CN106888557A - A kind of preparation method of the electronic circuit board with waterproof nano coating - Google Patents
A kind of preparation method of the electronic circuit board with waterproof nano coating Download PDFInfo
- Publication number
- CN106888557A CN106888557A CN201710181050.8A CN201710181050A CN106888557A CN 106888557 A CN106888557 A CN 106888557A CN 201710181050 A CN201710181050 A CN 201710181050A CN 106888557 A CN106888557 A CN 106888557A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic circuit
- parts
- nano coating
- waterproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Abstract
The invention discloses a kind of preparation method of the electronic circuit board with waterproof nano coating, it is characterised in that comprise the following steps：Prepare waterproof nano coating selection organic hybrid nano-resin, fluorine-containing couplant, esters of silicon acis, catalyst, organic solvent, nanometer grade silica colloidal sol, ethyl acetate and distilled water well mixed, pour into homogenizer, the rotating speed of the mixer is 1300 ~ 2300r/min, 20 ~ 30min of stirring, is obtained waterproof nano coating；Spraying, drying, detection.The present invention provides a kind of preparation method of the electronic circuit board with waterproof nano coating, and main component is the common material of in the market, and cost is relatively low, and obtained electronic circuit board water resistance is strong.
Description
Technical field
The invention belongs to electronics field, and in particular to a kind of preparation of the electronic circuit board with waterproof nano coating
Method.
Background technology
Electronic product need to undergo chemistry, vibrations, Gao Chen, smog, moist and high temperature ring during using and storing, generally
The problems such as border, electronic circuit board and its electronic component device soften, deform and go mouldy there may be burn into, causes wiring board to occur
Failure.For the printed circuit board (PCB) for making electronic product has the anti-protective capability of good three, would generally after printed circuit board (PCB) debugging
Spray three anti-protective coatings.
The three-proofing coating of traditional electronic applications in the aspect effect is significant such as damp proof, dust-proof, but in waterproof side
Face is still barely satisfactory, electronic product for example mobile phone, with intelligent development, it has also become indispensable angle in daily life
Color, in some accidental causes cause mobile phone etc. to fall into water in life, once water inlet, the damage that will cause to save to user
Lose.
The waterproof and dampproof treatment that electronic product equipment is carried out at this stage, is mostly that waterproof is carried out by structure design, then
Seam protection is carried out with rubber washer plus shell seam crossing, and reaches certain classification of waterproof, such processing method can not
Tackle the problem at its root.
United States Patent (USP) US20150146396 describes a kind of electronic installation with interior waterproof coating.Waterproof electronic device
Including at least one electronic building brick for being covered by waterproof coating at least in part.Waterproof coating can be located at the inside of electronic installation.
Waterproof coating can be only in overlay electronic device inner space border part.Waterproof coating may include that one or more are distinguishable
Other border or seam, one or more of recognizable borders or seam can be located at two or more groups of electronic installation
The position or adjacent with the position that part is engaged with each other, does not indicate using the waterproof coating of what property, if normal temperature cure,
Its large-scale industrial application validity cannot be judged.
Chinese patent CN203407069U describes have the waterproof and dampproof coating of hydrophobicity the utility model discloses one kind
Circuit board, including：One substrate, surface is provided with circuit or electronic component；And a hydrophobic coating, substrate surface is layed in,
Hydrophobic coating mask has the micro-structural of most fine protrusions, and micro-structure surface is covered with non-hydrophilic base material；Micro-structural it is big
Small is 5~15 microns.The utility model can not only effective waterproof, more can shrink the moisture on surface using its waterproof and dampproof property
It is pearl, and the drying of convenient holding surface and cleaning.And due to material property, after the completion of coating can't self is conductive,
But each metallic contact can't cause the phenomenons such as loose contact or open circuit because of coating into thickness.Hydrophobic angle in coating exists
Between 110-120 degree, the globule can not be slidably, although water resistance is strengthened, but does not carry out water resistance Soak Test,
Cannot judge whether long-term use still has reliable water resistance.
The content of the invention
Regarding to the issue above, the technical problem to be solved in the present invention is to propose a kind of electronics with waterproof nano coating
The preparation method of wiring board.
