CN106896552B - display device - Google Patents

Abstract

The present invention provides a display device comprising: a display panel defining an active area displaying an image and a non-active area outside the active area, the display panel having a first type of touch sensor embedded therein and including a A substrate with a first surface and a second surface opposite to the first surface; a plurality of pixels in an active region on the first surface of the substrate, each pixel including a pixel drive circuit; a transparent conductive layer on the substrate The second surface covers the active region and a portion of the inactive region; and a metal pattern in the inactive region on the second surface of the substrate, the metal pattern is electrically connected to the transparent conductive layer and has a smaller size than the transparent conductive layer The resistance of the metal pattern includes an extension that protrudes toward the edge of the second surface of the substrate and receives an electrical signal from the outside, the metal pattern serves as a conductive for reducing the potential difference with respect to the electrical signal in the entire area of the transparent conductive layer path.

Description

display device

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No. 10-2015-0152833 filed on October 31, 2015 and Korean Patent Application No. 10-2015-0190310 filed on December 30, 2015 in the Korean Intellectual Property Office, Its disclosure is incorporated herein by reference for all purposes as fully set forth herein.

technical field

The present disclosure relates to a display device and a method of manufacturing the same, and more particularly, to a display device including a touch sensor.

Background technique

Generally, when a display device capable of recognizing a user's touch is implemented, after the touch screen panel has been separately manufactured, it is then bonded to the display panel. That is, the touch electrodes have been individually formed using a glass substrate, a plastic substrate, a film, or a plate as a supporting member. Then, the support member on which the touch electrodes are formed has been bonded to the display panel with an adhesive sheet or an adhesive to realize a touch function.

In recent years, according to the trend toward light-weight and thin display devices, conventional techniques have been replaced by techniques of forming touch sensors in display panels. That is, touch electrodes are provided on a display panel using the display panel as a supporting member without a separate supporting member or a touch sensor is provided in the display panel. Thus, a display device including a display panel with a touch function has been realized.

Where a touch sensor is formed in or on a display panel, the touch sensor is physically very close to various components of the display panel. Thus, interference between the touch sensor and other components needs to be considered. In order for the touch sensor of the display device to more accurately recognize the user's touch, it is necessary to consider factors that cause unintentional interference in the touch sensor. However, due to the industrial trend towards ultra-thin display panels, unintentional interference has not been satisfactorily dealt with.

In addition, two types of touch sensors are embedded together in the display device to recognize the user's touch, thereby providing the user with various user interfaces (UI) and user experiences (UX) while displaying images. In order for such a plurality of touch sensors to harmoniously implement user touch without interfering with each other, it is necessary to optimize the positional relationship between the two types of touch sensors.

SUMMARY OF THE INVENTION

Accordingly, the present disclosure is directed to provide a display device and a method of manufacturing the same that substantially obviate one or more of the problems due to limitations and disadvantages of the related art.

An advantage of the present disclosure is to provide a display device with enhanced touch functionality.

According to the conventional technology, the touch sensor is embedded in the display panel, so that the direct and indirect influence of the various components of the display panel on the touch sensor is increased. In particular, if the touch sensor is a projected capacitive touch sensor, once the user touches, the touch signal is identified by measuring the capacitance value between one touch electrode and the user or by measuring the capacitance value between the touch electrodes. In this case, the capacitance value to be measured changes due to interference with various components of the display panel. Such changes can degrade touch functionality. In addition, for the pixel driving circuit of the display panel, the characteristics of each component may be changed by the direct and indirect influence of the touch sensor. Such changes can degrade image quality. In addition, since the pressure-sensitive touch sensor and the capacitive touch sensor are embedded together, interference can occur between the two touch sensors. Such interference can degrade touch sensing accuracy.

One object of the present disclosure is achieved by the following embodiment, which provides a display device in which a metal pattern having a width of several hundreds of nanometers and having an interface with the conductive layer is formed on a lower substrate (one surface of which is covered with a conductive layer) .

Another object of the present disclosure is achieved by the following embodiments, which provide a display device in which a metal pattern having an interface with a conductive layer is formed using a printing process or a dispensing process so as not to damage components of a display panel.

Another object of the present disclosure is achieved by the following embodiments, which provide a display in which a ground voltage can be applied to a conductive layer via a metal pattern with low sheet resistance to block interference when a user's touch is sensed through a capacitive touch sensor device.

Still another object of the present disclosure is achieved by the following embodiments, which provide a secondary sensor serving as a pressure-sensitive touch sensor or a conductive layer facing the sensor disposed between the capacitive touch sensor and the pressure-sensitive touch sensor. display device between sensitive touch sensors. Thus, the touch sensor is more easily and quickly applied to the conductive layer with a metal pattern with low sheet resistance.

Still another object of the present disclosure is achieved by the following embodiments, which provide a display device including a conductive layer having electrical conductivity and light transmission properties and also satisfying optical properties and electrical properties for a low level of external light reflection.

Still another object of the present disclosure is achieved by the following embodiment, which provides a display device in which the FPC and the conductive layer are electrically connected by a metal pattern, thus, compared with the case where the FPC and the conductive layer are not electrically connected by the metal pattern, in Low contact resistance at the interface and more stable grounding of the conductive layer.

Still another object of the present disclosure is achieved by the following embodiments, which provide a display device in which the metal pattern is continuously formed along all edges of the bottom surface of the conductive layer, and thus, the interface between the metal pattern and the conductive layer serves as a The path of the electrical signal applied to the conductive layer and the conductive layer can become an equipotential surface more rapidly.

Still another object of the present disclosure is achieved by the following embodiments, which provide a display device in which a conductive layer is more stably grounded through a metal pattern, thus enabling a user's sense of touch through an in-cell capacitive touch sensor The noise of the touch signal is minimized.

Still another object of the present disclosure is achieved by the following embodiments, which provide a display device in which static electricity accumulated in a display device is efficiently discharged through a metal pattern through a conductive layer.

The advantages and objects of the present disclosure are not limited to the foregoing objects, and other objects not mentioned above will be apparent to those of ordinary skill in the art from the following description.

According to one aspect of the present disclosure, there is provided a display device including an in-cell capacitive touch sensor and a pressure-sensitive touch sensor. In this display device, a light-transmitting conductive layer is provided on the entire bottom surface of the lower substrate. The opaque metal pattern is formed in a closed loop shape along the edge of the conductive layer. Thus, even if the light-transmitting conductive layer has a relatively large size, an electrical signal can be received through a metal pattern having a low sheet resistance and thus an equipotential surface can be rapidly formed.

According to one aspect of the present disclosure, there is provided a display device including: a display panel defining an active area displaying an image and a non-active area outside the active area, the display panel including a substrate having a first surface and a second surface opposite the first surface; a plurality of pixels on the first surface of the substrate located in the active region, each pixel including a pixel driver circuit; on the substrate's first surface a transparent conductive layer on the second surface, the transparent conductive layer covering the active area and a portion of the inactive area; and a metal pattern in the inactive area on the second surface of the substrate, the metal pattern being electrically connected to all the transparent conductive layer and having a resistance smaller than that of the transparent conductive layer, the metal pattern including an extension protruding toward the edge of the second surface of the substrate and receiving an electrical signal, and a display device without the metal pattern In contrast, the metal pattern serves as a conductive path to reduce a potential difference with respect to the electrical signal in the entire area of the transparent conductive layer.

