CN106910718B - Packaging structure and display screen - Google Patents
Packaging structure and display screen Download PDFInfo
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- CN106910718B CN106910718B CN201710115053.1A CN201710115053A CN106910718B CN 106910718 B CN106910718 B CN 106910718B CN 201710115053 A CN201710115053 A CN 201710115053A CN 106910718 B CN106910718 B CN 106910718B
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- cover plate
- package
- reinforcing
- cover
- packaging structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Abstract
The invention provides a packaging structure and a packaging structure of a display screen. The package cover plate is provided with a first surface and a second surface opposite to the first surface, the substrate is positioned on the first surface of the package cover plate, and the reinforcing cover plate covers the second surface of the package cover plate. Namely, the reinforcing cover plate can effectively relieve or even avoid external pressure acting on the packaging cover plate, so that the probability of damage of the packaging cover plate can be reduced, and the packaging structure has better damage resistance. Therefore, when the packaging structure is applied to an electronic device, the mechanical strength of the electronic device can be correspondingly improved, so that the electronic device can be normally used even under a high-pressure environment.
Description
Technical Field
The invention relates to the technical field of display, in particular to a packaging structure and a display screen comprising the same.
Background
In the manufacturing process of the display, after the related processes of the display panel are completed, the display panel is further packaged to connect corresponding circuits and the like and protect the display screen. Therefore, the packaged structure needs to have certain mechanical strength to resist the external force to damage the packaged structure, so as to ensure that the display screen can work normally; and the display panel has the capability of resisting water vapor and oxidation so as to avoid the influence on the performance of the display panel caused by oxidation or corrosion.
Fig. 1 is a schematic diagram of a conventional package structure, as shown in fig. 1, the conventional package structure generally includes a display panel 11 and a package cover 12, wherein the package cover 12 covers one side of the display panel 11. In order to ensure the mechanical strength of the package structure, a destructive test is usually performed on the package structure, which generally uses a push head 20 to apply a certain force to the package cover 12 of the package structure, so as to determine whether the mechanical strength of the package structure meets the requirement according to whether the package cover 12 is damaged under the specified force; and confirming the damage resistance of the packaging structure according to the maximum acting force which can be borne by the packaging structure.
However, as the display screen is gradually thinned and the application field of the display screen is continuously widened, for example, when the display screen is applied to a high-pressure underwater environment, the packaging structure of the display screen is required to have higher damage resistance, and therefore, it is important to improve the mechanical strength of the packaging structure.
Disclosure of Invention
The invention aims to provide a packaging structure, which aims to solve the problems that the existing packaging structure is insufficient in mechanical strength and is easy to damage in a high-pressure environment.
In order to solve the above technical problem, the present invention provides a package structure, which includes a substrate and a package cover plate, wherein the package cover plate has a first surface and a second surface opposite to the first surface, the substrate is located on the first surface of the package cover plate, and the package structure further includes a reinforcing cover plate covering the second surface of the package cover plate.
Optionally, the package cover further has at least one third surface, the third surface connects the first surface and the second surface, and the reinforcing cover covers the second surface and extends onto at least one of the third surfaces.
Optionally, a gap is provided between the reinforcing cover plate and the encapsulation cover plate.
Optionally, the reinforcing cover plate is provided with a groove on a second surface facing the encapsulation cover plate.
Optionally, a gap between the reinforcing cover plate and the encapsulation cover plate is 0.05mm-0.15 mm.
Optionally, the package cover plate and the reinforcing cover plate are bonded by a sealing adhesive. The sealant can be hot-melt water-resistant adhesive.
Optionally, the reinforcing cover plate is made of aluminum magnesium alloy.
Optionally, the thickness of the reinforcing cover plate is 0.1mm-0.3 mm.
It is still another object of the present invention to provide a display panel having the above-mentioned packaging structure, which has better damage resistance, so that the display panel can be applied in a high-voltage environment. Wherein, the substrate is a display panel.
In the packaging structure provided by the invention, the packaging cover plate is also covered with the reinforcing cover plate, and the reinforcing cover plate can effectively relieve or even prevent external pressure from acting on the packaging cover plate, so that the probability of damage of the packaging cover plate caused by external force can be reduced. That is, in the package structure of the present invention, the compressive strength of the package cover plate is not directly improved by improving the mechanical strength of the package cover plate, so that the related process and parameters of the package cover plate are not required to be adjusted, and the process stability is ensured. Further, the material of encapsulation apron is almag to usable almag has advantages such as the quality is light, compressive resistance is stronger, makes whole packaging structure only need increase less volume and weight, can effectively improve packaging structure's compressive property. Furthermore, a gap can be arranged between the reinforcing cover plate and the packaging cover plate to form a hollow structure, so that the buffer effect of the reinforcing cover plate on external acting force can be improved through the hollow structure. When the packaging structure provided by the invention is applied to the packaging structure of the display screen, the display screen has better mechanical strength on the basis of better waterproof performance, so that the formed display is suitable for high-pressure diving environments.
