CN106847864B - A kind of narrow frame touch-control display panel and display device and preparation method thereof - Google Patents
A kind of narrow frame touch-control display panel and display device and preparation method thereof Download PDFInfo
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- CN106847864B CN106847864B CN201710014163.9A CN201710014163A CN106847864B CN 106847864 B CN106847864 B CN 106847864B CN 201710014163 A CN201710014163 A CN 201710014163A CN 106847864 B CN106847864 B CN 106847864B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of narrow frame touch-control display panel and display device and preparation method thereof, the touch-control display panel includes substrate, substrate through holes, TFT circuit layer, the reception of INCELL capacitance touch sensor circuit and transmit circuit layer, OLED device layer, back-side circuit layer and polarization piece and cover board, by being connected by substrate through holes VIA with the TFT circuit layer of substrate top surface on the periphery of display screen effective display area domain Active Area, and the TFT of the substrate top surface of display panel and the protective layer of OLED device are filled into glue by cofferdam and are packaged, its width guarantees minimum widith, realize narrow frame effect；One production method with the display panel and the display device with the display panel are also provided.
Description
Technical field
The present invention relates to display panel field more particularly to a kind of narrow frame touch-control display panel and display devices and its system
Make method.
Background technique
The display technology of mainstream includes TFT-LCD, IPS-LCD, QD-LCD, OLED, electric ink eINK, Micro at present
LED etc..
LCD (Liquid Crystal Display) liquid crystal display applications are extensive, are the display panel skills of current mainstream
Art.The construction of LCD is that liquid crystal cell is placed in the parallel glass substrate of two panels, and TFT (film crystal is arranged on lower baseplate glass
Pipe), colored filter is set on upper substrate glass, is changed by signal on TFT and voltage to control the rotation of liquid crystal molecule
Direction, to reach whether controlling the outgoing of each pixel polarised light and reach display purpose.
And the feature of IPS display panel maximum be exactly its two poles of the earth all on the same face, rather than other liquid crystal modes
Electrode be the solid arrangement in upper and lower surface.
QD (Quantum Dot) LCD is the LCD technology by quantum point light source as backlight.Quantum dot (Quantum
Dot it) is invisible to the naked eye, extremely small inorganic nanocrystal.Whenever the stimulation by light, quantum dot will be issued very
Pure coloured light.Backlight using quanta point material is the most pure backlight of current color.Quantum dot TV uses
The most pure quantum dot light source of color is shown as backlight, revolutionary realization full gamut, most really restores image color.
EINK electronic ink display panel has many advantages, including legibility, flexible, easily cheap manufacture and low-power consumption.With
Other display technologies are compared, and the reflectivity and contrast of electric ink are preferable.
MicroLED technology refers to the LED permutation of high density microsize integrated on a single die, as LED is shown
Screen, each pixel can addressing, be operated alone and light, the scaled down version of outdoor LED display screen can be regarded as, by pixel distance
It is reduced to micron order from grade, scanned compared to existing micro display technology such as DLP, LCoS, MEMS etc., due to
MicroLED self-luminous, optical system are simple, it is possible to reduce volume, weight, the cost of total system, combine low-power consumption,
The characteristics such as fast reaction.
OLED Organic Light Emitting Diode (0rganic Light Emitting Diode, OLED) display panel use is very thin
Coating of organic material and glass substrate, when an electric current passes through it, organic material will shine, and organic light-emitting diode display
Screen visible angle is big, and can save significantly on electric energy, fast response time, is not necessarily to backlight, and colour gamut is wide, and contrast is high, whole
Body structure is frivolous, thus now Organic Light Emitting Diode using more and more extensive.Organic LED display panel divides again
For AMOLED and two kinds of PMOLED.
Traditional display technology, frame need to lay: gate driving GOA circuit or grid drive chip, test pixel list
First circuit (Cell Test Unit), ELVSS power supply and ELVDD ground wire are a plurality of, (RGB is red green for DEMUX data line to pixel circuit
The different pixels such as green four color of Lan Sanse, RGBG RGB arrange mechanism) demultplexer, INCELL touch induction circuit connects
Route, the ESD circuit (signal wire ESD, bonding angle ESD etc.) for receiving circuit (RX) and transmit circuit, then in the week of display panel
While being sealed (Glass Frit Encapsulation) with sealant；And generally in DEMUX circuit side, also to pass through COG
Or COF mode, with ACF each side opposite sex glue bonding display driver chip and the soft arranging wire FPC of bonding display panel.These do
Method all increases the border width of the width of display panel periphery, especially display driver chip and FPC bonding side.
Traditional narrow display panel production technology in both sides or three sides, it is small by doing GOA circuits as practical, or by GOA
Circuit is distributed in basic pixel circuit, and the frame on both sides or three sides is narrowed；This distributed gate driving circuit is done
Method has Railway Project, first is that gate driving circuit is distributed in basic pixel circuit, affects the aperture opening ratio of pixel circuit and bright
Degree, second is that driving capability is limited, it is ineffective to the driving of high-resolution and large size panel, third is that requiring modification display driving
Chip and circuit support distributed gate driving, cause circuit structure complicated.Meanwhile because placing DEMUX circuit and display
The frame on one side of IC is driven, because to do the bonding of display driving IC and the bonding of FPC, frame can not be accomplished extremely narrow, make
Display device can not be designed to the effect on four sides or periphery pole narrow frame.
With the development of technology, consumer pursues the screen accounting of display device, it is desirable to be able in size small as far as possible, have
Effective display area (Active Area, AA) big as far as possible, but traditional Wide frame display panel can not solve to pursue big
Contradiction between the display area and small size portability of size.
