CN106950805B - Alignment device and method - Google Patents
Alignment device and method Download PDFInfo
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- CN106950805B CN106950805B CN201710258236.9A CN201710258236A CN106950805B CN 106950805 B CN106950805 B CN 106950805B CN 201710258236 A CN201710258236 A CN 201710258236A CN 106950805 B CN106950805 B CN 106950805B
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- magnetic pole
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
- G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves
Abstract
The disclosure is directed to a kind of alignment device and method, is used for realization the contraposition of substrate and mask plate；The alignment device includes：First closing coil, is arranged in the first contraposition region of the substrate；First magnetic pole and the second magnetic pole, positioned at the both sides of the first predeterminable area of the mask plate and generate the first magnetic field；Wherein, first magnetic pole and second magnetic pole have gap with first predeterminable area；First current sensor, is connected with first closing coil.The alignment device can improve aligning accuracy.
Description
Technical field
This disclosure relates to display technology field, in particular to a kind of alignment device and a kind of alignment method.
Background technology
In panel preparation process, higher aligning accuracy is always one of key of technology, particularly array processes section
Mask plate process.Higher substrate aligning accuracy, is not only able to preferably ensure the accuracy of exposure, and can be very good
Solve the problem of misalignment between different film layers.
For example, in metal oxide AMOLED (Active-matrix Organic Light Emitting
Diode, active-matrix organic light emitting diode) in technique, since mask plate process is more, aligning accuracy requires particularly harsh.
It is corresponding typically by being set in the region to be aligned of substrate and mask plate in some conventional technique schemes
Mark, then realizes the contraposition of substrate and mask plate according to mark, but carry out contraposition inefficiency using the alignment method and
And the accuracy of contraposition is not also high.
It should be noted that information is only used for strengthening the reason to the background of the disclosure disclosed in above-mentioned background section
Solution, therefore can include not forming the information to the prior art known to persons of ordinary skill in the art.
The content of the invention
The purpose of the disclosure is to provide a kind of alignment device and a kind of alignment method, and then at least to a certain extent
Overcome one or more problem caused by the limitation of correlation technique and defect.
According to one aspect of the disclosure, there is provided a kind of alignment device, is used for realization the contraposition of substrate and mask plate, bag
Include：
First closing coil, is arranged in the first contraposition region of the substrate；
First magnetic pole and the second magnetic pole, positioned at the both sides of the first predeterminable area of the mask plate and generate the first magnetic
；Wherein, first magnetic pole and second magnetic pole have gap with first predeterminable area；
First current sensor, is connected with first closing coil.
In a kind of exemplary embodiment of the disclosure, first current sensor passes through on first closing coil
First wiring pin of configuration is connected with first closing coil.
In a kind of exemplary embodiment of the disclosure, first closing coil is set with the grid line on the substrate with layer
Put and there is phase same material with the grid line.
In a kind of exemplary embodiment of the disclosure, the alignment device further includes：
Second closing coil, is arranged in the second contraposition region of the substrate；
3rd magnetic pole and the 4th magnetic pole, positioned at the both sides of the second predeterminable area of the mask plate and generate the second magnetic
；Wherein, the 3rd magnetic pole and the 4th magnetic pole have gap with second predeterminable area；
Second current sensor, is connected with second closing coil.
In a kind of exemplary embodiment of the disclosure, first magnetic pole and the second magnetic pole are electromagnetic coil.
According to one aspect of the disclosure, there is provided a kind of alignment method, is used for realization the contraposition of substrate and mask plate, described
First contraposition region of substrate is provided with the first closing coil；Wherein, the alignment method includes：
The first magnetic field is generated using the first magnetic pole and the second magnetic pole；Wherein, first magnetic pole and the second magnetic pole position
In the both sides of the first predeterminable area of the mask plate and there is gap with first predeterminable area；
The mobile substrate simultaneously measures the first magnetic induction electricity that first closing coil is produced through first magnetic field
Stream；
Judge whether first induced field current reaches maximum sensing electric current and judging first induced field current
When reaching the maximum sensing electric current, stop the mobile substrate.
In a kind of exemplary embodiment of the disclosure, the first induced field current that first closing coil produces is measured
Including：
The first induced field current produced using the first closing coil described in the first current sensor measurement.
In a kind of exemplary embodiment of the disclosure, first induced field current passes through institute with first magnetic field
State the increase of the magnetic flux of the first closing coil and increase and start to reduce when increasing to critical value.
