CN106896552B

CN106896552B - Display device

Info

Publication number: CN106896552B
Application number: CN201611006094.9A
Authority: CN
Inventors: 赵兴柱; 朴正权; 朴灿; 权相铉
Original assignee: LG Display Co Ltd
Current assignee: LG Display Co Ltd
Priority date: 2015-10-31
Filing date: 2016-10-27
Publication date: 2020-12-01
Anticipated expiration: 2036-10-27
Also published as: CN106896552A; KR20170051111A

Abstract

The present invention provides a display device, comprising: a display panel defining an active area displaying an image and a non-active area outside the active area, the display panel being embedded with a first type of touch sensor and including a substrate having a first surface and a second surface opposite to the first surface; a plurality of pixels in an active area on a first surface of a substrate, each pixel including a pixel driving circuit; a transparent conductive layer covering the active region and a portion of the non-active region on the second surface of the substrate; and a metal pattern in the non-active region on the second surface of the substrate, the metal pattern being electrically connected to the transparent conductive layer and having a smaller resistance than the transparent conductive layer, the metal pattern including an extension protruding toward an edge of the second surface of the substrate and receiving an electrical signal from the outside, the metal pattern serving as a conductive path for reducing a potential difference with respect to the electrical signal in the entire region of the transparent conductive layer.

Description

Display device

Cross Reference to Related Applications

This application claims priority from korean patent application No. 10-2015-.

Technical Field

The present disclosure relates to a display device and a method of manufacturing the same, and more particularly, to a display device including a touch sensor.

Background

Generally, in implementing a display device capable of recognizing a user's touch, a touch screen panel is then bonded to a display panel after it has been separately manufactured. That is, the touch electrode has been separately formed using a glass substrate, a plastic substrate, a film, or a plate as a support member. Then, the support member on which the touch electrodes are formed has been bonded to the display panel with an adhesive sheet or an adhesive to implement a touch function.

In recent years, according to the trend toward lightweight and thin display devices, conventional techniques have been replaced with techniques of forming touch sensors in a display panel. That is, a touch electrode is provided on a display panel using the display panel as a support member without a separate support member or a touch sensor is provided in the display panel. Thus, a display device including a display panel having a touch function has been realized.

In the case where the touch sensor is formed in or on the display panel, the touch sensor is physically very close to various components of the display panel. Thus, interference between the touch sensor and other components needs to be considered. In order for the touch sensor of the display device to more accurately recognize the user's touch, it is necessary to consider factors that cause unintended interference in the touch sensor. However, due to the industry trend towards ultra-thin display panels, unintentional disturbances have not been satisfactorily addressed.

In addition, two types of touch sensors are embedded together in a display device to recognize a user's touch, thereby providing the user with various User Interfaces (UIs) and user experiences (UX) while displaying an image. In order for such a plurality of touch sensors to harmoniously realize user touches without interfering with each other, it is necessary to optimize the positional relationship between the two types of touch sensors.

Disclosure of Invention

Accordingly, the present disclosure is directed to a display device and a method of fabricating the same that substantially obviate one or more problems due to limitations and disadvantages of the related art.

An advantage of the present disclosure is to provide a display device with enhanced touch functionality.

According to the conventional art, the touch sensor is embedded in the display panel so that direct and indirect effects of various components of the display panel on the touch sensor may increase. In particular, if the touch sensor is a projected capacitive touch sensor, a touch signal is recognized by measuring a capacitance value of one touch electrode with a user or by measuring a capacitance value between the touch electrodes upon a user's touch. In this case, the capacitance value to be measured may change due to interference with various components of the display panel. Such changes may degrade the touch function. In addition, for the pixel driving circuit of the display panel, the characteristics of each component may be changed by direct and indirect influences of the touch sensor. Such changes may degrade image quality. In addition, since the pressure-sensitive touch sensor and the capacitive touch sensor are embedded together, interference may occur between the two touch sensors. Such interference can degrade touch sensing accuracy.

An object of the present disclosure is achieved by embodiments that provide a display device in which a metal pattern having a width of several hundreds of nanometers and having an interface with a conductive layer is formed on a lower substrate (one surface of the lower substrate is covered with the conductive layer).

Another object of the present disclosure is achieved by embodiments that provide a display device in which a metal pattern having an interface with a conductive layer is formed using a printing process or a dispensing (dispensing) process so as not to damage components of a display panel.

Another object of the present disclosure is achieved by embodiments that provide a display device in which a ground voltage may be applied to a conductive layer via a metal pattern having a low sheet resistance to block interference when a user's touch is sensed by a capacitive touch sensor.

Still another object of the present disclosure is achieved by embodiments that provide a display device in which a secondary sensor (secondary sensor) serving as a pressure-sensitive touch sensor or a conductive layer facing the sensor (vibrating sensor) is disposed between a capacitive touch sensor and the pressure-sensitive touch sensor. Thus, the touch sensor is more easily and quickly applied to the conductive layer with a metal pattern having a low sheet resistance.

Still another object of the present disclosure is achieved by embodiments that provide a display device including a conductive layer having electrical conductivity and light transmission characteristics and also satisfying optical and electrical characteristics for a low level of external light reflection.

Still another object of the present disclosure is achieved by embodiments that provide a display device in which an FPC and a conductive layer are electrically connected through a metal pattern, and thus, contact resistance is low at an interface and the conductive layer is more stably grounded than a case in which the FPC and the conductive layer are not electrically connected through the metal pattern.

Still another object of the present disclosure is achieved by embodiments that provide a display device in which a metal pattern is continuously formed along all edges of a bottom surface of a conductive layer, and thus, an interface between the metal pattern and the conductive layer serves as a path for an electrical signal to be applied to the conductive layer and the conductive layer can more rapidly become an equipotential surface.

Still another object of the present disclosure is achieved by embodiments that provide a display device in which a conductive layer is more stably grounded through a metal pattern, thus being capable of minimizing noise of a touch signal of a user sensed through an in-cell capacitive touch sensor.

Still another object of the present disclosure is achieved by the following embodiments, which provide a display device in which static electricity accumulated in the display device is effectively discharged through a conductive layer by a metal pattern.

Advantages and objects of the present disclosure are not limited to the foregoing objects, and other objects not mentioned above will be apparent to those of ordinary skill in the art from the following description.

According to an aspect of the present disclosure, there is provided a display device including an in-cell (in-cell) capacitive touch sensor and a pressure sensitive touch sensor. In the display device, a light-transmitting conductive layer is disposed on the entire bottom surface of the lower substrate. The opaque metal pattern is formed in a closed loop shape along the edge of the conductive layer. Thus, even if the light-transmitting conductive layer has a relatively large size, an electrical signal can be received by the metal pattern having a low sheet resistance and thus an equipotential surface can be quickly formed.

According to an aspect of the present disclosure, there is provided a display device including: a display panel defining an active area displaying an image and a non-active area outside the active area, the display panel including a substrate having a first surface and a second surface opposite to the first surface; a plurality of pixels on a first surface of the substrate in the active region, each pixel including a pixel driving circuit; a transparent conductive layer on the second surface of the substrate, the transparent conductive layer covering the active region and a portion of the non-active region; and a metal pattern in a non-active area on the second surface of the substrate, the metal pattern being electrically connected to the transparent conductive layer and having a smaller resistance than that of the transparent conductive layer, the metal pattern including an extension protruding toward an edge of the second surface of the substrate and receiving an electrical signal, the metal pattern serving as a conductive path to reduce a potential difference with respect to the electrical signal in an entire area of the transparent conductive layer, as compared to a display device without the metal pattern.