The narrow frame display of the patent CN201380069259.5: electronic equipment of Apple Inc.: electricity will be driven with via hole
Road chip (Driver IC) is connected on the flexible circuit board of substrate back in a manner of COF, only addresses only front driving circuit cloth
Rhetoric question topic, there is no the periphery border widths that system effectively solves the problems, such as the display panel of other influences full screen display.And this is specially
Benefit, can also be in addition to all moving all circuits that front occupies frame area to substrate back, including driving circuit using via hole
It is directly made in substrate back, or by driving circuit IC chip, in a manner of COG, is directly anchored to substrate back.
The number of patent application of magnificent starlight electricity: 201510239874.7: narrow frame flexible display apparatus and preparation method thereof, with
Apple patent CN201380069259.5 is similar, arranges driving IC on the FPC of substrate back with via hole.
The U.S. Patent number US20140042406A1:FlexibleDisplays (Apple): flexible base board of Apple Inc.
Display will drive IC etc. to be folded into the mould group back side, be not take up positive viewing area by extending the substrate of rectangular display panel
Domain.But the border width for how reducing other three sides of rectangular panel is not further described.Also fillet is not further described
The frame processing method in the round-corner transition region of rectangular display screen
Summary of the invention
Based on this, it is necessary to provide a kind of display panel, using the present invention program, in the electric property maintained like and show
Under the premise of showing effect, the surrounding periphery frame of display panel can be made narrower, be narrow frame rather than just both sides or three sides.
1. a kind of narrow frame touch-control display panel, it is characterised in that: including substrate, substrate through holes, TFT circuit layer,
The reception circuit and transmit circuit of INCELL capacitance touch sensor circuit, OLED device layer, back-side circuit layer and polarization piece and
Cover-plate glass；The back-side circuit layer is located at the bottom surface of the substrate, and the back-side circuit layer passes through substrate through holes and substrate top
The TFT circuit layer in face is connected；The OLED device layer is set on the TFT circuit layer；The INCELL capacitance touch induction
The transmit circuit of circuit is located in TFT circuit layer, and the reception circuit of the INCELL capacitance touch sensor circuit is located at TFT circuit
In layer or in back-side circuit layer.
2. narrow frame touch-control display panel according to claim 1, it is characterised in that: the substrate material is glass
Substrate or PI substrate.
3. narrow frame touch-control display panel according to claim 2, it is characterised in that: the substrate through holes use
CO2 laser-beam drilling machine is got, and aperture is less than or equal to 25 microns, and empty inner wall plates conductive coating.
4. narrow frame touch-control display panel according to claim 3, it is characterised in that: the conductive coating is Huang
Gold.
5. narrow frame touch-control display panel according to claim 4, it is characterised in that: the back-side circuit layer includes
GOA circuit, earthed circuit ELVSS, test circuit, ESD circuit, DEMUX circuit, VCOM circuit, touches power circuit ELVDD
Driving chip or equivalent touch control driving circuit, display driver chip or equivalent display driver circuit or touch-control show one
Body driving chip TDDI, power supply chip component, FPC bindings bit and FPC, the substrate include opposite top and bottom,
There is via hole, the TFT circuit layer is located at the top surface of the substrate, and the GOA circuit passes through substrate through holes and substrate on substrate
Corresponding grid is connected in the TFT circuit layer of top surface, reduces the GOA peak width of substrate front side, to reduce border width.
6. narrow frame touch-control display panel according to claim 5, it is characterised in that: the DEMUX of back-side circuit layer
Circuit, test circuit, ESD circuit, power circuit ELVDD and earthed circuit ELVSS, VCOM circuit by substrate through holes respectively with
The correspondence source electrode of the circuit of substrate top surface, corresponding test point, corresponding circuits point, substrate top surface ground wire point ELVSS, TFT circuit
The VCOM of layer is connected.
7. narrow frame touch-control display panel according to claim 1, it is characterised in that: also there is power supply chip,
It is bound in substrate bottom surface or bottom plate bottom surface FPC by COF mode, and the power supply chip passes through substrate through holes and back-side circuit
The power circuit ELVDD of layer is connected with earthed circuit ELVSS, provides corresponding driving and source voltage.
8. narrow frame touch-control display panel according to claim 1, it is characterised in that: when the touch drives
Chip or equivalent touch control driving circuit are bound to back-side circuit layer or are bundled on the FPC of back-side circuit layer, pass through base
Plate via hole and the transmit circuit of the INCELL capacitance touch sensor circuit of substrate top surface, receive circuit be connected or directly be located at
Transmit circuit, the reception circuit of INCELL capacitance touch sensor circuit in back-side circuit layer are connected.
9. narrow frame touch-control display panel according to claim 1, it is characterised in that: the display driver chip or
Equivalent display driver circuit or touch-control show the DEMUX circuit of integrated driving chip TDDI connecting substrate bottom surface, and pass through
Substrate through holes are connected with the base pixel data circuit of substrate top surface.
10. narrow frame touch-control display panel according to claim 5, it is characterised in that: each device on back-side circuit layer
Part is bound by each side opposite sex glue ACF.
11. narrow frame touch-control display panel according to claim 1, it is characterised in that: TFT, OLED device
Part and the encapsulation of back-side circuit layer film are packaged by cofferdam filling glue.
12. narrow frame touch-control display panel according to claim 1, it is characterised in that: the display panel can be with
For thin film transistor (TFT) TFT-LCD, IPS-LCD amorphous silicon a-Si-LCD, quantum dot QD-LCD, electric ink eINK, miniature LED,
OLED, nanotube Nanotube display screen.
13. narrow frame touch-control display panel according to claim 6, it is characterised in that: the display panel shape
It can be rectangular, rectangle, circle, sector, round rectangle.
14. narrow frame touch-control display panel according to claim 13, it is characterised in that: when display panel is fillet
When rectangle, source electrode via hole is arranged along fillet outer.
