CN106933071A - Focusing leveling device and method - Google Patents
Focusing leveling device and method Download PDFInfo
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- CN106933071A CN106933071A CN201511025469.1A CN201511025469A CN106933071A CN 106933071 A CN106933071 A CN 106933071A CN 201511025469 A CN201511025469 A CN 201511025469A CN 106933071 A CN106933071 A CN 106933071A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
Abstract
The invention discloses a kind of focusing leveling device and method, the device includes：Including the first lighting unit, projecting light path, imaging optical path, detector and control end, first lighting unit provides measuring beam, measured workpiece surface is incident to after the projecting light path, outgoing is to the imaging optical path after being reflected through the measured workpiece surface, enter the detector image-forming afterwards, after the control end obtains the defocusing amount on the measured workpiece surface according to image-forming information, and control work stage to move, by the measured workpiece surface modulation to the optimum exposure face in error allowed band；The first spatial light modulator is provided between first lighting unit and projecting light path, first spatial light modulator is provided with multiple thang-kng slits, and the measuring beam forms multiple measurement hot spots after first spatial light modulator.The present invention can effectively improve the Technological adaptability and certainty of measurement of focusing leveling device, improve finished product yield.
Description
Technical field
The present invention relates to projection lithography field, more particularly to a kind of focusing leveling device and method.
Background technology
Projection mask aligner or projection lithography apparatus, are that the pattern on mask is projected into work by projection objective
The device on part surface.In projection lithography apparatus, it is necessary to there is device for automatically focusing and leveling to guide work stage by work
Part surface is moved precisely to the exposure position specified.The automatic focusing leveling control of device for automatically focusing and leveling
Function has various different technical schemes, and more common at present is non-contact type photoelectricity e measurement technology.
Photodetection scheme based on imageing sensor is a kind of contactless optical Electric Measurement Technology of comparative maturity
Scheme, according to position of the mark spot projection on tested object plane with its reflected after into detector (CCD
Etc. photo-electric detector) on picture position corresponding relation, calculate the defocusing amount of tested object plane.Due to workpiece
Surface reflectivity is inconsistent and technique sex differernce, such as groove, local large deformation in workpiece, hot spot exist
The upper imagings of CCD can produce distortion, or even be fallen into oblivion by noise completely.
Many companies or mechanism are to solve above-mentioned technological problemses to propose many solutions and method, beautiful
State discloses a kind of prescan scheme, specially：The hot spot for first calculating multiple measurement points in exposure area is surveyed
The fit Plane of value, then the difference of each hot spot and the fit Plane is calculated, after carrying out certain choice,
The correcting value of each facula measurement value when part is as formal exposure, so as to improve survey to a certain extent
Accuracy of measurement, but lack the processing method when partially or completely hot spot is invalid for some exposure areas or presence
The defect such as cannot measure when preset value is difficult to set and hot spot gives up excessive.
Fig. 1 is the structural representation for being typically based on image processing techniques focusing leveling device, when measured workpiece 1
Upper surface location and projection objective 2 optimal focal plane position (the upper horizontal dotted line of measured workpiece 1 in figure
It is shown) overlap when, the reflection light path of measured workpiece 1 as shown in phantom in Figure 1, through projection slit 3
Angles Projections of the hot spot with incidence angle as θ to the surface of measured workpiece 1, after being reflected by the surface of measured workpiece 1
It is imaged on photodetector 4 after the imaged light path of hot spot.Upper surface location and projection when measured workpiece 1
The height tolerance of the optimal focal plane position of object lens 2 be Δ z when, through projection slit 3 hot spot in photodetection
Imaging is in the position knots modification Δ y of Z-direction on device 4：
Δ y=2 β Δ zsin θ (1-1)
In formula (1-1), β is the magnifying power of imaging optical path, and θ is to be arrived through the spot projection of projection slit 3
Incidence angle on measured workpiece 1.
It is anti-based on change in location of the image processing techniques focusing leveling device according to hot spot on photodetector 4
Calculation draws the defocusing amount on the surface of measured workpiece 1, typically uses many facula measurement schemes to increase unit tested surface
Product, raising certainty of measurement and efficiency.Below with some hot spot in many facula measurement schemes and by the hot spot
Split into as a example by 3 sub- hot spots of asymmetric geometry, narration is based on image processing techniques focusing leveling device
Measurement process.
