CN106922071B - A kind of spray head heating-cooling device and method for plasma reaction device - Google Patents
A kind of spray head heating-cooling device and method for plasma reaction device Download PDFInfo
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- CN106922071B CN106922071B CN201510985474.0A CN201510985474A CN106922071B CN 106922071 B CN106922071 B CN 106922071B CN 201510985474 A CN201510985474 A CN 201510985474A CN 106922071 B CN106922071 B CN 106922071B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/28—Cooling arrangements
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- Engineering & Computer Science (AREA)
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- Spectroscopy & Molecular Physics (AREA)
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Abstract
A kind of spray head heating-cooling device and method for plasma reaction device of disclosure of the invention, establishes to form spray head heating-cooling device using showerhead configuration, heating structure and cooling structure；The combination of above-mentioned component can be realized reaction gas before entering plasma reaction chamber, and reaction gas is sufficiently mixed in showerhead configuration, heating structure and cooling structure, is preheated；And it can be during plasma reaction intracavitary progress wafer engraving, constantly cooled down to the heating structure according to the temperature of real-time detection heating structure and cooling structure, to guarantee that reaction gas temperature remains unchanged, etching efficiency, product quality are improved.
Description
Technical field
The present invention relates to field of semiconductor processing, and in particular to a kind of spray head heating for plasma reaction device is cold
But device and method.
Background technique
In field of semiconductor manufacture, the spray head supplied to substrate to be processed with shape spray is widely used.Such as wait from
In daughter etching processing equipment, the mounting table for loading substrate is provided in process chamber, the position opposite with the mounting table
It is provided with spray head, the surface of the spray head is provided with multiple gas ejection holes, generates with shape spray supply response gas
Gas ions.In order to accurately control the processing effect to substrate fixed in mounting table, obtains higher homogeneity and need to being passed through
The gas zonal control of reaction chamber.Gas shower is each led into after reaction gas is separated into two kinds of gases by gas fractionation unit
The different zones of head, such as central area and peripheral region.Gas spray includes upper layer and lower layer gas distribution grid, top plate with
Lower plywood has corresponding stomata, and wherein the stomata bore on top plate is greater than the stomata on lower plywood.In order to avoid center
The mutual crosstalk of the gas of region and peripheral region, will be arranged for example airtight ring washer of isolating device, ring between the two regions
Shape washer, which is placed in gasket groove, makes the mutual gas barrier in the gas passage inside and outside washer, and wherein gasket groove can be provided with upper layer
Gas distribution grid can also be provided with underlying gas distribution grid.In order to guarantee the isolation of central area and peripheral region gas, pad
Circle needs adequate thickness that top plate and lower plywood is made to generate enough pressure when mutually being fastened with bolt.But thicker washer
But also contact pressure between top plate and lower plywood is not enough or there are gap while guaranteeing gas barrier, and upper layer
The capacity of heat transmission that gap between plate and lower plywood will cause between upper and lower laminate sharply deteriorates, and eventually leads to monolith gas shower
Temperature Distribution is uneven on head.Gas spray temperature distributing disproportionation will lead to heavy when device deformation and plasma treatment
Long-pending distribution of polymer it is uneven, these can all lead to the uneven of plasma treatment effect.
Summary of the invention
The purpose of the present invention is to provide a kind of spray head heating-cooling device and method for plasma reaction device,
It establishes to form spray head heating-cooling device using showerhead configuration, heating structure and cooling structure；The combination energy of above-mentioned component
Reaction gas is enough realized before entering plasma reaction chamber, reaction gas is in showerhead configuration, heating structure and cooling structure
In be sufficiently mixed, preheated；And it can be during plasma reaction intracavitary progress wafer engraving, according to real-time detection
The temperature and cooling structure of heating structure constantly cool down to the heating structure, to guarantee that reaction gas temperature is kept
It is constant, improve etching efficiency, product quality.
