CN106883558A - Packaging of photoelectric device composition - Google Patents
Packaging of photoelectric device composition Download PDFInfo
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- CN106883558A CN106883558A CN201710232298.2A CN201710232298A CN106883558A CN 106883558 A CN106883558 A CN 106883558A CN 201710232298 A CN201710232298 A CN 201710232298A CN 106883558 A CN106883558 A CN 106883558A
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- packaging
- epoxy resin
- photoelectric device
- device composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a kind of packaging of photoelectric device composition, according to mass percent, composition includes：90 10% esterification aromatic series phenols and the mixture of epoxy resin, 0.1 2% catalyst, 0.2 2% coupling agent, 0.1 0.5% age resistor, 0.1 0.5% toner, 10 90% fillers, wherein, the equivalent proportion being esterified in the mixture of esterification aromatic series phenols and epoxy resin between aromatic series phenols and epoxy resin is 0.8 1.2.The combination that packaging of photoelectric device of the invention passes through the fragrant phenol resin containing esterification structure and epoxy resin and other components with composition, can be formed and not damage heat resistance, sunproof solidfied material, it is the toughness of the solidfied material, hydrothermal stability (particularly to Reflow Soldering, damp and hot and salt spray resistance reliability), adaptation, resistance to anti-thread breakage higher.
Description
Technical field
The present invention relates to photoelectric device technical field, and in particular to a kind of packaging of photoelectric device composition.
Background technology
As optical-electronic equipment is continued to develop to miniaturization, portability, high output, the use model of encapsulating material
Enclose and also expand therewith, to the reliability requirement of material also more and more higher.Common LED, optics and associated electrical device
Part, encapsulating material generally uses epoxy/acid acid anhydride system, to ensure the optical stability of encapsulating material.However, epoxy/acid acid anhydride body
Due to the moisture absorption of acid anhydrides, moisture can cause performance significantly to deteriorate in storage and process for system.Further, since material after solidification
Hydroscopicity it is big, often there is interface peel due to " puffed rice " phenomenon when device is by Reflow Soldering, cause component failure.
In addition, highly cross-linked epoxy/acid acid anhydride encapsulating material fragility is big, easily there is cracking destruction during thermal shock；Reduce crosslink density
And toughness reinforcing can reduce Tg, heat resistance and moisture-proof is caused to decline.
In order to improve the performance of epoxy/acid acid anhydride encapsulating material, lot of documents reports all kinds of method of modifying.Such as patent
US5145889 passes through function dough liquid rubber and organic silicon to reduce material internal stress, and heat resistance and moisture-proof are lacked
Weary concern.Patent US6617400 uses boron cationoid catalyst, reduces acid anhydrides consumption to improve heat endurance, but to damp and hot
Stability and toughness but lack concern.Patent US6632892 passes through organic silicon type epoxy resin modification to improve the saturating of shortwave area
Light rate and stability, but hydrothermal stability and mechanical performance can be adversely affected.
Although the curing agent such as amine, phenolic aldehyde and mercaptan can improve performance in terms of part, phototube is difficult in adapt to
The optical stability of part requirement.As amine-type cure system changes colour due to the oxidation of amine；The hydroxyl produced after phenolic resin curing
Increase water absorption rate, remaining phenolic hydroxyl group is oxidized to quinone and changes colour；Heat resistance is relatively low after thio-alcohol solidification.
(ishikubo, the T. such as Nishikubo；Iizawa,T.；Matsumura,T.,Synthesis of polyester
by novel addition reaction of active di‐ester with di‐epoxy compound.Journal
of Polymer Science Part A:Polymer Chemistry 1989,27, (6), 1975-1984) first reported
The reaction of substitution phenyl ester class small molecule and epoxy.(Yashiro, the T. such as Yashiro；Matsushima,K.；Kameyama,A.；
Nishikubo,T.,A Novel Synthesis of Poly(carbonate)s by the Polyaddition of Bis
(epoxide) s with Diphenyl Carbonate.Macromolecules 2001,34, (10), 3205-3210.) it is logical
Cross aromatic ester and be prepared for high molecular weight resin with epoxy reaction.And be esterified by by phenolic resin, further with phenolic epoxy
Resin solidification, research finds that the water imbibition of resulting materials is declined to a great extent (Ding, Y.；Liu,M.；Li,S.；Zhang,S.；
Zhou,W.-F.；Wang,B.,Contributions of the side groups to the characteristics of
water absorption in cured epoxy resins.Macromolecular Chemistry and Physics
2001,202,(13),2681-2685.)。
However, up to the present, being esterified phenolic resin and containing the fragrant phenol resin and alicyclic epoxy of esterification structure
Curing system, its optical property, but never reported as the application of packaging of photoelectric device material.