According to one aspect of the present disclosure, there is provided a display device including: a display panel defining an active area displaying an image and a non-active area outside the active area, the display panel including a substrate having a first surface and a second surface opposite the first surface; a plurality of pixels on the first surface of the substrate in an active region, each pixel including a pixel driver circuit; in a transparent conductive layer on the second surface of the substrate covering the active area and a portion of the inactive area; and a non-active area on the outer edge of the transparent conductive layer metal pattern in .

The details of exemplary embodiments of the present disclosure will be included in the detailed description of the present disclosure and the accompanying drawings.

According to an embodiment of the present disclosure, it is possible to provide a display device in which a metal pattern having a width of several hundreds of nanometers and having an interface with the conductive layer is formed on a lower substrate, one surface of which is covered with a conductive layer.

In addition, according to embodiments of the present disclosure, it is possible to provide a display device in which a metal pattern having an interface with a conductive layer is formed using a printing process or a dispensing process so as not to damage components of a display panel.

Also, according to embodiments of the present disclosure, a display device in which a ground voltage can be applied to a conductive layer via a metal pattern having low sheet resistance to block interference when a user's touch is sensed through a capacitive touch sensor can be provided.

In addition, according to an embodiment of the present disclosure, it is possible to provide a display device in which a conductive layer functioning as a secondary sensor of a pressure-sensitive touch sensor or a facing sensor is provided between a capacitive touch sensor and a pressure-sensitive touch sensor. Thus, the touch sensor can be more easily and quickly applied to the conductive layer by a metal pattern with low sheet resistance.

In addition, according to the embodiments of the present disclosure, it is possible to provide a display device including a conductive layer having conductivity and light transmission characteristics for a low level of external light reflection and also satisfying optical characteristics and electrical characteristics.

In addition, according to the embodiments of the present disclosure, it is possible to provide a display device in which the FPC and the conductive layer are electrically connected through a metal pattern, thus making contact at an interface compared to a case in which the FPC and the conductive layer are not electrically connected through the metal pattern The resistance is low and the conductive layer is more stably grounded.

In addition, according to the embodiments of the present disclosure, it is possible to provide a display device in which the metal pattern is continuously formed along all edges of the bottom surface of the conductive layer, and thus, the interface between the metal pattern and the conductive layer serves as a source for the metal pattern to be applied to the conductive layer. The path of the electrical signal of the conductive layer and the conductive layer can become an equipotential surface more quickly.

In addition, according to the embodiments of the present disclosure, it is possible to provide a display device in which the conductive layer is more stably grounded through the metal pattern, thus enabling the detection of a user's touch signal sensed through an in-cell capacitive touch sensor. Noise is minimized.

In addition, according to the embodiments of the present disclosure, it is possible to provide a display device in which static electricity accumulated in the display device is effectively discharged through the metal pattern through the conductive layer.

The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned above will be apparent to those of ordinary skill in the art from the following description.

The objects to be achieved by the present disclosure, the aspects and effects of the present disclosure described above do not necessarily specify essential features of the claims, and thus the scope of the claims is not limited to the specific disclosure of the present disclosure.

Description of drawings

The above and other aspects, features, and other advantages of the present disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein:

1 is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure;

2A is a perspective view of a display panel showing a top surface of a display panel according to an exemplary embodiment of the present disclosure;

2B is a perspective view of the display panel showing the bottom surface of the display panel in a cell state;

3 is an enlarged plan view of the bottom surface of the display panel shown in FIG. 2B;

4 is a partial perspective view of a display panel illustrating a connection structure of an extension of a metal pattern on a bottom surface of a lower substrate of the display panel and an FPC on a top surface of the lower substrate according to an exemplary embodiment of the present disclosure picture;

FIG. 5 is an enlarged perspective view enlarging the area Z shown in FIG. 4;

Figure 6 is a cross-sectional view taken along line A-A' of Figure 4; and

Fig. 7 is a cross-sectional view taken along line B-B' of Fig. 4 .

Detailed ways

The advantages and features of the present disclosure and methods for achieving the advantages and features of the present disclosure will be more clearly understood from the various exemplary embodiments described below by referring to the accompanying drawings. However, the present disclosure is not limited to the following exemplary embodiments, but may be implemented in various forms. Various exemplary embodiments are provided only to complete the disclosure of the present disclosure and to fully provide those of ordinary skill in the art with the scope of the disclosure to which the present disclosure pertains, and the present disclosure will be defined by the appended claims.

The shapes, sizes, ratios, angles, numbers, etc. shown in the drawings to describe the exemplary embodiments of the present disclosure are only examples, and the present disclosure is not limited thereto.

The same reference numbers refer to the same elements throughout the specification.

In the following description, detailed descriptions of well-known related art may be omitted in order to avoid unnecessarily obscuring the subject matter of the present disclosure.

Terms such as "comprising," "having," and "including" as used herein are generally intended to allow for the addition of other components, unless the term is used in conjunction with the term "only."

Any reference to the singular may include the plural unless expressly stated otherwise.

Components are interpreted to include ordinary error ranges even if not expressly stated.

When the positional relationship between two components is described using terms such as "on", "above", "below" and "next", one or more components may be located between the two components, Unless these terms are used with the terms "immediately" or "directly".

Although the terms "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component referred to below in the technical concept of the present disclosure may be the second component.

Terms such as first, second, A, B, (a), (b), etc. may be used when describing components of the present disclosure. These terms are only used to distinguish parts from other parts. Accordingly, the nature, order, sequence or number of corresponding components is not limited by these terms. It will be understood that when an element is referred to as being "connected" or "coupled to" another element, it can be directly connected or coupled to the other element with the other element "interposed" therebetween to or coupled to, or "connected to" or "coupled to" another element through yet another element.

The features of the various exemplary embodiments of the present disclosure may be engaged or combined with each other, in part or in whole, and may be interlocked and operated in technically various ways as fully understood by those of ordinary skill in the art, and various exemplary Embodiments may be performed independently of each other or in association with each other.

Hereinafter, a display device 100 according to an exemplary embodiment of the present disclosure will be described with reference to FIG. 1 .

FIG. 1 is an exploded perspective view of a display device 100 according to an exemplary embodiment of the present disclosure.

1 , a display apparatus 100 according to an exemplary embodiment of the present disclosure includes: a display panel 110 for displaying an image; a backlight unit 120 for providing light from a rear surface of the display panel 110 ; and for protecting the display apparatus 100 cover glass 131 of the screen.

The display panel 110 includes a lower substrate 230 on which the pixel array layer 242 is disposed and an upper substrate 240 on which the color filter layer 232 is disposed. The lower substrate 230 and the upper substrate 240 are bonded together facing each other with a light control material between the lower substrate 230 and the upper substrate 240 .

The backlight unit 120 includes an optical sheet 121 , a light guide plate 123 under the optical sheet 121 , a light source 124 beside or under the light guide plate 123 , and a pressure-sensitive touch sensor 125 under the light source 124 and the light guide plate 123 . Additionally, the backlight unit 120 includes a cover bottom 129 disposed under the pressure-sensitive touch sensor 125 to receive other components of the backlight unit 120 and to connect to the system ground to connect the display device 100 to ground.

The light sources 124 may be, for example, edge-type or direct-type LED assemblies. The LED assembly may include a plurality of LED packages and a PCB on which the plurality of LED packages are arranged and mounted at a predetermined distance from each other. Alternatively, the light source 124 may be a fluorescent lamp, such as a cold cathode fluorescent lamp or an external electrode fluorescent lamp. Although FIG. 1 shows the light source 124 of an edge type, the light source 124 may be of a direct type and is not limited thereto. If the light source 124 is a direct type LED assembly, the light guide plate 123 may be omitted from the backlight unit 120 . If a fluorescent lamp is used as the light source 124 , the backlight unit 120 may further include a lamp guide to protect the fluorescent lamp and concentrate light toward the light guide plate 123 .