Drawings
Fig. 1 is a schematic diagram of a conventional package structure;
FIG. 2 is a diagram of a package structure according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a substrate and a package cover plate of the package structure according to the embodiment of the invention;
fig. 4 is a schematic structural diagram of a reinforcing cover plate of a package structure according to an embodiment of the invention.
Detailed Description
As described in the background art, in order to widen the application fields of various electronic devices having a package structure, it is necessary to further improve the mechanical strength of the package structure. The existing packaging structure is limited by the mechanical strength, so that the packaging structure cannot be used in some high-pressure environments. Fig. 1 shows a package structure of a display panel, in which a display panel 11 and a package cover 12 are usually made of glass. During destructive testing of the package structure shown in fig. 1, the package cover 12 is broken when the pusher 20 is applied to the package cover 12 with a force of about 100N. That is, the maximum pressure that the cover plate 12 can withstand is about 0.221Mpa, and the underwater pressure within the range of 10m to 60m underwater is about 0.5Mpa to 0.6 Mpa. Therefore, the packaging structure shown in fig. 1 cannot meet the requirements of underwater operation, and needs to have higher compression resistance by further improving the mechanical strength of the packaging structure, so as to achieve the purpose of being used in a high-pressure environment.
In contrast, the current practice is to increase the thickness of the package cover plate to improve the mechanical strength of the package structure. However, the thickness of the package cover plate can be increased only by a limited amount under the condition of the specified thickness of the product, so that the predetermined pressure-resistant requirement can not be met within the specified thickness. In addition, if the mechanical properties of the package cover plate are improved by changing the material of the package cover plate, the bonding effect between the package cover plate and the display panel made of different materials may be poor, and the overall performance of the package structure is affected.
To this end, the present invention provides a package structure comprising: the packaging cover plate is provided with a first surface and a second surface opposite to the first surface, and the substrate is positioned on the first surface of the packaging cover plate; and the packaging structure also comprises a reinforcing cover plate, and the reinforcing cover plate covers the second surface of the packaging cover plate.
That is, in the package structure of the present invention, a reinforcing cover plate is further disposed on a side of the package cover plate away from the substrate, and the reinforcing cover plate can further protect the package cover plate to prevent the package cover plate from directly receiving an external acting force, so that when the package structure receives a large external acting force, the probability of breakage of the package cover plate can be effectively reduced, and the package structure of the substrate can work.
The package structure and the package structure of the display panel according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Fig. 2 is a schematic diagram of a package structure in an embodiment of the present invention, and as shown in fig. 2, the package structure includes: a substrate 110, a package cover 120 and a reinforcement cover 130.
Fig. 3 is a schematic structural diagram of a substrate and a package cover plate of a package structure in an embodiment of the invention, and referring to fig. 2 and 3, the package cover plate 120 has a first surface 121 and a second surface 122 opposite to the first surface 121, and the substrate 110 is located on the first surface 121 of the package cover plate 120. The reinforcing cover plate 130 covers the second surface 122 of the package cover plate 120, so that when the package structure is under the action of an external force, the package cover plate 120 is protected by the reinforcing cover plate 130 to avoid directly receiving the action of the external force, even not receiving the action of the external force, and thus, the integrity of the package cover plate 120 can be effectively ensured, so as to ensure that the package structure can normally work.
Further, the substrate 110 may be a display panel, that is, the corresponding package structure is a package structure of a display screen. The display panel 110 has a light emitting side 111a and a non-light emitting side 111b opposite to the light emitting side 111a, and the non-light emitting side 111b is attached to the cover plate 120. In addition, the display panel 110 can be further divided into a display area 112a and a non-display area 112b in a direction parallel to the surface thereof. In this embodiment, the substrate 110 is rectangular, but in other embodiments, the substrate 110 may also be circular or other irregular shapes, which is not limited herein.
As shown in fig. 2, in the present embodiment, the package cover plate 120 covers the display area 112a of the non-light emitting side 111b of the substrate 110 and exposes the non-display area 112b of the substrate 110, where the non-display area 112b may be used to package a driving chip and the like in the following. Specifically, the encapsulation cover plate 120 and the substrate 110 can be fixedly attached by glass cement, and the encapsulation cover plate 120 and the substrate 110 can be attached by glass cement, so that the sealing property between the encapsulation cover plate 120 and the substrate 110 can be effectively ensured, water vapor and the like can be prevented from entering, and the encapsulation structure can be prevented from being oxidized or corroded.