According to an aspect of the present disclosure, there is provided a display device including: a display panel defining an active area displaying an image and a non-active area outside the active area, the display panel including a substrate having a first surface and a second surface opposite to the first surface; a plurality of pixels on the first surface of the substrate in an active region, each pixel including a pixel driving circuit; a transparent conductive layer on the second surface of the substrate covering the active region and a portion of the non-active region; and a metal pattern in a non-active region on an outer edge of the transparent conductive layer.

The details of exemplary embodiments of the present disclosure are included in the detailed description and drawings of the present disclosure.

According to an embodiment of the present disclosure, a display device in which a metal pattern having a width of several hundreds of nanometers and having an interface with a conductive layer is formed on a lower substrate (one surface of which is covered with the conductive layer) may be provided.

In addition, according to an embodiment of the present disclosure, a display device in which a metal pattern having an interface with a conductive layer is formed using a printing process or a dispensing process so as not to damage components of a display panel may be provided.

Further, according to an embodiment of the present disclosure, a display device in which a ground voltage may be applied to a conductive layer via a metal pattern having a low sheet resistance to block interference when a touch of a user is sensed by a capacitive touch sensor may be provided.

In addition, according to an embodiment of the present disclosure, a display device in which a conductive layer functioning as a secondary sensor or a facing sensor of a pressure-sensitive touch sensor is disposed between a capacitive touch sensor and the pressure-sensitive touch sensor may be provided. Thus, the touch sensor can be more easily and rapidly applied to the conductive layer through the metal pattern having a low sheet resistance.

In addition, according to an embodiment of the present disclosure, a display device including a conductive layer having conductivity and light transmission characteristics for a low level of external light reflection and also satisfying optical and electrical characteristics may be provided.

Further, according to the embodiments of the present disclosure, a display device in which an FPC and a conductive layer are electrically connected through a metal pattern can be provided, and thus, contact resistance is low at an interface and the conductive layer is more stably grounded, as compared to a case in which the FPC and the conductive layer are not electrically connected through the metal pattern.

In addition, according to the embodiments of the present disclosure, a display device in which a metal pattern is continuously formed along all edges of the bottom surface of a conductive layer may be provided, and thus, an interface between the metal pattern and the conductive layer serves as a path for an electrical signal to be applied to the conductive layer and the conductive layer may more rapidly become an equipotential surface.

In addition, according to an embodiment of the present disclosure, it is possible to provide a display device in which a conductive layer is more stably grounded through a metal pattern, thereby being capable of minimizing noise of a touch signal of a user sensed through an in-cell (in-cell) capacitive touch sensor.

Further, according to the embodiments of the present disclosure, a display device in which static electricity accumulated in the display device is effectively discharged through a conductive layer by a metal pattern may be provided.

The effects of the present disclosure are not limited to the above effects, and other effects not mentioned above will be apparent to those of ordinary skill in the art from the following description.

The objects to be achieved by the present disclosure, the aspects and effects of the present disclosure described above do not necessarily specify essential features of the claims, and thus the scope of the claims is not limited to the specific disclosure of the present disclosure.

Drawings

The above and other aspects, features and other advantages of the present disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

fig. 1 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure;

fig. 2A is a perspective view of a display panel showing a top surface of the display panel according to an exemplary embodiment of the present disclosure;

fig. 2B is a perspective view of the display panel showing a bottom surface of the display panel in a cell state;

fig. 3 is an enlarged plan view of a bottom surface of the display panel shown in fig. 2B;

fig. 4 is a partial perspective view of a display panel illustrating a connection structure of an extension portion of a metal pattern located on a bottom surface of a lower substrate of the display panel and an FPC located on a top surface of the lower substrate according to one exemplary embodiment of the present disclosure;

fig. 5 is an enlarged perspective view enlarging a region Z shown in fig. 4;

FIG. 6 is a cross-sectional view taken along line A-A' of FIG. 4; and

fig. 7 is a sectional view taken along line B-B' of fig. 4.

Detailed Description

Advantages and features of the present disclosure and methods for accomplishing the same will become more apparent from the following description of various exemplary embodiments with reference to the accompanying drawings. However, the present disclosure is not limited to the following exemplary embodiments, but may be implemented in various different forms. Various exemplary embodiments are provided only to complete the disclosure of the present disclosure and to fully provide those of ordinary skill in the art with the scope of the disclosure to which the present disclosure pertains, and the present disclosure will be defined by the appended claims.

Shapes, sizes, ratios, angles, numbers, and the like, which are shown in the drawings to describe exemplary embodiments of the present disclosure, are only examples, and the present disclosure is not limited thereto.

Like reference numerals refer to like elements throughout the specification.

In the following description, a detailed description of known related art may be omitted in order to avoid unnecessarily obscuring the subject matter of the present disclosure.

As used herein, terms such as "comprising," having, "and" including "are generally intended to allow the addition of other components unless the term is used with the term" only.

Any reference to the singular may include the plural unless specifically stated otherwise.

Components are to be construed as including common error ranges even if not explicitly stated.

When positional relationships between two components are described using terms such as "upper", "above", "below", and "next", one or more components may be located between two components unless the terms are used with the terms "immediately" or "directly".

Although the terms "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one element from another. Accordingly, the first component referred to below in the technical concept of the present disclosure may be the second component.

In describing the components of the present disclosure, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish one element from another. Accordingly, the nature, order, sequence or number of the respective components is not limited by these terms. It will be understood that when an element is referred to as being "connected to" or "coupled to" another element, it can be directly connected or coupled to the other element, be connected or coupled to the other element with the other element "interposed" therebetween, or be "connected" or "coupled" to the other element via yet another element.

Features of various exemplary embodiments of the present disclosure may be partially or wholly engaged or combined with each other, and may be interlocked and operated in various ways in technology as well understood by those of ordinary skill in the art, and various exemplary embodiments may be performed independently or in association with each other.

Hereinafter, a display device 100 according to an exemplary embodiment of the present disclosure will be described with reference to fig. 1.

Fig. 1 is an exploded perspective view of a display device 100 according to an exemplary embodiment of the present disclosure.

Referring to fig. 1, a display device 100 according to an exemplary embodiment of the present disclosure includes: a display panel 110 for displaying an image; a backlight unit 120 for providing light from a rear surface of the display panel 110; and a cover glass 131 for protecting the screen of the display device 100.

The display panel 110 includes a lower substrate 230 on which a pixel array layer 242 is disposed and an upper substrate 240 on which a color filter layer 232 is disposed. The lower substrate 230 and the upper substrate 240 are bonded together facing each other with a light control material between the lower substrate 230 and the upper substrate 240.

The backlight unit 120 includes an optical sheet 121, a light guide plate 123 under the optical sheet 121, a light source 124 beside or under the light guide plate 123, and a pressure-sensitive touch sensor 125 under the light source 124 and the light guide plate 123. In addition, the backlight unit 120 includes a cover bottom 129, and the cover bottom 129 is disposed under the pressure-sensitive touch sensor 125 to receive other components of the backlight unit 120 and is connected to a ground line of the system to connect the display device 100 to the ground.

