CN106949663B - Multi-section serial semiconductor refrigerating device - Google Patents
Multi-section serial semiconductor refrigerating device Download PDFInfo
- Publication number
- CN106949663B CN106949663B CN201710259892.0A CN201710259892A CN106949663B CN 106949663 B CN106949663 B CN 106949663B CN 201710259892 A CN201710259892 A CN 201710259892A CN 106949663 B CN106949663 B CN 106949663B
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- China
- Prior art keywords
- shell body
- air inlet
- air outlet
- section
- semiconductor refrigerating
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a multi-section serial semiconductor refrigerating device, which is characterized in that: the air inlet and the air outlet are communicated with the inner cavity of the shell body, and the air inlet and the air outlet are respectively connected with one end of the air inlet pipe and one end of the air outlet pipe; all the shell bodies are sequentially connected, the outer ends of the 1 st shell body and the N th shell body are respectively provided with a sealing cover, and the other end of the air inlet pipe of the N th segment is connected with the other end of the air outlet pipe of the N-2 th segment; semiconductor refrigerating sheets are arranged between the adjacent 2 sections of shell bodies, and the adjacent 2 sections of semiconductor refrigerating sheets are oppositely arranged. The invention adopts a plurality of sections of shells, the number of the shells can be increased or decreased according to the change of the load, thereby meeting the continuously changing environmental requirements and having high refrigeration efficiency.
Description
Technical Field
The invention relates to refrigeration technical equipment, in particular to a multi-section serial semiconductor refrigeration device.
Background
The working principle of semiconductor refrigeration is based on the Peltier effect, and the semiconductor refrigeration device has the characteristics of rapid refrigeration, simple operation, no need of refrigerant, no pollution, no noise and the like, is an emerging and developed refrigeration technology, and is widely used in recent years. However, the semiconductor refrigeration systems currently in use have the following drawbacks: 1. the volume is larger and the manufacturing cost is higher; 2. the heat dissipation and cold conduction efficiency is lower, and the refrigeration efficiency is not ideal. 3. The power of the current semiconductor refrigeration system is constant, and the continuous changing environment cannot be met.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a multi-section serial semiconductor refrigeration device which has a simple and reasonable structure and can adapt to various different load changes.
The aim of the invention is achieved by the following technical scheme: the multi-section serial semiconductor refrigerating device comprises N sections of shells, wherein N is greater than or equal to 3, each shell comprises a cylindrical shell body, an air inlet pipe and an air outlet pipe, the side wall of each shell body is provided with an air inlet and an air outlet, the air inlet and the air outlet are communicated with the inner cavity of the shell body, and the air inlet and the air outlet are respectively connected with one end of the air inlet pipe and one end of the air outlet pipe; all the shell bodies are sequentially connected, the outer ends of the 1 st shell body and the N th shell body are respectively provided with a sealing cover, and the other end of the air inlet pipe of the N th segment is connected with the other end of the air outlet pipe of the N-2 th segment; semiconductor refrigerating sheets are arranged between the adjacent 2 sections of shell bodies, and the adjacent 2 sections of semiconductor refrigerating sheets are oppositely arranged.
Preferably, the air inlet and the air outlet which are positioned on the same shell body are positioned on the same side of the side wall of the shell body, the inner cavity of the shell body is provided with a baffle plate, and the air inlet and the air outlet are respectively positioned on two sides of the baffle plate; the diameter of the baffle plate is equal to that of the inner cavity of the shell body, and a notch is arranged at one end of the baffle plate far away from the air inlet.
Preferably, the semiconductor refrigeration piece comprises a ring-cake-shaped refrigeration part, a heat insulation layer and a first flange part, wherein the heat insulation layer wraps the circumferential wall of the refrigeration part, and the first flange part is sleeved with the heat insulation layer.
Preferably, the two ends of the shell body are provided with second flange parts, and the second flange parts of the adjacent 2-section shell body are connected with the first flange parts.
Preferably, the diameter of the refrigerating unit is equal to the diameter of the inner cavity of the housing main body.
Preferably, the other end of the air inlet pipe and the other end of the air outlet pipe are both provided with a third flange part.
Compared with the prior art, the invention has the following advantages:
1. the multi-section serial semiconductor refrigerating device adopts a plurality of sections of shells, and the number of the shells can be increased or decreased according to the change of the load, thereby meeting the continuously changing environmental requirements.
