CN106885549B - Guide tube, film thickness sensor and evaporation equipment - Google Patents
Guide tube, film thickness sensor and evaporation equipment Download PDFInfo
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- CN106885549B CN106885549B CN201710184003.9A CN201710184003A CN106885549B CN 106885549 B CN106885549 B CN 106885549B CN 201710184003 A CN201710184003 A CN 201710184003A CN 106885549 B CN106885549 B CN 106885549B
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- guide tube
- evaporation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
- G01B21/085—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness using thermal means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The application provides a stand pipe, film thickness sensor and evaporation equipment for reduce because of stand pipe entrance coating by vaporization thing piles up the influence to film thickness detection accuracy, the stand pipe that this application provided for film thickness sensor, the stand pipe cavity includes: a vapor deposition inlet and a vapor deposition outlet; the sectional area of the evaporation material inlet is larger than that of the evaporation material outlet.
Description
Technical Field
The application relates to the technical field of evaporation processes, in particular to a guide tube, a film thickness sensor and evaporation equipment.
Background
At present, the evaporation process is widely applied to the manufacture of various products, and the evaporation is a process of evaporating or sublimating a substance to be formed into a film in vacuum so as to separate out the substance on the surface of a workpiece or a substrate to form the film. For example, in the fabrication of Organic electroluminescent Display (OLED), multiple layers of Organic material films are required to be deposited. In the process of evaporation, a film thickness sensor is needed to detect the thickness of the film in real time, so that evaporation is controlled. Specifically, the film thickness sensor is provided with the crystal oscillator, and the crystal oscillator has the characteristic that the resonant frequency changes along with the quality of the crystal oscillator, so that the change of the resonant frequency of the crystal oscillator reflects the change of the thickness of the film on the crystal oscillator in the evaporation process, and the film thickness can be obtained by detecting the resonant frequency of the crystal oscillator.
As shown in fig. 1, a typical film thickness sensor includes: the device comprises a guide pipe 1, a crystal oscillator 2 and a detection device 3 for detecting the resonance frequency of the crystal oscillator 2; wherein the guide tube 1 is generally hollow cylindrical and comprises: a vapor deposition inlet 11 and a vapor deposition outlet 12, and the crystal oscillator 2 is provided at the vapor deposition outlet 12 of the guide tube 1. In OLED coating by vaporization technology, when using film thickness sensor to detect film thickness for a long time, the coating by vaporization thing piles up at the coating by vaporization thing entrance (being called the stand pipe entrance for short) of stand pipe 1 easily for the coating by vaporization thing that the crystal oscillator can respond to reduces, thereby causes the film thickness that detects inaccurate.
Therefore, how to reduce the influence of the deposition on the film thickness detection accuracy due to the deposition at the inlet of the guide tube is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
The embodiment of the application provides a stand pipe, film thickness sensor and evaporation equipment for reduce because of the stand pipe entrance coating by vaporization thing piles up the influence to film thickness detection accuracy.
The embodiment of this application provides a stand pipe for film thickness sensor, the stand pipe cavity includes: a vapor deposition inlet and a vapor deposition outlet; the sectional area of the evaporation material inlet is larger than that of the evaporation material outlet.
The utility model provides a guide tube, because the sectional area of the coating by vaporization thing entry of guide tube is greater than the sectional area of the coating by vaporization thing export of this guide tube, like this, use the film thickness sensor of this guide tube when detecting film thickness, can reduce because of the influence of the coating by vaporization thing that guide tube entry coating by vaporization thing piles up the coating by vaporization thing that can respond to the crystal oscillator to reduce because of the influence of the coating by vaporization thing of guide tube entry piles up film thickness detection accuracy, improved film thickness detection's the degree of accuracy.
Preferably, the guide tube has a sectional area gradually decreasing from the vapor inlet to the vapor outlet.
Preferably, the guide tube is divided into two sections, from the evaporation material inlet to the evaporation material outlet, the section of the guide tube close to the evaporation material inlet has the same sectional area as that of the evaporation material inlet, and the sectional area of the other section of the guide tube is gradually reduced.
Preferably, the guide tube is divided into two sections, from the vapor deposition inlet to the vapor deposition outlet, the sectional area of one section of the guide tube close to the vapor deposition inlet is gradually reduced to be the same as that of the vapor deposition outlet, and the sectional area of the other section of the guide tube is the same as that of the vapor deposition outlet.