In order to achieve the above object, the invention is realized by the following technical scheme:
A kind of spray head heating-cooling device for plasma reaction device, the spray head heating-cooling device are set to
At the top of the reaction chamber of plasma reaction device, so that the reaction chamber inner sealing, its main feature is that, the spray head heating-cooling device
Include:
Showerhead configuration, the showerhead configuration are arranged above the reaction chamber, are provided in the showerhead configuration more
A spray air flue；
Heating structure is arranged above the showerhead configuration, and the lower surface of heating structure and showerhead configuration
Upper surface contact；
Cooling structure is arranged above the heating structure；
The lower surface of the cooling structure and the upper surface of the heating structure mutually fit in fit area, the fitting
Region includes central area and peripheral region, further includes area of isolation between cooling structure lower surface and heating structure, it is described every
At least one annular gas slot is equipped with from region between the central area and peripheral region, in area of isolation to tie cooling
The lower surface of structure and the upper surface of heating structure are mutually isolated, multiple sprays in the annular gas slot and the showerhead configuration
Leaching gas is to communicating with one another；
Include primary heater in the central area of the heating structure, includes secondary heater in peripheral region, it is described
Primary heater and secondary heater independent control.
Preferably, the heating structure includes:
First shell is arranged in the showerhead configuration；
Multiple first reaction gas passages, be respectively separated be arranged in the first shell, and with the multiple spray gas
Road connects；
Multiple first coolant ducts are circumferentially positioned at respectively in the first shell top.
Preferably, open slot is equipped at the top of the first shell；The multiple heater, the multiple first reaction gas
Channel is separately positioned in the first shell bottom；Each first coolant duct is circumferentially positioned at the top of the first shell
It is interior；Each heater is arranged in a ring in the first shell bottom；The first shell is made of aluminum material.
Preferably, the heating structure also includes: multiple temperature sensors, and multiple temperature sensors, which are respectively separated, to be set
It sets in first shell bottom, and is connect with external control structure.
Preferably, the cooling structure includes:
Second shell is arranged in the open slot at the top of the first shell；
Multiple second coolant ducts are respectively separated and are arranged in the second shell；Multiple first coolant pipes
Road and multiple second coolant duct independent controls；
At least one second reaction gas passage, be arranged in second shell, and respectively with multiple first reaction gas
Body channel connects.
Preferably, the second shell floor space is less than the sectional area of the open slot, covers greater than the multiple heater
The area of lid；The multiple heater is completely covered in the second shell bottom；The second shell is made of aluminum material；Institute
Stating multiple annular gas slots can pass the heat that the multiple heater generates in the corresponding annular gas slot
It leads.
A kind of control method of the spray head heating-cooling device for plasma reaction device, its main feature is that, the control
Method includes:
S1 is separately turned on multiple second coolant pipes of multiple first coolant ducts in heating structure, cooling structure
Road cools down the heating structure；
S2 opens multiple heaters of the heating structure by external control structure；
S3, after reaction gas is sufficiently mixed by least one second reaction gas passage of the cooling structure
Multiple first reaction gas passages for being sent into the heating structure are heated, and the reaction gas is sent into spray head after heating
Multiple spray air flues of structure；
S4, the temperature of multiple temperature sensor real-time measurement heating structure bottoms of the heating structure, judges temperature
It whether is more than the threshold temperature set；When being more than, a heater is added described in external control structure control and stops heating；When not
More than when, the heater added works on until reaching the threshold temperature of setting.
Compared with the prior art, the present invention has the following advantages:
The invention discloses a kind of spray head heating-cooling devices and method for plasma reaction device, using spray
Header structure, heating structure and cooling structure are established to form spray head heating-cooling device.The combination of above-mentioned component can be realized instead
Answer gas before entering plasma reaction chamber, reaction gas is filled in showerhead configuration, heating structure and cooling structure
Divide mixing, preheating；And it can be during plasma reaction intracavitary progress wafer engraving, according to real-time detection heating structure
Temperature and cooling structure constantly cool down to the heating structure, to guarantee that reaction gas temperature remains unchanged, mention
High etching efficiency, product quality.The present invention can be realized under high power heat transfer conditions efficiently controls reaction gas temperature.
Detailed description of the invention
Fig. 1 is a kind of overall structure section view of the spray head heating-cooling device for plasma reaction device of the present invention
Figure.