In a kind of exemplary embodiment of the disclosure, the second contraposition region of the substrate is provided with the second closed line
Circle；Wherein, the alignment method further includes：
The second magnetic field is generated using the 3rd magnetic pole and the 4th magnetic pole；Wherein, the 3rd magnetic pole and the 4th magnetic pole position
In the both sides of the second predeterminable area of the mask plate and there is gap with second predeterminable area；
The mobile substrate simultaneously measures the second magnetic induction electricity that second closing coil is produced through second magnetic field
Stream；
Judge whether second induced field current reaches maximum sensing electric current and judging first induced field current
And second induced field current stops the mobile substrate when reaching maximum sensing electric current.
In a kind of exemplary embodiment of the disclosure, first magnetic pole and the second magnetic pole are electromagnetic coil.
A kind of alignment device of the disclosure and method, can utilize the first magnetic pole and the second magnetic pole to generate the first magnetic field, make
The first closing coil is obtained to produce the first induced field current when through the first magnetic field and reach maximum sense in the first induced field current
During induced current, the contraposition of substrate and mask plate is realized；On the one hand, it is real when the first induced field current reaches maximum sensing electric current
The contraposition of existing substrate and mask plate, due to the first closing coil, to reach maximum faradic position unique, thus improves
The accuracy of contraposition；On the other hand, complete to align using electromagnetic principles, contraposition is not only saved for optical registration
Time, while also improve contraposition efficiency.
It should be appreciated that the general description and following detailed description of the above are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Attached drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.It should be evident that drawings in the following description are only the disclosure
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 schematically shows a kind of alignment device fundamental diagram.
Fig. 2 schematically shows a kind of closing coil distribution example figure.
Fig. 3 schematically shows a kind of contraposition exemplary plot.
Fig. 4 schematically shows another contraposition exemplary plot.
Fig. 5 schematically shows a kind of flow chart of alignment method.
Fig. 6 schematically shows the flow chart of another alignment method.
Embodiment
Example embodiment is described more fully with referring now to attached drawing.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；On the contrary, these embodiments are provided so that the disclosure will more
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Described feature, knot
Structure or characteristic can be incorporated in one or more embodiments in any suitable manner.In the following description, there is provided permitted
More details fully understand embodiment of the present disclosure so as to provide.It will be appreciated, however, by one skilled in the art that can
Omitted with putting into practice the technical solution of the disclosure one or more in the specific detail, or others side can be used
Method, constituent element, device, step etc..In other cases, be not shown in detail or describe known solution to avoid a presumptuous guest usurps the role of the host and
So that each side of the disclosure thickens.
Although the term of relativity, such as " on " " under " is used to describe icon component for another in this specification
The relativeness of one component, but these terms are used in this specification merely for convenient, for example, with reference to the accompanying drawings described in show
The direction of example.Be appreciated that, if making it turn upside down the upset of the device of icon, describe " on " component will
As " under " component.The term of other relativities, such as " height " " low " " top " " bottom " etc. also make have similar meaning.When certain
Structure other structures " on " when, it is possible to refer to that certain structural integrity is formed in other structures, or refer to certain structure " direct " and set
Put in other structures, or refer to certain structure and be arranged on by another structure " indirect " in other structures.
Term "one", " one ", "the", " described " to represent there are one or more elements/part/etc.；With
Language "comprising", " comprising " and " having " to represent it is open be included look like and refer to except list key element/
Also may be present outside part/wait other key element/part/etc.；Term " first ", " second " etc. only make as mark
With not being to the limitation of the quantity of its object.
In addition, attached drawing is only the schematic illustrations of the disclosure, it is not necessarily drawn to scale.Identical attached drawing mark in figure
Note represents same or similar part, thus will omit repetition thereof.Some block diagrams shown in attached drawing are work(
Can entity, not necessarily must be corresponding with physically or logically independent entity.These work(can be realized using software form
Energy entity, or these functional entitys are realized in one or more hardware modules or integrated circuit, or at heterogeneous networks and/or place
These functional entitys are realized in reason device device and/or microcontroller device.
This example embodiment provide firstly a kind of alignment device, be used for realization the contraposition of substrate and mask plate.With reference to
Shown in Fig. 1, Fig. 2 and Fig. 3, which includes：First closing coil 107, the first magnetic pole 102, the second magnetic pole 104 and
First current sensor 106.
