CN107008984A - Surface metallizing and brazing method used for electronic packaging composite - Google Patents

Surface metallizing and brazing method used for electronic packaging composite Download PDF

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CN107008984A
CN107008984A CN201710192150.0A CN201710192150A CN107008984A CN 107008984 A CN107008984 A CN 107008984A CN 201710192150 A CN201710192150 A CN 201710192150A CN 107008984 A CN107008984 A CN 107008984A
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composite
brazing
surface
plating
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CN201710192150.0A
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刘桂武
张相召
乔冠军
骆文强
刘磊
邵海成
徐紫巍
王明松
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江苏大学
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206Cleaning
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel

Abstract

The invention belongs to the technical field of welding, and relates to a surface metallizing and brazing method of a high-volume-fraction SiCp/Al composite. Through a reasonable process, a Ni-P-SiC composite coating is obtained, by adding SiC particles into the coating, the thermal expansion coefficient difference between a substrate and the coating can be effectively reduced, the binding force of the coating can be properly improved, and in addition, compared with the mode that nickel plating is only conducted on the upper surface of the SiCp/Al composite for welding, the brazing strength can be improved to a certain degree by adding the SiC particles into the coating. Low-melting glass brazing alloy (namely SnO-ZnO-P2O5 glass brazing alloy) and SiC ceramic have good wettability, the requirement for oxygen partial pressure of the welding condition is low when glass is used as brazing alloy, the brazing efficiency can be effectively improved, the cost is reduced, and thus, by combing surface metallizing with the brazing process, good brazing joints can be obtained and can meet the requirement for application in the electronic packaging field.

Description

一种用于电子封装复合材料的表面金属化及钎焊方法 A surface metallization and soldering method for electronic packaging of a composite material

技术领域 FIELD

[0001]本发明属于高体积分数SiCp/Al复合材料的焊接,涉及一种高体积分数^心/^复合材料的表面金属化及钎焊方法。 [0001] The present invention pertains to welding of high volume fraction SiCp / Al composites, relates to a high volume fraction heart ^ / ^ metallized surface and a brazing composite material.

背景技术 Background technique

[0002]闻体积分数SiCp/Al复合材料因具有筒热导、尚强度、良好的耐磨性及可调膨胀系数(CTE)等优点在汽车、航空航天、电子工业有着广泛的应用。 [0002] Wen volume fraction SiCp / Al composite tube by having thermal conductivity, yet strength, good wear resistance and an adjustable expansion coefficient (CTE), etc. in the automotive, aerospace, electronics industry has a wide range of applications. 尽管性能优异,但由于复合材料中高体积分数SiC颗粒和铝基体表面氧化膜的存在,严重阻碍了奸料在母材上的润湿和铺展,进而影响了基体材料的钎焊性能。 Despite the excellent performance, but because of the composite oxide film and the SiC particles of high volume fraction of the aluminum surface, a serious impediment rape material on a base material in wetting and spreading, thereby affecting the brazing properties of the matrix material.

[0003]针对这一问题,很多研究者选择在SiCp/Al复合材料表面进行化学镀镍,如中国专利ZL201110259096.X“一种铝碳化硅复合材料表面化学镀镍磷合金工艺”;如中国专利201510051866.X“一种高体积分数碳化硅颗粒增强铝基复合材料奸焊方法,,采用“—防卜24Cu-1 . 5Zn-lTi奸料在表面镀镍的SiCP/Al复合材料上做钎焊研究;中国专利ZL201010526125.X“一种钎焊铝碳化硅复合材料的中温奸料及制备和钎焊方法,,采用竑― Cu-Sn-Ni钎料薄带钎焊化学镀镍后的SiCP/Al复合材料和可伐合金进行奸焊;中国专利ZL201110415109_8“一种铝碳化硅复合材料可焊性化学镀镍的方法”化学镀镍的以仏/…复合材料表面使用普通铅锡焊料焊接氮化铝电子陶瓷基片。中国专利ZL201010520717.0“一种钎焊铝碳化硅复合材料的中温钎料及制备和钎焊方法”采用40A1-40.7Ag-19.3Cu共晶焊料焊接表面皆镀镍的A1N陶 [0003] To solve this problem, many researchers choose to chemically SiCp / Al composite surface nickel, such as China patent ZL201110259096.X "an aluminum-silicon carbide composite material surface chemical nickel-phosphorus alloy plating process"; Chinese Patent 201510051866.X "of a high volume fraction of silicon carbide particulate reinforced aluminum matrix composites rape welding method ,, a" - anti-Bu 24Cu-1 5Zn-lTi rape material on the surface of nickel plating SiCP do brazed / Al composite Study; Chinese Patent ZL201010526125.X "one kind of brazed aluminum-silicon carbide composite material prepared materials and rape temperature brazing method using Hong ,, - SiCP the Cu-Sn-Ni solder of the solder ribbon electroless nickel / Al Kovar and composites for solder rape; Chinese Patent ZL201110415109_8 "an aluminum-silicon carbide composite material, the weldability of the nickel plating chemistry" chemical nickel plating at Fo / ... composite surface using ordinary tin-lead solders aluminum nitride electronic ceramic substrate. Chinese patent ZL201010520717.0 "one kind of brazed aluminum silicon carbide composites prepared in temperature solder materials and soldering methods" 40A1-40.7Ag-19.3Cu using eutectic soldering surfaces are nickel-plated ceramic A1N 和SiC/Al复合材料。 And SiC / Al composites.

[0004]在焊接过程中,发现镀镍后可以改善钎料与基体材料的润湿与焊接性,但同时也出现了一些新的问题,基体与镀层的结合强度不够,特别是随着焊接温度的升高,由于基体与镀层热膨胀系数的差异导致镀镍层容易发生脱落而降低焊接强度。 [0004] During the welding process, we found that nickel can improve the wetting and weldability solder and base material, but also some new problems, binding strength of the matrix and the coating is not enough, especially as the welding temperature rises, due to differences in the coefficient of expansion of the substrate due to heat nickel plating layer readily falls off to reduce the weld strength. 本申请为了解决镀镍SiCP/Al复合材料焊接出现的这一问题,选择在镀镍层中引入一定量的SiC颗粒来制得复合镀层Ni-P-SiC,即可以有效的减小基体与镀层的热膨胀系数的差异,也可以增强镀层的结合力。 To solve this problem the present application nickel SiCP / Al composites welding appears, select introducing an amount of SiC particles in the nickel plating layer to produce composite coating Ni-P-SiC, which can effectively reduce the substrate and the coating the difference in thermal expansion coefficient, may also enhance coating adhesion.

