CN106910700A - The printing transferring method of transfer device and electronic device - Google Patents
The printing transferring method of transfer device and electronic device Download PDFInfo
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- CN106910700A CN106910700A CN201710138193.0A CN201710138193A CN106910700A CN 106910700 A CN106910700 A CN 106910700A CN 201710138193 A CN201710138193 A CN 201710138193A CN 106910700 A CN106910700 A CN 106910700A
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- transfer head
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- target devices
- transfer device
- release conditions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention discloses a kind of transfer device and the printing transferring method of electronic device, the transfer device includes：Transfer head substrate；At least one transfer head, transfer head is connected with transfer head substrate and extends towards the direction away from transfer head substrate, transfer head is convertible between seized condition and release conditions, and size when the free end of the transfer head at least one direction of transfer head is in seized condition is more than the size in release conditions.Transfer device according to embodiments of the present invention, the free end of transfer head is arranged to the form of variable dimension, in that context it may be convenient to crawl and release target devices, so as to realize the crawl and release of target devices.
Description
Technical field
The present invention relates to electronic circuit manufacturing technology field, more particularly to a kind of transfer device and using this transfer device
Transfer the printing transferring method of electronic device.
Background technology
Many semiconductor devices, such as LED, microlaser are all based on single-crystal semiconductor material and are made, and single
The growth of brilliant semi-conducting material has very strict requirements for substrate, and the single-crystal semiconductor material of growth must be with substrate lattice
Match somebody with somebody, can otherwise influence the property of semi-conducting material.So, semiconductor devices has stronger selectivity for substrate, it is general this
Kind substrate is smaller, and because the influence of material and subsequent technique is not suitable for driving and integrated circuit, has a strong impact on and partly lead
The integrated of body device is used.Transfer technique is that the semiconductor devices that will be grown in initial substrates is transferred in target substrate, and
And in target substrate or have integrated circuit or can conveniently carry out making integrated circuit, so, semiconductor devices can be obtained more
It is widely applied.
The content of the invention
It is contemplated that at least solving one of technical problem in correlation technique to a certain extent.Therefore, of the invention
One purpose is to propose a kind of transfer device, can be diverted the aim device by the reversible deformation of transfer head.
The invention also discloses a kind of transfer method of target devices.
Transfer device according to embodiments of the present invention, including：Transfer head substrate；At least one transfer head, the transfer head
It is connected with the transfer head substrate and extends towards the direction away from the transfer head substrate, the transfer head is in seized condition and releases
Put convertible between state, and in the free end of the transfer head at least one direction of the transfer head described
Size during seized condition is more than the size in the release conditions.
Transfer device according to embodiments of the present invention, the free end of transfer head is arranged to the form of variable dimension, can be with
Convenient crawl and release target devices, so as to realize the crawl and release of target devices.
In addition, transfer device according to the above embodiment of the present invention, can also have following additional technical characteristic：
In some embodiments of the invention, the transfer head is configured at least one in the air pressure of basis, humidity
Changed between seized condition and release conditions.
In some embodiments of the invention, Packed gas filled cavity, and the gas are formed in the transfer head
Filled cavity has for being inflated to the gas filled cavity and filling aspirating hole, the transfer head from gas filling chamber pumping
It is configured to be suitable to changed between seized condition and release conditions according to the air pressure in the gas filled cavity.
In some embodiments of the invention, it is formed with annular seal space, and the annular seal space in the transfer head and is filled with
Gas with predetermined pressure, the transfer head is suitable to be turned between seized condition and release conditions according to the change of ambient pressure
Change.
Further, the annular seal space includes the bubble being formed in the transfer head.
In some embodiments of the invention, at least a portion of the transfer head is by water swelling and the material of syneresis
Material is made, and the transfer head is changed according to the change of ambient humidity between seized condition and release conditions.
Further, the transfer head is made up of water-absorbing resin.
Advantageously, it is formed with the gap being in communication with the outside in the transfer head.
