CN106963416A - Ultrasonic device, ultrasonic detector, electronic equipment and ultrasound imaging device - Google Patents
Ultrasonic device, ultrasonic detector, electronic equipment and ultrasound imaging device Download PDFInfo
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- CN106963416A CN106963416A CN201610915818.5A CN201610915818A CN106963416A CN 106963416 A CN106963416 A CN 106963416A CN 201610915818 A CN201610915818 A CN 201610915818A CN 106963416 A CN106963416 A CN 106963416A
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- 238000012285 ultrasound imaging Methods 0.000 title claims abstract description 25
- 239000011148 porous material Substances 0.000 claims abstract description 62
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 30
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 238000010521 absorption reaction Methods 0.000 claims description 19
- 238000003860 storage Methods 0.000 claims description 9
- 102100032884 Neutral amino acid transporter A Human genes 0.000 claims 1
- 101710160582 Neutral amino acid transporter A Proteins 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 14
- 229920001296 polysiloxane Polymers 0.000 description 14
- 239000012528 membrane Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 9
- 230000009471 action Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 6
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002604 ultrasonography Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920003225 polyurethane elastomer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
- G01S7/52079—Constructional features
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/34—Trocars; Puncturing needles
- A61B17/3403—Needle locating or guiding means
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4411—Device being modular
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/52—Devices using data or image processing specially adapted for diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/5207—Devices using data or image processing specially adapted for diagnosis using ultrasonic, sonic or infrasonic waves involving processing of raw data to produce diagnostic data, e.g. for generating an image
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
- G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
- G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
- G01S15/8911—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a single transducer for transmission and reception
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
- G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
- G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
- G01S15/8915—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
- G01S7/52053—Display arrangements
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/18—Methods or devices for transmitting, conducting or directing sound
- G10K11/26—Sound-focusing or directing, e.g. scanning
- G10K11/30—Sound-focusing or directing, e.g. scanning using refraction, e.g. acoustic lenses
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/34—Trocars; Puncturing needles
- A61B17/3403—Needle locating or guiding means
- A61B2017/3413—Needle locating or guiding means guided by ultrasound
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
- G01S7/52077—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging with means for elimination of unwanted signals, e.g. noise or interference
Abstract
The ultrasonic wave that can suppress useless is provided and ultrasonic device, ultrasonic detector, electronic equipment and the ultrasound imaging device of slimming can be realized.Wherein, ultrasonic device possesses backing portion, and ultrasonic detector possesses ultrasonic device, and electronic equipment possesses ultrasonic detector.Ultrasonic device is the ultrasonic device (1) for the transmitting-receiving for carrying out ultrasonic wave, is possessed：Including projecting the first face of ultrasonic wave and the ultrasonic element (10) in the second face；With support ultrasonic element (10) the second face and can make to the second surface side injection ultrasonic attenuation backing portion (20), backing portion (20) possess：The lenticule (200) of position corresponding with ultrasonic element (10) is configured in the second surface side of ultrasonic element (10)；With the backing components (210) of the slit pore (211) passed through with the ultrasonic wave for making to pass through lenticule (200).Ultrasonic element (10) is configured to array-like, and lenticule (200) is accordingly configured to array-like with ultrasonic element (10).
Description
Technical field
The present invention relates to ultrasonic device, possess the ultrasonic detector of ultrasonic device, possess ultrasonic detector
Electronic equipment and ultrasound imaging device.
Background technology
In the past, ultrasonic device included piezoelectric part, backing portion, acoustic matching layer and acoustic lens etc..Also, ultrasonic sound appratus
Part makes the ultrasonic wave produced by piezoelectric part be incident to subject via acoustic matching layer, acoustic lens.Then, ultrasonic device is received
In the back wave (ultrasonic wave) of subject internal reflection, the strong and weak corresponding voltage with back wave is produced.In addition, backing portion is supported
Piezoelectric part simultaneously makes useless ultrasonic attenuation, thus suppresses noise and is attached on the ultrasonic wave for being incident to subject.
It should be noted that being formed as in piezoelectric part (ultrasonic element) on the vibrating membrane of piezoelectric body layer on a silicon substrate
In the case of the membrane structure for being configured to array-like, in order to ensure including the rigid power for suppressing the flexure of ultrasonic element array etc.
Structural strength, has used metallic plate as the backing components for constituting backing portion.In addition, backing components make use of travel distance to get over
Long (thickness is thicker) characteristic that then ultrasonic wave is decayed all the more, therefore, uses the metallic plate with thickness more than rigid power.
Patent Document 1 discloses following ultrasonic probe：It is by the piezoelectric vibrator structure that is configured on back lining materials
Into back lining materials are formed by the composite comprising fibrous material and resin, the long side direction of fibrous material and piezoelectric vibrator
Direction of vibration is consistent on direction.It is light and wideband can be realized by using the ultrasonic probe in addition, in patent document 1
Frequency characteristic, can obtain the image of high image quality.In addition, in patent document 1, piezoelectric vibrator is made up of so-called build, make
For back lining materials, realized such as by disperseing a small amount of tungsten powder in the composite being made up of epoxy resin and carbon fiber
Lightweight.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2007-134767 publications
Currently, in order to improve the convenience of ultrasonic detector, ultrasound imaging device, it is desirable to using membrane structure
Slimming is realized in the ultrasonic device of ultrasonic element (ultrasonic element array).In particular it is desired that backing portion realize it is thin
Type.It should be noted that in the case where the conventional simple thickness for making backing components is thinning, existing and not declined by backing components
The problem of useless ultrasonic wave direction ultrasonic element side subtracted is projected and causes big noise contribution.Also, in B-mode image
When, the noise contribution is shown as artifact in Y direction (depth direction), thus, causes false results in inspection etc..
The content of the invention
Accordingly, it is desirable to which a kind of energy, which suppresses useless ultrasonic wave, can simultaneously realize slimming, ultrasonic sound appratus that is possessing backing portion
Part, the ultrasonic detector for possessing ultrasonic device, the electronic equipment and ultrasound imaging device for possessing ultrasonic detector.
