CN107011855A - Normal temperature cure sealant composition and preparation method thereof - Google Patents
Normal temperature cure sealant composition and preparation method thereof Download PDFInfo
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- CN107011855A CN107011855A CN201710311879.5A CN201710311879A CN107011855A CN 107011855 A CN107011855 A CN 107011855A CN 201710311879 A CN201710311879 A CN 201710311879A CN 107011855 A CN107011855 A CN 107011855A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Abstract
The present invention discloses a kind of normal temperature cure sealant composition and preparation method thereof, and normal temperature cure sealant composition is made up of epoxy resin, organic amine curing agent, organosilicon polymer, antioxidant, plasticizer, organic solvent.Compared with prior art, normal temperature cure sealant composition that the present invention is provided and preparation method thereof, sealant composition can be at room temperature, and in a low temperature of less than less than 25 DEG C even 0 DEG C, rapid deep zone solidifies, for equipment Semi-seal structure, normal ageing experiment can be carried out after the airtight test of quick high-pressure, solidification 24h can be carried out after solidification 10min~30min；For building joint sealing, can quickly it be sufficiently hardened at 10 DEG C, sealant layer pin, which is stepped on, to be recessed；With preferable intensity, good resistant of high or low temperature and weatherability, service life are long, low fogging in preparation process, environment-friendly environmental protection.
Description
Technical field
The present invention relates to/sealant composition field, more particularly to a kind of normal temperature cure sealant composition and its preparation
Method.
Background technology
Fluid sealant is to guide to deform with sealing surface shape, is difficult trickling, there is the encapsulant of certain caking property.Be for
Fill configuration gap, the adhesive to play sealing function.With the effect such as anti-leak, waterproof, vibration proof and sound insulation, heat-insulated,
The sealing of building, communications and transportation, electronic instrument and parts can be widely used in.
Fluid sealant for building is indispensable important auxiliary material in construction industry, in installing construction and decoration dress
In semi-annular jade pendant engineering, the function such as embodiment watertight, airtight is used for the bound fraction of various parts and the filling of seam.In order to adapt to
The effect of outside environmental elements, expands with heat and contract with cold and bends as caused by temperature change, and concrete construction and metal framework structure exist
Expansion joint is all designed with during building.Variator is the weak link of concrete construction, one be variator due to by wind-force,
The effect of shake, temperature and humidity change etc. produces deformation；Two are easily seeped water in seam, corrode construction material, it is therefore necessary to right
Variator is sealed.
It is mainly PUR for the encapsulant used in semitight product in new energy component or apparatus field, resistance to height
Low temperature and adhesive property are relatively poor, and with the development of China's new energy field, attention of the people to environmental protection, many countries are advocating
Energy-saving and emission-reduction are led, there is larger energy consumption during PUR use；And room temperature vulcanized silicone rubber has environment, resistance to height with PUR ratio
The premium properties such as gentle vibration damping, have a wide range of applications.
The defect of prior art：The current joint sealers for building generally used mainly has pitch, prefabricated neoprene rubber
Glue, polysulfide sealant and polyurethane material etc., these materials are poor due to durability, elasticity, water resistance and overall caking property, and
The good sealing effectiveness to building joint can not be played, so as to influence the service life of building；Room temperature vulcanized silicone rubber has
Deep cure slow defect excessively, needs enough finished products to store place, while in semi-closed structure bonding, bonding force needs to be carried
It is high.
The content of the invention
To solve above technical problem, the present invention provides normal temperature cure sealant composition and preparation method thereof, to solve
Quick to realize deep cure, elastic restoring force is good and tensile elongation height and good with free from corrosion problem to base material adhesive force.
The technical solution adopted by the present invention is as follows：A kind of normal temperature cure sealant composition, key is by following quality
The raw material composition of number：35-55 parts of epoxy resin, 30~50 parts of organic amine curing agent, 40~60 parts of organosilicon polymer, antioxygen
2~6 parts of agent, 2~6 parts of plasticizer, 3~8 parts of inorganic filler, 12-28 parts of organic solvent；
The organosilicon polymer is made up of the raw material of following mass fraction：
α, 50 parts of alpha, omega-dihydroxy polydimethyl siloxane, 8~15 parts of organosilicon cross-linking agent, 8~11 parts of silane coupler,
0.01~0.2 part of catalyst.