15. narrow frame touch-control display panel according to claim 14, it is characterised in that: the display panel is rigid
Property or flexible display panels.
16. a kind of display device, it is characterised in that: have as the described in any item narrow frame touch-controls of claim 1-15 are aobvious
Show panel.
17. a kind of production method of narrow frame touch-control display panel, it is characterised in that: include panel substrate back side system
Make process flow, top surface fabrication processing, foreboard segment process process and module set section process flow；
The substrate back fabrication processing includes the following steps:
1) the two-sided clean dirt of substrate；
2) laser drilling device is used, it is punched in the corresponding position of substrate；
3) required material is deposited to substrate back by way of physically or chemically filming equipment by substrate back plated film
On, while the inner wall of via hole is coated into conductive material, form conductive via；
4) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding mistake on substrate will be made
Hole alignment connection, then overleaf coats photoresist；
5) by the way of optical illumination, on the substrate after the pattern on light shield to be transferred to by photoresist to plated film；
6) developing process is carried out；
7) etch process: by the way of chemistry or physics, by the film below the figure not covered by photoresist on substrate
It etches away；
8) stripping technology: the photoresist on cover film is washed off, and leaves the film layer with required figure；
Above-mentioned steps 3) -8) it is repeated a number of times, all back-side circuit layer circuits in the production back side, finally, not destroying
Under the premise of each circuit bindings bit bump contact, thin-film package is carried out to the back side；
After substrate back fabrication processing is completed, substrate is overturn, substrate top surface process flow is entered, specifically includes
Following steps:
9) substrate top surface coating process: filming equipment is used, required material is deposited into base with mode physically or chemically
On plate top surface；
10) high precision optical alignment equipment is used, the photoresist position for making related circuit is corresponding on substrate
Via hole alignment connection, then coats photoresist in top surface；
11) by the way of optical illumination, on the substrate after the pattern on light shield to be transferred to by photoresist to plated film；
12) developing process is carried out；
13) etch process: by the way of chemistry or physics, by the film below the figure not covered by photoresist on substrate
It etches away；
14) stripping technology: the photoresist on cover film is washed off, and leaves the film layer with required figure；
Above-mentioned steps 9) -14) it is repeated a number of times, all TFT circuit layer circuits in production top surface；
Foreboard segment process process is subsequently entered, is specifically comprised the following steps:
15) TFT substrate is cleaned, remaining dirt impurity in removal substrate back, top surface fabrication processing；
16) metal mask is thrown the net: high-precision metal mask plate uses the material with extremely low thermal deformation coefficient to make, production
It is located on metal framework and is sent to vapor deposition by screen-tensioning machine after the completion；
17) be deposited: evaporator is deposited through high-precision metal mask plate to LTPS base under ultrahigh vacuum, by organic material
In plate limited area；
18) thin-film package is protected: passing through thin-film package, the TFT circuit layer and organic pixel layer of protective substrate top surface；
19) cover board cleans gluing: after cover board cleaning, glass cement being coated in corresponding position；
20) substrate and cover board encapsulate: under vacuum conditions, being carried out it with protection board with glass cement to be bonded encapsulation；
After the completion of encapsulation, module set section process flow is entered, is specifically comprised the following steps:
21) cutting technique: packaged substrate cut is panel；
22) it panel test: carries out panel and lights inspection and senile experiment；
23) panel is attached into upper polarizer；
24) roll-over panels carry out the binding of back side of panel circuit；
25) back side of panel FPC is bound: the flexible printed circuit board FPC of pre-production being tied to substrate back phase with ACF
Answer contact region；
26) mould group is tested: being carried out the burn-in test of mould group and is lighted inspection, packs shipment.
The beneficial effects of the present invention are: the four sides border width of display panel and display device can be effectively reduced, especially
Its panel for being the reduction of traditional approach production needs to lay the top frame of DEMUX circuit and display driver chip or the width of bottom frame
Degree；Source electrode drive circuit is made in substrate back, reduces the GOA peak width of positive GOA mode about 0.5-1MM or so,
And then reduce border width.Meanwhile because substrate back area is abundant, there is sufficient spatial arrangement source electrode drive circuit, is promoted
Driving capability, improves display effect.Realize that real periphery pole narrow frame is shown.
Detailed description of the invention
In conjunction with attached drawing, invention is further described in detail:
Fig. 1 is the schematic top plan view of the INCELL AMOLED display panel in an embodiment；
Fig. 2 is the elevational schematic view of the INCELL AMOLED display panel in an embodiment；
Fig. 3 is the side sectional view of the INCELL AMOLED display panel in an embodiment；
Fig. 4 is INCELL AMOLED substrate bottom surface (back side) fabrication processing figure in an embodiment；
Fig. 5 is INCELL AMOLED substrate top surface (front) fabrication processing figure in an embodiment；
Fig. 6 is the INCELL AMOLED foreboard process flow chart in an embodiment；
Fig. 7 is the INCELL AMOLED mould group process flow chart in an embodiment；
Fig. 8 is the schematic diagram of the round rectangle display screen in an embodiment；
Specific embodiment
In order to which the purpose of the present invention, technical solution, process flow and advantage is more clearly understood, below in conjunction with attached drawing and
Embodiment, the present invention will be described in further detail.It should be appreciated that specific implementation example described herein is only to solve
The invention patent is released, restriction is not used to and is unable to patent of invention.Those skilled in the art can be by content disclosed by this specification
Other advantages and efficacy of the present invention can be easily understood.The present invention can also be subject to reality by way of a different and different embodiment
It applies or applies, the various details in this specification can also be based on different viewpoints and application, without departing from spirit of the invention
Lower carry out various modifications or alterations.
