaporation outlet 111, and evaporation outlet 111 is relative with the link position of heater block 10 positioned at evaporation part 11 One end, evaporation material 101 evaporation outlet 111 exit direction (direction as shown in solid arrow in Fig. 2) perpendicular to waiting to steam The place plane of plated substrate 12, Fig. 1 and Fig. 2 exemplarily set the angle between heater block 10 and evaporation part 11 to be 90 °.
Referring to Figures 1 and 2, relative to prior art, evaporation material 101 is no after gasifying directly to be gone out from heater block 10 Penetrate for evaporation, but pass through evaporation part 11 and reach evaporation 111 outgoing of outlet.Steamed specifically, entering from heater block 10 The evaporation material 101 for plating part 11 is still in divergent shape, and the limitation of the side wall of part 11 is being deposited in the evaporation material 101 in divergent shape Under, the direction moved in evaporation part 11 tends to the bearing of trend (AA ' directions i.e. in Fig. 1 and Fig. 2) of part 11 is deposited Unanimously, the final exit direction for causing evaporation material 101 in evaporation outlet 111 is perpendicular to the plane where substrate 12 to be deposited. It should be noted that here vertical may be considered near normal.When forming patterning films, typically in evaporation source with treating Setting mask plate (not shown) between substrate 12 is deposited, and mask plate is set parallel to substrate 12 to be deposited, evaporation part 11 Injection direction of the evaporation material 101 when reaching mask plate through hole can be made perpendicular to substrate 12 to be deposited by setting, relative to existing There is technology to greatly reduce the extension that material 101 is evaporated in position to be filmed on substrate 12 to be deposited, improve shadow effect.
Fig. 1 and Fig. 2 simply exemplarily set the angle between heater block 10 and evaporation part 11 to be 90 °, can also Set and set between heater block 10 and evaporation part 11 in (90 °, 180 °) angle, as long as shown in figure 3, ensureing heater block 10 are not parallel to each other with the bearing of trend (i.e. AA ' and BB ' directions in Fig. 3) of part 11 is deposited, and make steaming relative to prior art The directly outgoing direct in heater block 10 of material 101 is sent out for evaporation, you can to reduce evaporation material 101 in base to be deposited Extension on plate 12 around position to be filmed, improves shadow effect.The embodiment of the present invention is to heater block 10 and evaporation part 11 Between angle be not construed as limiting, as long as ensureing that angle therebetween is more than or equal to 90 °, less than 180 °.
Fig. 1-Fig. 3 simply exemplarily sets evaporation source to include a heater block 10, evaporation source can also be set to include Multiple heater blocks 10, and each heater block 10 is connected with evaporation part 11.Steamed as shown in figure 4, exemplarily setting Rise including two heater blocks 10, evaporation material 101, and each heater block 10 can be placed in each heater block 10 It is connected with evaporation part 11.Multiple heater blocks 10 are set, and each heater block 10 is connected with evaporation part 11, phase For only setting a heater block 10, during being deposited, set multiple heater blocks 10 being capable of balanced steam plating part The pressure that material 101 is produced is evaporated in part 11, is conducive to the uniformity of evaporation film-forming.In addition, setting evaporation source to include multiple add Thermal part 10, can add different evaporation materials 101 in different heater blocks 10, realize the mixing of evaporation material 101 Doping, you can to realize common evaporation.Fig. 4 is the exemplary angle set between each heater block 10 and evaporation part 11 More than 90 °, less than 180 °, it is 90 ° that can also set the angle between each heater block 10 and evaporation part 11.
Optionally, evaporation part 11 can be set in cuboid, and evaporation outlet 111 can be set with rectangular.Such as Fig. 5 institutes Show, evaporation part 11 is set to rectangular shape, then evaporation outlet 111 is correspondingly arranged as rectangle.Optionally, edge as shown in Figure 5 Evaporate the exit direction (CC ' directions) of material 101, area of section of the evaporation part 11 perpendicular to the evaporation exit direction of material 101 Equal, exemplarily along the evaporation exit direction of material 101, evaporation part 11 described in any selection Fig. 5 goes out perpendicular to evaporation material Penetrate two sections in direction, its area of section S1=S2.
Optionally, as shown in Figure 6 and Figure 7, along the exit direction of evaporation material 101, evaporation part 11 is perpendicular to evaporation material The area of section of material exit direction can also be gradually reduced.As shown in fig. 6, evaporation part 11 can be in the shape of similar terrace with edge, And along evaporation material exit direction (CC ' directions), arbitrarily take and part 11 is deposited described in Fig. 6 perpendicular to evaporation material exit direction Two sections, its area of section S1>S2.Can also be as shown in fig. 7, evaporation part 11 be perpendicular to evaporation material exit direction (CC ' Direction) area of section be not continuously reduced, it is exemplary, evaporation part 11 along evaporation material exit direction can have The different section of two areas, and area of section S1>S2.Set along evaporation material exit direction, evaporation part 11 perpendicular to The area of section of evaporation material exit direction is gradually reduced, and is more beneficial for being deposited the limit of 11 pairs of evaporation material exit directions of part System, it is ensured that exit direction of the evaporation material in evaporation outlet 111 can be to the full extent perpendicular to substrate 12 to be deposited, further Improve shadow effect.