2. Two adjacent semiconductor refrigerating sheets in the multi-section serial semiconductor refrigerating device are oppositely arranged, namely, cold ends or hot ends of the two adjacent semiconductor refrigerating sheets are opposite, so that a plurality of refrigerating sections and heating sections which are alternately arranged in sequence are formed, energy sources are reasonably utilized, and the utilization sources of the energy sources are improved.
3. The cold ends or the hot ends of two adjacent semiconductor refrigerating sheets in the multi-section serial semiconductor refrigerating device are opposite to each other, so that a plurality of refrigerating sections and heating sections which are alternately arranged in sequence are formed, and each refrigerating series connection and each heating section series connection are used for overlapping the plurality of refrigerating sections or overlapping the plurality of heating sections, thereby improving the refrigerating efficiency of the whole device
4. The multi-section serial semiconductor refrigerating device is formed by connecting a plurality of sections of shells in sequence, and has small volume and low manufacturing cost.
Drawings
Fig. 1 is a sectional view of a multi-stage serial semiconductor refrigeration device of the present invention.
Fig. 2 is a schematic structural view of a multi-stage serial semiconductor refrigeration device according to the present invention.
Fig. 3 is a schematic structural view of the housing of the present invention.
Fig. 4 is a cross-sectional view of the housing of the present invention.
Fig. 5 is a schematic structural view of the semiconductor refrigeration sheet of the present invention.
Detailed Description
The invention is further described below with reference to the drawings and examples.
The multi-section serial semiconductor refrigerating device as shown in fig. 1 to 4 comprises an N-section shell 1, wherein N is greater than or equal to 3, the shell 1 comprises a cylindrical shell body 2, an air inlet pipe 3 and an air outlet pipe 4, the side wall of the shell body 2 is provided with an air inlet 6 and an air outlet 7, the air inlet 6 and the air outlet 7 are communicated with the inner cavity of the shell body 2, and the air inlet 6 and the air outlet 7 are respectively connected with one end of the air inlet pipe 3 and one end of the air outlet pipe 4; all the shell bodies 2 are sequentially connected, the outer ends of the 1 st shell body 2 and the N th shell body 2 are respectively provided with a sealing cover 8, and the other end of the air inlet pipe 3 of the N th section is connected with the other end of the air outlet pipe 4 of the N-2 th section; a semiconductor refrigerating sheet 9 is arranged between the adjacent 2 sections of shell bodies 2, and the adjacent 2 sections of semiconductor refrigerating sheets 9 are oppositely arranged.
As shown in fig. 1 and 2, the multi-stage serial semiconductor refrigeration device of the present invention has 7-stage housings 1, each of the housings 1 being connected in sequence. As shown in fig. 1 and 2, the 7-section casing 1 is 1 st-section casing 1 to 7-section casing 1, respectively, from left to right. The outer ends of the 1 st section of shell main body 2 and the 7 th section of shell main body 2 are sealed by adopting a sealing cover 8, the other end of the 3 rd section of air inlet pipe 3 is connected with the 1 st section of air outlet pipe 4, the other end of the 4 th section of air inlet pipe 3 is connected with the other end of the 2 nd section of air outlet pipe 4, the other end of the 5 th section of air inlet pipe 3 is connected with the other end of the 3 rd section of air outlet pipe 4, the other end of the 6 th section of air inlet pipe 3 is connected with the other end of the 4 th section of air outlet pipe 4, and the other end of the 7 th section of air inlet pipe 3 is connected with the other end of the 5 th section of air outlet pipe 4. The casing bodies 2 of sections 1, 3, 5 and 7 are sequentially communicated to form a first passage, and the casing bodies 2 of sections 2, 4 and 6 are sequentially communicated to form a second passage. The adjacent 2 semiconductor refrigerating sheets 9 are oppositely arranged, namely, the cold ends or the hot ends of the adjacent 2 semiconductor refrigerating sheets 9 are opposite, for example, the multi-section serial semiconductor refrigerating device provided by the invention is provided with 7 sections of shells, the semiconductor refrigerating sheets 9 are arranged between the adjacent 2 sections of shells 1, namely, the multi-section serial semiconductor