CN106937480A - Veneer and forming method based on ladder golden finger - Google Patents
Veneer and forming method based on ladder golden finger Download PDFInfo
- Publication number
- CN106937480A CN106937480A CN201710125347.2A CN201710125347A CN106937480A CN 106937480 A CN106937480 A CN 106937480A CN 201710125347 A CN201710125347 A CN 201710125347A CN 106937480 A CN106937480 A CN 106937480A
- Authority
- CN
- China
- Prior art keywords
- substrate
- golden finger
- veneer
- ground plane
- ladder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The present invention relates to circuit board technology field, particularly a kind of veneer and forming method based on ladder golden finger, the method that complicated plug-in card veneer is designed using ladder golden finger, solve contradictory problems of the product function with electronic product standard interface, by second pressing, press part containing golden finger respectively for the first time and without golden finger part, then two parts are pressed again, cross section can be presented stairstepping at golden finger, the plug-in card needs of standard golden finger can be met, compact in design can be met again, veneer function is more, need to be needed compared with the design of multi-laminate, make system design more flexible.The present invention provides a kind of veneer based on ladder golden finger, including first substrate, second substrate and golden finger, the golden finger is arranged on the side of first substrate, and second substrate is fixed at first substrate upper surface, and the first substrate and second substrate include the wiring layer of multiple stackings.
Description
Technical field
The present invention relates to circuit board technology field, particularly a kind of veneer and forming method based on ladder golden finger.
Background technology
At present, the printed circuit board (PCB) with golden finger（PCB）Plate, generally uses in its structure design and is related to golden finger online
Mode within the shaping area of road plate top layer.And the golden finger for plugging function is provided, should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment
Do whole conversion, very waste of resource and cost；Golden finger circuit board is fixed due to thickness, it is impossible to be applied to various sizes of
Connecting-disconnecting interface, causes the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to which design is multiple
The golden finger circuit board of correspondence thickness, can influence the assembly space of product, and cause the wasting of resources and cost.
With the arrival of cloud era, to the calculating speed of server, stability, autgmentability, compliance more and more higher.
But energy-conservation of trying one's best again, design space is limited, it is necessary to function is more and more, is related to placement-and-routing space with properties of product
Contradiction.With device, function increases, and product specification limitation, how in design size, function, radiating, aspect of performance
It is the problem that server industries are studied always to obtain balance.Particularly with the plug-in card pcb board with standard PCIE gold hands, industry mark
Quasi- thickness of slab is the error rate of 1.6MM+-8%, how to realize the requirement in function and design limitation.
It is more complicated for function, the veneer using the design of standard PCIE plug-in cards is needed again, thickness of slab is mutual with veneer function
The relation of restriction, if necessary to more stackings, inevitable thickness of slab increases complicated function, it is impossible to ensure the 1.6MM thicknesss of slab of golden finger
It is required that.
The content of the invention
In consideration of it, the present invention provides a kind of veneer and forming method based on ladder golden finger, set using ladder golden finger
The method of the complicated plug-in card veneer of meter, solves contradictory problems of the product function with electronic product standard interface, by second pressing, the
Part containing golden finger is once pressed respectively and without golden finger part, then pressed two parts again, at golden finger
Cross section can be presented stairstepping, can meet the plug-in card needs of standard golden finger, and compact in design, veneer function can be met again
More, it is necessary to be needed compared with the design of multi-laminate, make system design more flexible.
In order to achieve the above object, the present invention is achieved by the following technical solutions：
The present invention provides a kind of veneer based on ladder golden finger, including first substrate, second substrate and golden finger, the golden hand
Finger is arranged on the side of first substrate, and second substrate is fixed at first substrate upper surface, the first substrate and second substrate
Include the wiring layer of multiple stackings.
Further, the golden finger thickness is equal with first substrate thickness.
Further, the golden finger is standard PCIE plug-in cards.
