CN106972096A - A kind of heat-dissipating structure body and application - Google Patents
A kind of heat-dissipating structure body and application Download PDFInfo
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- CN106972096A CN106972096A CN201610969740.5A CN201610969740A CN106972096A CN 106972096 A CN106972096 A CN 106972096A CN 201610969740 A CN201610969740 A CN 201610969740A CN 106972096 A CN106972096 A CN 106972096A
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- 239000002905 metal composite material Substances 0.000 claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 29
- 239000004411 aluminium Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 229910000838 Al alloy Inorganic materials 0.000 claims description 13
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 11
- 239000007770 graphite material Substances 0.000 claims description 9
- 229910021382 natural graphite Inorganic materials 0.000 claims description 6
- 239000005030 aluminium foil Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000004519 grease Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 abstract description 14
- 239000010439 graphite Substances 0.000 abstract description 14
- 239000006185 dispersion Substances 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 235000010210 aluminium Nutrition 0.000 description 22
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 238000010273 cold forging Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002969 artificial stone Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of heat-dissipating structure body and application.The flat board that graphite metal composite is made is fixed on metal fin the heat-dissipating structure body for obtaining the present invention, so that the heat-dissipating structure body keeps the good characteristic of graphite metal composite, simultaneously, the presence of metal fin also compensate for the defect of the mechanical low intensity of graphite metal composite, so as to obtain a kind of heat-dissipating structure body that relatively inexpensive heat dispersion is excellent, mechanical strength is enough.The heat-dissipating structure body can be effectively reduced the semiconductor device temperature including LED, can effectively extend the life-span of various electronic equipments, be with a wide range of applications in industrial scale.
Description
Technical field
The present invention relates to technical field of electric equipment, in particular, it is related to a kind of radiating with excellent heat dissipation property
Tectosome and application.
Background technology
Graphite-metal complex containing graphite material is metal matrix graphite particle or graphite fibre as material
Side's pressure forming such as scattered metal-base composites, extrusion-molded body, cold forging body, mould etc., are molded and pass through through uniaxial pressure
The graphite formed body of sintering, as the graphite-based metallic composite of metal dispersion, and it is known.
On the other hand, the composite containing graphite, its thermal diffusivity is 1.5-3cm2/ sec, with generally widely utilizing
The thermal diffusivity 0.7-1.0cm of the heat carriers such as aluminium, aluminium nitride2/ sec is compared to much greater, and therefore, its remarkable heat dispersion is wide
It is well known.
Other aspects, the composite containing graphite, for example, the bending of the composite using the extrded material graphite of aluminium
Intensity is 30-40Mpa, and modulus of elasticity is 12Gpa, only the 1/10 of the mechanical strength of the common metal such as aluminium, magnesium, titanium, copper, iron.
Moreover, the fin of aluminum extruded material etc., because it can largely be produced, therefore inexpensively.And graphite-metal composite,
In contrast, although heat dispersion is more excellent but price is of a relatively high.
The content of the invention
One of technical problems to be solved by the invention are, are keeping the good characteristic of graphite-metal composite
Meanwhile, its weaker mechanical property is made up, so as to provide relatively inexpensive heat dispersion excellent heat-dissipating structure body.
The two of the technical problems to be solved by the invention are, solve LED module and the high load capacity half including IGBT
Conductor surface-mounted integrated circuit, due to the lost of life and failure problems caused by high temperature.
Technical proposal that the invention solves the above-mentioned problems is：A kind of heat-dissipating structure body is provided, includes the graphite-metal of laminating
Composite layer and metal fin, the graphite-metal composite layer are pressed into tabular by graphite-metal composite
And cut obtained.
In the heat-dissipating structure body that the present invention is provided, with high-pressure impregnation by artificial after aluminium, copper or aluminium/copper alloy are melted
The voidage that graphite and/or natural graphite powder are made is combined in the space of 5-40% graphite materials, to obtain the graphite-metal
Material.