In this example embodiment, the first closing coil 107 can be arranged at the first contraposition region 109 of substrate 110
In；It is understood that can also be arranged in other contraposition regions, this example embodiment is not particularly limited this；The
One closing coil 107 can with the grid line on substrate 110 with layer set and have phase same material with grid line, such as can be chromium,
Either molybdenum tantalum alloy or other materials for example can be aluminium or aluminium alloy etc. to the alloy of chromium, this example embodiment party
Formula is not particularly limited this；By the way that the grid line of the first closing coil and substrate is set with layer, a photoetching work can be passed through
Skill forms the first closing coil and grid line, therefore simplifies technological process.
In this example embodiment, the first magnetic pole 102 and the second magnetic pole 104 all can be electromagnetic coil, can also
For permanent magnet, there is no special restriction on this for this example embodiment.
In this example embodiment, it is any that the first magnetic pole 102 and the second magnetic pole 104 can be symmetrically located in mask plate
The both sides of predeterminable area；It can not also be symmetrical arranged, there is no special restriction on this for this example embodiment；It is therefore to be understood that
It is that the gap of the first magnetic pole 102 and the second magnetic pole 104 and mask plate can be the same or different.In addition, the first magnetic pole
102 and second magnetic pole 104 can be integrally fixed on the stent of existing mask system, can also be by setting extra support to fill
The first magnetic pole 102 of carrying and the second magnetic pole 104 are put, particular determination is not done to this in the present exemplary embodiment.
In this example embodiment, by setting the second magnetic pole 104, magnetic field can be collectively forming with the first magnetic pole 102,
Play the role of supplement and adjusting in the magnetic field that can also be produced to the first magnetic pole 102；It is therefore to be understood that by using
One magnetic pole 102 and the second magnetic pole 104 generate the first magnetic field so that the first closing coil 107 is producing magnetic through the first magnetic field
When sensing electric current, contraposition essence can further be improved so that induced field current reaches maximum by only existing unique positions
Degree.
In this example embodiment, the first current sensor 106 can be electromagnetic current transducer or electronic type
Current transformer or current divider, there is no special restriction on this for this example embodiment.
In this example embodiment, the first current sensor 106 can by set on the first closing coil 107
One wiring pin 108 is attached with the first closing coil 107, can also be attached by other means, this example is implemented
Mode is not particularly limited this.
In above-mentioned alignment device, on the one hand, realized when the first induced field current reaches maximum sensing electric current substrate and
The contraposition of mask plate, due to the first closing coil, to reach maximum faradic position unique, thus improves the accurate of contraposition
Degree；On the other hand, complete to align using electromagnetic principles, position aligning time is not only saved for optical registration, at the same time
Also contraposition efficiency is improved.
This example embodiment additionally provides another alignment device, is used for realization the contraposition of substrate and mask plate.With reference to
Shown in Fig. 1, Fig. 2 and Fig. 4, which can also include：Second closing coil, the 3rd magnetic pole, the 4th magnetic pole and
Two current sensors.
In this example embodiment, the second closing coil can be arranged in the second contraposition region 111 of substrate 110；
It should be understood that can also be arranged in other contraposition regions, this example embodiment is not particularly limited this；Second closure
Coil can with the grid line on substrate 110 with layer set and have phase same material with delete line, such as can be chromium, chromium alloy or
Person's molybdenum tantalum alloy or other materials, such as can be aluminium or aluminium alloy etc., this example embodiment does not make this
It is specifically limited；By the way that the grid line of the first closing coil and substrate is set with layer, first can be formed by a photoetching process
Closing coil and grid line, therefore simplify technological process.
In this example embodiment, the 3rd magnetic pole and the 4th magnetic pole can be electromagnetic coil, or permanent magnet,
There is no special restriction on this for this example embodiment.
In this example embodiment, the 3rd magnetic pole and the 4th magnetic pole can be symmetrically located in any preset areas of mask plate
The both sides in domain；It can not also be symmetrical arranged, there is no special restriction on this for this example embodiment；It is therefore to be understood that the
Three magnetic poles and the gap of the 4th magnetic pole and mask plate can be the same or different；Further, the 3rd magnetic pole and the 4th
Magnetic pole all can be electromagnetic coil.Similar, the 3rd magnetic pole and the 4th magnetic pole can be integrally fixed at the branch of existing mask system
On frame, the 3rd magnetic pole and the 4th magnetic pole can also be carried by setting extra support device, it is right in the present exemplary embodiment
This does not do particular determination.