It is preferred that, the mass fraction of the raw material is：45 parts of epoxy resin, 40 parts of organic amine curing agent, polymerizable organosilicon
48 parts of thing, 3 parts of antioxidant, 3 parts of plasticizer, 5 parts of inorganic filler, 15 parts of organic solvent；Wherein organosilicon polymer by α, ω-
50 parts of dialkyl polydimethylsiloxane, 10 parts of organosilicon cross-linking agent, 0.08 part of composition of 9 parts of silane coupler and catalyst.
It is preferred that, the organosilicon polymer is obtained using following methods：Under normal temperature, by α, alpha, omega-dihydroxy polydimethyl
In siloxanes and inorganic filler, input stirred tank, 90-130 DEG C is warming up to, is stirred, removing system moisture is vacuumized, cooled down
Sizing is obtained to room temperature；Then the sizing, organosilicon cross-linking agent and silane coupler are dropped in scattered at a high speed
In mixer, 10~30min of mixing time, stir speed (S.S.) is 2000~3500r/min；It is subsequently added into catalyst, mixing time
30~50min, stir speed (S.S.) is 1500~2500r/min, vacuumizes de-bubbled, finally obtains organosilicon polymer.
It is preferred that, the epoxy resin is diglycidyl ether type epoxy resin, phenolic resin varnish type epoxy resin or shunk sweet
One or both of oily ester type epoxy resin.
It is preferred that, the organic amine curing agent is isophorone diamine, 1,3- bis- (4- piperidyls) propane, 2- ethyls -4-
One or both of methylimidazole thing mixed above.
It is preferred that, the organosilicon cross-linking agent is MTMS, tetrapropoxysilane, methoxyl group triethoxy
One or both of silane and thing mixed above；The silane coupler is N- (β-aminoethyl) -3- aminopropyl trimethoxies
One kind or two in silane, N- aminoethyl -3- aminopropyl triethoxysilanes, 3- (oxygen of 2,3- epoxies third) propyl trimethoxy silicane
Plant thing mixed above.
It is preferred that, the catalyst is in dialkyl tin dimaleate, two mercaptan tin alkyls or dibutyltin diacetate
One or more kinds of mixtures.
It is preferred that, the antioxidant is four [methylene -3- (3,5- di-t-butyl -4- hydroxy phenyls) propionic ester] first
Alkane, dilauryl -3, the double [3- (3,5- di-t-butyl -4- hydroxy phenyls) of 3 '-thiodipropionate, 2,2- thiodiethylenes
Propionic ester] in one kind or two kinds；The plasticizer is one in silicone oil with low viscosity, dihydric alcohol or two organic basic ring silicon ethers
Kind.
It is preferred that, the inorganic filler is one kind in calcium carbonate, talcum or aluminum oxide；Organic solvent is acetone, poly- second
One or both of glycol, petroleum ether or ethyl acetate thing mixed above.
A kind of preparation method of normal temperature cure sealant composition, key is to carry out according to the following steps：
Step 1: epoxy resin and 1/3~1/2 organic solvent are put into reactor, and mixing speed is controlled to be 100
Organic amine curing agent, is then dissolved in remaining organic solvent by~700rpm, then is added dropwise in reactor, by stirred tank plus
Heat stirs when being added dropwise to 60-70 DEG C, drips rear insulation reaction 15-30min, obtain mixture A；
It is uniformly dispersed Step 2: organosilicon polymer and inorganic filler are mixed, adds plasticizer under normal temperature while stirring,
Until forming homogeneous mixture B；
Step 3: being sufficiently mixed under the mixture B that will be obtained in the mixture A and step 2 that are obtained in step one, normal temperature
Afterwards, antioxidant is added while stirring, and further stir finished product.