The present invention is completed at least a portion in solving the above problems, and can be used as following mode or application
Example and realize.
Ultrasonic device involved by [application examples 1] the application example characterized in that, carry out sending and receiving for ultrasonic wave,
And possess：Ultrasonic element, including project the first face and the second face of ultrasonic wave；And backing portion, support ultrasonic element
Second face, can make the ultrasonic attenuation projected to the second face side, backing portion possesses：Lenticule, the of ultrasonic element
Two faces side, are configured at position corresponding with ultrasonic element；And backing components, lead to the ultrasonic wave through lenticule is made
The slit pore crossed.
According to such ultrasonic device, the backing portion in the second face of ultrasonic element is supported to possess lenticule and backing portion
Part.Also, lenticule is configured at position corresponding with ultrasonic element in the second surface side of ultrasonic element.Backing components have
Make the slit pore that the ultrasonic wave through lenticule passes through.Thus, enter in the ultrasonic wave projected from the second surface side of ultrasonic element
In the case of the lenticule for being mapped to backing portion, ultrasonic wave passes through lenticule, is projected in the state of convergence.Projected simultaneously from lenticule
The slit pore that the ultrasonic wave being converged passes through backing components.Then, the ultrasonic wave for having passed through slit pore advances to the end in backing portion
Face.Here, in the situation that the end face in backing portion is contacted with air layer, ultrasonic wave backing portion end face reflection, to
The direction (direction of slit pore) opposite with direct of travel up to the present is returned.But, in the case where reflecting return, surpass
Sound wave is spread.Therefore, again by the ultrasonic attenuation of slit pore.Action more than, can suppress to return from backing portion
To the ultrasonic wave (so-called useless ultrasonic wave) of ultrasonic element.Thereby, it is possible to suppress the ultrasound projected from the second surface side
Ripple is superimposed on the ultrasonic wave projected from the first surface side as noise.Also, backing portion (backing components) are relative to the conventional back of the body
The thickness of shirt portion (backing components), including lenticule can realize slimming to being able to ensure that the structural of ultrasonic element interiorly
Intensity and make the thickness of the bottom line of slit pore passed through from the ultrasonic wave that lenticule is projected.Thus, it can be achieved to suppress
Useless ultrasonic wave and the ultrasonic device for realizing slimming.
[application examples 2] preferably, in the ultrasonic device involved by above-mentioned application examples, ultrasonic element is configured to array
Shape, lenticule is accordingly configured to array-like with ultrasonic element.
According to such ultrasonic device, array-like is configured to and lenticule and ultrasonic element pair in ultrasonic element
In the case of being configured to array-like with answering, it also can assemble ultrasonic wave by using each lenticule and be passed to corresponding slit pore
Make the end face reflection in backing portion and the ultrasonic attenuation again by slit pore, so as to suppress useless ultrasonic wave.And
And, the thickness of backing portion (backing components) relative to conventional backing portion (backing components), it may include be configured to the micro- of array-like
Lens realize that slimming prevents the ultrasonic element for being configured to array-like (ultrasonic element array) to being able to ensure that interiorly
The structural strength of flexure etc. and make the thickness of the bottom line of slit pore passed through from the ultrasonic wave that lenticule is projected.Cause
This, the ultrasonic wave that can be achieved to suppress useless can simultaneously realize the ultrasonic device of slimming.
[application examples 3] preferably, in the ultrasonic device involved by above-mentioned application examples, slit pore is with being configured to array
The interval of the arrangement pitch of the lenticule of shape on an equal basis is configured.
According to such ultrasonic device, the arrangement pitch of lenticule of the slit pore with being configured to array-like is comparably carried out
Configuration, thus, injects corresponding slit pore with making the ultrasonic high-efficiency projected from ultrasonic element.Thus, slit pore can be made
As efficient configuration, accordingly, it is capable to further suppress to be back to the useless ultrasonic wave of ultrasonic element from backing portion, the back of the body can be made
Shirt portion is further thinned.
[application examples 4] preferably, in the ultrasonic device involved by above-mentioned application examples, lenticule and backing components are applied
It is covered with coating material.
According to such ultrasonic device, the air layer produced between ultrasonic element and backing portion can be prevented.In addition,
Used for example resin as coating material in the case of, can be matched with the acoustic impedance of ultrasonic element with degree.Thus,
The ultrasonic wave that can suppress to project from ultrasonic element makes it efficiently inject backing portion in the boundary face reflection in backing portion.Separately
Outside, the air layer of the inside in backing portion can be prevented, accordingly, it is capable to be carried on the back by (transmission) with making the ultrasonic high-efficiency projected from lenticule
The inside of the slit pore of shirt portion part.Thus, it can suppress to be back to the useless ultrasonic wave of ultrasonic element from backing portion.
[application examples 5] preferably, in the ultrasonic device involved by above-mentioned application examples, backing portion possesses absorption and passed through
The sound absorption portion of the ultrasonic wave of backing components.
According to such ultrasonic device, possess the sound absorption portion for absorbing the ultrasonic wave for having passed through backing components, thus, energy
Further suppression is back to the useless ultrasonic wave of ultrasonic element from backing portion.
Ultrasonic detector involved by [application examples 6] the application example is characterized in that, possess：Any of the above-described application examples institute
The ultrasonic device stated；And storage member, store ultrasonic device in the way of the part for making ultrasonic device is exposed.
According to such ultrasonic detector, the ultrasonic device for realizing slimming is accommodated in storage member to constitute
Ultrasonic detector, thus, can realize the slimming of ultrasonic detector.In addition, by storing the ultrasonic wave for suppressing useless
Ultrasonic device, projected from ultrasonic device to subject super is superimposed on so as to the ultrasonic wave that suppresses useless as noise
On sound wave.Thus, the quality of ultrasonic detector can be improved.
Electronic equipment involved by [application examples 7] the application example is characterized in that, possess：Above-mentioned ultrasonic detector；
And processing unit, ultrasonic detector is controlled, and handle the input signal from ultrasonic detector.
According to such electronic equipment, the ultrasonic detector improved by realizing slimming and quality is filled with processing
Put, so as to improve the convenience and quality of electronic equipment.