The use of voidage is that 5-25% graphite materials obtain the graphite-gold in the heat-dissipating structure body that the present invention is provided
Belong to composite.
In the heat-dissipating structure body that the present invention is provided, the graphite-metal composite layer and the metal fin make
Fixed or electroplated with fastener with reference to fixation；The metal fin is made using aluminium, copper or aluminium/copper alloy.
In the heat-dissipating structure body that provides of the present invention, the graphite-metal composite layer and the metal fin it
Between be coated with thermally conductive grease.
The present invention also provides a kind of LED module, and LED sub-primes are arranged on to the electric insulation layer of copper foil or aluminium foil wiring board
On, and be embedded on the flat board that graphite-metal composite is made, LED module is made.
In the LED module that the present invention is provided, with high-pressure impregnation by artificial stone after aluminium, copper or aluminium/copper alloy are melted
The voidage that ink and/or natural graphite powder are made is in the space of 5-40% graphite materials, to obtain graphite-metal composite.
The present invention also provides a kind of LED, and the LED module is fixed on metal fin, LED is made.
In the LED that provides of the present invention, the flat board that the graphite-metal composite of the LED module is made with it is described
Metal fin is fitted.
In the LED that the present invention is provided, the flat board that the graphite-metal composite is made and the metal fin
Fixed or electroplated using fastener with reference to fixation；The metal fin is made using aluminium, copper or aluminium/copper alloy.
Implement the present invention, have the advantages that：The flat board that graphite-metal composite is made is fixed on metal and dissipated
The heat-dissipating structure body of the present invention is obtained on backing so that the heat-dissipating structure body keeps the good characteristic of graphite-metal composite,
Meanwhile, the presence of metal fin also compensate for the defect of the mechanical low intensity of graphite-metal composite, thus obtain it is a kind of compared with
For the cheap heat-dissipating structure body that heat dispersion is excellent, mechanical strength is enough.The heat-dissipating structure body can be effectively reduced including
Semiconductor device temperature including LED, can effectively extend the life-span of various electronic equipments, have in industrial scale extensive
Application prospect.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below by using required in embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is a kind of side view of preferred application mode of heat-dissipating structure body of the present invention；
Fig. 2 is a kind of front view of preferred application mode of heat-dissipating structure body of the present invention；
Fig. 3 is the structural representation of LED module preferred embodiment of the present invention.
Embodiment
Embodiments of the invention are specifically described below in conjunction with accompanying drawing.
Graphite-metal composite has remarkable heat dispersion, but is due to its fancy price and weaker machinery
Characteristic, limit such a quality material in the electrical apparatus widely use by.
The main innovation point of the present invention is that the flat board that graphite-metal composite is made is fixed on metal fin
On obtain the present invention heat-dissipating structure body so that the heat-dissipating structure body keep graphite-metal composite good characteristic, together
When, the presence of metal fin also compensate for the defect of the mechanical low intensity of graphite-metal composite, so as to obtain one kind more
The tectosome that cheap heat dispersion is excellent, mechanical strength is enough.
Fig. 1 is a kind of side view of preferred application mode of heat-dissipating structure body of the present invention, as shown in figure 1, the heat-dissipating structure body
Graphite-metal composite layer 102 and metal fin 103 including laminating, graphite-metal composite layer 102 by graphite-
Metallic composite is pressed into tabular and cut and is made.The installation settings of heater 101 is in graphite-metal composite layer 102
Surface.
The manufacture of graphite-metal composite, can be obtained by the pressurization impregnation method processing of melting forging method.For example, will
The voidage that aluminium, copper or aluminium/copper alloy are made up using high-pressure impregnation after melting of Delanium and/or natural graphite powder is 5-
In the space of 40% graphite material, graphite-metal composite is obtained.The graphite powder now utilized, can be native graphite
And/or Delanium, the graphite sold on open market can also be used.Preferred natural graphite of the present invention prepares graphite-metal and answered
Condensation material, for example, the graphited various powder formed using post-order processes such as coke, with tar, pitch or organic resin
Deng binding agent, formed body is produced using processes such as the square pressure forming such as extrusion forming, cold forging, abrasive tool mouldings.Hereafter, according to need
Will, can impregnating pitch repeatedly, finally heated to more than 2500 DEG C processing, it is possible to close to 100% graphite structure.