Beneficial effect：Compared with prior art, normal temperature cure sealant composition that the present invention is provided and preparation method thereof,
Sealant composition can at room temperature, and including less than 25 DEG C even 0 DEG C it is following in a low temperature of, rapid deep zone solidification, use
Routine can be carried out after the airtight test of quick high-pressure, solidification 24h can be carried out after equipment Semi-seal structure, solidification 10min~30min
Senile experiment；For building joint sealing, can quickly it be sufficiently hardened at 10 DEG C, sealant layer pin, which is stepped on, to be recessed；It is simultaneous
Has the advantage of epoxy sealing glue and both silicone sealants, with higher mechanical strength and adhesion strength, while also improving glue
The resistant of high or low temperature and weatherability of body, storage stability extend low fogging in the storage period of fluid sealant, preparation process, environment friend
Good environmental protection.
Embodiment
To make those skilled in the art be better understood from technical scheme, with reference to subordinate list and specific embodiment party
Formula elaborates to the present invention.
First, a kind of normal temperature cure sealant composition
Embodiment 1：The configuration proportion of each raw material in normal temperature cure sealant composition
By each raw material in normal temperature cure sealant composition, the mass fraction as described in table 1 is mixed respectively, obtains 3 groups not
With normal temperature cure sealant composition I~III of mixed proportion.
The normal temperature cure sealant composition of the different mixing proportion of table 1 (mass fraction)
Embodiment 2：The preparation method of normal temperature cure sealant composition
Step 1: by 35 parts of diglycidyl ether type epoxy resin and 4 parts of input reactors of acetone, and control mixing speed
For 100rpm, then by 1,3- bis- (4- piperidyls) propane 30 parts be dissolved in remaining 8 parts of acetone, then be added dropwise to reactor
In, stirred tank is heated to 60 DEG C, is stirred when being added dropwise, is dripped rear insulation reaction 15min, obtain mixture A；
Step 2: under normal temperature, by α, 3 parts of 50 parts of alpha, omega-dihydroxy polydimethyl siloxane and calcium carbonate put into stirred tank
In, 90 DEG C are warming up to, is stirred, removing system moisture is vacuumized, is cooled to room temperature and obtains sizing；Then by the base
8 parts of plinth sizing material, 8 parts of MTMS and N- (β-aminoethyl) -3- aminopropyl trimethoxysilanes, which are dropped in, divides at a high speed
Dissipate in mixer, mixing time 10min, stir speed (S.S.) is 2000r/min；It is subsequently added into dialkyl tin dimaleate 0.01
Part, mixing time 30min, stir speed (S.S.) is 1500r/min, vacuumizes de-bubbled, obtains organosilicon polymer；
Step 3: by 40 parts of the organosilicon polymer obtained in the mixture A and step 2 that are obtained in step one, under normal temperature
After being sufficiently mixed, four [methylene -3- (3,5- di-t-butyl -4- hydroxy phenyls) propionic ester] methane 2 are separately added into while stirring
Part and two organic 2 parts of basic ring silicon ethers, further stir finished product.
Embodiment 3：The preparation method of normal temperature cure sealant composition
Step 1: by 55 parts of phenolic resin varnish type epoxy resin, 7 parts of input reactors of 7 parts of petroleum ether and ethyl acetate, and
Control mixing speed be 700rpm, then by isophorone diamine 50 parts be dissolved in remaining 7 parts of petroleum ethers and 7 parts of ethyl acetate
In, then be added dropwise in reactor, stirred tank is heated to 90 DEG C, is stirred when being added dropwise, is dripped rear insulation reaction 30min, obtain
To mixture A；
Step 2: under normal temperature, by α, 8 parts of 50 parts of alpha, omega-dihydroxy polydimethyl siloxane and talcum are put into stirred tank,
130 DEG C are warming up to, is stirred, removing system moisture is vacuumized, is cooled to room temperature and obtains sizing；Then by the basis
11 parts of sizing material, 15 parts of tetrapropoxysilane and N- aminoethyl -3- aminopropyl triethoxysilanes are dropped in high velocity dispersators
In, mixing time 30min, stir speed (S.S.) is 3500r/min；It is subsequently added into 0.2 part of two mercaptan tin alkyl, mixing time 50min,
Stir speed (S.S.) is 2500r/min, vacuumizes de-bubbled, obtains organosilicon polymer；
Step 3: by 60 parts of the organosilicon polymer obtained in the mixture A and step 2 that are obtained in step one, under normal temperature
After being sufficiently mixed, 6 parts of dilauryl -3,6 parts of 3 '-thiodipropionate and dihydric alcohol are separately added into while stirring, is further stirred
Mix uniform finished product.