Ultrasound imaging device involved by [application examples 8] the application example is characterized in that, possess：Above-mentioned ultrasonic wave is visited
Survey device；Processing unit, controls ultrasonic detector, handles the input signal from ultrasonic detector and generates image；And
Display device, shows the image generated by processing unit.
According to such ultrasound imaging device, by realize the ultrasonic detector of slimming, processing unit and
Display device, so as to improve the convenience of ultrasound imaging device.Further, since possessing the ultrasound for the ultrasonic wave for suppressing useless
Wave detector (ultrasonic device), so that ultrasound imaging device can suppress the generation of artifact when carrying out B-mode image, because
This, can reduce the reason for causing false results in inspection etc..Thus, the quality of ultrasound imaging device can be improved.
Brief description of the drawings
Fig. 1 is the stereogram for the schematic configuration for representing the ultrasound imaging device involved by first embodiment.
Fig. 2 is the stereogram for the schematic configuration for representing ultrasonic detector.
Fig. 3 is the stereogram for the schematic configuration for representing ultrasonic device.
Fig. 4 is the plan for the schematic configuration for representing ultrasonic element.
Fig. 5 is the sectional view for the schematic configuration for representing ultrasonic element.
Fig. 6 is the explanation figure for the schematic configuration for representing ultrasonic element array.
Fig. 7 is the sectional view for the composition for representing ultrasonic device.
Fig. 8 be from backing portion unilateral observation ultrasonic device when plan.
Fig. 9 is the sectional view for the composition for representing the ultrasonic device involved by second embodiment.
Description of reference numerals
1、1A：Ultrasonic device；10：Ultrasonic element；10A：Ultrasonic element array；20、20A：Backing (バ ッ キ Application
グ) portion；30：Acoustic matching layer；40：Acoustic lens；80：Storage member；81：Incorporating section；100：Ultrasonic detector；101：Processing dress
Put；102：Display device；110：Ultrasound imaging device；200：Lenticule；200A：Microlens array；210：Backing components；
211：Slit pore；220：Sound absorption portion；250：Coating material (コ ー テ ィ Application グ materials)
Embodiment
In the present embodiment, with reference to the accompanying drawings, illustrate ultrasonic device 1, possess the ultrasonic detector of ultrasonic device 1
100 and possesses the ultrasound imaging device 110 as electronic equipment of ultrasonic detector 100.It should be noted that each
Each part in accompanying drawing is set to the size that can recognize that on each accompanying drawing, therefore, makes the engineer's scale of each part is different to carry out
Diagram.
[first embodiment]
Fig. 1 is the stereogram for the schematic configuration for representing the ultrasound imaging device 110 involved by first embodiment.Reference
Fig. 1 illustrates the composition of ultrasound imaging device 110.
The ultrasound imaging device 110 of present embodiment is a kind of following device：Make ultrasonic detector 100 with being examined
Skin surface of body etc. is adjacent to and kept, then, sends ultrasonic wave from ultrasonic detector 100 and receives from subject internal reflection
Back wave (ultrasonic wave), parse the data of ultrasonic wave received and shown as image.Surgeon side confirms should
Image, side carries out puncture action etc..
Possess ultrasonic detector 100, processing unit 101 as the ultrasound imaging device 110 of electronic equipment and show
Showing device 102.Ultrasonic detector 100 and processing unit 101 receive and dispatch telecommunications by being connected with each other with flexible cable 103
Number.Possesses display device 102 in processing unit 101, to show that the image for being handled and being generated by processing unit 101 (is based on by surpassing
The image for the ultrasonic wave that acoustic detector 100 is detected).
Fig. 2 is the stereogram for the schematic configuration for representing ultrasonic detector 100.Specifically, Fig. 2 is pasted from skin surface
Stereogram during tight unilateral observation ultrasonic detector 100.Fig. 3 is the stereogram for the schematic configuration for representing ultrasonic device 1.
Reference picture 2, Fig. 3 illustrate ultrasonic detector 100, the composition of ultrasonic device 1.
As shown in Fig. 2 the ultrasonic detector 100 of present embodiment is configured to possess ultrasonic device 1, storage member 80
Deng.As shown in figure 3, the tabular that ultrasonic device 1 is formed as a generally rectangular.Storage member 80 is also same with ultrasonic device 1
The tabular that ground is formed as a generally rectangular.Storage member 80 has incorporating section 81, makes the part as ultrasonic device 1
Acoustic lens 40 (lens section 41) stores ultrasonic device 1 in the state of exposing.It should be noted that being received by ultrasonic device 1
When being contained in incorporating section 81, by the seal member 85 of organosilicon (シ リ コ ー Application) class is clipped in the medial surface of incorporating section 81 with
In the gap of the lateral surface of ultrasonic device 1, so that salable incorporating section 81 and the gap of ultrasonic device 1.In this embodiment party
In formula, synthetic resin members formation storage member 80 is used.It is however not limited to which this, can be used other parts, such as metal parts
Deng.
As shown in figure 3, the ultrasonic device 1 of present embodiment is configured to be formed as the ultrasonic element array of rectangle
Include acoustic matching layer 30, acoustic lens 40 and backing portion 20 etc. centered on 10A (ultrasonic element 10).Ultrasonic device 1 will be by
The ultrasonic wave that ultrasonic element 10 is produced incides subject via acoustic matching layer 30, acoustic lens 40.Then, ultrasonic device 1
The back wave (echo) in the ultrasonic wave of subject internal reflection is received, and produces the strong and weak corresponding voltage with echo.
Acoustic matching layer 30 reduces the difference of the acoustic impedance of ultrasonic element array 10A and subject and suppresses the reflection of ultrasonic wave
And efficiently obtain the acoustic matching for being incident to inside subject.As shown in Figure 2 and Figure 3, acoustic lens 40 is being used as outer surface
There is lens section 41 that is convex in a thickness direction, being formed as local cylindrical shape in simultaneously.The curvature of lens section 41
Set according to the focal position of ultrasonic wave.Also, acoustic lens 40 makes to penetrate in ultrasonic element array 10A by the lens section 41
The diffusion of the ultrasonic wave gone out is assembled and improves resolution ratio, also, backing portion 20 makes from the useless of ultrasonic element array 10A injections
Ultrasonic attenuation, thus improve image in range resolution ratio.