Fig. 2 a are the slit distribution schematic diagrams in projection slit 3, through the quilt that the spot projection of projection slit is arrived
Survey face is measured workpiece surface, when the manufacturability of tested surface is good and in zero-bit (the i.e. survey of sensor
Amount zero-bit, is also the optimum exposure face of projection objective), dotted line (outgoing) as shown in figure 2b, then warp
The light path imaging of end of probe on photodetector, the signal that the dotted line in its corresponding signal such as Fig. 2 c is represented；
When tested surface has the defocus of Δ z, solid line (outgoing) as shown in figure 2b, then correspondence is in photoelectricity
The signal represented by solid line on detector, then the position of the picture point that three sub- hot spots are imaged in photodetector
Put variable quantity respectively Δ y1, Δ y2, Δ y3, then the defocusing amount of the hot spot of correspondence tested surface is respectively Δ
z1、Δz2、Δz3.If tested surface only has defocus phenomenon, then obtain defocusing amount Δ z according to formula (1-1)
For：
If tested surface has inclination, then can according to three defocusing amount Δ z1 of sub- hot spot, Δ z2, Δ z3 and
Distance computation between corresponding points goes out tilt quantity Rx, Ry of the tested surface at this, obtain defocusing amount Δ z, Rx,
After Ry, signal is fed back to work stage by the control end of focusing and leveling sensor, is then adjusted by work stage
To the optimum exposure face in error allowed band, to ensure the exposure quality of projection objective.
But, when technique groove intensive ditch slotted vane is run into, as shown in Fig. 3 a~3d.It is incumbent when going out
Meaning 2 or 3 sub- spot projections to tested surface be Fig. 3 a or Fig. 3 any one situation of c when,
The signal for so detecting will be the signal shape of Fig. 3 b or Fig. 3 d, in obtaining the hot spot of photodetector
There is deviation with the practical center position of hot spot in heart positional information, and the vertical position information of the tested surface for measuring is not
It is the actual height of tested surface.When such case is run into, discard portion facula information is either taken
Fit Plane method is still all invalid using the true object plane of least square fitting curve simulation, because measuring
Positional information be not inconsistent with actual information inherently, be invalid signals.Under such operating mode, thrown using skew
The method of shadow facula position can also lose effect, because either along measurement direction positive offset or negative offset,
During spot projection can be because there is partial information to fall into groove to the situation that Fig. 3 a or Fig. 3 c can be run into after tested surface, all
And fail.
The content of the invention
The present invention provides a kind of focusing leveling device and method, close in the appearance of measured workpiece local surfaces to solve
The technique groove of collection, causes the data for measuring to reflect or can not truly reflect tested region elevation carrection
The problem of value.
In order to solve the above technical problems, a kind of focusing leveling device of present invention offer, including the first lighting unit,
Projecting light path, imaging optical path, detector and control end, first lighting unit provide measuring beam, warp
The measured workpiece surface is incident to after the projecting light path, through the measured workpiece surface reflect after outgoing extremely
The imaging optical path, afterwards into the detector image-forming, the control end is according to image-forming information is obtained
After the defocusing amount on measured workpiece surface, and the work stage is controlled to move, by the measured workpiece surface modulation
To the optimum exposure face in error allowed band；First is provided between first lighting unit and projecting light path
Spatial light modulator, first spatial light modulator is provided with multiple thang-kng slits, the measuring beam warp
Multiple measurement hot spots are formed after first spatial light modulator, first spatial light modulator can be according to institute
The groove structure feature and positional information for stating measured workpiece surface set thang-kng slit, and then modulate the measurement
The size of hot spot and position so that image-forming information of the measured workpiece surface on the detector is complete.
Preferably, first spatial light modulator is provided with multigroup measurement markers, every group of measurement markers by
Multiple thang-kng slit compositions, first lighting unit includes multigroup light fixture, light fixture described in every group
Measurement markers described in one group of correspondence.
Preferably, described device also includes reference path, the reference path includes second space light modulation
Device and the second lighting unit, the second space optical modulator are provided with one-to-one with the measurement markers
Reference marker, reference marker described in every group is made up of multiple thang-kng slits, the center of reference marker described in every group
Center with the measurement markers of same position is consistent, and second lighting unit includes multigroup illumination
Component, reference marker described in one group of light fixture correspondence described in every group, the light fixture provides illuminating bundle,
It is imaged on the detector through after the corresponding reference marker.
Preferably, described device also includes that relaying amplifies light path, by the hot spot after the imaging optical path and
Through the hot spot after the reference marker by it is described relaying amplify light path after shine on the detector into
Picture.
Preferably, reference marker described in every group is provided with multiple thang-kngs for surrounding the corresponding measurement markers
Slit.
Preferably, the thang-kng slit is raster mode.
Preferably, the detector is CCD or linear array CCD.
Preferably, the projecting light path includes group, steering assembly and group after projection before projection.
Preferably, the imaging optical path includes group, end of probe diaphragm, the before the first reflection subassembly, detection
Group after two reflection subassemblies and detection.
Preferably, the projecting light path includes group, projection end light before multigroup projection end reflection subassembly, projection
Group after door screen and projection, measurement markers described in one group of projection end reflection subassembly correspondence described in every group, will transmit through described
The measurement hot spot of measurement markers is reflexed to before the projection in group.
Preferably, the imaging optical path includes group and multigroup spy after the preceding group of detection, end of probe diaphragm, detection
End reflection subassembly is surveyed, measurement markers are through the imaging described in one group of end of probe reflection subassembly correspondence described in every group
The hot spot of road outgoing, and reflect it on the detector.
