CN106954010A - A kind of camera device and endoscope insertion part part - Google Patents
A kind of camera device and endoscope insertion part part Download PDFInfo
- Publication number
- CN106954010A CN106954010A CN201710054053.5A CN201710054053A CN106954010A CN 106954010 A CN106954010 A CN 106954010A CN 201710054053 A CN201710054053 A CN 201710054053A CN 106954010 A CN106954010 A CN 106954010A
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- solid
- camera device
- sensitive chip
- flexible substrate
- leg
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- 238000003780 insertion Methods 0.000 title claims abstract description 15
- 230000037431 insertion Effects 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 239000007787 solid Substances 0.000 claims abstract description 65
- 230000002708 enhancing effect Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 13
- 238000003384 imaging method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 210000000214 mouth Anatomy 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
- A61B1/00071—Insertion part of the endoscope body
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
Abstract
The invention discloses the endoscope insertion part part of a kind of camera device and the application camera device, camera device includes pick-up lens and the sensitive chip being oppositely arranged with pick-up lens, sensitive chip is arranged on a flexible substrate, flexible substrate is foldable to a solid, and it is packaged with the connection circuit electrically connected with sensitive chip, sensitive chip is arranged on the outer surface of solid side, leg of the solid provided with connection circuit.The endoscope insertion part part of the camera device and application of the present invention camera device, it is packaged with by the way that sensitive chip is arranged on into one on the flexible solid of connection circuit, and the leg of connection circuit is set on solid, so as to increase the operating space of sensitive chip welding, it is more convenient for other electron component being electrically connected on the leg of sensitive chip, with good practical value.
Description
Technical field
The present invention relates to medical treatment and industrial circle, the endoscope of especially a kind of camera device and the application camera device is inserted
Enter part.
Background technology
Endoscope is to have concentrated traditional optical, ergonomics, precision optical machinery, hyundai electronicses, mathematics, software etc. in one
Detecting instrument.One has imaging sensor, optical lens, light source illumination, mechanical device etc., in medical field, and it can be with
Direct oral cavity enters in stomach or enters internal through other natural holes.Using endoscope it can be seen that the lesion that X-ray can not be shown,
Therefore it is highly useful to doctor.Visit technical elements in the Non-Destructive Testing of industrial circle and hole, also can be widely used in Automobile Service,
The occasions such as security protection, safety check.In structure, endoscope, which generally comprises main body, Handheld Division and insertion, needs the insertion section of detection position, and
And the front end of insertion section be provided with camera device with by the image of detection position send to external visual device for doctor or its
He is personal observations.
Endoscope imaging apparatus generally includes pick-up lens and sensitive chip, and sensitive chip is can to convert optical signal
For the photosensitive imaging part of electric signal.During the use of endoscope, the purpose based on reduction wound or detection mouth is, it is necessary to interior
The individual size of components of sight glass front end is the smaller the better, therefore the sensitive chip size in current endoscope is minimum, and generally 0.5mm ×
0.5mm or so, the multiple legs being arranged on sensitive chip are more miniaturized, and are just so sensitive chip and other groups of endoscope
Being welded to connect between part brings great difficulty.
There is provided a kind of camera device, including solid-state imager in Patent No. CN101548535 patent document
Piece, one end are connected to the flexible substrate of above-mentioned solid-state imager piece and many on a face of above-mentioned flexible substrate
Individual electronic component, above-mentioned flexible substrate is disposed in the side opposite with imaging surface of above-mentioned solid-state imager piece with the state folded
Back side rear so that the mounting surface for being used to install multiple above-mentioned electronic components of above-mentioned flexible substrate is configured to multilayer, and respectively
Above-mentioned electronic component is overlapping across above-mentioned flexible substrate.
