CN106987808B - A kind of coating machine substrate heating device - Google Patents

A kind of coating machine substrate heating device Download PDF

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Publication number
CN106987808B
CN106987808B CN201710338663.8A CN201710338663A CN106987808B CN 106987808 B CN106987808 B CN 106987808B CN 201710338663 A CN201710338663 A CN 201710338663A CN 106987808 B CN106987808 B CN 106987808B
Authority
CN
China
Prior art keywords
tip holder
electrode tip
heating device
coating machine
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201710338663.8A
Other languages
Chinese (zh)
Other versions
CN106987808A (en
Inventor
向勇
杨小军
张韬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Cvac Vacuum Technology Co Ltd
Original Assignee
Chengdu Cvac Vacuum Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Cvac Vacuum Technology Co Ltd filed Critical Chengdu Cvac Vacuum Technology Co Ltd
Priority to CN201710338663.8A priority Critical patent/CN106987808B/en
Publication of CN106987808A publication Critical patent/CN106987808A/en
Application granted granted Critical
Publication of CN106987808B publication Critical patent/CN106987808B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source

Abstract

The invention discloses a kind of coating machine substrate heating devices, mainly by electrode tip holder (1), the heating tube (3) being electrically connected with the electrode contact (18) of electrode tip holder (1), and be arranged support bar group on electrode tip holder (1) at.The connection component that the present invention is set can drive the electrode tip holder rotation for being provided with heating tube, enable heating tube and change according to the shape of substrate the heating angle to substrate;The support rod that the present invention is arranged is Telescopic supporting rod, which can be adjusted according to the distance that the shape of substrate heats heating tube, ensures that the present invention to the effect of substrate heating, effectively raises the quality of substrate coating.