[0005]此外在焊接过程中,用于SiCP/Al复合材料钎焊的钎料主要有A1基、Sn基、Ag基。 [0005] Further, in the soldering process, a solder SiCP / Al composite brazing main group A1, Sn group, Ag group. 根据上述中焊接专利,以及以下文献:文献“王鹏,徐冬霞,陈龙,牛济泰.高体积分数SiCp/ 6063A1复合材料真空钎焊工艺及润湿机理研宄•热加工工艺,2〇14,〇3:155_157”采用A1_ Si-Cu-Mg-Ni五元合金奸料对60% SiCP/6063Al复合材料进行真空钎焊;文献“高增,李清跃,赵祖良,牛济泰•高体积分数sicP/e〇63Ai复合材料与可伐合金的真空钎焊工艺研宄.热加工工艺,2015,17:189-191”采用采用Ag57 _ 6-Cu22 • 4-InlO-SnlO钎料,研究高体积分数SiCP/Al复合材料与可伐合金的真空钎焊工艺;文献“范晓杰,徐冬霞,牛济泰,王东斌,陈思杰_Sn-Ag-Cu-Bi无铅钎料对不同体积比SiCP/6063Al复合材料真空软钎焊接头组织和性能的影响.材料导报,2015,ie: 89_93”研宄Sn-Ag-Cu-Bi无铅钎料对不同体积比SiCp/6063Al 复n材料真空软奸焊接头组织和性能的影响。 According to the welding patents, and the following documents: document "Peng, Xudong Xia, Chen, bovine Jitai high volume fraction SiCp / 6063A1 composite vacuum brazing process and a Subsidiary dampening mechanism • thermal processing, 2〇14, square 3: 155_157 "using A1_ Si-Cu-Mg-Ni quinary alloys rape feed of 60% SiCP / 6063Al composites vacuum brazing; Document" high growth, Li Qingyue, Zhaozu Liang, bovine Jitai • a high volume fraction sicP / e〇63Ai Kovar composite and vacuum brazing process study based thermal processing, 2015,17: 189-191 "with use of Ag57 _ 6-Cu22 • 4-InlO-SnlO solder, high volume fraction SiCP / Al composite materials and Kovar vacuum brazing process; Document "Fanxiao Jie, Xudong Xia, cattle Jitai, Wangdong Bin, Chen Sijie _Sn-Ag-Cu-Bi lead-free solder of different consistency SiCP / 6063Al composite vacuum soldered joints organization and affect the performance of materials Review, 2015, ie:. 89_93 Effect "study based on Sn-Ag-Cu-Bi lead-free solder of different volumes and properties of complex tissues rape n soft material of the vacuum welding head ratio SiCp / 6063Al. 上述纤料与本申请相比,ai基奸料易氧化,Sn 基钎料焊接温度过低,Ag基钎料成本较高,具有较大的使用局限性。 Compared with the above-described fiber material of the present application, the oxidizable material AI group rape, Sn-based solder soldering temperature is too low, a higher cost Ag-based brazing material, having a greater use limitations.

[0006]总之,与本申请相比,上述钎焊工艺或钎料选择均可以实现高体积分数SiCP/Al复合材料的钎焊,但Ni层与基体之间热膨胀系数不匹配,界面结合力不牢等缺陷,焊后容易在界面处诱发裂纹,此外金属钎料的各种限制(焊接温度高、易氧化或成本较高等)都成为了限制此类方法应用的主要因素。 [0006] In conclusion, compared with the present application, the aforementioned brazing process or brazing material selection may be implemented brazing a high volume fraction SiCP / Al composites, but the thermal expansion coefficient between the Ni layer and the substrate does not match the interface bonding force is not firmly and other defects, after welding is likely to cause cracking at the interface, in addition to the limitations of metal solder (high temperature soldering, easily oxidized, or higher cost, etc.) have become a major factor limiting the application of such methods. 因此如何通过研发合适的玻璃钎料以及优化钎焊工艺,成为高体积分数SiCP/Al复合材料广泛应用的技术瓶颈。 Therefore, how by developing suitable glass solder and a brazing process optimization, a high volume fraction SiCP / Al composites widely bottleneck.

发明内容 SUMMARY

[0007]本发明在于提供了一种电子封装复合材料的表面金属化及钎焊方法,目的是提高高体积分数SiCp/Al复合材料钎焊接头性能,特别是接头的强度、耐腐蚀性等特性。 [0007] The present invention is to provide a surface metallization and soldering method for electronic packaging of a composite material, aimed at improving high volume fraction SiCp / Al Composite soldered joint material, in particular joint strength, corrosion resistance and other properties .

[0008]为了实现上述目的,本发明是采取如下技术方案予以实现的,一种用于电子封装复合材料的表面金属化及钎焊方法,其表面金属化的制备由如下步骤组成: [0008] To achieve the above object, the present invention adopt the following technical solution is to be implemented, a surfactant and a method for brazing a metallized composite material for electronic packaging, the preparation of the surface of the metal by the following steps:

[0009] 1、一种用于电子封装复合材料表面金属化方法,包括: [0009] 1. A method of metallizing the surface of a composite material for an electronic package, comprising:

[0010] (1)配制复合镀液:将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸以一定浓度配比混合均匀,然后加入一定量的SiC颗粒,配置成一定PH值的Ni-p-SiC镀液。 [0010] (1) Preparation of a composite plating solution: Commercially available nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactate at a concentration ratio of mixed uniformly, and then adding a certain amount of SiC particles, arranged Ni-p-SiC PH value of the bath constant.

[0011] (2)试样预处理:将高体积分数SiCP/Al复合材料进行除油、敏化、活化后用去离子水清洗。 [0011] (2) Sample pretreatment: high volume fraction SiCP / Al composites degreasing sensitizing, activation washed with deionized water.