The content of the invention
It is an object of the invention to the problem above for overcoming prior art to exist, there is provided a kind of packaging of photoelectric device combination
Thing, by the way that by the combination of the fragrant phenol resin containing esterification structure and epoxy resin and other components, it can form and not damage resistance to
Hot, sunproof solidfied material, the toughness of the solidfied material, hydrothermal stability improve.
To realize above-mentioned technical purpose, above-mentioned technique effect is reached, the present invention is achieved through the following technical solutions：
A kind of packaging of photoelectric device composition, according to mass percent, composition includes：
Wherein, it is esterified between aromatic series phenols and epoxy resin in the mixture of esterification aromatic series phenols and epoxy resin
Equivalent proportion is 0.8-1.2.
Further include, the esterification aromatic series phenols is formula (I) compound, n1It is worth the integer for 3~7,
Wherein, the R in formula (I)1Structure include：
R2 is H or methyl；
The structure of R3 includes：
Wherein, n2It is the integer of 1-15.
Further include, esterification aromatic series phenols adds organic carboxyl acid, acid anhydrides and acyl chlorides with fragrant phenol resin as raw material,
By esterification, the fragrant phenol resin containing esterification structure is obtained.
Further include, the epoxy resin includes alicyclic ring type resin, diglycidyl ether type resin, glycidyl ester type tree
One or more in fat, wherein resin is comprising in aliphatic epoxy resin, cycloaliphatic epoxy resin, aromatic epoxy resin
One or more.
Further include, the epoxy resin include it is following in one or more：Double (3,4- epoxycyclohexyl-methyls)
Adipic acid, hydrogenated bisphenol A glycidol ether, HHPA ethylene oxidic ester, phthalic anhydride ethylene oxidic ester, inclined benzene three-glycidyl
Ester, isocyanic acid three-glycidyl ester, bis-phenol A glycidyl ether, o-cresol epoxy resin.
Further include, the catalyst include tertiary amine, quaternary ammonium salt, quaternary phosphonium salt, imidazoles, organic metal salt in one kind or
It is various.
Further include, the catalyst includes diazabicylo, three-(dimethylamino methyl) phenol, tetramethyl bromination
It is ammonium, TMAH, triphenylphosphine, tetrabutylammonium hydroxide phosphine, tetrabutyl phosphonium bromide phosphine, substituted imidazole, organotin, organic
One or more in zinc, Organic Chromium, organic titanium.
Further include, the coupling agent includes one or more in organosiloxane, organic titanium, Organic Chromium.
Further include, described filler include silica, aluminum oxide, magnesia, titanium dioxide, calcium carbonate, talcum powder,
One or more in clay.
Further include, composition is applied to be formed the encapsulation of luminous, optics and electronic device.
The beneficial effects of the invention are as follows:
Packaging of photoelectric device of the invention composition by fragrant phenol resin and epoxy resin containing esterification structure and
The combination of other components, can form and not damage heat resistance, sunproof solidfied material, and the toughness of the solidfied material, moisture-proof are thermally-stabilised
It is property (particularly to Reflow Soldering, damp and hot and salt spray resistance reliability), adaptation, resistance to anti-thread breakage higher；Especially by change ester
Change the chain length and substitution base of organic carboxyl acid in structure, can significantly improve the humidity resistance of solidfied material.By using alicyclic ring class
Epoxy resin, it is possible to increase the light resistance of solidfied material.By the way that the different fragrant phenol resins for being esterified structures and different epoxies will be contained
Resin ratio is set in certain limit, can make the optoelectronic package material for all meeting above-mentioned characteristic.
Described above is only the general introduction of technical solution of the present invention, in order to better understand technological means of the invention,
And can be practiced according to the content of specification, described in detail as after with presently preferred embodiments of the present invention below.Tool of the invention
Body implementation method is shown in detail by following examples.