The present invention also provides a kind of focusing and leveling method, using described focusing leveling device, for workpiece
Tilt quantity and defocus measurement are carried out, including：
Step 1, the illuminating bundle incide described through the thang-kng slit in first spatial light modulator
Measured workpiece surface is simultaneously reflected, and reflected light is imaged on the detector；
Step 2, the control end judge whether the image-forming information on the detector is complete, is performed if complete
Step 4, performs step 3 if imperfect；
The groove structure feature and position of step 3, first spatial light modulator according to the measured workpiece surface
Confidence ceases, and adjusts thang-kng slit, return to step 1；
Step 4, the control end calculate the defocusing amount on the measured workpiece surface according to the image-forming information, and
The work stage is controlled to move, by the measured workpiece surface modulation to the optimum exposure in error allowed band
Face.
If preferably, the step 2 specifically, in the image-forming information each facula information centre bit
Put inconsistent with practical center position, then the image-forming information on detector is imperfect, i.e., described measured workpiece table
Face defocus, performs step 3.
Preferably, the step 3 is specifically, first spatial light modulator obtains the measured workpiece
Whether the groove structure feature and positional information on surface, judge stored in first spatial light modulator right
The thang-kng slit distributed data answered, calls the thang-kng slit distributed data to adjust the thang-kng slit if having,
Return to step 1 afterwards；Thang-kng slit is adjusted if the information without if according to acquisition and preserved, afterwards return to step
1。
Preferably, the thang-kng slit uses raster mode.
Compared with prior art, the present invention has advantages below：
1st, reducing the size on facula measurement direction can make focusing leveling device adapt to the intensive tested work of groove
Part, improves the Technological adaptability of focusing leveling device；
2nd, the mode of projection spot size and layout is changed in the present invention using SLM, because it is directly in SLM
PC control ends by what is be directly realized by after software modification, do not have regulation mechanical component realize realization
Journey, will not bring the influence in structure to total, be conducive to improving the stability of sensing system structure；
3rd, the present invention can reduce the spot size in measurement direction, moreover it is possible to reduce because tested surface reflectivity is uneven
The influence uneven to spot energy distribution, improves the signal to noise ratio of signal, is conducive to improving certainty of measurement；
4th, the present invention can reduce the size on facula measurement direction, while the non-measured direction of hot spot can be increased
On size, can improve utilization ratio of optical energy, improve the signal to noise ratio of detector detectable signal, be conducive to carrying
High measurement accuracy.
5th, there is intensive technique groove in measured workpiece local surfaces, cause the number that focusing leveling device is measured
During according to that can not reflect or can not truly reflect tested region height measurements, utilization space optical modulator changes
The region of technogenic influence is directly avoided or be not coated with to the size of hot spot so that hot spot is not by technogenic influence
So as to extrapolate tested region height measurements；Or change the illumination or survey projected on measured workpiece surface
Spacing or facula position between amount hot spot, searching completely or partly can measure tested region elevation carrection
The alternative site of value.The present invention can effectively improve the Technological adaptability and certainty of measurement of focusing leveling device, carry
Finished product yield high.
Brief description of the drawings
Fig. 1 is the existing structural representation based on image processing techniques focusing and leveling sensor device；
Fig. 2 a~Fig. 2 c are the existing realization principle schematic diagram based on image processing techniques focusing and leveling sensor；
Fig. 3 a~Fig. 3 d are the schematic diagram of pre-resolved technological problemses；
Fig. 4 is the structural representation of focusing leveling device in the embodiment of the present invention 1；
Fig. 5 is the structural representation of the spatial light modulator of the embodiment of the present invention 1；
Fig. 6 a~6c is spatial light modulator after the size and layout that change thang-kng slit in the embodiment of the present invention 1
Structural representation；
Fig. 7 is light path of the hot spot on measured workpiece after the size for changing thang-kng slit in the embodiment of the present invention 1
Move towards schematic diagram；
The signal that Fig. 8 a~8c is detected for detector after the size for changing thang-kng slit in the embodiment of the present invention 1
Situation of change schematic diagram；
Fig. 9 is focusing and leveling method flow schematic diagram in the embodiment of the present invention 1；
Figure 10 is single thang-kng slit to be transform the spatial light modulator of grating mode as in the embodiment of the present invention 2
Schematic diagram；
Figure 11 is the A portions enlarged drawing of Figure 10；
Figure 12 is the schematic diagram of the spatial light modulator after increase thang-kng slot number in the embodiment of the present invention 2；
Figure 13 is the light path schematic diagram of focusing leveling device in the embodiment of the present invention 3；
Figure 14 a~14c is the schematic layout pattern of measurement markers and reference marker in the embodiment of the present invention 3.
Specific embodiment
It is right below in conjunction with the accompanying drawings to enable the above objects, features and advantages of the present invention more obvious understandable
Specific embodiment of the invention is described in detail.It should be noted that, accompanying drawing of the present invention is using simplification
Form and use non-accurately ratio, be only used to conveniently, lucidly aid in illustrating the embodiment of the present invention mesh
's.