The display panel 110 and the backlight unit 120 are modularized into one body through the guide panel 127 , the front frame 132 and the cover bottom 129 , and constitute the display apparatus 100 . For example, the display apparatus 100 according to an exemplary embodiment of the present disclosure may further include a front frame 132 to accommodate various modular components of the display panel 110 and the backlight unit 120 . The front frame 132 may be configured to cover top surface edges and sides of the display panel 110 . Alternatively, the display panel 110 and the backlight unit 120 whose edges are surrounded by the guide panel 127 having a square frame shape may be disposed on the cover bottom 129 and integrated.

Details of the display panel 110 will be described later with reference to FIGS. 2A , 2B and FIGS. 3 to 5 .

FIG. 2A is a perspective view of the display panel 110 showing the top surface of the display panel 110 according to an exemplary embodiment of the present disclosure.

Referring to FIG. 2A , the display panel 110 includes a lower substrate 230 and an upper substrate 240 that are bonded to each other to achieve a cell state. In addition, the lower polarizing plate 210 and the upper polarizing plate 220 are bonded to the bottom surface and the top surface of the unit, respectively. That is, the display panel 110 includes a lower substrate 230 , an upper substrate 240 , a lower polarizing plate 210 and an upper polarizing plate 220 .

On the top surface of the lower substrate 230, gate lines for applying various driving signals to the pixels and data lines for applying data voltages to the pixels are provided. A plurality of pixels are arranged on the display panel 110 to correspond to the intersections between the gate lines and the data lines. As will be described later with reference to FIG. 6 , a pixel array layer 242 including a plurality of pixel driving circuits respectively corresponding to the plurality of pixels is provided on the top surface of the lower substrate 230 . In addition, on the bottom surface of the upper substrate 240, a color filter layer 232 including a plurality of color filters corresponding to a plurality of pixels, respectively, is provided.

Each pixel includes two electrodes that form an electric field. The two electrodes that form an electric field are called a pixel electrode and a common electrode. The pixel electrodes receive data voltages inherent to each pixel from the data lines. The common electrode is disposed to correspond to the pixel electrode so as to form a horizontal electric field or a vertical electric field with the pixel electrode. The common electrode is implemented so that the same voltage can be applied to all of the plurality of pixels. Unlike the pixel electrode, the common electrode can thus be implemented integrally with respect to all of the plurality of pixels. Alternatively, a plurality of pixels may be grouped into several blocks, and a common electrode may be provided to each pixel group. That is, the common electrode may include a plurality of common electrode groups. The common electrode is located on the path of light irradiated to the outside of the display device 100, and thus may be formed of a material having excellent light transmission characteristics. For example, the common electrode may be formed of a transparent conductive material such as indium tin oxide (ITO).

Since a plurality of pixels are disposed on the display panel 110, the display panel 110 is divided into an active area A/A displaying an image and an inactive area I/A surrounding the active area A/A.

Although pixel driving circuits are configured on the top surface of the lower substrate 230 , gate drivers for applying electrical signals to gate lines may also be mounted on the top surface of the lower substrate 230 . This mounting method is referred to as a gate-in-plane (GIP) method in which the gate driver is mounted on a region of the top surface of the lower substrate 230 other than the region where the pixel driving circuit is provided.

In addition to spaces corresponding to a plurality of pixels, the lower substrate 230 as will be described later with reference to FIG. 7 may include spaces for fixing various circuit components such as the source driver 290 . For example, a space for fixing various circuit components may be prepared in the inactive area I/A corresponding to one side of the lower substrate 230 . To this end, the lower substrate 230 may have a larger size than that of the upper substrate 240 . In addition, a part of the region of the lower substrate 230 that does not overlap with the upper substrate 240 corresponds to the inactive region I/A.

The FPC 250 is bonded to one side of the edge of the top surface of the lower substrate 230 which does not overlap with the upper substrate 240 and thus is partially exposed. Various electrical signals are supplied to the display panel 110 from the outside of the display panel 110 through the FPC 250, including predetermined electrical signals applied to the conductive layer IM.

The lower polarizing plate 210 bonded to the bottom surface of the lower substrate 230 has a size smaller than that of the lower substrate 230 . The upper polarizing plate 220 and the lower polarizing plate 210 have a size larger than that of the active area A/A. In addition, both the upper polarizing plate 220 and the lower polarizing plate 210 overlap the entire active area A/A. Therefore, the lower polarizing plate 210 is disposed over the area from the active area A/A to the non-active area I/A. Therefore, a portion of the lower substrate 230 in the inactive region I/A does not overlap with the upper substrate 240, so that a portion of the top surface of the lower substrate 230 is exposed.

In addition, the FPC 250 is bonded to the exposed portion of the top surface of the lower substrate 230 . Part of the area of the FPC 250 does not overlap the top surface of the lower substrate 230 . FPC connection pads 251 are provided on a partial area of the FPC 250 that does not overlap with the lower substrate 230 . That is, on a partial region of the FPC 250 protruding toward the side surface of the display panel 110 , the FPC connection pads 251 are provided. The FPC connection pads 251 are provided and electrically connected to the closed-loop-shaped metal patterns MP formed on the bottom surface of the lower substrate 230 . The metal pattern MP contacting the bottom surface of the lower substrate 230 will be described later with reference to FIGS. 2B and 3 . The FPC 250 will be described later with reference to FIGS. 5 and 7 .

FIG. 2B is a perspective view of the display panel showing the bottom surface of the display panel in a unit state. A structure in which the lower substrate 230 and the upper substrate 240 are bonded to each other to be spaced apart from each other is called a cell. That is, FIG. 2B shows a state in which the upper polarizing plate 220 and the lower polarizing plate 210 of the display panel 110 are not bonded to the unit. In the display panel 110 according to the exemplary embodiment of the present disclosure, the metal pattern MP having a closed loop shape is formed along the edge of the bottom surface of the lower substrate 230 .

More specifically, the metal pattern MP having a lower sheet resistance than that of the conductive layer IM is formed in a closed-loop shape along the edge of the conductive layer IM to reduce or minimize the relative distance of the conductive layer IM from the FPC connection pads. The potential difference between the point of 251 and the point of the conductive layer IM relatively close to the FPC connection pad 251 . The metal pattern MP having a lower sheet resistance than that of the conductive layer IM serves as a conductive highway to uniformly distribute a predetermined electrical signal with reduced or minimized RC delay from the FPC connection pads 251 Transfer to the entire area of the conductive layer IM.

The metal pattern MP includes at least two branches, extensions EX. The extension portion EX of the metal pattern MP protrudes toward the outside of the ring of the metal pattern MP. In other words, the extension EX protrudes toward the edge of the display panel 110 . The extension portion EX is provided adjacent to the FPC connection pad 251 . The specific positions of the metal pattern MP and the extension part EX will be described later with reference to FIGS. 3 and 4 .

FIG. 3 is an enlarged plan view of the bottom surface of the display panel shown in FIG. 2B .

The conductive layer IM continuously deposited over from the active region A/A to the inactive region I/A may be disposed on the bottom surface of the lower substrate 230 . The conductive layer IM advantageously has a light reflectivity of less than 1% in the visible wavelength range. Therefore, it can be used as a path for light generated inside the display device 100 and radiated to the outside. In addition, the conductive layer IM advantageously has a sheet resistance of less than 300 Ω/sq. Therefore, it can form an equipotential surface more quickly and uniformly.