[0012] (3)施镀:将步骤⑵中处理好的试样放入步骤⑴中配置好的复合镀液中,置于一定温度的磁力搅拌水浴锅中进行复合镀。 [0012] (3) plating: the step ⑵ sample is placed in the Handled in step ⑴ configured composite plating solution is placed in a constant temperature water bath with magnetic stirring composite plating.

[0013]上述的配制复合镀液,Ni -PS i C镀液中硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸的浓度分别为:25&/1、3(^/1、2(^/1、158几和3(^凡,5丨(:浓度为38/]^,附-?-3丨(:镀液的PH值为4-6。 [0013] The preparation of composite plating solution, Ni -PS i C bath nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactate concentrations were: 25 & amp; / 1,3 (^ / 1 , 2 (^ / 1,158 and several 3 (where ^, 5 Shu (:? concentration of 38 /] ^, attached - - 3 Shu (: 4-6 PH value of the bath.

[00M]上述的试样预处理,其中除油:丙酮,超声l〇min;敏化:50ml/L HCl+25g/L SnCl2 溶液中,15s,室温;活化:25ml/L HCl+0.25g/L PdCl2溶液中,20s,室温。 [00M] Sample pre-treatment described above, wherein the degreasing: acetone, ultrasonic l〇min; sensitizing: 50ml / L HCl + 25g / L SnCl2 solution, 15s, rt; activation: 25ml / L HCl + 0.25g / L PdCl2 solution, 20s, rt.

[0015]上述的施镀,其施镀温度为80-9(TC,施镀时间:15-60mim。 [0015] In the above plating, plating temperature which is 80-9 (TC, plating time: 15-60mim.

[0016]为了实现上述目的,本发明是采取如下技术方案予以实现的,一种用于电子封装复合材料的表面金属化及钎焊工艺,其钎焊工艺由如下步骤组成: [0016] To achieve the above object, the present invention adopt the following technical solution is to be implemented, and one surface metal brazing process of the composite material for electronic packaging, the brazing process which consists of the following steps:

[0017] (1)将经表面金属化的待焊接件置于无水乙醇中超声清洗15分钟。 [0017] (1) placing the surface of the metal member to be welded ultrasonically cleaned in ethanol for 15 min.

[0018] ⑵取市售的低熔Sn〇-Zn〇-P2〇5玻璃钎料,加上适量的有机粘结剂,充分搅拌后得到均匀膏剂。 [0018] ⑵ take-Sn〇 commercially available low-melting glass solder Zn〇-P2〇5, with the right amount of organic binder, followed by sufficient mixing to obtain a homogeneous paste.

[0019] (3)采用手工涂覆或丝网印刷的方法将膏状钎料均匀涂覆在清洗好的待焊接件上。 [0019] (3) by hand coating method or screen printing a paste-like brazing material to be uniformly coated on the cleaned weldment.

[0020] (4)将两个涂覆好的待焊接件表面相接触并对齐放入石墨模具中,并在两个涂覆好的待焊件上放置可施加一定压力的钢件。 [0020] (4) will be two good coated surface in contact and aligned with welding placed in a graphite mold, and can be a good place to be applied to a certain pressure on the steel weldment two coating.

[0021] (5)将装配好的石墨模具置于真空炉中真空(真空度SIX 10_2pa)或氩气保护下进行钎焊,以一定加热速度加热至一定温度,待保温一定时间后,以一定冷却速度降温至300 °C,然后随炉冷却至室温时开炉取样。 [0021] (5) The assembled mold was placed in a graphite vacuum furnace brazing under vacuum (degree of vacuum SIX 10_2pa) or argon atmosphere at a constant rate of heating to a certain temperature, until a certain incubation time, a constant cooling rate cooling to 300 ° C, then cooling with the furnace when the furnace in the sample to room temperature.

[0022]上述的适量的粘结剂为松油醇和乙基纤维素的复合溶液,其中松油醇为溶剂,且松油醇:乙基纤维素:低熔SnO-ZnO-P20s玻璃钎料的质量比为9:1:10。 [0022] The appropriate amount of the binder is ethyl cellulose in terpineol and complex solution, wherein the solvent is terpineol and terpineol: ethyl cellulose: a low-melting glass SnO-ZnO-P20s solder mass ratio of 9: 1: 10

[0023]上述的一定压力为3-10kPa。 [0023] The constant pressure 3-10kPa. . L〇〇24」上述的升温速度为5-10°C/min,钎焊温度为5〇〇_6〇〇。 L〇〇24 "above a heating rate of 5-10 ° C / min, the brazing temperature is 5〇〇_6〇〇. (:,保温时间为l〇-30min,冷却速度为3-5 °C/min。 (:, L〇 holding time-30min, cooling rate is 3-5 ° C / min.

[0025]本申请主要通过高体积分数SiCP/Al复合材料表面金属化及采用中温玻璃钎料利用真空保护钎焊复合材料。 [0025] The present application by bonding the composite material of high volume fraction SiCP / Al metallization and medium-temperature glass solder surface of the composite material protected by vacuum brazing. 通过对高体积分数SiCP/Al复合材料表面金属化,提高玻璃钎料对复合材料的润湿性能,通过向金属化镀层中加入适量SiC颗粒,可以有效的减小基体与镀层的热膨胀系数差,适当的提升镀层的结合力。 Adoption of the addition of an appropriate amount of SiC particles to the metallization layer can effectively reduce the base body and the coating thermal expansion coefficient difference of the high volume fraction SiCP / Al composite surface metalized to increase the glass solder wettability of the composite material, appropriate to enhance the coating adhesion. 为保证获得良好的钎焊接头,在钎焊过程, 待焊接件需要施加一定的压力,同时焊接气氛需要为真空或氩气保护。 In order to ensure good brazed joint, the brazing process, members to be welded need to apply some pressure, while the welding conditions need to be protected by a vacuum or argon.