In addition, the endoscope of the present invention includes camera device, the camera device is characterised by, including solid-state imager
Piece, one end are connected to the flexible substrate of above-mentioned solid-state imager piece and many on a face of above-mentioned flexible substrate
Individual electronic component, above-mentioned flexible substrate is disposed in the side opposite with imaging surface of above-mentioned solid-state imager piece with the state folded
Back side rear so that the mounting surface for being used to install multiple above-mentioned electronic components of the flexible substrate is configured to multilayer, and it is each on
State electronic component overlapping across above-mentioned flexible substrate.The patent is solved in endoscopic applications, is seeking what encapsulation part was minimized
Meanwhile, the electronic component number on FPC increases, then at the rear of solid-state imager piece, what is overlooked from shooting surface side
Under state, the problem of FPC can be arranged greatly beyond encapsulation part.However, the rugosity design of FPC in the patent still without
The problem of miniature electronic part inconvenience that method solves thereon is connected with other components weldings of endoscope.
There is provided a kind of envelope of many full full-view endoscopes of camera lens in Patent No. CN 103222845A patent document
Dress method, comprising：Using rigid flexible system plate as substrate, the endoscope is arranged on the rigid flexible system plate；The hard and soft knot
Plywood includes rigid plate and flexible board, and the rigid flexible system plate can be bent to form solid by the flexible board, wherein, institute
The flexible board that is mechanically and electrically interconnected by stated between rigid plate realizes, the rigid plate as the solid face.
The method for packing for the full full-view endoscope of many camera lenses that the present invention is provided, substrate, the rigid flexible system plate are used as using rigid flexible system plate
Flexible board comprising rigid plate and connection rigid plate, whole rigid flexible system plate can be bent to form solid, solve existing
The full full-view endoscope of many camera lenses method for packing using flexible board formation solid when be difficult to be molded the problem of.However, this is special
The problem of rigid flexible system plate in profit can not also solve miniature electronic part and inconvenient other components weldings in endoscope.
The content of the invention
In order to solve the above problems, it is an object of the invention to provide a kind of camera device, including pick-up lens and with taking the photograph
As the sensitive chip that camera lens is oppositely arranged, sensitive chip is arranged on a flexible substrate, and flexible substrate is foldable to a solid,
And the connection circuit electrically connected with sensitive chip is packaged with, sensitive chip is arranged on the outer surface of solid side, geometry
Leg of the body provided with connection circuit.
Further, flexible substrate tiling is "convex" shaped, and the solid that flexible substrate is folded is with four sides
Hollow cuboid.
It is preferred that sensitive chip is arranged on the outer surface of one of side of solid, leg is arranged at solid
Its excess-three side remote sensitive chip end inner surface and/or outer surface.
Further, flexible substrate tiling is " ten " font, and the solid that flexible substrate is folded is with five sides
Hollow cuboid.
It is preferred that sensitive chip is arranged on the outer surface of one of side of solid, leg is arranged at solid
Remaining four side remote sensitive chip end inner surface and/or outer surface.
Further, leg is multiple contacts on flexible substrate or a plurality of sealing wire.
It is preferred that the material of flexible substrate is FPC.
Further, flexible substrate is provided with signal enhancing device.
The present invention also provides a kind of endoscope insertion part part, including the signal set by work telescope, along work telescope
Transmission line and the camera device for being connected to signal transmssion line, camera device use camera device any in such as claim 1-8,
Signal transmssion line is welded to connect the leg in camera device.
Further, the inside portion corresponding to camera device of work telescope is additionally provided with LED light source.
As above, the endoscope insertion part part of camera device of the invention and the application camera device, by by sensitive chip
It is packaged with installed in one on the flexible substrate of connection circuit, the flexible substrate is foldable to a solid, and on solid
Leg provided with connection circuit, so as to increase the operating space of sensitive chip welding, is more convenient for other electron component being electrically connected
It is connected on the leg of sensitive chip, with good practical value.
For the above of the present invention can be become apparent, preferred embodiment cited below particularly, and with reference to accompanying drawing, make detailed
It is described as follows.
