CN106914653A - A kind of cutting processing technique of mobile fingerprint button substrate - Google Patents
A kind of cutting processing technique of mobile fingerprint button substrate Download PDFInfo
- Publication number
- CN106914653A CN106914653A CN201710126732.9A CN201710126732A CN106914653A CN 106914653 A CN106914653 A CN 106914653A CN 201710126732 A CN201710126732 A CN 201710126732A CN 106914653 A CN106914653 A CN 106914653A
- Authority
- CN
- China
- Prior art keywords
- finished product
- semi
- substrate
- processing technique
- fingerprint button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/37—Fibreglass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Push-Button Switches (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of cutting processing technique of mobile fingerprint button substrate, the evenly distributed front for having multiple fingerprint chip monomers, substrate is provided with baking vanish layer on described substrate, and step of the invention includes：Pretreatment, clamping, first time CNC processing, second CNC processing, cleaning, drying, deprotection film, inspection and patch protecting film；Instant invention overcomes the shortcoming high of the easy avalanche of one side with baking vanish, percent defective when cutting mobile fingerprint button in the prior art, the outline of the mobile fingerprint button processed using a kind of cutting processing technique of mobile fingerprint button substrate of the invention is neat, finish is good, high in machining efficiency, with low cost, easy operation, meet design requirement, and percent defective is low.
Description
【Technical field】
The present invention relates to a kind of cutting processing technique of mobile fingerprint button substrate.
【Background technology】
With the development of fingerprint identification technology, fingerprint recognition unlocking function has become cell-phone function part, existing hand
In the processing technology of machine fingerprint button, first multiple mobile fingerprint chips are equably integrated on glass substrate, referred to improve
The wearability of line button or the texture of raising mobile fingerprint button, paint baking is done in glass front side of matrix, i.e. press surface, because
The hard fragility of baking vanish material, when mobile fingerprint button is cut down from substrate, there is the easy avalanche of one side of baking vanish layer, makes to cut
The profile out-of-flatness cut, reduces crudy, and percent defective is high, causes high cost.
The present invention is to research and propose in view of the shortcomings of the prior art.
【The content of the invention】
The technical problem to be solved in the present invention is to provide a kind of cutting processing technique of mobile fingerprint button substrate, overcomes
The shortcoming of the easy avalanche of one side with baking vanish, makes the mobile fingerprint for processing when cutting mobile fingerprint button in the prior art
The profile of button is smooth, bright and clean, meets design requirement, and percent defective is low.
In order to solve the above technical problems, a kind of cutting processing technique of mobile fingerprint button substrate of the invention, described
The evenly distributed front for having multiple fingerprint chip monomers, substrate is provided with baking vanish layer on substrate, and the wherein thickness of substrate is h1, baking vanish
The thickness of layer is h2, and the present invention includes that pretreatment, clamping, first time CNC processing, second CNC are processed, cleaned, drying up, going to protect
Cuticula, inspection and patch protecting film, concrete operation step are as follows：
A) pre-process：The diaphragm that thickness is h3 is sticked respectively in the front and back of substrate, obtains semi-finished product a；
B) clamping：By on the face-up and clamping of semi-finished product a to the workbench of CNC machine；
C) first time CNC processing：First time milling, first time milling are carried out to semi-finished product a using cutter A according to design drawing
Depth is cut for d1, d1 meets：H2+h3≤d1≤h2+h3+0.004mm, obtains semi-finished product b；
D) second CNC processing：Second milling, second milling are carried out to semi-finished product b using cutter B according to design drawing
Depth is cut for d2, d2 meets：H1+h2+h3≤d1 ＜ h1+h2+2h3, obtain semi-finished product c；
E) clean：Semi-finished product b is cleaned, semi-finished product d is obtained；
F) dry up：Semi-finished product d is dried up using dry gases at high pressure, when semi-finished product e；
G) film is deprotected：By the diaphragm removal of the front and back patch in semi-finished product e, semi-finished product f is obtained；
H) check：Semi-finished product f is detected according to test stone, finished product g is obtained after detection is qualified；
I) protecting film is pasted：Protecting film is pasted to finished product g.