It should be noted that as shown in Fig. 2 scanning direction D2 is defined as parallel with the bus of acoustic lens 40, will cut into slices
Direction D1 is defined as parallel with the face that the incorporating section 81 of storage member 80 is formed at the positive intersecting and merging of the bus of acoustic lens 40.
In the face, scanning direction D2 and slice direction D1 are mutually orthogonal.
Fig. 4 is the plan for the schematic configuration for representing ultrasonic element 10.Fig. 5 is the outline structure for representing ultrasonic element 10
Into sectional view.It should be noted that Fig. 5 is illustrated that along the section of Fig. 4 A-A lines of cut.Fig. 6 is to represent ultrasonic element
The explanation figure of part array 10A schematic configuration.4~Fig. 6 of reference picture illustrates the ultrasonic element 10 and ultrasonic wave of present embodiment
Element arrays 10A composition.It should be noted that the ultrasonic element 10 of present embodiment is made up of the piezoelectric element of film.
As shown in Figure 4, Figure 5, ultrasonic element 10 have basal substrate 11, be formed at the vibrating membrane 13 of basal substrate 11 with
And the piezoelectrics portion 18 on vibrating membrane 13.Also, piezoelectrics portion 18 has first electrode 14, the electricity of piezoelectric body layer 15, second
Pole 16.
Ultrasonic element 10 on the basal substrates such as silicon 11 have opening portion 12, and possess covering opening portion 12 blocked
Vibrating membrane 13.Carried out from the back side (face for the not forming element) side of basal substrate 11 by reactive ion etching (RIE) etc.
Etch and form opening portion 12.Vibrating membrane 13 is for example by silica (SiO2) layer and zirconium oxide (ZrO2) layer double-layer structure constitute.
Here, in the case where basal substrate 11 is silicon substrate, can be by carrying out thermal oxidation to substrate surface come film forming silica
Layer.In addition, carrying out film forming zirconia layer for example, by methods such as sputterings on silicon oxide layer.Here, zirconia layer is for example to make
With lead zirconate titanate (PZT) as piezoelectric body layer 15 described later in the case of be used for prevent constitute PZT lead be diffused into silicon oxide layer
Layer.In addition, zirconia layer is also improved relative to effect of flexure efficiency of the deformation of piezoelectric body layer 15 etc..
First electrode 14 is formed with the upper surface of vibrating membrane 13, piezoelectric body layer is formed with the upper surface of first electrode 14
15, and then it is formed with second electrode 16 in the upper surface of piezoelectric body layer 15.In other words, piezoelectrics portion 18 is by by piezoelectric body layer
15 are clipped in the structure between first electrode 14 and second electrode 16 to constitute.
First electrode 14 in the case where being formed by metallic film and being possessed multiple ultrasonic elements 10 (piezoelectric body layer 15),
As shown in Figure 4 or to element-forming region lateral and with adjacent ultrasonic element 10 (piezoelectric body layer 15)
The distribution of connection.
Piezoelectric body layer 15 is for example formed by PZT (lead zirconate titanate) film, is disposed at least one of first electrode 14
Point.It should be noted that the material of piezoelectric body layer 15 is not limited to PZT, for example, it can also use lead titanates (PbTiO3), lead zirconates
(PbZrO3), load lanthanium titanate ((Pb, La) TiO3) etc..
Second electrode 16 is formed by metallic film, is disposed at least a portion of piezoelectric body layer 15.It is multiple possessing
In the case of ultrasonic element 10 (piezoelectric body layer 15), the second electrode 16 is as shown in Figure 4 or to element-forming region
Lateral and the distribution that is connected with adjacent ultrasonic element 10 (piezoelectric body layer 15).
In addition, as shown in figure 5, possessing covering ultrasonic element 10 to prevent from the outside damp course 19 for oozing tide.Should
Damp course 19 is formed by materials such as aluminum oxide, located at the entire surface or a part of ultrasonic element 10.It should be noted that damp proof
The structure for being appropriately arranged with or being not provided with damp course 19 according to the state, environment used of layer 19.
By applying voltage between first electrode 14 and second electrode 16, so that piezoelectric body layer 15 is stretched in the in-plane direction
Contracting.Thus, when applying voltage to piezoelectric body layer 15, for example, produce the flexure for becoming convex in the side of opening portion 12 and scratch vibrating membrane 13
It is bent.By applying alternating voltage to piezoelectric body layer 15, thus, vibrating membrane 13 vibrates in film thickness direction, passes through the vibrating membrane 13
Vibration, ultrasonic wave is projected from opening portion 12.Also, also project ultrasound in the side (element formation side) opposite with opening portion 12
Ripple.It should be noted that the ultrasonic device 1 of present embodiment will be penetrated in the side (element formation side) opposite with opening portion 12
The ultrasonic wave direction subject gone out is projected.Voltage (driving voltage) such as peak-to-peak value for putting on piezoelectric body layer 15 is 10V~30V,
Frequency is, for example, 1MHz~10MHz.
The receiving element for the echo that the ultrasonic wave that ultrasonic element 10 is also projected as receiving is reflected and returned by object
And act.Vibrating membrane 13 is vibrated due to echo, because the vibration applies stress to piezoelectric body layer 15, in first electrode 14 and the
Voltage is produced between two electrodes 16.The voltage subtraction can be regard as reception signal.
Below, reference picture 6 illustrates the ultrasonic element array 10A that above-mentioned ultrasonic element 10 is configured to array-like.
Ultrasonic element array 10A includes being configured to multiple ultrasonic elements 10 of array-like, driving electrodes line DL, public
Electrode wires CL.Multiple ultrasonic elements 10 are configured to the rectangular of m rows n row.In figure 6, as one, along slice direction D1
8 rows are configured to, 12 row are configured to along scanning direction D2.