In this example embodiment, the second current sensor can be electromagnetic current transducer or electronic current
Mutual inductor or current divider, there is no special restriction on this for this example embodiment.
In this example embodiment, the second current sensor can be by the second wiring for being set on the second closing coil
Pin is attached with the second closing coil, can also be attached by other means, this example embodiment does not make this
It is specifically limited.
In the following, above-mentioned alignment device will be further expalined with reference to alignment method.
It provide firstly a kind of alignment method in this example embodiment, be used for realization the contraposition of substrate and mask plate；Its
In, the contraposition region of substrate is provided with closing coil.Refering to what is shown in Fig. 5, the contraposition alignment method can include step S510, step
Rapid S520 and step S530.Wherein：
In step S510, the first magnetic field is generated using the first magnetic pole and the second magnetic pole；Wherein, first magnetic pole with
And second magnetic pole be located at the mask plate the first predeterminable area both sides and have gap with first predeterminable area.
In this example embodiment, refering to what is shown in Fig. 1, matching somebody with somebody respectively in the both sides up and down of the first predeterminable area of mask plate
The first magnetic pole 102 and the second magnetic pole 104 are put, rule are then produced by the first alternating current 103 and the second alternating current 105 respectively
The first magnetic field then changed.Wherein, the first magnetic pole 102 and the second magnetic pole 104 can movably be set by outside support
In the both sides of the first predeterminable area, which, which can be fixedly installed, can also move setting；Also, the first magnetic pole 102 with
The gap of second magnetic pole 104 and the first predeterminable area can be the same or different；First alternating current 103 and the second alternating current
105 sizes can be the same or different；The current direction of first alternating current 103 and the second alternating current 105 can reversely be set
Put, so that then the line of magnetic induction between the two is more suitable for the disclosure.
In step S520, the mobile substrate simultaneously measures what first closing coil was produced through first magnetic field
First induced field current.
In this example embodiment, with reference to shown in figure 1 and Fig. 2, the first closing coil 107 is located at the of substrate 110
On one contraposition region 109；Moving substrate 110, when the first closing coil 107 passes through above-mentioned first magnetic field, utilizes the first electric current
Sensor 106 measures the first closing coil 107 and passes through the first induced field current caused by above-mentioned first magnetic field；Further,
In order to enable the first current sensor 106 and the first closing coil 107 are easy to connect, is provided with the first closing coil 107
One wiring pin 108；First current sensor 106 is attached by the first wiring pin 108 and the first closing coil 107,
And measure the first closing coil 107 and pass through the first induced field current caused by above-mentioned first magnetic field.
In step S530, judge whether first induced field current reaches maximum sensing electric current and judging described the
When one induced field current reaches the maximum sensing electric current, stop the mobile substrate.
In this example embodiment, with reference to shown in figure 1 and Fig. 3, the first magnetic is measured using the first current sensor 106
Sense electric current, and judge whether the first induced field current reaches maximum sensing electric current, specifically：
When the first closing coil 107 passes through the first magnetic field, as the first closing coil 107 passes through the area in the first magnetic field
Increase, first magnetic field also begins to increase through the magnetic flux (calling the first magnetic flux in the following text) of first closing coil, because
This first induced field current also increases as；When the first induced field current increases to a critical value (it is understood that when the
When one induced field current increases to the critical value, it can make it may be considered that the position of the first closing coil is in the first magnetic field
Induced field current reaches the unique positions of maximum) when start to reduce；When the first induced field current starts to reduce, determining should
Critical value is maximum induced field current.It is understood, therefore, that when the first induced field current starts to reduce, it was demonstrated that first
The area in closing coil 107 through the first magnetic field starts to reduce (the first magnetic flux also begins to reduce)；Substrate is continued to move to, when
When one induced field current reaches maximum sensing electric current again, stop moving substrate 110, realize the first contraposition region of substrate 110
109 with the contraposition of the first predeterminable area of mask plate.
In order to further improve the aligning accuracy of mask plate and substrate and prevent substrate run-off the straight in contraposition, this example
Embodiment further provides another alignment method.Refering to what is shown in Fig. 6, the alignment method can also include step S610, step
S620 and step S630.Wherein：
In step S610, the second magnetic field is generated using the 3rd magnetic pole and the 4th magnetic pole；Wherein, the 3rd magnetic pole with
And the 4th magnetic pole be located at the mask plate the second predeterminable area both sides and have gap with second predeterminable area.