It should be noted that the basic conception that only the invention is illustrated in a schematic way is illustrated provided in the present embodiment,
Then only shown in schema with it is of the invention in related component rather than component count, shape and size when according to actual implementation draw
System, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout form can also
It can be increasingly complex.
It refering to fig. 1, is the schematic top plan view of narrow frame INCELL touch-control AMOLED display panel of the present invention；It is aobvious to simplify
Show, the basic pixel circuit of TFT circuit layer, only show the pixel circuit matrix (RGB) of 3X3, does not show the transmitting electricity of INCELL
Road (TX) and reception circuit (RX)；To simplify display, schematic top plan view does not show cover board and polaroid.
As shown in Figure 1, the top surface (front) 100 of narrow frame INCELL touch-control AMOLED display panel of the present invention is laid out are as follows:
Substrate front side 100, sealing frame/frame 101, TFT circuit layer 160, power vias ELVDD VIA (111,112,113), ground wire mistake
Hole ELVSS VIA (121,122,123), VCOM via hole 124, pixel unit test circuit (Cell Test Unit) via hole VIA
(131,132,133), gate driving circuit via hole Gate VIA (141,142,143), RGB pixel data circuit vias RGB
The transmit circuit (TX) of VIA (151,152,153), INCELL capacitance touch sensor circuit and the via hole VIA for receiving circuit (RX)
(161,162,163).
The reception of INCELL capacitance touch sensor circuit, transmit circuit via hole VIA (161,162,163).
As shown in Fig. 2, the bottom surface (back side) 200 of narrow frame INCELL touch-control AMOLED display panel of the present invention is laid out are as follows:
Substrate bottom surface 200, gate driving circuit GOA 201 and 202 (left and right), ESD circuit 204 (ESD of signal wire and bonding angle), number
The DEMUX circuit 204 of rgb pixel circuit is arrived according to driving, pixel unit tests circuit (Cell Test Unit) 205, soft arranging wire
FPC 210, the connector 211 on soft arranging wire, the component 212 on soft arranging wire, touch drive circuit, display driver circuit or
Touch-control shows integration drive circuit chip TDDI IC 220.Power supply chip Power IC 221.
As shown in figure 3,
Soft arranging wire FPC 210 is bonded on the corresponding position of back-side circuit layer by each side's opposite sex glue 290 (see Fig. 3)；Touching
It controls driving chip, display driver chip or touch-control and shows that integration drive circuit chip TDDI IC 220 passes through each side's opposite sex
Glue 290 (see Fig. 3), is bonded on the corresponding position of back-side circuit layer；Power supply chip Power IC 221 passes through each side's opposite sex glue
290 (see Fig. 3), are bonded on the corresponding position of back-side circuit layer；Preferably, in certain embodiments, due to technology into
Step, touch-control driving chip and power supply chip 221, unified integration is into single touch-control display driver chip TDDI IC 220.The back side
Power vias ELVDD VIA (111,112,113) and ground wire via hole ELVSS VIA (121,122,123) pass through back-side circuit
It is electrically connected in power supply chip 221 or one chip 220, provides power supply for the basic circuit of substrate front side；The VCOM at the back side
Circuit is connected by VCOM circuit vias VCOM VIA 124 with the VCOM circuit of substrate top surface TFT circuit layer；Pixel unit
It tests circuit (Cell Test Unit) via hole VIA (131,132,133) and back-side circuit layer is electrically connected to by back-side circuit
Pixel unit is tested on circuit (Cell Test Unit)；Gate driving circuit via hole Gate VIA (141,142,143) passes through
Back-side circuit is electrically connected on the gate driving circuit 201 or 202 of back-side circuit layer.RGB pixel data circuit vias RGB VIA
(151,152,153) are electrically connected on the DEMUX circuit 204 of back-side circuit layer by back-side circuit.
To further reduce the cost, reliability is improved, it is preferred that touch-control driving chip can be by being directly produced on substrate base
Equivalent touch drive circuit substitution in the circuit layer of face；
To further reduce the cost, reliability is improved, flexible base board is reduced and bends bring chip rupture problem, preferably
, conventionally employed bare die be bonded to the display driver chip on substrate can by be directly produced in substrate bottom surface circuit layer etc.
Imitate display driver circuit substitution；
Touch-control driving chip or equivalent touch drive circuit, display driver chip or equivalent display driver circuit or
Touch-control shows that integration drive circuit chip TDDI IC 220, power supply chip Power IC 221 and other needs are output to
Other circuit connections of the main circuit board of display device are connected on soft arranging wire FPC210 by the circuit of back-side circuit layer, into
And it is connected on main circuit board by connector 211.
Preferably, GOA circuit, ESD circuit, Cell Test Unit, VCOM circuit, ELVSS, ELVDD and DEMUX it is complete
Portion or part can be laid in the TFT circuit layer of substrate top surface according to technique and process requirements, in a conventional manner.
Preferably, AMOLED display panel of the invention supports the capacitance touching control circuit of Full Incell mode.For
Manufacture difficulty is reduced, AMOLED display panel of the invention also supports the capacitance touching control circuit of Oncell mode
Technology and technique at present with future are supported in the production of capacitance touching control circuit, including are not limited to be based on from electricity
The modes such as appearance, mutual capacitance, the operation of VCOM time-sharing circuit, hybrid INCELL, complete INCELL, metal mesh Metal Mesh, touching
The specific implementation for controlling circuit, not in coverage area of the invention.On certain touch-control circuit implementations, receive (RX,
Induction) circuit or transmitting (TX, driving) circuit can partly or entirely be set to substrate top surface, without being set to substrate base
Face.Its specific implementation, for the purpose of supporting the realized ultra-narrow frame of this patent, not within the scope of the elaboration of this patent.