Driving electrodes line DL1~DL12 is connected up respectively along slice direction D1.During the transmission of ultrasonic wave is projected, constitute
Transmission signal VT1~VT12 that the process circuit (omit diagram) of processing unit 101 is exported via driving electrodes line DL1~
DL12 is fed to each ultrasonic element 10.In addition, in the reception period for the echo-signal for receiving ultrasonic wave, from ultrasonic element
10 reception signal VR1~VR12 is output to process circuit via driving electrodes line DL1~DL12.
Public electrode wire CL1~CL8 is connected up respectively along scanning direction D2.It is public to public electrode wire CL1~CL8 supplies
Voltage VCOM.Common electric voltage VCOM is certain DC voltage, may not be 0V, i.e. earthing potential (ground
potential)。
During sending, the voltage of the difference of signal voltage transmission and common electric voltage puts on each ultrasonic element 10, projects
The ultrasonic wave of assigned frequency.It should be noted that the matrix that the configuration of ultrasonic element 10 is not limited to the m rows n row shown in Fig. 6 is matched somebody with somebody
Put.
Fig. 7 is the sectional view for the composition for representing ultrasonic device 1.Specifically, it is to cut ultrasonic wave in scanning direction D2
Sectional view after device 1.Plan when Fig. 8 is the ultrasonic device 1 from the side of backing portion 20.It should be noted that in order to
It is easy to explanation, Fig. 8 illustrates the backing components 210 of the coating of coated material 250 with solid line.In addition, for convenience of description, will sweep
The number for retouching direction D2 ultrasonic element 10 is illustrated as 10.Reference picture 3, Fig. 7, Fig. 8 illustrate the composition of ultrasonic device 1.
As described above, ultrasonic device 1 is configured to be formed as the ultrasonic element array 10A (ultrasonic elements of rectangle
10) acoustic matching layer 30, acoustic lens 40 and backing portion 20 etc. are included centered on.In the present embodiment, in ultrasonic element battle array
Element formation face (the first face) for arranging 10A forms acoustic matching layer 30, and acoustic lens 40 is formed on the top of acoustic matching layer 30.In addition,
In ultrasonic element array 10A face (the second face) the formation support ultrasonic element array with element formation face opposite side
10A backing portion 20.
Acoustic lens 40 is formed by resins such as silicones (シ リ コ ー Application Trees fat).As shown in figure 3, the lens section of acoustic lens 40
41 are disposed over the corresponding scope of ultrasonic element 10 with constituting ultrasonic element array 10A.
Acoustic matching layer 30 is formed between ultrasonic element array 10A and acoustic lens 40.Acoustic matching layer 30 is by using having
The bonding agent of machine silicon class simultaneously makes bonding agent solidify and ultrasonic element array 10A adheres (Nian Jie) with acoustic lens 40, solidification
Bonding agent (resin) is used as the function of acoustic matching layer 30.Acoustic matching layer 30 is relaxed between ultrasonic element 10 and acoustic lens 40
The mismatch of acoustic impedance.
Ultrasonic element array 10A be silicones is filled to be formed at basal substrate 11 opening portion 12 in and solidify,
The state of opening portion 12 is filled out with silicones.Thus, in the case where being connected with backing portion 20 described later, prevent in opening portion 12
Middle generation air layer.
Backing portion 20 includes microlens array 200A and backing components 210.In addition, microlens array 200A and backing components
210 are coated with coating material 250.
Microlens array 200A functions as the lens for achieving acoustic matching.Microlens array 200A profile shape
As rectangle.The lens (lenticule 200) that microlens array 200A is formed as convex are configured to array-like.In addition, each lenticule
200 and ultrasonic element array 10A each ultrasonic element 10 is accordingly configured at relative position.It should be noted that micro-
Lens array 200A (lenticule 200) is formed by the acoustic impedance silicones close with ultrasonic element 10.In addition, present embodiment
The acoustic impedance of ultrasonic element 10 be about 1MRayl.
In the present embodiment, backing components 210 by profile be rectangle and be tabular metal parts parts of stainless steel
Constitute.It should be noted that backing components 210 can also use metal parts, ceramic component beyond parts of stainless steel etc..
Backing components 210 have the slit pore 211 of insertion in a thickness direction.In the present embodiment, slit pore 211 with
Lenticule 200 is correspondingly formed.It should be noted that lenticule 200 and ultrasonic element array 10A 10 pairs of ultrasonic element
Should, therefore, slit pore 211 is correspondingly formed with ultrasonic element 10.
Slit pore 211 is by the equal interval (spacing) of arrangement pitch of the lenticule 200 with being configured to array-like, in this reality
Apply in mode be formed with shape corresponding with the quantity for the lenticule 200 being arranged on slice direction D1 it is multiple.In Fig. 7, Fig. 8
In, the long side direction of slit pore 211 is formed by the corresponding length of 5 lenticules 200 with being arranged on slice direction D1.Separately
Outside, slit pore 211 is formed with 10 altogether in scanning direction D2 by the interval (spacing) of the arrangement pitch with lenticule 200 on an equal basis.
The width of the short side direction of slit pore 211 is set as larger than the beam diameter of ultrasonic wave so that assembled by lenticule 200 and
The ultrasonic wave energy of injection passes through.
In the present embodiment, slit pore 211 is formed by Laser Processing.Specifically, slit pore 211 by using
The Laser Processing of so-called picosecond laser (short-pulse laser) and formed.It should be noted that picosecond laser represents laser
The pulse width of irradiation time is located at the laser in the region of psec, and irradiation time is short, therefore processing department periphery is not easily susceptible to heat
Influence, is not likely to produce burr etc. caused by melting, and can carry out highdensity hole machined with high accuracy.
It should be noted that as described above, microlens array 200A and the overall coated material 250 of backing components 210 are applied
Cover.As coating material 250, in the present embodiment using silicones.
In addition, formation microlens array 200A silicones is compared with for the silicones of coating material 250, crosslinking agent
Amount is allocated less.Thus, microlens array 200A is constituted softlyer compared with coating material 250.