Specific embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
In the examples below, the raw material for using are as follows：
Cycloaliphatic epoxy resin (ERL-4221：DOW Chemical trade name, epoxide equivalent 128~140)
Bisphenol A type epoxy resin (DER-331：DOW Chemical trade name, epoxide equivalent 182~192)
Phenol-aralkyl-type epoxy resin (NC-2000:Nippon Kayaku K. K, epoxide equivalent 229~244)
Phenolic resin (H-4, Japan is bright and is melted into Co., Ltd., OH equivalents 103~107)
Phenol-aralkyl-type phenol resin (MEH-7800, Japan is bright and is melted into Co., Ltd., OH equivalents 173~180)
2- undecyl imidazoles (C11Z:Japanese Shikoku Chem)
(1) preparation of ethyl esterified phenolic resin：
H-4 type phenolic resin 200g, plus the dissolving of people 750mL aceticanhydrides are weighed in three-necked bottle, 25mL pyridines is added to urge
Agent.It is stirred continuously under nitrogen protection, is placed in being heated to 100 DEG C, after sustained response 24h in oil bath, heating steams big portion
The remaining aceticanhydride of part and pyridine；Again plus after the dissolving of people 1000mL chloroforms, move into separatory funnel, be 3% with mass fraction
NaHCO3Solution is washed for several times, until bubble-free is released；Add pure water washing for several times, take out chloroform organic layer, use
Anhydrous magnesium sulfate is dried overnight, and steams chloroform, is placed in vacuum drying oven and is further dried.
(2) preparation of butyl ester copolymerization phenolic resin：
MEH-7800 type resin 200g, plus the dissolving of people 800mL butyric anhydrides are weighed in three-necked bottle, adding 25mL pyridines is
Catalyst.It is stirred continuously under nitrogen protection, is placed in being heated to 100 DEG C, after sustained response 24h in oil bath, heating steams big
The remaining butyric anhydride of part and pyridine；Again plus after the dissolving of people 1000mL chloroforms, move into separatory funnel, be with mass fraction
3% NaHCO3Solution is washed for several times, until bubble-free is released；Add pure water washing for several times, take out chloroform organic
Layer, is dried overnight with anhydrous magnesium sulfate, steams chloroform, is placed in vacuum drying oven and is further dried.
(3) preparation of ethyl esterified napthalinic phenolic resins
To input 1- naphthols and beta naphthal mixture 282g, paraformaldehyde 92g, toluene 150g and oxalic acid 3g in reactor；
It is stirred continuously under nitrogen protection, is placed in being heated to 110 DEG C in oil bath, the water of generation is taken off outside system by phase-splitter, etc.
After being generated there is no water in phase-splitter, continue to react 2 hours in 135-145 DEG C ask.After completion of the reaction, with sodium carbonate
With the oxalic acid of residual, and temperature is slowly warmed up to 165 DEG C sloughs neutralization reaction generation water, toluene and unreacted paraformaldehyde；
Temperature is finally raised to 175 DEG C and vacuumizes that vacuum distillation is de- to take residual volatiles, obtain napthalinic phenolic resins.Using with (1) phase
Similar method, is esterified by acetic anhydride and obtains ethyl esterified napthalinic phenolic resins.
Experimental example 1
The ethyl esterified phenolic aldehyde H-4 of 100g epoxy resin ERL-4221 and 108g is mixed in 80 DEG C of heating stirrings, coupling is added
Agent 0.5g, antioxidant 0.5g and catalyst 0.3g, after stirring to transparent clarification, deaeration cooling.
Experimental example 2~7
Such as the proportioning in table 1, in 80 DEG C of heating stirring mixing, after stirring to transparent clarification, deaeration is cooled down.
Comparative example 1~2
Such as the proportioning in table 1, in 80 DEG C of heating stirring mixing, after stirring to transparent clarification, deaeration is cooled down.
In above-described embodiment and comparative example, the epoxy resin includes alicyclic ring type resin, diglycidyl ether type resin, contracting
One or more in water glycerine ester type resin, wherein resin includes aliphatic epoxy resin, cycloaliphatic epoxy resin, aromatic series
One or more in epoxy resin.