Graphite material used in the present invention, voidage is 5-40%, and it is more than 95% impregnated of metal material.If empty
Gap rate reaches more than 40%, and while the coefficient of thermal expansion increase of graphite-metal composite, thermal diffusivity can also be reduced.Cause
This, more satisfactory voidage is 5-25%.
By foregoing obtained graphite-metal composite, because processing characteristics is excellent, tabular can be processed into holding very much,
The sheet material below several millimeters of thickness can be especially processed into, as the substrate with superior heat radiation, for adhere to LED and including
High load capacity semiconductor including IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor)
Deng integrated circuit, the heat of these heat generating components generation is quickly exported.
Prepare in the metal that graphite-metal composite is used, be that JIS (close by Japan using the occasion of aluminium and aluminium alloy
Goldstandard) telescopic material, such as JIS casting alloys, JIS alloy for die casting.Using the occasion of copper and copper alloy, it can use
JIS stretches copper series alloy.
Fig. 2 is a kind of front view of preferred application mode of heat-dissipating structure body of the present invention, as shown in Fig. 2 by obtained above
Heat-dissipating structure body, in the position connected with heater, using the graphite-metal composite that heat diffusivity is excellent, with radiating table
The metal fin 103 that the big aluminium of area, copper or aluminium/Cu alloy material are made combines the heat-dissipating structure for obtaining fine heat radiation property
Body.
Graphite-metal composite layer 102 and metal fin 103 are fixed using fastener, for example, make to be screwed；
Can also be using being electroplated to its contact surface, i.e., plating, which is combined, fixes, and for example scolding tin combines fixed method.Graphite-metal
After composite layer 102 and metal fin 103 are fixed, graphite-metal composite layer 102 and metal fin 103
Between be coated with thermally conductive grease, such as machine silicone grease is conducive to heat conduction.
Metal fin 103 is made using aluminium, copper or aluminium/copper alloy.Can be by extrusion forming, grinding tool casting, die casting
It is made etc. method, especially combines and be made with calendering sheet material.The radiating surface and atmosphere of metal fin 103, or
It is applied in combination with radiator fan.
In the present embodiment, the heat that heater 101 (including LED module, IGBT or other integrated circuit boards) is produced, warp
Graphite-metal composite, is able to efficiently spread, and through the high fin fan heat release of the intensity with big surface area, structure
Into the construction of economic and excellent performance.
Fig. 3 is the structural representation of LED module preferred embodiment of the present invention, as shown in figure 3, LED sub-primes 201 are arranged on
On the electric insulation layer 204 of copper foil or aluminium foil wiring board, and it is embedded on the flat board 202 that graphite-metal composite is made, is made
LED module.Because the LED module is using COB (CHIP ON BOARD, chip on board encapsulation) mode, advantages.This LED
Module is greatly increased due to temperature reduction, illumination, and the life-span significantly extends so that produces LED etc. relatively inexpensively and is possibly realized.
Copper foil and aluminium foil can be used with ray mode.Meanwhile, insulating barrier can be using heat resistance good acid amides, aramid fiber, acid imide etc.
Organic film uses ceramic thin plate.
It is of course also possible to which directly LED sub-primes 201 are arranged on the electric insulation layer 204 of copper foil or aluminium foil wiring board simultaneously
Heat-dissipating structure body in embedded previous embodiment, or the LED module in above-described embodiment is fixed on metal fin 203
On, LED is made.In the LED of the present embodiment, flat board 202 and metal fin that graphite-metal composite is made
203 laminatings, due to using metal fin 203, compensate for the not enough weakness of the mechanical strength of graphite-metal composite, make
Performance and intensity are simultaneously deposited.Moreover, with all by graphite-metal composite compared with, price is more cheap.Particularly COB field
Close, eliminate the larger sapphire material of heat resist in LED sub-primes 201, radiating and economy are self-evident.
