CN106981465A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN106981465A
CN106981465A CN201611136407.2A CN201611136407A CN106981465A CN 106981465 A CN106981465 A CN 106981465A CN 201611136407 A CN201611136407 A CN 201611136407A CN 106981465 A CN106981465 A CN 106981465A
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China
Prior art keywords
glue
integrated circuit
driving
receiving electrode
current
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Granted
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CN201611136407.2A
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CN106981465B (zh
Inventor
托马斯·苏沃德
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NXP BV
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NXP BV
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • G—PHYSICS
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  • Engineering & Computer Science (AREA)
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Abstract

根据本公开的第一方面，提供一种电子装置，所述电子装置包括：基板；集成电路；位于所述基板和所述集成电路之间的一层胶；耦合到所述胶和所述集成电路的一组驱动电极；耦合到所述胶和所述集成电路的接收电极；耦合到所述胶和所述基板的反电极；其中所述胶包括导电粒子，所述导电粒子与所述接收电极、所述反电极和所述驱动电极组的至少一部分电连接，使得如果驱动电流被提供到所述驱动电极组，那么所述驱动电流的至少一部分通过所述导电粒子和所述反电极流动到所述接收电极。根据本公开的第二方面，构想一种制造电子装置的对应方法。

Description

电子装置
技术领域
本公开涉及一种电子装置。此外，本公开涉及制造电子装置的对应方法。
背景技术
电子装置例如智能卡现今在社会中广泛使用。例如，智能卡可以被用作电子身份(eID)卡。然而，此类eID卡的终端用户接受性仍相对较低。虽然由于通过嵌入式安全元件(例如安全控制器芯片)提供的eID卡的加密能力使得eID卡是相对安全的，但是难以验证安全元件和所述安全元件安装在上面的装置主体(例如基板)的特定组合是否为真实的。一般而言，难以验证集成电路(例如处理单元)和所述集成电路安装在上面的装置主体(例如基板)的特定组合是否为真实的。因此，所阐述的种类的电子装置仍然易受篡改的影响。
发明内容
根据本公开的第一方面，提供一种电子装置，该电子装置包括：基板；集成电路；位于基板和集成电路之间的一层胶；耦合到胶和集成电路的一组驱动电极；耦合到胶和集成电路的接收电极；耦合到胶和基板的反电极；其中胶包括导电粒子，该导电粒子与接收电极、反电极和驱动电极组的至少一部分电连接，使得如果驱动电流被提供至所述驱动电极组，那么驱动电流的至少一部分通过导电粒子和反电极流动到接收电极。
在一个或多个实施例中，流动到接收电极的驱动电流的所述部分取决于导电粒子在胶中的分布。
在一个或多个实施例中，导电粒子的分布实施物理不可克隆函数。
在一个或多个实施例中，装置另外包括：被布置成产生所述驱动电流的电流产生器；被布置成测量由接收电极接收的驱动电流的部分并输出对应的电流输出值的测量单元；被布置成接收来自测量单元的至少一个电流输出值并比较所述电流输出值与参考值的处理单元。