[0026]与现有技术相比,本发明具有以下优点:(1)通过合理的工艺制得复合镀层Ni_P— SiC,通过向镀层中添加SiC颗粒,即可以有效减小基体与镀层之间的热膨胀系数差异,还可以适当的提升镀层的结合力,此外,相对仅在SiCP/Al复合材料上表面镀镍进行焊接,镀层中添加SiC颗粒可以一定程度上提高钎焊强度。 [0026] Compared with the prior art, the present invention has the following advantages: (1) a process to obtain reasonable composite coating Ni_P- SiC, SiC particles by adding to the coating, which can effectively reduce the coating between the substrate and thermal expansion coefficient difference, may also be appropriate to enhance the coating adhesion, in addition, only the opposite surface of welding nickel plating on SiCP / Al composites, SiC particles added to the coating can be enhanced brazing strength to some extent. (¾相对几种传统金属基钎料而言,低熔玻璃钎料(SnO-ZnO-PsO5玻璃钎料)与SiC陶瓷有较好的润湿性,玻璃用作钎料对焊接条件中氧分压的要求较低,可有效的提高奸焊效率,降低成本,因此将表面金属化和此钎焊工艺相结合,可取得良好的钎焊接头,满足电子封装领域的应用。 (¾ relative several traditional metal-based solder, the low-melting glass solder (SnO-ZnO-PsO5 solder glass) and SiC ceramic has good wettability on a glass is used as the solder welding conditions Oxygen lower required pressure, can effectively improve rape welding efficiency, reduce costs, thus combining this surface metallization and soldering processes, can achieve good soldered joints meet the application field of electronic packaging.

附图说明 BRIEF DESCRIPTION

[0027]图1为高体积分数SiCP/Al复合材料表面Ni-P-SiC镀层SM图。 [0027] FIG. 1 is a high volume fraction SiCP / Al composite surface Ni-P-SiC plating SM FIG.

[0028]图2为高体积分数SiCP/Al复合材料表面Ni-P-SiC镀层横截面SEM图,说明SiC陶瓷均勾分布于镀层之中。 [0028] FIG. 2 is a high volume fraction SiCP / Al composite surface coating Ni-P-SiC SEM cross-sectional diagram illustrating the SiC ceramic coating are distributed in the hook.

[0029]图3为SiC浓度3g/L时复合镀层的刮擦形貌及对应声信号图,复合镀层刮擦试验后的形貌及对应声信号强度,说明复合镀层与SiCp/Al复合材料具有良好的结合性能。 Scraper morphology [0029] FIG. 3 is a SiC concentration of 3g / L when the composite coating and crashed to FIG signal, the morphology of the composite coating to the scratch test and crashed signal strength, and composite coatings described SiCp / Al composite material having good bonding properties.

具体实施方式 Detailed ways

[0030] 下面结合具体实施例对本发明做进一步的阐述。 [0030] The following specific examples further elaborated in conjunction with the present invention. 本发明所述的一种用于电子封装复合材料的表面金属化步骤包括: Surface metallization of an electronic packaging step for the composite material of the present invention comprises:

[0031] (1)配制复合镀液:将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸以一定浓度配比混合均匀,然后加入SiC颗粒,配置成一定PH值的Ni-P-SiC镀液。 [0031] (1) Preparation of a composite plating solution: Commercially available nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactate at a concentration ratio of mixed uniformly, followed by addition of SiC particles, arranged at a certain PH value the Ni-P-SiC plating solution.

[0032] (2)试样预处理:将高体积分数SiCP/Al复合材料进行除油、敏化、活化后用去离子水清洗。 [0032] (2) Sample pretreatment: high volume fraction SiCP / Al composites degreasing sensitizing, activation washed with deionized water.

[0033] (3)施镀:将(2)中处理好的试样放入⑴中配置好的复合镀液中,置于一定温度的磁力搅拌水浴锅中进行复合镀。 [0033] (3) plating: A (2) treated sample was placed in good ⑴ configured in the composite plating solution is placed in a constant temperature water bath with magnetic stirring composite plating.

[0034] 本发明所述的配制复合镀液,Ni -PS i C镀液中硫酸镍、次亚磷酸钠、柠檬酸三钠、 乙酸钠和乳酸的浓度分别为:258/1、3(^/1、2(^/1、158/1和3(^/1^1(:浓度38/1,复合镀液PH为4-6。 [0034] The formulation of the composite plating solution of the present invention, Ni -PS i C bath nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactate concentrations were: 258/3 (^ / 2 (^ / 1,158 / 1 and 3 (^ / 1 ^ 1 (: 38/1 concentration, the composite plating solution to PH 4-6.

[0035] 本发明所述的试样预处理,其中除油:丙酮,超声lOmin;敏化:50ml/L HCl+25g/L SnCl2溶液中,15s,室温;活化:25ml/L HCl+0.25g/L PdCl2溶液中,20s,室温。 [0035] The sample pre-treatment according to the present invention, wherein degreasing: acetone, ultrasonic lOmin; sensitizing: 50ml / L HCl + 25g / L SnCl2 solution, 15s, rt; activation: 25ml / L HCl + 0.25g / L PdCl2 solution, 20s, rt.

[0036] 本发明所述的施镀,其施锻温度为80-90°C,施镀时间:l5_6〇mim。 [0036] The plating of the present invention, which is applied to forging temperature of 80-90 ° C, plating time: l5_6〇mim.

[0037] 本发明所述的一种用于电子封装复合材料的钎焊工艺包括: [0037] An electronic package brazing process for a composite material according to the present invention comprises:

[0038] (1)将经表面金属化的待焊接件置于无水乙醇中超声清洗15分钟。 [0038] (1) placing the surface of the metal member to be welded ultrasonically cleaned in ethanol for 15 min.

[0039] ⑵取市售的低熔Sn〇-Zn〇-P2〇5玻璃钎料,加上适量的有机粘结剂,充分搅拌后得到均勾膏剂。 [0039] ⑵ take-Sn〇 commercially available low-melting glass solder Zn〇-P2〇5, with the right amount of organic binder, followed by sufficient mixing to obtain a paste-average hook.

[0040] (3)米用手工涂覆或丝网印刷的方法将霄状钎料均勻涂覆在清洗好的待焊接件上。 [0040] (3) meters by hand coating or screen printing method to form a solder Xiao uniform coating on the weld to be cleaned.

[0041] (4)将两个涂覆好的待焊接件表面相接触并对齐放入石墨模具中,并在两个涂覆好的待焊件上放置可施加一定压力的钢件。 [0041] (4) will be two good coated surface in contact and aligned with welding placed in a graphite mold, and can be a good place to be applied to a certain pressure on the steel weldment two coating.