Fig. 1-Fig. 7 simply exemplarily sets the evaporation outlet 111 of evaporation part 11 is rectangular to set, and can also set steaming Plate part 11 to set in cylinder, evaporation outlet 111 is rounded to be set.As shown in figure 8, evaporation part 11 is set in cylinder, Evaporation outlet 111 is rounded to be set, and along the exit direction (CC ' directions) of evaporation material, evaporation part 11 is perpendicular to evaporation material Expect that the area of section of exit direction, exemplarily along evaporation material exit direction, can arbitrarily be taken and part is deposited described in Fig. 8 with equal 11 perpendicular to two sections of evaporation material exit direction, its area of section S1=S2.
Optionally, as shown in Figure 9 and Figure 10, along the exit direction of evaporation material, evaporation part 11 is perpendicular to evaporation material The area of section of exit direction can also be gradually reduced.As shown in figure 9, along evaporation material exit direction (CC ' directions), arbitrarily taking Part 11 is deposited described in Fig. 9 perpendicular to two sections of evaporation material exit direction, its area of section S1>S2.Can also be such as figure Shown in 10, evaporation part 11 is not continuously reduced perpendicular to the area of section of evaporation material exit direction, exemplary, evaporation Exit direction (CC ' direction) of the part 11 along evaporation material can have the different section of two areas, and area of section S1> S2.Likewise, the exit direction along evaporation material is set, area of section of the evaporation part 11 perpendicular to evaporation material exit direction It is gradually reduced, is more beneficial for being deposited the limitation of 11 pairs of evaporation material exit directions of part, it is ensured that evaporation material is in evaporation outlet 111 Exit direction can further improve shadow effect to the full extent perpendicular to substrate 12 to be deposited.
It should be noted that the present invention simply schematically illustrate evaporation part 11 evaporation outlet 111 it is rectangular or Circular situation, evaporation part 11 or evaporation outlet 111 can also be set in other shapes, and the embodiment of the present invention is not limited this It is fixed.Evaporation source in the embodiment of the present invention can be with linear evaporation source or point-like evaporation source, and the embodiment of the present invention is to this It is not construed as limiting.
Optionally, exemplified by part 11 is deposited shown in Fig. 5, the height along the exit direction evaporation part 11 of evaporation material is H, along the exit direction perpendicular to evaporation material, the minimum value of the length of side of the evaporation outlet 111 of rectangle is W, and W is square in Fig. 5 The length of side of the shorter edge of the evaporation outlet 111 of shape, can set H:W≥100:36.Specifically, as shown in figure 5, H and W pie graphs Shown in triangle two right-angle sides, then in the evaporation part 11 evaporate material exit direction, relative to the CC ' institutes in figure The maximum angle α for showing direction is approximately 20 °, and (tan20 ° is approximately equal to 36:100) outgoing of material, i.e., is evaporated in evaporation part 11 Direction, the angle relative to direction shown in the CC ' in figure is respectively less than equal to 20 °.I.e. by setting H:W≥100:36, it can make Part 11 must be deposited to the full extent to limit the exit direction for evaporating material, is in relative to evaporation material in the prior art Divergent shape outgoing, the exit direction of the evaporation material of evaporation source provided in an embodiment of the present invention can be similar to perpendicular to be deposited Plane where substrate, substantially improves shadow effect.
Part 11 then can also be deposited along the exit direction of evaporation material exemplified by the structure of part 11 is deposited shown in Fig. 8 Highly it is L, along the exit direction perpendicular to evaporation material, circular evaporation exports 111 a diameter of D, can set L:D≥ 100:36。
Optionally, referring to Fig. 1-Fig. 4, evaporation source can also include heating and thermal insulation part 13, and heating and thermal insulation part 13 is wrapped up The outer surface of heater block 10 and evaporation part 11, can make heater block 10 be more than evaporation material with the temperature in evaporation part 11 Material 101 gasification temperature, and keep the temperature at evaporation material 101 gasification temperature more than, prevent evaporation material 101 from Heater block 10 freezes during being moved to evaporation part 11, obstruction evaporation outlet 111.Further, heating and thermal insulation Part 13 can be such that heater block 10 is in the temperature in evaporation part 11 in the range of [50 DEG C -1000 DEG C].Exemplary, plus Hot heat preservation component 13 can include heater strip.Heater strip has with low cost, the characteristics of firing rate is fast, can reduce the application The manufacturing cost of evaporation source, improves evaporation efficiency.Because heating and thermal insulation part 13 can make heater block 10 and evaporation part 11 In temperature be more than evaporation material 101 gasification temperature, evaporation material 101 can add in the presence of heating and thermal insulation part 13 Presence in the form of a vapor in thermal part 10 and evaporation part 11, to realize evaporation function.
It should be noted that the gasification temperature of different evaporation materials 101 is different, the embodiment of the present invention is to evaporation material 101 Species be not construed as limiting, as long as ensureing that heating and thermal insulation part 13 can be more than the temperature in heater block 10 and evaporation part 11 Evaporate the gasification temperature of material 101.