To achieve the above object, the technical scheme is that：A kind of electronic circuit board with waterproof nano coating
Preparation method, comprises the following steps：
Step 1：Prepare waterproof nano coating, choose organic hybrid nano-resin, fluorine-containing couplant, esters of silicon acis, catalyst, organic
Solvent, nanometer grade silica colloidal sol, ethyl acetate and distilled water are well mixed, and pour into homogenizer, the mixer
Rotating speed be 1300 ~ 2300r/min, stir 20 ~ 30min, waterproof nano coating is obtained；
Step 2：Spraying, obtained nano paint is sprayed on circuit boards by three-axis robot, and the thickness of spraying is 1
~ 3 μm, obtain transparent waterproof nano coating；
Step 3：Drying, dries being put into baking room by the electronic circuit board of spraying, and the temperature of baking room is maintained at 40 ~ 80
DEG C, the wind speed size of baking room is controlled at 1 ~ 2 grade, and wind is dried with favouring the direction of 30 ~ 45 ° of electronic circuit board；
Step 4：Detection, electronic circuit board is dripped to by the globule of a diameter of 1.5 ~ 2.5cm, the shape of its globule is observed, if the globule
Keep spherical, and the waterproof nano coating soaked on electronic circuit board is that, by test, will be put by the electronic circuit board tested
Enter the alcoholic solution that concentration is 60 ~ 75% and soak 15 ~ 35min, take out electronic circuit board, be passed through light current after drying and tested.
Preferably, dust removal step is included before step 2 spraying process, wiring board is drawn with circuit board dust collector dedicated
On dust.
Preferably, the component of the waterproof nano coating in the step 1 is organic hybrid nanotrees according to quality parts ratio
8 ~ 15 parts of fat, 6 ~ 15 parts of fluorine-containing couplant, 3 ~ 15 parts of esters of silicon acis, 8 ~ 15 parts of catalyst, 6 ~ 19 parts of organic solvent, nanoscale dioxy
20 ~ 40 parts of 3 ~ 9 parts of SiClx colloidal sol, 6 ~ 20 parts of ethyl acetate and distilled water.
Preferably, the component of the waterproof nano coating according to quality parts ratio be 9 ~ 14 parts of organic hybrid nano-resin,
8 ~ 13 parts of fluorine-containing couplant, 5 ~ 14 parts of esters of silicon acis, 10 ~ 13 parts of catalyst, 8 ~ 17 parts of organic solvent, nanometer grade silica colloidal sol
25 ~ 35 parts of 5 ~ 8 parts, 8 ~ 22 parts of ethyl acetate and distilled water.
Preferably, the catalyst in the step 1 is selected from biocatalyst, complex compound catalyst and molecular sieve catalyst
Any.
Preferably, the organic solvent in the step 1 is styrene, perchloroethylene, trichloro ethylene, ethylene glycol and second
Alkenyl toluene.
Preferably, the light current in the step 4 is the DC voltage of 5 ~ 10V.
Preferably, the temperature in the homogenizer in the step 1 is maintained at 50 ~ 75 DEG C.
The beneficial effects of the present invention are：The present invention provides a kind of preparation of the electronic circuit board with waterproof nano coating
Method, main component is the common material of in the market, and cost is relatively low, and obtained electronic circuit board water resistance is strong, is added with
Machine solvent has more toughness by waterproof nano coating.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, following examples, are carried out to the present invention
It is further to describe in detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, this is not limited
Invention.
Embodiment 1
A kind of preparation method of the electronic circuit board with waterproof nano coating, it is characterised in that comprise the following steps：
Step 1：Prepare waterproof nano coating, choose organic hybrid nano-resin, fluorine-containing couplant, esters of silicon acis, catalyst, organic
Solvent, nanometer grade silica colloidal sol, ethyl acetate and distilled water are well mixed, and pour into homogenizer, the mixer
Rotating speed be 1300r/min, stir 20min, waterproof nano coating is obtained；
Step 2：Spraying, obtained nano paint is sprayed on circuit boards by three-axis robot, and the thickness of spraying is 1
μm, obtain transparent waterproof nano coating；
Step 3：Drying, dries being put into baking room by the electronic circuit board of spraying, and the temperature of baking room is maintained at 40 DEG C,
The wind speed size of baking room is controlled at 1 grade, and wind is dried with favouring the direction of 30 ° of electronic circuit board；
Step 4：Detection, electronic circuit board is dripped to by the globule of a diameter of 1.5cm, observes the shape of its globule, if the globule keeps
It is spherical, and wetting electronic circuit board on waterproof nano coating be by test, by by test electronic circuit board be put into it is dense
The alcoholic solution spent for 60% soaks 15min, takes out electronic circuit board, is passed through light current after drying and is tested.