在一个或多个实施例中，处理单元另外被布置成针对环境影响来校正电流输出值。
在一个或多个实施例中，集成电路包括以下各项中的至少一者：处理单元、驱动电极组、接收电极、电流产生器、测量单元。
在一个或多个实施例中，驱动电流是对应于挑战代码的加权驱动电流。
在一个或多个实施例中，挑战代码由包括在所述装置中的处理单元产生。
在一个或多个实施例中，处理单元另外被布置成比较一连串电流输出值与预定响应代码。
在一个或多个实施例中，集成电路是通用处理器芯片或应用处理器芯片。
在一个或多个实施例中，基板是印刷电路板或卡嵌体。
在一个或多个实施例中，集成电路是安全元件，具体来说是安全控制器芯片。
在一个或多个实施例中，装置是智能卡。
根据本公开的第二方面，构想一种制造电子装置的方法，该方法包括提供具有以下项的电子装置：基板；集成电路；位于基板与集成电路之间的一层胶；耦合到胶和集成电路的一组驱动电极；耦合到胶和集成电路的接收电极；耦合到胶和基板的反电极；其中胶包括导电粒子，该导电粒子电连接接收电极、反电极和驱动电极组的至少一部分，使得如果驱动电流被提供到所述驱动电极组，那么驱动电流的至少一部分通过导电粒子和反电极流动到接收电极。
附图说明
将参考附图更详细地描述实施例，在附图中
图1示出导电胶的例子；
图2示出包括导电胶的组件的例子；
图3示出使用导电胶组装在基板上的芯片的例示性实施例；
图4示出电子装置的例示性实施例；
图5示出装置实施方案的例示性实施例；
图6示出另一装置实施方案的例示性实施例；
图7示出另外的装置实施方案的例示性实施例；
图8示出IC基板组件的例示性实施例；
图9示出控制系统的例示性实施例；
图10示出生物计量系统的例示性实施例；
图11示出带有嵌入的生物计量系统的芯片的例示性实施例；
图12示出验证序列的例子。
附图标记列表
100 导电胶
102 导电粒子
200 接触垫
202 接触垫
300 集成电路
302 基板
304 接触垫
306 接触垫
308 钝化层
310 聚酰亚胺绝缘层
312 聚酰亚胺绝缘层
314 凸块下金属化物
316 再分布层(RDL)金属化物
318 反电极
400 电子装置
402 驱动电极
404 驱动电极
406 驱动电极
408 接收电极
500 装置实施方案
600 装置实施方案
700 装置实施方案
800 集成电路(IC)基板组件
802 在聚酰亚胺绝缘层中的窗
804 电接触
806 接收比较器
900 驱动电极控制
902 接收电极控制
904 电化传感器
1000 挑战代码
1002 挑战环路
1004 刺激挑战电极
1006 物理不可克隆函数
1008 感测接收电极
1010 组装响应代码
1012 预处理
1014 特征提取
1016 模板产生器
1018 参考模板
1020 模板匹配
1022 验证结果
1100 服务请求验证
1102 数据接口
1104 加密单元
1106 中央处理单元
1108 存储器单元
1110 输入/输出接口
1112 输入/输出接口
1114 挑战/响应电极
1116 挑战/响应电极
1200 验证序列
1202 接收识别请求
1204 产生挑战模式
1206 转化成驱动电极电流模式
1208 配置输入/输出级
1210 输出挑战
1212 获得电流响应
1214 将所接收的响应转换成数值模式
1216 生物计量模式匹配
1218 产生识别响应
1220 返回识别响应
具体实施方式
如上所述，根据本公开的第一方面，提供一种电子装置，该电子装置包括：基板；集成电路；位于基板和集成电路之间的一层胶；耦合到胶和集成电路的多个驱动电极；耦合到胶和集成电路的接收电极；耦合到胶和基板的反电极；其中胶包括导电粒子，该导电粒子与接收电极、反电极和驱动电极的至少一部分电连接，使得如果驱动电流被提供至所述驱动电极，那么驱动电流的至少一部分通过导电粒子和反电极流动到接收电极。