For example, epoxy resin can be selected：Double (3,4- epoxycyclohexyl-methyls) adipic acids, hydrogenated bisphenol A glycidol
Ether, HHPA ethylene oxidic ester, phthalic anhydride ethylene oxidic ester, inclined benzene three-glycidyl ester, isocyanic acid three-glycidyl ester, bis-phenol
A glycidol ethers, o-cresol epoxy resin.
Catalyst includes one or more in tertiary amine, quaternary ammonium salt, quaternary phosphonium salt, imidazoles, organic metal salt.Catalyst includes
Diazabicylo, three-(dimethylamino methyl) phenol, 4 bromide, TMAH, triphenylphosphine, the tetrabutyl
In hydroxide phosphine, tetrabutyl phosphonium bromide phosphine, substituted imidazole, organotin, organic zinc, Organic Chromium, organic titanium.
Coupling agent is included in organosiloxane, organic titanium, Organic Chromium；Filler can select silica, aluminum oxide, oxidation
Magnesium, titanium dioxide, calcium carbonate, talcum powder, clay.
Performance test
The composition prepared in 1~2 in embodiment 1~6 and comparative example is carried out into performance test, method of testing is as follows：
(1) heat resistance
It is 1mm that composition is coated on into thickness of dry film on quartz glass, is then solidified at 150 DEG C 3 hours, 170 DEG C of solidifications 2
Hour.The solidfied material is aging 200 hours at 150 DEG C, visually it is aging after solidfied material outward appearance, it is heat-resisting with following benchmark evaluations
Property.
(color change)
A:It is not changed in；B：Vary slightly；C：Generation xanthochromia.
(2) light resistance
It is 1mm that composition is coated on into thickness of dry film on quartz glass, is then solidified at 150 DEG C 3 hours, 170 DEG C of solidifications 2
Hour.Spot light by the solidfied material in below 350nm irradiates, and irradiation illumination is the ultraviolet light 200 hours of 5000mW/cm2, mesh
The outward appearance of the solidfied material after visual purple outside line irradiation, with following benchmark evaluation lights resistance.
(color change)
A:It is not changed in；B：Vary slightly；C：Generation xanthochromia.
(3) peel resistance after moisture absorption and Reflow Soldering
By composition dispensing to 3030 type surface attaching type LED encapsulation pieces, solidify at 150 DEG C 3 hours, 170 DEG C of solidifications 2 are small
When.Climatic chamber by the LED component of gained in 85 DEG C/85% humidity is placed 12 hours and 36 hours, is welded using backflow
It is 260 DEG C of Reflow Soldering programs of 10 seconds to put and carry out 3 maximum temperatures.With the boundary of LED samples after observation by light microscope Reflow Soldering
Peel off in face.To each sample, every 20 carry out same observation, with following benchmark evaluation peel resistance.
AA:Without stripping after placing 36 hours；A:Without stripping after placing 12 hours, there is stripping after placing 36 hours；B：Place
20 have 1~5 packaging part peeling-off with resin after 12 hours；C：After placing 12 hours 20 have more than 6 packaging parts with
Resin is peeling-off
(4) cold-resistant thermal impact
To finish that damp and hot 36 hours aging and Reflow Soldering after LED component, be warmed up to from -65 DEG C with the speed of 1 DEG C/min
150 DEG C and -65 DEG C are cooled to from 150 DEG C, as 1 circulation, implement 1000 circulations of thermal shock.After experiment terminates, use
The interface peel of LED samples after observation by light microscope Reflow Soldering.To each sample, every 20 carry out same observation, with following
The cold-resistant thermal impact of benchmark evaluation.
A：Without stripping；B：20 have 1~5 packaging part peeling-off with resin；C：20 have more than 6 packaging parts with tree
Fat is peeling-off.
By above performance test, property indices are as shown in table 1 in embodiment 1~6 and comparative example 1~2.
Table 1 is formulated and performance table
Can be seen that composition by fragrant phenol resin and epoxy resin containing esterification structure by the data in table 1 and
The combination of other components, can form and not damage heat resistance, sunproof solidfied material, and the toughness of the solidfied material, moisture-proof are thermally-stabilised
It is property (particularly to Reflow Soldering, damp and hot and salt spray resistance reliability), adaptation, resistance to anti-thread breakage higher；Especially by change ester
Change the chain length and substitution base of organic carboxyl acid in structure, can significantly improve the humidity resistance of solidfied material.By using alicyclic ring class
Epoxy resin, it is possible to increase the light resistance of solidfied material.By the way that the different fragrant phenol resins for being esterified structures and different epoxies will be contained
Resin ratio is set in certain limit, can make the optoelectronic package material for all meeting above-mentioned characteristic.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or uses the present invention.