In some embodiments of the invention, the transfer head is connected and to downward with the bottom surface of the transfer head substrate
Stretch.
In some embodiments of the invention, in the freedom of the transfer head on each direction of the transfer head
The size in the seized condition is held more than the size in the release conditions.
The printing transferring method of electronic device according to embodiments of the present invention, including foregoing transfer device, it is characterised in that institute
Stating printing transferring method includes：S1, the transfer device moves to relative with the initial substrates for being placed with target devices, and makes described turning
The transfer head in release conditions that printing equipment is put is stretched into the transfer groove of the target devices；S2, the transfer device it is described
Transfer head is changed to the seized condition makes the transfer head compress at least a portion of the inner peripheral surface of the transfer groove, and makes institute
Target devices are stated to be separated with the initial substrates；S3, the transfer device is moved to and the mesh for placing the target devices
Mark substrate is relative, and the target devices are positioned over into precalculated position, and the transfer device is changed to release conditions and discharges institute
State target devices.
The printing transferring method of electronic device according to embodiments of the present invention, by the State Transferring of transfer head, can be easily
Target devices are transferred in target substrate from initial substrates, but also electronic device can be avoided to be contaminated.
In some embodiments of the invention, stressed mode is applied on the target devices by the transfer device
Or cause that target devices are separated with initial substrates by etching technics.
Further, connected by sacrifice layer between the target devices and the initial substrates.
Advantageously, the sacrifice layer is that point is connected with the target devices.
In some embodiments of the invention, the target substrate has bottom electrode and is located on the bottom electrode
Bonded layer, the step S3 also includes：Target devices transfer device turn after the completion of being fixedly connected with the bonded layer
Shift to release conditions.
Brief description of the drawings
Fig. 1 to Fig. 4 is that the transfer device of the embodiment of the present invention diverts the aim the schematic diagram of device.
Fig. 5, Fig. 6 and Fig. 7 are the transfer printing head use state schematic diagrames of different embodiments of the invention.
Reference：Transfer device 1, transfer head substrate 11, transfer head 12, target devices 2, target substrate 3, initial substrates
4, gas filled cavity 1201 fills aspirating hole 1202, and annular seal space 1203, transfer groove 201, bottom electrode 301, bonded layer 302 is sacrificed
Layer 401.
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
It is exemplary to scheme the embodiment of description, it is intended to for explaining the present invention, and be not considered as limiting the invention.
Many semiconductor devices, such as LED, microlaser are all based on single-crystal semiconductor material and are made, and single
The growth of brilliant semi-conducting material has very strict requirements for substrate, and the single-crystal semiconductor material of growth must be with substrate lattice
Match somebody with somebody, can otherwise influence the property of semi-conducting material.So, semiconductor devices has stronger selectivity for substrate, it is general this
Kind substrate is smaller, and because the influence of material and subsequent technique is not suitable for driving and integrated circuit, has a strong impact on and partly lead
The integrated of body device is used.Transfer technique is that the semiconductor devices that will be grown in initial substrates is transferred in target substrate, and
And in target substrate or have integrated circuit or can conveniently carry out making integrated circuit, so, semiconductor devices can be obtained more
It is widely applied.
Therefore, the invention provides a kind of transfer device that can be used for transferring semiconductor devices etc. and using the transfer
Device transfers the printing transferring method of electronic device.
Describe originally to put the transfer device 1 of embodiment with reference to the accompanying drawings, transfer device 1 is used for the device 2 that diverts the aim.
As shown in Fig. 1 to Fig. 4, transfer device 1 according to embodiments of the present invention, including：Transfer head substrate 11 and transfer
First 12.
Specifically, transfer head 12 includes at least one, and the transfer head 12 is connected and court with the transfer head substrate 11
Direction away from the transfer head substrate 11 extends.
For example, as being provided with multiple transfer heads 12 on the transfer head substrate 11 in Fig. 1, by transfer head in wherein Fig. 1
12 are arranged on below transfer head substrate 11, and transfer head 12 is extended downwardly.