The light source 124 may be, for example, an edge-type or direct-type LED assembly. The LED assembly may include a plurality of LED packages and a PCB on which the plurality of LED packages are arranged and mounted at a predetermined distance from each other. Alternatively, the light source 124 may be a fluorescent lamp, such as a cold cathode fluorescent lamp or an external electrode fluorescent lamp. Although fig. 1 illustrates the light source 124 of an edge type, the light source 124 may be of a direct (direct) type, and is not limited thereto. If the light source 124 is a direct type LED assembly, the light guide plate 123 may be omitted from the backlight unit 120. If a fluorescent lamp is used as the light source 124, the backlight unit 120 may further include a lamp guide to protect the fluorescent lamp and concentrate light toward the light guide plate 123.

The display panel 110 and the backlight unit 120 are modularized into one body by the guide panel 127, the front frame 132, and the cover bottom 129, and constitute the display device 100. For example, the display device 100 according to an exemplary embodiment of the present disclosure may further include a front frame 132 to accommodate various modular components of the display panel 110 and the backlight unit 120. The front frame 132 may be configured to cover top surface edges and sides of the display panel 110. Alternatively, the display panel 110 and the backlight unit 120, the edges of which are surrounded by the guide panel 127 having a square frame shape, may be disposed on the cover bottom 129 and integrated.

Details of the display panel 110 will be described later with reference to fig. 2A, 2B, and 3 to 5.

Fig. 2A is a perspective view of the display panel 110 showing a top surface of the display panel 110 according to an exemplary embodiment of the present disclosure.

Referring to fig. 2A, the display panel 110 includes a lower substrate 230 and an upper substrate 240 bonded to each other to achieve a cell (cell) state. In addition, a lower polarizing plate 210 and an upper polarizing plate 220 are respectively bonded to the bottom and top surfaces of the unit. That is, the display panel 110 includes a lower substrate 230, an upper substrate 240, a lower polarizing plate 210, and an upper polarizing plate 220.

On the top surface of the lower substrate 230, gate lines for applying various driving signals to the pixels and data lines for applying data voltages to the pixels are disposed. A plurality of pixels are disposed on the display panel 110 to correspond to intersections between the gate lines and the data lines. As will be described later with reference to fig. 6, a pixel array layer 242 including a plurality of pixel driving circuits respectively corresponding to a plurality of pixels is disposed on the top surface of the lower substrate 230. In addition, on the bottom surface of the upper substrate 240, a color filter layer 232 including a plurality of color filters corresponding to the plurality of pixels, respectively, is disposed.

Each pixel comprises two electrodes forming an electric field. The two electrodes forming the electric field are referred to as a pixel electrode and a common electrode. The pixel electrode receives a data voltage inherent to each pixel from the data line. The common electrode is disposed to correspond to the pixel electrode so as to form a horizontal electric field or a vertical electric field with the pixel electrode. The common electrode is implemented such that the same voltage can be applied to all of the plurality of pixels. Unlike the pixel electrode, the common electrode can therefore be realized to be integrated with respect to all of the plurality of pixels. Alternatively, the plurality of pixels may be grouped into several groups (blocks), and a common electrode may be provided to each pixel group. That is, the common electrode may include a plurality of common electrode groups. The common electrode is located on a path of light irradiated to the outside of the display device 100, and thus may be formed of a material having excellent light transmission characteristics. For example, the common electrode may be formed of a transparent conductive material such as Indium Tin Oxide (ITO).

Since a plurality of pixels are disposed on the display panel 110, the display panel 110 is divided into an active area a/a displaying an image and a non-active area I/a surrounding the active area a/a.

Although the pixel driving circuit is disposed on the top surface of the lower substrate 230, a gate driver for applying an electrical signal to the gate lines may be mounted on the top surface of the lower substrate 230. This mounting method is referred to as a gate-in-panel (GIP) method in which a gate driver is mounted on a region of the top surface of the lower substrate 230 except for a region where a pixel driving circuit is disposed.

The lower substrate 230 as will be described later with reference to fig. 7 may include a space for fixing various circuit components such as the source driver 290, in addition to a space corresponding to a plurality of pixels. For example, a space for fixing various circuit components may be prepared (prepare) in the non-active region I/a corresponding to one side of the lower substrate 230. For this, the lower substrate 230 may have a size larger than that of the upper substrate 240. In addition, a portion of the lower substrate 230 that does not overlap the upper substrate 240 corresponds to the non-active region I/a.

The FPC250 is bonded to one side of an edge of the top surface of the lower substrate 230 that does not overlap with the upper substrate 240 and thus is partially exposed. Various electrical signals are supplied from the outside of the display panel 110 to the display panel 110 through the FPC250, including predetermined electrical signals applied to the conductive layer IM.

The lower polarizing plate 210 bonded to the bottom surface of the lower substrate 230 has a size smaller than that of the lower substrate 230. The upper and lower

polarizing plates

220 and 210 have a size larger than that of the active area a/a. In addition, both the upper and lower

polarizing plates

220 and 210 overlap the entire active region a/a. Thus, the lower polarizing plate 210 is disposed over a region from the active area a/a to the non-active area I/a. Accordingly, a portion of the lower substrate 230 in the non-active region I/a does not overlap the upper substrate 240, so that a portion of the top surface of the lower substrate 230 is exposed.

In addition, the FPC250 is bonded to the exposed portion of the top surface of the lower substrate 230. A partial region of the FPC250 does not overlap with the top surface of the lower substrate 230. An FPC connection pad 251 is provided on a partial region of the FPC250 that does not overlap with the lower substrate 230. That is, on a partial region of the FPC250 protruding toward the side surface of the display panel 110, the FPC connection pad 251 is provided. The FPC connection pad 251 is disposed and electrically connected to the metal pattern MP of a closed loop shape formed on the bottom surface of the lower substrate 230. The metal pattern MP contacting the bottom surface of the lower substrate 230 will be described later with reference to fig. 2B and 3. The FPC250 will be described later with reference to fig. 5 and 7.

Fig. 2B is a perspective view of the display panel showing a bottom surface of the display panel in a unit state. A structure in which the lower substrate 230 and the upper substrate 240 are bonded to each other to be spaced apart from each other is referred to as a cell (cell). That is, fig. 2B illustrates a state in which the upper and lower

polarizing plates

220 and 210 of the display panel 110 are not joined to the unit. In the display panel 110 according to an exemplary embodiment of the present disclosure, the metal pattern MP having a closed loop shape is formed along an edge of the bottom surface of the lower substrate 230.

More specifically, the metal pattern MP having a sheet resistance lower than that of the conductive layer IM is formed in a closed loop shape along the edge of the conductive layer IM to reduce or minimize a potential difference between a point of the conductive layer IM relatively far from the FPC connection pad 251 and a point of the conductive layer IM relatively close to the FPC connection pad 251. The metal pattern MP having a sheet resistance lower than that of the conductive layer IM serves as a conductive path (highway) to uniformly transfer a predetermined electrical signal having a reduced or minimized RC delay from the FPC connection pad 251 to the entire area of the conductive layer IM.

The metal pattern MP includes at least two branches, an extension EX. The extension EX of the metal pattern MP protrudes toward the outside of the ring of the metal pattern MP. In other words, the extension EX protrudes toward the edge of the display panel 110. The extension portion EX is disposed adjacent to the FPC connection pad 251. Specific positions of the metal pattern MP and the extension EX will be described later with reference to fig. 3 and 4.

Fig. 3 is an enlarged plan view of the bottom surface of the display panel shown in fig. 2B.

A conductive layer IM continuously deposited over from the active area a/a to the non-active area I/a may be disposed on the bottom surface of the lower substrate 230. The electrically conductive layer IM advantageously has a light reflectivity of less than 1% in the visible wavelength range. Therefore, it may be used as a path of light generated inside the display device 100 and radiated to the outside. In addition, the conductive layer IM advantageously has a sheet resistance of less than 300 Ω/sq. Therefore, it is possible to form an equipotential surface more rapidly and uniformly.