Preferably, the guide tube is divided into two sections, from the evaporation material inlet to the evaporation material outlet, the section of the guide tube close to the evaporation material inlet is gradually increased in cross section, and the section of the guide tube in the other section is gradually decreased in cross section.
Preferably, the guide tube is axially symmetrical along a connecting line of a central point of the evaporation material inlet and a central point of the evaporation material outlet.
The guide tube is axially symmetrical along the connecting line of the central point of the evaporation material inlet and the central point of the evaporation material outlet, so that the production is convenient.
Preferably, the guide tube has a circular, oval or square cross-section.
The embodiment of the present application further provides a film thickness sensor, including: the utility model provides a stand pipe, the setting is in the quartz crystal at the coating by vaporization thing exit of stand pipe, and with what quartz crystal was connected is used for detecting quartz crystal resonant frequency's detection device.
Because the film thickness sensor that this application embodiment provided adopts foretell stand pipe, and the sectional area of the coating by vaporization thing entry of stand pipe is greater than the sectional area of the coating by vaporization thing export of this stand pipe, like this, when detecting film thickness, can reduce because of the stand pipe entry coating by vaporization thing piles up the influence of the coating by vaporization thing that can respond to the crystal oscillator to reduce because of the stand pipe entry coating by vaporization thing piles up the influence to film thickness detection accuracy, improved the degree of accuracy that film thickness detected.
The embodiment of the present application further provides an evaporation equipment, including: at least one evaporation source and a film thickness sensor as provided in any of the embodiments herein; wherein the evaporated material inlet of one guide tube of the film thickness sensor faces the evaporation surface of one evaporation source.
Because the evaporation equipment that this application embodiment provided adopts foretell film thickness sensor, film thickness sensor adopts foretell stand pipe simultaneously, and the sectional area of the coating by vaporization thing entry of stand pipe is greater than the sectional area of the coating by vaporization thing export of this stand pipe, like this, when detecting film thickness, can reduce because of the stand pipe entrance coating by vaporization thing piles up the influence of the coating by vaporization thing that can respond to the crystal oscillator to reduce because of the influence of the coating by vaporization thing of stand pipe entrance piles up film thickness detection accuracy, the degree of accuracy that film thickness detected has been improved.
Preferably, the evaporation sources are arranged in a row, the cross section of the guide tube is elliptical, and the length of the short axis of the evaporation material inlet of the guide tube is not greater than the maximum length of the evaporation surface of the evaporation source, which is faced by the evaporation material inlet of the guide tube, in the arrangement direction of the evaporation sources.
In the vapor deposition apparatus, since the length of the short axis of the vapor deposition inlet of the guide tube is not greater than the maximum length of the evaporation surface of the evaporation source, which is faced by the vapor deposition inlet of the guide tube, along the arrangement direction of the plurality of evaporation sources, when the film thickness sensor using the guide tube is used for detecting the film thickness, the vapor deposition adjacent to the evaporation source can be prevented from influencing the film thickness sensor, and therefore, the accuracy of film thickness detection can be improved.
Drawings
FIG. 1 is a schematic diagram of a prior art thin film thickness sensor;
FIG. 2 is a schematic structural diagram of a guide tube according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a guide tube according to a second embodiment of the present application;
fig. 4 is a schematic structural diagram of a guide tube provided in the third embodiment of the present application;
FIG. 5 is a schematic structural diagram of a guide tube according to a fourth embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a film thickness sensor according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of an evaporation apparatus provided in an embodiment of the present application;
fig. 8 is a top view of an evaporation source and an evaporation material inlet of a guide tube in an evaporation apparatus according to an embodiment of the present disclosure;
fig. 9 is a top view of an evaporation source and a vapor deposition material inlet of a guide tube in another evaporation apparatus provided in an embodiment of the present application.
Detailed Description
The embodiment of the application provides a stand pipe, film thickness sensor and evaporation equipment for reduce because of the stand pipe entrance coating by vaporization thing piles up the influence to film thickness detection accuracy.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the thicknesses and shapes of the devices in the drawings of the present application do not reflect actual proportions, and are merely intended to schematically illustrate the present application.
