CN106866898A - A kind of rapid photocuring vinylite - Google Patents

A kind of rapid photocuring vinylite Download PDF

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Publication number
CN106866898A
CN106866898A CN201611243412.3A CN201611243412A CN106866898A CN 106866898 A CN106866898 A CN 106866898A CN 201611243412 A CN201611243412 A CN 201611243412A CN 106866898 A CN106866898 A CN 106866898A
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CN
China
Prior art keywords
parts
acid
epoxy resin
vinylite
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN201611243412.3A
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Chinese (zh)
Inventor
王鸿
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Zhejiang Kenobi Polymer Material Co Ltd
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Zhejiang Kenobi Polymer Material Co Ltd
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Priority to CN201611243412.3A priority Critical patent/CN106866898A/en
Publication of CN106866898A publication Critical patent/CN106866898A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/002Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers modified by after-treatment
    • C08F283/004Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers modified by after-treatment modified by incorporation of silicium atoms

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

The present invention relates to technical field of macromolecules, and in particular to a kind of rapid photocuring vinylite.Meter includes by weight:Bisphenol F/47 50 parts of resorcinol copoly type epoxy resin, 10 15 parts of modifying epoxy resin by organosilicon, 35 parts of butyl ether benzoguanamine resin, 15 16 parts of methacrylic acid, 14 18 parts of acrylic acid, 68 parts of fumaric acid, 9 15 parts of maleic anhydride, 0.5 1 parts of tri-phenyl-ethyl phosphonium bromide, 0.3 0.6 parts of hydroquinones, 45 48 parts of styrene, 0.2 0.5 parts of light trigger, 25 parts of reactive diluent, light-initiated compounding ingredient 0.3 0.8,58 parts of composite modifier.Product prepared by the present invention, with fixed line speed higher, and its fixed line shrinkage factor is low, and pliability is good, and elongation at break is high, and shock resistance and milk cracking performance are excellent.