Optionally, referring to Fig. 1-Fig. 4, evaporation material addition window member is also provided with each heater block 10 14, evaporation material addition window member 14 can be opened when changing or adding evaporation material 101, change or adding evaporation material Closed after material 101.Exemplary, evaporation material addition window member 14 can be arranged at each heater block 10 and evaporation part The relative side of 11 link positions, the replacing or addition of convenient evaporation material 101.Evaporation material addition window member 14 is set In the side relative with the evaporation link position of part 11 of heater block 10, without evaporation material addition window member 14 is set At link position of the heater block 10 with evaporation part 11, it is to avoid motion path from evaporation material 101 to evaporation outlet 111 It is upper poorly sealed defect occur.
Optionally, as is illustrated by figs. 11 and 12, evaporation source can be the evaporation material in linear evaporation source, heater block 10 101 are set along the bearing of trend of linear evaporation source, can by the way of shown in Figure 11, will evaporate material 101 continuously, edge The bearing of trend (DD ' directions) of linear evaporation source is set, it would however also be possible to employ the mode shown in Figure 12, along the extension of linear evaporation source Direction (DD ' directions), is positioned apart from evaporating material 101, makes to evaporate material 101 along linear evaporation source in heater block 10 Bearing of trend, which is set, can effectively improve the uniformity of film forming on substrate 12 to be deposited.
It should be noted that accompanying drawing of the embodiment of the present invention is the size for schematically illustrating each element, do not represent Actual size.
The embodiment of the present invention evaporates the heater block of material 101 by the way that evaporation part 11 is internally provided with least one 10 connections, set the evaporation outlet 111 of evaporation part 11 to be located at one relative with the link position of heater block 10 of evaporation part 11 End, and the angle between evaporation part 11 and each heater block 10 is more than or equal to 90 °, less than 180 °, relative to existing skill Make the directly outgoing after heating and gasifying in heater block 10 of evaporation material 101 in art, the embodiment of the present invention is in heater block 10 Evaporation material 101 gasify after, do not make directly the evaporation material 101 of gasification from heater block 10 outgoing for evaporation, But make evaporation material 101 be introduced into heater block 10 in [90 °, 180 °) angle connection evaporation part 11, utilize evaporation The exit direction of 11 pairs of evaporation materials 101 of part is limited, and sets evaporation material 101 to go out in the evaporation of evaporation part 11 The exit direction of mouth 111 so ensure that evaporation material 101 is passed through to the full extent perpendicular to the place plane of substrate 12 to be deposited Injection direction when crossing mask plate through hole reduces treated on substrate 12 to be deposited greatly perpendicular to the place plane of substrate 12 to be deposited The extension of material 101 is evaporated around film location, and then improves shadow effect, the display matter of organic electroluminescence device is improved Amount.
The embodiment of the present invention additionally provides the evaporation source in a kind of vacuum deposition apparatus, including above-mentioned any embodiment, also Evaporation chamber and substrate to be deposited can be included.Figure 13 it is exemplary a kind of structural representation of vacuum deposition apparatus is shown.Such as Shown in Figure 13, vacuum deposition apparatus includes evaporation chamber 15, substrate to be deposited 12 and evaporation source 16.When carrying out vacuum evaporation, Exemplary, evaporation source 16 can be linear evaporation source, then evaporation source 16 can along along Figure 13 EE ' directions, from evaporation substrate One end is moved to the other end of evaporation substrate, film layer needed for being formed on evaporation substrate, and required film can be formed by mask plate Layer.Exemplary, evaporation source 16 can also be point-like evaporation source, then the serpentine path movement that evaporation source 16 can be shown in FF ', And evaporation material is sprayed to being deposited on substrate, required film layer can be formed by mask plate.No matter evaporation source is point-like evaporation source Or linear evaporation source, ensure that exit direction of the evaporation material in evaporation outlet is put down where substrate to be deposited Face, improves shadow effect.
It should be noted that evaporation source 16 can also be deposited according to other mobile routes, the embodiment of the present invention pair Mobile route of the evaporation source 16 during evaporation is not construed as limiting, as long as ensureing that evaporation source 16 can precisely form required film layer i.e. Can, during evaporation, film uniformity can be improved into by setting speed and the path that evaporation source is moved.It is of the invention real Applying the vacuum deposition apparatus of example offer includes the evaporation source in above-described embodiment, therefore vacuum evaporation provided in an embodiment of the present invention Device also possesses the beneficial effect described in above-described embodiment, and here is omitted.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art it is various it is obvious change, Readjust, be combined with each other and substitute without departing from protection scope of the present invention.Therefore, although by above example to this Invention is described in further detail, but the present invention is not limited only to above example, is not departing from present inventive concept In the case of, other more equivalent embodiments can also be included, and the scope of the present invention is determined by scope of the appended claims.