The first embodiment is as follows:
referring to fig. 2, in an embodiment of the present application, there is provided a guide tube for a film thickness sensor, the guide tube being hollow and including: a vapor inlet 11 and a vapor outlet 12; the sectional area of the vapor deposition inlet 11 is larger than that of the vapor deposition outlet 12, and the sectional area of the guide tube decreases gradually from the vapor deposition inlet 11 to the vapor deposition outlet 12.
Because the sectional area of the coating by vaporization thing entry 11 of stand pipe is greater than the sectional area of the coating by vaporization thing export 12 of this stand pipe, like this, use the film thickness sensor of this stand pipe when detecting film thickness, can reduce because of the stand pipe entrance coating by vaporization thing piles up the influence of the coating by vaporization thing that can respond to the crystal oscillator to reduce because of the stand pipe entrance coating by vaporization thing piles up the influence to film thickness detection accuracy, improved the degree of accuracy that film thickness detected.
The cross section of the guide tube may be circular, oval, square, or the like, which is not limited in the embodiments of the present application.
When the cross section of the guide tube is circular, the cross section of the vapor deposition inlet 11 is larger than the cross section of the vapor deposition outlet 12, and the cross section of the guide tube gradually decreases from the vapor deposition inlet 11 to the vapor deposition outlet 12, that is, the diameter of the vapor deposition inlet 11 is larger than the diameter of the vapor deposition outlet 12, and the diameter of the guide tube gradually decreases from the vapor deposition inlet 11 to the vapor deposition outlet 12, as shown in fig. 2.
In a preferred embodiment, as shown in fig. 2, the guiding tube is axially symmetric along the center point of the vapor inlet 11 and the center point connecting line 13 of the vapor outlet 12.
This is advantageous in view of the fact that the guide tube is axially symmetrical along the centre point of the vapour inlet 11 and the centre point of the vapour outlet 12, which is connected to the line 13.
Example two:
the guide tube provided in the second embodiment of the present application is similar to the guide tube provided in the first embodiment of the present application, and the same parts are not described herein again, and only different parts are described below.
Referring to fig. 3, the guide tube provided in the second embodiment of the present application is divided into two sections, from the vapor deposition inlet 11 to the vapor deposition outlet 12, a section of the guide tube 101 near the vapor deposition inlet 11 has the same cross-sectional area as that of the vapor deposition inlet 11, and a section of the guide tube 102 in the other section gradually decreases in cross-sectional area; when the cross section of the guide tube is circular, it can be said that the diameter of one guide tube 101 near the vapor deposition inlet 11 is the same as the diameter of the vapor deposition inlet 11, and the diameter of the other guide tube 102 gradually decreases from the vapor deposition inlet 11 to the vapor deposition outlet 12.
Example three:
the guide tube provided by the third embodiment of the present application is similar to the guide tube provided by the first embodiment of the present application, and the same parts are not described herein again, and only different parts are described below.
Referring to fig. 4, the guide tube provided in the third embodiment of the present application is divided into two sections, from the vapor deposition inlet 11 to the vapor deposition outlet 12, the sectional area of the guide tube 101 near the vapor deposition inlet 11 is gradually reduced to be the same as that of the vapor deposition outlet 12, and the sectional area of the guide tube 102 in the other section is the same as that of the vapor deposition outlet 12; when the cross section of the guide tube is circular, it can be said that the diameter of the guide tube 101 at a section near the vapor deposition inlet 11 gradually decreases to the same diameter as the vapor deposition outlet 12 from the vapor deposition inlet 11 to the vapor deposition outlet 12, and the diameter of the guide tube 102 at another section is the same diameter as the vapor deposition outlet 12.
Example four:
the guide tube provided in the fourth embodiment of the present application is similar to the guide tube provided in the first embodiment of the present application, and the same parts are not described herein again, and only different parts are described below.
Referring to fig. 5, the guide tube provided in the fourth embodiment of the present invention is divided into two sections, from the vapor deposition inlet 11 to the vapor deposition outlet 12, the sectional area of one section of the guide tube 101 near the vapor deposition inlet 11 is gradually increased, and the sectional area of the other section of the guide tube 102 is gradually decreased; when the cross section of the guide tube is circular, it can be said that the diameter of one guide tube 101 near the vapor deposition inlet 11 gradually increases and the diameter of the other guide tube 102 gradually decreases from the vapor deposition inlet 11 to the vapor deposition outlet 12.