的厚度，以使导电层IM具有低薄层电阻。The conductive layer IM may have a multilayer structure in which layers having a high refractive index and layers having a low refractive index are alternately stacked in order. For example, the conductive layer IM may include a first inorganic layer with a refractive index of n1, a second inorganic layer with a refractive index of n2, and a third inorganic layer with a refractive index of n3, which are sequentially stacked. Herein, n1, n2 and n3 may have a relationship of n2<n1 and n2<n3 with respect to light in the visible light wavelength range. One or more of the first to third inorganic layers may be formed of a conductive material. For example, the third inorganic layer may be formed by depositing indium tin oxide. In this case, the third inorganic layer may be formed to at least

thickness so that the conductive layer IM has a low sheet resistance.

Meanwhile, when the third inorganic layer is formed of a conductive transparent material such as indium tin oxide (ITO), the light transmittance of the third inorganic layer decreases as the thickness of the third inorganic layer increases. In order to compensate the light transmittance of the third inorganic layer, second inorganic layers having a low refractive index and first inorganic layers having a high refractive index are alternately stacked. For example, the first inorganic layer may be formed of niobium oxide (Nb ₂ O ₅ ), the second inorganic layer may be formed of silicon oxide (SiO ₂ ), and the third inorganic layer may be formed of indium tin oxide (ITO). Therefore, the conductive layer IM having a light reflectivity of less than 1%, a light transmittance of 95% or more and a sheet resistance of 300Ω/sq or less can be obtained.

In addition, in the case of forming the third inorganic layer of indium tin oxide (ITO), if the thickness of the third inorganic layer is increased in order to reduce the sheet resistance of the conductive layer IM, the light reflectivity is increased to 1% or more large, or the transmittance is reduced to less than 90%. Therefore, the conditions for forming the third inorganic layer of indium tin oxide (ITO) are adjusted so that the conductive layer IM advantageously has a sheet resistance of 300Ω/sq or less and a light reflectivity of 1% or less. If the size of the conductive layer IM increases due to an increase in the size of the display panel 110, the resistivity of the conductive layer IM alone may not be able to rapidly form an equipotential surface on the entire area of the conductive layer IM. When an electrical signal is applied to the conductive layer IM through the point of application, there may be a potential difference between the point of application and a point located at the conductive layer IM remote from the point of application. This potential difference is proportional to the size of the conductive layer IM.

In order to solve this problem, a predetermined electric signal for forming the equipotential of the conductive layer IM is applied through the metal pattern MP, the metal pattern MP has a sheet resistance smaller than that of the conductive layer IM, and is advantageously similar to that of the conductive layer IM. Entire edge contact. That is, it is advantageous that the metal pattern MP and the conductive layer IM form an interface as large as possible without invading the active region A/A. Therefore, a predetermined electrical signal can be applied to the conductive layer IM through the interface formed by the contact between the metal pattern MP and the conductive layer IM.

A metal pattern MP having a sheet resistance smaller than that of the conductive layer IM is disposed on the bottom surface of the lower substrate 230 on which the conductive layer IM is formed. Therefore, the metal pattern MP is in contact with the bottom surface of the conductive layer IM. More specifically, the metal pattern MP forms an interface with the third inorganic layer of the conductive layer IM. In other words, the metal pattern MP is in direct contact with one surface of the third inorganic layer that provides conductivity to the conductive layer IM. As the size of the interface between the opaque metal pattern MP and the light-transmitting conductive layer IM increases, the contact resistance between the metal pattern MP and the conductive layer IM decreases. Therefore, when disposed to correspond to the non-active area I/A, the metal pattern MP may be formed in a closed-loop shape along the edge of one surface of the conductive layer IM in order to increase or maximize the gap between the metal pattern MP and the light-transmitting conductive layer IM the size of the interface. For example, if the display panel 110 has a square shape in plan view, the metal pattern MP may have a square ring shape. Also, the metal electrode may have a closed-loop shape, but is not limited thereto. For example, referring to FIGS. 2B to 3 , a part of the metal pattern MP extending between the two extension parts EX may be opened, so that the metal pattern MP may have an open-loop shape.

When the metal pattern MP is opaque, as described above, it is desirable not to invade the active area A/A as much as possible. In other words, the metal pattern MP is disposed such that the size of the interface between the metal pattern MP and the light-transmitting conductive layer IM is increased or maximized, and at the same time, the metal pattern MP does not intrude into the active area A/A as much as possible. For example, the metal pattern MP may surround the active area A/A of the lower substrate 230 . That is, the metal pattern MP may form a closed loop shape along the edge of the bottom surface of the conductive layer IM. The metal pattern MP may be printed on the bottom surface of the lower substrate 230 using metal ink to have a closed loop shape.

The metallic ink refers to a composition in a paste state in which highly conductive particles such as metal particles are dispersed in a solvent. The metallic ink has fluidity, viscosity, and surface tension suitable for forming a thread by an inkjet printing method. The metallic ink may include, as a substrate, an organic solvent that is liquid at room temperature and that metal particles can be uniformly dispersed. In addition, the metallic ink may contain a dispersant that promotes uniform dispersion of the metallic particles in the solvent. For example, the organic solvent may be a polar organic material such as triethylene glycol monoethyl ether ( _TGME , _{C8H18O4 )} with alcohol functionality of appropriate viscosity. Additionally, the organic solvent may be an alkaline material such as tetramethylammonium hydroxide (TMAH, (CH ₃ ) ₄ NOH)). For example, the organic solvent contained in the metallic ink may be a polar organic solvent. Organic solvents with different properties may be included in the metal ink in consideration of the properties of the metal particles, the properties of the dispersant, the properties of the substrate on which printing is performed, and the properties of the cleaning solution used in the post-sintering cleaning process.

The metal pattern MP may contain a metal material or metal alloy material having excellent conductivity, such as silver (Ag), copper (Cu), molybdenum (Mo), chromium (Cr), and the like. That is, the metal particles contained in the metal ink may be a metal material or a metal alloy material having excellent conductivity, such as silver (Ag), copper (Cu), molybdenum (Mo), chromium (Cr), or the like. If the conductive layer IM includes indium-tin oxide (ITO) to achieve high light transmittance, the metal pattern MP advantageously has a line resistance of 1Ω/mm or less so that the metal pattern MP has a thinner layer than the conductive layer IM Low resistance sheet resistance. Sheet resistance is a value derived by applying various correction factors including the thickness and shape of the measurement object to the line resistance of the unique characteristic of the measurement object. Typically, sheet resistance is measured by a 4-probe test.

Ensuring low sheet resistance means ensuring low wire resistance. For example, if the metal pattern MP is formed of silver (Ag) having a lower resistivity than that of indium-tin oxide (ITO), the contact resistance between the conductive layer IM and the metal pattern MP decreases. If the metal pattern MP is formed of silver (Ag), the line resistance of the metal pattern MP may be reduced to at least 0.005Ω/mm. Therefore, the metal pattern MP may have a line resistance of 0.005Ω/mm to 1Ω/mm. If the metal pattern MP is formed of silver (Ag), when the metal pattern MP has a width W of 400 to 800 nm and a height of 0.1 to 1 μm, the metal pattern MP may have a line resistance of 0.005 to 1 Ω/mm. That is, if the metal pattern MP is formed of silver (Ag), when the metal pattern MP has a width W of 400 nm to 800 nm and a height of 0.1 μm to 1 μm, the metal pattern MP has more The sheet resistance of the conductive layer IM is lower sheet resistance. If the metal pattern MP is formed of silver (Ag), when the metal ink used to form the metal pattern MP contains silver (Ag) particles in a weight ratio of 20 to 30% and the metal ink has a viscosity of 10 cp to 30 cp, the metal pattern MP The MP may have a width W of 400 nm to 800 nm and a height of 0.1 μm to 1 μm.