In this example embodiment, set respectively in the both sides up and down of the second predeterminable area of mask plate the 3rd magnetic pole with
And the 4th magnetic pole, then pass through the 4th magnetic field that the 3rd alternating current and the 4th alternating current generation rule change respectively.Wherein,
Three magnetic poles and the 4th magnetic pole can be movably disposed at the both sides of the second predeterminable area, the outside support by outside support
Can be fixedly installed can also move setting；Also, the gap of the 3rd magnetic pole and the 4th magnetic pole and the second predeterminable area can phase
Together can not also be same；The size of 3rd alternating current and the 4th alternating current can be the same or different, the 3rd alternating current and
The current direction of 4th alternating current can be oppositely arranged, so that then the line of magnetic induction between the two is more suitable for the disclosure.
Wherein, refering to what is shown in Fig. 5, the 3rd magnetic pole and the 4th magnetic pole can be separately positioned on the first magnetic pole and the second magnetic pole
On diagonal position；It is therefore to be understood that the position in the second magnetic field for the first magnetic field, is also in the first magnetic field
Diagonal position.
It should be noted that schematic diagram (Fig. 2) and profit due to producing the second magnetic field using the 3rd magnetic pole and the 4th magnetic pole
Identical (identical with Fig. 2) to produce the schematic diagram in the first magnetic field with the second magnetic pole with the first magnetic pole, details are not described herein again.
In step S620, the mobile substrate simultaneously measures what second closing coil was produced through second magnetic field
Second induced field current.
In this example embodiment, with reference to shown in figure 1 and Fig. 4, the second closing coil is located at the second couple of substrate 110
On the region 111 of position；Moving substrate 110, when the second closing coil passes through above-mentioned second magnetic field, is surveyed using the second current sensor
Two closing coil of flow control passes through the second induced field current caused by above-mentioned second magnetic field；Further, in order to enable the second electricity
Flow sensor and the second closing coil are easy to connect, and the second wiring pin is provided with the second closing coil；Second current sense
Device is attached by the second wiring pin and the second closing coil, and measures the second closing coil when passing through above-mentioned second magnetic field
The second induced field current produced.
In step S630, judge whether second induced field current reaches maximum sensing electric current and judging described the
When one induced field current and second induced field current reach maximum sensing electric current, stop the mobile substrate.
In this example embodiment, with reference to shown in figure 1 and Fig. 4, second the second magnetic strength of current sensor measurement is utilized
Induced current, and judge whether the second induced field current reaches maximum sensing electric current, specifically：
When the second closing coil passes through the second magnetic field, as the second closing coil passes through the increasing of the area in the second magnetic field
Adding, the magnetic flux (calling the second magnetic flux in the following text) of second magnetic field through second closing coil also increases as, therefore the
Two induced field currents also increase as；When the second induced field current increases to a critical value (it is understood that when the second magnetic strength
When induced current increases to the critical value, it may be considered that the position of the second closing coil, which is in the second magnetic field, can cause magnetic strength
Induced current reaches the unique positions of maximum) when start to reduce；When the second induced field current starts to reduce, the critical value is determined
For maximum induced field current.It is understood, therefore, that when the second induced field current starts to reduce, it was demonstrated that the second closed line
The area through the second magnetic field is enclosed to start to reduce (the second magnetic flux is also with reduction)；Substrate 110 is continued to move to, when the second magnetic strength
When induced current reaches maximum sensing electric current at the same time with above-mentioned first induced field current, stop moving substrate 110, realize substrate 110
The first contraposition region 109 and mask plate the first predeterminable area and the second contraposition region 111 and the second preset areas of mask plate
Aligned while domain.
In a kind of exemplary embodiment of the disclosure, first magnetic pole and the second magnetic pole are electromagnetic coil.
In addition, although describing each step of method in the disclosure with particular order in the accompanying drawings, still, this does not really want
These steps must be performed according to the particular order by asking or implying, or the step having to carry out shown in whole could be realized
Desired result.It is additional or alternative, it is convenient to omit multiple steps are merged into a step and performed by some steps, and/
Or a step is decomposed into execution of multiple steps etc..
It should be noted that although some modules or list of the equipment for action executing are referred in above-detailed
Member, but this division is not enforceable.In fact, according to embodiment of the present disclosure, it is above-described two or more
Either the feature of unit and function can embody module in a module or unit.A conversely, above-described mould
Either the feature of unit and function can be further divided into being embodied by multiple modules or unit block.
