CN106964629A - 一种废弃电路板的拆解方法 - Google Patents
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Abstract
一种废弃电路板拆解方法。由以下步骤组成：在100~200℃下熔化低熔点合金；将废弃电路板焊接面朝下置于低熔点合金熔体面上，于不低于140℃的温度下，摆动废弃电路板使电路板上的钎料熔化；将熔焊后的电路板取出，击打、震动或采用150℃左右的热风吹扫，使钎料合金和电子元器件脱落，与电路板分离；回收低熔点合金以及锡、铅、银、铜，低熔点合金经重新调配返回使用。本发明的方法可防止有机物热解产生毒害物质和降低可重用高值元件的损坏程度，降低处理废弃电路板的二次污染和提高资源利用价值。
Description
技术领域
本发明属危固废物环保处理及资源再生领域，涉及一种废弃电路板拆解新方法，特别涉及一种废弃电路板环保拆解新技术。
背景技术
废弃电路板是装嵌了各种电子元器件的电子线路板，与PCB板的显著差别是组成复杂，材料种类多，难以用简单的工艺处理与回收。废弃电路板上的元器件主要有二极管、三极管、电容、电感、电阻、集成电路芯片、光电耦合器、继电器、变压器及接插件等等，它们的材料组分差异大，对元器件进行拆解、分类资源化是公推和较为成熟的废弃电路板处理方法。废弃电路板上绝大部分电子元器件是钎料焊接的，熔焊是拆解废弃电路板的一个重要步骤，目前的方法主要有热传导熔焊、热空气熔焊、热介质熔焊和红外线熔焊等，操作温度一般介于280~400℃之间，将会引起电路板中有机物的热分解，产生高毒焦结物和烟气（含二恶英类化合物），难于处理，严重污染环境。此外，熔焊温度过高，会损坏可重用的高值电子元器件，降低电路板资源化利用价值。因此，降低电路板拆解熔焊温度，防止有机材料的热分解和可重用高值电子元器件损坏，是避免电路板处理过程污染环境和提高循环利用价值的一种重要技术手段。
发明内容
为有效解决废弃电路板拆解过程中存在的环境污染等问题，实现废弃电路板高效、绿色循环再利用。
本发明的技术方案依次由以下步骤组成：
（1）在100~200℃下熔化低熔点合金；
（2）将废弃电路板焊接面朝下置于低熔点合金熔体面上，于不低于140℃的温度下，摆动废弃电路板使电路板上的钎料熔化；
（3）将熔焊后的电路板取出，击打、震动或采用150℃左右的热风吹扫，使钎料合金和电子元器件脱落，与电路板分离；
（4）回收低熔点合金以及锡、铅、银和铜，低熔点合金经重新调配后返回步骤（1）。
所述低熔点合金为Bi-Pb-Sn系、Bi-Pb-Sn-In系或Bi-Pb-Sn-Cr系合金，合金中各组分质量比为0%~100%。
本发明的废弃电路板电子元器件拆解效率达到96%以上，其原理在于：废弃电路板上焊接元器件的钎料为锡基合金，如Sn-Pb、Sn-Ag-Cu、Sn-Bi、Sn-In等，与Bi-Pb-Sn系、Bi-Pb-Sn-In系和Bi-Pb-Sn-Cr系等低熔点合金成分相似，容易相溶合金化。本发明方法利用熔融的低熔点合金液浸蚀废弃电路板上的钎料，通过合金化降低钎料的熔化温度，实现废弃电路板的低温拆解。此外，循环使用的低熔点合金溶解的钎料量不断增加，影响熔焊能力后，可以采用真空冶金方法，分离低熔点和高熔点合金组分，实现低熔点合金的循环使用和钎料组分的综合回收。
本发明的优点主要在于：防止有机物热解产生毒害物质和降低可重用高值元件的损坏程度，降低处理废弃电路板的二次污染和提高资源利用价值。
具体实施方式
实施例1：收集废旧电路板15.35kg，手工拆除电路板上用螺丝紧固的元器件，并裁剪尺寸太大的电路板，使每块板的尺寸不大于25cm×25cm。以63Sn-37Pb钎料、金属铋、金属铅为原料，按Bi∶Pb∶Sn=52.5∶32.0∶15.5配制10kg混合料，将混合料置于不锈钢圆盘内电热板加热熔化、搅匀得到Bi-Pb-Sn低熔点合金，熔融合金保持150~160℃。逐一取废旧电路板放入不锈钢圆盘内的合金熔体上，放置时使废旧电路板焊接面（无元器件或含少量元器件一面）朝下置于合金液面上，轻微摆动电路板，保持1.5~2.5min，使电路板上的钎料熔化，随后取出电路板，用夹具钳制后击打3~5次，电路板上的电子元器件及钎料脱落，实现废旧电路板拆解。随机统计其中10块电路板的元器件拆解情况，拆除元器件1283个，基板上残留元器件38个，以个数计元器件的拆解效率为97.12%。全部废旧电路板拆解完后得到基板8.72kg，电子元器件6.41kg，占原料重量比例分别为56.81%和41.76%。拆解过程收集的钎料碎粒全部放回合金熔体中熔化，拆解完毕后冷却合金熔体，称重，合金总重为10.24kg，增加0.24kg。