The conductive layer IM may have a multilayer structure in which a layer having a high refractive index and a layer having a low refractive index are alternately stacked in this order. For example, the conductive layer IM may include a first inorganic layer having a refractive index of n1, a second inorganic layer having a refractive index of n2, and a refractive index of n2, which are sequentially stackedA third inorganic layer of n 3. Herein, n1, n2, and n3 may have a relationship of n2 < n1 and n2 < n3 with respect to light in the visible wavelength range. One or more of the first to third inorganic layers may be formed of a conductive material. For example, the third inorganic layer may be formed by depositing indium tin oxide. In this case, the third inorganic layer may be formed at least

So that the conductive layer IM has a low sheet resistance.

Meanwhile, when the third inorganic layer is formed of a conductive transparent material such as Indium Tin Oxide (ITO), the light transmittance of the third inorganic layer decreases as the thickness of the third inorganic layer increases. In order to compensate for the light transmittance of the third inorganic layer, a second inorganic layer having a low refractive index and a first inorganic layer having a high refractive index are alternately stacked. For example, the first inorganic layer may be formed of niobium oxide (Nb)₂O₅) The second inorganic layer may be formed of silicon oxide (SiO)₂) The third inorganic layer may be formed of Indium Tin Oxide (ITO). Therefore, the conductive layer IM having a light reflectance of less than 1%, a light transmittance of 95% or more, and a sheet resistance of 300 Ω/sq or less can be obtained.

In addition, in the case of forming the third inorganic layer of Indium Tin Oxide (ITO), if the thickness of the third inorganic layer is increased in order to reduce the sheet resistance of the conductive layer IM, the light reflectance is increased to 1% or more, or the light transmittance is decreased to less than 90%. Therefore, the conditions for forming the third inorganic layer of Indium Tin Oxide (ITO) are adjusted so that the conductive layer IM advantageously has a sheet resistance of 300 Ω/sq or less and a light reflectance of 1% or less. If the size of the conductive layer IM increases due to the increase in the size of the display panel 110, the resistivity of the conductive layer IM alone may not be able to quickly form an equipotential surface over the entire area of the conductive layer IM. When an electric signal is applied to the conductive layer IM by an application point, there may be a potential difference between the application point and a point located at the conductive layer IM far from the application point. This potential difference is proportional to the size of the conductive layer IM.

In order to solve this problem, a predetermined electric signal for forming an equipotential of the conductive layer IM is applied through the metal pattern MP, which has a sheet resistance smaller than that of the conductive layer IM and is advantageously in contact with the entire edge of the conductive layer IM. That is, it is advantageous that the metal pattern MP and the conductive layer IM form an interface as large as possible without intruding into the active region a/a. Accordingly, a predetermined electrical signal can be applied to the conductive layer IM through an interface formed by the contact between the metal pattern MP and the conductive layer IM.

A metal pattern MP having a sheet resistance smaller than that of the conductive layer IM is disposed on the bottom surface of the lower substrate 230 on which the conductive layer IM is formed. Accordingly, the metal pattern MP contacts the bottom surface of the conductive layer IM. More specifically, the metal pattern MP forms an interface with the third inorganic layer of the conductive layer IM. In other words, the metal pattern MP is in direct contact with one surface of the third inorganic layer that provides conductivity to the conductive layer IM. As the size of the interface between the opaque metal pattern MP and the light-transmissive conductive layer IM increases, the contact resistance between the metal pattern MP and the conductive layer IM decreases. Accordingly, when disposed to correspond to the non-active region I/a, the metal pattern MP may be formed in a closed loop shape along an edge of one surface of the conductive layer IM in order to increase or maximize the size of an interface between the metal pattern MP and the light-transmissive conductive layer IM. For example, if the display panel 110 has a square shape in a plan view, the metal pattern MP may have a square ring shape. Further, the metal electrode may have a closed loop shape, but is not limited thereto. For example, referring to fig. 2B to 3, a portion of the metal pattern MP extending between the two extension portions EX may be opened, so that the metal pattern MP may have an open loop shape.

When the metal pattern MP is opaque, it is desirable not to intrude into the active region a/a as much as possible as described above. In other words, the metal pattern MP is disposed such that the size of the interface between the metal pattern MP and the light-transmitting conductive layer IM is increased or maximized, and at the same time, the metal pattern MP does not intrude into the active region a/a as much as possible. For example, the metal pattern MP may surround the active area a/a of the lower substrate 230. That is, the metal pattern MP may form a closed loop shape along the edge of the bottom surface of the conductive layer IM. The metal pattern MP may be printed on the bottom surface of the lower substrate 230 using a metallic ink to have a closed loop shape.

The metallic ink refers to a composition in a paste state in which highly conductive particles such as metallic particles are dispersed in a solvent. The metallic ink has fluidity, viscosity, and surface tension suitable for forming a line shape by an inkjet printing method. The metal ink may include an organic solvent that is liquid at room temperature and in which metal particles can be uniformly dispersed as a substrate. In addition, the metallic ink may contain a dispersant that promotes uniform dispersion of the metallic particles in the solvent. For example, the organic solvent may be a polar organic material, such as triethylene glycol monoethyl ether (TGME, C) with an alcohol functional group of appropriate viscosity₈H₁₈O₄). Alternatively, the organic solvent may be a basic material, such as tetramethylammonium hydroxide (TMAH, (CH)₃)₄NOH)). The organic solvent contained in the metallic ink may be a polar organic solvent, for example. Organic solvents having different properties may be included in the metal ink in consideration of the properties of the metal particles, the properties of the dispersant, the properties of the substrate on which printing is performed, and the properties of the cleaning solution used in the cleaning process after sintering.

The metal pattern MP may include a metal material or a metal alloy material having excellent conductivity, for example, silver (Ag), copper (Cu), molybdenum (Mo), chromium (Cr), or the like. That is, the metal particles contained in the metal ink may be a metal material or a metal alloy material having excellent conductivity, such as silver (Ag), copper (Cu), molybdenum (Mo), chromium (Cr), or the like. If the conductive layer IM includes indium-tin oxide (ITO) to achieve high light transmittance, the metal pattern MP advantageously has a line resistance of 1 Ω/mm or less, so that the metal pattern MP has a sheet resistance smaller than that of the conductive layer IM. The sheet resistance is a value derived by applying various correction factors including the thickness and shape of the measurement object to the line resistance of the unique characteristic of the measurement object. Typically, sheet resistance is measured by a 4-probe test.

Ensuring a low sheet resistance means ensuring a low line resistance. For example, if the metal pattern MP is formed of silver (Ag) having a lower resistivity than that of indium-tin oxide (ITO), the contact resistance between the conductive layer IM and the metal pattern MP is reduced. If the metal pattern MP is formed of silver (Ag), the line resistance of the metal pattern MP may be reduced to at least 0.005 Ω/mm. Accordingly, the metal pattern MP may have a line resistance of 0.005 Ω/mm to 1 Ω/mm. If the metal pattern MP is formed of silver (Ag), the metal pattern MP may have a line resistance of 0.005 Ω/mm to 1 Ω/mm when the metal pattern MP has a width W of 400nm to 800nm and a height of 0.1 μm to 1 μm. That is, if the metal pattern MP is formed of silver (Ag), when the metal pattern MP has a width W of 400nm to 800nm and a height of 0.1 μm to 1 μm, the metal pattern MP has a sheet resistance lower than that of the conductive layer IM including Indium Tin Oxide (ITO). If the metal pattern MP is formed of silver (Ag), the metal pattern MP may have a width W of 400nm to 800nm and a height of 0.1 μm to 1 μm when the metal ink for forming the metal pattern MP includes silver (Ag) particles in a weight ratio of 20% to 30% and the metal ink has a viscosity of 10cp to 30 cp.