A kind of cutting processing technique of mobile fingerprint button substrate as described above, uses plastic sealing machine in described step a
Substrate (1) to sticking diaphragm (4) carries out bubble and processes, the thickness h 3 of diaphragm used meet 0.06mm≤h3≤
0.1mm。
A kind of cutting processing technique of mobile fingerprint button substrate as described above, is inhaled in described step b using vacuum
Disk carries out clamping to semi-finished product a.
A kind of cutting processing technique of mobile fingerprint button substrate as described above, described step c and step d are in processing
During carry out misting cooling.
A kind of cutting processing technique of mobile fingerprint button substrate as described above, uses pure water in described step e
Semi-finished product b is cleaned.
Compared with prior art, instant invention overcomes the one side with baking vanish when cutting mobile fingerprint button in the prior art
Easy avalanche, percent defective shortcoming high, are processed using a kind of cutting processing technique of mobile fingerprint button substrate of the invention
Come mobile fingerprint button outline it is neat, finish is good, high in machining efficiency, with low cost, easy operation, meet design will
Ask, and percent defective is low.
【Brief description of the drawings】
Specific embodiment of the invention is described in further detail below in conjunction with the accompanying drawings, wherein：
Fig. 1 is the front schematic view of the substrate that fingerprint recognition chip is integrated with the present invention.
Fig. 2 is the schematic rear view of the substrate that fingerprint recognition chip is integrated with the present invention.
Fig. 3 is the explosive view of the semi-finished product a obtained after step a is pre-processed.
Fig. 4 is the partial sectional view of the semi-finished product a obtained after step a is pre-processed.
Fig. 5 is the structural representation that step i pastes the finished product g obtained after protecting film.
【Specific embodiment】
Embodiments of the present invention are elaborated below in conjunction with the accompanying drawings.
As shown in Figures 1 to 5, the cutting processing technique of a kind of mobile fingerprint button substrate in the present embodiment, on substrate 1
The evenly distributed front for having multiple fingerprint chip monomers 2, substrate 1 is provided with baking vanish layer 3, and the wherein thickness of substrate is h1, baking vanish layer 3
Thickness be h2, it is characterised in that comprise the following steps：
A) pre-process：The diaphragm 4 that thickness is h3 is sticked respectively in the front and back of substrate 1, obtains semi-finished product a；
B) clamping：By on the face-up and clamping of semi-finished product a to the workbench of CNC machine；
C) first time CNC processing：First time milling, first time milling are carried out to semi-finished product a using cutter A according to design drawing
Depth is cut for d1, d1 meets：H2+h3≤d1≤h2+h3+0.004mm, obtains semi-finished product b；
D) second CNC processing：Second milling, second milling are carried out to semi-finished product b using cutter B according to design drawing
Depth is cut for d2, d2 meets：H1+h2+h3≤d1 ＜ h1+h2+2h3, obtain semi-finished product c；
E) clean：Semi-finished product b is cleaned, semi-finished product d is obtained；
F) dry up：Semi-finished product d is dried up using dry gases at high pressure, when semi-finished product e；
G) film is deprotected：By diaphragm (4) removal of the front and back patch in semi-finished product e, semi-finished product f is obtained；
H) check：Semi-finished product f is detected according to test stone, finished product g is obtained after detection is qualified；
I) protecting film is pasted：Protecting film 5 is pasted to finished product g.
Bubble is carried out in step a to the substrate 1 for sticking diaphragm 4 using plastic sealing machine to process, the thickness of diaphragm used
Degree h3 meets 0.06mm≤h3≤0.1mm.
Clamping is carried out to semi-finished product a using vacuum cup in step b, it is convenient, efficient.
Step c and step d in process, pure water will be atomized as obtained in water purification machine, as cooling medium,
In process, wherein the rotating speed of CNC machine is n, and n meets 10000r/min≤n≤18000r/min；CNC machine is cut
Speed is cut for v, v meets 200mm/min≤v≤1000mm/min.
In order to prevent during cleaning, the mineral element in water is aoxidized to mobile fingerprint button, therefore using pure in step e
Water is cleaned to semi-finished product b.
