CN106949663B - A multi-segment series semiconductor refrigeration device - Google Patents
A multi-segment series semiconductor refrigeration device Download PDFInfo
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- CN106949663B CN106949663B CN201710259892.0A CN201710259892A CN106949663B CN 106949663 B CN106949663 B CN 106949663B CN 201710259892 A CN201710259892 A CN 201710259892A CN 106949663 B CN106949663 B CN 106949663B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000005057 refrigeration Methods 0.000 title claims abstract description 50
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本发明公开了一种多节串联式半导体制冷装置，其特征在于：包括N节壳体，N大于或等于3，所述壳体包括圆筒状的壳体主体、进气管和出气管，所述壳体主体的侧壁设有进气口和出气口，此进气口与出气口均与壳体主体的内腔相通，所述进气口和出气口分别与进气管的一端和出气管的一端连接；所有壳体主体依次连接，且第1节壳体主体和第N节壳体主体的外端均设有封盖，第N节的进气管的另一端与第N‑2节的出气管的另一端连接；相邻的2节壳体主体之间设有半导体制冷片，且相邻的2张半导体制冷片相对设置。本发明采用多节壳体多成，壳体的数量可根据负荷的变化而增减，从而满足不断变化的环境需求，且制冷效率高。
The invention discloses a multi-segment serial semiconductor refrigeration device, which is characterized in that it includes N-segment shells, N is greater than or equal to 3, and the shells include a cylindrical shell body, an air inlet pipe and an air outlet pipe. The side wall of the housing main body is provided with an air inlet and an air outlet, and the air inlet and the air outlet are all communicated with the inner cavity of the housing main body, and the air inlet and the air outlet are connected to one end of the air inlet pipe and the air outlet pipe respectively. All the shell bodies are connected in sequence, and the outer ends of the shell body of the first section and the shell body of the Nth section are provided with a cover, and the other end of the air intake pipe of the Nth section is connected with the N-2 section The other end of the air outlet pipe is connected; a semiconductive refrigeration sheet is arranged between two adjacent shell bodies, and two adjacent semiconductive refrigeration sheets are arranged oppositely. The invention adopts multi-section shells, and the number of shells can be increased or decreased according to the change of the load, so as to meet the constantly changing environmental requirements, and the refrigeration efficiency is high.
Description
技术领域technical field
本发明涉及制冷技术设备，具体涉及一种多节串联式半导体制冷装置。The invention relates to refrigeration technical equipment, in particular to a multi-section serial semiconductor refrigeration device.
背景技术Background technique
半导体制冷的工作原理是基于帕尔帖效应，具有制冷迅速，操作简单，不需要制冷剂，无污染、无噪音等特点，是一种新兴发展起来的制冷技术，近年来被广泛使用。但目前的使用的半导体制冷系统还会存在以下缺陷：1、其体积较大，且制造成本较高；2、散热和导冷的效率较低，制冷效率不理想。3、目前的半导体制冷系统的功率恒定，无法满足不断变化的环境。The working principle of semiconductor refrigeration is based on the Peltier effect. It has the characteristics of rapid cooling, simple operation, no need for refrigerant, no pollution, no noise, etc. It is a newly developed refrigeration technology and has been widely used in recent years. However, the currently used semiconductor refrigeration system also has the following defects: 1. It has a large volume and high manufacturing cost; 2. The efficiency of heat dissipation and cooling conduction is low, and the refrigeration efficiency is not ideal. 3. The power of the current semiconductor refrigeration system is constant, which cannot meet the changing environment.
发明内容Contents of the invention
本发明的目的是为了克服以上现有技术存在的不足，提供了一种结构简单、合理，可适应各种不同负荷变化的多节串联式半导体制冷装置。The object of the present invention is to overcome the shortcomings of the prior art above, and provide a multi-section serial semiconductor refrigeration device with a simple and reasonable structure, which can adapt to various load changes.