Embodiment 1
By the graphite block (East Sea carbon system) that size is 150mm × 200mm × 250mm, 700 DEG C of argon atmospheres are maintained at
In, on the other hand, by JISAC3A aluminium alloys, after 700 DEG C are dissolved, in injection dissolving forging mold, it is pressurized to 65Mpa
Casting, obtains graphite-metal composite.
By graphite-metal composite, taken out from above-mentioned cast member, determine its thermal diffusivity for 2.5cm2/sec.Enter
One step, the thick plates of 2cm is cut into the tabular of 60cm square, the aramid fiber resin of 60 μ m-thicks is sticked thereon, and with copper on
Paper tinsel formation is matched somebody with somebody after ray mode, according to COB modes, configures 40 LED sub-primes (201) (SEOUL CERACON society SV1400), is completed
Module.Thereon, by the heated portion Φ 90mm of aluminum thermal fin, with long 50mm, wide 15mm 20 fans, the basket of composition
Body, is screwed, the LED as 40W.This lamp is powered with voltage 115V, electric current 350mA.
After above-mentioned LED lighting 24 hours, the temperature measuring result at illumination and each position, as shown in table 1.
Comparative example 1
In embodiment 1, graphite-metal composite is replaced with aluminium sheet, LED energization is equally made, due to 1 hour
Back light extinguishes, therefore determines the illumination and temperature results of 30 minutes after energization, as shown in table 1.
Comparative example 2
In embodiment 1, instead of COB, with sapphire module is used under the LED sub-primes generally used, same LED is made
Lamp is powered, the illumination and each spot temperature result determined after 24 hours, as shown in table 1.
The illumination of table 1 and temperature measuring result
Embodiment 2
In embodiment 1, on the plate that graphite-metal composite is cut into that 80mm × 40mm, thickness are 3mm, it will generate heat
Measure and be screwed for 110W IGBT.On heated part 80mm × 40mm, will by height be 30mm, 30 pieces of fan aluminums
Fin, with graphite-metal PARTICLE BOARD SCREWS fix after be powered, determine composite temperature be 45 DEG C, fin
The temperature of fan is 36 DEG C.
Comparative example 3
In example 2, it is powered with C1100 instead of an equal amount of graphite-metal composite, C1100 temperature is
78 DEG C, the temperature of fin is 56 DEG C.
The heat-dissipating structure body that graphite-metal composite of the present invention is constituted with metal fin, can be effectively reduced bag
The semiconductor device temperature including LED is included, can effectively extend the life-span of various electronic equipments, is had in industrial scale wide
General application prospect.
Embodiments of the invention are described above in conjunction with accompanying drawing, but the invention is not limited in above-mentioned specific
Embodiment, above-mentioned embodiment is only schematical, rather than restricted, one of ordinary skill in the art
Under the enlightenment of the present invention, in the case of present inventive concept and scope of the claimed protection is not departed from, it can also make a lot
Form, these are belonged within the protection of the present invention.
Claims (10)
1. a kind of heat-dissipating structure body, it is characterised in that graphite-metal composite layer (102) and heat dissipation metal including laminating
Piece (103), the graphite-metal composite layer (102) is pressed into tabular and the system of cutting by graphite-metal composite
.
2. heat-dissipating structure body according to claim 1, it is characterised in that with height after aluminium, copper or aluminium/copper alloy are melted
The voidage that pressure dipping is made up of Delanium and/or natural graphite powder is described in the space of 5-40% graphite materials, obtaining
Graphite-metal composite.
3. heat-dissipating structure body according to claim 2, it is characterised in that obtained using voidage for 5-25% graphite materials
The graphite-metal composite.