Brief description of the drawings
Fig. 1 be first embodiment of the invention and second embodiment in camera device profile；
Fig. 2 a be the first embodiment of the present invention in flexible substrate structural representation；
The structural representation for the solid that Fig. 2 b fold for the flexible substrate in the first embodiment of the present invention；
Fig. 3 a be the second embodiment of the present invention in flexible substrate structural representation；
The structural representation for the solid that Fig. 3 b fold for the flexible substrate in the second embodiment of the present invention；
Fig. 4 is the profile of the work telescope of the endoscope insertion part part of the third embodiment of the present invention.
Embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.Although description of the invention will combine preferred embodiment
Introduce together, but this feature for not representing this invention is only limitted to the embodiment.On the contrary, being invented with reference to embodiment
The purpose of introduction is the other selections or transformation for being possible to extend to cover the claim based on the present invention.In order to carry
Understand for the depth to the present invention, many concrete details will be included in describing below.The present invention can also be thin without using these
Section is implemented.In addition, in order to avoid the emphasis of the chaotic or fuzzy present invention, some details will be omitted in the de-scription.
" on ", " under ", "left", "right", " top ", " bottom " in addition, used in the following description, should not be construed as pair
The limitation of the present invention.
【First embodiment】
As shown in Fig. 1 and Fig. 2 a, Fig. 2 b, the first embodiment of the present invention provides a kind of camera device 10, including takes the photograph
The sensitive chip 30 being oppositely arranged as camera lens 20 and with pick-up lens 20, sensitive chip 30 is arranged on a flexible substrate 40, is scratched
Property substrate 40 is foldable to a solid 50a, and flexible substrate 40 is packaged with the connection circuit electrically connected with sensitive chip 30,
Sensitive chip 30 is arranged on the outer surface of solid 50a sides, legs 60 of the solid 50a provided with connection circuit.
In the present embodiment, as shown in figs. 2 a and 2b, the tiling of flexible substrate 40 is the "convex" shaped with convex portion and body portion,
The solid 50a folded by flexible substrate 40 is the hollow cuboid with four sides.More specifically, sensitive chip
30 are arranged on solid 50a one of side 51a outer surface, and leg 60 is arranged at solid 50a its excess-three
The inner surface of the end of side 52a, 53a, 54a remote sensitive chip 30 and/or outer surface., can be by sensitive chip during operation
30 paste or are fixed on the surface of the convex portion of "convex" shaped flexible substrate 40, due to the enclosed inside of flexible substrate 40 have can with it is photosensitive
The connection circuit that chip 30 is electrically connected, sensitive chip 30 is by being arranged at the leg in the body portion of "convex" shaped flexible substrate 40
It can be electrically connected with other electronic components.Further, based on section space-efficient purpose, by the "convex" shaped flexible substrate 40
The solid 50a with four sides is folded into, now sensitive chip 30 is located at solid 50a side 51a appearance
Face, leg 60 can be located at the end of solid 50a its excess-three side 52a, 53a and 54a remote sensitive chip 30.So
Welding lead can be drawn from the unclosed sides of solid 50a.
It is preferred that leg 60 is multiple contacts on flexible substrate 40 or a plurality of sealing wire.I.e. can be by solid
50a its excess-three side 52a, 53a and 54a is extended, and sets contact to meet space requirement in extension；Or several
The end of what body 50a its excess-three side 52a, 53a and 54a remote sensitive chip 30 sets sealing wire, and pad is drawn
Out meet space requirement.It is further preferable that multiple contacts or a plurality of sealing wire can on flexible substrate 40 interlaced arrangement, a side
Face can reduce the area of flexible substrate 40, preferably meet element demand miniaturization, on the other hand be conducive to preventing short circuit.