Description

A kind of coating machine substrate heating device
Technical field
The present invention relates to a kind of heating device, in particular to a kind of coating machine substrate heating devices.
Background technique
Coating machine steams equipment generally by the resistance being arranged in coating machine makes its surface component with atom to heat target Group or ionic species are evaporated out, and the atomic group of target or ion is made to be deposited in substrate surface, (are dissipated by film forming procedure Point-island structure-fan walks structure-layer growth) form film.In order to keep the coating quality of substrate more preferable, people are in coating machine Coating chamber in be provided with substrate heating device.
However, existing substrate heating device when for substrate heating, cannot adjust heating angle according to the shape of substrate The distance of degree and heating, the effect for causing substrate heating device to heat substrate is poor, thus the serious plating for affecting substrate Film quality.
Summary of the invention
It is an object of the invention to overcome existing substrate heating device not to be adjustable the defect of the heating angle to substrate, A kind of coating machine substrate heating device is provided.
The purpose of the present invention passes through a kind of following technical proposals reality: coating machine substrate heating device, mainly by electrode Seat, the heating tube being electrically connected with the electrode contact of electrode tip holder, and the support bar group that is arranged on electrode tip holder at;Electrode tip holder with The connection component of energy band moving electrode seat rotation is additionally provided between support rod.
The connection component includes the mounting base being connected with support rod, and is connected in mounting base and can prolong by shaft The support frame of shaft rotation;The electrode tip holder is connected with support frame.
The support rod includes outer bar, and is arranged in outer bar and can prolong the telescopic rod of outer bar up and down motion, the installation Seat is connected with telescopic rod.
It is additionally provided with antifouling board on the electrode tip holder, is respectively arranged with card slot and opening on the antifouling board.
Further, bolt is provided on the electrode tip holder, the bolt is flexibly connected with card slot.
The screw for locking support frame is provided in the mounting base.
The lock-screw for locking telescopic rod is provided in the outer bar.
Further, the lower end of the outer bar is additionally provided with mounting plate, uses insulation board on the mounting plate.
Transparent baffle is additionally provided on the electrode tip holder, the transparent baffle is located at the top of heating tube.
Compared with the prior art, the present invention has the following advantages and the utility model has the advantages that
(1) connection component that the present invention is set can drive the electrode tip holder rotation for being provided with heating tube, enable heating tube according to base The shape of piece changes the heating angle to substrate;Ensure that the present invention to the effect of substrate heating, effectively raises The quality of substrate coating.
(2) the telescopic rod energy band moving electrode seat for the support rod that the present invention is arranged moves up and down, and ensures that energy of the present invention The distance of substrate heating is adjusted.
(3) antifouling board set by the present invention can effectively prevent substrate heating device dirty by the atomic group of target or ion Dye;And antifouling board is used by card slot and screw fit, and the installation or removal of antifouling board can be made more convenient.
(4) screw being arranged in the mounting base of connection component of the invention can consolidate the support frame of connection component very much It is fixed, it is maintained at the rotational angle of support frame in required angle, to improve the present invention to the accuracy of substrate heating.
(5) support rod that the present invention is arranged is matched with the lock-screw being disposed thereon, and can make the heating of heating device Pipe is accurately maintained at required height, ensures that the accuracy that the present invention adjusts heating tube at a distance from substrate.
(6) mounting plate that the present invention is arranged on the bottom end of support rod can be convenient for the installation and removal of antifouling board, and be arranged Insulation board on a mounting board can make substrate heating device safer when in use.
Detailed description of the invention
Fig. 1 is overall schematic of the invention.
Fig. 2 is partial sectional view of the invention.
Fig. 3 is the structural schematic diagram of antifouling board of the invention.
In above-mentioned attached drawing, the corresponding component names of appended drawing reference are as follows:
1-electrode tip holder, 2-antifouling boards, 3-heating tubes, 4-telescopic rods, 5-outer bars, 6-mounting plates, 7-insulation boards, 8-transparent baffles, 9-support frames, 10-shafts, 11-mounting bases, 12-screws, 13-installation through-holes, 14-bolts, 15- Lock-screw, 16-card slots, 17-openings, 18-electrode contacts.
Specific embodiment
The present invention is described in further detail below with reference to embodiment, but embodiments of the present invention are not limited to This.
Embodiment
As shown in Figures 1 to 3, the invention discloses a kind of coating machine substrate heating devices, mainly by electrode tip holder 1, with electricity The heating tube 3 that electrode seat 1 is electrically connected, and the support bar group that is arranged on electrode tip holder 1 at.It is set on electrode tip holder 1 as shown in Figure 1, 2 There is antifouling board 2, and is additionally provided with the connection component of the rotation of energy band moving electrode seat 1 between electrode tip holder 1 and support rod;The branch Strut is as shown in Figure 1, 2 comprising outer bar 5 and telescopic rod 4.
When implementation, heretofore described electrode tip holder 1 preferentially uses the electrode tip holder equipped with two arrays of electrodes connector 18, the electricity Electrode seat 1 is equipped with the threaded hole of installation corresponding component.The heating tube 3 is preferentially come using the fast halogen lamp tube of electrothermal calefactive rate It realizes, heating tube 3 is arranged on electrode tip holder 1, and the electrode tip of heating tube 3 is electrically connected with the electrode contact 18 of electrode tip holder 1, the present invention The quantity and electrode tip of set heating tube 3 are identical as the group number of the electrode contact of electrode tip holder 1.3 quilt of heating tube in order to prevent The atomic group or ionic soil of target, the present invention are provided with transparent baffle 8 on the upper electrode seat 1 for being located at heating tube 3, this is thoroughly Bright baffle 8 preferentially realizes that transparent baffle 8 is solid by tapping screw using high temperature resistant and the good suprasil plate of heat-transfer effect It is scheduled on electrode tip holder 1.The electrode tip holder of two arrays of electrodes connector of the present invention can be changed to setting as needed when in use There is the electrode tip holder of different groups of number electrode contacts, and the quantity of heating tube 3 can also be according to the electrode contact of used electrode tip holder Group number is adjusted.