Embodiment 4：The preparation method of normal temperature cure sealant composition
Step 1: by 45 parts of glycidyl ester type epoxy resin, 2 parts of input reactors of 3 parts of acetone and polyethylene glycol, and
Control mixing speed be 500rpm, then by 2-ethyl-4-methylimidazole 40 parts be dissolved in remaining 7 parts of acetone and 3 parts of poly- second
In glycol, then it is added dropwise in reactor, stirred tank is heated to 80 DEG C, is stirred when being added dropwise, drip rear insulation reaction
30min, obtains mixture A；
Step 2: under normal temperature, by α, 5 parts of 50 parts of alpha, omega-dihydroxy polydimethyl siloxane and aluminum oxide put into stirred tank
In, 100 DEG C are warming up to, is stirred, removing system moisture is vacuumized, is cooled to room temperature and obtains sizing；Then will be described
Sizing, 10 parts of methoxyl group triethoxysilane and 3- (oxygen of 2,3- epoxies third) 9 parts of propyl trimethoxy silicane are dropped in height
In fast dispersator, mixing time 30min, stir speed (S.S.) is 2500r/min；It is subsequently added into dibutyltin diacetate 0.08
Part, mixing time 50min, stir speed (S.S.) is 2500r/min, vacuumizes de-bubbled, obtains organosilicon polymer；
Step 3: by 48 parts of the organosilicon polymer obtained in the mixture A and step 2 that are obtained in step one, under normal temperature
After being sufficiently mixed, the double [3- (3,5- di-t-butyl -4- hydroxy phenyls) third of 2,2- thiodiethylenes are separately added into while stirring
Acid esters] 3 parts and 3 parts of silicone oil with low viscosity, further stir finished product.
The comparative example of embodiment 5
Equipment and operation be the same as Example 4, the difference is that trien is replaced into 2-ethyl-4-methylimidazole, other
Raw material and its consumption are constant, and resulting sealant composition code name is IV.
The comparative example of embodiment 6
Equipment and operation be the same as Example 4, the difference is that the consumption of organosilicon polymer is changed to 0, other raw materials and its use
Amount is constant, and resulting sealant composition code name is V.
2nd, the sealant composition for respectively preparing the various embodiments described above carries out performance test and comparison：
(1) method of testing
1st, the general condition of test
The environmental condition of test site
Standard state：23 ± 2 DEG C of temperature, relative humidity 60 ± 5%.
Off-rating：5-35 DEG C of temperature, relative humidity 45-85%.
2nd, sampling method
The sample of upper, middle and lower three is taken to be tested according to the position of kettle per kettle product.
3rd, test piece steel plate
Automobile cold-rolled calendering steel plate, is 25mm × 100mm × 0.1mm per chip size.
4th, key instrument device：WD-5 type electronic universal testers, hot blast constant temperature oven, is beaten constant temperature thermostat, balance
Glue device, tensile testing machine.
5th, the measure of curing rate
A devices：Glass plate (5mm × 200mm × 300mm), timer, polyethylene film (50mm × 25mm, 0.1mm),
Constant temperature thermostat, scraper.
B methods：Fluid sealant to be tested is applied on a glass, thick 5mm, width 6mm, long 50mm film is become and beats
Go out long 100mm, width 10mm, high 12mm triangle adhesive tape.Be placed under standard state, at the time of glue is got, every 5min
One polyethylene film is affixed on film, polyethylene film is peeled off along 180 degree direction, untill not gluing, this period is recorded
It is used as the table of the sealant composition solid time.After after 24h, another adhesive tape is cut with blade, cured layer thickness is measured with micrometer, should
Thickness is 24h curing rates (mm/24h).
C results：Horizontal survey 3 times, takes its arithmetic mean of instantaneous value.
6th, the measure of shear strength
A devices：Tensile testing machine, constant temperature thermostat, painted steel sheet and glass coupon.
