CN106973489A - A kind of matching connection member in radio frequency microwave circuit plate and attaching method thereof - Google Patents
A kind of matching connection member in radio frequency microwave circuit plate and attaching method thereof Download PDFInfo
- Publication number
- CN106973489A CN106973489A CN201710404361.6A CN201710404361A CN106973489A CN 106973489 A CN106973489 A CN 106973489A CN 201710404361 A CN201710404361 A CN 201710404361A CN 106973489 A CN106973489 A CN 106973489A
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- China
- Prior art keywords
- connection member
- matching connection
- circuit board
- matching
- radio frequency
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
Abstract
The present invention relates to matching connection member in radio frequency microwave circuit plate design field, more particularly to a kind of radio frequency microwave circuit plate and attaching method thereof.If being provided with dry units and some transmission lines on radio frequency microwave circuit plate, connection member is matched to be located between transmission line and the pin pad of device, for realizing that the matching of transmission line and device is connected, matching connection member is board structure of circuit, and circuit board includes upper layer circuit board, middle layer circuit board and lower circuit plate;Middle layer circuit board is inclined-plane layer;Matching connection member is constituted between upper layer circuit board and middle layer circuit board, the thickness of matching connection member successively decreases step by step along transmission line to device direction.Upper layer circuit board is wiring layer, and middle layer circuit board and bottom circuit board all applies copper.Using the connection method of the matching connection member, the relation between the width and thickness of corresponding position matching connection member is set by default computational methods.It is capable of realizing impedance matching using the matching connection member, reduce return loss.
Description
Technical field
The present invention relates in radio frequency microwave circuit plate design field, more particularly to a kind of radio frequency microwave circuit plate
With connection member and attaching method thereof.
Background technology
, it is necessary to connect multiple modules using transmission line in the design of radio frequency microwave circuit plate.That is, in same
Circuit board top can place multiple functional units simultaneously.Some functional units are that (such as microstrip filter, micro-strip hinder distributed constant
Anti- matching etc.), some functional units are microwave integrated circuits, with the rise of frequency, and many microwave integrated circuits use QFN
Encapsulation mode.The characteristics of QFN encapsulation modes is the substantial amounts of pin of areal extent layout in very little, by the size for reducing device
Go to reduce the influence of distributed constant.So, on one piece of complicated circuit module, generally require interconnection distributed constant device with
Microwave integrated circuit device, and their characteristic size often differs greatly, and impedance is must take into consideration when being interconnected to them
Matching.
Typical QFN pin widths are about 0.25mm, and typical microwave transmission linear dimension is near 0.8-2mm.In order to
Accomplish impedance matching, it is necessary to which these QFN small pin is connected to above relatively wide transmission line, accordingly, it would be desirable to complete resistance
Anti- matched design.Otherwise, if impedance mismatch or matching are undesirable serious microwave signal can be caused to launch, when frequency foot
When enough high, or even circuit function is set to fail.
Current existing technology mainly completes QFN to the connection of transmission line using transition connecting line mode, or using micro-
The matching for being directly connected to introduce is made up with line compensation way to pay no attention to and think over a problem, such as in patent CN103547064, as shown in figure 1,
The matching that width gradual change transmission line is employed with matched transmission line and device pin is connected design method.This design method by
Laying ground connection copper sheet in width gradual change transmission line both sides is simultaneously grounded copper sheet and width gradual change transmission line according to the adjustment of predetermined computation method
Distance, make the impedance of width gradual change transmission line portions equal with matching transmission line impedence, realize impedance matching.Its return loss
About-the 19dB near 16GHz, this index meets the application of common engineering.But improved when to circuit characteristic requirement is further
When, the method is required further improvement.
The content of the invention
It is an object of the invention to provide matching connection member in a kind of radio frequency microwave circuit plate and attaching method thereof, make
The connection for obtaining QFN pins to other outside distributed constant devices completes impedance matching, increases its return loss.
The technical scheme is that:Matching connection member in a kind of radio frequency microwave circuit plate, in radio frequency microwave circuit
If plate is provided with dry units and some transmission lines, the matching connection member is located at transmission line and device in radio frequency microwave circuit plate
Pin pad between, for realize transmission line and device matching connect, it is described matching connection member be board structure of circuit, institute
Stating circuit board includes upper layer circuit board, middle layer circuit board and lower circuit plate;The middle layer circuit board is inclined-plane layer;The upper strata
Constitute matching connection member between circuit board and the middle layer circuit board, the thickness of the matching connection member is along the transmission line
Successively decrease step by step to the device direction.
Further, the upper layer circuit board is wiring layer, and the middle layer circuit board and the bottom circuit board are all applied
Copper.