Claims (14)

1. a kind of evaporation source, it is characterised in that including:
Evaporation material is provided with least one heater block, the heater block;
Part is deposited, the evaporation part is connected with the heater block, including evaporation outlet, positioned at the evaporation part and institute The relative one end of heater block link position is stated, the evaporation material is in the direction of the evaporation outlet outgoing perpendicular to be deposited Plane where substrate;
Angle between the evaporation part and each heater block is all higher than being equal to 90 °, and less than 180 °.
2. evaporation source according to claim 1, it is characterised in that the evaporation part is set in cuboid, the evaporation Outlet is rectangular to be set.
3. evaporation source according to claim 1, it is characterised in that the evaporation part is set in cylinder, the evaporation Outlet is rounded to be set.
4. evaporation source according to claim 1, it is characterised in that along the exit direction of the evaporation material, the evaporation Part is equal perpendicular to the area of section of the evaporation material exit direction.
5. evaporation source according to claim 1, it is characterised in that along the exit direction of the evaporation material, the evaporation Part is gradually reduced perpendicular to the area of section of the evaporation material exit direction.
6. evaporation source according to claim 2, it is characterised in that along steam plating part described in the exit direction of the evaporation material The height of part is H;Along the exit direction perpendicular to the evaporation material, the minimum value of the length of side of the evaporation outlet of rectangle is W, wherein H:W≥100:36.
7. evaporation source according to claim 3, it is characterised in that along steam plating part described in the exit direction of the evaporation material The height of part is L;Along the exit direction perpendicular to the evaporation material, a diameter of D, wherein L that the circular evaporation is exported: D≥100:36。
8. evaporation source according to claim 1, it is characterised in that also include:
Heating and thermal insulation part, the heating and thermal insulation part wraps up the outer surface of the heater block and the evaporation part, is used for The heater block is set to be more than the vapourizing temperature of the evaporation material with the temperature in the evaporation part.
9. evaporation source according to claim 8, it is characterised in that the heating and thermal insulation part is used to make the heater block It is in the temperature in the evaporation part in the range of [50 DEG C -1000 DEG C].
10. evaporation source according to claim 8, it is characterised in that the heating and thermal insulation part includes heater strip.
11. evaporation source according to claim 1, it is characterised in that be additionally provided with evaporation material on each heater block Material addition window member;The evaporation material addition window member is opened when changing or adding the evaporation material, is being changed Or closed after adding the evaporation material.
12. evaporation source according to claim 11, it is characterised in that the evaporation material addition window member is arranged at often The individual heater block side relative with the evaporation part link position.
13. evaporation source according to claim 1, it is characterised in that the evaporation source is linear evaporation source, the heating part Bearing of trend of the evaporation material along the linear evaporation source in part is set.
14. a kind of vacuum deposition apparatus, it is characterised in that including any evaporation sources of claim 1-13.
CN201710388172.4A 2017-05-27 2017-05-27 A kind of evaporation source and vacuum deposition apparatus Pending CN107012434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710388172.4A CN107012434A (en) 2017-05-27 2017-05-27 A kind of evaporation source and vacuum deposition apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710388172.4A CN107012434A (en) 2017-05-27 2017-05-27 A kind of evaporation source and vacuum deposition apparatus