Description

A kind of rapid photocuring vinylite
Technical field
The present invention relates to technical field of macromolecules, and in particular to a kind of rapid photocuring vinylite.
Background technology
Unsaturated polyester resin, is usually contracted by unsaturated dibasic acid dihydroxylic alcohols or monounsaturated dicarboxylic acid unsaturation dihydroxylic alcohols The poly- chain macromolecule compound with ester bond and unsaturated double-bond.Generally, polyesterification polycondensation reaction be 190~ 220 DEG C are carried out, until reaching expected acid number (or viscosity), after polyesterification contracting reaction terminates, a certain amount of second are added while hot Alkenyl monomer, is made into sticky liquid, and such polymer solution is referred to as unsaturated polyester resin.
So far, unsaturated polyester (UP) (resin) matrix as matrices of composite material is substantially O-phthalic acid type both at home and abroad (referred to as adjacent benzene-type), M-phthalic acid type (abbreviation metaphenylene), bisphenol A-type and vinyl ester type, halo unsaturated polyester resin Deng.
Vinylite is vinyl ester resin, is a kind of epoxy resin and a kind of unsaturated monoacid containing ethylene linkage Addition reaction product, and diluted through a kind of reactive monomer.Vinylite has good decay resistance, has asphalt mixtures modified by epoxy resin concurrently The excellent mechanical property of fat and the good characteristic of unsaturated polyester resin normal temperature cure.The resin base made of vinylite is combined Material, is widely used at aspects such as chemical anticorrosion, flue gas desulfurization, communications and transportation, electronic apparatus.
Traditional vinylite, in the case where curing degree is accelerated, its shrinkage factor can increase, and cause its pliability to become Difference, in order to improve this phenomenon, it is necessary to develop a kind of new vinylite.
The content of the invention
The invention aims to solve the above problems, there is provided a kind of rapid photocuring vinylite.
In order to reach foregoing invention purpose, the present invention uses following technical scheme:
A kind of rapid photocuring vinylite, by weight meter include:Bisphenol F/resorcinol copoly type asphalt mixtures modified by epoxy resin Fat 47-50 parts, modifying epoxy resin by organosilicon 10-15 parts, 3-5 parts of butyl ether benzoguanamine resin, methacrylic acid 15-16 Part, acrylic acid 14-18 parts, fumaric acid 6-8 parts, maleic anhydride 9-15 parts, tri-phenyl-ethyl phosphonium bromide 0.5-1 parts, to benzene Diphenol 0.3-0.6 parts, styrene 45-48 parts, light trigger 0.2-0.5 parts, reactive diluent 2-5 parts, light-initiated compounding ingredient 0.3-0.8, composite modifier 5-8 parts.
It is further preferred that meter includes by weight:Bisphenol F/47 parts of resorcinol copoly type epoxy resin, organosilicon 15 parts of modified epoxy, 3 parts of butyl ether benzoguanamine resin, methacrylic acid 15-16 parts, 18 parts of acrylic acid, fumaric acid 6 Part, 15 parts of maleic anhydride, 0.5 part of tri-phenyl-ethyl phosphonium bromide, 0.6 part of hydroquinones, 45 parts of styrene, light trigger 0.2 part, 5 parts of reactive diluent, light-initiated compounding ingredient 0.3,8 parts of composite modifier.
Meter includes by weight:Bisphenol F/50 parts of resorcinol copoly type epoxy resin, modifying epoxy resin by organosilicon 10 parts, 5 parts of butyl ether benzoguanamine resin, 15 parts of methacrylic acid, 18 parts of acrylic acid, 6 parts of fumaric acid, maleic anhydride 15 parts, 0.5 part of tri-phenyl-ethyl phosphonium bromide, 0.6 part of hydroquinones, 45 parts of styrene, 0.2 part of light trigger, reactive diluent 5 Part, light-initiated compounding ingredient 0.3,8 parts of composite modifier.
It is further preferred that the composite modifier counts composed of the following components by weight:Butyl acrylate 8-10 Part, itaconic acid 10-12 parts, ethylene glycol diglycidylether 8-9 parts, 5 parts of maleic acid, 4,4'- DADPS 0.5-2 Part.
It is further preferred that the light trigger is 2,4,6- trimethylbenzoy-dipheny phosphine oxides or 2,4,6- Trimethylbenzoyl phenyl phosphinic acid ethyl ester.