Various modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention
It is not intended to be limited to the embodiments shown herein.
Claims (10)
1. a kind of packaging of photoelectric device composition, it is characterised in that according to mass percent, composition includes：
Wherein, the equivalent between aromatic series phenols and epoxy resin is esterified in the mixture of esterification aromatic series phenols and epoxy resin
Than being 0.8-1.2.
2. packaging of photoelectric device composition according to claim 1, it is characterised in that the esterification aromatic series phenols is
Formula (I) compound, n1It is worth the integer for 3~7,
Wherein, the R in formula (I)1Structure include：
R2 is H or methyl；
The structure of R3 includes：
Wherein, n2It is the integer of 1-15.
3. packaging of photoelectric device composition according to claim 1, it is characterised in that esterification aromatic series phenols is with fragrant phenol
Base resin is raw material, adds organic carboxyl acid, acid anhydrides and acyl chlorides, by esterification, obtains the fragrant phenolic group tree containing esterification structure
Fat.
4. packaging of photoelectric device composition according to claim 1, it is characterised in that the epoxy resin includes alicyclic ring
One or more in type resin, diglycidyl ether type resin, glycidyl ester type resin, wherein resin includes aliphatic epoxy
One or more in resin, cycloaliphatic epoxy resin, aromatic epoxy resin.
5. packaging of photoelectric device composition according to claim 4, it is characterised in that the epoxy resin includes following
In one or more：Double (3,4- epoxycyclohexyl-methyls) adipic acids, hydrogenated bisphenol A glycidol ether, HHPA shrink
Glyceride, phthalic anhydride ethylene oxidic ester, inclined benzene three-glycidyl ester, isocyanic acid three-glycidyl ester, bis-phenol A glycidyl ether, neighbour
Cresol epoxy resin.
6. packaging of photoelectric device composition according to claim 1, it is characterised in that the catalyst include tertiary amine,
One or more in quaternary ammonium salt, quaternary phosphonium salt, imidazoles, organic metal salt.
7. packaging of photoelectric device composition according to claim 6, it is characterised in that the catalyst includes diaza
Two rings, three-(dimethylamino methyl) phenol, 4 bromide, TMAH, triphenylphosphine, tetrabutylammonium hydroxide
One or more in phosphine, tetrabutyl phosphonium bromide phosphine, substituted imidazole, organotin, organic zinc, Organic Chromium, organic titanium.
8. packaging of photoelectric device composition according to claim 1, it is characterised in that the coupling agent includes organosilicon
One or more in oxygen alkane, organic titanium, Organic Chromium.
9. packaging of photoelectric device composition according to claim 1, it is characterised in that described filler includes titanium dioxide
One or more in silicon, aluminum oxide, magnesia, titanium dioxide, calcium carbonate, talcum powder, clay.
10. the packaging of photoelectric device composition according to claim 1-9 any one, it is characterised in that composition
It is applied to be formed the encapsulation of luminous, optics and electronic device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710232298.2A CN106883558B (en) | 2017-04-11 | 2017-04-11 | Composition for encapsulating photoelectric device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710232298.2A CN106883558B (en) | 2017-04-11 | 2017-04-11 | Composition for encapsulating photoelectric device |
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Non-Patent Citations (1)
| Title |
|---|
| YIFU DING ET AL.: "Contributions of the Side Groups to the Characteristics of Water Absorption in Cured Epoxy Resins", 《MACROMOL. CHEM. PHYS.》 * |
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Effective date of registration: 20220224 Address after: Room a5-1-101, Jiachuang Zhigu vision Industrial Park, No. 99, Zhonghua section, Pinglang line, Xincang Town, Pinghu City, Jiaxing City, Zhejiang Province, 314000 Patentee after: Huiyongjin photoelectric (Zhejiang) Co.,Ltd. Address before: 215000 Building 9, No. 99, gangtian Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: Suzhou Huiyongjin Photoelectric Co.,Ltd. |
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