实施例2：收集废旧电路板11.47kg，手工拆除电路板上用螺丝紧固的元器件，并裁剪尺寸太大的电路板，使每块板的尺寸不大于25cm×25cm。以63Sn-37Pb钎料、金属铋、金属铅为原料，按Bi∶Pb∶Sn=40∶30.0∶30.0配制10kg混合料，将混合料置于不锈钢圆盘内电热板加热熔化、搅匀得到Bi-Pb-Sn低熔点合金，熔融合金保持170~180℃。取废旧电路板放入不锈钢圆盘内的合金熔体上，放置时使废旧电路板焊接面朝下置于合金液面上，轻微摆动电路板，保持2.0~3.0min，使电路板上的钎料熔化，随后取出电路板，用夹具钳制后击打3~5次，电路板上的电子元器件及钎料脱落，实现废旧电路板拆解。随机统计其中10块板的元器件拆解情况，拆除元器件917个，基板上残留元器件32个，以个数计元器件的拆解效率为96.62%。全部废旧电路板拆解完后得到基板6.70kg，电子元器件4.59kg，占原料重量比例分别为58.41%和40.02%。拆解过程收集的钎料碎粒全部放回合金熔体中熔化，拆解完毕后冷却合金熔体，称重，合金总重为10.16kg，增加0.16kg。
实施例3：收集废旧电路板21.39kg，手工拆除电路板上用螺丝紧固的元器件，并裁剪尺寸太大的电路板，使每块板的尺寸不大于25cm×25cm。将Bi-Pb-Sn-In低熔点合金10.13kg置于不锈钢圆盘内电热板加热熔化，熔融合金保持140~150℃。逐一取废旧电路板放入不锈钢圆盘内的合金熔体上，放置时使废旧电路板焊接面朝下置于合金液面上，轻微摆动电路板，保持3.0~4.0min，使电路板上的钎料熔化，随后取出电路板置于振动台上震动，振动频率为20~30Hz，震动30秒后用夹具钳住后再击打1~2次，电路板上的电子元器件及钎料脱落，实现废旧电路板拆解。随机统计其中10块板的元器件拆解情况，拆除元器件1121个，基板上残留元器件45个，以个数计元器件的拆解效率为96.14%。全部废旧电路板拆解完后得到基板10.61kg，电子元器件10.27kg，占原料重量比例分别为49.60%和48.01%。拆解过程收集的钎料碎粒全部放回合金熔体中熔化，拆解完毕后冷却合金熔体，称重，合金总重为10.56kg，增加0.43kg。
实施例4：收集废旧电路板24.57kg，手工拆除电路板上用螺丝紧固的元器件，并裁剪尺寸太大的电路板，使每块板的尺寸不大于25cm×25cm。将Bi-Pb-Sn-Cd低熔点合金10.32kg置于不锈钢圆盘内电热板加热熔化，熔融合金保持140~150℃。逐一取废旧电路板放入不锈钢圆盘内的合金熔体上，放置时使废旧电路板焊接面朝下置于合金液面上，轻微摆动电路板，保持2.0~3.0min，使电路板上的钎料熔化，随后用钳具取出电路板，130~150℃的热风吹扫熔化的钎料，再击打2~3次，电路板上的电子元器件及钎料脱落，实现废旧电路板拆解。随机统计其中10块板的元器件拆解情况，拆除元器件986个，基板上残留元器件37个，以个数计元器件的拆解效率为96.38%。全部废旧电路板拆解完后得到基板14.65kg，电子元器件9.37kg，占原料重量比例分别为59.63%和38.14%。拆解过程收集的钎料碎粒全部放回合金熔体中熔化，拆解完毕后冷却合金熔体，称重，合金总重为10.71kg，增加0.39kg。
本发明还可有其他多种实施例，在不违背本发明主要实质的情况下，熟知本技术领域的相关人员可根据本发明做出合理的变型，但这些相应的变型都应属于本发明权利要求的保护范围。
Claims (2)
1.一种废弃电路板的拆解方法，其特征是由以下步骤组成：
（1）在100~200℃下熔化低熔点合金；
（2）将废弃电路板焊接面朝下置于低熔点合金熔体面上，于不低于140℃的温度下，摆动废弃电路板使电路板上的钎料熔化；
（3）将熔焊后的电路板取出，击打、震动或采用150℃左右的热风吹扫，使钎料合金和电子元器件脱落，与电路板分离；
（4）回收低熔点合金以及锡、铅、银和铜，低熔点合金经重新调配后返回步骤（1）。
2.根据权利要求1所述的一种废弃电路板的拆解方法，其特征是所述低熔点合金为Bi-Pb-Sn系、Bi-Pb-Sn-In系或Bi-Pb-Sn-Cr系合金，合金中各组分质量比为0%~100%。
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| CN101112728A (zh) * | 2007-08-30 | 2008-01-30 | 四川长虹电器股份有限公司 | 电路板元器件和焊料分离回收方法及装置 |
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