CN106848042A - 低亮高灰高显示的led制造工艺 - Google Patents

低亮高灰高显示的led制造工艺 Download PDF

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Publication number
CN106848042A
CN106848042A CN201710096990.7A CN201710096990A CN106848042A CN 106848042 A CN106848042 A CN 106848042A CN 201710096990 A CN201710096990 A CN 201710096990A CN 106848042 A CN106848042 A CN 106848042A
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black
led
substrate
manufacturing process
low bright
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Inventor
雷均勇
谭伟东
刘伟东
梁少芬
张大梅
文群
马甲强
曾露露
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Shenzhen Xinguang Electronic Polytron Technologies Inc
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Shenzhen Xinguang Electronic Polytron Technologies Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明公开一种低亮高灰高显示的LED制造工艺,包括步骤:S1、制作基板时加入黑色原料,使基板成为黑色的基体载体;S2、将晶片和晶线安装在黑色的基板上,分别进行固晶和焊接;S3、制作黑色的胶体,并将黑色胶体封装至LED上;S4、对LED进行烘烤、分光;S5、对封装完成后的LED进行包装封口。通过全黑的制造设计,LED发光的正面是全黑的颜色,LED的光源是从一个较黑色的背景后发出光,从而实现LED应用于显示屏时使显示屏的画面具有更鲜明的对比效果和更柔和的视觉效果并且能有很高的对比度。

Description

低亮高灰高显示的LED制造工艺
技术领域
本发明涉及对数视力表的技术领域,尤其涉及一种低亮高灰高显示的LED制造工艺。
背景技术
光二极管(Light Emitting Diode,LED)是一种能发光的半导体电子元件,可以将电能转化为光能输出。由于其亮度、光照度较强,且功耗小的缘故,被广泛应用于照明、显示等领域。但是目前的所使用的LED显示屏的出光面为点出光且为光表面,容易产生眩光和反光现象,且显示对比度不高。
发明内容
针对上述技术中存在的不足之处,本发明提供一种制造简单方便的低亮高灰高显示的LED制造工艺。
为了达到上述目的,本发明提供的一种低亮高灰高显示的LED制造工艺,包括步骤:
S1、制作基板时加入黑色原料,使基板成为黑色的基体载体;
S2、将晶片和晶线安装在黑色的基板上,分别进行固晶和焊接;
S3、制作黑色的胶体,并将黑色胶体封装至LED上;
S4、对LED进行烘烤、分光;
S5、对封装完成后的LED进行包装封口。
其中,所述黑色胶体的制作包括步骤:
S1、将环氧主剂的A和硬化剂及催化剂等组成的B按一定比例混合均匀并制作成粉剂;
S2、将制成的粉剂中按一定比例加入纳米等的黑色粉末,再混合均匀制作成黑色的粉剂;
S3、将黑色粉剂按一定的重量称取或分配,放入特定的模具型腔内压铸成圆柱状的胶饼并冷藏保存;
S4、将黑色的圆柱形胶饼解冻至常温经molding工艺封装至LED产品上。
其中,所述基板包括基体、玻璃纤维和环氧胶,环氧胶将玻璃纤维粘接在基体上。
其中,所述晶线全部进行黑色化处理。
与现有技术相比,本发明提供的低亮高灰高显示的LED制造工艺,通过全黑的制造设计,LED发光的正面是全黑的颜色,LED的光源是从一个较黑色的背景后发出光,从而实现LED应用于显示屏时使显示屏的画面具有更鲜明的对比效果和更柔和的视觉效果并且能有很高的对比度。
附图说明
图1为本发明LED的制造流程图;
图2为本发明黑色胶体的制造流程图。
具体实施方式
为了更清楚地表述本发明,下面结合附图对本发明作进一步地描述。
参阅图1,本发明提供的一种低亮高灰高显示的LED制造工艺,包括步骤:
S1、制作基板时加入黑色原料,使基板成为黑色的基体载体;
S2、将晶片和晶线安装在黑色的基板上,分别进行固晶和焊接;
S3、制作黑色的胶体,并将黑色胶体封装至LED上;
S4、对LED进行烘烤、分光;
S5、对封装完成后的LED进行包装封口。
与现有技术相比,本发明提供的低亮高灰高显示的LED制造工艺,通过全黑的制造设计,LED发光的正面是全黑的颜色,LED的光源是从一个较黑色的背景后发出光,从而实现LED应用于显示屏时使显示屏的画面具有更鲜明的对比效果和更柔和的视觉效果并且能有很高的对比度。
参阅图2,在本发明中,所述黑色胶体的制作包括步骤:
S1、将环氧主剂的A和硬化剂及催化剂等组成的B按一定比例混合均匀并制作成粉剂;
S2、将制成的粉剂中按一定比例加入纳米等的黑色粉末,再混合均匀制作成黑色的粉剂;
S3、将黑色粉剂按一定的重量称取或分配,放入特定的模具型腔内压铸成圆柱状的胶饼并冷藏保存;
S4、将黑色的圆柱形胶饼解冻至常温经molding工艺封装至LED产品上。
在本发明中,所述基板包括基体、玻璃纤维和环氧胶,环氧胶将玻璃纤维粘接在基体上,所述玻璃纤维主要是起到承载基体的作用,而环氧胶的功能是将多层玻璃纤维粘接结合在一起,起到增加基板强度的作用。
在本发明中,所述晶线全部进行黑色化处理,增加基板的黑色面积。
以上公开的仅为本发明的几个具体实施例,但是本发明并非局限于此,任何本领域的技术人员能思之的变化都应落入本发明的保护范围。