Fig. 2 is a kind of overall structure diagram of plasma reaction device of the present invention.
Fig. 3 is a kind of entirety of the control method of the spray head heating-cooling device for plasma reaction device of the present invention
Flow chart.
Specific embodiment
The present invention is further elaborated by the way that a preferable specific embodiment is described in detail below in conjunction with attached drawing.
As shown in Figure 1, a kind of spray head heating-cooling device for plasma reaction device, spray head heating cooling
Device is set to 100 top of reaction chamber of plasma reaction device, so that being in sealing state, the spray inside the reaction chamber 100
Leaching head heating-cooling device includes: showerhead configuration 1, heating structure 2 and cooling structure 3.
Wherein, showerhead configuration 1 is arranged above reaction chamber, and multiple spray air flues 11 are provided in the showerhead configuration 1.
Heating structure 2 is arranged above showerhead configuration 1, and the lower surface of heating structure 2 and the upper surface of showerhead configuration 1 connect
Touching；Cooling structure 3 is arranged above heating structure 2；The upper surface of cooling structure 3 and the heating structure 2 is mutual in fit area
Fit, fit area includes central area and peripheral region, further include between 3 lower surface of cooling structure and heating structure 2 every
From region, area of isolation is equipped at least one annular gas slot 34 between central area and peripheral region in area of isolation
The upper surface of the lower surface of cooling structure 3 and heating structure 2 is mutually isolated, in annular gas slot 34 and showerhead configuration 1
Multiple spray gas are to communicating with one another.
Include primary heater in the central area of heating structure 2, includes secondary heater, the first heating in peripheral region
Device and secondary heater independent control.
In the present embodiment, showerhead configuration 1 is made of materials such as silicon or silicon carbide.
As shown in Figure 1, heating structure 2 includes: first shell 25, multiple first reaction gas passages 22, multiple first cold
But liquid pipe road 23 and multiple temperature sensors 24.
Wherein, first shell 25 is arranged in showerhead configuration 1；Multiple heaters 21, which are respectively separated, to be arranged in first shell
In 25, and it is connect with external control structure；Multiple first reaction gas passages 22, which are respectively separated, to be arranged in first shell 25, and
It connects with multiple spray air flues 11；Multiple first coolant ducts 23 are circumferentially positioned at respectively in 25 top of first shell.
As shown in Figure 1 and Figure 2, open slot is equipped at the top of first shell 25.Multiple heaters 21, multiple first reaction gas
Channel 22 is separately positioned in 25 bottom of first shell.Each first coolant duct 23 is circumferentially positioned at the first shell 25
In top.Each heater 21 is arranged in a ring in 25 bottom of first shell.Multiple temperature sensors 24 are respectively separated setting
It is connect in 25 bottom of first shell, and with external control structure.In the present invention, first shell 25 is made of aluminum material；It is more
A annular gas slot 34 can conduct the heat that multiple heaters 21 generate in corresponding annular gas slot 34.
In the present embodiment, multiple annular gas slots 34 can make between heating structure 2 and cooling structure 3 central area and outer
Enclose region temperature can independent control, otherwise can not subregion independent control.Multiple annular gas slots 34 can make the center of being in
The heat that zone heater 21 generates substantially will not cross conduction arrive peripheral region, peripheral region on the contrary will not lateral transport arrive
Central area, both only can in various regions vertical direction transmitting heat, which achieves independent temperature controls.
As shown in Figure 1 and Figure 2, cooling structure 3 includes: second shell 33, multiple second coolant ducts 31 and at least one
Second reaction gas passage 32.
Wherein, second shell 33 is arranged in the open slot at 25 top of first shell；Multiple second coolant ducts 31 divide
It is not arranged at intervals in second shell 33.Multiple second coolant ducts 31 and multiple first coolant ducts 23 respectively by
Independent control.At least one second reaction gas passage 32 be arranged in second shell 33, and respectively with multiple first reaction gas
Body channel 22 connects.
As shown in Figure 1,33 floor space of second shell is less than the sectional area of open slot, greater than the face of multiple heaters 21 covering
Product.Multiple heaters 21 are completely covered in 33 bottom of second shell.In the present invention, second shell 33 is made of aluminum material.