Publications (1)

Publication Number Publication Date
CN107012434A true CN107012434A (en) 2017-08-04

Family

ID=59451543

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710388172.4A Pending CN107012434A (en) 2017-05-27 2017-05-27 A kind of evaporation source and vacuum deposition apparatus

Country Status (1)

Country Link
CN (1) CN107012434A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021378A (en) * 1983-07-15 1985-02-02 Nisshin Steel Co Ltd Vacuum deposition apparatus
CN1575349A (en) * 2001-10-26 2005-02-02 松下电工株式会社 Device and method for vacuum deposition, and organic electroluminescent element provided by the device and the method
CN101041891A (en) * 2006-03-22 2007-09-26 佳能株式会社 Vapor deposition source and vapor deposition apparatus
CN101111625A (en) * 2004-12-07 2008-01-23 阿顿公司 Device for vacuum deposition with recharging reservoir and corresponding vacuum deposition method
CN101845610A (en) * 2010-06-07 2010-09-29 崔铮 Continuous vertical hot evaporation metal film coating method
CN101892455A (en) * 2009-05-22 2010-11-24 三星移动显示器株式会社 Film deposition apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021378A (en) * 1983-07-15 1985-02-02 Nisshin Steel Co Ltd Vacuum deposition apparatus
CN1575349A (en) * 2001-10-26 2005-02-02 松下电工株式会社 Device and method for vacuum deposition, and organic electroluminescent element provided by the device and the method
CN101111625A (en) * 2004-12-07 2008-01-23 阿顿公司 Device for vacuum deposition with recharging reservoir and corresponding vacuum deposition method
CN101041891A (en) * 2006-03-22 2007-09-26 佳能株式会社 Vapor deposition source and vapor deposition apparatus
CN101892455A (en) * 2009-05-22 2010-11-24 三星移动显示器株式会社 Film deposition apparatus
CN101845610A (en) * 2010-06-07 2010-09-29 崔铮 Continuous vertical hot evaporation metal film coating method

Similar Documents

Publication Publication Date Title
JP5784779B2 (en) Single point linear evaporation source system
TWI495741B (en) Evaporation source assembly, thin film deposition apparatus and thin film deposition method
JP6513201B2 (en) Material deposition apparatus, vacuum deposition system, and material deposition method
EP1518940A1 (en) Thin film-forming apparatus
JP6657239B2 (en) Nozzle for dispensing assembly of material deposition source configuration, material deposition source configuration, vacuum deposition system, and method for depositing material
KR102260572B1 (en) Thin Film Deposition Apparatus with Multiple Evaporation Source
US20160201195A1 (en) Depositing apparatus
CN206916210U (en) Crucible, evaporation source and evaporated device
KR101961752B1 (en) Deposition Chamber Having Structure for Controlling Angle of Injection to Prevent Mask Shadow
TWI660057B (en) Material deposition arrangement, vacuum deposition system and method therefor
CN108048800A (en) Crucible and evaporated device is deposited
CN110592538B (en) Evaporation device, evaporation source and nozzle
KR102260617B1 (en) Thin Film Deposition Apparatus with Evaporation Source Installed Multi-Crucible
CN107012434A (en) A kind of evaporation source and vacuum deposition apparatus
CN107002223B (en) Material deposition system and method for the deposition materials in material deposition system
KR102319998B1 (en) Deposition source having volume changeable type crucible
CN206375995U (en) A kind of vacuum deposition apparatus
Hwang et al. 75‐2: Novel Plane Source FMM Evaporation Techniques for Manufacturing of 2250ppi flexible AMOLEDs
JPWO2017018314A1 (en) Vapor deposition source, vapor deposition apparatus and vapor deposition film manufacturing method
CN113463034B (en) Evaporation device and evaporation method
CN109844169A (en) Material deposition arrangement, vacuum deposition system and its method
KR102260575B1 (en) Thin Film Deposition Apparatus with Multiple Evaporation Source
CN207581906U (en) A kind of Pvd equipment
CN207749178U (en) A kind of OLED vapor depositions crucible
TW201925499A (en) Evaporation apparatus, evaporation method and control plate for forming an evaporation film with high film thickness uniformity and less shadow, and performing excellent evaporation even on a large substrate

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170804

RJ01 Rejection of invention patent application after publication