The metal pattern MP may be formed to be thick enough to have a lower sheet resistance than that of the light-transmitting conductive layer IM. In order to form the thick metal pattern MP by deposition, a long manufacturing time is generally required, which means that the display panel 110 may be exposed to damage for a long time during the manufacturing process. That is, the environmental conditions for manufacturing the metal pattern MP and the amount of time for manufacturing the metal pattern MP are major factors for the performance of the display device 100 to be managed.

If the metal pattern MP is manufactured by printing or dispensing, uniformity at the surface or edge of the metal pattern MP may be reduced as compared to the case where the metal pattern MP is manufactured by deposition. However, the metal pattern MP having a large thickness can be formed in a much shorter time. That is, if the metal pattern MP is formed of a material that can be printed or dispensed, the surface or edge of the metal pattern MP may have low uniformity, compared to the case where the metal pattern MP is formed of a material that can be deposited. Since the shape accuracy is relatively unimportant compared to the metal pattern constituting the micro integrated circuit for the thick and wide metal pattern MP having a thickness of several μm or a width of several hundreds nm. Therefore, if the thick and wide metal pattern MP having a thickness of several μm or a width of several hundreds nm is formed, the metal pattern MP is preferably manufactured by printing or dispensing. When the metal pattern MP is manufactured by printing or dispensing, the thickness and width of the metal pattern MP can be adjusted by adjusting the discharge amount or viscosity of the metal ink.

As described above, the metal pattern is formed by printing or dispensing a metal ink. Thus, the metallic ink is formed of a material that can be printed or dispensed. The printing or dispensing method may be a pneumatic type, a piezoelectric type, and an electric type, which are merely examples, but may not be limited thereto. Pneumatic type methods use pneumatic pressure control and a microprocessor based timer. The piezoelectric type method is a method of pushing a liquid using a piezoelectric principle. The electric type method is a method of forming an electromagnet on a coil and pushing a liquid.

For example, the pneumatic type method may be a method of discharging liquid by driving a pneumatic piston using a spherical tip at an end thereof and a spring. If the piston is raised by pneumatic pressure, the liquid in the syringe is expelled by pneumatic pressure through the spray nozzle. If the pneumatic pressure of the piston is blocked, the piston blocks the spray nozzle by the return spring pressure and stops the discharge of liquid. The liquid is discharged by repeating the piston movement using the air pressure and the operation using the pressure of the return spring.

For example, the piezoelectric type method may be a method of discharging a liquid by installing a piezoelectric linear motor using a piezoelectric actuator, which can precisely control displacement by applying a voltage, in a syringe and using piezoelectricity as a driving source. Since high-speed and high-precision control is possible, the liquid can be discharged in a very small amount. In addition, the discharge amount of the liquid can be controlled in accordance with changes in the drive voltage, the drive frequency, and the waveform of the application voltage applied to the piezoelectric element.

For example, an electric-type (electric-type) method may be a method of discharging liquid by moving a coil up and down according to a solenoid driving method. In an electrical type method like the piezoelectric method, the actuator may be installed in the injector. The solenoid valve can be controlled at low power and uses an electric signal, and thus, the opening/closing time can be controlled quickly. In addition, the discharge amount of the liquid can be accurately controlled by appropriately adjusting the number of windings of the coil and the input current.

As described above, the metal pattern MP according to the exemplary embodiment of the present disclosure may be formed by printing or dispensing. The metal pattern MP is formed by drying and curing the printed metal ink. In this case, the solvent or dispersant contained in the metallic ink may remain in the metal pattern MP. That is, the metal pattern MP may include not only a metal material or a metal alloy material but also an organic material such as a solvent or a dispersant.

The fluidity of the metal ink is removed by removing the solvent from the metal ink, and the metal particles are sintered at a high temperature so that the metal ink printed on the lower substrate 230 is fixed to the lower substrate 230. Thus, the solidified metal pattern MP can be obtained.

Then, a washing process is performed using distilled water, so that the lower polarizing plate 210 can be bonded to the bottom surface of the lower substrate 230 without foreign substances. Since various foreign substances are generated and remain on the lower substrate 230 and the upper substrate 240 when the metal ink is dried and sintered, it is generally desirable to wash the surface of the unit. In order to avoid the loss of the metal pattern MP during the washing process using distilled water, the metal pattern MP is covered with the protective coating OC before the washing process. In order to insulate the metal pattern MP from other components, the protective coating OC may include an insulating material. For example, the protective coating OC may include tetramethylammonium hydroxide groups (TMAH, (CH)₃)₄NOH)), ethylene glycol based materials or polyimide based materials. Similar to the metal pattern MP, the protective coating layer OC may be formed by printing a protective material having viscosity and fluidity on the lower substrate 230 to cover the metal pattern MP, and then curing the protective material. The protective coating OC may also surround the active area a/a along the non-active area I/a so as not to invade the active area a/a.

Since the overcoat layer OC covers the metal pattern MP, the overcoat layer OC may have a width greater than that of the metal pattern MP. Accordingly, there is a region where the lower substrate 230 is in contact with the overcoat layer OC without the metal pattern MP therebetween. The extension EX of the metal pattern MP extends to the edge of the display panel. In addition, open pads OP are formed at the ends of the extension portions EX of the metal pattern MP, respectively, and the protective coating OC exposes the open pads OP. That is, the metal pattern MP is covered with the insulating protective coating OC except for the open pads OP so that the open pads OP are defined.

The lower polarizing plate 210 is bonded to the bottom surface of the lower substrate 230 on which the metal pattern MP and the protective coating OC are formed. Details of the positional relationship between the lower polarizing plate 210 and the metal pattern MP and the position of the open pad OP will be described later with reference to fig. 4 and 5.

Fig. 4 is a partial perspective view of the display panel 110 illustrating a connection structure of the extension EX of the metal pattern MP located on the bottom surface of the lower substrate 230 of the display panel and the FPC250 located on the top surface of the lower substrate 230. Fig. 5 is an enlarged perspective view enlarging a region Z shown in fig. 4.

After the rinsing process with distilled water, the lower and upper

polarizing plates

210 and 220 are respectively bonded to the bottom and top surfaces of the cell in which the upper and

lower substrates

240 and 230 are bonded. The lower polarizing plate 210 is bonded to the bottom surface of the lower substrate 230 to overlap the metal pattern MP. In this case, the lower polarizing plate 210 exposes the extension EX of the metal pattern MP so that the open pad OP is not covered by the lower polarizing plate 210. In addition, the lower polarizing plate 210 may be bonded to overlap the active region a/a without overlapping the extension EX. As described above, the FPC connection pad 251 is disposed on a partial region of the FPC250 that protrudes without overlapping with the lower substrate 230. The open pad OP is disposed on the extension EX protruding from the metal pattern MP. A portion of the region of the FPC250 protruding without overlapping the lower substrate 230 and the extension portion EX overlap the lower substrate 230 therebetween such that the FPC connection pad 251 is adjacent to the open pad OP. In addition, the connection member 410 electrically connecting the FPC connection pad 251 and the opening pad OP is formed on the FPC connection pad 251, the side of the lower substrate 230, and the opening pad OP. The connection member 410 may be formed by printing a metallic ink in a dot shape and then curing the metallic ink. The metal ink may be silver (Ag) paste. Accordingly, the connection member 410 may be a thermally cured silver (Ag) paste. That is, the open pad OP is covered with a thermally cured silver (Ag) paste.