Further, the first substrate includes 8 stacking wiring layers, respectively 4 signals layers and 4 ground planes, letter
Number floor and the stacking of ground plane interval.
Further, the second substrate include 10 stacking wiring layers, respectively 4 signals layers, 4 ground planes and
2 bus planes, 2 bus planes are disposed adjacent, and ground plane is provided between signals layer, between signals layer and two bus planes.
Further, the thickness of the first substrate and golden finger is 1.6mm ± 8%.
Further, the first substrate is connected with second substrate by pressing, and integral thickness is 2.5mm after pressing.
The present invention also provides a kind of forming method of the veneer based on ladder golden finger, including：By signals layer and ground plane
Interval pressing is first substrate, and first substrate side is provided with golden finger；It is the second base by the pressing of bus plane, signals layer and ground plane
Plate, signals layer and ground plane interval setting；First substrate is pressed with second substrate.
Further, it is first substrate by signals layer and the pressing of ground plane interval, specifically includes：By 4 signals layers and 4
The pressing of ground plane interval is first substrate, wherein most last layer is ground plane.
Further, it is second substrate by the pressing of bus plane, signals layer and ground plane, specifically includes：By 4 signals layers, 4
Individual ground plane and 2 bus plane pressings are second substrate, wherein, the wiring layer of second substrate is followed successively by from top to bottom：Signals layer,
Ground plane, signals layer, ground plane, signals layer, ground plane, signals layer, ground plane, bus plane, bus plane.
The present invention provides a kind of veneer based on ladder golden finger, has the advantages that：
Restricting relation between function that the present invention is related to when design with regard to server system and standard interface, proposition one kind is based on
The veneer of ladder golden finger, complicated plug-in card veneer is designed using ladder golden finger, is solved product function and is connect with electronic product standard
The contradictory problems of mouth, make product design more flexible, are integrally laminated for SGSGSGSGPPGSGSGSGS, wherein S representation signals layer,
G represents ground plane, and P represents bus plane, carries out second pressing, presses part containing golden finger respectively for the first time, thickness for 1.6MM ±
8%, i.e. 8 layers of SGSGSGSG and without golden finger part above, i.e., following 10 layers of PPGSGSGSGS afterwards again enters two parts
Row is pressed again, and cross section can be presented stairstepping at golden finger, can meet the plug-in card needs of standard golden finger, and can meet
Compact in design, veneer function is more, it is necessary to be needed compared with the design of multi-laminate；Meanwhile, the production technology of the veneer of this structure, commonly
Plate factory can realize, more practical.
The beneficial effect of the forming method of the veneer based on ladder golden finger is similar with the veneer based on ladder golden finger, no
Repeat again.
Brief description of the drawings
Fig. 1 is the veneer overall structure diagram based on ladder golden finger；
Fig. 2 is the veneer cross-sectional profile schematic diagram based on ladder golden finger；
Fig. 3 is close-up schematic view at A in Fig. 2；
Fig. 4 is the schematic flow sheet of the forming method of the veneer based on ladder golden finger provided by the present invention.
Specific embodiment
In order to make it easy to understand, the part noun to occurring in the present invention makees explanation explained below：
Golden finger is a kind of standard card interface, all data flows of internal memory processing unit, electron stream be exactly based on golden finger with
The contact of memory bank is swapped with PC systems, is the I/O mouthful of internal memory, therefore its manufacture craft is for internal memory company
Connect and seem quite important.
PCIE and SAS are a kind of high-speed serial bus, and most of external interfaces support this bus protocol.
PCH is Platform Controller Hub, similar to the south bridge function in computer framework.
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Described in detail on exemplary embodiment of the invention according to following accompanying drawing.
Implication in figure representated by sequence number is：1- first substrates, 2- second substrates, 3- golden fingers, 4- first substrates ground connection
Layer, 5- first substrate signals layers, 6- bus planes, 7- second substrate ground planes, 8- second substrate signals layers, H1- golden finger thickness,
H2- second substrate thickness.