Preferably, AMOLED display panel of the invention supports touch-control driving and display to drive integrated TDDI chip.
As shown in figure 3, the side sectional view of the INCELL AMOLED display panel in an embodiment of the invention, base
Each functional circuit of the TFT circuit layer of plate top surface, pass through corresponding via hole VIA: power vias ELVDD VIA (111,112,
113), ground wire via hole ELVSS VIA (121,122,123), VCOM circuit vias VCOM VIA124, pixel unit test circuit
(Cell Test Unit) via hole VIA (131,132,133), gate driving circuit via hole Gate VIA (141,142,143),
It the transmit circuit (TX) of RGB pixel data circuit vias RGB VIA (151,152,153), INCELL and receives circuit (RX)
Via hole VIA (161,162,163) is connected on each functional circuit and component of the back-side circuit layer 200 of substrate bottom surface.
Preferably, soft arranging wire FPC210 is bonded to the corresponding position of back-side circuit layer 200 by each side's opposite sex glue ACF 290
On；
Preferably, touch-control driving chip, display driver chip or touch-control show integration drive circuit chip TDDI IC
220, it is bonded on the corresponding position of back-side circuit layer 200 by each side opposite sex glue ACF 290；
Preferably, power supply chip Power IC 221 is bonded to back-side circuit layer 200 by each side opposite sex glue ACF 290
Corresponding position on；
Below in conjunction with schematic diagram, the fabrication processing of AMOLED panel and mould group is further described.
With reference to Fig. 4 INCELL AMOLED substrate bottom surface (back side) fabrication processing:
1) the two-sided clean dirt of substrate, in this embodiment, the substrate may include glass substrate, polyimides tree
Rouge (polyimide abbreviation PI), polyethylene naphthalate (PEN), polyethylene terephthalate (polyester resin
PET), at least one of various kinds of resin lamination, dielectric metallic film, glass resin lamination etc..
2) substrate is punched, using laser drilling device, in the punched VIA of the corresponding position of substrate.In this embodiment
In, via hole can be made before the back-side circuit of production substrate top surface TFT circuit and bottom surface (to carry out laser in plant substrate to beat
Hole), it can also be made after the back-side circuit of production substrate top surface TFT circuit and bottom surface.Using which kind of mode, according to face
The specific technique adjustment of plate factory is required and is carried out.
In this embodiment, as the resolution ratio of technological progress and display panel rises, base pixel element circuit
Up and down and between left and right every can be smaller and smaller, the punching size of punch device be caused, has been more than that interval between pixel is permitted
Range should arrange the modes such as via hole by biserial or multiple row via hole or sawtooth pattern at this time, make corresponding via hole, to support
The via hole technique of high-resolution display panel.
3) substrate bottom surface coating process is that required material is deposited to base with mode physically or chemically using filming equipment
On board bottom face, while the inner wall of via hole is coated into conductive material, forms conductive via.Substrate wall thickness and via diameter ratio, are answered
It prevents from causing to break to ensure that via hole inner wall can continuously coat conductive material greater than certain proportion.If (via hole makes
It is carried out in plant substrate, then the technique of via hole coated inner wall conductive material, should also carry out in plant substrate)
4) bottom surface photoresist is coated with, and coats photoresist in bottom surface.In this step, using high precision optical alignment equipment,
The photoresist position for making related circuit via hole VIA corresponding on substrate is directed at connection.
5) bottom surface exposure technology is by the way of optical illumination, after the pattern on light shield is transferred to plated film by photoresist
Substrate on；
6) developing process；
7) etch process: etch process is the mode using chemistry or physics, the figure that will not covered by photoresist on substrate
Film below shape etches away.
8) stripping technology: finally washing off the photoresist on cover film, leaves the film layer with required figure；
Above-mentioned steps 3) -8) it is repeated a number of times, (usual 12 times), all back-side circuit layers in production bottom surface (including
VCOM circuit, EVLDD power circuit, ELVSS earthed circuit, GOA gate driving circuit, unit testing circuit Cell Test
Unit, ESD circuit, DEMUX circuit, equivalent touch drive circuit, equivalent display driver circuit, INCELL touch-control receive and or
Transmit circuit, touch chip bonding position, display driver chip bonding position, TDDI IC bonding position, power supply chip Power IC bonding
Position, soft arranging wire FPC bonding position etc.), finally under the premise of protecting each bonding position bump contact, overleaf carry out thin-film package
(Thin Film Encapsulation) protects back-side circuit layer.Pass through packaging technology, it is ensured that the flatness of thin-film package,
Prevent substrate back out-of-flatness, caused by display panel bad display.
In order to reduce substrate bottom surface making technology complexity, cost is saved, only can carry out electrical connecting wire in substrate bottom surface
The production on road and touch-control circuit makes (Gate Driver, DEMUX, ESD, Test unit etc.) without TFT circuit, so
One is only needed to arrive P100 process flow twice.The circuits such as Gate Driver, DEMUX, ESD, Test unit, are still in base
Plate top surface process flow production.
Technology and technique at present with future are supported in the production of touch-control circuit, including are not limited to be based on self-capacitance, mutually electricity
The modes such as appearance, the operation of VCOM time-sharing circuit, hybrid INCELL, complete INCELL, metal mesh Metal Mesh, touch-control circuit
Specific implementation, not in coverage area of the invention.On certain touch-control circuit implementations, (RX, induction) electricity is received
Road or transmitting (TX, driving) circuit can partly or entirely be set to substrate top surface, without being set to substrate bottom surface.
After back-side circuit layer completes, substrate is overturn, substrate top surface process flow is entered.