refrigerating device provided by the invention is provided with 6 semiconductor refrigerating sheets 9. In fig. 1 and 2, 6 semiconductor refrigeration sheets 9 are respectively 1 st semiconductor refrigeration sheet 9 to 6 th semiconductor refrigeration sheet 9 from left to right, the cold end of the 1 st semiconductor refrigeration sheet 9 faces the sealing cover 8 positioned at the outer end of the first section of the casing main body 2, the hot end of the 1 st semiconductor refrigeration sheet 9 is opposite to the hot end of the 2 nd semiconductor refrigeration sheet 9, the cold end of the 2 nd semiconductor refrigeration sheet 9 is opposite to the cold end of the 3 rd semiconductor refrigeration sheet 9, the hot end of the 3 rd semiconductor refrigeration sheet 9 is opposite to the hot end of the 4 th semiconductor refrigeration sheet 9, the cold end of the 4 th semiconductor refrigeration sheet 9 is opposite to the cold end of the 5 th semiconductor refrigeration sheet 9, the hot end of the 5 th semiconductor refrigeration sheet 9 is opposite to the hot end of the 6 th semiconductor refrigeration sheet 9, and finally the cold end of the 6 th semiconductor refrigeration sheet 9 faces the sealing cover 8 positioned at the outer end of the 7 th section of the casing main body 2.
The first channels formed by sequentially connecting the shell bodies 2 of the 1 st, 3 rd, 5 th and 7 th sections are cold energy channels, and when a first medium flows into the first channels from the air inlet pipe 3 of the 1 st section, the first medium sequentially flows through the 1 st, 3 rd, 5 th and 7 th sections of shell bodies 2, absorbs cold energy generated by cold ends of the semiconductor refrigerating sheets 9, and is discharged through the air outlet pipe 4 of the 7 th section after the cold energy is absorbed, and flows to corresponding places, such as a food storage refrigerating chamber. The second channels formed by the 2 nd, 4 th and 6 th sections of shell bodies 2 in sequence are heat channels, a second medium for cooling flows into the second channels from the 2 nd section of air inlet pipe 3, the second medium absorbs heat generated by the hot ends of the semiconductor refrigerating sheets 9 in the process of flowing through the 2 nd, 4 th and 6 th sections of shell bodies 2 in sequence, and then the second medium absorbing the heat is discharged from the 6 th section of air outlet pipe 4, so that the heat generated by the multi-section serial semiconductor refrigerating device is taken away, and the multi-section serial semiconductor refrigerating device can be guaranteed to perform refrigerating operation efficiently.
The air inlet 6 and the air outlet 7 which are positioned on the same shell body 2 are positioned on the same side of the side wall of the shell body 2, a baffle plate 10 is arranged in the inner cavity of the shell body 2, and the air inlet 6 and the air outlet 7 are respectively positioned on two sides of the baffle plate 10; the diameter of the baffle plate 10 is equal to that of the inner cavity of the shell body 2, and a notch 11 is arranged at one end of the baffle plate 10 away from the air inlet 6. The structure can prolong the flowing time of the medium in the inner cavity of the shell body 2, ensure that the medium fully absorbs cold or heat, and further improve the refrigeration efficiency.
As shown in fig. 5, the semiconductor refrigeration sheet 9 includes a doughnut-shaped refrigeration portion 12, a heat insulating layer 13, and a first flange portion 14, wherein the heat insulating layer 13 wraps the circumferential wall of the refrigeration portion 12, and the first flange portion 14 is sleeved with the heat insulating layer 13. The heat insulation layer 13 has a simple structure, prevents cold and heat exchange between the first channel and the second channel, and improves the refrigerating efficiency of the device.
The two ends of the housing body 2 are provided with second flange parts 15, and the second flange parts 15 of the adjacent 2-section housing body 2 are connected with the first flange parts 14. This structure ensures the connection stability between the housing main body 2 and the semiconductor refrigeration sheet 9, and improves the operational reliability.
The diameter of the refrigerating unit 11 is equal to the diameter of the inner cavity of the housing main body 2. The structure is compact, and the utilization rate of the refrigerating part is ensured, namely, the cooling capacity manufactured by the refrigerating part and the generated heat are prevented from being dissipated out of the first channel or the second channel.