Exemplary embodiment of the invention is illustrated below in conjunction with concrete condition：
As shown in Figure 1 and Figure 2, the present invention provides a kind of veneer based on ladder golden finger, including first substrate 1, second substrate 2
With golden finger 3, the golden finger 3 is arranged on the side of first substrate 1, and second substrate 2 is fixed at the upper surface of first substrate 1,
The first substrate 1 and second substrate 2 include the wiring layer of multiple stackings.The thickness of the golden finger 3 and the thickness of first substrate 1
It is equal.
Used as a kind of implementation method, the golden finger 3 is standard PCIE plug-in cards.
Further, the first substrate 1 includes 8 stacking wiring layers, respectively 4 signals layers and 4 ground planes, letter
Number floor and the stacking of ground plane interval.
Further, the second substrate 2 includes 10 wiring layers of stacking, respectively 4 signals layers, 4 ground planes
With 2 bus planes, 2 bus planes are disposed adjacent, and ground connection is provided between signals layer, between signals layer and two bus planes
Layer.
Further, the thickness of the first substrate 1 and golden finger 3 is 1.6mm ± 8%.
Further, the first substrate 1 is connected with second substrate 2 by pressing, and integral thickness is 2.5mm after pressing.
Used as a kind of embodiments possible, golden finger thickness H1 can choose different thickness according to the interface standard of required adaptation
Metric lattice, while second substrate thickness H2 can also choose different thickness specifications according to the interface standard of required adaptation, and
Do not enumerating, best embodiment of the present invention illustrated below.
As shown in Figure 1, Figure 2 and Figure 3, in a preferred embodiment of the invention, first substrate 1 includes 8 stacking wiring layers,
Respectively 4 first substrate signals layers 5 and 4 first substrate ground planes 4, first substrate signals layer 5 and first substrate ground plane 4
Interval stacking, specific arrangement mode is followed successively by from top to bottom：First substrate ground plane 4- first substrate signals layer the first bases of 5-
Plate earthing layer 4- first substrate signals layer 5- first substrate ground plane 4- first substrate signals layer 5- first substrate ground planes 4- the
One substrate signal layer 5.
Second substrate includes 10 wiring layers of stacking, respectively 4 second substrate signals layers, 4 second substrate ground connection
Layer and 2 bus planes, 2 bus planes are adjacent, between second substrate signals layer and second substrate signals layer and two bus planes
Between be provided with second substrate ground plane.Specific arrangement mode is followed successively by from top to bottom：Second substrate signals layer 8- second
Substrate ground layer 7- second substrate signals layer 8- second substrate ground plane 7- second substrate signals layer 8- second substrate ground planes 7-
Second substrate signals layer 8- second substrate ground plane 7- bus plane 6- bus planes 6.
First substrate 1 and second substrate 2 are carried out into pressing connection, during pressing, the first substrate of most going up of first substrate 1 is connect
Stratum 4 contacts pressing with the bus plane 6 that most descends of second substrate.
The thickness of first substrate 1 and golden finger 3 is 1.6mm ± 8%.First substrate 1 is connected with second substrate 2 by pressing,
Integral thickness is 2.5mm after pressing.