本发明的目的通过以下的技术方案实现：本多节串联式半导体制冷装置，包括N节壳体，N大于或等于3，所述壳体包括圆筒状的壳体主体、进气管和出气管，所述壳体主体的侧壁设有进气口和出气口，此进气口与出气口均与壳体主体的内腔相通，所述进气口和出气口分别与进气管的一端和出气管的一端连接；所有壳体主体依次连接，且第1节壳体主体和第N节壳体主体的外端均设有封盖，第N节的进气管的另一端与第N-2节的出气管的另一端连接；相邻的2节壳体主体之间设有半导体制冷片，且相邻的2张半导体制冷片相对设置。The purpose of the present invention is achieved through the following technical solutions: the multi-section serial semiconductor refrigeration device includes N-section casings, N is greater than or equal to 3, and the casing includes a cylindrical casing main body, an air inlet pipe and an air outlet pipe , the side wall of the housing main body is provided with an air inlet and an air outlet, and the air inlet and the air outlet are all communicated with the inner cavity of the housing main body, and the air inlet and the air outlet are respectively connected to one end of the air intake pipe and One end of the air outlet pipe is connected; all the shell bodies are connected in sequence, and the outer ends of the shell body of the first section and the shell body of the Nth section are provided with a cover, and the other end of the air intake pipe of the Nth section is connected with the N-2 The other end of the air outlet pipe of the section is connected; a semiconductor cooling sheet is arranged between the two adjacent casing bodies, and two adjacent semiconductor cooling sheets are oppositely arranged.
优选的，位于同一个壳体主体的进气口和出气口均位于壳体主体的侧壁的同一侧，所述壳体主体的内腔设有折流板，所述进气口和出气口分别位于折流板的两边；此折流板的直径与壳体主体的内腔的直径相等，且折流板远离进气口的一端设有缺口。Preferably, the air inlet and the air outlet located on the same housing body are located on the same side of the side wall of the housing body, the inner cavity of the housing body is provided with a baffle, and the air inlet and the air outlet They are respectively located on both sides of the baffle; the diameter of the baffle is equal to the diameter of the inner cavity of the housing main body, and a gap is provided at the end of the baffle away from the air inlet.
优选的，所述半导体制冷片包括圈饼状的制冷部、隔热层和第一法兰部，所述隔热层包裹着制冷部的圆周壁，所述第一法兰部与隔热层套接。Preferably, the semiconductor refrigerating sheet includes a donut-shaped refrigerating part, a heat insulating layer and a first flange part, the heat insulating layer wraps the circumferential wall of the refrigerating part, and the first flange part and the heat insulating layer socket.
优选的，所述壳体主体的两端设有第二法兰部，相邻的2节壳体主体的第二法兰部均与第一法兰部连接。Preferably, both ends of the housing body are provided with second flanges, and the second flanges of two adjacent housing bodies are connected to the first flanges.
优选的，所述制冷部的直径与壳体主体的内腔的直径相等。Preferably, the diameter of the refrigerating part is equal to the diameter of the inner chamber of the housing body.
优选的，所述进气管的另一端和出气管的另一端均设有第三法兰部。Preferably, the other end of the air inlet pipe and the other end of the air outlet pipe are both provided with a third flange.
本发明相对于现有技术具有如下的优点：Compared with the prior art, the present invention has the following advantages:
1、本多节串联式半导体制冷装置采用多节壳体多成，壳体的数量可根据负荷的变化而增减，从而满足不断变化的环境需求。1. The multi-section serial semiconductor refrigeration device adopts multi-section shells, and the number of shells can be increased or decreased according to the change of load, so as to meet the changing environmental requirements.
2、本多节串联式半导体制冷装置中相邻的两张半导体制冷片相对设置，即相邻的两张半导体制冷片的冷端相对或热端相对，从而形成多个依次交替相间的制冷区间和制热区间，以合理利用能源，提高能源的利用源。2. In this multi-section serial semiconductor refrigeration device, the adjacent two semiconductor refrigeration sheets are arranged opposite to each other, that is, the cold ends or hot ends of the adjacent two semiconductor refrigeration sheets are opposite to each other, thus forming a plurality of alternating cooling intervals and heating intervals to rationally utilize energy and improve the source of energy utilization.
3、本多节串联式半导体制冷装置中相邻的两张半导体制冷片的冷端相对或热端相对，从而形成多个依次交替相间的制冷区间和制热区间，且各个制冷串联连接及各个制热区间串联连接，则多个制冷区间相叠加使用或多个制热区间相叠加使用，这提高了整个装置的制冷效率3. In this multi-section serial semiconductor refrigeration device, the cold ends or hot ends of the adjacent two semiconductor refrigeration sheets are opposite to each other, thus forming a plurality of alternating cooling sections and heating sections, and each refrigeration is connected in series and each If the heating sections are connected in series, multiple cooling sections can be used in superimposition or multiple heating sections can be used in a superimposed manner, which improves the cooling efficiency of the entire device
4、本多节串联式半导体制冷装置通过多节壳体依次连接构成，体积小，制造成本低。4. The multi-section tandem semiconductor refrigeration device is formed by sequentially connecting multi-section housings, which has small volume and low manufacturing cost.
