CN106922109B - Flow guiding and heat dissipating device - Google Patents
Flow guiding and heat dissipating device Download PDFInfo
- Publication number
- CN106922109B CN106922109B CN201710292704.4A CN201710292704A CN106922109B CN 106922109 B CN106922109 B CN 106922109B CN 201710292704 A CN201710292704 A CN 201710292704A CN 106922109 B CN106922109 B CN 106922109B
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- air
- cabinet
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- air outlet
- air inlet
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- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000007613 environmental effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- 238000009825 accumulation Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a flow guide heat dissipation device, which is used for solving the technical problem of heat accumulation between equipment in a cabinet. The flow guiding and heat dissipating device of the embodiment of the invention comprises: the air inlet flow guide device, the air outlet flow guide device and the fan module; the air inlet guide device and the air outlet guide device are arranged on the square hole strip of the cabinet through hangers; the equipment is arranged on the square hole strip of the belonging cabinet through the hanging lug; the fan module is installed on the top of the cabinet.
Description
Technical Field
The invention relates to the field of heat dissipation, in particular to a flow-guiding heat dissipation device.
Background
At present, processor equipment is widely used in the visualization industry, and the main functions of the processor equipment are input, conversion processing and output of images and video signals. Due to the diversification of customer requirements and application scenes, the shapes of the processor equipment are diversified, and the air ducts on the heat dissipation design level are diversified, such as: upper and lower wind channels, left and right wind channels, front and rear wind channels, etc.
When processor equipment in different air duct forms is placed in a cabinet for combined application, air ducts are complicated, air outlet of lower-layer equipment often affects air inlet of upper-layer equipment (as shown in ① and ② in fig. 2) and further deteriorates the use air inlet environment of the upper-layer equipment, the higher the temperature of the air inlet environment is, the serious influence is caused on the reliability of service chips and power supply devices on a board card of the equipment, and researches show that the failure rate of the processor equipment can rise by 10% when the junction temperature of the chip rises by 1 ℃.
Disclosure of Invention
The embodiment of the invention provides a flow guide heat dissipation device, which solves the technical problem of heat accumulation among equipment in a cabinet.
The embodiment of the invention provides a flow guiding and heat dissipating device, which comprises: the air inlet flow guide device, the air outlet flow guide device and the fan module;
the air inlet guide device and the air outlet guide device are arranged on the square hole strip of the cabinet through hangers;
the equipment is arranged on the square hole strip of the belonging cabinet through the hanging lug;
the fan module is installed on the top of the cabinet.
Preferably, the equipment base is supported by a rack, the rack being provided in the cabinet.
Preferably, the fan module is a fan box.
Preferably, the fan module is fixed on the top of the cabinet through screws.
Preferably, the stent is an L-shaped stent.
Preferably, the equipment comprises front air inlet and upper air outlet duct equipment, lower air inlet and upper air outlet duct equipment and lower air inlet and top and peripheral air outlet duct equipment.
Preferably, the air inlet guide device is installed at the air inlet of the equipment.
Preferably, the air outlet guide device is installed at the air outlet of the equipment.
According to the technical scheme, the embodiment of the invention has the following advantages:
the embodiment of the invention provides a flow guide heat dissipation device, which comprises: the air inlet flow guide device, the air outlet flow guide device and the fan module; the air inlet guide device and the air outlet guide device are arranged on the square hole strip of the cabinet through hangers; the equipment is arranged on the square hole strip of the belonging cabinet through the hanging lug; the fan module is installed on the top of the cabinet. In this embodiment, through an air inlet, air-out guiding device for the rack gets into the cold air current and gets into from the equipment air intake, and hot-blast from the equipment air outlet discharge finally discharges the rack outside through the fan frame at rack top, realizes effective radiating purpose, can effectively solve equipment heat accumulation problem in the rack, and then guarantees that equipment effectively operates in the rack.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of an embodiment of a flow-guiding heat dissipation device provided in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of a conventional flow-guiding heat dissipation apparatus provided in the embodiment of the present invention;
FIG. 3 is a schematic view of an embodiment of an intake air deflector of the present invention;
fig. 4 is a schematic structural diagram of an embodiment of an air outlet flow guide device provided in the embodiment of the present invention;
illustration of the drawings: 1. an air inlet flow guide device; 2. an air outlet flow guide device; 3. a fan module; 4. a cabinet; 5. equipment (I); 6. a device (II); 7. and (III).