Transferred-electron device of transfer head 12 etc. for convenience, the transfer head 12 can between seized condition and release conditions
Conversion, transfer head 12 can capture electronic device (such as Fig. 2) in seized condition, and transfer head 12 can discharge electronics in release conditions
Device (such as Fig. 4).
Transfer head 12 captures and discharges electronic device for convenience, in the present invention that the free end of transfer head 12 is (such as attached
The lower end of transfer head 12 in Fig. 1) it is arranged to the shape of variable dimension, specifically, the free end of transfer head 12 is perpendicular to turning
Variable dimension on first 12 at least one direction is moved, specifically, at least one direction of transfer head 12, is shifted
Size B of first 12 free end in the case where the size A of seized condition is more than release conditions.
With accompanying drawing 1 for example, transfer head 12 is vertically extending, therefore, the direction perpendicular to transfer head 12 is exactly
Horizontal direction (such as left and right directions, fore-and-aft direction etc.).
Transfer device 1 according to embodiments of the present invention, the free end of transfer head 12 is arranged to the form of variable dimension, can
With convenient crawl and release target devices 2, so as to realize the crawl and release of target devices 2.
That is, target devices 2 can be captured and be positioned in target substrate 3 from initial substrates 4, mesh is then discharged
Mark device 2, completes the transfer (shifting in other words) of target devices 2.
For example, in the transfer process of target devices 2：
Step 1, such as Fig. 1, the transfer device 1 moves to relative with the initial substrates 4 for being placed with target devices 2, and makes
The transfer head 12 in release conditions of the transfer device 1 is stretched into the transfer groove 201 of the target devices 2；
Step 2, such as Fig. 2, the transfer head 12 of the transfer device 1 are changed to the seized condition and make the transfer head
At least a portion of 12 inner peripheral surfaces for compressing the transfer groove 201, and the target devices 2 is separated with the initial substrates 4；
Step 3, such as Fig. 3 and Fig. 4, the transfer device 1 are moved to and the target substrate for placing the target devices 2
3 is relative, and the target devices 2 are positioned over into precalculated position, and the transfer device 1 is changed to release conditions and discharges the mesh
Mark device 2.
In addition, the use of transfer device 1 for convenience, the invention provides some specific embodiments.
The deformable free end for including but is not limited to transfer head 12 of transfer head 12, for example, can also be arranged to whole transfer
First 12 is all deformable.
Such as Fig. 5,6 and 7, in one embodiment of the invention, the transfer head 12 is configured to the air pressure of basis, wet
At least one in degree is changed between seized condition and release conditions.That is, being realized by changing air pressure and humidity
Conversion of the transfer head 12 between seized condition and release conditions.So as to simplify transfer device 1 operation, and improve transfer into
The qualification rate of target devices 2 after power and transfer.
Wherein, the present invention can change the shape of transfer head 12 by changing air pressure, the humidity etc. of the local environment of transfer head 12
State, it is also possible to change the state of transfer head 12 by changing air pressure, humidity inside transfer head 12 etc..
It is of course also possible to change the state of transfer head 12, such as temperature etc. in other way.
Such as Fig. 5, in some examples of the invention, Packed gas filled cavity 1201 is formed in the transfer head 12,
And the gas filled cavity 1201 has for being inflated to the gas filled cavity 1201 and being taken out from the gas filled cavity 1201
Gas fills aspirating hole 1202, and the transfer head 12 is configured to be suitable to according to the air pressure in the gas filled cavity 1201 in crawl
Changed between state and release conditions.
For example, as Fig. 5 a in the case where ambient pressure (air pressure of the local environment of transfer head 12) is constant, can by
Gas filled cavity 1201 is inflated, so as to increase the air pressure in gas filled cavity 1201 so that transfer head 12 swells so that transfer head
12 change to seized condition；As Fig. 5 b can be evacuated from gas filled cavity 1201 so that reduce in gas filled cavity 1201
Air pressure causes that transfer head 12 reduces so that transfer head 12 is changed to release conditions.