When reaction gas not of the same race enters the multiple of heating structure 2 by the second reaction gas passage 32 of cooling structure 3
After first reaction gas passage 22, it is sufficiently mixed.In the present invention, multiple heaters 21 can be to entrance heating structure 2
Reaction gas is sufficiently heated.Multiple temperature sensors 24 measure the temperature of 2 different parts of heating structure, when temperature do not arrive it is pre-
If when value, external control structure control heater 21 carries out continuing to heat；When temperature is more than preset value, external control structure control
Heater 21 processed stops heating.In the whole process, full of cooling liquid in multiple first coolant ducts 23 of heater 21
Continued down is carried out to heating structure 2；Make in multiple second coolant ducts 31 of cooling structure 3 full of cooling liquid simultaneously
Obtaining the cooling structure 3 persistently can carry out continued down to 2 contact site of heating structure, in particular for setting having heaters
21 position cools down, and realizes the temperature uniformity for improving heating structure 2, so as to improve the uniformity of reaction gas temperature,
Improve etching effect.
As shown in Fig. 2, heating structure 2 includes: first shell 25, multiple heaters 21, multiple first reaction gas passages
22, multiple first coolant ducts 23 and multiple temperature sensors 24.
Wherein, first shell 25 is arranged in showerhead configuration 1；Multiple heaters 21, which are respectively separated, to be arranged in first shell
In 25, and it is connect with external control structure；Multiple first reaction gas passages 22, which are respectively separated, to be arranged in first shell 25, and
It connects with multiple spray air flues 11；Multiple first coolant ducts 23, are separately positioned in first shell 25.
As shown in Fig. 2, being equipped with open slot at the top of first shell 25.Multiple heaters 21, multiple first reaction gas passages
22 are separately positioned in 25 bottom of first shell.Each first coolant duct 23 is circumferentially positioned at 25 top of first shell
It is interior.Each heater 21 is arranged in a ring in 25 bottom of first shell.Multiple temperature sensors 24 are respectively separated setting the
One shell, 25 bottom, and connect with external control structure.In the present invention, first shell 25 is made of aluminum material.
As shown in Fig. 2, cooling structure 3 includes: second shell 33, multiple second coolant ducts 31 and at least one second
Reaction gas passage 32.
Wherein, second shell 33 is arranged in the open slot at 25 top of first shell；Multiple second coolant ducts 31 divide
It is not arranged at intervals in second shell 33；At least one second reaction gas passage 32 is arranged in second shell 33, and respectively
It connects with multiple first reaction gas passages 22.
As shown in Fig. 2, 33 floor space of second shell is less than the sectional area of open slot, greater than the face of multiple heaters 21 covering
Product.Multiple heaters 21 are completely covered in 33 bottom of second shell.In the present invention, second shell 33 is made of aluminum material；
Multiple annular gas slots 34 can conduct the heat that multiple heaters 21 generate in corresponding annular gas slot 34.
In the present embodiment, multiple annular gas slots 34 can make between heating structure 2 and cooling structure 3 center tend to and outside
Enclose region temperature can independent control, otherwise can not subregion independent control.Multiple annular gas slots 34 can make the center of being in
The heat that zone heater 21 generates substantially will not cross conduction arrive peripheral region, peripheral region on the contrary will not lateral transport arrive
Central area, both only can in various regions vertical direction transmitting heat, which achieves independent temperature controls.
When reaction gas not of the same race enters the multiple of heating structure 2 by the second reaction gas passage 32 of cooling structure 3
After first reaction gas passage 22, it is sufficiently mixed.In the present invention, multiple heaters 21 can be to entrance heating structure 2
Reaction gas is sufficiently heated.Multiple temperature sensors 24 measure the temperature of 2 different parts of heating structure, when temperature do not arrive it is pre-
If when value, external control structure control heater 21 carries out continuing to heat；When temperature is more than preset value, external control structure control
Heater 21 processed stops heating.In the whole process, full of cooling liquid in multiple first coolant ducts 23 of heater 21
Continued down is carried out to heating structure 2；Make in multiple second coolant ducts 31 of cooling structure 3 full of cooling liquid simultaneously
Obtaining the cooling structure 3 persistently can carry out continued down to 2 contact site of heating structure, in particular for setting having heaters
21 position cools down, so that the temperature uniformity for improving heating structure 2 is realized, so as to improve the uniform of reaction gas temperature
Property.Enable and effectively the wafer to be processed 120 in it is effectively carved into the reaction gas inside reaction chamber 100
Erosion.