Include dust removal step before step 2 spraying process, the ash on wiring board is drawn with circuit board dust collector dedicated
Dirt.
The component of the waterproof nano coating in the step 1 is 8 parts of organic hybrid nano-resin according to quality parts ratio, contains
6 parts of fluorine couplant, 3 parts of esters of silicon acis, 8 parts of catalyst, 6 parts of organic solvent, 3 parts of nanometer grade silica colloidal sol, 6 parts of ethyl acetate
With 20 parts of distilled water.
Catalyst in the step 1 is selected from any in biocatalyst, complex compound catalyst and molecular sieve catalyst
It is a kind of.
Organic solvent in the step 1 is styrene, perchloroethylene, trichloro ethylene, ethylene glycol and vinyl first
Benzene.
Light current in the step 4 is the DC voltage of 5V.
The temperature in homogenizer in the step 1 is maintained at 50 DEG C.
Embodiment 2
A kind of preparation method of the electronic circuit board with waterproof nano coating, it is characterised in that comprise the following steps：
Step 1：Prepare waterproof nano coating, choose organic hybrid nano-resin, fluorine-containing couplant, esters of silicon acis, catalyst, organic
Solvent, nanometer grade silica colloidal sol, ethyl acetate and distilled water are well mixed, and pour into homogenizer, the mixer
Rotating speed be 2300r/min, stir 30min, waterproof nano coating is obtained；
Step 2：Spraying, obtained nano paint is sprayed on circuit boards by three-axis robot, and the thickness of spraying is 3
μm, obtain transparent waterproof nano coating；
Step 3：Drying, dries being put into baking room by the electronic circuit board of spraying, and the temperature of baking room is maintained at 80 DEG C,
The wind speed size of baking room is controlled at 2 grades, and wind is dried with favouring the direction of 45 ° of electronic circuit board；
Step 4：Detection, electronic circuit board is dripped to by the globule of a diameter of 2.5cm, observes the shape of its globule, if the globule keeps
It is spherical, and wetting electronic circuit board on waterproof nano coating be by test, by by test electronic circuit board be put into it is dense
The alcoholic solution spent for 75% soaks 35min, takes out electronic circuit board, is passed through light current after drying and is tested.
Include dust removal step before step 2 spraying process, the ash on wiring board is drawn with circuit board dust collector dedicated
Dirt.
The component of the waterproof nano coating in the step 1 is 8 parts of organic hybrid nano-resin according to quality parts ratio, contains
15 parts of fluorine couplant, 15 parts of esters of silicon acis, 15 parts of catalyst, 19 parts of organic solvent, 9 parts of nanometer grade silica colloidal sol, acetic acid second
40 parts of 20 parts of ester and distilled water.
Catalyst in the step 1 is selected from any in biocatalyst, complex compound catalyst and molecular sieve catalyst
It is a kind of.
Organic solvent in the step 1 is styrene, perchloroethylene, trichloro ethylene, ethylene glycol and vinyl first
Benzene.
Light current in the step 4 is the DC voltage of 10V.
The temperature in homogenizer in the step 1 is maintained at 75 DEG C.