Wherein, the air pressure in the transfer head 12 in seized condition can be more than in the transfer head 12 under release conditions
Air pressure, and air pressure in the transfer head 12 in seized condition can be more than, less than or equal to ambient pressure, in release
The air pressure in transfer head 12 under state can be more than, less than or equal to ambient pressure.
It is easy to operate, it is only necessary to change the i.e. achievable transfer head 12 of the air pressure in the gas filled cavity 1201 of transfer head 12 and exist
Changed between seized condition and release conditions.
Such as Fig. 6, in other examples of the invention, annular seal space 1203 is formed with the transfer head 12, and it is described close
Filled with the gas with predetermined pressure in envelope chamber 1203, the transfer head 12 is suitable to the change according to ambient pressure in crawl shape
Changed between state and release conditions.
For example, such as Fig. 6 a, in the case that air pressure in annular seal space 1203 is constant, (can be turned by reducing ambient pressure
Move the air pressure of first 12 local environment) so that the air pressure in annular seal space 1203 increases relative to ambient pressure so that transfer head
12 swell can be such that transfer head 12 changes to seized condition；Such as Fig. 6 b, can be by increasing ambient pressure (ring residing for transfer head 12
The air pressure in border) so that the air pressure in annular seal space 1203 is relative to ambient pressure reduction so that transfer head 12 swells can be made
Transfer head 12 is changed to release conditions.
Wherein, ring of the ambient pressure of the transfer head 12 in seized condition less than the transfer head 12 under release conditions
Border air pressure, and the ambient pressure of the transfer head 12 in seized condition can be more than, less than or equal to gas in annular seal space 1203
Pressure, the ambient pressure of the transfer head 12 under release conditions can be more than, less than or equal to air pressure in annular seal space 1203.
It is easy to operate, it is only necessary to which that the ambient pressure for changing transfer head 12 is capable of achieving transfer head 12 in seized condition and release
Changed between state.
Preferably, the annular seal space 1203 includes the bubble being formed in the transfer head 12, and multiple bubbles can hold
Receive gas so that gas can disperse to accommodate with annular seal space 1203, when ambient pressure changes, the deformation everywhere of transfer head 12
Than more uniform, realize that the deformation of transfer head 12 is controllable by the homogeneous deformation everywhere of transfer head 12.
Such as Fig. 7, it is of the invention in some instances, at least a portion of the transfer head 12 is by water swelling and dehydration
The material of contraction is made, and the transfer head 12 is changed according to the change of ambient humidity between seized condition and release conditions.
When needing to change the state of transfer head 12, it is only necessary to change the humidity of environment.It is easy to operate.
Preferably, the transfer head 12 is made up of water-absorbing resin.Certainly, transfer head 12 can also be using other water-absorption materials
Material.
Furthermore it is also possible to transfer head 12 is arranged into water-absorbing shrinkable, water swellable form is taken off.
Further, it is formed with the gap being in communication with the outside in the transfer head 12.Gap in transfer head 12 can make
Obtain surrounding air to enter into inside transfer head 12, so as to realize the homogeneous deformation everywhere of transfer head 12, so as to improve transfer head 12
The uniformity of deformation, with the deformation of easier control transfer head 12.
Such as Fig. 1, in some embodiments of the invention, the transfer head 12 is connected with the bottom surface of the transfer head substrate 11
And extend downwardly.Target devices 2 can conveniently be captured.
Certainly, for the target devices 2 of different placement forms, can for example be placed using the transfer device 1 of multi-form
Target devices 2 on the bottom surface of target substrate 3, can be shifted by the transfer head 12 being arranged above transfer head substrate 11.Separately
Outward, it is preferred that the position of transfer head 12 is variable, for example, transfer head 12 is movable on transfer head substrate 11, or transfer head lining
Bottom 11 is rotatable etc..Transfer head 12 can also be set in multiple faces of transfer head substrate 11.
In some embodiments of the invention, in the transfer head 12 on each direction of the transfer head 12
Size A of the free end in the seized condition is more than the size B in the release conditions.It is further to improve the steady of crawl
It is qualitative.