As shown in figure 3, a kind of control method of the spray head heating-cooling device for plasma reaction device, the control
Method includes:
S1 is separately turned on multiple second coolings of multiple first coolant ducts 23, cooling structure 3 in heating structure 2
Liquid pipe road 31 cools down heating structure 2.
In the present embodiment, coolant liquid is respectively filled with multiple first coolant ducts 23 and multiple second coolant ducts
31, to carry out circulating cooling to heating structure 2.
S2 opens multiple heaters 21 of heating structure 2 by external control structure.
There is no cross-ventilation heat transfer in vacuum environment of the invention, ring can only be opened up by directly contacting transmitting heat
In corresponding 34 near zone of annular gas slot between 34 post-heater 21 of shape gaseous diffusion cell and the second coolant duct 31
The relatively other abutting positions of capacity of heat transmission are decreased obviously.Inflow gas diffuses to the reaction gas air pressure outside annular gas slot 34
Extremely low only millitorr rank, so not playing influence on capacity of heat transmission substantially.
In the present embodiment, multiple temperature sensors 24 measure the temperature of 2 different location of heating structure respectively, when all temperature
When the temperature of sensor 24 has reached setting value, step S3 is executed；Otherwise multiple heaters 21 continue heating structure 2
Heating is until reach setting value.
S3, after reaction gas is sufficiently mixed by least one second reaction gas passage 32 of cooling structure 3
Multiple first reaction gas passages 22 for being sent into heating structure 2 are heated, and reaction gas is sent into showerhead configuration 1 after heating
Multiple spray air flues 11.
S4, the temperature of 24 real-time measurement of multiple temperature sensors of heating structure 2,2 bottom of heating structure, judges temperature
It whether is more than the threshold temperature set；When being more than, external control structure control adds a heater 21 and stops heating；When not surpassing
It is out-of-date, it adds a heater 21 and works on until reaching the threshold temperature of setting.
In the present embodiment, during heating structure 2 carries out continuous heating, cooling structure 3, multiple first coolant pipes
Road 23 persistently cools down the heating structure 2, since cooling structure 3 can cover institute's having heaters 21, so that this is cold
But structure 3 cools down to 2 part of heating structure being in contact with it, so that the temperature uniformity of heating structure 2 is improved, it is final real
Now the reaction gas for entering multiple first reaction gas passages 22 is sufficiently heated, and it is consistent to reach heating temperature.
It is discussed in detail although the contents of the present invention have passed through above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read above content, for of the invention
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (7)
1. a kind of spray head heating-cooling device for plasma reaction device, the spray head heating-cooling device are set to
At the top of the reaction chamber of ionic reaction device, so that the reaction chamber inner sealing, which is characterized in that the spray head heating-cooling device
Include:
Showerhead configuration, the showerhead configuration are arranged above the reaction chamber, and multiple sprays are provided in the showerhead configuration
Drench air flue；
Heating structure is arranged above the showerhead configuration, and the upper table of the lower surface of heating structure and showerhead configuration
Face contact, the heating structure is interior to be arranged the first coolant duct；
Cooling structure is arranged above the heating structure, and the cooling structure is equipped with the second coolant duct；
First coolant duct and the second coolant duct independent control；The lower surface of the cooling structure adds with this
The upper surface of heat structure mutually fits in fit area, and the fit area includes central area and peripheral region, cooling knot
Further include area of isolation between structure lower surface and heating structure, the area of isolation be located at the central area and peripheral region it
Between, it is equipped at least one annular gas slot in area of isolation and is mutually separated by the lower surface of cooling structure and the upper surface of heating structure
From the annular gas slot communicates with one another with multiple spray air flues in the showerhead configuration；
The heating structure includes multiple heaters: including primary heater, external zones in the central area of the heating structure
It include secondary heater, the primary heater and secondary heater independent control in domain；Multiple annular gas slots can
The heat that the multiple heater generates is conducted in the corresponding annular gas slot.