Meanwhile as shown in Figure 1, 2, in order to prevent the main component of heating device by the atomic group or ionic soil of target, The present invention is also provided with antifouling board 2 on electrode tip holder 1, and the structure of the antifouling board 2 is as shown in figure 3, the antifouling board 2 uses resistance to height Warm and easy to clean stainless steel plate is realized.For the ease of the installation and removal of antifouling board 2, spiral shell of the present invention on electrode tip holder 1 Bolt 14 is provided on pit, the antifouling board 2 is then mounted on bolt 14 by the card slot 16 being arranged on antifouling board 2, The bayonet diameter of the card slot 16 is slightly larger than the diameter of bolt 14, keeps the installation or removal of antifouling board 2 more convenient.And antifouling board 2 is such as Shown in Fig. 3, it is additionally provided with an opening 17 thereon, support rod is in contact after running through the opening 17 with the inner wall of opening 17, antifouling Opening 17 set by plate 2 can be such that antifouling board 2 preferably protects heating device.
The present invention is in order to solve the problems, such as that heating angle cannot be adjusted in existing substrate heating device, in support rod Rotatable connection component is provided with the junction of electrode tip holder 1.The connection component is as shown in Figure 2 comprising with support The mounting base 11 that bar is connected, and it is arranged in mounting base 11 and can prolong the support frame 9 of the rotation of shaft 10 by shaft 10.It is described Mounting base 11 be equipped with installation through-hole 13, one end of the support rod is then mounted in the installation through-hole 13 of mounting base 11, And the inner wall of the outer wall of the support rod and installation through-hole 13 is in close contact.Multiple threaded holes, electricity are provided on the support frame 9 Electrode seat 1 is then fixedly connected on support frame 9 by the drive screw to match with the threaded hole on support frame 9, and support frame 9 prolongs shaft Just energy band moving electrode seat 1 is rotated when 10 rotation, so that the heating angle for the heating tube 3 being arranged on electrode tip holder 1 be made to occur Variation.In order to be able to maintain the heating angle of heating tube 3 on a fixed position, the present invention is provided in mounting base 11 For the screw 12 of locking support frame 9, the screw 12 preferentially uses to be realized convenient for the butterfly screw that turns, when use Turning screw 12 makes 12 locking support frame 9 of screw, and support frame 9 no longer rotates, and the heating angle of heating tube 3 is also consolidated simultaneously It is fixed.In the heating angle that need to adjust heating tube 3, then screw 12 need to be only turned, be in close contact screw 12 just with support frame 9 It is able to achieve the adjusting to the heating angle of heating tube 3.
Further, in order to realize the adjusting of the heating distance to substrate, support rod of the present invention uses flexible Formula support rod realizes that the support rod is as shown in Figure 1, 2 comprising outer bar 5 and telescopic rod 4.On described 5 one end of outer bar It is provided with the lock-screw 15 for locking telescopic rod 4, is provided with mounting plate 6 on the other end;And the telescopic rod 4 is then arranged In outer bar 5 and can prolong outer bar 5 inner wall move up and down, the upper end of the telescopic rod 4 is pacified after then passing through the opening 17 on antifouling board 2 In the installation through-hole 13 in mounting base 11, which is simultaneously in close contact with the inner wall of opening 17, and therefore, telescopic rod 4 is transported Mounting base 11 and the component being arranged in mounting base 11 can be driven to move together when dynamic with telescopic rod 4, and by turning locking screw Nail 15 just can control the motion state of telescopic rod 4, so that the present invention be made to realize the adjusting to substrate heating distance.
Wherein, the mounting plate 6 is connected in outer bar 5 by drive screw, on the mounting plate 6 simultaneously be provided with two with The upper through-hole for installation, mounting plate 6 are then mounted on the erecting bed of vaporization chamber by the screw rod of the through-hole on mounting plate 6 On.Safety when using in order to ensure the present invention, is also provided with insulation board 7 between mounting plate 6 and the erecting bed of vaporization chamber, The insulation board 7 uses ceramic isolation plate resistant to high temperature preferentially then to realize.
In the use of the present invention, electrode tip holder 1 is connected by electric wire with external power supply to provide work for heating tube 3 Voltage, the electric wire for connection electrode seat 1 and external power supply then run through each part centre through-hole as shown in Figure 2.The present invention When operation, when we need to change the angle to substrate heating, we need to only be such that support frame 9 drives by rotary support frame 9 Coupled electrode tip holder 1 rotates, and the heating tube being mounted on electrode tip holder 13 can just become the heating angle of substrate Change.In heating tube 3 to the heating angular adjustment of substrate to angle needed for us when, we are arranged by tightening in mounting base 11 On screw 12, be in close contact screw 12 and support frame 9, support frame 9 not can rotate then, and heating tube 3 adds substrate at this time Hot angle is just able to maintain in required heating angle.
Meanwhile the present invention can be realized by adjusting the distance of the up and down motion of the telescopic rod 4 of support rod to heating tube 3 and base The distance of piece is adjusted.When need to shorten heating tube 3 and substrate apart from when, we just move upwards telescopic rod 4, are heating Pipe 3 reach at a distance from substrate it is required apart from when, lock the lock-screw 15 that is arranged in outer bar 5, just can make heat pipe 3 and base Piece distance is maintained in required distance.When need to increase heating tube 3 and substrate apart from when, we just make telescopic rod 4 downwards transport It is dynamic, heating tube 3 reach with substrate at a distance from it is required apart from when, the lock-screw 15 that locking is arranged in outer bar 5 just can make Heat pipe 3 and substrate distance are maintained in required distance.And the antifouling board 2 being arranged on electrode tip holder 1 can prevent substrate well Heating device is by the atomic group or ionic soil of target.To which the existing substrate heating device of very good solution of the present invention cannot The angle and distance of substrate heating is adjusted, and cannot effectively prevent substrate heating device by the atomic group of target or The problem of ionic soil.
As described above, the present invention can be realized well.