Referring to fig. 5, the connection between the FPC connection pad 251 and the open pad OP will be described in detail. The FPC connection pad 251 and the open pad OP are exposed in the same direction. That is, the FPC connection pad 251 and the open pad OP are exposed toward the bottom surface of the display panel 110. In addition, metal ink is printed along the side of the lower substrate 230 to connect the FPC connection pad 251 to the open pad OP. In this case, the metallic ink may be printed by a continuous discharge method or a discharge method corresponding to a repetitive pulse. The metal ink may cover the entirety of the open pad OP and the FPC connection pad 251, or may cover only a portion of the open pad OP or the FPC connection pad 251. Thus, the connection member 410 may be disposed to cover a portion of the open pad OP and a portion of the FPC connection pad 251. For example, the metal ink may include silver (Ag). Accordingly, the connection member 410 may be a streamlined structure formed of silver (Ag).

Fig. 6 is a sectional view taken along line a-a' of fig. 4. More specifically, fig. 6 is a sectional view schematically showing a section of the display panel 110 taken along line a-a' of fig. 4.

Referring to fig. 6, a display panel 110 according to an exemplary embodiment of the present disclosure is divided into an active area a/a and a non-active area I/a on the periphery of the active area a/a. The active area a/a refers to an area where an image is actually displayed on the display panel 110, and the non-active area I/a refers to an area on the display panel 110 except for the area where the image is actually displayed. The non-active area I/a is located around the active area a/a to surround the active area a/a. For example, the non-active area I/a may have a closed loop shape such as a ring shape.

The upper substrate 240 and the lower substrate 230 facing each other are also divided into an active area a/a and a non-active area I/a surrounding the active area a/a. The lower substrate 230 may have a size larger than that of the upper substrate 240. The lower and

upper substrates

230 and 240 may function as a supporting member and a protective member, and various components included in the display panel 110 are disposed on the protective member. The lower substrate 230 and the upper substrate 240 may be fixed in a flat state or in a bent state, or may be repeatedly bent and extended. The lower and

upper substrates

230 and 240 may be formed of glass or plastic-based polymer material. The lower substrate 230 and the upper substrate 240 have light transmitting characteristics and thus may be transparent or translucent.

The display panel 110 includes a color filter layer 232, a light control layer 270, and a pixel array layer 242 between a lower substrate 230 and an upper substrate 240 that are facing-bonded to each other. A state in which the lower substrate 230 and the upper substrate 240 are joined as being spaced apart from each other is referred to as a cell (cell), the pixel array layer 242 is disposed on the lower substrate 230, and the color filter layer 232 is disposed on the upper substrate 240. The display panel 110 in a cell state includes a light control layer 270 between the upper substrate 240 and the lower substrate 230. The light control layer 270 includes a light control material. The upper and lower

polarizing plates

220 and 210 may be respectively bonded to the top and bottom surfaces of the display panel 110 in a unit state.

The light control material controls and filters light generated by the display device 100 to cause each pixel of the display device 100 to emit light having a particular brightness. For example, the light control material may be a liquid crystal material that enables the respective pixels to emit light with controlled luminance using the polarity of light generated from the backlight unit 120 at the back of the light control material. Alternatively, the light control material may be an organic light emitting element in which each pixel emits light with controlled luminance. That is, in a predetermined gap between the upper substrate 240 and the lower substrate 230, a liquid crystal or an organic light emitting element may be disposed. Fig. 1 illustrates an example in which a display device 100 according to an exemplary embodiment of the present disclosure is a liquid crystal display device including a backlight unit 120. However, the present disclosure is not limited thereto. It should be understood that in the organic light emitting display device, the organic light emitting element used as the light control material and the backlight unit 120 are not included, and the pressure sensitive touch sensor 125 is separately included.

In order to bond the upper substrate 240 and the lower substrate 230, a sealant 260 is coated on the non-active region I/a between the upper substrate 240 and the lower substrate 230. The light control layer 270 is surrounded by an encapsulant 260.

The color filter layer 232 disposed on the bottom surface of the upper substrate 240 is divided into a plurality of color filters and may include a black matrix 233 to cover the non-active area I/a of the display panel 110. The black matrix 233 may include a photosensitive pigment or carbon black. The black matrix 233 may absorb light and may not reflect light. The black matrix 233 is configured to cover various components under the black matrix 233 to be not visually recognized by a user when the user views the display device 100. The metal pattern MP is disposed under the black matrix 233 and may also be covered by the black matrix 233.

The pixel array layer 242 disposed on the top surface of the lower substrate 230 includes a plurality of pixel driving circuits corresponding to the plurality of pixels, respectively. Embedded capacitive touch sensor 243 is embedded in pixel array layer 242.

The display device 100 according to an exemplary embodiment of the present disclosure includes an in-cell capacitive touch sensor 243 directly disposed on the lower substrate 230 within the display panel 110. In addition, the display device 100 according to an exemplary embodiment of the present disclosure includes a pressure-sensitive touch sensor 125 outside the display panel 110. That is, the display device 100 according to the exemplary embodiment of the present disclosure recognizes a touch by combining a plurality of touch sensors. Thus, the display device 100 includes the in-cell capacitive touch sensor 243 between the upper substrate 240 and the lower substrate 230 of the display panel 110 and the pressure sensitive touch sensor 125 under the display panel 110. Fig. 6 shows an example in which the display panel 110 includes an in-cell capacitive touch sensor 243 disposed between the upper substrate 240 and the lower substrate 230. However, the present disclosure is not limited thereto. The display panel 110 may include one of various different types of sensors, such as a touch sensor on a cartridge disposed on the top surface of the upper substrate 240 or a hybrid touch sensor disposed on the top surface of the upper substrate 240 and the top surface of the lower substrate 230. The pressure-sensitive touch sensor 125 may be disposed under the display panel 110 as embedded in the backlight unit 120.

In this case, the in-cell capacitive touch sensor 243 may be a projected (projected) capacitive touch sensor. The projected capacitive touch sensor recognizes touch and touch coordinates based on a change in the amount of charge between charges accumulated between the touch sensor and a finger having static electricity and flowing through the body of a user when the finger of the user touches the display device 100 and the charges accumulated when contact is not made. Here, the pressure-sensitive touch sensor 125 may be a resistive touch sensor. The display device 100 according to the exemplary embodiment of the present disclosure will obtain touch coordinates using the in-cell capacitive touch sensor 243 and also obtain touch pressure using the pressure sensitive touch sensor 125. The touch coordinates and the touch pressure may be recognized at the same time. To this end, the pressure-sensitive touch sensor 125 may be applied with a first touch driving signal and the in-cell capacitive touch sensor 243 may be applied with a second touch driving signal.

The driving period of the display panel 110 may be a repetition of a period in which an image is displayed and a period in which a user touch is recognized. A voltage (e.g., a common voltage) to be commonly applied to all the pixels is applied to the respective pixels through a common electrode, which is one of two electrodes constituting the respective pixels. Here, if the common electrode includes a plurality of common electrode groups (blocks), the common voltage is applied during a driving period in which an image is displayed through the display panel 110. In addition, the touch sensing signal may be applied during a driving period in which a touch of a user is recognized through the display panel 110. That is, the in-cell capacitive touch sensor 243 may include a plurality of common electrode groups.