Further, the width of the matching connection member is uniform between transmission line width and device pin pad width
Change, the matching connection member is equal with the width of the transmission line with the width of one end that the transmission line is connected, described
The width phase of the width and the pin pad of the device of one end that matching connection member is connected with the pin pad of the device
Deng.
A kind of connection method of matching connection member in radio frequency microwave circuit plate, the radio frequency microwave circuit plate is provided with
If dry units and some transmission lines, it is attached between the device and transmission line using above-mentioned matching connection member, it is right
The relation between the width and thickness that match connection member at position is answered to be set by default computational methods.
Further, default computational methods are as follows:
(a) it is the position extended to the left from device pin to set x, and it is the matching connecting portion at the x of position to set W (x)
The width of part, it is the thickness that connection member is matched at the x of position to set d (x), sets εeIt is normal for the equivalent relative dielectric of circuit board
Number, sets the impedance that Z (x) is the matching connection member at the x of position, and its calculation formula is as follows:
(b) keep W (x)/d (x) ratios constant, Z (x) is definite value, and the width W (0) of device pin is, it is known that can then calculate
d(0)。
(c) total length for setting matching connection member is L, and the thickness d (L) of whole matching connection member is, it is known that can calculate
Go out W (L), and then the W (x) and d (x) of any position can be calculated.
Further, the selection principle of the total length L of matching connection member is L > 5W (L).
Matching connection member of a kind of microwave radio circuit board of the present invention and attaching method thereof, with following beneficial effect
Really:
(1) setting of matching connection member is advantageously implemented the connection that matches between transmission line and device pin, completes resistance
Anti- matching;
(2) by realizing the corresponding relation of the width and thickness that match connection member, the anti-of microwave signal can effectively be reduced
Penetrate, improve return loss, and it is capable of realizing impedance matching that the corresponding width and thickness of connection member are only matched by changing, and is not had
The addition of redundant structure, simple structure.
Brief description of the drawings
, below will be to embodiment or existing for the clearer explanation embodiment of the present invention or technical scheme of the prior art
There is the accompanying drawing used required in technology description to be briefly described, it is clear that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is matching connection diagram of the transmission line to device in radio frequency microwave circuit plate in background technology;
Fig. 2 is wiring layer structural representation in radio frequency microwave circuit plate of the present invention matching connection member;
Fig. 3 is board structure of circuit side view in radio frequency microwave circuit plate of the present invention matching connection member;
Fig. 4 is applied to the interconnection structure schematic diagram in microwave circuit unit for the matching connection method of the present invention;
Fig. 5 is applied to the board structure of circuit side view in microwave circuit unit for the matching connection method of the present invention;
Fig. 6 is matching connection method and the reflectance factor S11 comparative bid parameter of conventional method of the application present invention;
In figure:1- matches layer circuit board in connection member, the upper layer circuit boards of 11-, 12-, 13- lower circuit plates, 2- transmission
Line, 3- devices.
Embodiment
Below in conjunction with the accompanying drawing in the present invention, clear, complete retouch is carried out to the technical scheme in the embodiment of the present invention
State, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on the present invention
In embodiment, all other reality that those skilled in the art is obtained on the premise of creative work is not made
Example is applied, protection scope of the present invention is belonged to.
Matching connection member 1 in a kind of radio frequency microwave circuit plate of the present invention, as shown in Figure 2 to Figure 3, in frequency microwave
If circuit board is provided with some transmission lines 2 and dry units 3, matching connection member 1 be located in radio frequency microwave circuit plate transmission line 2 with
Between the pin pad of device 3, for realizing that the matching of transmission line 2 and device 3 is connected, matching connection member 1 is that circuit is hardened
Structure, circuit board includes upper layer circuit board 11, middle layer circuit board 12 and lower circuit plate 13;Middle layer circuit board 12 is inclined-plane layer;On
Between layer circuit board 11 and middle layer circuit board 12 constitute matching connection member 1, match connection member 1 thickness along transmission line 2 to
Successively decrease step by step in the direction of device 3.
In microwave radio circuit board, the size difference between transmission line 2 and device 3 is larger, is interconnected to the two
When, it is necessary to consider resistance matching problem.Because when impedance mismatch, signal power losses, power with frequency can be caused
Fluctuations, influence signal quality.The setting of connection member 1 is matched, the connection between transmission line 2 and device 3 is realized, simultaneously
Matching connection member 1 is arranged to the board structure of circuit of gradient thickness on the basis of width gradual change, makes matching connection member 1 in width
To that there should be different thickness values while degree direction change, the impedance of connection member is matched beneficial to adjustment, makes itself and transmission line
Impedance is equal, realizes impedance matching.