The other end of the air inlet pipe 3 and the other end of the air outlet pipe 4 are respectively provided with a third flange part 5. The structure is simple, and the connection stability of the air inlet pipe and the air outlet pipe is ensured to be high.
The above embodiments are preferred examples of the present invention, and the present invention is not limited thereto, and any other modifications or equivalent substitutions made without departing from the technical aspects of the present invention are included in the scope of the present invention.
Claims (4)
1. A multisection serial semiconductor refrigerating plant, its characterized in that: the air inlet and the air outlet are communicated with the inner cavity of the shell body, and the air inlet and the air outlet are respectively connected with one end of the air inlet pipe and one end of the air outlet pipe; all the shell bodies are sequentially connected, the outer ends of the 1 st shell body and the N th shell body are respectively provided with a sealing cover, and the other end of the air inlet pipe of the N th segment is connected with the other end of the air outlet pipe of the N-2 th segment; a semiconductor refrigerating sheet is arranged between the adjacent 2 sections of shell bodies, and the adjacent 2 sections of semiconductor refrigerating sheets are oppositely arranged;
the air inlets and the air outlets which are positioned on the same shell body are positioned on the same side of the side wall of the shell body, a baffle plate is arranged in the inner cavity of the shell body, and the air inlets and the air outlets are respectively positioned on two sides of the baffle plate; the diameter of the baffle plate is equal to that of the inner cavity of the shell body, and a notch is arranged at one end of the baffle plate far away from the air inlet;
the semiconductor refrigerating sheet comprises a ring-cake-shaped refrigerating part, a heat insulation layer and a first flange part, wherein the heat insulation layer wraps the circumferential wall of the refrigerating part, and the first flange part is sleeved with the heat insulation layer.
2. The multi-section serial semiconductor refrigeration device according to claim 1, wherein: two ends of the shell body are provided with second flange parts, and the second flange parts of the adjacent 2-section shell body are connected with the first flange parts.
3. The multi-section serial semiconductor refrigeration device according to claim 1, wherein: the diameter of the refrigerating part is equal to the diameter of the inner cavity of the shell body.
4. The multi-section serial semiconductor refrigeration device according to claim 1, wherein: the other end of the air inlet pipe and the other end of the air outlet pipe are both provided with a third flange part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259892.0A CN106949663B (en) | 2017-04-20 | 2017-04-20 | Multi-section serial semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259892.0A CN106949663B (en) | 2017-04-20 | 2017-04-20 | Multi-section serial semiconductor refrigerating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106949663A CN106949663A (en) | 2017-07-14 |
| CN106949663B true CN106949663B (en) | 2023-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710259892.0A Active CN106949663B (en) | 2017-04-20 | 2017-04-20 | Multi-section serial semiconductor refrigerating device |
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| Country | Link |
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| CN (1) | CN106949663B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118299977B (en) * | 2024-06-06 | 2024-08-16 | 山东晨宇电气股份有限公司 | Automatic energy storage preassembled box-type transformer substation |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10185390A (en) * | 1996-11-08 | 1998-07-14 | Matsushita Refrig Co Ltd | Heat exchanging unit having built-in thermoelectric module and refrigerator employing heat exchanging unit |
| CN105299950A (en) * | 2015-11-12 | 2016-02-03 | 华南理工大学 | Solar semiconductor refrigerating system |
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
| CN206831861U (en) * | 2017-04-20 | 2018-01-02 | 华南理工大学 | A kind of multi-section serial formula semiconductor cooling device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7059137B2 (en) * | 2004-09-07 | 2006-06-13 | Childress William H | Portable thermoelectric cooling and heating device |
-
2017
- 2017-04-20 CN CN201710259892.0A patent/CN106949663B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10185390A (en) * | 1996-11-08 | 1998-07-14 | Matsushita Refrig Co Ltd | Heat exchanging unit having built-in thermoelectric module and refrigerator employing heat exchanging unit |
| CN105299950A (en) * | 2015-11-12 | 2016-02-03 | 华南理工大学 | Solar semiconductor refrigerating system |
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
| CN206831861U (en) * | 2017-04-20 | 2018-01-02 | 华南理工大学 | A kind of multi-section serial formula semiconductor cooling device |
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| Publication number | Publication date |
|---|---|
| CN106949663A (en) | 2017-07-14 |
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