4. heat-dissipating structure body according to claim 1, it is characterised in that the graphite-metal composite layer (102) and
The metal fin (103) is fixed or electroplated using fastener with reference to fixation；Metal fin (103) the use aluminium,
Copper or aluminium/copper alloy are made.
5. heat-dissipating structure body according to claim 1, it is characterised in that the graphite-metal composite layer (102) and
Thermally conductive grease is coated between the metal fin (103).
6. a kind of LED module, it is characterised in that LED sub-primes (201) are arranged on to the electric insulation layer of copper foil or aluminium foil wiring board
(204) on, and it is embedded on the flat board (202) that graphite-metal composite is made, LED module is made.
7. LED module according to claim 6, it is characterised in that with high pressure after aluminium, copper or aluminium/copper alloy are melted
It is in the space of 5-40% graphite materials, to obtain graphite-gold to impregnate the voidage being made up of Delanium and/or natural graphite powder
Belong to composite.
8. a kind of LED, it is characterised in that the LED module in claim 5 or 6 is fixed on metal fin (203)
On, LED is made.
9. LED according to claim 8, it is characterised in that the graphite-metal composite of the LED module is made
Flat board (202) fitted with the metal fin (203).
10. LED according to claim 8, it is characterised in that the flat board that the graphite-metal composite is made
(202) fix or electroplate using fastener with reference to fixation with the metal fin (203)；The metal fin (203)
It is made using aluminium, copper or aluminium/copper alloy.
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| CN201610969740.5A CN106972096A (en) | 2016-10-26 | 2016-10-26 | A kind of heat-dissipating structure body and application |
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| CN201610969740.5A CN106972096A (en) | 2016-10-26 | 2016-10-26 | A kind of heat-dissipating structure body and application |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246936A (en) * | 2019-06-18 | 2019-09-17 | 吕素萍 | A kind of high-brightness LED light source and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101458049A (en) * | 2008-12-02 | 2009-06-17 | 王晓山 | Composite graphite heat conducting radiation fins |
| KR20100009094U (en) * | 2009-03-09 | 2010-09-17 | 이영옥 | Power led chip power led metal pcb |
| CN102317236A (en) * | 2009-02-12 | 2012-01-11 | 电气化学工业株式会社 | Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member |
| CN102473829A (en) * | 2009-07-17 | 2012-05-23 | 电气化学工业株式会社 | LED chip assembly, LED package, and manufacturing method of LED package |
| CN102530933A (en) * | 2011-12-30 | 2012-07-04 | 清华大学 | Artificial graphite product taking emulsified asphalt as binder and preparation method thereof |
| CN203675528U (en) * | 2014-01-16 | 2014-06-25 | 中国科学院青岛生物能源与过程研究所 | Graphite film heat conduction radiating fin with wrinkle structure |
| CN103972379A (en) * | 2013-01-29 | 2014-08-06 | 世光国际贸易有限公司 | Light-emitting device with light-emitting diodes |
-
2016
- 2016-10-26 CN CN201610969740.5A patent/CN106972096A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101458049A (en) * | 2008-12-02 | 2009-06-17 | 王晓山 | Composite graphite heat conducting radiation fins |
| CN102317236A (en) * | 2009-02-12 | 2012-01-11 | 电气化学工业株式会社 | Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member |
| KR20100009094U (en) * | 2009-03-09 | 2010-09-17 | 이영옥 | Power led chip power led metal pcb |
| CN102473829A (en) * | 2009-07-17 | 2012-05-23 | 电气化学工业株式会社 | LED chip assembly, LED package, and manufacturing method of LED package |
| CN102530933A (en) * | 2011-12-30 | 2012-07-04 | 清华大学 | Artificial graphite product taking emulsified asphalt as binder and preparation method thereof |
| CN103972379A (en) * | 2013-01-29 | 2014-08-06 | 世光国际贸易有限公司 | Light-emitting device with light-emitting diodes |
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