Specifically, upper layer circuit board 11 is wiring layer, middle layer circuit board 12 and bottom circuit board 13 all apply copper.Middle level electricity
Road plate 12 and bottom circuit board 13 apply copper and are grounded, and can make stable signal transmission, greatly reduce the interference of electromagnetic radiation.
Specifically, the width of matching connection member 1 uniformly becomes between the width of transmission line 2 and the pin pad width of device 3
Change, matching connection member 1 it is equal with the width of transmission line 2 with the width of one end that transmission line 2 connect, match connection member 1 and
The width of one end of the pin pad connection of device 3 is equal with the width of the pin pad of device 3.Pass through the matching of width gradual change
Transmission line is attached by connection member with device, be compensate for being directly connected to the matching that introduces and is paid no attention to think over a problem, connect matching
The impedance of part is equal with transmission line impedance, realizes impedance matching.
On the connection method of matching connection member in a kind of radio frequency microwave circuit plate of the present invention, radio frequency microwave circuit plate
If provided with dry units 3 and some transmission lines 2, being connected between transmission line 2 and device 3 using above-mentioned matching connection member 1
Connect, the relation between the width and thickness of corresponding position matching connection member 1 is set by default computational methods.
Specifically, as shown in Figures 2 and 3, default computational methods are as follows:
(a) it is the position extended to the left from device pin to set x, and it is the matching connecting portion at the x of position to set W (x)
The width of part, it is the thickness that connection member is matched at the x of position to set d (x), sets εeIt is normal for the equivalent relative dielectric of circuit board
Number, sets the impedance that Z (x) is the matching connection member at the x of position, and its calculation formula is as follows:
(b) keep W (x)/d (x) ratios constant, Z (x) is definite value, and the width W (0) of device pin is, it is known that can then calculate
d(0)。
(c) total length for setting matching connection member is L, and the thickness d (L) of whole matching connection member is, it is known that can calculate
Go out W (L), and then the W (x) and d (x) of any position can be calculated.
Specifically, the selection principle of the total length L of matching connection member is L > 5W (L).
Specifically, in some embodiments of the invention, as shown in Figure 4 and Figure 5, should by the matching connection member of the present invention
The interconnection between line and device is transmitted for microwave circuit unit, realizes that QFN device is believed to the microwave of other microwave modules
Number transmission, the width of matching connection member any position and the relation of thickness are obtained by above-mentioned computational methods.Will be using this
The reflectance factor S11 parameter values obtained after the connection method of invention are compared with the S11 parameter values obtained using conventional method,
As shown in fig. 6, wherein solid line is the reflectance factor test chart of connection method of the present invention, dotted line is surveyed for the reflectance factor of conventional method
Attempt, by contrast, reflectance factor of this method on most of frequency range is better than conventional method 3-8dB or so, explanation
The matching effect of the connection method of matching connection member is more preferable in the microwave radio circuit board of the present invention.
The present invention is further described by specific embodiment above, it should be understood that, here specifically
Description, should not be construed as the restriction to the spirit and scope of the invention, and one of ordinary skilled in the art is reading this explanation
The various modifications made after book to above-described embodiment, belong to the scope that the present invention is protected.
Claims (6)
1. the matching connection member in a kind of radio frequency microwave circuit plate, it is characterised in that if being provided with radio frequency microwave circuit plate
Dry units and some transmission lines, the matching connection member are located at the pin pad of transmission line and device in radio frequency microwave circuit plate
Between, for realizing that the matching of transmission line and device is connected, the matching connection member is board structure of circuit,
The circuit board includes upper layer circuit board, middle layer circuit board and lower circuit plate;
The middle layer circuit board is inclined-plane layer;
Matching connection member, the thickness of the matching connection member are constituted between the upper layer circuit board and the middle layer circuit board
Successively decrease step by step along the transmission line to the device direction.
2. the matching connection member in radio frequency microwave circuit plate as claimed in claim 1, it is characterised in that the upper strata circuit
Plate is wiring layer, and the middle layer circuit board and the bottom circuit board all apply copper.
3. the matching connection member in radio frequency microwave circuit plate as claimed in claim 1, it is characterised in that the matching connection
The width of part even variation between transmission line width and device pin pad width, the matching connection member is passed with described
The width of one end of defeated line connection is equal with the width of the transmission line, and the matching connection member and the pin of the device are welded
The width of one end of disk connection is equal with the width of the pin pad of the device.
4. a kind of connection method of the matching connection member in radio frequency microwave circuit plate, it is characterised in that the frequency microwave electricity
If road plate is provided with dry units and some transmission lines, any one of claim 1-3 institute is utilized between the device and transmission line
The matching connection member stated is attached, and the relation between the width and thickness of corresponding position matching connection member passes through default
Computational methods set.