Embodiment 1
The focusing leveling device (FLS) of the present embodiment is as shown in figure 4, it is specifically included：Lighting unit, throwing
Shadow light path, imaging optical path, detector 116 and control end, the lighting unit provide measuring beam, warp
The surface of measured workpiece 103 is incident to after the projecting light path, is gone out after being reflected through the surface of the measured workpiece 103
The imaging optical path is incident upon, is imaged into the detector 116 afterwards, the control end is according to image-forming information
After obtaining the defocusing amount on the surface of the measured workpiece 103, and work stage 104 is controlled to move, will be described tested
The surface modulation of workpiece 103 is to the optimum exposure face in error allowed band；The lighting unit and projecting light path
Between be provided with spatial light modulator 107, the spatial light modulator 107 is provided with multiple thang-kng slits 1071,
The measuring beam forms multiple measurement hot spots, the space light modulation after the spatial light modulator 107
Device 107 can set thang-kng slit according to the groove structure feature on the surface of the measured workpiece 103 and positional information
1071, and then modulate size and the position of the measurement hot spot so that the surface of the measured workpiece 103 is in institute
The image-forming information stated on detector 116 is complete.
Further, the spatial light modulator 107 is provided with multigroup measurement markers, every group of measurement markers by
Multiple thang-kng slits 1071 are constituted, and the lighting unit includes multigroup light fixture, light fixture described in every group
Measurement markers described in one group of correspondence.
Specifically, the light fixture is used to provide illuminating bundle, including light source 105 and collimation camera lens 106.
The light source 105 uses visible light illuminator part, including white light LEDs, Halogen lamp LED, xenon lamp etc..
The projecting light path includes：Projection before group 108, steering assembly 109 and projection after organize 110, for will
The illuminating bundle projects the surface of measured workpiece 103 of the work stage 104 of exposure system.
The imaging optical path include multigroup projection end reflection subassembly 111, projection before group 112, projection end diaphragm 113,
115 are organized after reflection subassembly 114 and projection, is projected described in every group and is measured described in one group of the correspondence of end reflection subassembly 111
Mark, the measurement hot spot that will transmit through the measurement markers is reflexed to before the projection in group 112.
Through the spatial light modulator 107 after the collimated collimation of camera lens 106 of light beam that the light source 105 sends
Multiple measurement hot spots are formed afterwards, and the measurement hot spot projects to measured workpiece through the projecting light path with incidence angle θ
103 surfaces, reflected light is collected through the imaging optical path and is imaged onto on the detector 116.
Further, the spatial light modulator 107 uses iris diaphgram or moving machinery diaphragm.Such as Fig. 5
Shown, the iris diaphgram includes the display screen S1 on support H1 and support H1, certainly, display screen S1
On be provided with the thang-kng slit 1071.Further, the spatial light modulator 1071 is by control end control,
I.e. the position of thang-kng slit 1071 and clear aperture can be modified by the drive software of control end.
Specifically, when the operational characteristic of measured workpiece 103 relatively good (surface is flat without groove),
The thang-kng slit 1071 and fixed slit of the prior art in spatial light modulator 107 are used in the present embodiment
Effect it is identical.But when the measured workpiece 103 of intensive trench process is measured, can be by reducing spatial light
Clear aperture of the thang-kng slit 1071 in measurement direction on modulator 107, as shown in FIG. 6 a size change
The size shown in Fig. 6 b, but the center spacing of thang-kng slit 1071 is constant；If necessary, chi is being changed
The center spacing of thang-kng slit 1071 can also suitably be adjusted while very little according to actual conditions as fig. 6 c,
To adapt to different process requirements.By the hot spot of thang-kng slit 1071 measured workpiece 103 projection form
As shown in fig. 7, the signal curve of the correspondence imaging on detector 116 is as shown in Fig. 8 b and 8c, 8a's
Signal curve is the corresponding signal curve of thang-kng slit 1071 shown in Fig. 6 a.
As shown in figure 9, the present invention also provides a kind of focusing and leveling method, following steps are specifically included：
Step 1, the illuminating bundle incide described through the thang-kng slit in the spatial light modulator 107
Measured workpiece surface is simultaneously reflected, and reflected light is imaged on the detector 116；
Step 2, the control end judge whether the image-forming information on the detector 116 is complete, if complete be
When the center location information of the measurement hot spot is with practical center position consistency, then step 4 is performed；If not complete
Whole is when the center location information of the hot spot has deviation with practical center position, then to perform step 3；,
The groove structure feature of step 3, the spatial light modulator 107 according to the surface of the measured workpiece 103
And positional information, regulation thang-kng slit 1071, return to step 1；
Specifically, the step 3 includes：The spatial light modulator 107 obtains the measured workpiece 103
Whether the groove structure feature and positional information on surface, judge stored in the spatial light modulator 107 right
The distributed data of thang-kng slit 1071 answered, calls the distributed data of the thang-kng slit 1071 regulation institute if having
Thang-kng slit 1071 is stated, afterwards return to step 1；If the information regulation thang-kng slit 1071 without if according to acquisition
And preserve, return to step 1 afterwards.