Fig. 5 is INCELL AMOLED substrate top surface (front) fabrication processing figure in an embodiment；The base
Plate top surface fabrication processing the following steps are included:
9) substrate top surface coating process: filming equipment is used, required material is deposited into base with mode physically or chemically
On plate top surface；
10) high precision optical alignment equipment is used, the photoresist position for making related circuit is corresponding on substrate
Via hole alignment connection, then coats photoresist in top surface；
11) by the way of optical illumination, on the substrate after the pattern on light shield to be transferred to by photoresist to plated film；
12) developing process is carried out；
13) etch process: by the way of chemistry or physics, by the film below the figure not covered by photoresist on substrate
It etches away；
14) stripping technology: the photoresist on cover film is washed off, and leaves the film layer with required figure；
Above-mentioned steps 9) -14) it is repeated a number of times, all TFT circuit layer circuits in production top surface；
It is required according to the flow process of panel factory, backboard top surface technique and backboard back process can be exchanged, it can first
Backboard back-side circuit is made, then inverts production back side top surface circuit.
After completing, foreboard segment process process is entered:, as shown in fig. 6, the foreboard section process includes following step
It is rapid:
In this embodiment, foreboard segment process by high-precision metal mask plate (FMM) by luminous organic material and
The materials such as cathode are vaporized on backboard, and luminescent device is formed in conjunction with driving circuit, then are packaged in oxygen-free environment to rise
To protective effect.The aligning accuracy of vapor deposition and the air-tightness of encapsulation are all the challenge places of foreboard segment process.Other techniques are also wrapped
It includes and forms organic light emissive pixels by modes such as printing, inkjet printings
15) TFT substrate is cleaned, remaining dirt impurity in removal substrate back, top surface fabrication processing；
16) metal mask is thrown the net: high-precision metal mask plate uses the material with extremely low thermal deformation coefficient to make, production
It is located on metal framework and is sent to vapor deposition by screen-tensioning machine after the completion；
17) be deposited: evaporator is deposited through high-precision metal mask plate to LTPS base under ultrahigh vacuum, by organic material
In plate limited area；
18) thin-film package is protected: passing through thin-film package, the TFT circuit layer and organic pixel layer of protective substrate top surface；
19) cover board cleans gluing: after cover board cleaning, glass cement being coated in corresponding position；
20) substrate and cover board encapsulate: under vacuum conditions, being carried out it with protection board with glass cement to be bonded encapsulation；
After the completion of encapsulation, module set section fabrication processing is entered.As shown in fig. 7, the module set section fabrication processing
The following steps are included:
21) cutting technique: packaged substrate cut is panel；
22) it panel test: carries out panel and lights inspection and senile experiment；
23) panel is attached into upper polarizer；
24) roll-over panels carry out the binding of back side of panel circuit；
Preferably, in this embodiment, using TDDI technology, touch chip TPIC and display driver chip IC is closed two
It is one；
Preferably, to further reduce the cost, reliability is improved, touch-control driving chip can be by being directly produced on substrate base
Equivalent touch drive circuit substitution in the circuit layer of face；
To further reduce the cost, reliability is improved, flexible base board is reduced and bends bring chip rupture problem, preferably
, conventionally employed bare die be bonded to the display driver chip on substrate can by be directly produced in substrate bottom surface circuit layer etc.
Imitate display driver circuit substitution；
Preferably, in this embodiment, because substrate back regional space is well-to-do, the aobvious of elongated ultra-narrow can not be used
Show driving TDDI IC model, reduce with ACF be bonded chip after, after thermal contraction caused by warpage effect, also reduce because of external force
Caused by display driver chip fracture defect, improve the reliability of display panel；
25) back side of panel FPC is bound: the flexible printed circuit board FPC of pre-production being tied to substrate back phase with ACF
Answer contact region；
26) mould group is tested: being carried out the burn-in test of mould group and is lighted inspection, packs shipment.
As shown in figure 8,810 shape of effective display area domain of the panel 800 is fillet in order to reach beautiful display effect
Rectangle, in the round-corner transition part 830 of round rectangle, grid circuit is connected to back gate driving circuit by via hole VIA, subtracts
The width of few frame 820, and source circuit extends a distance, in bending region 840 by being normally routed typesetting on substrate
Bent, driving circuit IC850 by COG mode with ACF bonding on extended substrate, also prolonging by ACF by bonding by FPC
On long substrate.Under the premise of ultra-narrow frame round rectangle display area by not influencing integral panels, it is cut into a sideband
There is rectangle to extend the round rectangle display screen of substrate, drive circuit chip is then bonded using COG mode on extended substrate
And FPC, via hole mode is applied in combination and is connected to the innovative approach set forth in the present invention such as the gate driving circuit at the back side, reaches round
The ultra-narrow frame display effect of angle rectangular display screen.
The above embodiment is the manufacture craft of the AMOLED display panel of narrow frame INCELL touch control manner of the invention
Process.Concrete technology flow process therein, can carry out sequence adjustment as the case may be, or increase subtract corresponding technique stream
Journey.
Similar, Super AMOLED, amorphous silicon a-Si LCD, LTPS LCD, IPS LCD, quantum dot QD-LCD is micro- aobvious
Show MicroLED, electric ink eINK display panel and following other novel display panel technologies occurred, it can be using this
Described technical solution and process flow are invented, realizes narrow frame display panel.
To sum up, by the above measure, the positive effect of narrow frame touch-control display panel of the invention is: the present invention
The space layout for taking full advantage of substrate back can accomplish display surface under the premise of guaranteeing electric property and display effect
Plate periphery (four sides) pole narrow frame is advantageously implemented periphery (four sides) narrow frame display device of innovation, promotes screen accounting, meets
Mobility requirement of the consumer to big screen display device.