It is further preferred that the light-initiated compounding ingredient is septichen phenyl ester and double (2,2,6,6- tetramethyl -4- Piperidyl) sebacate mixture, the two part by weight be 2-3:1.
Light-initiated compounding ingredient can coordinate light trigger to improve the photo-curing rate under low temperature.
It is further preferred that the reactive diluent is neodecanoic acid glycidol fat or trihydroxy methyl ice alkane three-glycidyl Ether.
Product prepared by the present invention, with fixed line speed higher, and its fixed line shrinkage factor is low, and pliability is good, and fracture is stretched Rate long is high, and shock resistance and milk cracking performance are excellent.
Specific embodiment
Explanation is further described to technical scheme below by specific embodiment.
If without specified otherwise, the raw material employed in embodiments of the invention is raw material commonly used in the art, implements Method employed in example, is the conventional method of this area.
Embodiment 1:
A kind of rapid photocuring vinylite, the specific proportioning of its formula is as follows:Bisphenol F/resorcinol copoly type epoxy Resin 47kg, modifying epoxy resin by organosilicon 15kg, butyl ether benzoguanamine resin 3kg, methacrylic acid 15kg, acrylic acid 18kg, fumaric acid 6kg, maleic anhydride 15kg, tri-phenyl-ethyl phosphonium bromide 0.5kg, hydroquinones 0.6kg, styrene 45kg, light trigger 0.2kg, reactive diluent 5kg, light-initiated compounding ingredient 0.3, composite modifier 8kg.
Light trigger is 2,4,6- trimethylbenzoy-dipheny phosphine oxides;Light-initiated compounding ingredient is o-hydroxy first The mixture of acid phenenyl ester and double (2,2,6,6- tetramethyl -4- piperidyls) sebacates, the two part by weight is 2:1;Activity is dilute Agent is released for neodecanoic acid glycidol fat;
The composition and ratio of composite modifier is as follows:Butyl acrylate 8-10 parts, itaconic acid 10-12 parts, ethylene glycol two shrinks Glycerin ether 8-9 parts, 5 parts of maleic acid, 4,4'- DADPS 0.5-2 parts.
Embodiment 2:
A kind of rapid photocuring vinylite, the specific proportioning of its formula is as follows:Bisphenol F/resorcinol copoly type epoxy Resin 50kg, modifying epoxy resin by organosilicon 10kg, butyl ether benzoguanamine resin 5kg, methacrylic acid 15kg, acrylic acid 18kg, fumaric acid 6kg, maleic anhydride 15kg, tri-phenyl-ethyl phosphonium bromide 0.5kg, hydroquinones 0.6kg, styrene 45kg, light trigger 0.2kg, reactive diluent 5kg, light-initiated compounding ingredient 0.3, composite modifier 8kg;
Light trigger is 2,4,6- trimethylbenzoyl phenyl phosphinic acid ethyl esters;Light-initiated compounding ingredient is septichen The mixture of phenyl ester and double (2,2,6,6- tetramethyl -4- piperidyls) sebacates, the two part by weight is 3:1;Activity dilution Agent is trihydroxy methyl ice alkane triglycidyl ether;
The composition and ratio of composite modifier is as follows:Butyl acrylate 8-10 parts, itaconic acid 10-12 parts, ethylene glycol two shrinks Glycerin ether 8-9 parts, 5 parts of maleic acid, 4,4'- DADPS 0.5-2 parts.
Vinylite prepared by embodiment 1,2, performance test is carried out according to GB, and test result is contrasted with conventional resins Such as following table:
Project Embodiment 1 Embodiment 2 Conventional resins Testing standard
Outward appearance Casting matrix zero defect Casting matrix zero defect Visually
Hardness Barcol ≥40 ≥40 ≥35 GB/T3854-83
Heat distortion temperature DEG C ≥120 ≥120 ≥100 GB/T1634-89
Fracture elongation % 5.5 5.7 3-4 GB/T2568-95
Tensile strength Mpa ≥72 ≥72 ≥65 GB/T2568-95
Tensile modulus of elasticity Mpa ≥4100 ≥4100 ≥3300 GB/T2568-95
Bending strength Mpa 120-150 120-150 ≥100 GB/T2570-95
Modulus of elasticity in static bending Mpa 3700 3800 ≥3100 GB/T2570-95
25 DEG C of solidification rate It is high It is high In
5 DEG C of solidification rate It is high It is high It is low
0 DEG C of solidification rate In In It is low
Embodiment described above is a kind of preferably scheme of the invention, not makees any formal to the present invention Limitation, also has other variants and remodeling on the premise of without departing from the technical scheme described in claim.