2. being used for the spray head heating-cooling device of plasma reaction device as described in claim 1, which is characterized in that described
Heating structure includes:
First shell is arranged in the showerhead configuration；
Multiple first reaction gas passages, be respectively separated be arranged in the first shell, and with the multiple spray air flue phase
Perforation；
Multiple first coolant ducts are circumferentially positioned at respectively in the first shell top.
3. being used for the spray head heating-cooling device of plasma reaction device as claimed in claim 2, which is characterized in that described
Open slot is equipped at the top of first shell；The multiple heater, the multiple first reaction gas passage be separately positioned on this
In one housing bottom；In each first coolant duct is circumferentially positioned at the top of the first shell；Each heater
It is arranged in the first shell bottom in a ring；The first shell is made of aluminum material.
4. being used for the spray head heating-cooling device of plasma reaction device as claimed in claim 3, which is characterized in that described
Heating structure also includes: multiple temperature sensors, and multiple temperature sensors, which are respectively separated, to be arranged in first shell bottom, and
It is connect with external control structure.
5. being used for the spray head heating-cooling device of plasma reaction device as claimed in claim 3, which is characterized in that described
Cooling structure includes:
Second shell is arranged in the open slot at the top of the first shell；
Multiple second coolant ducts are respectively separated and are arranged in the second shell；Multiple first coolant pipes
Road and multiple second coolant duct independent controls；
At least one second reaction gas passage is arranged in second shell, and logical with multiple first reaction gas respectively
Road connects.
6. being used for the spray head heating-cooling device of plasma reaction device as claimed in claim 5, which is characterized in that described
Second shell floor space is less than the sectional area of the open slot, greater than the area of the multiple heater covering；The second shell
The multiple heater is completely covered in bottom；The second shell is made of aluminum material.
7. the control method in a kind of claim 1 for the spray head heating-cooling device of plasma reaction device,
It is characterized in that, which includes:
S1 is separately turned on multiple second coolant ducts pair of multiple first coolant ducts in heating structure, cooling structure
The heating structure is cooled down；
S2 opens multiple heaters of the heating structure by external control structure；
S3 is sent into after being sufficiently mixed reaction gas by least one second reaction gas passage of the cooling structure
Multiple first reaction gas passages of the heating structure are heated, and the reaction gas is sent into showerhead configuration after heating
Multiple spray air flues；
Whether S4, the temperature of multiple temperature sensor real-time measurement heating structure bottoms of the heating structure, judge temperature
More than the threshold temperature of setting；When being more than, external control structure controls the multiple heater and stops heating；When being less than
When, the multiple heater works on until reaching the threshold temperature of setting.
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| CN201510985474.0A CN106922071B (en) | 2015-12-25 | 2015-12-25 | A kind of spray head heating-cooling device and method for plasma reaction device |
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| JP6925538B2 (en) * | 2018-08-28 | 2021-08-25 | 株式会社Ｆｕｊｉ | Plasma generator and plasma head cooling method |
| CN112530774B (en) * | 2019-09-17 | 2024-04-05 | 中微半导体设备(上海)股份有限公司 | Plasma processing apparatus |
| CN113804046B (en) * | 2020-06-15 | 2023-10-13 | 拓荆科技股份有限公司 | Low-cost initiative accuse Wen Penlin head |
| CN113136568B (en) * | 2021-04-07 | 2022-10-11 | 拓荆科技股份有限公司 | Energy-saving type active temperature control spray head |
| CN116024555B (en) * | 2023-03-27 | 2023-07-11 | 长鑫存储技术有限公司 | Substrate processing apparatus and method |
| CN118553593B (en) * | 2024-07-24 | 2024-10-29 | 深圳市新凯来工业机器有限公司 | Upper electrode, plasma etching equipment and temperature control method |
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| CN104099584A (en) * | 2013-04-10 | 2014-10-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber and plasma processing equipment |
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