Through the above description of the embodiments, those skilled in the art is it can be readily appreciated that example described herein is implemented
Mode can be realized by software, can also be realized by way of software is with reference to necessary hardware.Therefore, according to the disclosure
The technical solution of embodiment can be embodied in the form of software product, the software product can be stored in one it is non-volatile
Property storage medium (can be CD-ROM, USB flash disk, mobile hard disk etc.) in or network on, including some instructions are so that a calculating
Equipment (can be personal computer, server, mobile terminal or network equipment etc.) is performed according to disclosure embodiment
Method.
Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice invention disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
Claims (10)
1. a kind of alignment device, is used for realization the contraposition of substrate and mask plate, it is characterised in that including：
First closing coil, is arranged in the first contraposition region of the substrate；
First magnetic pole and the second magnetic pole, positioned at the both sides of the first predeterminable area of the mask plate and generate the first magnetic field；Its
In, first magnetic pole and second magnetic pole have gap with first predeterminable area；
First current sensor, is connected with first closing coil.
2. alignment device according to claim 1, it is characterised in that first current sensor is closed by described first
The first wiring pin configured on zygonema circle is connected with first closing coil.
3. alignment device according to claim 1, it is characterised in that first closing coil and the grid on the substrate
Line sets with layer and has phase same material with the grid line.
4. alignment device according to claim 1, it is characterised in that the alignment device further includes：
Second closing coil, is arranged in the second contraposition region of the substrate；
3rd magnetic pole and the 4th magnetic pole, positioned at the both sides of the second predeterminable area of the mask plate and generate the second magnetic field；Its
In, the 3rd magnetic pole and the 4th magnetic pole have gap with second predeterminable area
Second current sensor, is connected with second closing coil.
5. alignment device according to claim 1, it is characterised in that first magnetic pole and the second magnetic pole are electromagnetism
Coil.
6. a kind of alignment method, is used for realization the contraposition of substrate and mask plate, it is characterised in that the first contraposition area of the substrate
Domain is provided with the first closing coil；Wherein, the alignment method includes：
The first magnetic field is generated using the first magnetic pole and the second magnetic pole；Wherein, first magnetic pole and the second magnetic pole are located at institute
State the both sides of the first predeterminable area of mask plate and have gap with first predeterminable area；
The mobile substrate simultaneously measures the first induced field current that first closing coil passes through first magnetic field to produce；
Judge whether first induced field current reaches maximum sensing electric current and judging that first induced field current reaches
During the maximum sensing electric current, stop the mobile substrate.
7. alignment method according to claim 6, it is characterised in that the first magnetic that measurement first closing coil produces
Sensing electric current includes：
The first induced field current produced using the first closing coil described in the first current sensor measurement.
8. alignment method according to claim 6, it is characterised in that first induced field current is with first magnetic
Field increases through the increase of the magnetic flux of first closing coil and starts to reduce when increasing to critical value.
9. alignment method according to claim 6, it is characterised in that the second contraposition region of the substrate is provided with second
Closing coil；Wherein, the alignment method further includes：
The second magnetic field is generated using the 3rd magnetic pole and the 4th magnetic pole；Wherein, the 3rd magnetic pole and the 4th magnetic pole are located at institute
State the both sides of the second predeterminable area of mask plate and have gap with second predeterminable area；
The mobile substrate simultaneously measures the second induced field current that second closing coil passes through second magnetic field to produce；
Judge second induced field current whether reach maximum sensing electric current and judge first induced field current and
When second induced field current reaches maximum sensing electric current, stop the mobile substrate.
10. alignment method according to claim 6, it is characterised in that first magnetic pole and the second magnetic pole are electricity
Magnetic coil.
Priority Applications (1)
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| CN1991591A (en) * | 2005-12-30 | 2007-07-04 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| CN101098571A (en) * | 2006-06-28 | 2008-01-02 | 尹正洙 | The electric heat mat controller |
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| JP2002036373A (en) * | 2000-07-25 | 2002-02-05 | Sanyo Electric Co Ltd | Stereo lithographic apparatus |
| JP2003324028A (en) * | 2002-04-30 | 2003-11-14 | Jfe Steel Kk | Method of manufacturing planar magnetic element |
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| CN1991591A (en) * | 2005-12-30 | 2007-07-04 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| CN101098571A (en) * | 2006-06-28 | 2008-01-02 | 尹正洙 | The electric heat mat controller |
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