Claims (7)

1. a kind of coating machine substrate heating device is electrically connected mainly by electrode tip holder (1) with the electrode contact (18) of electrode tip holder (1) The heating tube (3) connect, and be arranged support bar group on electrode tip holder (1) at;It is characterized in that, in electrode tip holder (1) and support The connection component of energy band moving electrode seat (1) rotation is additionally provided between bar;The connection component includes being connected with support rod Mounting base (11), and the support frame (9) of shaft (10) rotation is connected on mounting base (11) and can prolonged by shaft (10);It is described Electrode tip holder (1) is connected with support frame (9);It is additionally provided with antifouling board (2) on the electrode tip holder (1), on the antifouling board (2) respectively It is provided with card slot (16) and opening (17).
2. a kind of coating machine substrate heating device according to claim 1, it is characterised in that: the support rod includes outer Bar (5), and be arranged on outer bar (5) and can prolong outer bar (5) up and down motion telescopic rod (4), the mounting base (11) with stretch Bar (4) is connected.
3. a kind of coating machine substrate heating device according to claim 2, it is characterised in that: on the electrode tip holder (1) It is provided with bolt (14), the bolt (14) is flexibly connected with card slot (16).
4. a kind of coating machine substrate heating device according to claim 3, it is characterised in that: on the mounting base (11) It is provided with the screw (12) for locking support frame (9).
5. a kind of coating machine substrate heating device according to claim 4, it is characterised in that: set on the outer bar (5) It is equipped with the lock-screw (15) for locking telescopic rod (4).
6. a kind of coating machine substrate heating device according to claim 5, it is characterised in that: under the outer bar (5) End is additionally provided with mounting plate (6), uses insulation board (7) on the mounting plate (6).
7. a kind of coating machine substrate heating device according to claim 6, it is characterised in that: on the electrode tip holder (1) It is additionally provided with transparent baffle (8), the transparent baffle (8) is located at the top of heating tube (3).
CN201710338663.8A 2017-05-15 2017-05-15 A kind of coating machine substrate heating device Expired - Fee Related CN106987808B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710338663.8A CN106987808B (en) 2017-05-15 2017-05-15 A kind of coating machine substrate heating device

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Application Number Priority Date Filing Date Title
CN201710338663.8A CN106987808B (en) 2017-05-15 2017-05-15 A kind of coating machine substrate heating device

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CN106987808B true CN106987808B (en) 2019-04-09

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108220888B (en) * 2017-12-27 2019-12-27 上海超导科技股份有限公司 Heating device suitable for pulse laser coating and pulse laser coating device thereof
CN109652776A (en) * 2019-02-18 2019-04-19 东莞职业技术学院 A kind of heated holder in PIP ion film plating process for mold

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768899B1 (en) * 2006-05-18 2007-10-19 (주)멕스코리아아이엔씨 Heating apparatus for semiconductor wafers and glass substrates
JP2010159463A (en) * 2009-01-08 2010-07-22 Nippon Seisan Gijutsu Kenkyusho:Kk In-line type plasma cvd method, and apparatus thereof
CN104871292A (en) * 2012-12-18 2015-08-26 株式会社Eugene科技 Substrate treatment apparatus, and method for controlling temperature of heater
CN105296952A (en) * 2015-11-03 2016-02-03 深圳职业技术学院 Substrate temperature control system and method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060165904A1 (en) * 2005-01-21 2006-07-27 Asm Japan K.K. Semiconductor-manufacturing apparatus provided with ultraviolet light-emitting mechanism and method of treating semiconductor substrate using ultraviolet light emission

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768899B1 (en) * 2006-05-18 2007-10-19 (주)멕스코리아아이엔씨 Heating apparatus for semiconductor wafers and glass substrates
JP2010159463A (en) * 2009-01-08 2010-07-22 Nippon Seisan Gijutsu Kenkyusho:Kk In-line type plasma cvd method, and apparatus thereof
CN104871292A (en) * 2012-12-18 2015-08-26 株式会社Eugene科技 Substrate treatment apparatus, and method for controlling temperature of heater
CN105296952A (en) * 2015-11-03 2016-02-03 深圳职业技术学院 Substrate temperature control system and method

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