The preferred embodiments of the present invention are the foregoing is only, is not intended to limit the invention, although with reference to foregoing reality
Apply example to be described in detail the present invention, for a person skilled in the art, it still can be to foregoing each implementation
Technical scheme described in example is modified, or carries out equivalent to which part technical characteristic.It is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (8)
1. a kind of preparation method of the electronic circuit board with waterproof nano coating, it is characterised in that comprise the following steps：
Step 1：Prepare waterproof nano coating, choose organic hybrid nano-resin, fluorine-containing couplant, esters of silicon acis, catalyst, organic
Solvent, nanometer grade silica colloidal sol, ethyl acetate and distilled water are well mixed, and pour into homogenizer, the mixer
Rotating speed be 1300 ~ 2300r/min, stir 20 ~ 30min, waterproof nano coating is obtained；
Step 2：Spraying, obtained nano paint is sprayed on circuit boards by three-axis robot, and the thickness of spraying is 1
~ 3 μm, obtain transparent waterproof nano coating；
Step 3：Drying, dries being put into baking room by the electronic circuit board of spraying, and the temperature of baking room is maintained at 40 ~ 80
DEG C, the wind speed size of baking room is controlled at 1 ~ 2 grade, and wind is dried with favouring the direction of 30 ~ 45 ° of electronic circuit board；
Step 4：Detection, electronic circuit board is dripped to by the globule of a diameter of 1.5 ~ 2.5cm, the shape of its globule is observed, if the globule
Keep spherical, and the waterproof nano coating soaked on electronic circuit board is that, by test, will be put by the electronic circuit board tested
Enter the alcoholic solution that concentration is 60 ~ 75% and soak 15 ~ 35min, take out electronic circuit board, be passed through light current after drying and tested.
2. a kind of preparation method of electronic circuit board with waterproof nano coating according to claim 1, its feature exists
In, dust removal step is included before step 2 spraying process, draw the dust on wiring board with circuit board dust collector dedicated.
3. a kind of preparation method of electronic circuit board with waterproof nano coating according to claim 1, its feature exists
In the component of, the waterproof nano coating in the step 1 be 8 ~ 15 parts of organic hybrid nano-resin, fluorine-containing according to quality parts ratio
6 ~ 15 parts of couplant, 3 ~ 15 parts of esters of silicon acis, 8 ~ 15 parts of catalyst, 6 ~ 19 parts of organic solvent, nanometer grade silica colloidal sol 3 ~ 9
20 ~ 40 parts of part, 6 ~ 20 parts of ethyl acetate and distilled water.
4. a kind of preparation method of electronic circuit board with waterproof nano coating according to claim 3, its feature exists
In, the waterproof nano coating component according to quality parts ratio be 9 ~ 14 parts of organic hybrid nano-resin, fluorine-containing couplant 8 ~
13 parts, 5 ~ 14 parts of esters of silicon acis, 10 ~ 13 parts of catalyst, 8 ~ 17 parts of organic solvent, 5 ~ 8 parts of nanometer grade silica colloidal sol, acetic acid second
25 ~ 35 parts of 8 ~ 22 parts of ester and distilled water.
5. a kind of preparation method of electronic circuit board with waterproof nano coating according to claim 1, its feature exists
In the catalyst in the step 1 is selected from any in biocatalyst, complex compound catalyst and molecular sieve catalyst.
6. a kind of preparation method of electronic circuit board with waterproof nano coating according to claim 1, its feature exists
In the organic solvent in the step 1 is styrene, perchloroethylene, trichloro ethylene, ethylene glycol and vinyltoluene.
7. a kind of preparation method of electronic circuit board with waterproof nano coating according to claim 1, its feature exists
In the light current in the step 4 is the DC voltage of 5 ~ 10V.
8. a kind of preparation method of electronic circuit board with waterproof nano coating according to claim 1, its feature exists
In the temperature in homogenizer in the step 1 is maintained at 50 ~ 75 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710181050.8A CN106888557A (en) | 2017-03-24 | 2017-03-24 | A kind of preparation method of the electronic circuit board with waterproof nano coating |
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| CN201710181050.8A CN106888557A (en) | 2017-03-24 | 2017-03-24 | A kind of preparation method of the electronic circuit board with waterproof nano coating |
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| CN106888557A true CN106888557A (en) | 2017-06-23 |
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| CN201710181050.8A Withdrawn CN106888557A (en) | 2017-03-24 | 2017-03-24 | A kind of preparation method of the electronic circuit board with waterproof nano coating |
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Cited By (3)
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| CN107163632A (en) * | 2017-07-12 | 2017-09-15 | 合肥轻风飏电气科技有限责任公司 | A kind of plastic lamp shade heat-resisting paint |
| CN108156183A (en) * | 2018-02-13 | 2018-06-12 | 青岛厚科信息工程有限公司 | Wireless charging secrecy sensing module and its electric power storage and information transferring method |
| CN113480914A (en) * | 2021-07-06 | 2021-10-08 | 浙江大学杭州国际科创中心 | Organic-inorganic hybrid three-proofing coating and preparation method thereof |
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Application publication date: 20170623 |