If the common electrode is used only for displaying an image on the display panel 110, the common electrode may be manufactured as a thin film type electrode integrated with respect to all pixels. However, if the common electrode is used to display an image on the display panel 110 and also to recognize the touch coordinates of the user on the display panel, the common electrode is advantageously divided into a plurality of common electrode groups to recognize the touch coordinates of the user. Accordingly, the in-cell capacitive touch sensor 243 may include a plurality of common electrode groups and may be implemented to be suitable for time division (time division) driving to function as a common electrode and a touch electrode.

More specifically, if the display panel 110 is driven to display an image during the display driving mode, the common voltage is applied to the plurality of common electrode groups. That is, the plurality of common electrode groups function as common electrodes facing the pixel electrodes and forming an electric field. In addition, if the display panel 110 is driven to recognize a user touch during the touch driving mode, the touch driving voltage is applied to the plurality of common electrode groups. Then, the touch of the user is sensed by recognizing a capacitance formed between a touch pointer (e.g., a finger of the user, a pen, etc.) and a common electrode group corresponding to a position of the touch pointer. That is, the plurality of common electrodes also function as the in-cell capacitive touch sensor 243.

In order to transfer the common voltage or the second touch driving signal to the plurality of common electrode groups, a plurality of touch signal lines respectively corresponding to the plurality of common electrode groups may be connected. If the driving mode of the display panel 110 is the display driving mode, the common voltage supplied from the common voltage supply unit is equally applied to all of the plurality of common electrode groups through the plurality of touch signal lines. If the driving mode of the display panel 110 is the touch driving mode, the second touch driving signal generated in the second touch integrated circuit is transferred to all or some of the plurality of common electrode groups through the plurality of touch signal lines.

The second touch driving signal provided by the second touch integrated circuit or the common voltage provided by the common voltage supply unit is transferred to the plurality of common electrode groups through the plurality of touch signal lines. The second touch integrated circuit or the common voltage supply unit is disposed on one side of the edge of the display panel 110. Thus, a plurality of touch signal lines are connected to the respective common electrode groups and extend to one side of the edge of the display panel 110. A plurality of touch signal lines connected to one side of an edge of the display panel 110 from each of the plurality of common electrode groups are arranged to correspond to the active area a/a on the pixel array layer 242. The plurality of common electrode groups may be connected to each other in contact with the plurality of touch signal lines or may be connected to each other through an additional contact pattern. That is, each of the plurality of common electrode groups is electrically connected to the plurality of touch signal lines.

Here, a plurality of touch signal lines are disposed between the plurality of common electrode groups in the active area a/a and the lower substrate 230. In other words, a plurality of touch signal lines are disposed on the pixel array layer 242 in the active area a/a. That is, a plurality of touch signal lines are included in the pixel driving circuit as one component of the pixel driving circuit. However, the positions of the plurality of touch signal lines are not limited thereto. For example, the plurality of touch signal lines may be disposed on the same plane as a member constituting the plurality of thin film transistors or may be disposed higher than the member. As an example, a plurality of common electrode groups are provided on a plurality of thin film transistors included in the pixel driving circuit.

The FPC250 may include various integrated circuits such as a first touch integrated circuit or a second touch integrated circuit. A chip-type first touch integrated circuit or a second touch integrated circuit may be bonded to the FPC 250. In the FPC250, a line connected to the first touch integrated circuit or the second touch integrated circuit provided outside the display panel may be provided. Here, the second touch integrated circuit and the first touch integrated circuit may be different components or may be the same component. Otherwise, in the FPC250, a line to which a ground voltage from the system is applied may be set. The extension line of the FPC250 forms an end of the FPC connection pad 251. A predetermined electrical signal is applied from the FPC connection pad 251 to the conductive layer IM. Here, the open pad OP of the metal pattern MP is electrically connected to the FPC connection pad 251 through the connection member 410. Thus, the conductive layer IM may be electrically connected to the FPC connection pad 251.

The conductive layer IM is deposited to cover the bottom surface of the lower substrate 230. That is, the conductive layer IM covers the entire bottom surface of the lower substrate 230 generally corresponding to the active area a/a and the non-active area I/a. In addition, the conductive layer IM may be deposited to cover the bottom surface of the lower substrate 230 and not to overlap with a portion of the non-active region I/a. The conductive layer IM is disposed between the pressure sensitive touch sensor 125 and the in-cell capacitive touch sensor 243. A conductive layer IM may be deposited on the bottom surface of the lower substrate 230 to be disposed between the pressure sensitive touch sensor 125 and the in-cell capacitive touch sensor 243. The conductive layer IM provides an equipotential surface on the bottom surface of the lower substrate 230 and thus may reduce or minimize interference between various electrical signals.

For example, the conductive layer IM may suppress interference between the first touch driving signal and the second touch driving signal. For this, the conductive layer IM may be electrically connected to a ground line of the system to be grounded. That is, the conductive layer IM may provide a smooth discharge path to the display panel 110. In this case, the predetermined electrical signal applied to the conductive layer IM is a ground voltage. Alternatively, to sense the touch pressure of the user, the conductive layer IM may be a touch sensor facing the pressure-sensitive touch sensor 125. In this case, the predetermined electrical signal applied to the conductive layer IM may be a third touch driving signal that forms a potential difference in response to the first touch driving signal and thus can sense pressure. Alternatively, to sense the touch pressure of the user, the conductive layer IM may be a secondary touch sensor of the pressure-sensitive touch sensor 125. In this case, the conductive layer IM may be applied with a first touch driving signal through the first touch integrated circuit, similar to the pressure-sensitive touch sensor 125.

The conductive layer IM is formed of a material capable of forming an equipotential surface more rapidly and uniformly. The conductive layer IM is located on a path of light generated in the display device 100 and radiated to the outside of the display device 100. Thus, preferably, the conductive layer IM may have excellent optical properties. For example, the conductive layer IM may be formed of a light transmissive material so that light radiated from the backlight unit 120 under the display panel 110 to the outside of the display device 100 through the lower polarizing plate 210 can pass through. Preferably, the conductive layer IM may have a light transmittance of 90% or more in a visible light band range. In addition, the conductive layer IM may preferably have an average light reflectance of less than 1% in a visible light wavelength range. Thus, it is possible to reduce or minimize a reduction in visibility of the display device caused by reflection of external light incident into the display device 100 from the outside. For example, the conductive layer IM may be formed of Indium Tin Oxide (ITO) to have light-transmitting characteristics and also have high electrical conductivity.

However, the conductive layer IM is advantageously optically transparent. Thus, there is a limit in increasing the thickness of the conductive layer IM to reduce the sheet resistance of the conductive layer IM. That is, if the thickness of the conductive layer IM is increased so that the conductive layer IM becomes an equipotential surface in a short time, the light transmittance of the conductive layer IM is reduced. Therefore, the metal pattern MP is formed along the edge of the conductive layer IM to make the conductive layer IM a uniform equipotential surface in the entire area in a short time and not to reduce the light transmittance of the conductive layer IM.