附图说明Description of drawings
图1是本发明的多节串联式半导体制冷装置的剖视图。Fig. 1 is a cross-sectional view of a multi-segment series semiconductor refrigeration device of the present invention.
图2是本发明的多节串联式半导体制冷装置的结构示意图。Fig. 2 is a structural schematic diagram of a multi-section serial semiconductor refrigeration device of the present invention.
图3是本发明的壳体的结构示意图。Fig. 3 is a structural schematic diagram of the casing of the present invention.
图4是本发明的壳体的剖视图。Fig. 4 is a cross-sectional view of the housing of the present invention.
图5是本发明的半导体制冷片的结构示意图。Fig. 5 is a schematic diagram of the structure of the semiconductor refrigeration chip of the present invention.
具体实施方式Detailed ways
下面结合附图和实施例对本发明作进一步说明。The present invention will be further described below in conjunction with drawings and embodiments.
如图1至图4所示的多节串联式半导体制冷装置，包括N节壳体1，N大于或等于3，所述壳体1包括圆筒状的壳体主体2、进气管3和出气管4，所述壳体主体2的侧壁设有进气口6和出气口7，此进气口6与出气口7均与壳体主体2的内腔相通，所述进气口6和出气口7分别与进气管3的一端和出气管4的一端连接；所有壳体主体2依次连接，且第1节壳体主体2和第N节壳体主体2的外端均设有封盖8，第N节的进气管3的另一端与第N-2节的出气管4的另一端连接；相邻的2节壳体主体2之间设有半导体制冷片9，且相邻的2张半导体制冷片9相对设置。The multi-section serial semiconductor refrigeration device shown in Figures 1 to 4 includes N-section casing 1, N is greater than or equal to 3, and the casing 1 includes a cylindrical casing body 2, an inlet pipe 3 and an outlet pipe. Air pipe 4, the side wall of the housing main body 2 is provided with an air inlet 6 and an air outlet 7, and the air inlet 6 and the air outlet 7 are all communicated with the inner cavity of the housing main body 2, and the air inlet 6 and the air outlet 7 are connected to each other. The air outlet 7 is respectively connected to one end of the air intake pipe 3 and one end of the air outlet pipe 4; all the shell bodies 2 are connected in sequence, and the outer ends of the first section shell body 2 and the N section shell body 2 are provided with caps 8. The other end of the air inlet pipe 3 of Section N is connected to the other end of the outlet pipe 4 of Section N-2; a semiconductor refrigeration sheet 9 is provided between the two adjacent shell main bodies 2, and the adjacent two Zhang semiconductor cooling sheet 9 is oppositely arranged.
如图1和图2所示，本发明中的多节串联式半导体制冷装置具有7节壳体1，各节壳体1依次连接。如图1和图2中，自左向右起，7节壳体1分别为，第1节壳体1至第7节壳体1。第1节壳体主体2和第7节壳体主体2的外端均采用封盖8密封，而第3节进气管3的另一端和第1节出气管4连接，而第4节进气管3的另一端与第2节出气管4的另一端连接，所述第5节进气管3的另一端与第3节的出气管4的另一端连接，所述第6节进气管3的另一端与第4节出气管4的另一端连接，第7节进气管3的另一端与第5节出气管4的另一端连接。则第1、3、5和7节的壳体主体2依次连通形成第一通道，而第2、4和6节的壳体主体2依次连通而形成第二通道。相邻的2张半导体制冷片9相对设置，即相邻的2张半导体制冷片9的冷端相对或热端相对，如本发明的多节串联式半导体制冷装置具有7节壳体，相邻2节壳体1之间具有半导体制冷片9，即本发明的多节串联式半导体制冷装置具有6张半导体制冷片9。在图1和图2中，自左向右起，6张半导体制冷片9分别为第1张半导体制冷片9至第6张半导体制冷片9，第1张半导体制冷片9的冷端朝向位于第一节壳体主体2外端的封盖8，而第1张半导体制冷片9的热端与第2张半导体制冷片9的热端相对，而第2张半导体制冷片9的冷端与第3张半导体制冷片9的冷端相对设置，第3张半导体制冷片9的热端与第4张半导体制冷片9的热端相对，第4张半导体制冷片9的冷端与第5张半导体制冷片9的冷端相对设置，第5张半导体制冷片9的热端与第6张半导体制冷片9的热端相对，最后第6张半导体制冷片9的冷端朝向位于第7节壳体主体2外端的封盖8。As shown in FIG. 1 and FIG. 2 , the multi-section serial semiconductor refrigeration device in the present invention has seven casings 1 , and the casings 1 of each section are connected in sequence. As shown in FIG. 1 and FIG. 2 , from left to right, the 7-section housing 1 is respectively, the 1st-section housing 1 to the 7th-section housing 1 . The outer ends of the first section housing main body 2 and the seventh section housing main body 2 are sealed with a cover 8, while the other end of the third section air intake pipe 3 is connected with the first section air outlet pipe 4, while the fourth section air intake pipe The other end of 3 is connected with the other end of the 2nd section air outlet pipe 4, the other end of the 5th section air intake pipe 3 is connected with the other end of the 3rd section air outlet pipe 4, the other end of the 6th section air intake pipe 3 One end is connected with the other end of the 4th joint air