Claims (4)

1.一种低亮高灰高显示的LED制造工艺,包括步骤:
S1、制作基板时加入黑色原料,使基板成为黑色的基体载体;
S2、将晶片和晶线安装在黑色的基板上,分别进行固晶和焊接;
S3、制作黑色的胶体,并将黑色胶体封装至LED上;
S4、对LED进行烘烤、分光;
S5、对封装完成后的LED进行包装封口。
2.根据权利要求1所述的低亮高灰高显示的LED制造工艺,其特征在于,所述黑色胶体的制作包括步骤:
S1、将环氧主剂的A和硬化剂及催化剂等组成的B按一定比例混合均匀并制作成粉剂;
S2、将制成的粉剂中按一定比例加入纳米等的黑色粉末,再混合均匀制作成黑色的粉剂;
S3、将黑色粉剂按一定的重量称取或分配,放入特定的模具型腔内压铸成圆柱状的胶饼并冷藏保存;
S4、将黑色的圆柱形胶饼解冻至常温经molding工艺封装至LED产品上。
3.根据权利要求1所述的低亮高灰高显示的LED制造工艺,其特征在于,所述基板包括基体、玻璃纤维和环氧胶,环氧胶将玻璃纤维粘接在基体上。
4.根据权利要求1所述的低亮高灰高显示的LED制造工艺,所述晶线全部进行黑色化处理。
CN201710096990.7A 2017-02-22 2017-02-22 低亮高灰高显示的led制造工艺 Pending CN106848042A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108864956A (zh) * 2018-06-14 2018-11-23 深圳市德彩光电有限公司 Led封装胶水配方及配制方法

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CN201885071U (zh) * 2010-11-05 2011-06-29 深圳利亚德光电有限公司 Led封装灯、led显示面板及led显示器
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CN202495474U (zh) * 2012-03-19 2012-10-17 佛山市国星光电股份有限公司 一种发光二极管封装结构
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CN201885071U (zh) * 2010-11-05 2011-06-29 深圳利亚德光电有限公司 Led封装灯、led显示面板及led显示器
CN102466205A (zh) * 2010-11-05 2012-05-23 深圳利亚德光电有限公司 Led封装灯、led显示面板及led显示器
CN202495474U (zh) * 2012-03-19 2012-10-17 佛山市国星光电股份有限公司 一种发光二极管封装结构
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108864956A (zh) * 2018-06-14 2018-11-23 深圳市德彩光电有限公司 Led封装胶水配方及配制方法

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Application publication date: 20170613