集成电路(IC)例如安全控制器芯片通常被组装到高安全性电子文档的卡主体中。卡主体的真实性和安全控制器芯片的真实性可以单独地验证，但是难以验证真实的安全控制器芯片已经以真实的方式组装到真实的卡主体中。换句话说，难以验证集成电路与卡主体(即，集成电路安装在上面的基板)的特定组合(即，特定组件)是真实的。根据本公开，组件的真实性可以通过相对较少的资源且以相对较低的成本来验证。这通过利用用于将集成电路附接到基板的导电胶的物理特性获得。具体地说，可以预期流动到接收电极的驱动电流的比例将在不同的组件之间不同，因为导电胶的物理特性针对每个组件将不同。更具体来说，驱动电极中的一些将电连接到反电极，因为导电路径由存在于驱动电极的位置处的导电粒子形成。但是，在其它位置处，可能缺乏导电路径，并且因此在这些位置处的驱动电极未电连接到反电极。因此，视具体情况，只有驱动电流的一部分(即，一定比例)可以流动到反电极。通过测量该比例的驱动电流，能够唯一地识别特定组件。
在一个或多个实施例中，流动到反电极的驱动电流的该部分取决于导电粒子在胶中的分布。由于导电粒子的分布可以在不同组件之中显著改变，所以组件识别是唯一的概率可以因此增大。此外，导电粒子的分布可以取决于制造过程中的固有的变化性，这可以允许导电粒子的拟随机分布。因此，导电粒子的分布可以实施物理不可克隆函数(PUF)，这可以另外增大组件识别是唯一的概率。换句话说，通过利用导电胶中的导电粒子的拟随机分布，可以导出可以用于IC基板组件识别的唯一签名(即，用于验证IC基板组件是真实的)。
导电胶可以是各向异性导电胶。各向异性导电胶是用于将裸露的小片组装到基板例如卡嵌体或印刷电路板(PCB)上的材料。集成电路可以是智能卡中的安全元件，例如安全控制器芯片。在这种情况下，基板可以是安全控制器芯片组装在上面的卡嵌体。可替换的是，但是非限制性地，集成电路可以是通用处理器芯片或应用处理器芯片。在这种情况下，基板可以是处理器芯片组装在上面的PCB，例如，在移动装置中，并且IC基板组件识别可用于实施防伪。
在一个或多个实施例中，装置另外包括：被布置成产生所述驱动电流的电流产生器；被布置成测量由接收电极接收的驱动电流的该部分并输出对应的电流输出值的测量单元；以及被布置成接收来自测量单元的至少一个电流输出值，并比较所述电流输出值与参考值的处理单元。以此方式，可以促进驱动电流的接收到的部分或比例(在下文还被称作接收到的“电流的总和”)的处理。
图1示出导电胶100的例子。导电胶100包括分散于树脂中的导电粒子102。胶100可用于将裸露的小片组装到基板例如印刷电路板或卡嵌体上。导电粒子102可以是由金属制成的薄片，该金属包括但不限于银或金。薄片可具有不规则的大小和形状，并且由于制造过程中的固有变化性而可以拟随机地分布在导电胶100中。其它物理效应例如表面张力也可以影响粒子分布。所述薄片的中数直径可以涉及胶100附接到的接触垫的直径；根据经验，薄片直径可以选择为接触垫的宽度或长度中的较小值的至少1/5。在实际实施方案中，直径介于10μm到30μm的范围内。通过在芯片组装期间在垂直方向上施加压力，包含于胶100中的粒子102被冷凝直至在接触垫之间建立电接触。树脂被移置到侧面。在组装期间施加的热量或UV光开始树脂的固化过程。当固化时胶100提供芯片与基板之间的强粘附。
图2示出包括导电胶100的组件的例子。该组件包括例如芯片(未示出)的第一接触垫200和例如基板(未示出)的第二接触垫202。可以看出，在胶100中的一些位置处存在触碰彼此和接触垫200、202的一连串的导电粒子，以便在所述接触垫200、202之间形成导电路径。
图3示出使用导电胶100组装在基板302上的芯片300的例示性实施例。芯片300具有经由凸块下金属化物(UBM)314和再分布层(RDL)金属化物316连接至导电胶100的接触垫304、306。UBM 314和RDL金属化物316嵌入在可以由聚酰亚胺制成的绝缘层312中。此外，接触垫304、306可以嵌入在钝化层308中并且可以嵌入在也可以由聚酰亚胺制成的另一个绝缘层310中。RDL金属化物316可以由铜制成。此外，反电极318连接至基板302。
图4示出电子装置400的例示性实施例。电子装置400包括导电胶100和连接至导电胶100的多个驱动电极402、404、406。此外，电子装置400包括接收电极408和反电极318，接收电极408和反电极318两者也都连接至导电胶100。驱动电极402、404、406和接收电极408连接至集成电路(未示出)。此外，反电极318连接至基板(未示出)。胶100包括与接收电极408，反电极318和驱动电极402、404的至少一部分电连接的导电粒子。