The conductive layer IM is electrically connected to the FPC250 through the metal pattern MP and the connection member 410. For example, the conductive layer IM is formed of Indium Tin Oxide (ITO) and the metal pattern MP is formed of silver (Ag), the metal pattern MP having a lower sheet resistance than the conductive layer IM. Here, as shown in fig. 6, the contact resistance at the interface formed when the metal pattern MP is located on the bottom surface of the conductive layer IM is smaller than the contact resistance at the interface formed on the assumption that the FPC250 is in contact with the conductive layer IM. With the metal pattern MP having high conductivity and electrically connecting the conductive layer IM with the FPC250, an electrical signal can be rapidly transferred to all edges of the conductive layer IM. Thus, the conductive layer IM can be made an equipotential surface more quickly and uniformly. In addition, if the connection member 410 and the metal pattern MP are formed of the same material, the contact resistance formed at the interface between the metal pattern MP and the connection member 410 can be reduced. In addition, with the connection member 410 having high conductivity like the metal pattern MP, the electrical signal can be more rapidly transferred to the open pad OP of the metal pattern MP.

Fig. 7 is a sectional view taken along line B-B' of fig. 4. More specifically, fig. 7 is a sectional view schematically showing a section of the display panel 110 taken along line B-B' of fig. 4. That is, as compared with fig. 6, fig. 7 illustrates a sectional view of a portion other than the portions of the open pad OP and the FPC connection pad 251 of the metal pattern MP electrically connected to each other in the display panel 110 illustrated in fig. 4. More specifically, fig. 7 is a sectional view of a portion in which the source driver 290 is disposed between two extension portions EX if the metal pattern MP has the two extension portions EX as shown in fig. 3.

Referring to fig. 7, the source driver 290 configured to apply an electrical signal to the data line on the top surface of the lower substrate 230 is mounted in the form of a driving Integrated Circuit (IC) corresponding to the non-active area I/a. Pads 244 configured to receive various electrical signals applied to the pixel array layer 242 may be disposed on the edges of the pixel array layer 242. The pad 244 may be electrically connected to the FPC connection pad 251 through an Anisotropic Conductive Film (ACF) 280. In this case, the FPC connection pad 251 electrically connected to the pad 244 may be the same as or different from the FPC connection pad 251 electrically connected to the metal pattern MP as shown in fig. 6. The ACF film 280 is formed by dispersing conductive particles in a resin film. When the film is cured by heat and pressure due to being pressed, the conductive particles conduct electricity by electrically connecting the pads 244 with the FPC connection pads 251. Meanwhile, in a region where the extension EX portion does not protrude, the metal pattern MP is entirely covered with the protective coating OC and overlaps the lower polarizing plate 210. The metal pattern MP is disposed to correspond to the non-active region I/a.

That is, referring to fig. 4, 6 and 7, in the display device 100 according to the exemplary embodiment of the present disclosure, the metal pattern MP having a closed loop shape and surrounding around the non-active area I/a is disposed under the lower substrate 230. The respective extension portions EX of the metal pattern MP are disposed on both sides of the source driver 290, and the open pad OP is exposed at one end of each extension portion EX. The FPC connection pad 251 protrudes further than the edge of the lower substrate 230 to correspond to the extension portion EX. The FPC connection pad 251 and the open pad OP of the metal pattern MP are electrically connected through the connection member 410. The connection member 410 is fixed to be in contact with the side of the lower substrate 230. That is, the conductive layer IM covering the bottom surface of the lower substrate 230 is electrically connected with the FPC250 disposed on the top surface of the lower substrate 230 through the metal pattern MP and the connection member 410.

The display apparatus 100 according to the exemplary embodiment of the present disclosure has been described, the backlight unit 120 including the light source 124 is included in the display apparatus 100 by way of example, but the present disclosure is not limited thereto. For example, if the light control material is implemented by an organic light emitting element that does not require a separate light source 124, typically outside the display panel 110, the backlight unit 120 can be replaced by the pressure-sensitive touch sensor 125.

Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the present disclosure. Accordingly, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and do not limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above-described exemplary embodiments are illustrative in all respects and not limiting on the present disclosure. The scope of the present disclosure should be understood based on the following claims, and all technical concepts within the equivalent scope thereof should be understood as falling within the scope of the present disclosure.

Claims

1. A display device, comprising:

a display panel defining an active area displaying an image and a non-active area outside the active area, the display panel including a substrate having a first surface and a second surface opposite to the first surface;

a plurality of pixels on the first surface of the substrate in the active region, each pixel including a pixel driving circuit;

a transparent conductive layer on the second surface of the substrate, the transparent conductive layer covering the active region and a portion of the non-active region;

a metal pattern on the second surface of the substrate located in the non-active region, the metal pattern being electrically connected to the transparent conductive layer and having a lower resistance than that of the transparent conductive layer, the metal pattern including an extension protruding toward an edge of the second surface of the substrate and receiving an electrical signal, the metal pattern serving as a conductive path to reduce a potential difference with respect to the electrical signal in the entire area of the transparent conductive layer; and

wherein the transparent conductive layer has a sheet resistance of less than 300 Ω/sq and the metal pattern has a line resistance of 1 Ω/mm or less.

2. The display device according to claim 1, further comprising a first type of touch sensor inside or above the display panel and a second type of touch sensor below the display panel, the display device determining a user's touch by a combination of the first type of touch sensor and the second type of touch sensor.

3. The display device of claim 2, wherein the first type of touch sensor is an in-cell capacitive touch sensor that utilizes a common electrode of the display panel as a sense electrode.

4. The display device of claim 2, wherein the second type of touch sensor is a pressure sensitive touch sensor.

5. The display device according to claim 1, wherein the transparent conductive layer is one of: the shielding layer, the electrodes of the sensor, and the facing of the pressure sensitive touch sensor.

6. The display device according to claim 1, wherein the transparent conductive layer has a multilayer structure in which a layer having a high refractive index and a layer having a low refractive index are alternately stacked.

7. The display device of claim 1, wherein the metal pattern is in direct contact with an outer edge of the transparent conductive layer.

8. The display device according to claim 7, wherein the metal pattern has a closed loop shape.

9. The display device of claim 8, wherein the metal pattern surrounds the active region of the substrate.

10. The display device according to claim 1, wherein the metal pattern is formed by a printing method or a dispensing method using a metal ink.

11. A display device, comprising:

a metal pattern in the non-active region on an outer edge of the transparent conductive layer, wherein the metal pattern includes an extension protruding toward an edge of the second surface of the substrate and receiving an electrical signal or a ground voltage;

a protective coating on the metal pattern, the protective coating having a width greater than the metal pattern;

a Flexible Printed Circuit (FPC) bonded to one side of an edge of the first surface of the substrate, wherein a partial area of the FPC does not overlap the first surface of the substrate, wherein on the partial area of the FPC that does not overlap the substrate, a Flexible Printed Circuit (FPC) connection pad exposed toward a bottom surface of the display panel is provided; and

an open pad at an end adjacent to the extended portion of the Flexible Printed Circuit (FPC) connection pad, wherein the protective coating exposes the open pad toward the bottom surface of the display panel, and the open pad is electrically connected to the Flexible Printed Circuit (FPC) connection pad by means of a connection member to receive the electrical signal, wherein the connection member is formed on the Flexible Printed Circuit (FPC) connection pad, a side surface of the substrate, and the open pad.

12. The display device according to claim 11, wherein the metal pattern has a closed loop shape.

13. The display device of claim 12, wherein the metal pattern surrounds the active region of the substrate.

14. The display device according to claim 11, wherein the transparent conductive layer has a multilayer structure in which a layer having a high refractive index and a layer having a low refractive index are alternately stacked.

15. The display device according to claim 12, wherein the transparent conductive layer has a sheet resistance of less than 300 Ω/sq and the metal pattern has a line resistance of 1 Ω/mm or less.