B methods：
The making of test piece：Painted steel sheet 2 and glass coupon 1 are removed after surface dirt, degreasing is removed with cleaning agent.Respectively
Car body primer 3 and glass primer 4 are applied, rear (3~5min) to be dried fixes cushion block 5 with adhesive tape in painted steel sheet upper surface
(5mm thick), coats the fluid sealant 6 of slightly above cushion block, sheet glass is compressed from above, fixed with adhesive tape, extrusion it is unnecessary close
Sealing is wiped off with scraper.The test piece prepared is placed in constant temperature and humidity cabinet (23 ± 2 DEG C, 60 ± 5%RH), places 168h.
Determine：Taken out under standard state after test piece, tear adhesive tape, remove cushion block 5 and test fixture is fixed on puller system
Upper clamper on.The one end for gluing sample sheet glass is inserted in test fixture, painted steel sheet one end is clipped under puller system
On clamper.Painted steel sheet one end is clipped on the lower gripper of puller system.Determine sample shear under 50 ± 2mm/min draw speed
Cut peak load during damage.The length and width of shear surface are measured with slide calliper rule, 0.01mm is accurate to.
C results：5 samples of parallel testing, take its arithmetic mean of instantaneous value.
7th, the measure of hardness
A devices：Shore A durometer, glass plate.
B methods：Fluid sealant is applied on clean glass plate, the size for the film painted is 6mm × 50mm × 50mm.
168h is placed under standard state.Test piece is used as after being fully cured.Hardness is measured with Shore A durometer, each point point of measure is not away from
Less than 6mm, measurement point is not less than 10mm apart from sample edge.
C results：Take the arithmetic mean of instantaneous value of 5 measured values.
8th, tensile strength and the measure of elongation
A devices：Tensile testing machine, blanking die, cut-off knife (the dumb-bell shape cut-off knife for meeting 1 type in standard GB/T 528).
B methods：On glass plate (200mm × 300mm), fluid sealant is painted into the thick glued membranes of 2.0 ± 0.3mm, in standard
Under state, 168h is placed.It is cut into No. 1 dumb-bell shape cut-off knife and takes dumbbell-shaped test piece.
The position at dumbbell-shaped test piece center is measured with measurer, and marks vertical center line aa ', Zai center both sides apart
Vertical graticule bb ' and cc ' is drawn at each 10mm of center line, two clampers of tensile testing machine are clipped on normal line respectively.Open
Dynamic tensile testing machine, it is 500 ± 2mm/min to make translational speed.Load when sample extends one times is recorded, when sample is destroyed most
Big load and tensile elongation (test position must not have stomata).
C results：As a result the arithmetic mean of instantaneous value of 5 parallel samples is taken.
9th, the measure of tearing strength
A devices：Tensile testing machine, glass plate (200mm × 300mm), cut-off knife (meets nothing as defined in standard GB/T 530
Scarfing square style).
B methods：In coating the thick glued membranes of 2.0 ± 0.3mm on glass plate, 168h is placed in normal conditions.Test piece is used
Cut-off knife is cut into lambdoid test piece, accurately measures the thickness of right angle tip position, is accurate to 0.01mm.The clamp of tensile testing machine
Two ends are clamped, test piece, peak load when record is broken are broken with 500 ± 2mm/min draw speed.
C results：5 samples are determined, its arithmetic mean of instantaneous value is taken.The each measured value of sample and the difference of average value cannot be greater than
15%.