Further, flexible substrate 40 can use flexible PCB (Flexible Printed Circuit abbreviation FPC),
FPC is that the one kind being made using polyimides or polyester film as base material has height reliability, excellent pliable printed circuit
Plate.It is easy to flexible substrate being folded into the solid of given shape using FPC, and with Distribution density is high, lightweight, thickness
It is thin, bending property it is good the characteristics of.
More specifically, signal enhancing device, such as G-Sensor, Power convert are additionally provided with flexible substrate 40
IC, or mipi signals turn the conversion IC of LVDS signals, and analog signal turns the IC of data signal, and Mipi serial ports turns the IC of parallel port, electricity
Electric capacity etc. is hindered, signal enhancing device can be used for the signal of enhancing sensitive chip 30 to send and receiving ability.
Flexible substrate is folded into the hollow cuboid with four sides by the camera device of the first embodiment of the present invention,
The operating space of sensitive chip welding is increased, is easy to other electronic components being electrically connected on the leg of sensitive chip, is solved
The problem of sensitive chip of miniaturization is difficult welding.
【Second embodiment】
As shown in Fig. 1 and Fig. 3 a, Fig. 3 b, the second embodiment of the present invention provides a kind of camera device 10, including shooting
Camera lens 20 and the sensitive chip 30 being oppositely arranged with pick-up lens 20, sensitive chip 30 are arranged on a flexible substrate 40, flexible
Substrate 40 is foldable to a solid 50b, and flexible substrate 40 is packaged with the connection circuit electrically connected with sensitive chip 30, sense
Optical chip 30 is arranged on the outer surface of solid 50b sides, legs 60 of the solid 50b provided with connection circuit.
In the present embodiment, as shown in Figure 3 a and 3b shown, the tiling of flexible substrate 40 is " ten " font, is folded by flexible substrate 40
Solid 50b be the hollow cuboid with five sides.More specifically, sensitive chip 30 is arranged at solid
On a 50b side 51b, leg 60 is arranged at solid 50b remaining four sides 52b, 53b, 54b and 55b interior table
The inner surface of the end of the remote sensitive chip 30 of face and/or outer surface and/or outer surface., can be by sensitive chip during operation
30 paste or are fixed on the surface at the center of " ten " font flexible substrate 40, due to the enclosed inside of flexible substrate 40 have can with it is photosensitive
The connection circuit that chip 30 is electrically connected, sensitive chip 30 is by being arranged at four ends of " ten " font flexible substrate 40
Leg can be electrically connected with other electronic components.Further, based on section space-efficient purpose, by the flexible base of " ten " font
Plate 40 is folded into the solid 50b with five sides, and now sensitive chip 30 is located at a solid 50b side 51b's
Outer surface, leg 60 can be located at the end of remaining four sides 52b, 53b, 54b and 55b of solid 50 remote sensitive chip 30
Portion.Such welding lead can be drawn from the unclosed sides of solid 50b.
It is preferred that leg 60 is multiple contacts on flexible substrate 40 or a plurality of sealing wire.I.e. can be by solid
50b remaining four sides 52b, 53b and 54b and 55b are extended, and set contact to meet space requirement in extension；Or
Person solid 50b remaining four sides 52b, 53b and 54b and 55b remote sensitive chip 30 end set sealing wire,
Pad is extracted and meets space requirement.It is further preferable that multiple contacts or a plurality of sealing wire can be submitted in flexible substrate 40
Mistake arrangement, on the one hand can reduce the area of flexible substrate 40, preferably meet element demand miniaturization, be on the other hand conducive to
Prevent short circuit.
Further, flexible substrate 40 can use flexible PCB (Flexible Printed Circuit abbreviation FPC),
FPC is that the one kind being made using polyimides or polyester film as base material has height reliability, excellent pliable printed circuit
Plate.It is easy to flexible substrate being folded into the solid of given shape using FPC, and with Distribution density is high, lightweight, thickness
It is thin, bending property it is good the characteristics of.