Claims (7)

1. a kind of rapid photocuring vinylite, it is characterised in that meter includes by weight:Bisphenol F/resorcinol copolymerization 47-50 parts of type epoxy resin, modifying epoxy resin by organosilicon 10-15 parts, 3-5 parts of butyl ether benzoguanamine resin, methyl-prop Olefin(e) acid 15-16 parts, acrylic acid 14-18 parts, fumaric acid 6-8 parts, maleic anhydride 9-15 parts, tri-phenyl-ethyl phosphonium bromide 0.5- It is 1 part, hydroquinones 0.3-0.6 parts, styrene 45-48 parts, light trigger 0.2-0.5 parts, reactive diluent 2-5 parts, light-initiated Compounding ingredient 0.3-0.8, composite modifier 5-8 parts.
2. a kind of rapid photocuring vinylite according to claim 1, it is characterised in that meter bag by weight Include:Bisphenol F/47 parts of resorcinol copoly type epoxy resin, 15 parts of modifying epoxy resin by organosilicon, butyl ether benzoguanamine tree 3 parts of fat, 16 parts of methacrylic acid, 18 parts of acrylic acid, 6 parts of fumaric acid, 15 parts of maleic anhydride, tri-phenyl-ethyl phosphonium bromide 0.5 part, 0.6 part of hydroquinones, 45 parts of styrene, 0.2 part of light trigger, 5 parts of reactive diluent, light-initiated compounding ingredient 0.3 is multiple Close 8 parts of modifying agent.
3. a kind of rapid photocuring vinylite according to claim 1, it is characterised in that meter bag by weight Include:Bisphenol F/50 parts of resorcinol copoly type epoxy resin, 10 parts of modifying epoxy resin by organosilicon, butyl ether benzoguanamine tree 5 parts of fat, 15 parts of methacrylic acid, 18 parts of acrylic acid, 6 parts of fumaric acid, 15 parts of maleic anhydride, tri-phenyl-ethyl phosphonium bromide 0.5 part, 0.6 part of hydroquinones, 45 parts of styrene, 0.2 part of light trigger, 5 parts of reactive diluent, light-initiated compounding ingredient 0.3 is multiple Close 8 parts of modifying agent.
4. a kind of rapid photocuring vinylite according to claim 1 and 2, it is characterised in that described composite modified Agent is counted composed of the following components by weight:Butyl acrylate 8-10 parts, itaconic acid 10-12 parts, ethylene glycol diglycidyl Ether 8-9 parts, 5 parts of maleic acid, 4,4'- DADPS 0.5-2 parts.
5. a kind of rapid photocuring vinylite according to claim 1, it is characterised in that the light trigger is 2, 4,6- trimethylbenzoy-diphenies phosphine oxide or 2,4,6- trimethylbenzoyl phenyl phosphinic acid ethyl esters.
6. a kind of rapid photocuring vinylite according to claim 1, it is characterised in that the light-initiated compounding ingredient For septichen phenyl ester with it is double(2,2,6,6- tetramethyl -4- piperidyls)The mixture of sebacate, the two part by weight It is 2-3:1.
7. a kind of rapid photocuring vinylite according to claim 1, it is characterised in that the reactive diluent is Neodecanoic acid glycidol fat or trihydroxy methyl ice alkane triglycidyl ether.
CN201611243412.3A 2016-12-29 2016-12-29 A kind of rapid photocuring vinylite Pending CN106866898A (en)

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CN201611243412.3A CN106866898A (en) 2016-12-29 2016-12-29 A kind of rapid photocuring vinylite

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107915847B (en) * 2017-12-18 2020-11-27 长兴合成树脂(常熟)有限公司 Preparation method of anti-aging moisture-curing vinyl resin
CN114395089A (en) * 2022-01-14 2022-04-26 东莞市比翼新材料科技有限公司 Compression molding type vinyl resin and preparation method thereof
CN116100974A (en) * 2022-12-29 2023-05-12 江苏学泰印务有限公司 Preparation process of high-temperature-resistant scratch-resistant PET thermal transfer film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103910855A (en) * 2012-12-29 2014-07-09 常州华科聚合物股份有限公司 Vinyl ester resin and preparation method thereof
CN103951791A (en) * 2014-04-28 2014-07-30 华东理工大学华昌聚合物有限公司 Synthetic method of high-toughness epoxy vinyl ester resin
CN106189980A (en) * 2016-07-12 2016-12-07 武汉市科达云石护理材料有限公司 A kind of enhancement mode fast setting dry-hang glue

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103910855A (en) * 2012-12-29 2014-07-09 常州华科聚合物股份有限公司 Vinyl ester resin and preparation method thereof
CN103951791A (en) * 2014-04-28 2014-07-30 华东理工大学华昌聚合物有限公司 Synthetic method of high-toughness epoxy vinyl ester resin
CN106189980A (en) * 2016-07-12 2016-12-07 武汉市科达云石护理材料有限公司 A kind of enhancement mode fast setting dry-hang glue

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107915847B (en) * 2017-12-18 2020-11-27 长兴合成树脂(常熟)有限公司 Preparation method of anti-aging moisture-curing vinyl resin
CN114395089A (en) * 2022-01-14 2022-04-26 东莞市比翼新材料科技有限公司 Compression molding type vinyl resin and preparation method thereof
CN114395089B (en) * 2022-01-14 2024-04-16 东莞市比翼新材料科技有限公司 Molded vinyl resin and preparation method thereof
CN116100974A (en) * 2022-12-29 2023-05-12 江苏学泰印务有限公司 Preparation process of high-temperature-resistant scratch-resistant PET thermal transfer film

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