outlet pipe 4, and the other end of the 7th joint air intake pipe 3 is connected with the other end of the 5th joint air outlet pipe 4. Then the casing main bodies 2 of the 1st, 3rd, 5th and 7th sections are connected in sequence to form the first passage, while the casing main bodies 2 of the 2nd, 4th and 6th sections are connected in sequence to form the second passageway. Two adjacent semiconductor refrigeration sheets 9 are arranged oppositely, that is, the cold ends or hot ends of two adjacent semiconductor refrigeration sheets 9 are opposite, as the multi-section serial semiconductor refrigeration device of the present invention has 7 shells, adjacent There are semiconductor cooling fins 9 between the two shells 1, that is, the multi-segment series semiconductor cooling device of the present invention has six semiconductor cooling fins 9. In Fig. 1 and Fig. 2, from left to right, the six peltiers 9 are the first peltier 9 to the sixth peltier 9, and the cold end of the first peltier 9 is located at The cover 8 of the outer end of the first section housing main body 2, and the hot end of the first semiconductor refrigeration sheet 9 is opposite to the hot end of the second semiconductor refrigeration sheet 9, and the cold end of the second semiconductor refrigeration sheet 9 is opposite to the first semiconductor refrigeration sheet 9. The cold ends of the three semiconductor refrigeration sheets 9 are arranged oppositely, the hot end of the third semiconductor refrigeration sheet 9 is opposite to the hot end of the fourth semiconductor refrigeration sheet 9, and the cold end of the fourth semiconductor refrigeration sheet 9 is connected to the fifth semiconductor refrigeration sheet. The cold end of the refrigerating sheet 9 is oppositely arranged, the hot end of the 5th peltier cooling sheet 9 is opposite to the hot end of the 6th peltier cooling sheet 9, and finally the cold end of the 6th peltier cooling sheet 9 faces the housing located in section 7 A cover 8 at the outer end of the main body 2 .
则第1、3、5和7节的壳体主体2依次连通形成的第一通道为冷量通道，当第一介质从第1节的进气管3流入第一通道，此第一介质依次流过第1、3、5和7节壳体主体2的过程中，吸收各张半导体制冷片9的冷端产生的冷量，吸收了冷量的第一介质再通过第7节出气管4排出，而流至相应的地方，如存储食品冷藏室。第2、4和6节壳体主体2依次连通形成的第二通道为热量通道，用于冷却的第二介质从第2节进气管3流入第二通道，此第二介质依次流过第2、4和6节壳体主体2的过程中吸收各张半导体制冷片9的热端产生的热量，然后吸收了热量的第二介质再从第6节出气管4排出，从而带走本发明的多节串联式半导体制冷装置产生的热量，保证多节串联式半导体制冷装置可高效的进行制冷工作。Then the first channel formed by connecting the housing bodies 2 of Sections 1, 3, 5 and 7 in turn is a cooling channel. When the first medium flows into the first channel from the intake pipe 3 of Section 1, the first medium flows sequentially. During the process of passing through the first, third, fifth and seventh sections of the shell body 2, the cold generated by the cold end of each semiconductor refrigeration sheet 9 is absorbed, and the first medium that has absorbed the cold is discharged through the seventh section air outlet pipe 4 , and flow to the corresponding place, such as storage food refrigerator. Sections 2, 4 and 6 The second channel formed by the sequential connection of the shell main body 2 is a heat channel, and the second medium used for cooling flows into the second channel from the intake pipe 3 of the second section, and the second medium flows through the second channel in turn. , 4 and 6 sections of the shell main body 2 absorb the heat produced by the hot ends of each semiconductor refrigeration sheet 9, and then the second medium that has absorbed the heat is discharged from the 6th section air outlet pipe 4, thereby taking away the heat of the present invention The heat generated by the multi-section series semiconductor refrigeration device ensures that the multi-section series semiconductor refrigeration device can perform cooling work efficiently.