Step 4, the control end calculate the defocusing amount on the surface of measured workpiece 103 according to the image-forming information,
And control the work stage 104 to move, by the surface modulation of the measured workpiece 103 to error allowed band
Optimum exposure face.
The step 4 is specially：If there is defocus, tilt phenomenon, work stage in the measured workpiece 103
After 104 regulation measured workpieces 103, exposure system starts exposure；If the measured workpiece 103 in the absence of defocus,
Tilt phenomenon, then exposure system directly start exposure.
Specifically, when tested surface (i.e. the surface of measured workpiece 103) is in preferable focal plane, if now
Position be z0, the last corresponding initial position y of picture on detector 116 of projection hot spot0, its signal is such as
The signal curve that dotted line in Fig. 2 c is represented, when tested surface has the defocus of Δ z, is tested work in such as Fig. 4
The position that the solid line on the surface of part 103 is represented, corresponding signal curve is the signature tune that the solid line in Fig. 2 c is represented
Line, then its correspondence position relation and initial position corresponding relation in the image position of detector 116 is Δ y
(the image space deviation of three correspondence hot spots is Δ y1, Δ y2, Δ y3), then the calculating formula of defocusing amount Δ z：
When measured workpiece 103 has inclination, the calculation with typical structure is identical, similarly can be with
Obtain the tilt quantity of Rx, the Ry at this.FLS be measured after by defocus, obliquity feedback of the information to work
Part platform 104, measured workpiece 103 is calibrated by work stage 104, then start exposure.
The exposure process is：When measured workpiece 103 is in the optimal focal plane of exposure object lens 102, mask
Through exposing the measured workpiece that object lens 102 are imaged onto in work stage 104 after the exposed optical illumination of figure on 101
103 surfaces, the photoresist to correspondence position is exposed, and then completes light after other a series of flows again
Flow is carved, is not key content of the present invention due to photolithographic procedures, and be prior art, no longer chatted in detail herein
State.
Needs are said, due to when practical application, for the measured workpiece 103 of fixed batch, its work
Skill figure is fixed, that is to say, that the positional information of groove is known on the workpiece of the batch, therefore
Before formal measurement, can according to known to measured workpiece 103 groove positional information, the control of control end
Corresponding dynamic regulation hot spot distribution pattern data are compiled in software and then is formed corresponding with the measured workpiece 103
Slit distributed image data, and store to stand-by in the database of SLM 107, test to specific groove
During position, SLM 107 just calls corresponding slit distributed image data, so rapidly can effectively advise
The influence of measurand technique is kept away, the certainty of measurement and testing efficiency of focusing leveling device is improved.Therefore, originally
Embodiment first confirmd that size, the positional information of the groove of measured workpiece 103 before focusing and leveling is carried out
Whether it is to determine, if be to determine, then chi of the control end for the groove of the batch measured workpiece 103
Very little, positional information makes corresponding FLS slits distributed image data, and the database stored to SLM 107
The middle advance data as FLS is standby, and FLS works as detection when the batch measured workpiece 103 is measured
Device 116 detects spot signal curve and signal curve shown in similar Fig. 3 b, 3d occurs, then control end is just adjusted
With storing corresponding slit distributed image data in the databases of SLM 107 before, and on display screen S1
Thang-kng slit 1071 is adjusted/switches.
The focusing leveling device and method of the present embodiment are mainly in the table of measured workpiece 103 for intensive groove occur
When face, part or all of measurement hot spot can not measure complete tested region height measurements, using SLM 107
The mode for changing spot size is realized to adapt to intensive groove, accurately and quickly to there is intensive groove measured workpiece
103 measurement.The present embodiment can be severe to TSV etc. technique piece measure, be equally applicable certainly
In the focusing and leveling system of big visual field multimetering.
Embodiment 2
The present embodiment is with the distinctive points of embodiment 1, and in the present embodiment, spatial light modulator 107 is light
Can be changed to for wherein single thang-kng slit 1071 as shown in Figure 10,11 by grid pattern, the grating mode
Grating mode, it is also possible to some thang-kng slits are constituted into grating as shown in figure 12.In this way, working as space light modulation
In the case that device middle part light splitting grid hot spot fails, the grating of also part other parts is unlikely to failure.Additionally,
In the case where light channel structure is not changed, can be according to actual, different operating modes to the demand parameter of certainty of measurement
Difference, the number of measurement sub-light spot is increased by spatial light modulator 107, as shown in Figure 10,11,12,
Number of spots in figure is only the differences of relative 3 number of spots, actual condition increase as needed it is more or
Person is reduced.Detector only needs the sub-light spot of Selection Center positional information and practical center position consistency, judges institute
Measured workpiece is stated with the presence or absence of defocus, tilt phenomenon, work stage is fed back to.
Embodiment 3
The present embodiment is that the present embodiment is applied to big visual field multimetering with the distinctive points of embodiment 1 and 2
Focusing and leveling system, while detector can also be slackened influenceed by temperature drift, improve the measurement essence of sensor
Degree.