在操作中，如果驱动电流被提供到驱动电极402、404、406，那么驱动电流的至少一部分通过导电粒子和反电极318流动到接收电极408。在本例子中，驱动电流将从驱动电极402和404流动，因为该驱动电极402和404通过导电路径电连接到反电极318，该导电路径通过邻接导电粒子形成。但是，将无电流从驱动电极406流动，因为不存在这种导电路径。胶100中的此类导电路径的位置可以在不同的IC基板组件中变化。因此，流动到接收电极408的驱动电流的比例也将在不同的组件中变化，并且可由此用作用于识别特定组件的根据。
更具体来说，在反电极408不与驱动电极402、404、406中的任一个相对的位置处，粒子不大可能建立电接触。相对于包含于导电胶100中的粒子102的大小的驱动电极402、404、406的尺寸可以选择成使得在反电极408和驱动电极402、404、406中的任一个之间的电接触处于平均值，该平均值仅由一半数量的驱动电极402、404、406建立。因此，在反电极408和驱动电极402、404、406中的任一个之间的电化连接可以取决于导电粒子102在导电胶100中的随机分布。相对于粒子102的大小的接收电极418的大小可以选择成使得始终与反电极318建立电接触。技术人员将理解电子装置400可包括多于一个反电极318。
图5示出装置实施方案500的例示性实施例。在此例子中，一组由软件控制的电流I1，I2...In被注入到驱动电极402、404、406中。如果通过导电粒子在驱动电极402、404、406的至少一部分和接收电极408之间建立电接触，那么由接收电极408接收电流的总和。由接收电极408接收的电流的总和可以通过合适的方法转换成可由处理单元(未示出)处理的数值表示。在此例子中，电流的总和被馈送到连接到参考电位的电阻器。跨越所述电阻器产生的电压是针对电流的总和的测量，并且可以使用模/数转换器(未示出)转换成数值。
图6示出另一装置实施方案600的例示性实施例。在此例子中，积分器用于将由接收电极408接收的电流的总和转换成电压，其中该电压也取决于施加电流的总和的时间t。
图7示出另外的装置实施方案700的例示性实施例。在此例子中，比较器用于检查跨越电容器Cint的电压是否超过所施加的参考电压Vref。电流的总和的初次断言与跨越电容器Cint的电压超过参考电压Vref时的时刻之间的时间是针对电流的总和的间接测量。该方法良好适用于在处理单元上实施，该处理单元可以易于被配置成通过对时钟周期进行计数来测量时间。在另一个实施例中(未示出)，比较器和参考电压可以被呈现固定的跳脱电压的输入缓冲器代替，其中低于该跳脱电压的输入电压产生逻辑低的输出信号，而高于该跳脱电压的输入电压产生逻辑高的输出信号。在一个实施例中，电流I1，I2...In低于10μA并且由集成电路提供；因此电容器Cint可以被制成足够小以便也集成到所述集成电路中。应用该方法可以从用于芯片组件的胶材料提供物理不可克隆函数。待固定的芯片包括数组驱动电极和用于确定粒子在用于组装同一芯片的胶中的随机分布的对应的比较器。电极可被布置成交叉影线布置。现有过程模块可以用于形成所谓的再分布层，该再分布层用于在芯片的有源侧的顶部上创建和布置影线图案。
图8示出IC基板组件800的例示性实施例。组件800包含一种布置，该布置包括驱动电极402、404、406，反电极318，接收电极408和接收比较器806。电极可被布置成在集成电路或芯片的有源表面上的行和列。可以在驱动电极402和反电极318之间建立电接触804。在聚酰亚胺绝缘层中的窗802可以实现在反电极318和接收电极408之间的电接触。在此例子中，提供被组织成三行和三列的九个电化传感器(即，在反电极和接收电极之间的接触点)。驱动电流借助于确定的接触被供应到驱动电极。成行和成列的布置可以因为可供使用的空间所允许而自由选择。
图9示出控制系统的例示性实施例。多个电化传感器904可以设置于IC基板组件中。驱动电极可以由驱动电极控制电路900控制。控制驱动电极包括向驱动电极供应驱动电流。接收电极可以由接收电极控制电路902控制。控制接收电极包括处理所接收驱动电流的比例。驱动电流可通过向单独的驱动电极分配不同倍数的电流单位而被加权。因此，在一个或多个实施例中，驱动电流是对应于挑战代码的加权驱动电流。借助于此种挑战代码，IC基板组件可以被更精确地识别。应指出，所述权重的至少一部分也可以设定成0。挑战代码可以由包括在集成电路中的处理单元产生，这提高了攻击者得到所述代码的障碍。