Detailed Description
The embodiment of the invention provides a flow guide heat dissipation device, which solves the technical problem of heat accumulation among equipment in a cabinet.
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of a flow-guiding heat dissipation device according to an embodiment of the present invention includes:
an air inlet guide device 1 as shown in fig. 3, an air outlet guide device 2 as shown in fig. 4, and a fan module 3;
the air inlet guide device 1 and the air outlet guide device 2 are arranged on the square hole strip of the cabinet through hangers;
the equipment is arranged on the square hole strip of the belonging cabinet through the hanging lug;
the fan module 3 is mounted on the top of the cabinet 4.
Further, the bottom of the apparatus is supported by a rack provided in the cabinet 4.
Further, the fan module 3 is a fan box.
Further, the fan module 3 is fixed on the top of the cabinet 4 by screws.
Further, the support is an L-shaped support.
Furthermore, the equipment comprises a front air inlet upper air outlet air channel device, a lower air inlet upper air outlet air channel device and a lower air inlet top peripheral air outlet air channel device.
Further, the air inlet guiding device is installed at the air inlet of the equipment.
Further, the air outlet flow guide device is installed at the air outlet of the equipment.
In this embodiment, a principle of operation of the diversion heat dissipation device is as follows: ambient cold air enters the interior of the cabinet 4 through the front door of the cabinet 4, and for the equipment (I) 5 and the equipment (III) 7 with lower air inlet, the cold air entering the cabinet 4 is guided by the air inlet guide device 1 and then enters the equipment; for the equipment of going up air-out of equipment (II) 6 and equipment (III) 7 this kind, the temperature rises and becomes hot-blast after the cold wind cooling, and hot-blast can be through air-out guiding device 2 to rack 4 back door interval, and the drive of fan module 3 is discharged the rack 4 outside at last. In the process, the diversion heat dissipation device guides the air inlet and outlet directions of the equipment to be consistent with those of the cabinet 4, the cold and hot regions in the cabinet 4 are subjected to complementary influence, the heat dissipation environment of the equipment is finally improved, and the heat dissipation problem caused by heat accumulation is solved.
In the embodiment, the air inlet and outlet guide devices 2 are arranged on the square hole strips of the cabinet through the hangers; the equipment is arranged on the square hole strip of the cabinet through the hanging lugs, and the bottom of the equipment is supported by the L-shaped bracket; the fan module 3 is a fan box and is fixed at the top of the cabinet 4 through screws, so that the problem of heat accumulation between equipment is solved, the heat dissipation effect of the equipment is improved, and the reliability and the service life of a product are improved. The heat dissipation air duct of the cabinet 4 is generally in the air outlet mode at the air inlet top of the front door, and the equipment running in the heat dissipation air duct passes through the diversion heat dissipation device, so that cold air entering the cabinet 4 enters from the equipment air inlet, hot air is discharged from the equipment air outlet, and finally the cold air is discharged to the outside of the cabinet 4 through the fan frame at the top of the cabinet 4, thereby achieving the purpose of effective heat dissipation. In this embodiment, the air duct form of the equipment and the air duct form of the cabinet 4 are matched by the diversion heat dissipation device in combination with the air duct form of the cabinet 4, so that the problem of heat accumulation between the equipment is effectively solved, and the normal and safe operation of the equipment is ensured.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. A flow-directing heat sink, comprising: the air inlet flow guide device, the air outlet flow guide device and the fan module;
the air inlet guide device and the air outlet guide device are arranged on the square hole strip of the cabinet through hangers;
the equipment is arranged on the square hole strip of the belonging cabinet through the hanging lug;
the fan module is arranged at the top of the cabinet;
further comprising: a front air inlet and upper air outlet air channel device, a lower air inlet and upper air outlet air channel device and a lower air inlet and top peripheral air outlet air channel device;
the lower air inlet upper air outlet air channel equipment, the front air inlet upper air outlet air channel equipment and the lower air inlet top peripheral air outlet air channel equipment are sequentially arranged along the bottom of the cabinet to the top direction of the cabinet;
when ambient cold air enters the interior of the cabinet through the front door of the cabinet, the ambient cold air enters the lower air inlet upper air outlet air channel equipment, the lower air inlet top peripheral air outlet air channel equipment and the front air inlet upper air outlet air channel equipment through the guide of the air inlet guide device;
the ambient cold air after passing through the lower air inlet and upper air outlet duct equipment and the front air inlet and upper air outlet duct equipment is discharged to a rear door section of the cabinet through an air outlet flow guide device; the fan module is changed into hot air after passing through the lower air inlet upper air outlet air channel equipment, the front air inlet upper air outlet air channel equipment and the lower air inlet top peripheral air outlet air channel equipment, and the environmental cold air is discharged out of the cabinet.