The above specific embodiment is only used to illustrate the technical scheme of the present invention and not to limit it, although referring to example to this hair
It is bright to be described in detail, those skilled in the art should understand that, it can modify to technical solution of the present invention
Or equivalent replacement should all cover in claim of the invention without departing from the spirit and scope of the technical solution of the present invention
In range.
Claims (12)
1. a kind of narrow frame touch-control display panel, it is characterised in that: including substrate, substrate through holes, TFT circuit layer, INCELL electricity
Hold the reception circuit and transmit circuit, OLED device layer, back-side circuit layer and polarize piece and cover-plate glass of touch induction circuit；
The back-side circuit layer is located at the bottom surface of the substrate, and the back-side circuit layer passes through the TFT of substrate through holes and substrate top surface electricity
Road floor is connected；The OLED device layer is set on the TFT circuit layer；The transmitting of the INCELL capacitance touch sensor circuit
Circuit is located in TFT circuit layer, and the reception circuit of the INCELL capacitance touch sensor circuit is located in TFT circuit layer or back
In the circuit layer of face,
The substrate material is glass substrate or PI substrate；
The substrate through holes are got using C02 laser-beam drilling machine, and aperture is less than or equal to 25 microns, and empty inner wall plates conductive coating；
The conductive coating is gold；
The back-side circuit layer include GOA circuit, power circuit ELVDD, earthed circuit ELVSS, test circuit, ESD circuit,
DEMUX circuit, touches driving chip or equivalent touch control driving circuit, display driver chip or equivalent display at VCOM circuit
Driving circuit or touch-control show integrated driving chip TDDI, power supply chip component, FPC bindings bit and FPC, the base
Plate includes opposite top and bottom, has via hole on substrate, the TFT circuit layer is located at the top surface of the substrate, the GOA
Circuit is connected by substrate through holes with corresponding grid in the TFT circuit layer of substrate top surface, and the region GOA of substrate front side is reduced
Width, to reduce border width, each device is bound by each side opposite sex glue ACF on back-side circuit layer；
The production method of the narrow frame touch-control display panel includes panel substrate technique for manufacturing back process, top surface production
Process flow, foreboard segment process process and module set section process flow；
The substrate back fabrication processing includes the following steps:
1) the two-sided clean dirt of substrate；
2) laser drilling device is used, it is punched in the corresponding position of substrate；
3) substrate back plated film is deposited to required material on substrate back by way of physically or chemically filming equipment,
The inner wall of via hole is coated into conductive material simultaneously, forms conductive via；
4) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding via hole pair on substrate will be made
Quasi- connection, then overleaf coats photoresist；
5) by the way of optical illumination, on the substrate after the pattern on light shield to be transferred to by photoresist to plated film；
6) developing process is carried out；
7) etch process: by the way of chemistry or physics, the film below the figure not covered by photoresist on substrate is etched
Fall；
8) stripping technology: the photoresist on cover film is washed off, and leaves the film layer with required figure；
Above-mentioned steps 3) -8) it is repeated a number of times, all back-side circuit layer circuits in the production back side, finally, not destroying each electricity
Under the premise of the bindings bit bump contact of road, thin-film package is carried out to the back side；
After substrate back fabrication processing is completed, substrate is overturn, substrate top surface process flow is entered, specifically includes as follows
Step:
9) substrate top surface coating process: filming equipment is used, required material is deposited into substrate top with mode physically or chemically
On face；
10) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding via hole on substrate will be made
Then alignment connection coats photoresist in top surface；
11) by the way of optical illumination, on the substrate after the pattern on light shield to be transferred to by photoresist to plated film；
12) developing process is carried out；
13) etch process: by the way of chemistry or physics, the film below the figure not covered by photoresist on substrate is etched
Fall；
14) stripping technology: the photoresist on cover film is washed off, and leaves the film layer with required figure；
Above-mentioned steps 9) -14) it is repeated a number of times, all TFT circuit layer circuits in production top surface；
Foreboard segment process process is subsequently entered, is specifically comprised the following steps:
15) TFT substrate is cleaned, remaining dirt impurity in removal substrate back, top surface fabrication processing:
16) metal mask is thrown the net: high-precision metal mask plate uses the material with extremely low thermal deformation coefficient to make, and completes
It is located on metal framework and is sent to vapor deposition by screen-tensioning machine afterwards；
17) be deposited: organic material is deposited through high-precision metal mask plate to LTPS substrate and limits under ultrahigh vacuum by evaporator
Determine on region；
18) thin-film package is protected: passing through thin-film package, the TFT circuit layer and organic pixel layer of protective substrate top surface；
19) cover board cleans gluing: after cover board cleaning, glass cement being coated in corresponding position；
20) substrate and cover board encapsulate: under vacuum conditions, being carried out it with protection board with glass cement to be bonded encapsulation；
After the completion of encapsulation, module set section process flow is entered, is specifically comprised the following steps:
21) cutting technique: packaged substrate cut is panel；
22) it panel test: carries out panel and lights inspection and senile experiment；
23) panel is attached into upper polarizer；
24) roll-over panels carry out the binding of back side of panel circuit；
25) back side of panel FPC is bound: the flexible printed circuit board FPC of pre-production being tied to substrate back with ACF and is accordingly touched
Point region；
26) mould group is tested: being carried out the burn-in test of mould group and is lighted inspection, packs shipment.
2. narrow frame touch-control display panel according to claim 1, it is characterised in that: the DEMUX circuit of back-side circuit layer,
Test circuit, ESD circuit, power circuit ELVDD and earthed circuit ELVSS, VCOM circuit by substrate through holes respectively with substrate
The correspondence source electrode of the circuit of top surface, corresponding test point, corresponding circuits point, the ground wire point ELVSS of substrate top surface, TFT circuit layer
VCOM is connected.