(2) test result
The performance test results contrast of each sealant composition of table 2
| Group | Composition I | Composition II | Composition III | Composition IV | Composition V |
| When table is solid (min) | 15 | 15 | 10 | 30 | 20 |
| Curing rate (mm/24h) | 6.5 | 6.7 | 8.2 | 4.4 | 5.8 |
| Elongation (%) | 505 | 430 | 530 | 480 | 510 |
| Tensile strength (MPa) | 13.5 | 12.9 | 15.7 | 8.3 | 11.6 |
| Shear strength (MPa) | 7.3 | 6.8 | 7.9 | 5.6 | 6.4 |
| Hardness (° A) | 60 | 61 | 61 | 56 | 59 |
| 100% stretching strength (MPa) | 2.8 | 2.4 | 3.4 | 2.9 | 3.1 |
| Tearing strength (N/mm) | 47.2 | 33.7 | 56.8 | 35.4 | 41.2 |
From the data of upper table, normal temperature cure sealant composition of the invention is not with accordingly added with organosilicon polymer
Modified composition is compared with the composition that epoxy resin cure is participated in primary amine, and performance has increased significantly；Composition
III is compared with composition IV, due to selecting the heterocycle organic amine for containing secondary amine as the curing agent of epoxy resin, so when table is solid
Between shorten to 10min from 30min, and curing rate is also to greatly improve, and the sealant composition of the present invention with not added with
The sealant composition that organosilicon polymer is modified is compared, and either performance such as curing rate, tensile strength, shear strength etc. is comprehensive
Performance is improved.With potential industrial application value, being bonded and sealed for auto parts and components and construction material can apply to.
Finally it is to be appreciated that foregoing description is only the preferred embodiments of the present invention, those skilled in the art is in the present invention
Enlightenment under, on the premise of without prejudice to present inventive concept and claim, expression as multiple types can be made, it is such to become
Change and each fall within protection scope of the present invention.
Claims (10)
1. a kind of normal temperature cure sealant composition, it is characterised in that be made up of the raw material of following mass fraction：Epoxy resin 35-
55 parts, 30~50 parts of organic amine curing agent, 40~60 parts of organosilicon polymer, 2~6 parts of antioxidant, 2~6 parts of plasticizer, have
12-28 parts of machine solvent；
The organosilicon polymer is made up of the raw material of following mass fraction：
α, it is 50 parts of alpha, omega-dihydroxy polydimethyl siloxane, 3~8 parts of inorganic filler, 8~15 parts of organosilicon cross-linking agent, silane coupled
8~11 parts of agent, 0.01~0.2 part of catalyst.
2. normal temperature cure sealant composition according to claim 1, it is characterised in that the mass fraction of the raw material is：
45 parts of epoxy resin, 40 parts of organic amine curing agent, 48 parts of organosilicon polymer, 3 parts of antioxidant, 3 parts of plasticizer, organic solvent
15 parts；Wherein organosilicon polymer is by α, 50 parts of alpha, omega-dihydroxy polydimethyl siloxane, 5 parts of inorganic filler, organosilicon cross-linking agent
10 parts, 0.08 part of composition of 9 parts of silane coupler and catalyst.
3. normal temperature cure sealant composition according to claim 1 or 2, it is characterised in that：The organosilicon polymer
Obtained using following methods：Under normal temperature, by α, alpha, omega-dihydroxy polydimethyl siloxane and inorganic filler are put into stirred tank, are risen
Temperature stirs to 90-130 DEG C, vacuumizes removing system moisture, be cooled to room temperature and obtain sizing；Then by the base
Plinth sizing material, organosilicon cross-linking agent and silane coupler are dropped in high velocity dispersators, 10~30min of mixing time, stirring
Speed is 2000~3500r/min；Catalyst, 30~50min of mixing time are subsequently added into, stir speed (S.S.) is 1500~2500r/
Min, vacuumizes de-bubbled, finally obtains organosilicon polymer.
4. normal temperature cure sealant composition according to claim 3, it is characterised in that：The epoxy resin is sweet to shrink
One or both of oily ether type epoxy, phenolic resin varnish type epoxy resin or glycidyl ester type epoxy resin.
5. normal temperature cure sealant composition according to claim 1, it is characterised in that：The organic amine curing agent is different
One or both of fluorine your ketone diamines, 1,3- bis- (4- piperidyls) propane, 2-ethyl-4-methylimidazole thing mixed above.
6. normal temperature cure sealant composition according to claim 1, it is characterised in that：The organosilicon cross-linking agent is first
One or both of base trimethoxy silane, tetrapropoxysilane, methoxyl group triethoxysilane and thing mixed above；It is described
Silane coupler be N- (β-aminoethyl) -3- aminopropyl trimethoxysilanes, N- aminoethyl -3- aminopropyl triethoxysilanes,
One or more kinds of mixtures in 3- (oxygen of 2,3- epoxies third) propyl trimethoxy silicane.