Claims (5)
1. a kind of cutting processing technique of mobile fingerprint button substrate, evenly distributed on described substrate (1) to have multiple fingerprint cores
Piece monomer (2), the front of substrate (1) is provided with baking vanish layer (3), and the wherein thickness of substrate is h1, and the thickness of baking vanish layer (3) is h2,
It is characterized in that comprising the following steps：
A) pre-process：The diaphragm (4) that thickness is h3 is sticked respectively in the front and back of substrate (1), obtains semi-finished product a；
B) clamping：By on the face-up and clamping of semi-finished product a to the workbench of CNC machine；
C) first time CNC processing：First time milling, first time milling depth are carried out to semi-finished product a using cutter A according to design drawing
It is d1 to spend, and d1 meets：H2+h3≤d1≤h2+h3+0.004mm, obtains semi-finished product b；
D) second CNC processing：Second milling, second milling depth are carried out to semi-finished product b using cutter B according to design drawing
It is d2 to spend, and d2 meets：H1+h2+h3≤d1 ＜ h1+h2+2h3, obtain semi-finished product c；
E) clean：Semi-finished product b is cleaned, semi-finished product d is obtained；
F) dry up：Semi-finished product d is dried up using dry gases at high pressure, when semi-finished product e；
G) film is deprotected：By diaphragm (4) removal of the front and back patch in semi-finished product e, semi-finished product f is obtained；
H) check：Semi-finished product f is detected according to test stone, finished product g is obtained after detection is qualified；
I) protecting film is pasted：Protecting film (5) is pasted to finished product g.
2. the cutting processing technique of a kind of mobile fingerprint button substrate according to claim 1, it is characterised in that：Described
Bubble is carried out in step a to the substrate (1) for sticking diaphragm (4) using plastic sealing machine to process, the thickness h 3 of diaphragm used
Meet 0.06mm≤h3≤0.1mm.
3. the cutting processing technique of a kind of mobile fingerprint button substrate according to claim 1, it is characterised in that：Described
Clamping is carried out to semi-finished product a using vacuum cup in step b.
4. the cutting processing technique of a kind of mobile fingerprint button substrate according to claim 1, it is characterised in that：Described
Step c and step d carry out misting cooling in process.
5. the cutting processing technique of a kind of mobile fingerprint button substrate according to claim 1, it is characterised in that：Described
Semi-finished product b is cleaned using pure water in step e.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126732.9A CN106914653B (en) | 2017-03-06 | 2017-03-06 | A kind of cutting processing technique of mobile fingerprint key substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126732.9A CN106914653B (en) | 2017-03-06 | 2017-03-06 | A kind of cutting processing technique of mobile fingerprint key substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106914653A true CN106914653A (en) | 2017-07-04 |
| CN106914653B CN106914653B (en) | 2019-09-20 |
Family
ID=59462029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710126732.9A Active CN106914653B (en) | 2017-03-06 | 2017-03-06 | A kind of cutting processing technique of mobile fingerprint key substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106914653B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076069A (en) * | 2019-03-20 | 2019-08-02 | 江西合力泰科技有限公司 | A kind of spraying method of fingerprint module chip |
| CN111451690A (en) * | 2020-04-26 | 2020-07-28 | 遵义宏港机械有限公司 | Power supply frame clamping device and using method thereof |
| CN113500653A (en) * | 2021-07-13 | 2021-10-15 | 深圳市光千合新材料科技有限公司 | Cutting processing equipment of cell-phone fingerprint button base plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201168813Y (en) * | 2007-12-28 | 2008-12-24 | 肖衍盛 | Numerical control carve-milling machine |
| CN102310355A (en) * | 2011-09-16 | 2012-01-11 | 天津市中环高科技有限公司 | Processing technique for special-shaped glass lens of mobile phone |
| CN102432198A (en) * | 2011-09-15 | 2012-05-02 | 天津市中环高科技有限公司 | Technology for minimizing scratch of touch screen glass optical lenses after molding |
| CN202276378U (en) * | 2011-10-24 | 2012-06-13 | 赫比（上海）通讯科技有限公司 | CNC milled integrated cell phone component |