接收电极控制电路902的输入端可以被布置成以合适的方式感测所施加的电流的总和。倘若使用如图7中所示的感测电路，可以测量与单个接收比较器通道相关联的积分时间，该积分时间指示参考电压电平并且还指示施加至比较器通道的电流的总和。因此测量通过循环计数表示的时间，该循环计数指示胶粒子的分布并且还指示所应用的挑战代码。通过依次执行各自基于不同挑战代码的所述电流总和测量，可以捕获一组对应的响应。在这种情况下，随着挑战的所引起的电流总和读数表示响应模式。该响应模式因此基于一连串所阐述种类的电流输出值。在一个或多个实施例中，处理单元另外被布置成比较响应模式与预定响应代码。因此，IC基板组件可以以较高精确度来识别。响应的熵可以通过调节不同因素(例如电化传感器的数量、成行和成列的电化传感器的布置、挑战代码的熵、所应用的挑战代码的数量、相对于电极的大小的导电粒子的大小)而增加。
图10示出生物计量系统的例示性实施例。该系统可被称为生物计量系统，因为IC基板组件的所导出的标识符或签名可以被视为所述组件的物理指纹。在挑战环路1002中，应用至少一个挑战1000，并且所引起的响应是借助于所阐述的种类的一个或多个电流总和测量读数获得的。在环路的每次迭代中，可以刺激一组驱动电极(或挑战电极)1004，并且在1008处，受导电粒子(实施PUF 1006)影响的电流的总和可以由接收电极测量或感测。所获得的响应可以呈现基于(例如)环境效果的变化。为了使响应适用于另外的评估，该响应可能必须经受特征提取过程1014，该特征提取过程1014提取不依赖于所述环境影响的一组可靠的识别特征。所提取的特征可以是电流总和读数，通过预处理1012该电流总和读数已经针对包括例如温度、湿度和空气压力的环境影响而得到校正。由此，可以获得IC基板组件的更可靠的识别。所提取的识别特征可以是基于一连串挑战代码的一组电容测量值。所述提取的特征可以由模板产生器1016格式化为模板，以用于简单和快速地针对模板数据库1018中的参考模板进行匹配。在装置制造阶段中，一组挑战-响应对可以被确定并作为数据库1018中的一组参考模板存储在例如芯片的安全储存单元内。该过程被称作登记。所存储的挑战-响应对可以形成代码字母表。在正常操作模式中，应用来自代码字母表的挑战并且所引起的响应针对参考模板进行匹配1020。可以定义阈值以设定应当从一组挑战/响应对获得以实现整体肯定检验结果1022的肯定检验的数目。这可以用于通过定义一组新的挑战/响应对来更新物理指纹。按照原理，此处所公开的系统能够提供可以被视为用于由生物计量系统所使用的代码字母表的定义空间的巨大但无限数目的挑战/响应对。
图11示出带有嵌入的生物计量系统的芯片的例示性实施例。如图11中所示，用于验证IC基板组件的生物计量系统可以集成到形成所述组件的一部分的IC 300(芯片)中。IC300可以是安全控制器芯片，该安全控制器芯片包括用于将IC 300连接至请求验证组件的服务1100的数据接口1102、加密单元1104、中央处理单元1106、存储器单元1108(例如RAM和/或ROM)，和用于将IC 300连接至与导电胶100连接的挑战/响应电极1114、1116的输入/输出接口1110、1112。输入/输出接口1110、1112可以由IC 300的中央处理单元1106控制。如上所述，被布置成接收电流输出值(即，对应于所测量的电流的总和的值)并比较该电流输出值与参考值的处理单元可以包括在IC 300中。这是有用的，因为从可以减小处理单元被篡改的风险的方面来看，具体来讲在IC 300是安全控制器芯片的情况下，可以提高安全等级。所述处理单元可以是例如图11中所示的中央处理单元1106。
图12示出验证序列1200的例子。该验证序列包括在1202处接收识别请求，即接收请求以验证根据本公开的IC基板组件的识别。此外，验证序列1200包括在1204处产生挑战模式，在1206处将挑战模式转化成驱动电极电流模式，在1208处配置输入/输出级，在1210处输出挑战，在1212处获得电流响应，在1214处将所接收的响应转换成数值模式，在1216处执行生物计量模式匹配，在1218处产生识别响应，在1220处返回识别响应。