7. normal temperature cure sealant composition according to claim 1, it is characterised in that：The catalyst is dialkyl tin
One or both of dimaleate, two mercaptan tin alkyls or dibutyltin diacetate thing mixed above.
8. normal temperature cure sealant composition according to claim 1, it is characterised in that：The antioxidant is four [sub-
Methyl -3- (3,5- di-t-butyl -4- hydroxy phenyls) propionic ester] methane, dilauryl -3,3 '-thiodipropionate, 2,2-
One kind in thiodiethylene double [3- (3,5- di-t-butyl -4- hydroxy phenyls) propionic ester] or two kinds；The plasticizer
For silicone oil with low viscosity, one kind in dihydric alcohol or two organic basic ring silicon ethers.
9. normal temperature cure sealant composition according to claim 1, it is characterised in that：The inorganic filler is carbonic acid
One kind in calcium, talcum or aluminum oxide；Organic solvent is one kind or two in acetone, polyethylene glycol, petroleum ether or ethyl acetate
Plant thing mixed above.
10. the preparation method of the normal temperature cure sealant composition according to claim any one of 1-9, it is characterised in that press
Following steps are carried out：
Step 1: epoxy resin and 1/3~1/2 organic solvent are put into reactor, and control mixing speed for 100~
Organic amine curing agent, is then dissolved in remaining organic solvent by 700rpm, then is added dropwise in reactor, and stirred tank is heated
To 60-90 DEG C, stirred when being added dropwise, drip rear insulation reaction 15-30min, obtain mixture A；
Step 2: preparing organosilicon polymer；
Step 3: being sufficiently mixed under the organosilicon polymer that will be obtained in the mixture A and step 2 that are obtained in step one, normal temperature
Afterwards, antioxidant and plasticizer are separately added into while stirring, and further stir finished product.
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| CN111154412A (en) * | 2020-01-15 | 2020-05-15 | 江苏明昊新材料科技股份有限公司 | Quick-drying silicone adhesive material and preparation method thereof |
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2017
- 2017-05-05 CN CN201710311879.5A patent/CN107011855A/en not_active Withdrawn
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| CN109487637A (en) * | 2018-08-31 | 2019-03-19 | 重庆交通大学 | Track bed face waterproof layer expanded joint structure |
| CN109487638A (en) * | 2018-08-31 | 2019-03-19 | 重庆交通大学 | Railway ballastless track road bed waterproof layer expanded joint structure |
| CN109502206A (en) * | 2018-12-05 | 2019-03-22 | 江苏中矿大正表面工程技术有限公司 | A kind of oil storage tank margin plate sealant safeguard structure and technique |
| CN109810670A (en) * | 2019-01-30 | 2019-05-28 | 温州包鹿新材料有限公司 | A kind of bi-component fire prevention silicone sealant and preparation method thereof |
| CN109810670B (en) * | 2019-01-30 | 2022-02-01 | 江苏赛欧信越消泡剂有限公司 | Bi-component fireproof silicone sealant and preparation method thereof |
| CN109913165A (en) * | 2019-03-31 | 2019-06-21 | 詹志立 | A kind of bridge expanssion joint healant |
| CN110016320A (en) * | 2019-04-12 | 2019-07-16 | 西安科技大学 | A kind of porous material soft adhesive and its preparation method and application |
| CN110016320B (en) * | 2019-04-12 | 2021-05-04 | 西安科技大学 | Soft adhesive for porous material and preparation method and application thereof |
| CN110212467A (en) * | 2019-06-03 | 2019-09-06 | 伊斯特密封科技（江苏）有限公司 | A kind of fire-proof and explosion-proof cable seal of high leakproofness and preparation method thereof |
| CN111154412A (en) * | 2020-01-15 | 2020-05-15 | 江苏明昊新材料科技股份有限公司 | Quick-drying silicone adhesive material and preparation method thereof |
| CN112834299A (en) * | 2020-12-31 | 2021-05-25 | 中铁十八局集团有限公司 | Sealing material based on fly ash machine-made sand mortar impermeability test and use method thereof |
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Application publication date: 20170804 |