The method for describing the transferred-electron device of transfer device 1 of the embodiment of the present invention with reference to the accompanying drawings.
The printing transferring method of electronic device according to embodiments of the present invention, including according to foregoing transfer device 1, the transfer
Method includes：
S1, as shown in figure 1, the transfer device 1 moves to relative with the initial substrates 4 for being placed with target devices 2, and makes
The transfer head 12 in release conditions of the transfer device 1 is stretched into the transfer groove 201 of the target devices 2, is now shifted
First 12 free end is less than transfer groove 201, and transfer head 12 can be extend into transfer groove 201.
S2, as shown in Fig. 2 the transfer head 12 of the transfer device 1 is changed to the seized condition and makes the transfer
At least a portion of first 12 inner peripheral surfaces for compressing the transfer groove 201, and make 4 points of the target devices 2 and the initial substrates
From, during the conversion of transfer head 12 to crawl seized condition, at least a portion of the inner peripheral surface of the low pressure transfer groove 201 of transfer head 12, because
This transfer head 12 links together with target devices 2, if now target devices 2 separated with initial substrates 4, target substrate 3
Will be moved with transfer head 12.
S3, such as Fig. 3, the transfer device 1 move to it is relative with for placing the target substrate 3 of the target devices 2, and
The target devices 2 are positioned over precalculated position, such as Fig. 4, the transfer device 1 is changed to release conditions and discharges the target
Device 2.
The printing transferring method of electronic device according to embodiments of the present invention, by the State Transferring of transfer head 12, can be conveniently
From initial substrates 4 be transferred in target substrate 3 target devices 2 by ground, but also electronic device can be avoided to be contaminated.
In some embodiments of the present invention, there is provided the method that target devices 2 are separated with initial substrates 4, for example can be with
Stressed mode is applied on the target devices 2 by the transfer device 1 so that target devices 2 are separated with initial substrates 4.
It is equally possible that causing that target devices 2 are separated with initial substrates 4 by etching technics.
It is possible to further will be connected by sacrifice layer 401 between the target devices 2 and the initial substrates 4, Ke Yiqi
To the purpose of protection target devices 2.
Preferably, the sacrifice layer 401 is that point is connected with the target devices 2.The mode of point connection can facilitate target
Device 2 is separated with sacrifice layer 401, so as to the mesh for playing protection target devices 2, facilitating sacrifice layer 401 with target devices 2 separate
, target devices 2 can be avoided to shift bad or the loose contact of transfer head 12 problem.
Such as Fig. 4, in some embodiments of the invention, the target substrate 3 has bottom electrode 301 and is located at the bottom
Bonded layer 302 on portion's electrode 301, the step S3 also includes：The target devices 2 are fixedly connected with the bonded layer 302
After the completion of the transfer device 1 change to release conditions.Now, transfer device 1 serves the effect of positioning, by transfer device
1 positioning conduct, can facilitate the installation of target devices 2, so as to improve yields.
Below by taking LED semiconductor devices as an example, transfer process is illustrated.
1st, LED is grown in initial substrates 4.Wherein, there is one layer of sacrifice layer 401 between initial substrates 4 and LED, for it
After LED component is preferably separated with initial substrates 4.Target is caused by applying pressure or etching technics on target devices 2
Device 2 is separated with initial substrates 4, while transfer head substrate 11 is ready to, the deformation of transfer head 12 expansion crawl target devices 2.
2nd, transfer process is started with expanding the crawl of transfer head 12 LED component.By the transfer head substrate 11 in Fig. 1 down
Put, after the groove close contact of target devices 2, the expansion crawl target devices 2 of transfer head 12.Then, transfer head 12 is applied downwards
Plus-pressure so that target devices 2 are broken with the contact site of sacrifice layer 401, or are etched away sacrifice layer 401 by etching.Most
Afterwards, transfer head substrate 11 is moved up, LED component is grabbed from initial substrates 4.
