CN106973523A - 一种电路板焊锡装置 - Google Patents
一种电路板焊锡装置 Download PDFInfo
- Publication number
- CN106973523A CN106973523A CN201710327209.2A CN201710327209A CN106973523A CN 106973523 A CN106973523 A CN 106973523A CN 201710327209 A CN201710327209 A CN 201710327209A CN 106973523 A CN106973523 A CN 106973523A
- Authority
- CN
- China
- Prior art keywords
- scolding tin
- fortune
- groove
- pod
- vertical pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 238000005476 soldering Methods 0.000 title claims abstract description 16
- 238000012423 maintenance Methods 0.000 claims abstract description 58
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 239000000523 sample Substances 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 7
- 230000013011 mating Effects 0.000 claims description 8
- 230000002035 prolonged effect Effects 0.000 claims description 8
- 230000032258 transport Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 4
- 238000001727 in vivo Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710327209.2A CN106973523B (zh) | 2017-05-10 | 2017-05-10 | 一种电路板焊锡装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710327209.2A CN106973523B (zh) | 2017-05-10 | 2017-05-10 | 一种电路板焊锡装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106973523A true CN106973523A (zh) | 2017-07-21 |
CN106973523B CN106973523B (zh) | 2019-03-12 |
Family
ID=59331452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710327209.2A Expired - Fee Related CN106973523B (zh) | 2017-05-10 | 2017-05-10 | 一种电路板焊锡装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106973523B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070197077A1 (en) * | 2006-02-21 | 2007-08-23 | Hon Hai Precision Ind. Co., Ltd. | Land grid array connector with reinforcement stiffener |
CN102500861A (zh) * | 2011-10-29 | 2012-06-20 | 昆山明创电子科技有限公司 | 可调节过锡炉治具 |
CN204168611U (zh) * | 2014-08-22 | 2015-02-18 | 邓育智 | Pcb板的印锡贴片焊接治具 |
CN204859792U (zh) * | 2015-08-24 | 2015-12-09 | 无锡威达智能电子股份有限公司 | 一种电路板锡膏自动涂抹装置的移动机构 |
CN106002320A (zh) * | 2016-06-07 | 2016-10-12 | 石狮市固定科锁具有限公司 | 一种可双轴调节的工作台装置 |
CN106583825A (zh) * | 2016-12-22 | 2017-04-26 | 上海翁大电气科技有限公司 | 一种电路板分割设备 |
-
2017
- 2017-05-10 CN CN201710327209.2A patent/CN106973523B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070197077A1 (en) * | 2006-02-21 | 2007-08-23 | Hon Hai Precision Ind. Co., Ltd. | Land grid array connector with reinforcement stiffener |
CN102500861A (zh) * | 2011-10-29 | 2012-06-20 | 昆山明创电子科技有限公司 | 可调节过锡炉治具 |
CN204168611U (zh) * | 2014-08-22 | 2015-02-18 | 邓育智 | Pcb板的印锡贴片焊接治具 |
CN204859792U (zh) * | 2015-08-24 | 2015-12-09 | 无锡威达智能电子股份有限公司 | 一种电路板锡膏自动涂抹装置的移动机构 |
CN106002320A (zh) * | 2016-06-07 | 2016-10-12 | 石狮市固定科锁具有限公司 | 一种可双轴调节的工作台装置 |
CN106583825A (zh) * | 2016-12-22 | 2017-04-26 | 上海翁大电气科技有限公司 | 一种电路板分割设备 |
Also Published As
Publication number | Publication date |
---|---|
CN106973523B (zh) | 2019-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190202 Address after: Room 1801-1804, Block B, Kechuang Building, 586 Xihuan Road, Keqiao Economic Development Zone, Keqiao District, Shaoxing City, Zhejiang Province Applicant after: SHAOXING WEIHUA ELECTRONIC TECHNOLOGY CO.,LTD. Address before: 362700 Shiquan Road No. two, Shishi, Quanzhou, Fujian Province, 60 Applicant before: SHISHI GUDINGKE LOCKSET CO.,LTD. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220831 Address after: 312000 rooms 1611 and 1613, floor 16, No. 683, Yangming North Road, Yuecheng District, Shaoxing City, Zhejiang Province Patentee after: Core cube (Shaoxing) Semiconductor Co.,Ltd. Address before: Room 1801-1804, Block B, Kechuang Building, 586 Xihuan Road, Keqiao Economic Development Zone, Keqiao District, Shaoxing City, Zhejiang Province Patentee before: SHAOXING WEIHUA ELECTRONIC TECHNOLOGY CO.,LTD. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190312 |