The metal pattern MP may be formed thick enough to have a lower sheet resistance than that of the light-transmitting conductive layer IM. In order to form a thick metal pattern MP by deposition, a long manufacturing time is generally required, which means that the display panel 110 may be exposed to damage for a long time during the manufacturing process. That is, environmental conditions for fabricating the metal patterns MP and the amount of time for fabricating the metal patterns MP are major factors for the performance of the display device 100 to be managed.

If the metal pattern MP is manufactured by printing or dispensing, the uniformity at the surface or edge of the metal pattern MP may be reduced compared to the case where the metal pattern MP is manufactured by deposition. However, the metal pattern MP with a large thickness can be formed in a much shorter time. That is, if the metal pattern MP is formed of a material that can be printed or dispensed, the surface or edge of the metal pattern MP may have low uniformity compared to a case where the metal pattern MP is formed of a material that can be deposited. Since for a thick and wide metal pattern MP having a thickness of several μm or a width of several hundreds of nm, the shape accuracy is relatively unimportant compared to the metal pattern constituting the micro-integrated circuit. Therefore, if a thick and wide metal pattern MP having a thickness of several μm or a width of several hundreds of nm is formed, it is preferable to manufacture the metal pattern MP by printing or dispensing. When the metal pattern MP is manufactured by printing or dispensing, the thickness and width of the metal pattern MP can be adjusted by adjusting the discharge amount or viscosity of the metal ink.

As mentioned above, the metallic pattern is formed by printing or dispensing metallic ink. Thus, metallic inks are formed from materials that can be printed or dispensed. The printing or dispensing method may be pneumatic type, piezoelectric type, and electric type, which are only examples, but may not be limited thereto. Pneumatic methods use air pressure control and a microprocessor-based timer. Piezo-type methods are methods of propelling liquids using the piezoelectric principle. The electric type method is a method in which an electromagnetism is formed on a coil and a liquid is pushed.

For example, a pneumatic type method may be a method of discharging liquid by driving a pneumatic piston with a spherical tip at its end and a spring. If the piston is raised by pneumatic pressure, the liquid in the syringe is expelled through the spray nozzle by pneumatic pressure. If the pneumatic pressure of the piston is blocked, the piston blocks the spray nozzle by the return spring pressure and stops the discharge of the liquid. The liquid is discharged by repeating the piston movement by air pressure and the operation by the pressure of the return spring.

For example, a piezoelectric type method may be a method in which liquid is discharged by installing a piezoelectric linear motor using a piezoelectric actuator, which can be precisely applied by applying a voltage, as a driving source by installing a piezoelectric linear motor in a syringe and using piezoelectricity as a driving source. control the displacement. Since high-speed and high-precision control is possible, the liquid can be discharged in a very small amount. In addition, the discharge amount of the liquid can be controlled according to changes in the driving voltage, the driving frequency, and the waveform of the applied voltage applied to the piezoelectric element.

For example, an electric-type method may be a method of discharging liquid by moving a coil up and down according to a solenoid driving method. In an electrical type method like the piezoelectric method, the actuator can be installed in the syringe. Solenoid valves can be controlled with low power and use electrical signals, therefore, opening/closing times can be quickly controlled. In addition, the discharge amount of the liquid can be precisely controlled by appropriately adjusting the number of windings of the coil and the input current.

As described above, the metal pattern MP according to the exemplary embodiment of the present disclosure may be formed by printing or dispensing. The metal pattern MP is formed by drying and curing the printed metal ink. In this case, the solvent or dispersant contained in the metal ink may remain in the metal pattern MP. That is, the metal pattern MP may include not only a metal material or a metal alloy material but also an organic material such as a solvent or a dispersant.

The fluidity of the metal ink is removed by removing the solvent from the metal ink, and the metal particles are sintered at a high temperature, so that the metal ink printed on the lower substrate 230 is fixed to the lower substrate 230 . Therefore, a cured metal pattern MP can be obtained.

Then, a washing process is performed using distilled water so that the lower polarizing plate 210 can be bonded to the bottom surface of the lower substrate 230 without foreign matter. Since various foreign substances are generated and retained on the lower substrate 230 and the upper substrate 240 when the metallic ink is dried and sintered, it is generally desirable to wash the surface of the unit. In order to avoid the loss of the metal patterns MP during the washing process using distilled water, the metal patterns MP are covered with a protective coating OC before the washing process. In order to insulate the metal pattern MP from other components, the protective coating OC may include an insulating material. For example, the protective coating OC may include tetramethylammonium hydroxide-based (TMAH, (CH ₃ ) ₄ NOH)), ethylene glycol-based, or polyimide-based materials. Similar to the metal pattern MP, the protective coating OC may be formed by printing a protective material having viscosity and fluidity on the lower substrate 230 to cover the metal pattern MP, and then curing the protective material. The protective coating OC may also surround the active area A/A along the non-active area I/A so as not to invade the active area A/A.

Since the protective coating OC covers the metal pattern MP, the protective coating OC may have a width greater than that of the metal pattern MP. Therefore, there is a region where the lower substrate 230 is in contact with the protective coating OC without the metal pattern MP therebetween. The extension part EX of the metal pattern MP extends to the edge of the display panel. In addition, open pads OP are formed at the ends of the extending portions EX of the metal pattern MP, respectively, and the overcoat OC exposes the open pads OP. That is, except for the open pads OP, the metal pattern MP is covered with the insulating protective coating OC so that the open pads OP are defined.

The lower polarizing plate 210 is bonded to the bottom surface of the lower substrate 230 on which the metal pattern MP and the protective coating OC are formed. Details of the positional relationship between the lower polarizing plate 210 and the metal pattern MP and the position of the open pad OP will be described later with reference to FIGS. 4 and 5 .

4 is a partial perspective view of the display panel 110 showing the connection structure of the extension part EX of the metal pattern MP on the bottom surface of the lower substrate 230 of the display panel and the FPC 250 on the top surface of the lower substrate 230 . FIG. 5 is an enlarged perspective view enlarging the area Z shown in FIG. 4 .

After rinsing treatment with distilled water, the lower polarizing plate 210 and the upper polarizing plate 220 are bonded to the bottom and top surfaces of the unit in which the upper substrate 240 and the lower substrate 230 are bonded, respectively. The lower polarizing plate 210 is bonded to the bottom surface of the lower substrate 230 to overlap the metal pattern MP. In this case, the lower polarizing plate 210 exposes the extension portion EX of the metal pattern MP so that the open pad OP is not covered by the lower polarizing plate 210 . In addition, the lower polarizing plate 210 may be bonded to overlap the active area A/A without overlapping the extension part EX. As described above, the FPC connection pads 251 are provided on the protruding partial area of the FPC 250 without overlapping with the lower substrate 230 . The open pad OP is provided on the extension EX protruding from the metal pattern MP. A portion of the area of the FPC 250 that protrudes and does not overlap the lower substrate 230 and the extension EX overlap the lower substrate 230 therebetween so that the FPC connection pads 251 are adjacent to the open pads OP. In addition, connection members 410 that electrically connect the FPC connection pads 251 and the open pads OP are formed on the FPC connection pads 251 , the side surfaces of the lower substrate 230 , and the open pads OP. The connection member 410 may be formed by printing metallic ink in a dot shape and then curing the metallic ink. The metallic ink may be a silver (Ag) paste. Therefore, the connection member 410 may be a thermally cured silver (Ag) paste. That is, the open pads OP are covered with thermally cured silver (Ag) paste.