3rd, after the crawl of transfer head 12 LED component, the top of target substrate 3 is moved to, and close to target substrate 3, will
After the bonded layer 302 of LED and target substrate 3 is to good position, target devices 2 are placed on bonded layer 302.
4th, after target devices 2 are placed on bonded layer 302, changed by ambient humidity, air pressure etc. and cause transfer head 12
Self structure deformation is reduced, and LED component is discharged to target substrate 3, and then transfer head 12 rises, breakaway device 2.
5th, so far, crawl and release of the LED component in initial substrates 4 by transfer head 12 are grown on, target is transferred to
On substrate 3.
The present invention relates to a kind of Novel transfer print device 1.The purpose of the device be will in initial substrates 4 grow device such as
LED component, is transferred in target substrate 3.The transfer device 1 is made up of transfer head substrate 11 and transfer head 12, wherein transfer head
12 is the reversible device of deformation, by the change of environment temperature or humidity or pressure etc. so that transfer head 12 is inflatable or reduces,
So as to realize crawl and release to target devices 2, most device is transferred in target substrate 3 from initial substrates 4 at last.The transfer
First 12 is the reversible device of deformation, and the size of transfer head 12 is changed by the change of environment, controls transfer head 12 and object machine
Active force between part 2, relative to gravitation, electrostatic force, van der Waals interaction power, crawl, releasability to target devices 2
By force, lifting transfer yield.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " be based on orientation shown in the drawings or
Position relationship, is for only for ease of the description present invention and simplifies description, must rather than the device or element for indicating or imply meaning
With specific orientation, with specific azimuth configuration and operation, therefore must be not considered as limiting the invention.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In the description of the invention, " multiple " is meant that at least two, such as two, three
It is individual etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or integrally；Can be that machinery connects
Connect, or electrically connect；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be in two elements
The connection in portion or two interaction relationships of element, unless otherwise clearly restriction.For one of ordinary skill in the art
For, can as the case may be understand above-mentioned term concrete meaning in the present invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be with
It is the first and second feature directly contacts, or the first and second features are by intermediary mediate contact.And, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means to combine specific features, structure, material or spy that the embodiment or example are described
Point is contained at least one embodiment of the invention or example.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.And, the specific features of description, structure, material or feature can be with office
Combined in an appropriate manner in one or more embodiments or example.Additionally, in the case of not conflicting, the skill of this area
Art personnel can be tied the feature of the different embodiments or example described in this specification and different embodiments or example
Close and combine.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (10)
1. a kind of transfer device, for the device that diverts the aim, it is characterised in that including：
Transfer head substrate；
At least one transfer head, the transfer head is connected simultaneously towards the direction away from the transfer head substrate with the transfer head substrate
Extend, the transfer head is convertible between seized condition and release conditions, and perpendicular at least one of the transfer head
Size of the free end of the transfer head in the seized condition is more than the size in the release conditions on direction.
2. transfer device according to claim 1, it is characterised in that the transfer head is configured to the air pressure of basis, wet
At least one in degree is changed between seized condition and release conditions.
3. transfer device according to claim 1, it is characterised in that Packed gas filling is formed in the transfer head
Chamber, and the gas filled cavity to the gas filled cavity with for inflating and filling pumping from gas filling chamber pumping
Hole, the transfer head is configured to be suitable to turned between seized condition and release conditions according to the air pressure in the gas filled cavity
Change.
4. transfer device according to claim 1, it is characterised in that annular seal space is formed with the transfer head, and it is described
Filled with the gas with predetermined pressure in annular seal space, the transfer head be suitable to according to the change of ambient pressure in seized condition and
Changed between release conditions.
5. transfer device according to claim 1, it is characterised in that at least a portion of the transfer head is by water swelling
And the material of syneresis is made, the transfer head turns according to the change of ambient humidity between seized condition and release conditions
Change.
6. transfer device according to claim 5, it is characterised in that the transfer head is made up of water-absorbing resin, described turn
Move in head and be formed with the gap being in communication with the outside.