As shown in figure 13, the focusing leveling device of the present embodiment is removed includes and the structure identical first of embodiment 1
Outside lighting unit E1, the first spatial light modulator 107, projecting light path E2 and detection light path E3, also include
Reference path, the reference path includes second space optical modulator 107 ' and second lighting unit E1 ', described
Second space photo-detector 107 ' is arranged between the second lighting unit E1 ' and detection light path E3, described
Second space optical modulator 107 ' is provided with reference marker 107b one-to-one with the measurement markers 107a,
Reference marker 107b described in every group is made up of multiple thang-kng slits, the center of reference marker 107b described in every group
Center with the measurement markers 107a of same position is consistent.It is identical with the first lighting unit E1, it is described
Second lighting unit E1 ' includes multigroup light fixture, is referred to described in one group of light fixture correspondence described in every group
Mark 107b, the light fixture provides illuminating bundle, through after the corresponding reference marker 107b in institute
State and be imaged on detector.
The present embodiment increases reference marker 107b between the second lighting unit E1 ' and detection light path E3,
Detector can be weakened to be influenceed by environment temperature drift.Reference marker 107b debugs completion, and it is with respect to whole system
Position relationship be steady in a long-term, and reference marker 107b light beams need not have by tested technique piece
The influence of technique, when detector does not receive environment temperature drift to be influenceed, reference marker 107b is in detector target surface
On image space be fixed, the theoretical image space of reference marker 107b can be set to；When detector is received
When being influenceed to environment temperature drift, image spaces of the reference marker 107b on detector target surface is with respect to its theory imaging
There is certain skew position, and detector can be demarcated because being influenceed to sensor by environment temperature drift using the side-play amount
The influence amount of certainty of measurement, can thus weaken or eliminate because detector receive environment temperature drift to sensor
The adverse effect brought, so as to improve the certainty of measurement of sensor.
Further, the measurement markers 107a and reference marker 107b respectively by first, second SLM107,
107 ' control to realize, wherein measurement markers 107a is distributed as shown in figures 14a, and reference marker 107b is distributed such as
Shown in Figure 14 b, and measurement markers 107a and reference marker 107b is one-to-one, and Figure 14 c are to survey
Amount mark 107a and reference marker 107b is placed on the schematic layout pattern under same coordinate, label in such as Figure 14 a
With label 01~05 in Figure 14 b it is mutually corresponding according to order from small to large for 01~05 measurement markers 107a
, each position relationship being marked in the spatial light modulator at respective place is determined when designing and completing.
Using when according to the process condition per batch processes pieces, will need to change size or position by control end
The mark put creates corresponding pictorial symbolization (including measurement markers 107a and corresponding reference marker 107b) number
According to, and store in corresponding database, to call at any time being subsequently encountered corresponding process condition.
So in order to realize while being measured to two kinds of marks, the present embodiment also has additional relaying and amplifies light path
E4, the relaying amplifies light path E4 and is used to detect measurement markers 107a and reference marker 107b simultaneously.
It should be noted that two figures in the dotted line frame of Figure 13 are relayings and amplifying two of light path E4 and hanging down mutually
Look at the schematic diagram at angle straight.
In the present embodiment, (01~05 totally five groups, five groups are only shown every group in the measurement markers 107a of Figure 14 a
Meaning, can be with more) mark including 3 slot markers (3 slits are only to illustrate, can be with more), it is right
Answering every group of (01~05, group number is corresponding with measurement markers 107a) reference marker 107b in Figure 14 b includes 2
Individual slot marker, the mark in Figure 14 a, 14b combine after as shown in figure 14 c.Measurement markers 107a
After corresponding to light fixture illumination in the first lighting unit E1 therewith, projection mark hot spot is first projected light path
E2 is projected on tested technique piece, is then detected light path E3 and is collected, last repeated amplification light path E4 into
As on detector, the detector is generally CCD or linear array CCD, i.e. LCCD, it would however also be possible to employ
Other similar detectors；Corresponding reference marker 107b is by corresponding photograph in the second lighting unit E1 '
Direct repeated amplification light path E4 is imaged onto on detector after bright module light, and it is surveyed with group number identical certainly
Amount mark 107a is imaged onto on same LCCD, i.e. measurement markers 107a and reference marker 107b shares one
Individual detector, measurement is completed after subsequently being processed through back end signal.
To sum up, the present invention has advantages below：
1st, reducing the size on facula measurement direction can make focusing leveling device adapt to the intensive tested work of groove
Part 103, improves the Technological adaptability of focusing leveling device；
2nd, the mode of projection spot size and layout is changed in the present invention using SLM 107, because it is directly to exist
The PC control ends of SLM 107 do not have what regulation mechanical component was realized by what is be directly realized by after software modification
Implementation process, will not bring the influence in structure to total, be conducive to improving sensing system structure
Stability；
3rd, the present invention can reduce the spot size in measurement direction, moreover it is possible to reduce because tested surface reflectivity is uneven
The influence uneven to spot energy distribution, improves the signal to noise ratio of signal, is conducive to improving certainty of measurement；
4th, the present invention can reduce the size on facula measurement direction, while the non-measured direction of hot spot can be increased
On size, can improve utilization ratio of optical energy, improve the signal to noise ratio of the detectable signal of detector 116, favorably
In raising certainty of measurement.