As painting method, in the present embodiment, microlens array 200A is placed in the folder as coating first
In the container of tool.Now, lenticule 200 is loaded in the way of upward.Then, set on microlens array 200A top
Backing components 210.Now, contraposition setting is carried out in the way of the center that slit pore 211 is located at lenticule 200.
Then, silicones is flowed into container, it is being coated with microlens array 200A and backing components 210 are overall
Solidify under state.Thus, microlens array 200A each lenticule 200 and peripheral part, in the slit pore 211 of backing components 210
Portion and peripheral part are applied, and complete backing portion 20.
The backing portion 20 so constituted is aligned, and ultrasonic element array 10A is adhered to via adhesive linkage 50.Adhesive linkage
50 use so-called double faced adhesive tape in the present embodiment.
Then, the action on ultrasonic wave in backing portion 20 is illustrated.
The ultrasonic wave projected from ultrasonic element 10 through be filled in opening portion 12, acoustic impedance and ultrasonic element 10 be
The silicones of same degree, and pass through adhesive linkage 50.The lenticule battle array in backing portion 20 is incided through the ultrasonic wave of adhesive linkage 50
Arrange 200A.
As described above, the microlens array 200A in backing portion 20 uses silicones, its acoustic impedance and ultrasonic element 10
Acoustic impedance is same degree, therefore suppresses boundary face reflection of the ultrasonic wave in microlens array 200A, and ultrasonic wave incides micro-
Lens array 200A inside.
As shown in fig. 7, the ultrasonic wave for inciding microlens array 200A enters in corresponding lenticule 200, and because thoroughly
Mirror effect and project in the state of assembling.It should be noted that passing through the coating material formed by the silicones harder than lenticule 200
Material 250, the ultrasonic wave projected from lenticule 200 is suppressed and projected in the reflection of the boundary face of lenticule 200.
The ultrasonic wave projected in the state of convergence from the lenticule 200 with the function as lens passes through coating material
250, incide the corresponding slit pore 211 of backing components 210.It should be noted that the inside coated material of slit pore 211
250 fillings, therefore, the inside that ultrasonic wave passes through slit pore 211 (through the coating material 250 of filling).Slit pore 211 is passed through
Ultrasonic wave turn into from backing components 210 project state, towards backing portion 20 end face advance.
It should be noted that in the case of being air layer before backing portion 20, reach backing portion 20 end face it is super
Sound wave is substantially totally reflected in the end face as boundary face.Then, the ultrasonic wave of reflection towards backing components 210 while diffusion while row
Enter.A part for the ultrasonic wave for spreading and advancing is incident to slit pore 211, and lenticule 200 is passed through by path contrary to the above
Inside and be back to ultrasonic element 10.But, the ultrasonic wave by slit pore 211 is the ultrasonic wave after end face diffusion,
Also, the width of slit pore 211 be also can by the width of the ultrasonic wave after convergence, less, therefore, ultrasonic wave fully declines
Subtract.Thus, the useless ultrasonic wave for being back to ultrasonic element is inhibited.
As shown in figure 8, backing components 210 are made up of the metal parts (parts of stainless steel) of rectangle, except in slice direction
Beyond the slit pore 211 extended on D1, peripheral part is connected.Also, backing components 210, which have, to be ensured to prevent ultrasonic element array
Rigid power needed for the structural strength of 10A flexure etc..
In addition, slit pore 211 is set as to ensure to prevent the structural strong of ultrasonic element array 10A flexure etc.
Suppress the thickness of useless ultrasonic wave (useless ultrasonic wave enters allowed band) on the basis of degree (thickness).In other words,
Backing portion 20 is set as being able to ensure that the structural strength of the flexure for preventing ultrasonic element array 10A etc. and can suppress useless
Ultrasonic wave slit pore 211 thickness.
In the past, as backing portion (backing components), the metal parts (parts of stainless steel) that thickness is 10mm degree has been used,
But the metal parts (parts of stainless steel) that thickness is 3mm~5mm degree can be used in the backing components 210 of present embodiment.
According to above-mentioned embodiment, following effect can obtain.
According to the ultrasonic device 1 of present embodiment, (opposite with element formation face from the second face of ultrasonic element 10
The face of side) side project ultrasonic wave incide the lenticule 200 in backing portion 20 in the case of, ultrasonic wave passes through lenticule
200 and in the state of convergence project.The slit that the ultrasonic wave for projecting and being converged from lenticule 200 passes through backing components 210
Hole 211.Then, the ultrasonic wave for having passed through slit pore 211 advances to the end face in backing portion 20.Here, for example in backing portion 20
In situation that end face is contacted with air layer etc., ultrasonic wave backing portion 20 end face reflection and to traveling side up to the present
(direction of slit pore 211) is returned in the opposite direction.But, in the case where reflection is returned, ultrasonic wave divergence.Therefore,
It is attenuated again by the ultrasonic wave of slit pore 211.Action more than, can suppress to be back to ultrasonic element from backing portion 20
The ultrasonic wave (so-called useless ultrasonic wave) of part 10.Also, backing portion 20 (backing components 210) are relative to conventional backing portion
The thickness of (backing components), including lenticule 200 can realize slimming to the structure for being able to ensure that ultrasonic element 10 interiorly
Property intensity and make the thickness of the bottom line of slit pore 211 passed through from the ultrasonic wave that lenticule 200 is projected.Therefore, can be real
Show the ultrasonic wave that can suppress useless and realize the ultrasonic device 1 of slimming.
According to the ultrasonic device 1 of present embodiment, ultrasonic element 10 be configured to array-like and lenticule 200 with
In the case that ultrasonic element 10 is accordingly configured to array-like, ultrasonic wave can be also assembled by using each lenticule 200 and makes it
Make end face reflection in backing portion 20 by corresponding slit pore 211 and again by the ultrasonic attenuation of slit pore 211, from
And useless ultrasonic wave can be suppressed.Also, backing portion 20 (backing components 210) are relative to conventional backing portion (backing components)
Thickness, it may include the lenticule 200 for being configured to array-like realizes that slimming prevents from being configured to array to being able to ensure that interiorly
The structural strength of the flexure of ultrasonic element 10 (ultrasonic element array 10A) of shape etc. and make to project from lenticule 200
The thickness of the bottom line of slit pore 211 that passes through of ultrasonic wave.Therefore, the ultrasonic wave that can be achieved to suppress useless can simultaneously be realized
The ultrasonic device 1 of slimming.