[0042] ⑸将装配好的石墨模具置于真空炉中真空(真空度Q x 10_2Pa)或氩气保护下进行钎焊,以一定加热速度加热至一定温度,待保温一定时间后,以一定冷却速度降温至3〇〇°C,然后随炉冷却至室温时开炉取样。 [0042] ⑸ the assembled mold was placed in a graphite vacuum furnace brazing under vacuum (degree of vacuum of Q x 10_2Pa) or an argon atmosphere, heated at a constant heating rate to a temperature, holding until a certain time, at a constant cooling speed cooling to 3〇〇 ° C, then cooling with the furnace when the furnace in the sample to room temperature.

[0043 ]本发明所述的适量的粘结剂为松油醇+乙基纤维素溶液,其中松油醇为溶剂,且松油醇:乙基纤维素:低熔Sn〇-Zn〇-P2〇5玻璃钎料=9g: lg: l〇g,施加一定压力为3-10kPa,升温速度为5-l〇°C/min,钎焊温度为500_6〇0°C,保温时间为10-30min,冷却速度为3-5°C/min。 [0043] The amount of the binder of the present invention terpineol + ethyl cellulose solution, wherein the solvent is terpineol and terpineol: ethyl cellulose: Sn〇 low-melting-P2 Zn〇 〇5 glass solder = 9g: lg: l〇g, applying a certain pressure 3-10kPa, heating rate 5- l〇 ° C / min, the brazing temperature is 500_6〇0 ° C, holding time 10-30min The cooling rate of 3-5 ° C / min. [0044] 实施案例1 [0044] Embodiment 1 Case

[0045] (1)将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸分别以25g/L、30g/ L、20g/L、15g/L和30g/L浓度混合均匀,然后加入3g/L的SiC颗粒,配置成PH为4的Ni-P-SiC 镀液。 [0045] (1) Commercially available nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactic acid respectively 25g / L, 30g / L, 20g / L, 15g / L and 30g / L concentration of the mixture homogeneous and then added to 3g / L of SiC particles, configured to PH plating Ni-P-SiC 4.

[0046] ⑵将高体积分数SiCP/Al复合材料先经丙酮超生除油后,置于5〇ral/L HCl+25g/L SnCl2溶液中敏化,然后在放与25ml/L HCl+0.25g/L PdCl2溶液中活化,用去离子水冲洗干净置于(1)中配置好的复合镀液中。 [0046] ⑵ high volume fraction SiCP / Al composites bounce back after first degreasing with acetone, placed 5〇ral / L HCl + 25g / L SnCl2 sensitizing solution, and then put 25ml / L HCl + 0.25g / L PdCl2 activation solution, rinsed with deionized water was placed in (1) configured composite plating solution. 最后置于磁力搅拌水浴锅中进行复合镀,调节温度为80 °C,施镀时间为60min。 Finally water bath placed on a magnetic stirring composite plating, adjusting the temperature to 80 ° C, plating time of 60min.

[OO47] (3)取市售的低熔SnO-ZnO-P2〇5玻璃钎料,加上适量的松油醇+乙基纤维素溶液(松油醇:乙基纤维素:低熔SnO-ZnO-PsOs玻璃钎料= 9g:lg:l〇g),充分搅拌后得到均匀膏剂。 [OO47] (3) to take a commercially available low-melting glass SnO-ZnO-P2〇5 brazing material, with the right amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: Low melting SnO- ZnO-psOs glass solder = 9g: lg: l〇g), followed by sufficient mixing to obtain a homogeneous paste. 用手工涂覆或丝网印刷方法将膏剂覆盖在金属化处理的高体积分数SiCp/Al复合材料表面上。 By hand coating method or a screen printing the paste covering the metallized high volume fraction SiCp / Al composite surface.

[0048] (4)将涂覆完成的带焊接件表面相接触并对齐放入石墨模具中,并在待连接试样上放置施加10kPa压力的钢件;将装配好的石墨模具置于真空炉(真空度彡丨x 1(r2Pa)或氩气保护下进行钎焊,以10°C/min加热400°C,再以5°C/min加热至53(TC,保温30min后,以5 °C/min的冷却速度至400°C,再以3°C/min的冷却速度至300。(:,然后随炉冷却至室温时开炉取样。 [0048] (4) finished with solder coated contact surface aligned and placed in a graphite mold and steel is placed to be connected 10kPa pressure exerted on the sample; the assembled mold was placed in a graphite vacuum furnace (degree of vacuum Sanshu x 1 (r2Pa) or under an argon atmosphere brazing, at 10 ° C / min heating 400 ° C, reheated to 53 (TC, after incubation 30min, to 5 ° in 5 ° C / min cooling rate C / min to 400 ° C, and then at a cooling rate of 3 ° C / min to 300. (:), and then cool with the furnace when the furnace in the sample to room temperature.

[0049] 实施案例2 [0049] Embodiment 2 Case

[0050] (1)将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸分别以25g/L、30g/ 1、2(^/1、158凡和3(^/1浓度混合均匀,然后加入38/1的51(:颗粒,配置成?11为4的附-?-3比镀液。 [0050] (1) Commercially available nickel sulfate, sodium hypophosphite, trisodium citrate, sodium acetate and lactic acid respectively 25g / L, 30g / 1,2 (^ / 1,158 and 3 where (^ / a mixed concentration, followed by addition of 51 38/1 (: particle, 11 is configured to be attached to the 4 - - 3 bath ratio??.

[0051] ⑵将高体积分数SiCP/Al复合材料先经丙酮超生除油后,置于50ml/L HCl+25g/L SnCh溶液中敏化,然后在放与25ml/L HCl+0.25g/L PdCh溶液中活化,用去离子水冲洗干净置于⑴中配置好的复合镀液中。 [0051] ⑵ high volume fraction SiCP / Al composites bounce back after first degreasing with acetone, placed in 50ml / L HCl + 25g / L SnCh sensitizing solution, and then put 25ml / L HCl + 0.25g / L PdCh activated solution, rinsed with deionized water was placed ⑴ configured in the composite plating solution. 最后置于磁力搅拌水浴锅中进行复合镀,调节温度为90 °C,施镀时间为30m in。 Finally water bath placed on a magnetic stirring composite plating, adjusting the temperature to 90 ° C, plating time was 30m in.