More specifically, signal enhancing device, such as G-Sensor, Power convert are additionally provided with flexible substrate 40
IC, or mipi signals turn the conversion IC of LVDS signals, and analog signal turns the IC of data signal, and Mipi serial ports turns the IC of parallel port, electricity
Electric capacity etc. is hindered, signal enhancing device can be used for the signal of enhancing sensitive chip 30 to send and receiving ability.
Flexible substrate is folded into the hollow cuboid with five sides by the camera device of the second embodiment of the present invention,
The operating space of sensitive chip welding is increased, is easy to other electronic components being electrically connected on the leg of sensitive chip, is solved
The problem of sensitive chip of miniaturization is difficult welding.
【3rd embodiment】
Third embodiment of the invention provide a kind of endoscope insertion part part, including by work telescope 1, along work telescope
1 signal transmssion line 2 set and the camera device 3 for being connected to signal transmssion line 2, camera device 3 include housing, are arranged at housing
Internal pick-up lens and the sensitive chip being oppositely arranged with pick-up lens, sensitive chip are arranged on a flexible substrate, flexible
Substrate is foldable to a solid, and flexible substrate is packaged with the connection circuit electrically connected with sensitive chip, and sensitive chip is set
On the outer surface for being placed in solid side, leg of the solid provided with connection circuit, signal transmssion line 2 is welded to connect in shooting
The leg of device.
Further, the inside portion corresponding to camera device 3 of work telescope 1 is additionally provided with LED light source 4.
In the present embodiment, flexible substrate tiling is the "convex" shaped with convex portion and body portion, is folded and formed by flexible substrate
Solid be the hollow cuboid with four sides.Or flexible substrate tiling is " ten " font, is folded by flexible substrate
Solid be the hollow cuboid with five sides.
It is preferred that leg is multiple contacts on flexible substrate or a plurality of sealing wire.I.e. can by solid its
Remaininging four sides is extended, and space requirement is met in extension setting contact；Or in remaining four side of solid
Remote sensitive chip end set sealing wire, pad is extracted and meets space requirement.It is further preferable that multiple contacts
Or a plurality of sealing wire can on flexible substrate interlaced arrangement, on the one hand can reduce the area of flexible substrate, preferably meet element
Demand miniaturization, is on the other hand conducive to preventing short circuit.
Further, flexible substrate can use flexible PCB (Flexible Printed Circuit abbreviation FPC),
FPC is that the one kind being made using polyimides or polyester film as base material has height reliability, excellent pliable printed circuit
Plate.It is easy to flexible substrate being folded into the solid of given shape using FPC, and with Distribution density is high, lightweight, thickness
It is thin, bending property it is good the characteristics of.
More specifically, it is additionally provided with signal enhancing device, such as G-Sensor on flexible substrate, Power convert IC,
Or mipi signals turn the conversion IC of LVDS signals, analog signal turns the IC of data signal, and Mipi serial ports turns the IC of parallel port, resistance electricity
Hold etc., signal enhancing device can be used for the signal of enhancing sensitive chip to send and receiving ability.
Flexible substrate is folded into solid by the camera device of the endoscope insertion part part of the third embodiment of the present invention, is increased
The big operating space of sensitive chip welding, is easy to other electronic components being electrically connected on the leg of sensitive chip, solves
The problem of sensitive chip of miniaturization is difficult welding.
In summary, using the endoscope insertion part part of the camera device and application of the present invention camera device, pass through and incite somebody to action
Sensitive chip is arranged on one and is packaged with the flexible substrate of connection circuit, and the flexible substrate is foldable to a solid, and
Leg of the solid provided with connection circuit, so as to increase the operating space of sensitive chip welding, is more convenient for other electronics
Element is electrically connected on the leg of sensitive chip, with good practical value.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (10)
1. a kind of camera device, including pick-up lens and the sensitive chip that is oppositely arranged with the pick-up lens, it is characterised in that
The sensitive chip is arranged on a flexible substrate, and the flexible substrate is foldable to a solid, and be packaged with it is described
The connection circuit of sensitive chip electrical connection, the sensitive chip is arranged on the outer surface of the solid side, the geometry
Leg of the body provided with the connection circuit.