In the preferred embodiment, there is veneer PCIE to turn the RAID functions of SAS, and processor is interacted with PCH chips
South bridge function.Golden finger is designed using the PCIE plug-in cards of standard.Realize two functions according to plate face size：Need in 6
Layer cabling, total number of plies is 18 layers, and gross thickness is 2.5MM；The PCIE plug-in cards of design standard are needed, this thickness of slab is 1.6MM+-8%, if
Golden finger stage by stage is calculated as, veneer external interface part is 1.6MM, and other main parts are 2.5MM.As shown in Fig. 2 being ladder
Golden finger veneer cross-sectional view, is golden finger plug-in card position thickness at H1, and H2 is main body thickness of slab, herein H1=1.6MM+-
8%, H2=2.5MM.Need sweetly disposition to be laminated in single board design, in the preferred embodiment, be integrally laminated for
SGSGSGSGPPGSGSGSGS, wherein S representation signals layer, G represents stratum, and P represents bus plane, does second pressing, divides for the first time
Not Ya He part containing golden finger, thickness is 1.6MM+-8%, production 8 layers of SGSGSGSG and without golden finger part above, below 10
Layer PPGSGSGSGS.Two parts are pressed again again afterwards, cross section can be presented stairstepping, such as Fig. 2 at golden finger
It is shown.The benefit of this kind of design is the plug-in card needs that can meet standard golden finger, and compact in design, veneer function can be met again
More, it is necessary to be needed compared with the design of multi-laminate.Make system design more flexible.
The present invention also provides a kind of forming method of the veneer based on ladder golden finger, as shown in figure 4, including following step
Suddenly：
Step S401, by signals layer and ground plane interval pressing be first substrate, first substrate side is provided with golden finger.
Step S402, by bus plane, signals layer and ground plane pressing be second substrate, signals layer and ground plane interval set
Put.
Step S403, first substrate and second substrate are pressed.
According to the veneer based on ladder golden finger that optimum embodiment of the present invention is proposed, can also provide a kind of based on ladder
The forming method of the veneer of golden finger, comprises the following steps：
1. it is first substrate by signals layer and the pressing of ground plane interval, specifically includes：By 4 signals layers and 4 ground plane intervals
It is first substrate to press, wherein most last layer is ground plane.
2. it is second substrate by the pressing of bus plane, signals layer and ground plane, specifically includes：By 4 signals layers, 4 ground connection
Layer and 2 bus plane pressings are second substrate, wherein, the wiring layer of second substrate is followed successively by from top to bottom：Signals layer, ground connection
Layer, signals layer, ground plane, signals layer, ground plane, signals layer, ground plane, bus plane, bus plane.
3. first substrate is pressed with second substrate, wherein by the most last layer ground plane of first substrate and second
The basecoat bus plane contact pressing of substrate.
Finally, in addition it is also necessary to explanation, herein, such as first and second or the like relational terms be used merely to by
One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation
Between there is any this actual relation or order.And, term " including ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, article or equipment including a series of key elements not only include that
A little key elements, but also other key elements including being not expressly set out, or also include for this process, method, article or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", does not arrange
Except also there is other identical element in the process including the key element, method, article or equipment.
A kind of highly dense server hard disk back plane provided by the present invention is described in detail above, it is used herein
Specific case is set forth to principle of the invention and implementation method, and the explanation of above example is only intended to help and understands this
The method and its core concept of invention；Simultaneously for those of ordinary skill in the art, according to thought of the invention, specific
Be will change in implementation method and range of application, in sum, this specification content should not be construed as to of the invention
Limitation.
Claims (10)
1. a kind of veneer based on ladder golden finger, it is characterised in that described including first substrate, second substrate and golden finger
Golden finger is arranged on the side of first substrate, and second substrate is fixed at first substrate upper surface, the first substrate and second
Substrate includes the wiring layer of multiple stackings.
2. the veneer based on ladder golden finger according to claim 1, it is characterised in that the golden finger thickness and first
Substrate thickness is equal.
3. the veneer based on ladder golden finger according to claim 1, it is characterised in that the golden finger is standard PCIE
Plug-in card.
4. the veneer based on ladder golden finger according to claim 1, it is characterised in that the first substrate includes 8
Stacking wiring layer, respectively 4 signals layers and 4 ground planes, signals layer and the stacking of ground plane interval.
5. the veneer based on ladder golden finger according to claim 1, it is characterised in that the second substrate includes 10
The wiring layer of stacking, respectively 4 signals layers, 4 ground planes and 2 bus planes, 2 bus planes are disposed adjacent, signals layer it
Between, between signals layer and two bus planes be provided with ground plane.