[0052] ⑶取市售的低熔SnO-ZnO-P2〇5玻璃钎料,加上适量的松油醇+乙基纤维素溶液(松油醇:乙基纤维素:低恪Sn〇-Zn〇-P2〇5玻璃钎料= 9g: lg: 10g),充分搅拌后得到均勾膏剂。 [0052] ⑶ taken commercially available low-melting glass SnO-ZnO-P2〇5 brazing material, with the right amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: Low-Zn Verified Sn〇 square glass solder-P2〇5 = 9g: lg: 10g), followed by sufficient mixing to obtain a paste-average hook. 用于丄徐復现这卩刷万法将霄剂覆盖在金属化处理的高体积分数Sicp/A1复合材料表面上。 Xu Shang for reproducing this methodology the brush Xiao Jie agent coated on a high volume fraction Sicp / A1 composite surface metallized.

[0053] (4)将涂覆完成的带焊接件表面相接触并对齐放入石墨模具中,并在待连接试样上放置施加5kPa压力的钢件;将装配好的石墨模具置于真空炉(真空度^丨x 1〇-2Pa)或氩气保护下进行钎焊,以KTC/min加热4〇(TC,再以5tVmin加热至50(TC,保温15min后,以5-C/ min的冷却速度至400°C,再以3°C/min的冷却速度至300。(:,然后随炉冷却至室温时开炉取样。 [0053] (4) finished with solder coated contact surface aligned and placed in a graphite mold and steel is placed to be connected 5kPa pressure exerted on the sample; the assembled mold was placed in a graphite vacuum furnace (degree of vacuum 1〇 x ^ Shu-2Pa) under argon or brazed to KTC / min heating 4〇 (the TC, then to 5tVmin was heated to 50 (TC, after incubation 15min, to 5-C / min to cooling rate to 400 ° C, and then at a cooling rate of 3 ° C / min to 300. (:), and then cool with the furnace when the furnace in the sample to room temperature.

[0054] 实施案例3 [0054] Embodiment 3 Case

[0055] (1)将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸分别以25g/L、3〇g/ 1、2(^凡、158凡和3(^几浓度混合均匀,然后加入38几的8:[(:颗粒,配置成1}11为6的附—{)—31(: 镀液。 [0055] (1) Commercially available nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactic acid respectively 25g / L, 3〇g / 2 (where ^, 158 3, and where (^ mixed several concentrations, 38 8, was then added a few: [(: particles 1} 11 is configured to attach the 6 - {) - 31 (: bath.

[0056]⑵将高体积分数SiCp/Al复合材料先经丙酮超生除油后,置于50ml/L HCl+25g/L SnCh溶液中敏化,然后在放与25ml/L HCl+0_25g/L PdCh溶液中活化,用去离子水冲洗干净置于⑴中配置好的复合镀液中。 [0056] ⑵ high volume fraction SiCp / Al composites bounce back after first degreasing with acetone, placed in 50ml / L HCl + 25g / L SnCh sensitizing solution, and then put 25ml / L HCl + 0_25g / L PdCh activation solution, rinsed with deionized water was placed ⑴ configured in the composite plating solution. 最后置于磁力搅拌水浴锅中进行复合镀,调节温度为9〇°C,施镀时间为15min。 Finally water bath placed on a magnetic stirring composite plating, adjusting the temperature of 9〇 ° C, plating time of 15min.

[0057] (3)取市售的低熔Sn〇-Zn〇-P2〇5玻璃钎料,加上适量的松油醇+乙基纤维素溶液(松油醇:乙基纤维素:低溶SnO-Zn〇-P2〇5玻璃钎料= 9g: lg: 10g),充分搅拌后得到均匀膏剂。 [0057] (3) a commercially available low-melting Sn〇 take-Zn〇-P2〇5 glass solder, with the right amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: low melting Zn〇 of SnO-glass-solder P2〇5 = 9g: lg: 10g), followed by sufficient mixing to obtain a homogeneous paste. 用手工涂覆或丝网印刷方法将膏剂覆盖在金属化处理的高体积分数SiCp/A1复合材料表面上。 By hand coating or screen printing the paste coated on a high volume fraction SiCp / A1 composite surface metallized.

[0058] (4)将涂覆完成的带焊接件表面相接触并对齐放入石墨模具中,并在待连接试样上放置施加3kPa压力的钢件;将装配好的石墨模具置于真空炉(真空度彡丨x 10-2Pa)或氧气保护下进行钎焊,以10°C/min加热40CTC,再以5°C/min加热至580°C,保温30min后,以5IV min的冷却速度至400°C,再以:TC/min的冷却速度至300。 [0058] (4) finished with solder coated contact surface aligned and placed in a graphite mold and steel is placed to be connected 3kPa pressure exerted on the sample; the assembled mold was placed in a graphite vacuum furnace carried out (vacuum Sanshu x 10-2Pa) protected brazing or oxygen, to 10 ° C / min heating 40CTC, reheated to 580 ° C at 5 ° C / min, after incubation 30min, at a cooling rate of 5IV min to 400 ° C, then to: a cooling rate of TC / min to 300. (:,然后随炉冷却至室温时开炉取样。 (:, Sample and then open the furnace when the furnace was cooled to room temperature.

[0059] 实施案例4 [0059] Embodiment 4 Case

[0060] (1)将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸分别以25g/L、30g/ L、20g/L、15g/L和30g/L浓度混合均匀,然后加入3g/L的SiC颗粒,配置成PH为6的Ni-P-SiC 镀液。 [0060] (1) Commercially available nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactic acid respectively 25g / L, 30g / L, 20g / L, 15g / L and 30g / L concentration of the mixture homogeneous and then added to 3g / L of SiC particles, configured to PH plating Ni-P-SiC 6.