5th, there is intensive technique groove in measured workpiece local surfaces, cause the number that focusing leveling device is measured
During according to that can not reflect or can not truly reflect tested region height measurements, utilization space optical modulator 107
The region of technogenic influence is directly avoided or be not coated with to the size for changing hot spot so that hot spot does not receive technique shadow
It is loud so as to extrapolate tested region height measurements；Or change the photograph projected on the surface of measured workpiece 103
Spacing or facula position between bright or measurement hot spot, searching completely or partly can measure tested region
The alternative site of height measurements.The present invention can effectively improve Technological adaptability and the measurement of focusing leveling device
Precision, improves finished product yield.
Obviously, those skilled in the art can carry out various changes and modification without deviating from the present invention to invention
Spirit and scope.So, if it is of the invention these modification and modification belong to the claims in the present invention and its
Within the scope of equivalent technologies, then the present invention is also intended to including including these changes and modification.
Claims (15)
1. a kind of focusing leveling device, including the first lighting unit, projecting light path, imaging optical path, detector
And control end, the first lighting unit offer measuring beam, tested work is incident to after the projecting light path
Part surface, through the measured workpiece surface reflect after outgoing to the imaging optical path, afterwards into the detection
Device is imaged, and after the control end obtains the defocusing amount on the measured workpiece surface according to image-forming information, and controls
Work stage is moved, by the measured workpiece surface modulation to the optimum exposure face in error allowed band；
Characterized in that, the first spatial light modulator is provided between first lighting unit and projecting light path,
First spatial light modulator is provided with multiple thang-kng slits, and the measuring beam is through first spatial light
Multiple measurement hot spots are formed after modulator.
2. focusing leveling device as claimed in claim 1, it is characterised in that first space light modulation
Device is provided with multigroup measurement markers, and measurement markers described in every group are made up of multiple thang-kng slits, and described first shines
Bright unit includes multigroup light fixture, measurement markers described in one group of light fixture correspondence described in every group.
3. focusing leveling device as claimed in claim 2, it is characterised in that described device also includes reference
Light path, the reference path includes second space optical modulator and the second lighting unit, the second space light
Modulator be provided with the one-to-one reference marker of the measurement markers, reference marker is by multiple described in every group
Thang-kng slit is constituted, the center one of the measurement markers of the center of reference marker described in every group and same position
Cause, second lighting unit includes multigroup light fixture, one group of institute of light fixture correspondence described in every group
State reference marker, the light fixture provides illuminating bundle, through after the corresponding reference marker described
It is imaged on detector.
4. focusing leveling device as claimed in claim 3, it is characterised in that described device also includes relaying
Amplify light path, by the hot spot after the hot spot after the imaging optical path and the transmission reference marker by institute
State after relaying amplifies light path and shine imaging on the detector.
5. focusing leveling device as claimed in claim 3, it is characterised in that reference marker described in every group sets
There are multiple thang-kng slits for surrounding the corresponding measurement markers.
6. the focusing leveling device as described in claim 1 or 3, it is characterised in that the thang-kng slit is
Raster mode.
7. focusing leveling device as claimed in claim 1, it is characterised in that the detector be CCD or
Linear array CCD.
8. focusing leveling device as claimed in claim 1, it is characterised in that the projecting light path includes throwing
Group, steering assembly and group after projection before shadow.
9. focusing leveling device as claimed in claim 1, it is characterised in that the imaging optical path includes the
Group, end of probe diaphragm, the second reflection subassembly and group after detection before one reflection subassembly, detection.
10. focusing leveling device as claimed in claim 2, it is characterised in that the projecting light path includes
Group, projection end diaphragm and group after projection, project end anti-before multigroup projection end reflection subassembly, projection described in every group
Measurement markers described in one group of component correspondence are penetrated, the measurement hot spot that will transmit through the measurement markers reflexes to the throwing
Before shadow in group.
11. focusing leveling devices as claimed in claim 2, it is characterised in that the imaging optical path includes
Group and multigroup end of probe reflection subassembly after the preceding group of detection, end of probe diaphragm, detection, end of probe described in every group are anti-
Hot spot of the measurement markers described in one group of component correspondence through the imaging optical path outgoing is penetrated, and is reflected it to described
On detector.
A kind of 12. methods for being applied to the focusing leveling device described in claim 1~11 any one, its
It is characterised by, including：
Step 1, the illuminating bundle incide described through the thang-kng slit in first spatial light modulator
Measured workpiece surface is simultaneously reflected, and reflected light is imaged on the detector；
Step 2, the control end judge whether the image-forming information on the detector is complete, is performed if complete
Step 4, performs step 3 if imperfect；
The groove structure feature and position of step 3, first spatial light modulator according to the measured workpiece surface
Confidence ceases, and adjusts thang-kng slit, return to step 1；
Step 4, the control end calculate the defocusing amount on the measured workpiece surface according to the image-forming information, and
The work stage is controlled to move, by the measured workpiece surface modulation to the optimum exposure in error allowed band
Face.