位于同一个壳体主体2的进气口6和出气口7均位于壳体主体2的侧壁的同一侧，所述壳体主体2的内腔设有折流板10，所述进气口6和出气口7分别位于折流板10的两边；此折流板10的直径与壳体主体2的内腔的直径相等，且折流板10远离进气口6的一端设有缺口11。此结构可延长介质在壳体主体2的内腔里的流动时间，保证介质充分吸收冷量或热量，从而提高制冷效率。The air inlet 6 and the air outlet 7 that are located in the same housing body 2 are all located on the same side of the side wall of the housing body 2, and the inner cavity of the housing body 2 is provided with a baffle 10, and the air inlet 6 and the air outlet 7 are located on both sides of the baffle 10; This structure can prolong the flow time of the medium in the inner cavity of the shell main body 2, and ensure that the medium fully absorbs cold or heat, thereby improving the cooling efficiency.
如图5所示，所述半导体制冷片9包括圈饼状的制冷部12、隔热层13和第一法兰部14，所述隔热层13包裹着制冷部12的圆周壁，所述第一法兰部14与隔热层13套接。此结构简单，隔热层13避免第一通道和第二通道之间的冷量与热量交换，提高了装置的制冷效率。As shown in Figure 5, the semiconductor cooling chip 9 includes a donut-shaped cooling part 12, a heat insulating layer 13 and a first flange part 14, and the heat insulating layer 13 wraps the peripheral wall of the cooling part 12, and the The first flange part 14 is sleeved on the heat insulation layer 13 . The structure is simple, and the heat insulation layer 13 avoids the exchange of cold and heat between the first channel and the second channel, thereby improving the cooling efficiency of the device.
所述壳体主体2的两端设有第二法兰部15，相邻的2节壳体主体2的第二法兰部15均与第一法兰部14连接。此结构保证了壳体主体2与半导体制冷片9之间连接稳定性，提高了工作可靠性。Both ends of the housing body 2 are provided with second flanges 15 , and the second flanges 15 of two adjacent housing bodies 2 are connected to the first flanges 14 . This structure ensures the stability of the connection between the casing main body 2 and the semiconductor cooling chip 9, and improves the working reliability.
所述制冷部11的直径与壳体主体2的内腔的直径相等。此结构紧凑，保证了制冷部的利用率，即避免制冷部制造的冷量和产生的热量散出第一通道或第二通道。The diameter of the cooling part 11 is equal to the diameter of the inner cavity of the housing main body 2 . The compact structure ensures the utilization rate of the refrigerating part, that is, avoids the cold produced by the refrigerating part and the heat generated from dissipating from the first channel or the second channel.
所述进气管3的另一端和出气管4的另一端均设有第三法兰部5。此结构简单，保证了进气管与出气管连接的稳定性高。The other end of the air inlet pipe 3 and the other end of the air outlet pipe 4 are both provided with a third flange portion 5 . The structure is simple, which ensures the high stability of the connection between the inlet pipe and the outlet pipe.
上述具体实施方式为本发明的优选实施例，并不能对本发明进行限定，其他的任何未背离本发明的技术方案而所做的改变或其它等效的置换方式，都包含在本发明的保护范围之内。The specific implementation described above is a preferred embodiment of the present invention, and does not limit the present invention. Any other changes or other equivalent replacement methods that do not deviate from the technical solution of the present invention are included in the scope of protection of the present invention. within.
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| JPH10185390A (en) * | 1996-11-08 | 1998-07-14 | Matsushita Refrig Co Ltd | Heat exchanging unit having built-in thermoelectric module and refrigerator employing heat exchanging unit |
| CN105299950A (en) * | 2015-11-12 | 2016-02-03 | 华南理工大学 | Solar semiconductor refrigerating system |
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
| CN206831861U (en) * | 2017-04-20 | 2018-01-02 | 华南理工大学 | A kind of multi-section serial formula semiconductor cooling device |
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| JPH10185390A (en) * | 1996-11-08 | 1998-07-14 | Matsushita Refrig Co Ltd | Heat exchanging unit having built-in thermoelectric module and refrigerator employing heat exchanging unit |
| CN105299950A (en) * | 2015-11-12 | 2016-02-03 | 华南理工大学 | Solar semiconductor refrigerating system |
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
| CN206831861U (en) * | 2017-04-20 | 2018-01-02 | 华南理工大学 | A kind of multi-section serial formula semiconductor cooling device |
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