[0061]⑵将高体积分数SiCp/Al复合材料先经丙酮超生除油后,置于50ml/L HC1+25g/L SnCh溶液中敏化,然后在放与25ml/L HC1+0• 25g/L PdCh溶液中活化,用去离子水冲洗干净置于⑴中配置好的复合镀液中。 [0061] ⑵ high volume fraction SiCp / Al composites bounce back after first degreasing with acetone, placed in 50ml / L HC1 + 25g / L SnCh sensitizing solution, and then put 25ml / L HC1 + 0 • 25g / It was activated L PdCh, rinsed with deionized water was placed ⑴ configured in the composite plating solution. 最后置于磁力搅拌水浴锅中进行复合镀,调节温度为85 °C,施镀时间为40min。 Finally water bath placed on a magnetic stirring composite plating, adjusting the temperature to 85 ° C, plating time of 40min.

[0062]⑶取市售的低熔SnO-ZnO-PA玻璃钎料,加上适量的松油醇+乙基纤维素溶液(松油醇:乙基纤维素:低熔Sn〇-Zn〇-P2〇5玻璃钎料=Qg: lg: l〇g),充分搅拌后得到均匀膏剂。 [0062] ⑶ taken commercially available low-melting glass SnO-ZnO-PA brazing material, with the right amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: a low-melting-Zn〇- Sn〇 P2〇5 glass solder = Qg: lg: l〇g), followed by sufficient mixing to obtain a homogeneous paste. 用手工涂覆或丝网印刷方法将膏剂覆盖在金属化处理的高体积分数SiCp/A1复合材料表面上。 By hand coating or screen printing the paste coated on a high volume fraction SiCp / A1 composite surface metallized.

[0063] (4)将涂覆完成的带焊接件表面相接触并对齐放入石墨模具中,并在待连接试样上放置施加WkPa压力的钢件;将装配好的石墨模具置于真空炉(真空度彡丨x 1〇_2Pa)或氩气保护下进行钎焊,以l〇°C/min加热40(TC,再以5XVmin加热至60(TC,保温10min后,以5 °C/min的冷却速度至400 °C,再以3°C/min的冷却速度至3001:,然后随炉冷却至室温时开炉取样。 [0063] (4) finished with solder coated contact surface aligned and placed in a graphite mold and steel is placed to be connected to the pressure exerted on the sample WkPa; the assembled mold was placed in a graphite vacuum furnace brazing (vacuum degree Sanshu 1〇_2Pa x) or an argon atmosphere, to l〇 ° C / min heating 40 (TC, then to 5XVmin heated to 60 (TC, incubated 10min, to 5 ° C / min cooling rate to 400 ° C, and then at a cooling rate of 3 ° C / min to 3001 :, and then cool with the furnace when the furnace in the sample to room temperature.

[0064]实施案例5 [0064] Embodiment 5 Case

[0065] (1)将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸分别以25g/L、30g/ 匕、2(^几、158几和3(^几浓度混合均匀,然后加入3§几的3;[(:颗粒,配置成?11为5的附-?-5:^ 镀液。 [0065] (1) Commercially available nickel sulfate, sodium hypophosphite, sodium citrate, sodium acetate and lactic acid respectively 25g / L, 30g / dagger, (2 ^ several concentrations (^ a few, several, and 3 158 mixed, 3§ 3 was then added a few; [(: particle, 11 is configured to be attached to the 5 - - 5: bath ^??.

[0066] (2)将高体积分数SiCP/Al复合材料先经丙酮超生除油后,置于50ml/L HC1+25g/L SnCh溶液中敏化,然后在放与25ml/L HCl+0.25g/L PdCl2溶液中活化,用去离子水冲洗干净置于(1)中配置好的复合镀液中。 [0066] (2) the high volume fraction SiCP / Al composites bounce back after first degreasing with acetone, placed in 50ml / L HC1 + 25g / L SnCh sensitizing solution, and then put 25ml / L HCl + 0.25g / L PdCl2 activation solution, rinsed with deionized water was placed in (1) configured composite plating solution. 最后置于磁力搅拌水浴锅中进行复合镀,调节温度为80 °C,施镀时间为15min。 Finally water bath placed on a magnetic stirring composite plating, adjusting the temperature to 80 ° C, plating time of 15min.

[0067] (3)取市售的低熔SnO-Zn〇-P2〇5玻璃钎料,加上适量的松油醇+乙基纤维素溶液(松油醇:乙基纤维素:低熔SnO-Zn〇-P2〇5玻璃钎料二9g:lg:10g),充分搅拌后得到均匀膏剂。 [0067] (3) to take a commercially available low-melting-SnO-Zn〇 P2〇5 glass solder, with the right amount of terpineol + ethyl cellulose solution (terpineol: ethyl cellulose: Low melting SnO -Zn〇 brazing two glass-P2〇5 9g: lg: 10g), followed by sufficient mixing to obtain a homogeneous paste. 用手工涂覆或丝网印刷方法将膏剂覆盖在金属化处理的高体积分数SiCp/A1复合材料表面上。 By hand coating or screen printing the paste coated on a high volume fraction SiCp / A1 composite surface metallized.

[0068] (4)将涂覆完成的带焊接件表面相接触并对齐放入石墨模具中,并在待连接试样上放置施加WkPa压力的钢件;将装配好的石墨模具置于真空炉(真空度彡丨x 10-2Pa)或氩气保护下进行钎焊,以10°C/min加热40CTC,再以5°C/min加热至59(TC,保温30min后,以5 °C/min的冷却速度至400°C,再以3t:/min的冷却速度至30(TC,然后随炉冷却至室温时开炉取样。 [0068] (4) finished with solder coated contact surface aligned and placed in a graphite mold and steel is placed to be connected to the pressure exerted on the sample WkPa; the assembled mold was placed in a graphite vacuum furnace after brazing (vacuum degree Pieshu x 10-2Pa) or argon atmosphere at 10 ° C / min heating 40CTC, reheated to 59 (TC, for 30min at 5 ° C / min, at 5 ° C / min cooling rate to 400 ° C, and then to 3t: / min cooling rate to 30 (TC, then cooling with the furnace when the furnace in the sample to room temperature.

[0069]以上所述,仅是本发明的较佳实施例,并非对本发明作任何限制,凡是根据本发明技术实质对以上实施例所作的任何简单修改、变更,均仍属于本发明技术方案的保护范围内。 [0069] The above, only the preferred embodiment of the present invention, the present invention is not any limitation, according to all the technical spirit of the present invention is made by any simple modification of the above embodiment, the changes are still within the technical solutions of the present invention within the scope of protection.