2. The deflector heat sink of claim 1, wherein the equipment bottom is supported by a rack disposed in the cabinet.
3. The device of claim 2, wherein the fan module is a fan box.
4. The device as claimed in claim 3, wherein the fan module is fixed to the top of the cabinet by screws.
5. The flow-guiding and heat-dissipating device of claim 4, wherein the bracket is an L-shaped bracket.
6. The deflector heat sink of claim 1, wherein the air outlet deflector is mounted at the equipment air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710292704.4A CN106922109B (en) | 2017-04-28 | 2017-04-28 | Flow guiding and heat dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710292704.4A CN106922109B (en) | 2017-04-28 | 2017-04-28 | Flow guiding and heat dissipating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106922109A CN106922109A (en) | 2017-07-04 |
| CN106922109B true CN106922109B (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710292704.4A Expired - Fee Related CN106922109B (en) | 2017-04-28 | 2017-04-28 | Flow guiding and heat dissipating device |
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| Country | Link |
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| CN (1) | CN106922109B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110475456A (en) * | 2018-05-09 | 2019-11-19 | 新疆北方建设集团有限公司 | A kind of radiator structure for photovoltaic DC-to-AC converter |
| CN110198609A (en) * | 2019-06-04 | 2019-09-03 | 和记奥普泰通信技术有限公司 | The installation of the sub- frame of packetizing OTN, PTN, IPRAN and SPN equipment and method for dismounting |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200953715Y (en) * | 2006-09-26 | 2007-09-26 | 中兴通讯股份有限公司 | Guide routing plug box |
| CN201115064Y (en) * | 2007-09-21 | 2008-09-10 | 中兴通讯股份有限公司 | A machine cabinet |
| CN103079386A (en) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | Heat dissipation structure of rack-mounted communication equipment |
| CN203481874U (en) * | 2013-09-18 | 2014-03-12 | Abb技术有限公司 | Charging device |
| CN105392339A (en) * | 2015-11-17 | 2016-03-09 | 许继集团有限公司 | Electrical cabinet heat radiating device and electrical cabinet using same |
| CN105451517A (en) * | 2015-11-30 | 2016-03-30 | 中国电子科技集团公司第二十八研究所 | Forced air exhaust type radiating electronic case |
| CN205754707U (en) * | 2016-05-06 | 2016-11-30 | 天津时逸欣奇科技有限公司 | A kind of professional switch device in terms of computer network |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9204576B2 (en) * | 2012-09-14 | 2015-12-01 | Cisco Technolgy, Inc. | Apparatus, system, and method for configuring a system of electronic chassis |
-
2017
- 2017-04-28 CN CN201710292704.4A patent/CN106922109B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200953715Y (en) * | 2006-09-26 | 2007-09-26 | 中兴通讯股份有限公司 | Guide routing plug box |
| CN201115064Y (en) * | 2007-09-21 | 2008-09-10 | 中兴通讯股份有限公司 | A machine cabinet |
| CN103079386A (en) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | Heat dissipation structure of rack-mounted communication equipment |
| CN203481874U (en) * | 2013-09-18 | 2014-03-12 | Abb技术有限公司 | Charging device |
| CN105392339A (en) * | 2015-11-17 | 2016-03-09 | 许继集团有限公司 | Electrical cabinet heat radiating device and electrical cabinet using same |
| CN105451517A (en) * | 2015-11-30 | 2016-03-30 | 中国电子科技集团公司第二十八研究所 | Forced air exhaust type radiating electronic case |
| CN205754707U (en) * | 2016-05-06 | 2016-11-30 | 天津时逸欣奇科技有限公司 | A kind of professional switch device in terms of computer network |
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| CN106922109A (en) | 2017-07-04 |
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