5, the connection between the FPC connection pad 251 and the open pad OP will be described in detail. The FPC connection pads 251 and the open pads OP are exposed in the same direction. That is, the FPC connection pads 251 and the open pads OP are exposed toward the bottom surface of the display panel 110 . In addition, metallic ink is printed along the side surface of the lower substrate 230 to connect the FPC connection pads 251 to the open pads OP. In this case, the metallic ink may be printed by a continuous discharge method or a discharge method corresponding to repeated pulses. The metal ink may cover the entirety of the open pad OP and the FPC connection pad 251 , or may cover only a part of the open pad OP or the FPC connection pad 251 . Thus, the connection member 410 may be provided to cover a portion of the open pad OP and a portion of the FPC connection pad 251 . For example, the metallic ink may include silver (Ag). Therefore, the connection member 410 may be a streamlined structure formed of silver (Ag).

Fig. 6 is a cross-sectional view taken along line A-A' of Fig. 4 . More specifically, FIG. 6 is a cross-sectional view schematically showing a cross-section of the display panel 110 taken along the line A-A' of FIG. 4 .

6 , the display panel 110 according to an exemplary embodiment of the present disclosure is divided into an active area A/A and a non-active area I/A on the periphery of the active area A/A. The active area A/A refers to an area on the display panel 110 where an image is actually displayed, and the non-active area I/A refers to an area on the display panel 110 other than the area where an image is actually displayed. The non-active area I/A is located around the active area A/A to surround the active area A/A. For example, the inactive region I/A may have a closed-loop shape such as a ring shape.

The upper substrate 240 and the lower substrate 230 facing each other are also divided into an active area A/A and an inactive area I/A surrounding the active area A/A. The lower substrate 230 may have a larger size than that of the upper substrate 240 . The lower substrate 230 and the upper substrate 240 may function as support members and protective members, and various components included in the display panel 110 are disposed on the protective members. The lower substrate 230 and the upper substrate 240 may be fixed in a flat state or in a curved state, or may be repeatedly bent and stretched. The lower substrate 230 and the upper substrate 240 may be formed of glass or a plastic-based polymer material. The lower substrate 230 and the upper substrate 240 have light-transmitting properties and thus may be transparent or translucent.

The display panel 110 includes a color filter layer 232, a light control layer 270, and a pixel array layer 242 between the lower substrate 230 and the upper substrate 240, which are facing and bonded to each other. The state where the lower substrate 230 and the upper substrate 240 are bonded as if spaced apart from each other is called a cell, the pixel array layer 242 is provided on the lower substrate 230 , and the color filter layer 232 is provided on the upper substrate 240 . The display panel 110 in the unit state includes the light control layer 270 between the upper substrate 240 and the lower substrate 230 . The light management layer 270 includes a light management material. The upper polarizing plate 220 and the lower polarizing plate 210 may be bonded to the top and bottom surfaces of the display panel 110 in a unit state, respectively.

The light control material controls and filters the light generated by the display device 100 so that each pixel of the display device 100 emits light with a specific brightness. For example, the light control material may be a liquid crystal material that enables each pixel to emit light with controlled brightness using the polarity of light generated from the backlight unit 120 at the back of the light control material. Alternatively, the light management material may be an organic light emitting element in which each pixel emits light with controlled brightness. That is, in a predetermined gap between the upper substrate 240 and the lower substrate 230, a liquid crystal or an organic light emitting element may be disposed. FIG. 1 illustrates an example in which a display device 100 according to an exemplary embodiment of the present disclosure is a liquid crystal display device including a backlight unit 120 . However, the present disclosure is not limited thereto. It should be understood that, in the organic light emitting display device, the organic light emitting element and the backlight unit 120 used as light control materials are not included, but the pressure-sensitive touch sensor 125 is separately included.

In order to bond the upper substrate 240 and the lower substrate 230 , a sealant 260 is coated on the inactive region I/A between the upper substrate 240 and the lower substrate 230 . Light management layer 270 is surrounded by encapsulant 260 .

The color filter layer 232 disposed on the bottom surface of the upper substrate 240 is divided into a plurality of color filters and may include a black matrix 233 to cover the inactive area I/A of the display panel 110 . The black matrix 233 may include photosensitive pigments or carbon black. The black matrix 233 can absorb light and cannot reflect light. The black matrix 233 is configured to cover various different components under the black matrix 233 so as not to be visually recognized by the user when the user views the display apparatus 100 . The metal pattern MP is disposed under the black matrix 233 and may also be covered by the black matrix 233 .

The pixel array layer 242 disposed on the top surface of the lower substrate 230 includes a plurality of pixel driving circuits respectively corresponding to the plurality of pixels. The in-cell capacitive touch sensor 243 is embedded in the pixel array layer 242 .

The display device 100 according to an exemplary embodiment of the present disclosure includes an in-cell capacitive touch sensor 243 disposed directly on the lower substrate 230 within the display panel 110 . In addition, the display device 100 according to the exemplary embodiment of the present disclosure includes the pressure-sensitive touch sensor 125 outside the display panel 110 . That is, the display apparatus 100 according to an exemplary embodiment of the present disclosure recognizes a touch by incorporating a plurality of touch sensors. Thus, the display device 100 includes the in-cell capacitive touch sensor 243 between the upper substrate 240 and the lower substrate 230 of the display panel 110 and the pressure-sensitive touch sensor 125 below the display panel 110 . FIG. 6 shows an example in which the display panel 110 includes the in-cell capacitive touch sensor 243 disposed between the upper substrate 240 and the lower substrate 230 . However, the present disclosure is not limited thereto. The display panel 110 may include one of various different types of sensors, such as a touch-on-cell sensor disposed on the top surface of the upper substrate 240 or a hybrid touch sensor disposed on the top surface of the upper substrate 240 and the top surface of the lower substrate 230 sensor. The pressure-sensitive touch sensor 125 may be disposed under the display panel 110 as embedded in the backlight unit 120 .

In this case, the in-cell capacitive touch sensor 243 may be a projected capacitive touch sensor. The projected capacitive touch sensor is based on the difference of the amount of electric charge between the electric charge accumulated between the touch sensor and the finger having static electricity and flowing through the user's body when the user's finger touches the display apparatus 100 and the electric charge accumulated when the contact is not made. Change to recognize touch and touch coordinates. Here, the pressure-sensitive touch sensor 125 may be a resistive touch sensor. The display device 100 according to the exemplary embodiment of the present disclosure will obtain touch coordinates using the in-cell capacitive touch sensor 243 and also obtain touch pressure using the pressure-sensitive touch sensor 125 . Touch coordinates and touch pressure can be recognized at the same time. To this end, the pressure sensitive touch sensor 125 may be applied with a first touch drive signal and the in-cell capacitive touch sensor 243 may be applied with a second touch drive signal.

The driving period of the display panel 110 may be a repetition of a period in which an image is displayed and a period in which a user's touch is recognized. A voltage to be commonly applied to all pixels (eg, a common voltage) is applied to each pixel through a common electrode, which is one of two electrodes constituting each pixel. Here, if the common electrode includes a plurality of common electrode blocks, the common voltage is applied during a driving period in which an image is displayed by the display panel 110 . Also, the touch sensing signal may be applied during a driving period in which the user's touch is recognized through the display panel 110 . That is, the in-cell capacitive touch sensor 243 may include a plurality of common electrode groups.