Claims (7)

1.一种用于电子封装复合材料的表面金属化及钎焊方法,其特征在于具体步骤如下: (1) 配制复合镀液:将市售的硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸以一定浓度配比混合均匀,然后加入一定量的SiC颗粒,配置成一定ph值的Ni-P-SiC镀液; (2) 施镀:将预处理好的试样放入步骤(1)中配置好的复合镀液中,置于一定温度的磁力搅拌水浴锅中进行复合镀,得到经表面金属化的待焊接件; ⑶f市售的低熔SnO-ZnO-PzOs玻璃钎料,加入有机粘结剂,充分搅拌后得到均匀膏剂; ⑷米用手工涂覆或丝网印刷的方法将膏状钎料均匀涂覆在清洗好的经表面金属化的待焊接件上; (5) 将两个涂覆好的待焊接件表面相接触并对齐放入石墨模具中,并在两个涂覆好的待焊件上放置可施加一定压力的钢件; (6) 将装配好的石墨模具置于真空炉中真空或氩气保护下进行钎焊, A surface metallization and soldering method for electronic packaging of a composite material, characterized by the following steps: (1) preparing a composite plating solution: Commercially available nickel sulfate, sodium hypophosphite, sodium citrate , sodium acetate and lactate at a concentration ratio of mixed uniformly, and then adding a certain amount of SiC particles, into a certain configuration of ph plating Ni-P-SiC; (2) plating: the sample was placed in the pretreated step (1) configured in the composite plating solution is placed in a constant temperature water bath with magnetic stirring for composite plating, to give the surface of the metal member to be welded; ⑶f commercially available low-melting glass SnO-ZnO-PzOs solder material, an organic binder is added, after sufficiently stirring to obtain a homogeneous paste; ⑷ meters by hand coating method or screen printing a paste-like brazing material uniformly coated on the surface-cleaned of metal members to be welded; ( 5) the two weld surface to be coated with a good contact and alignment placed in a graphite mold, and can be a good place to be applied to a certain pressure on the steel weldment two coating; (6) assembled graphite mold was placed in a vacuum oven under a vacuum or an argon atmosphere brazing, 一定加热速度加热至一定温度,待保温一定时间后,以一定冷却速度降温至3〇(rc,然后随炉冷却至室温时开炉取样。 Constant rate of heating to a temperature, holding until a certain time, at a constant cooling rate cooling to 3〇 (RC, then cooling with the furnace when the furnace in the sample to room temperature.
2.如权利要求1所述的-种用于电子封装复合材料的麵金属化及钎焊方法,其特征在于:所述Ni-P-SiC镀液中,硫酸镍、次亚磷酸钠、柠檬酸三钠、乙酸钠和乳酸的浓度分别为:258/1^、3(^凡、2(^几、158几和3(^凡,5:^浓度为38几,附-?—5;[(]镀液的?田直为4-6。 As claimed in claim 1 - and the surface of the metal soldering method of electronic packaging types for composite material, wherein: said Ni-P-SiC plating solution, nickel sulfate, sodium hypophosphite, lemon trisodium, sodium acetate concentration and the lactic acid were: 258/1 ^ 3 (^ Where, 2 (^ several, 158 several, and 3 (^ Where, 5: ^ a concentration of 38 several attached - - 5;? [(] the bath? Tian straight 4-6.
3.如权利要求1臓的-种用于电子封装复合材料的麵金属化及钎焊方法,其特征在于,所述的试样预处理指:将尚体积分数SiCP/Al复合材料进行除油、敏化、活化后用去离子水清洗;其中除油:丙酮,超声lOmin;敏化:50ml/L HCl+25g/L SnCld#液中,15s,室温. 活化:25ml/L HCl+0_25g/L PdCl2溶液中,2〇s,室温。 Zang claim 1 - the surface of the metal soldering method of electronic packaging and composite materials for seed, wherein said means to pretreat the sample: The volume fraction still SiCP / Al composites deoiling , a sensitizer, upon activation rinsed with deionized water; wherein degreasing: acetone, ultrasonic lOmin; sensitizing:. 50ml / L HCl + 25g / L SnCld # liquid, 15s, room temperature activation: 25ml / L HCl + 0_25g / L PdCl2 solution, 2〇s, rt.
4.如权利要求1所述的-种用于电子封装复合材料的表面金属化及钎焊方法,其特征在于,所述的施镀,其施镀温度为8〇-9〇°C,施镀时间:丨5__6Qmim。 As claimed in claim 1 - and the surface of the metal brazing method of electronic packaging types for composite material, characterized in that said plating, plating temperature which is 8〇-9〇 ° C, Shi plating time: Shu 5__6Qmim.
5.如权利要求1臓的-种用于电子封装复合材料的麵金属化及奸焊方法,其特征在于,所述_麵麵复合_,其中松麵为_,且松油醇:乙基纤维素:低熔Sn〇-Zn〇-P2〇5玻璃奸料的质量比为9:1: 1〇。 Zang according to claim 1 - the surface of the metal bonding method of the electronic package and rape seed for the composite material, wherein said composite things to _ _, _ wherein the surface is a loose, and terpineol: Ethyl cellulose: mass of the low-melting Sn〇 Zn〇 rape-P2〇5 glass frit ratio of 9: 1: 1〇.
6.如权利要求1所述的一种用于电子封装复合材料的麵金属化及钎焊方法,其特征在于,所述的一定压力为3—l〇kPa。 Soldering the metallized surface and a method for electronic packaging composite as claimed in claim 1, wherein the constant pressure is 3- l〇kPa.
7.如权利要臟的一种^于寸装复合材料的麵金属化及钎焊方法,斯在于,所述真空度< = 队升温速度为5-KTC/min,钎焊温度为5〇〇一e〇(rc,保温时间10-30min,冷却速度为3-5 °C /min。 7. A ^ claims dirty surface metallizations inch and mounted in the brazing process the composite material, Adams, wherein the degree of vacuum <= Force heating rate of 5-KTC / min, the brazing temperature is 5〇〇 a e〇 (rc, holding time 10-30min, the cooling rate of 3-5 ° C / min.
CN201710192150.0A 2017-03-28 2017-03-28 Surface metallizing and brazing method used for electronic packaging composite CN107008984A (en)

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