| US20130157729A1 (en) * | 2011-12-16 | 2013-06-20 | Joseph Akwo Tabe | Energy harvesting computer device in association with a communication device configured with apparatus for boosting signal reception |
| CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
-
2017
- 2017-03-06 CN CN201710126732.9A patent/CN106914653B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201168813Y (en) * | 2007-12-28 | 2008-12-24 | 肖衍盛 | Numerical control carve-milling machine |
| CN102432198A (en) * | 2011-09-15 | 2012-05-02 | 天津市中环高科技有限公司 | Technology for minimizing scratch of touch screen glass optical lenses after molding |
| CN102310355A (en) * | 2011-09-16 | 2012-01-11 | 天津市中环高科技有限公司 | Processing technique for special-shaped glass lens of mobile phone |
| CN202276378U (en) * | 2011-10-24 | 2012-06-13 | 赫比（上海）通讯科技有限公司 | CNC milled integrated cell phone component |
| US20130157729A1 (en) * | 2011-12-16 | 2013-06-20 | Joseph Akwo Tabe | Energy harvesting computer device in association with a communication device configured with apparatus for boosting signal reception |
| CN103763859A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Machining method for printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076069A (en) * | 2019-03-20 | 2019-08-02 | 江西合力泰科技有限公司 | A kind of spraying method of fingerprint module chip |
| CN111451690A (en) * | 2020-04-26 | 2020-07-28 | 遵义宏港机械有限公司 | Power supply frame clamping device and using method thereof |
| CN111451690B (en) * | 2020-04-26 | 2023-04-18 | 遵义宏港机械有限公司 | Power supply frame clamping device and using method thereof |
| CN113500653A (en) * | 2021-07-13 | 2021-10-15 | 深圳市光千合新材料科技有限公司 | Cutting processing equipment of cell-phone fingerprint button base plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106914653B (en) | 2019-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105034182B (en) | Machining method for ultra-thin sapphire flaky bodies | |
| CN107244812B (en) | Secondary-strength toughened glass film and manufacturing method thereof | |
| CN105728807B (en) | The processing method of thin-walled parts | |
| CN106914653A (en) | A kind of cutting processing technique of mobile fingerprint button substrate | |
| US10029941B2 (en) | Machining methods of forming laminated glass structures | |
| CN101166404A (en) | Metal shell and its making method | |
| CN104708724A (en) | Sapphire diaphragm producing technology | |
| CN103921068A (en) | Single-curvature cover machining method | |
| CN106625035A (en) | Method for processing 3D zirconia ceramic used for mobile phone rear cover | |
| CN108237442B (en) | Processing technology of ultrathin ceramic fingerprint identification sheet | |
| CN108020774B (en) | Method for removing layer of small sample | |
| CN109849201A (en) | A kind of wafer splitting device and its method | |
| CN117260996A (en) | Method for processing semiconductor silicon carbide | |
| CN105538047B (en) | A kind of surface polishing method of the organic transparent products of aviation | |
| CN203957180U (en) | A kind of separated vacuum chuck | |
| CN110524361B (en) | Step-shaped glass with special-shaped frame and manufacturing process thereof | |
| CN105108608B (en) | Hard brittle material super-smooth surface adaptive machining method | |
| CN100506483C (en) | Slice sticking method for hard brittle crystal thin substrate grinding and polishing | |
| CN211163563U (en) | Reusable silicon wafer chamfering and edging grinding wheel | |
| JP2005001059A (en) | Polishing laminate | |
| CN112207635A (en) | Multidirectional wire drawing process for notebook aluminum shell | |
| TWI224832B (en) | Process for machining a wafer-like workpiece | |
| CN115396538B (en) | Preparation method of flash sand glass mobile phone rear cover | |
| CN107866699A (en) | Mobile phone battery cover surface treatment method | |
| CN115139694B (en) | Technological method for machine carving hardware fitting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190902 Address after: 528437 Guangdong city of Zhongshan Province along the Yangtze River Road No. 13 national health base of Yu Park Applicant after: Zhong Shanxinhui microtechnic limited company Address before: 528437 Cuilan Road 41, Cuiheng New District, Zhongshan City, Guangdong Province Applicant before: Zhongshan Xinhui Precision Technology Co., Ltd. |
|
| TA01 | Transfer of patent application right |