7. the transfer device according to any one of claim 1-6, it is characterised in that perpendicular to the every of the transfer head
Size of the free end of the transfer head in the seized condition is more than the size in the release conditions on individual direction.
8. a kind of printing transferring method of electronic device, including the transfer device according to any one of claim 1-7, its feature
It is that the printing transferring method includes：
S1, the transfer device moves to relative with the initial substrates for being placed with target devices, and makes the place of the transfer device
Stretched into the transfer groove of the target devices in the transfer head of release conditions；
S2, the transfer head of the transfer device is changed to the seized condition and the transfer head is compressed the transfer groove
At least a portion of inner peripheral surface, and the target devices is separated with the initial substrates；
S3, the transfer device move to it is relative with for placing the target substrate of the target devices, and by the object machine
Part is positioned over precalculated position, and the transfer device is changed to release conditions and discharges the target devices.
9. the printing transferring method of electronic device according to claim 8, it is characterised in that by the transfer device in institute
State and applied on target devices stressed mode or by etching technics so that target devices are separated with initial substrates, the object machine
Connected by sacrifice layer between part and the initial substrates, the sacrifice layer is with the target devices for point is connected.
10. the printing transferring method of electronic device according to claim 8 or claim 9, it is characterised in that the target substrate has bottom
Portion's electrode and the bonded layer being located on the bottom electrode, the step S3 also include：The target devices and the bonded layer
The transfer device is changed to release conditions after the completion of being fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710138193.0A CN106910700B (en) | 2017-03-09 | 2017-03-09 | Transfer device and transfer method of electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710138193.0A CN106910700B (en) | 2017-03-09 | 2017-03-09 | Transfer device and transfer method of electronic device |
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| CN106910700A true CN106910700A (en) | 2017-06-30 |
| CN106910700B CN106910700B (en) | 2020-12-04 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| TWI678691B (en) * | 2017-11-15 | 2019-12-01 | 鴻海精密工業股份有限公司 | Method for making micro led display panel |
| CN108400108B (en) * | 2018-03-23 | 2021-03-09 | 京东方科技集团股份有限公司 | Micro-device transfer printing device and micro-device transfer printing system |
| CN108400108A (en) * | 2018-03-23 | 2018-08-14 | 京东方科技集团股份有限公司 | A kind of micro element transfer device and micro element transferring system |
| CN110660717B (en) * | 2018-06-30 | 2023-08-25 | 江西兆驰半导体有限公司 | Transfer device and transfer method for transferring micro light emitting diode |
| CN110660717A (en) * | 2018-06-30 | 2020-01-07 | 江西兆驰半导体有限公司 | Transfer device and transfer method for transferring micro light-emitting diode |
| CN108962015B (en) * | 2018-07-25 | 2021-04-23 | 京东方科技集团股份有限公司 | Device transfer device and device transfer method |
| US11230076B2 (en) | 2018-07-25 | 2022-01-25 | Beijing Boe Display Technology Co., Ltd. | Device transferring apparatus |
| CN108962015A (en) * | 2018-07-25 | 2018-12-07 | 京东方科技集团股份有限公司 | A kind of device transfer device and element transfer method |
| CN111261572A (en) * | 2018-11-30 | 2020-06-09 | 昆山工研院新型平板显示技术中心有限公司 | Transfer device and method for transferring micro-component |
| CN111415894A (en) * | 2019-01-07 | 2020-07-14 | 普因特工程有限公司 | Micro light-emitting diode transfer head |
| WO2020186461A1 (en) * | 2019-03-19 | 2020-09-24 | 厦门市三安光电科技有限公司 | Semiconductor light-emitting module |
| CN111446200A (en) * | 2020-04-07 | 2020-07-24 | 浙江大学 | Magnetic control film transfer seal with air pressure regulation and control and transfer method |
| CN111446200B (en) * | 2020-04-07 | 2023-03-31 | 浙江大学 | Magnetic control film transfer seal with air pressure regulation and control and transfer method |
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