5. transmission line is to the matching connection method of device in a kind of radio frequency microwave circuit plate according to claim 4, it is special
Levy and be, default computational methods are as follows:
(a) it is the position extended to the left from device pin to set x, and it is the matching connection member at the x of position to set W (x)
Width, it is the thickness that connection member is matched at the x of position to set d (x), sets εeFor the equivalent relative dielectric constant of circuit board, if
Impedances of the Z (x) for the matching connection member at the x of position is put, its calculation formula is as follows:
(b) keep W (x)/d (x) ratios constant, Z (x) is definite value, and the width W (0) of device pin is, it is known that can then calculate d
(0)。
(c) total length for setting matching connection member is L, and the thickness d (L) of whole matching connection member is, it is known that W can be calculated
(L), and then the W (x) and d (x) of any position can be calculated.
6. transmission line is to the matching connection method of device in a kind of radio frequency microwave circuit plate according to claim 5, it is special
Levy and be, the selection principle for matching the total length L of connection member is L > 5W (L).
Priority Applications (1)
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CN201710404361.6A CN106973489A (en) | 2017-06-01 | 2017-06-01 | A kind of matching connection member in radio frequency microwave circuit plate and attaching method thereof |
Applications Claiming Priority (1)
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CN201710404361.6A CN106973489A (en) | 2017-06-01 | 2017-06-01 | A kind of matching connection member in radio frequency microwave circuit plate and attaching method thereof |
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CN201710404361.6A Pending CN106973489A (en) | 2017-06-01 | 2017-06-01 | A kind of matching connection member in radio frequency microwave circuit plate and attaching method thereof |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110602868A (en) * | 2019-08-16 | 2019-12-20 | 武汉光迅信息技术有限公司 | Flexible circuit board and corresponding optical module |
CN112203405A (en) * | 2020-10-26 | 2021-01-08 | 恒为科技(上海)股份有限公司 | Method for determining width of PCB (printed circuit board) bonding pad and PCB |
CN114424101A (en) * | 2019-08-27 | 2022-04-29 | Oe解决方案美国股份有限公司 | Method and apparatus for matching impedance of optical component using tapered transmission line |
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JP2001053507A (en) * | 1999-08-13 | 2001-02-23 | Nec Corp | Wiring board and manufacturing method therefor |
JP2001148553A (en) * | 1999-11-19 | 2001-05-29 | Fujitsu General Ltd | Microwave circuit |
JP2006173239A (en) * | 2004-12-14 | 2006-06-29 | Matsushita Electric Ind Co Ltd | Wiring substrate, its manufacturing method, and electronic equipment using the same |
CN101604643A (en) * | 2008-06-13 | 2009-12-16 | 索尼株式会社 | Method of attachment and substrate |
CN103547064A (en) * | 2013-10-11 | 2014-01-29 | 中国电子科技集团公司第四十一研究所 | Method for matched connection from transmission line to devices in radio frequency microwave circuit board |
CN105045985A (en) * | 2015-07-08 | 2015-11-11 | 浪潮电子信息产业股份有限公司 | Design method for realizing trace impedance matching |
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2017
- 2017-06-01 CN CN201710404361.6A patent/CN106973489A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001053507A (en) * | 1999-08-13 | 2001-02-23 | Nec Corp | Wiring board and manufacturing method therefor |
JP2001148553A (en) * | 1999-11-19 | 2001-05-29 | Fujitsu General Ltd | Microwave circuit |
JP2006173239A (en) * | 2004-12-14 | 2006-06-29 | Matsushita Electric Ind Co Ltd | Wiring substrate, its manufacturing method, and electronic equipment using the same |
CN101604643A (en) * | 2008-06-13 | 2009-12-16 | 索尼株式会社 | Method of attachment and substrate |
CN103547064A (en) * | 2013-10-11 | 2014-01-29 | 中国电子科技集团公司第四十一研究所 | Method for matched connection from transmission line to devices in radio frequency microwave circuit board |
CN105045985A (en) * | 2015-07-08 | 2015-11-11 | 浪潮电子信息产业股份有限公司 | Design method for realizing trace impedance matching |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110602868A (en) * | 2019-08-16 | 2019-12-20 | 武汉光迅信息技术有限公司 | Flexible circuit board and corresponding optical module |
CN114424101A (en) * | 2019-08-27 | 2022-04-29 | Oe解决方案美国股份有限公司 | Method and apparatus for matching impedance of optical component using tapered transmission line |
CN112203405A (en) * | 2020-10-26 | 2021-01-08 | 恒为科技(上海)股份有限公司 | Method for determining width of PCB (printed circuit board) bonding pad and PCB |
CN112203405B (en) * | 2020-10-26 | 2022-05-20 | 恒为科技(上海)股份有限公司 | Method for determining width of PCB bonding pad and PCB |
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Application publication date: 20170721 |
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