3. narrow frame touch-control display panel according to claim 1, it is characterised in that: also there is power supply chip, pass through
COF mode is bound on substrate bottom surface or bottom plate bottom surface FPC, and the power supply chip passes through substrate through holes and back-side circuit layer
Power circuit ELVDD is connected with earthed circuit ELVSS, provides corresponding driving and source voltage.
4. narrow frame touch-control display panel according to claim 1, it is characterised in that: when the touch driving chip or wait
Effect touch control driving circuit be bound to back-side circuit layer or be bundled on the FPC of back-side circuit layer, by substrate through holes with
Transmit circuit, the reception circuit of the INCELL capacitance touch sensor circuit of substrate top surface are connected or directly and positioned at back-side circuit
Transmit circuit, the reception circuit of INCELL capacitance touch sensor circuit in layer are connected.
5. narrow frame touch-control display panel according to claim 1, it is characterised in that: the display driver chip is equivalent
Display driver circuit or touch-control show the DEMUX circuit of integrated driving chip TDDI connecting substrate bottom surface, and pass through substrate
Via hole is connected with the base pixel data circuit of substrate top surface.
6. narrow frame touch-control display panel according to claim 1, it is characterised in that: TFT, OLED device and the back
Face circuit layer thin-film package is packaged by cofferdam filling glue.
7. narrow frame touch-control display panel according to claim 1, it is characterised in that: the display panel is film crystal
Pipe TFT-LCD, IPS-LCD amorphous silicon a-Si-LCD, quantum dot QD-LCD, electric ink eINK, miniature LED, OLED or nanometer
Pipe Nanotube display screen.
8. narrow frame touch-control display panel according to claim 1, it is characterised in that: the display panel shape is side
Shape, circle, sector or round rectangle.
9. narrow frame touch-control display panel according to claim 8, it is characterised in that: when display panel is round rectangle
When, source electrode via hole is arranged along fillet outer.
10. narrow frame touch-control display panel according to claim 9, it is characterised in that: the display panel be rigidity or
Flexible display panels.
11. a kind of display device, it is characterised in that: have such as the described in any item narrow frame touch-control display surfaces of claim 1-10
Plate.
12. a kind of production method of narrow frame touch-control display panel, it is characterised in that: make work comprising the panel substrate back side
Skill process, top surface fabrication processing, foreboard segment process process and module set section process flow；
The substrate back fabrication processing includes the following steps:
1) the two-sided clean dirt of substrate；
2) laser drilling device is used, it is punched in the corresponding position of substrate；
3) substrate back plated film is deposited to required material on substrate back by way of physically or chemically filming equipment,
The inner wall of via hole is coated into conductive material simultaneously, forms conductive via；
4) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding via hole pair on substrate will be made
Quasi- connection, then overleaf coats photoresist；
5) by the way of optical illumination, on the substrate after the pattern on light shield to be transferred to by photoresist to plated film；
6) developing process is carried out；
7) etch process: by the way of chemistry or physics, the film below the figure not covered by photoresist on substrate is etched
Fall；
8) stripping technology: the photoresist on cover film is washed off, and leaves the film layer with required figure；
Above-mentioned steps 3) -8) it is repeated a number of times, all back-side circuit layer circuits in the production back side, finally, not destroying each electricity
Under the premise of the bindings bit bump contact of road, thin-film package is carried out to the back side；
After substrate back fabrication processing is completed, substrate is overturn, substrate top surface process flow is entered, specifically includes as follows
Step:
9) substrate top surface coating process: filming equipment is used, required material is deposited into substrate top with mode physically or chemically
On face；
10) high precision optical alignment equipment is used, the photoresist position of related circuit and the corresponding via hole on substrate will be made
Then alignment connection coats photoresist in top surface；
11) by the way of optical illumination, on the substrate after the pattern on light shield to be transferred to by photoresist to plated film；
12) developing process is carried out；
13) etch process: by the way of chemistry or physics, the film below the figure not covered by photoresist on substrate is etched
Fall；
14) stripping technology: the photoresist on cover film is washed off, and leaves the film layer with required figure；
Above-mentioned steps 9) -14) it is repeated a number of times, all TFT circuit layer circuits in production top surface；
Foreboard segment process process is subsequently entered, is specifically comprised the following steps:
15) TFT substrate is cleaned, remaining dirt impurity in removal substrate back, top surface fabrication processing:
16) metal mask is thrown the net: high-precision metal mask plate uses the material with extremely low thermal deformation coefficient to make, and completes
It is located on metal framework and is sent to vapor deposition by screen-tensioning machine afterwards；
17) be deposited: organic material is deposited through high-precision metal mask plate to LTPS substrate and limits under ultrahigh vacuum by evaporator
Determine on region；
18) thin-film package is protected: passing through thin-film package, the TFT circuit layer and organic pixel layer of protective substrate top surface；
19) cover board cleans gluing: after cover board cleaning, glass cement being coated in corresponding position；
20) substrate and cover board encapsulate: under vacuum conditions, being carried out it with protection board with glass cement to be bonded encapsulation；
After the completion of encapsulation, module set section process flow is entered, is specifically comprised the following steps:
21) cutting technique: packaged substrate cut is panel；
22) it panel test: carries out panel and lights inspection and senile experiment；
23) panel is attached into upper polarizer；
24) roll-over panels carry out the binding of back side of panel circuit；
25) back side of panel FPC is bound: the flexible printed circuit board FPC of pre-production being tied to substrate back with ACF and is accordingly touched
Point region；
26) mould group is tested: being carried out the burn-in test of mould group and is lighted inspection, packs shipment.
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| CN115424542B (en) * | 2022-11-03 | 2023-02-28 | 长春希达电子技术有限公司 | Seamless spliced Micro-LED display panel and preparation method thereof |
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