With continued reference to fig. 3, the package cover 120 further has at least one third surface 123, and the third surface 123 connects the first surface 121 and the second surface 122. In this embodiment, the package cover 120 may also be a rectangular structure having four third surfaces 123, and the four third surfaces 123 form four sidewalls of the package cover 120.
In a preferred embodiment, the reinforcing cover 130 covers the second surface 122 of the encapsulating cover 120 and extends to at least one of the third surfaces 123. Referring to fig. 1, when performing destructive testing on the package structure, the inventors found that the damaged area of the package cover plate mainly occurs at the edge area 12a of the package cover plate, because the edge area of the package cover plate 120 is subjected to a larger force when being subjected to an external force, and thus the damage is very likely to occur. Based on this, the reinforcing cover 130 in this embodiment further extends to the third surface 123 of the package cover 120 to completely cover the edge region of the package cover 120, so as to improve the protection of the edge region of the package cover 120.
Fig. 4 is a schematic structural diagram of a reinforcing cover plate of a package structure according to an embodiment of the invention, and referring to fig. 2 and 4, a shape of the reinforcing cover plate 130 matches a shape of the package cover plate 120, and the reinforcing cover plate can completely cover the second surface 122 of the package cover plate 120. In this embodiment, the reinforcing cover 130 extends from the second surface 122 of the package cover 120 to three third surfaces 123 thereof, wherein the package cover 120 is not covered with the reinforcing cover 130 on the third surface 123 close to the non-display area 112b of the display panel 110, so that the protection strength of the package cover can be improved and the influence on the subsequent package can be avoided. That is, the reinforcing cover 130 has a top plate 131 facing the second surface 122 of the sealing cover 120, and three side plates 132 extending from the top plate 131 to the third surface 123 of the sealing cover 120, wherein the three side plates 132 are perpendicular to the top plate 131 in this embodiment.
Preferably, a gap is further disposed between the reinforcing cover plate 130 and the sealing cover plate 120 to form a hollow structure, so that when the reinforcing cover plate 130 is subjected to an external pressure, the pressure can be effectively relieved through the hollow structure, and the external pressure can be prevented from acting on the sealing cover plate 120, thereby ensuring that the sealing cover plate 120 is not damaged. Referring to fig. 4, the reinforcing cover 130 is provided with a groove 131a on a partial region facing the second surface 122 of the sealing cover 120, so that the hollow structure can be formed through the groove 131 a. That is, the groove 131a is located on the top plate 131 of the reinforcing cover 130. In this embodiment, the shape of the groove 131a is rectangular, but in other embodiments, the shape of the groove 131a may also be correspondingly configured according to the shape of the package cover 120, for example, it may be circular, oval, or trapezoidal, as long as the groove 131a is located in the upper region of the second surface 122 of the package cover 120, so that a gap is formed between the package cover 120 and the reinforcing cover 130. Specifically, the gap between the reinforcing cover 120 and the sealing cover 130 is preferably 0.05mm to 0.15 mm.
In addition, in this embodiment, the package cover plate 120 and the reinforcement cover plate 130 may be bonded and fixed by a sealant 140, and the sealant 140 may be a hot-melt water-blocking adhesive, so as to ensure a strong adhesive strength and a good sealing property, such as a glass adhesive. That is, since the substrate 110 and the encapsulation cover plate 120 are bonded by glass cement, the encapsulation cover plate 120 and the reinforcement cover plate 130 are also bonded by glass cement, so that the encapsulation structure has better waterproof performance, and thus, the encapsulation structure can be applied to underwater operation. As shown in fig. 1 to fig. 4, the sealant 140 is coated on the top plate 131 of the reinforcing cover plate 130, and then the reinforcing cover plate 130 is attached to the package cover plate 120, so that the reinforcing cover plate 130 is attached and fixed to the package cover plate 120.
Further, the material of the reinforcing cover 130 is preferably an aluminum magnesium alloy. Because almag has advantages such as the quality is light, density is low, the thermal diffusivity is better, crushing resistance is stronger, fully satisfies the highly integrated, frivolous, miniaturized, anti falling of 3C product and hits and electromagnetic shield and radiating requirement, consequently, is being applied to packaging structure with it, can make whole packaging structure only need increase less volume and weight, can effectively improve packaging structure's compressive property. Specifically, the thickness of the reinforcing cover 130 may be, for example, 0.1mm to 0.3 mm.
Referring to fig. 2, in the present embodiment, the reinforcing cover 130 further extends from the third surface 123 of the package cover 120 to the side surface of the substrate 110 and covers the sidewall of the substrate 110, so that the protection performance of the reinforcing cover 130 can be further improved.