If the common electrode is only used for displaying an image on the display panel 110, the common electrode may be fabricated as a thin film type electrode integrated with respect to all pixels. However, if the common electrodes are used to display images on the display panel 110 and also identify the user's touch coordinates on the display panel, the common electrodes are advantageously divided into a plurality of common electrode groups to identify the user's touch coordinates. Therefore, the in-cell capacitive touch sensor 243 may include a plurality of common electrode groups and may be implemented suitable for time division driving to function as common electrodes and touch electrodes.

More specifically, if the display panel 110 is driven to display an image during the display driving mode, a common voltage is applied to the plurality of common electrode groups. That is, the plurality of common electrode groups function as common electrodes facing the pixel electrodes and forming an electric field. In addition, if the display panel 110 is driven to recognize a user's touch during the touch driving mode, a touch driving voltage is applied to the plurality of common electrode groups. Then, the user's touch is sensed by identifying the capacitance formed between the touch pointer (eg, the user's finger, pen, etc.) and the common electrode group corresponding to the location of the touch pointer. That is to say, the plurality of common electrodes also function as the in-cell capacitive touch sensor 243 .

In order to transmit a common voltage or a second touch driving signal to the plurality of common electrode groups, a plurality of touch signal lines respectively corresponding to the plurality of common electrode groups may be connected. If the driving mode of the display panel 110 is the display driving mode, the common voltage supplied from the common voltage supply unit is equally applied to all of the plurality of common electrode groups through the plurality of touch signal lines. If the driving mode of the display panel 110 is the touch driving mode, the second touch driving signal generated in the second touch integrated circuit is transmitted to all or some electrode groups of the plurality of common electrode groups through the plurality of touch signal lines .

The second touch driving signal provided by the second touch integrated circuit or the common voltage provided by the common voltage supply unit is transferred to the plurality of common electrode groups through the plurality of touch signal lines. The second touch integrated circuit or the common voltage supply unit is disposed on one side of the edge of the display panel 110 . Thus, a plurality of touch signal lines are connected to the respective common electrode groups and extend to one side of the edge of the display panel 110 . A plurality of touch signal lines connected from each of the plurality of common electrode groups to one side of the edge of the display panel 110 are arranged to correspond to the active areas A/A on the pixel array layer 242 . The plurality of common electrode groups may be connected to each other in contact with the plurality of touch signal lines or may be connected to each other through additional contact patterns. That is, each of the plurality of common electrode groups is electrically connected to the plurality of touch signal lines.

Here, a plurality of touch signal lines are disposed between a plurality of common electrode groups in the active area A/A and the lower substrate 230 . In other words, a plurality of touch signal lines are disposed on the pixel array layer 242 in the active area A/A. That is, a plurality of touch signal lines are included in the pixel driving circuit as one component of the pixel driving circuit. However, the positions of the plurality of touch signal lines are not limited thereto. For example, the plurality of touch signal lines may be arranged on the same plane as the components constituting the plurality of thin film transistors or may be arranged higher than the components. As an example, a plurality of common electrode groups are provided on a plurality of thin film transistors included in a pixel driving circuit.

The FPC 250 may include various integrated circuits, such as a first touch integrated circuit or a second touch integrated circuit. The chip-type first touch integrated circuit or the second touch integrated circuit may be bonded to the FPC 250 . In the FPC 250, a line connected to the first touch integrated circuit or the second touch integrated circuit disposed outside the display panel may be provided. Here, the second touch integrated circuit and the first touch integrated circuit may be different components or may be the same component. Otherwise, in the FPC 250, a line to which the ground voltage from the system is applied may be provided. The extension lines of the FPC 250 form ends of the FPC connection pads 251 . A predetermined electrical signal is applied from the FPC connection pad 251 to the conductive layer IM. Here, the open pads OP of the metal patterns MP are electrically connected to the FPC connection pads 251 through the connection members 410 . Thus, the conductive layer IM may be electrically connected to the FPC connection pads 251 .

A conductive layer IM is deposited to cover the bottom surface of the lower substrate 230 . That is, the conductive layer IM covers the entire bottom surface of the lower substrate 230 generally corresponding to the active regions A/A and the inactive regions I/A. In addition, the conductive layer IM may be deposited to cover the bottom surface of the lower substrate 230 and not overlap with a portion of the inactive region I/A. The conductive layer IM is disposed between the pressure-sensitive touch sensor 125 and the in-cell capacitive touch sensor 243 . A conductive layer 1M may be deposited on the bottom surface of the lower substrate 230 to be disposed between the pressure-sensitive touch sensor 125 and the in-cell capacitive touch sensor 243 . The conductive layer IM provides an equipotential surface on the bottom surface of the lower substrate 230 and thus may reduce or minimize interference between various electrical signals.

For example, the conductive layer IM may suppress interference between the first touch driving signal and the second touch driving signal. To this end, the conductive layer IM may be electrically connected to the ground line of the system for grounding. That is, the conductive layer IM may provide a smooth discharge path to the display panel 110 . In this case, the predetermined electrical signal applied to the conductive layer IM is the ground voltage. Alternatively, in order to sense the user's touch pressure, the conductive layer IM may be a touch sensor facing the pressure-sensitive touch sensor 125 . In this case, the predetermined electrical signal applied to the conductive layer IM may be a third touch driving signal that forms a potential difference in response to the first touch driving signal and thus can sense pressure. Alternatively, the conductive layer IM may be a secondary touch sensor of the pressure-sensitive touch sensor 125 in order to sense the user's touch pressure. In this case, similar to the pressure-sensitive touch sensor 125, the conductive layer IM may be applied with the first touch driving signal through the first touch integrated circuit.

The conductive layer IM is formed of a material capable of forming an equipotential surface more rapidly and uniformly. The conductive layer IM is located on the path of light generated in the display device 100 and radiated to the outside of the display device 100 . Thus, preferably, the conductive layer IM may have excellent optical properties. For example, the conductive layer IM may be formed of a light-transmitting material so that light radiated from the backlight unit 120 under the display panel 110 to the outside of the display device 100 through the lower polarizing plate 210 can pass therethrough. Preferably, the conductive layer IM may have a light transmittance of 90% or more in the visible light wavelength range. In addition, preferably, the conductive layer IM may have an average light reflectivity of less than 1% in the visible light wavelength range. Thus, it is possible to reduce or minimize a decrease in visibility of the display device caused by reflection of external light incident into the display device 100 from the outside. For example, the conductive layer IM may be formed of indium tin oxide (ITO) to have light-transmitting properties and also have high electrical conductivity.

However, the conductive layer IM is advantageously optically transparent. Thus, there is a limit in increasing the thickness of the conductive layer IM to reduce the sheet resistance of the conductive layer IM. That is, if the thickness of the conductive layer IM is increased so that the conductive layer IM becomes an equipotential surface in a short time, the light transmittance of the conductive layer IM is lowered. Therefore, the metal pattern MP is formed along the edge of the conductive layer IM to make the conductive layer IM a uniform equipotential surface in the entire area in a short time and not reduce the light transmittance of the conductive layer IM.

The conductive layer IM is electrically connected to the FPC 250 through the metal pattern MP and the connection member 410 . For example, the conductive layer IM is formed of indium tin oxide (ITO) and the metal pattern MP is formed of silver (Ag), and the metal pattern MP has a lower sheet resistance than the conductive layer IM. Here, as shown in FIG. 6 , the contact resistance at the interface formed when the metal pattern MP is on the bottom surface of the conductive layer IM is smaller than the contact resistance at the interface formed when the FPC 250 is assumed to be in contact with the conductive layer IM. With the metal pattern MP having high conductivity and electrically connecting the conductive layer IM and the FPC 250, electrical signals can be rapidly transferred to all edges of the conductive layer IM. Therefore, the conductive layer IM can become an equipotential surface more quickly and uniformly. In addition, if the connection member 410 and the metal pattern MP are formed of the same material, the contact resistance formed at the interface between the metal pattern MP and the connection member 410 can be reduced. In addition, with the connection member 410 having high conductivity like the metal pattern MP, the electrical signal can be more rapidly transferred to the open pad OP of the metal pattern MP.