出于安全组件认证的目的，可能需要的是产生具有低错误接受率(FAR)与高错误拒绝率(FRR)的可靠验证。FAR可以通过调节待用于产生一个响应的挑战的数量容易地受到控制。FRR可以通过影响整体代码熵的不同因素的适当定义按比例调整。此外，当与芯片相关的物理不可克隆函数例如SRAM-PUF组合时，所引起的组合呈现与单独应用的SRAM-PUF相比较大的熵。
应注意，已经参考不同主题描述了以上实施例。具体地说，一些实施例可能已参考方法类的权利要求来描述，而其它实施例可能已参考设备类的权利要求来描述。然而，本领域的技术人员将从上述内容了解到，除非另外指明，否则除属于一种类型的主题的特征的任何组合外，与不同主题相关的特征的任何组合，具体地说，方法类的权利要求的特征与设备类的权利要求的特征的组合，也视为与此文档一起公开。
此外，应注意，附图是示意性的。在不同附图中，用相同的附图标记表示类似或相同的元件。此外，应注意，为了提供例示性实施例的简洁描述，可能并未描述属于技术人员的习惯做法的实施方案细节。应了解，在任何此类实施方案的发展中，与在任何工程或设计项目中一样，必须做出大量实施方案特定的决策以便实现研发者的特定目标，例如遵守系统相关的和商业相关的约束条件，这些约束条件在不同的实施方案中可以不同。此外，应了解，此种发展工作可能复杂且耗时，但只是本领域技术人员进行设计、制作和制造的例行任务而已。
最后，应注意，技术人员将能够在不脱离所附权利要求书的范围的情况下设计许多可替换实施例。在权利要求书中，置于圆括号之间的任何附图标记不应解释为限制权利要求。“包括”这个词不排除在权利要求中列出的那些元件或步骤之外的元件或步骤的存在。在元件之前的单词“一”不排除多个此类元件的存在。权利要求书中叙述的措施可以借助于包括若干独特元件的硬件和/或借助于适当编程的处理器来实施。在列出若干构件的装置权利要求中，可以通过硬件中的同一个物件实施这些构件中的若干构件。在彼此不同的附属权利要求项中叙述某些措施这一单纯事实并不指示不能使用这些措施的组合来获得优势。

Claims (10)

1.一种电子装置，其特征在于，包括：
基板；
集成电路；
位于所述基板与所述集成电路之间的一层胶；
耦合到所述胶和所述集成电路的驱动电极组；
耦合到所述胶和所述集成电路的接收电极；
耦合到所述胶和所述基板的反电极；
其中所述胶包括导电粒子，所述导电粒子与所述接收电极、所述反电极和所述驱动电极组的至少一部分电连接，使得如果驱动电流被提供到所述驱动电极组，那么所述驱动电流的至少一部分通过所述导电粒子和所述反电极流动到所述接收电极。
2.根据权利要求1所述的装置，其特征在于，流动到所述接收电极的所述驱动电流的所述部分取决于所述导电粒子在所述胶中的分布。
3.根据权利要求2所述的装置，其特征在于，所述导电粒子的所述分布实施物理不可克隆函数。
4.根据权利要求1所述的装置，其特征在于，另外包括：
-被布置成产生所述驱动电流的电流产生器；
-被布置成测量由所述接收电极接收的所述驱动电流的所述部分并且输出对应的电流输出值的测量单元；
-被布置成接收来自所述测量单元的至少一个电流输出值并比较所述电流输出值与参考值的处理单元。
5.根据权利要求4所述的装置，其特征在于，所述处理单元另外被布置成针对环境影响来校正所述电流输出值。
6.根据权利要求4或权利要求5所述的装置，其特征在于，所述集成电路包括以下各项中的至少一者：所述处理单元、所述驱动电极组、所述接收电极、所述电流产生器、所述测量单元。
7.根据权利要求1所述的装置，其特征在于，所述驱动电流是对应于挑战代码的加权驱动电流。
8.根据权利要求7所述的装置，其特征在于，所述挑战代码由包括在所述装置中的处理单元产生。
9.根据权利要求8所述的装置，其特征在于，所述处理单元另外被布置成比较一连串电流输出值与预定响应代码。
10.一种制造电子装置的方法，其特征在于，所述方法包括提供具有以下项的所述电子装置：
-基板；
-集成电路；
-位于所述基板与所述集成电路之间的一层胶；
-耦合到所述胶和所述集成电路的驱动电极组；
-耦合到所述胶和所述集成电路的接收电极；
-耦合到所述胶和所述基板的反电极；
其中所述胶包括导电粒子，所述导电粒子与所述接收电极、所述反电极和所述驱动电极组的至少一部分电连接，使得如果驱动电流被提供到所述驱动电极组，那么所述驱动电流的至少一部分通过所述导电粒子和所述反电极流动到所述接收电极。
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