It should be noted that the guide tube provided in the embodiment of the present application can be further divided into three or more sections according to the change of the caliber, for example: if the guide pipe is divided into three sections, on the basis of the shape of the guide pipe provided in the second embodiment of the present application, a section of guide pipe with the same caliber as that of the evaporated material outlet 12 can be further included behind the guide pipe 102; alternatively, on the basis of the shape of the guide tube provided in the third embodiment of the present application, a guide tube having a diameter equal to the diameter of the vapor deposition material inlet 11 may be further included in front of the guide tube 101; alternatively, based on the shape of the guide tube provided in the fourth embodiment of the present invention, a guide tube having the same diameter as the vapor deposition material inlet 11 may be further included in front of the guide tube 101, or a guide tube having the same diameter as the vapor deposition material outlet 12 may be further included in rear of the guide tube 102; if the guide tube is divided into four sections, based on the shape of the guide tube provided in the fourth embodiment of the present invention, a guide tube having the same diameter as the vapor deposition inlet 11 may be further included in front of the guide tube 101, and a guide tube having the same diameter as the vapor deposition outlet 12 may be further included in rear of the guide tube 102.
Based on the same inventive concept, an embodiment of the present application further provides a film thickness sensor for detecting a film thickness in an evaporation process, with reference to fig. 6, the film thickness sensor includes: the guide tube 1 provided in any embodiment of the present application, the crystal oscillator 2 disposed at the evaporated material outlet 12 of the guide tube 1, and the detection device 3 connected to the crystal oscillator 2 and used for detecting the resonant frequency of the crystal oscillator 2.
In a preferred embodiment, the film thickness sensor may further include: and a processor electrically connected with the detection device 3 and used for determining the film thickness according to the resonance frequency of the crystal oscillator 2.
In a preferred embodiment, the film thickness sensor may further include: and the display device is electrically connected with the processor and is used for displaying the film thickness.
The display device may be a digital display or a dial display.
Based on the same inventive concept, an embodiment of the present application further provides an evaporation apparatus, with reference to fig. 7, the evaporation apparatus includes: at least one evaporation source 71 and a film thickness sensor 72 (shown in dashed outline in fig. 7) provided in any of the embodiments of the present application; the vapor deposition material inlet 11 of the one guide tube 1 of the film thickness sensor 72 faces the evaporation surface 73 of the one evaporation source 71.
The evaporation surface of the evaporation source refers to an opening through which evaporation is generated by the evaporation source.
In a preferred embodiment, the evaporation sources 71 are arranged in a row, the cross section of the guide tube is elliptical, and normally, only the evaporation materials adjacent to the evaporation source 71 in the same row will affect the detected film thickness, but the evaporation materials of the evaporation sources 71 in different rows will not affect the detected film thickness, so as to improve the accuracy of film thickness detection, as shown in fig. 8 and 9, the length of the minor axis a of the evaporation material inlet 11 of the guide tube 1 can be set to be equal to the maximum length L of the evaporation surface 73 of the evaporation source 71 facing the evaporation material inlet 11 of the guide tube 1 along the arrangement direction of the evaporation sources 71, so that when the film thickness sensor 72 of the guide tube 1 is used to detect the film thickness, the influence of the evaporation materials adjacent to the evaporation source 71 on the film thickness sensor 72 can be avoided, therefore, the accuracy of film thickness detection can be improved. Of course, the length of the short axis of the vapor deposition inlet 11 of the guide tube 1 may be set to be smaller than the maximum length of the evaporation surface of the evaporation source 71, which the vapor deposition inlet 11 of the guide tube 1 faces, in the arrangement direction of the plurality of evaporation sources 71.
The evaporation surface 73 of the evaporation source 71 may be circular, as shown in fig. 8, or the evaporation surface 73 of the evaporation source 71 may be rectangular, as shown in fig. 9, or of course, may have other shapes, and the present embodiment is not limited thereto.
If the cross section of the guide tube 1 is circular, in order to avoid the influence of the vapor deposition material adjacent to the evaporation source 71 and improve the accuracy of film thickness detection, the aperture of the vapor deposition material inlet 11 of the guide tube 1 may be set not larger than the maximum length of the evaporation surface of the evaporation source 71, which is faced by the vapor deposition material inlet 11 of the guide tube 1, in the arrangement direction of the plurality of evaporation sources 71.