According to the ultrasonic device 1 of present embodiment, slit pore 211 is with the row of the lenticule 200 with being configured to array-like
The equal interval in row interval is configured, thus, is incident to correspondence with making the ultrasonic high-efficiency projected from ultrasonic element 10
Slit pore 211.Thus, slit pore 211 can be made to turn into efficient configuration, so as to suppress to be back to ultrasonic wave from backing portion 20
The useless ultrasonic wave of element 10, can be thinned backing portion 20.
According to the ultrasonic device 1 of present embodiment, constitute backing portion 20 lenticule 200 (microlens array 200A) and
Backing components 210 are coated with coating material 250.Thus, it can prevent what is produced between ultrasonic element 10 and backing portion 20
Air layer.In addition, in the case where using silicones as coating material 250, the same journey of acoustic impedance that can be with ultrasonic element 10
The matching of degree ground.Thus, the ultrasonic wave that can suppress to project from ultrasonic element 10 makes it high in the boundary face reflection in backing portion 20
Backing portion 20 (microlens array 200A) is injected on effect ground.In addition, the air layer inside backing portion 20 can be prevented, accordingly, it is capable to press down
Make the reflection of the ultrasonic wave for the convergence projected from lenticule 200 and it is efficiently incident to the slit pore of backing components 210 211
Inside, and make ultrasonic wave by and reach the rear sides (surface side opposite with the side of ultrasonic element 10) of backing components 210.
Therefore, spread by the ultrasonic wave of backing components 210 in the end face reflection in backing portion 20, so as to suppress by slit
Hole 211 and the useless ultrasonic wave for being back to ultrasonic element 10 from backing portion 20 through lenticule 200.
The ultrasonic detector 100 of present embodiment is configured to the ultrasonic device 1 for realizing slimming being accommodated in
Part 80 is received, therefore, it is possible to realize the slimming as ultrasonic detector 100.Suppress in addition, ultrasonic detector 100 is stored
The ultrasonic device 1 of useless ultrasonic wave, is superimposed on from ultrasonic device 1 thus, it is possible to suppress useless ultrasonic wave as noise
On the ultrasonic wave projected towards subject.Thus, the quality of ultrasonic detector 100 can be improved.
The ultrasound imaging device 110 of present embodiment is filled by realizing the ultrasonic detector 100 of slimming, processing
Put 101 and display device 102 and the convenience of ultrasound imaging device 110 can be improved.
The ultrasound imaging device 110 of present embodiment possesses the ultrasound that the ultrasonic wave that can suppress useless is superimposed as noise
Wave detector 100, therefore when carrying out B-mode image, the generation and display of the artifact caused by noise can be suppressed.Thus,
Ultrasound imaging device 110 can generate clearly B-mode image, can improve the quality as ultrasound imaging device 110.Separately
Outside, surgeon can reduce false results in inspection etc. by using the ultrasound imaging device 110 that can suppress artifact, draw
Correct result.
[second embodiment]
Fig. 9 is the sectional view for the composition for representing the ultrasonic device 1A involved by second embodiment.The explanation of reference picture 9 is originally
The ultrasonic device 1A of embodiment composition and action.
The ultrasonic device 1A of present embodiment backing portion 20A compared with the ultrasonic device 1 of first embodiment structure
Into difference.Composition in addition is constituted in the same manner as the ultrasonic device 1 of first embodiment.Pair and first embodiment
Same constituting portion mark identical reference.
The backing portion 20A of present embodiment is used has added sound absorption portion 220 to the backing portion 20 of first embodiment
Constitute.Specifically, backing portion 20A includes：Lenticule 200 is configured to the microlens array 200A of array-like；With slit pore
211 backing components 210；And sound absorption (sound-absorbing) portion 220.It should be noted that microlens array 200A and backing components
210 are coated in the same manner as first embodiment with coating material 250.Backing portion 20A planar dimension and first embodiment
The planar dimension in backing portion 20 is roughly the same.
Sound absorption portion 220 is set to absorb ultrasonic wave.Sound absorption portion 220 is in the present embodiment by being formed as
The sheet rubber of the tabular of rectangle is constituted.As sheet rubber, in the present embodiment using polyurethane rubber.Sound absorption portion 220 with
Overlapping state is carried out on the thickness direction in the backing portion 20 of first embodiment and is set.Specifically, sound absorption portion 220
Nian Jie with the outer surface in backing portion 20 via adhesive linkage 230, the outer surface in backing portion 20 is the end of the coating material 250 solidified
Face.Adhesive linkage 230 uses so-called double faced adhesive tape in the present embodiment.
Then, the action on ultrasonic wave in backing portion 20A is illustrated.It should be noted that passing through lenticule from ultrasonic wave
200 and time point of incident, to have passed through backing components 210 slit pore 211 starts to illustrate the action of ultrasonic wave.
The ultrasonic wave for having passed through the slit pore 211 of backing components 210 advances to the end face of coating material 250.Advance to end
The ultrasonic wave in face carries out reflection to a certain degree from the end face of coating material 250, and remaining ultrasonic wave enters via adhesive linkage 230
It is mapped to sound absorption portion 220.Ultrasonic wave on inciding sound absorption portion 220, as the characteristic using sound absorption portion 220 internally
Absorb the state of ultrasonic wave, ultrasonic attenuation.It should be noted that the ultrasonic wave not absorbed by sound absorption portion 220 is in its end face
Reflect and be back to the side of coating material 250.
According to the ultrasonic device 1A of above-mentioned embodiment, except the ultrasonic device 1 with first embodiment can be played
Beyond same effect, following effect is also acted as.