As described above, the package structure provided by the present invention can be applied to a package structure of a display panel, that is, the substrate is a display panel. Accordingly, the display screen with the packaging structure also has better mechanical strength, so that the display screen containing the packaging structure can also be applied to high-pressure environments, such as high-pressure underwater environments.
In summary, in the package structure provided by the present invention, the mechanical strength of the package structure is further enhanced by the reinforcing cover plate, so that the package structure has better damage resistance. Compared with the prior art for improving the mechanical strength of the packaging structure, the invention does not need to change the related process and parameters of the original packaging cover plate, ensures the process stability of the packaging structure and avoids influencing the original performance of the packaging structure. Therefore, when the packaging structure is applied to a corresponding electronic device, the mechanical strength of the electronic device can be effectively improved, so that the application field of the electronic device can be widened, and the purpose of using the packaging structure under a high-pressure water environment can be achieved.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (7)
1. A package structure, comprising a substrate and a package cover plate, the package cover plate having a first surface and a second surface opposite to the first surface, the substrate being located on the first surface of the package cover plate, characterized in that the package structure further comprises a reinforcement cover plate, the reinforcement cover plate covering the second surface of the package cover plate, and the reinforcement cover plate having a groove on the surface facing the package cover plate, so that a gap is provided between the reinforcement cover plate and the package cover plate; the base plate is a display panel and is provided with a light-emitting side and a non-light-emitting side, the packaging cover plate and the reinforcing cover plate are both located on the non-light-emitting side of the display panel, and the reinforcing cover plate is made of aluminum magnesium alloy.
2. The package structure of claim 1, wherein the package cover further has at least one third surface, the third surface connecting the first surface and the second surface, the stiffening cover covering the second surface and extending onto the at least one third surface.
3. The package structure of claim 1, wherein a gap between the reinforcement cover and the package cover is 0.05mm to 0.15 mm.
4. The package structure of claim 1, wherein the package cover and the reinforcement cover are bonded by a sealing adhesive.
5. The package structure of claim 4 wherein the sealant is a hot melt water resistant adhesive.
6. The package structure of claim 1, wherein the reinforcing cover plate has a thickness of 0.1mm to 0.3 mm.
7. A display screen, comprising the encapsulation structure according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710115053.1A CN106910718B (en) | 2017-02-28 | 2017-02-28 | Packaging structure and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710115053.1A CN106910718B (en) | 2017-02-28 | 2017-02-28 | Packaging structure and display screen |
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| Publication Number | Publication Date |
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| CN106910718A CN106910718A (en) | 2017-06-30 |
| CN106910718B true CN106910718B (en) | 2020-07-31 |
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| CN201710115053.1A Active CN106910718B (en) | 2017-02-28 | 2017-02-28 | Packaging structure and display screen |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600204A (en) * | 2014-12-26 | 2015-05-06 | 深圳市华星光电技术有限公司 | OLED package structure and OLED packaging method |
| CN104820820A (en) * | 2015-03-06 | 2015-08-05 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification apparatus touch control screen and terminal device |
| CN105677072A (en) * | 2014-11-20 | 2016-06-15 | 宸鸿科技(厦门)有限公司 | Touch panel and touch display equipment thereof |
| CN105976724A (en) * | 2015-03-10 | 2016-09-28 | 三星显示有限公司 | Display apparatus and portable terminal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100667358B1 (en) * | 2004-02-04 | 2007-01-12 | 엘지전자 주식회사 | Electro-luminescence display device |
| KR100729084B1 (en) * | 2006-09-21 | 2007-06-14 | 삼성에스디아이 주식회사 | Organic light emitting diode |
-
2017
- 2017-02-28 CN CN201710115053.1A patent/CN106910718B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105677072A (en) * | 2014-11-20 | 2016-06-15 | 宸鸿科技(厦门)有限公司 | Touch panel and touch display equipment thereof |
| CN104600204A (en) * | 2014-12-26 | 2015-05-06 | 深圳市华星光电技术有限公司 | OLED package structure and OLED packaging method |
| CN104820820A (en) * | 2015-03-06 | 2015-08-05 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification apparatus touch control screen and terminal device |
| CN105976724A (en) * | 2015-03-10 | 2016-09-28 | 三星显示有限公司 | Display apparatus and portable terminal |
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| CN106910718A (en) | 2017-06-30 |
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Address after: 215300, 188, Feng Feng Road, Kunshan hi tech Zone, Suzhou, Jiangsu, Kunshan Patentee after: Suzhou Qingyue Photoelectric Technology Co., Ltd Address before: 215300, 188, Feng Feng Road, Kunshan hi tech Zone, Kunshan, Suzhou, Jiangsu, Jiangsu Patentee before: Kunshan Visionox Technology Co.,Ltd. |