To sum up, among the technical scheme that this application embodiment provided, because the sectional area of the coating by vaporization thing entry of stand pipe is greater than the sectional area of the coating by vaporization thing export of this stand pipe, like this, use the film thickness sensor of this stand pipe when detecting film thickness, can reduce because of the stand pipe entry coating by vaporization thing piles up the influence of the coating by vaporization thing that can respond to the crystal oscillator to reduce because of the influence of the coating by vaporization thing of stand pipe entrance piles up film thickness detection accuracy, improved film thickness detection's the degree of accuracy.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (6)
1. A guide tube for a film thickness sensor, the guide tube being hollow and comprising: a vapor deposition inlet and a vapor deposition outlet; the sectional area of the evaporation material inlet is larger than that of the evaporation material outlet, the guide pipe is divided into two sections, from the evaporation material inlet to the evaporation material outlet, the sectional area of one section of the guide pipe close to the evaporation material inlet is gradually reduced to be the same as that of the evaporation material outlet, and the sectional area of the other section of the guide pipe is the same as that of the evaporation material outlet.
2. The guide tube according to claim 1, wherein the guide tube is axisymmetric along a line connecting a center point of the vapor inlet and a center point of the vapor outlet.
3. The guide tube of claim 2, wherein the guide tube has a circular, elliptical or square cross-section.
4. A thin film thickness sensor, comprising: the guide tube according to any one of claims 1 to 3, a crystal oscillator provided at a vapor deposition outlet of the guide tube, and a detection device connected to the crystal oscillator for detecting a resonance frequency of the crystal oscillator.
5. An evaporation apparatus, comprising: at least one evaporation source and the film thickness sensor of claim 4; wherein the evaporated material inlet of one guide tube of the film thickness sensor faces the evaporation surface of one evaporation source.
6. The evaporation apparatus according to claim 5, wherein the evaporation sources are plural and arranged in a row, the guide tube has an elliptical cross section, and a length of a short axis of the vapor deposition inlet of the guide tube is not larger than a maximum length of an evaporation surface of the evaporation source, which the vapor deposition inlet of the guide tube faces, in an arrangement direction of the plural evaporation sources.
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| CN201710184003.9A CN106885549B (en) | 2017-03-24 | 2017-03-24 | Guide tube, film thickness sensor and evaporation equipment |
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| CN201710184003.9A CN106885549B (en) | 2017-03-24 | 2017-03-24 | Guide tube, film thickness sensor and evaporation equipment |
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| CN106885549A CN106885549A (en) | 2017-06-23 |
| CN106885549B true CN106885549B (en) | 2020-07-07 |
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| CN108277459B (en) * | 2018-03-29 | 2020-02-18 | 武汉华星光电半导体显示技术有限公司 | Film thickness detection device and evaporation machine |
| CN108411255A (en) * | 2018-04-11 | 2018-08-17 | 张家港国龙光伏科技有限公司 | A kind of Al-BSF vacuum evaporation mechanism |
| JP7314209B2 (en) * | 2021-06-30 | 2023-07-25 | キヤノントッキ株式会社 | Film forming apparatus, film forming method, and evaporation source unit |
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| CN103210113A (en) * | 2010-12-21 | 2013-07-17 | 夏普株式会社 | Vapor deposition device, vapor deposition method, and organic el display device |
| CN203112920U (en) * | 2013-03-26 | 2013-08-07 | 京东方科技集团股份有限公司 | Film thickness sensor and evaporation equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005203248A (en) * | 2004-01-16 | 2005-07-28 | Sony Corp | Vapor deposition method and vapor deposition device |
| WO2016138964A1 (en) * | 2015-03-03 | 2016-09-09 | Applied Materials, Inc. | Nozzle for a material source arrangement used in vacuum deposition |
| CN205329148U (en) * | 2016-02-18 | 2016-06-22 | 合肥鑫晟光电科技有限公司 | Vacuum evaporation source device and vacuum evaporation equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103210113A (en) * | 2010-12-21 | 2013-07-17 | 夏普株式会社 | Vapor deposition device, vapor deposition method, and organic el display device |
| CN203112920U (en) * | 2013-03-26 | 2013-08-07 | 京东方科技集团股份有限公司 | Film thickness sensor and evaporation equipment |
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