2. camera device as claimed in claim 1, it is characterised in that the flexible substrate tiling is "convex" shaped, described to scratch
Property substrate fold the solid be the hollow cuboid with four sides.
3. camera device as claimed in claim 2, it is characterised in that the sensitive chip is arranged at the solid wherein
On the outer surface of one side, the leg is arranged at the remote sensitive chip of its excess-three side of the solid
The inner surface of end and/or outer surface.
4. camera device as claimed in claim 1, it is characterised in that the flexible substrate tiling is " ten " font, described to scratch
Property substrate fold the solid be the hollow cuboid with five sides.
5. camera device as claimed in claim 4, it is characterised in that the sensitive chip is arranged at the solid wherein
On the outer surface of one side, the leg is arranged at the remote sensitive chip of remaining four side of the solid
The inner surface of end and/or outer surface.
6. camera device as claimed in claim 1, it is characterised in that the leg is to be multiple on the flexible substrate
Contact or a plurality of sealing wire.
7. camera device as claimed in claim 1, it is characterised in that the material of the flexible substrate is FPC.
8. the camera device as described in any in claim 1-7, it is characterised in that the flexible substrate is provided with signal enhancing
Device.
9. a kind of endoscope insertion part part, including the signal transmssion line set by work telescope, along the work telescope and company
It is connected to the camera device of the signal transmssion line, it is characterised in that the camera device is used such as any institute in claim 1-8
The camera device stated, the signal transmssion line is welded in the leg of the camera device.
10. endoscope insertion part part as claimed in claim 9, it is characterised in that the work telescope corresponds to described take the photograph
As the inside portion of device is additionally provided with LED light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710054053.5A CN106954010A (en) | 2017-01-22 | 2017-01-22 | A kind of camera device and endoscope insertion part part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710054053.5A CN106954010A (en) | 2017-01-22 | 2017-01-22 | A kind of camera device and endoscope insertion part part |
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| Publication Number | Publication Date |
|---|---|
| CN106954010A true CN106954010A (en) | 2017-07-14 |
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ID=59465786
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710054053.5A Pending CN106954010A (en) | 2017-01-22 | 2017-01-22 | A kind of camera device and endoscope insertion part part |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948491A (en) * | 2017-12-29 | 2018-04-20 | 王耀瓒 | A kind of miniature image imaging modules and the probe using the module |
| CN109981961A (en) * | 2019-05-15 | 2019-07-05 | 德淮半导体有限公司 | A kind of camera module structure and preparation method thereof |
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2017
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|---|---|---|---|---|
| JPH06237085A (en) * | 1993-02-09 | 1994-08-23 | Kokusai Electric Co Ltd | Integrated circuit multilayer wiring board and its manufacture |
| US20070277364A1 (en) * | 2006-06-02 | 2007-12-06 | Chicony Electronics Co. Ltd. | Method of fabricating an electronic module having a side contact |
| CN103271716A (en) * | 2013-06-08 | 2013-09-04 | 扬州市三园科技有限公司 | Wireless power supply and image transmitting system of gynecological endoscope |
| CN104580852A (en) * | 2014-11-28 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Image pick-up device of mobile phone and mobile phone |
| CN206559468U (en) * | 2017-01-22 | 2017-10-13 | 上海安清医疗器械有限公司 | A kind of camera device and endoscope insertion part part |
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| CN107948491A (en) * | 2017-12-29 | 2018-04-20 | 王耀瓒 | A kind of miniature image imaging modules and the probe using the module |
| CN109981961A (en) * | 2019-05-15 | 2019-07-05 | 德淮半导体有限公司 | A kind of camera module structure and preparation method thereof |
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Application publication date: 20170714 |