6. the veneer based on ladder golden finger according to claim 1, it is characterised in that the first substrate and golden finger
Thickness be 1.6mm ± 8%.
7. the veneer based on ladder golden finger according to claim 1, it is characterised in that the first substrate and the second base
Plate is connected by pressing, and integral thickness is 2.5mm after pressing.
8. a kind of forming method of the veneer based on ladder golden finger, it is characterised in that including：By signals layer and ground connection interlayer
It is first substrate every pressing, first substrate side is provided with golden finger；It is the second base by the pressing of bus plane, signals layer and ground plane
Plate, signals layer and ground plane interval setting；First substrate is pressed with second substrate.
9. the forming method of the veneer based on ladder golden finger according to claim 8, it is characterised in that by signals layer and
The pressing of ground plane interval is first substrate, is specifically included：It is first substrate by 4 signals layers and 4 ground plane interval pressings, its
In most last layer be ground plane.
10. the forming method of the veneer based on ladder golden finger according to claim 8, it is characterised in that by bus plane,
Signals layer and ground plane pressing are second substrate, are specifically included：It is by 4 signals layers, 4 ground planes and 2 bus plane pressings
Second substrate, wherein, the wiring layer of second substrate is followed successively by from top to bottom：Signals layer, ground plane, signals layer, ground plane, signal
Layer, ground plane, signals layer, ground plane, bus plane, bus plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710125347.2A CN106937480A (en) | 2017-03-04 | 2017-03-04 | Veneer and forming method based on ladder golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710125347.2A CN106937480A (en) | 2017-03-04 | 2017-03-04 | Veneer and forming method based on ladder golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106937480A true CN106937480A (en) | 2017-07-07 |
Family
ID=59423303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201710125347.2A Pending CN106937480A (en) | 2017-03-04 | 2017-03-04 | Veneer and forming method based on ladder golden finger |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3599799A1 (en) * | 2018-07-23 | 2020-01-29 | Quanta Computer Inc. | Ladder type pcb for high layer count golden finger card design |
| CN111586969A (en) * | 2020-04-28 | 2020-08-25 | 中国科学院计算技术研究所 | Circuit wiring method, DDR4 internal memory circuit and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203072250U (en) * | 2012-12-20 | 2013-07-17 | 奥特斯(中国)有限公司 | Semi-finished product for production of printed circuit board and printed circuit board |
| CN203596032U (en) * | 2013-11-21 | 2014-05-14 | 蒋石正 | Stepped Active SIM full-featured card |
| CN105578741A (en) * | 2014-10-15 | 2016-05-11 | 北大方正集团有限公司 | Metal-finger plugging board and manufacturing method thereof |
| CN105764269A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
-
2017
- 2017-03-04 CN CN201710125347.2A patent/CN106937480A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203072250U (en) * | 2012-12-20 | 2013-07-17 | 奥特斯(中国)有限公司 | Semi-finished product for production of printed circuit board and printed circuit board |
| CN203596032U (en) * | 2013-11-21 | 2014-05-14 | 蒋石正 | Stepped Active SIM full-featured card |
| CN105578741A (en) * | 2014-10-15 | 2016-05-11 | 北大方正集团有限公司 | Metal-finger plugging board and manufacturing method thereof |
| CN105764269A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3599799A1 (en) * | 2018-07-23 | 2020-01-29 | Quanta Computer Inc. | Ladder type pcb for high layer count golden finger card design |
| CN110753444A (en) * | 2018-07-23 | 2020-02-04 | 广达电脑股份有限公司 | Golden finger card and combination of golden finger card and connector |
| CN111586969A (en) * | 2020-04-28 | 2020-08-25 | 中国科学院计算技术研究所 | Circuit wiring method, DDR4 internal memory circuit and electronic equipment |
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Application publication date: 20170707 |
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