13. focusing and leveling methods as claimed in claim 12, it is characterised in that the step 2 is specific
For, if the center of each facula information is inconsistent with practical center position in the image-forming information, institute
The image-forming information stated on detector is imperfect, performs step 3.
14. focusing and leveling methods as claimed in claim 12, it is characterised in that the step 3 is specific
For, first spatial light modulator obtains the groove structure feature and positional information on the measured workpiece surface,
Judge whether corresponding thang-kng slit distributed data is stored in first spatial light modulator, adjusted if having
The thang-kng slit is adjusted with the thang-kng slit distributed data, afterwards return to step 1；Obtained if the basis without if
The information for taking adjusts thang-kng slit and preserves, afterwards return to step 1.
15. focusing and leveling methods as claimed in claim 12, it is characterised in that the thang-kng slit is adopted
Use raster mode.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109426093A (en) * | 2017-08-31 | 2019-03-05 | 上海微电子装备（集团）股份有限公司 | A kind of focusing-levelling detection device |
| CN110057839A (en) * | 2019-04-18 | 2019-07-26 | 中国科学院微电子研究所 | Focusing control apparatus and method in a kind of Optical silicon wafer detection system |
| CN110501878A (en) * | 2018-05-18 | 2019-11-26 | 上海微电子装备（集团）股份有限公司 | A kind of focusing leveling device, lithographic equipment and focusing and leveling method |
| CN111443577A (en) * | 2020-04-08 | 2020-07-24 | 中国科学院微电子研究所 | Adjusting device and method for exposure equipment and exposure equipment |
| CN112649435A (en) * | 2020-12-01 | 2021-04-13 | 上海御微半导体技术有限公司 | Focal plane measuring device and defect detection equipment |
| CN112731773A (en) * | 2020-12-31 | 2021-04-30 | 中国科学院微电子研究所 | Electron beam exposure machine, focusing method and device |
| CN113764298A (en) * | 2021-05-31 | 2021-12-07 | 上海微电子装备（集团）股份有限公司 | Substrate defect detection device and substrate defect detection method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060103827A1 (en) * | 2004-11-17 | 2006-05-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101226343A (en) * | 2008-01-29 | 2008-07-23 | 芯硕半导体（中国）有限公司 | Method for improving photolithography exposure energy homogeneity using grey level compensation |
| CN103838088A (en) * | 2012-11-23 | 2014-06-04 | 上海微电子装备有限公司 | Focusing and levelling device and method |
-
2015
- 2015-12-30 CN CN201511025469.1A patent/CN106933071B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060103827A1 (en) * | 2004-11-17 | 2006-05-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101226343A (en) * | 2008-01-29 | 2008-07-23 | 芯硕半导体（中国）有限公司 | Method for improving photolithography exposure energy homogeneity using grey level compensation |
| CN103838088A (en) * | 2012-11-23 | 2014-06-04 | 上海微电子装备有限公司 | Focusing and levelling device and method |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109426093A (en) * | 2017-08-31 | 2019-03-05 | 上海微电子装备（集团）股份有限公司 | A kind of focusing-levelling detection device |
| CN109426093B (en) * | 2017-08-31 | 2020-12-11 | 上海微电子装备（集团）股份有限公司 | Focusing and leveling detection device |
| CN110501878A (en) * | 2018-05-18 | 2019-11-26 | 上海微电子装备（集团）股份有限公司 | A kind of focusing leveling device, lithographic equipment and focusing and leveling method |
| CN110057839A (en) * | 2019-04-18 | 2019-07-26 | 中国科学院微电子研究所 | Focusing control apparatus and method in a kind of Optical silicon wafer detection system |
| CN111443577A (en) * | 2020-04-08 | 2020-07-24 | 中国科学院微电子研究所 | Adjusting device and method for exposure equipment and exposure equipment |
| CN112649435A (en) * | 2020-12-01 | 2021-04-13 | 上海御微半导体技术有限公司 | Focal plane measuring device and defect detection equipment |
| CN112731773A (en) * | 2020-12-31 | 2021-04-30 | 中国科学院微电子研究所 | Electron beam exposure machine, focusing method and device |
| CN112731773B (en) * | 2020-12-31 | 2024-04-16 | 中国科学院微电子研究所 | Electron beam exposure machine, focusing method and device |
| CN113764298A (en) * | 2021-05-31 | 2021-12-07 | 上海微电子装备（集团）股份有限公司 | Substrate defect detection device and substrate defect detection method |
| CN113764298B (en) * | 2021-05-31 | 2023-11-17 | 上海微电子装备（集团）股份有限公司 | Substrate defect detection device and substrate defect detection method |
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