Fig. 7 is a cross-sectional view taken along line B-B' of Fig. 4 . More specifically, FIG. 7 is a cross-sectional view schematically showing a cross-section of the display panel 110 taken along the line B-B' of FIG. 4 . That is, compared with FIG. 6 , FIG. 7 shows parts other than the open pads OP and the FPC connection pads 251 of the metal patterns MP that are electrically connected to each other in the display panel 110 shown in FIG. 4 . Sectional view of the outside part. More specifically, FIG. 7 is a cross-sectional view of a portion in which the source driver 290 is disposed between the two extensions EX if the metal pattern MP has the two extensions EX as shown in FIG. 3 .

7, the source driver 290 configured to apply electrical signals to the data lines on the top surface of the lower substrate 230 is mounted in the form of a driver integrated circuit (IC) corresponding to the non-active area I/A. Pads 244 configured to receive various electrical signals applied to the pixel array layer 242 may be disposed on the edge of the pixel array layer 242 . The pads 244 may be electrically connected to the FPC connection pads 251 through an anisotropic conductive film (ACF) 280 . In this case, the FPC connection pads 251 electrically connected to the pads 244 may be the same as or different from the FPC connection pads 251 electrically connected to the metal patterns MP as shown in FIG. 6 . The ACF film 280 is formed by dispersing conductive particles in a resin film. When the film is pressed and cured by heat and pressure, the conductive particles conduct electricity by electrically connecting the pads 244 with the FPC connection pads 251 . Meanwhile, in a region where the extension part EX does not protrude, the metal pattern MP is entirely covered by the protective coating OC and overlaps the lower polarizing plate 210 . The metal patterns MP are disposed to correspond to the non-active regions I/A.

That is, referring to FIGS. 4 , 6 and 7 , in the display device 100 according to an exemplary embodiment of the present disclosure, the metal pattern MP having a closed-loop shape and surrounding the inactive region I/A is disposed on the lower substrate 230 below. The respective extension parts EX of the metal pattern MP are disposed on both sides of the source driver 290, and the open pad OP is exposed at one end of each extension part EX. The FPC connection pads 251 protrude further than the edge of the lower substrate 230 to correspond to the extension EX. The FPC connection pads 251 and the open pads OP of the metal patterns MP are electrically connected through the connection member 410 . The connection member 410 is fixed to be in contact with the side surface of the lower substrate 230 . That is, the conductive layer IM covering the bottom surface of the lower substrate 230 is electrically connected with the FPC 250 disposed on the top surface of the lower substrate 230 through the metal pattern MP and the connection member 410 .

The display device 100 according to the exemplary embodiment of the present disclosure has been described in which the backlight unit 120 including the light source 124 is included by way of example, but the present disclosure is not limited thereto. For example, the backlight unit 120 can be replaced by a pressure-sensitive touch sensor 125 if the light management material is implemented by organic light emitting elements that generally do not require a separate light source 124 outside the display panel 110 .

Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for the purpose of illustration only and do not limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above-described exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The protection scope of the present disclosure should be understood based on the following claims, and all technical concepts within the equivalent scope thereof should be understood as falling within the scope of the present disclosure.

Claims (15)

1. A display device comprising: a display panel defining an active area displaying an image and an inactive area outside the active area, the display panel including a first surface and a second surface opposite the first surface the substrate; a plurality of pixels on the first surface of the substrate in the active region, each pixel including a pixel driver circuit; a transparent conductive layer on the second surface of the substrate, the transparent conductive layer covering the active region and a portion of the inactive region; a metal pattern on the second surface of the substrate in the inactive region, the metal pattern being electrically connected to the transparent conductive layer and having a resistance lower than that of the transparent conductive layer, The metal pattern includes an extension that protrudes toward the edge of the second surface of the substrate and receives an electrical signal, the metal pattern serves as a conductive path to reduce relative to the transparent conductive layer in the entire area. the potential difference of the electrical signal; and wherein the transparent conductive layer has a sheet resistance of less than 300Ω/sq and the metal pattern has a line resistance of 1Ω/mm or less. 2. The display device of claim 1 , further comprising a first type of touch sensor inside or above the display panel and a second type of touch sensor below the display panel, the display device passing through the The combination of the first type of touch sensor and the second type of touch sensor determines a user's touch. 3. The display device of claim 2, wherein the first type of touch sensor is an in-cell capacitive touch sensor using a common electrode of the display panel as a sensing electrode. 4. The display device of claim 2, wherein the second type of touch sensor is a pressure-sensitive touch sensor. 5. The display device of claim 1, wherein the transparent conductive layer is one of: a blocking layer, an electrode of a sensor, and a facing sensor of a pressure-sensitive touch sensor. 6. The display device according to claim 1, wherein the transparent conductive layer has a multilayer structure in which layers having a high refractive index and layers having a low refractive index are alternately stacked. 7. The display device of claim 1, wherein the metal pattern is in direct contact with an outer edge of the transparent conductive layer. 8. The display device of claim 7, wherein the metal pattern has a closed loop shape. 9. The display device of claim 8, wherein the metal pattern surrounds the active region of the substrate. 10. The display device of claim 1, wherein the metal pattern is formed by a printing method or a glue dispensing method using metal ink. 11. A display device, comprising: a display panel defining an active area displaying an image and an inactive area outside the active area, the display panel including a first surface and a second surface opposite the first surface the substrate; a plurality of pixels on the first surface of the substrate in the active region, each pixel including a pixel driver circuit; a transparent conductive layer on the second surface of the substrate, the transparent conductive layer covering the active region and a portion of the inactive region; a metal pattern in the inactive region on an outer edge of the transparent conductive layer, wherein the metal pattern includes an extension that protrudes toward the edge of the second surface of the substrate and receive electrical signals or ground voltage; a protective coating on the metal pattern, the width of the protective coating being larger than that of the metal pattern; a flexible printed circuit (FPC) bonded to one side of an edge of the first surface of the substrate, wherein a partial area of the flexible printed circuit (FPC) does not overlap the first surface of the substrate, wherein On the partial area of the flexible printed circuit (FPC) that does not overlap the substrate, a flexible printed circuit (FPC) connection pad exposed toward the bottom surface of the display panel is provided; and open pads at ends of the extensions adjacent to the flexible printed circuit (FPC) connection pads, wherein the protective coating directs the open pads towards the bottom of the display panel The surface is exposed, and the open pads are electrically connected to the flexible printed circuit (FPC) connection pads by means of connection members formed to connect the flexible printed circuit (FPC) to receive the electrical signals pads, side surfaces of the substrate and on the open pads. 12. The display device of claim 11, wherein the metal pattern has a closed loop shape. 13. The display device of claim 12, wherein the metal pattern surrounds the active region of the substrate. 14. The display device according to claim 11, wherein the transparent conductive layer has a multilayer structure in which layers having a high refractive index and layers having a low refractive index are alternately stacked. 15. The display device of claim 12, wherein the transparent conductive layer has a sheet resistance of less than 300 Ω/sq and the metal pattern has a line resistance of 1 Ω/mm or less.

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