According to the ultrasonic device 1A of present embodiment, backing portion 20A possesses absorption and has passed through (the slit of backing components 210
Hole 211) ultrasonic wave sound absorption portion 220.According to this composition, compared with the backing portion 20 in first embodiment, it can make to surpass
Sound wave is further decayed, and can further suppress to be back to the useless ultrasonic wave of ultrasonic element 10 from backing portion 20A.
It should be noted that be not limited to above-mentioned embodiment, can be carried out in scope without departing from the spirit various changes,
Improvement etc. is implemented.Variation is described below.
In the ultrasonic device 1 of above-mentioned first embodiment, backing portion 20 is formed at ultrasonic element 10 and element
The face (the second face in present embodiment) of formation face opposite side.It is however not limited to which this, backing portion 20 can also be formed at member
Part formation face.In this case, element formation face turns into the second face.This is also same in this second embodiment.
In the ultrasonic device 1 of above-mentioned first embodiment, cover the ultrasonic element 10 along slice direction D1 formation
Entirety is formed with the slit pore 211 of 1 backing portion 20 (backing components 210).It is however not limited to this, can also be by along section side
The ultrasonic element 10 formed to D1 is divided as multiple, forms multiple slit pores 211 in such a state.This is implemented second
It is also same in mode.
In the ultrasonic device 1 of above-mentioned first embodiment, the slit pore 211 of backing portion 20 (backing components 210) exists
Extend on slice direction D1 and formed.It is however not limited to which this, slit pore 211 can also extend formation on the D2 of scanning direction.This
It is also same in second embodiment.
In the ultrasonic device 1 of above-mentioned first embodiment, the slit pore 211 of backing portion 20 (backing components 210) exists
Extend on slice direction D1 and formed.It is however not limited to which this, can also extend what is formed on scanning direction D2, slice direction D1
Slit pore 211 is mixed in 1 backing components 210.This is also same in this second embodiment.
In the ultrasonic device 1 of above-mentioned first embodiment, 10 pairs of the ultrasonic element with ultrasonic element array 10A
It is provided with lenticule 200, slit pore 211 with answering.But, in ultrasonic element array 10A, when the ultrasonic wave positioned at outer circumferential side
Element 10 used as illusory (dummy) and in the case of constituting, can be micro- using being not provided with to illusory ultrasonic element 10
The composition of lens 200, slit pore 211.This is also same in this second embodiment.
In the ultrasonic device 1A of above-mentioned second embodiment, sound absorption portion 220 uses polyurethane rubber.But, no
It is limited to this, resin system rubber etc. can also be used.Alternatively, it is also possible to be filled with the rubber of ferrite powder or be dispersed with
Epoxy resin or polyvinyl chloride of tungsten powder etc..Alternatively, it is also possible to use the sound for being obtained by mixing resin and felt, mineral wool etc.
Absorption portion etc..
In the ultrasonic device 1 of above-mentioned first embodiment, microlens array 200A and the use of coating material 250 are identical
Silicones formed.It is however not limited to which this, can also use silicones formation microlens array 200A, and use ABS resin
Coating material 250 is used as Deng synthetic resin.This is also same in this second embodiment.
Claims (8)
1. a kind of ultrasonic device, it is characterised in that carry out sending and receiving for ultrasonic wave, the ultrasonic device possesses：
Ultrasonic element, including project the first face and the second face of the ultrasonic wave；And
Backing portion, supports second face of the ultrasonic element, can make to the described super of second face side injection
SATT,
The backing portion possesses：
Lenticule, in second face side of the ultrasonic element, is configured at position corresponding with the ultrasonic element；
And
Backing components, with the slit pore for passing through the ultrasonic wave through the lenticule.
2. ultrasonic device according to claim 1, it is characterised in that
The ultrasonic element is configured to array-like,
The lenticule is accordingly configured to array-like with the ultrasonic element.
3. ultrasonic device according to claim 2, it is characterised in that
The slit pore is configured with the equal interval of the arrangement pitch of the lenticule with being configured to the array-like.
4. according to ultrasonic device according to any one of claims 1 to 3, it is characterised in that
The lenticule and the backing components are coated with coating material.
5. according to ultrasonic device according to any one of claims 1 to 4, it is characterised in that
The backing portion possesses the sound absorption portion for absorbing the ultrasonic wave for having passed through the backing components.
6. a kind of ultrasonic detector, it is characterised in that possess：
Ultrasonic device according to any one of claims 1 to 5；And
Storage member, the ultrasonic device is stored in the way of the part for making the ultrasonic device is exposed.
7. a kind of electronic equipment, it is characterised in that possess：
Ultrasonic detector described in claim 6；And
Processing unit, controls the ultrasonic detector, and handle the input signal from the ultrasonic detector.
8. a kind of ultrasound imaging device, it is characterised in that possess：
Ultrasonic detector described in claim 6；
Processing unit, controls the ultrasonic detector, handles the input signal from the ultrasonic detector and generates figure
Picture；And
Display device, shows the image generated by the processing unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-212631 | 2015-10-29 | ||
| JP2015212631A JP2017080132A (en) | 2015-10-29 | 2015-10-29 | Ultrasonic device, ultrasonic probe, electronic apparatus and ultrasonic imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106963416A true CN106963416A (en) | 2017-07-21 |
| CN106963416B CN106963416B (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610915818.5A Active CN106963416B (en) | 2015-10-29 | 2016-10-20 | Ultrasonic device, ultrasonic probe, electronic apparatus, and ultrasonic imaging apparatus |
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| Country | Link |
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| US (1) | US10429497B2 (en) |
| JP (1) | JP2017080132A (en) |
| CN (1) | CN106963416B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10429497B2 (en) * | 2015-10-29 | 2019-10-01 | Seiko Epson Corporation | Ultrasonic device, ultrasonic probe, electronic apparatus, and ultrasonic imaging apparatus |
| CN110596010A (en) * | 2019-10-24 | 2019-12-20 | 南昌洋深电子科技有限公司 | Micro-lens array capable of receiving and transmitting ultrasound |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2017080132A (en) | 2017-05-18 |
| US20170123056A1 (en) | 2017-05-04 |
| US10429497B2 (en) | 2019-10-01 |
| CN106963416B (en) | 2021-03-02 |
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