CN106847507B - A kind of ultra-thin impulse capacitor and preparation method thereof - Google Patents
A kind of ultra-thin impulse capacitor and preparation method thereof Download PDFInfo
- Publication number
- CN106847507B CN106847507B CN201710174417.3A CN201710174417A CN106847507B CN 106847507 B CN106847507 B CN 106847507B CN 201710174417 A CN201710174417 A CN 201710174417A CN 106847507 B CN106847507 B CN 106847507B
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- plate
- negative plate
- positive
- negative
- positive plate
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- 239000003990 capacitor Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 claims abstract description 51
- 239000010949 copper Substances 0.000 claims abstract description 51
- 238000007747 plating Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000003989 dielectric material Substances 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000012528 membrane Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000007123 defense Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a kind of ultra-thin impulse capacitors, and including intersecting the positive plate and negative plate that are stacked together, the positive plate and negative plate include three-decker, respectively the ceramic dielectric material film of the copper membrane and substrate back of FPC substrate and substrate front side；On positive plate and negative plate, there is the conductive through hole through copper membrane, FPC substrate and ceramic dielectric material film；The copper plating film of all positive plates is connected by the conductive through hole on positive plate；The copper plating film of all negative plates is connected by the conductive through hole on negative plate；The copper membrane one side for intersecting the positive plate and negative plate that stack is upward, and is fixed together by way of pressurization bonding.The invention also discloses the preparation methods of the new type superthin impulse capacitor.Capacitor manufacture of the present invention is very simple, is suitable for high-volume, low cost is manufactured.The overall thickness of the capacitor can control in submillimeter rank.
Description
Technical field
The present invention relates to a kind of capacitors, and in particular to a kind of based on the ultra-thin impulse capacitor of soft board technique and its preparation
Method.
Background technique
Capacitor is that the important electronic components such as modern civilian, national defense industry pass through moment using capacitive charge storage
Triggering release pulse high current realizes short pulse electric discharge.The basic principle of capacitor be using ceramic dielectric material by positive and negative polarities every
It opens, and stores a large amount of charge on the two poles of the earth.Currently, there are mainly two types of common capacitors, organic film capacitor and ceramic electrical
Hold.Organic capacitive amount of storage is big, but volume is also larger simultaneously.Its production procedure needs to undergo winding, is cold-pressed (or hot pressing), is pre-
The series of process process such as braid, metal spraying, welding, encapsulation, sorting, mark, many processes are set by artificial or semi-automation
Standby to complete, production efficiency is low.Ceramic condenser belongs to rigid device, is easy failure, electric leakage in case of large deformations.
Summary of the invention
It is an object of the invention to design a kind of new type superthin pulsed capacitance using mature soft board (FPC) manufacturing process
Device.
A kind of ultra-thin impulse capacitor, including intersecting the positive plate and negative plate that are stacked together, it is characterised in that:
The positive plate and negative plate include three-decker, respectively FPC substrate and the copper membrane of substrate front side and
The ceramic dielectric material film of substrate back；
On positive plate and negative plate, there is the conductive through hole through copper membrane, FPC substrate and ceramic dielectric material film；
The copper plating film of all positive plates is connected by the conductive through hole on positive plate；
The copper plating film of all negative plates is connected by the conductive through hole on negative plate；
The copper membrane one side for intersecting the positive plate and negative plate that stack is upward, and is connected in by way of pressurization bonding
Together.
Further scheme is: the positive plate is identical with the quantity of negative plate；
Further scheme is: the conductive through hole is in position in the side of copper plating film；
Further scheme is: the dielectric material is corresponding with the position of copper plating film, and the size of dielectric material will
The corresponding position of copper plating film is completely covered.
Further scheme is: the positive plate is identical with the structure of negative plate, and positive plate is in FPC base plan
The structure of negative plate when being stacked in intersection after interior 180 ° of rotation.
The present invention also provides the preparation methods of the ultra-thin impulse capacitor, specifically include:
1) one layer of copper film is covered by way of pressing in FPC substrate front side and forms copper membrane；
2) ceramic dielectric material film is formed in FPC substrate back, to complete the production of pole plate；
3) use and step (1) and (2) identical technique, complete the production of multiple pole plates；
4) according to demand, several positive plates and negative plate are intersected and are placed, in placement process, the plating of positive plate and negative plate
Copper film is upward；
5) by way of pressurization bonding, positive plate and negative plate are fixed together；
6) conductive through hole is made on positive plate, and the copper plating film of all positive plates is connected；
7) conductive through hole is made on negative plate, and the copper plating film of all negative plates is connected.
Ultra-thin impulse capacitor of the invention includes positive plate, negative plate and conductive through hole composition, positive plate and negative plate
It is made of copper plating film, polyimide base film and ceramic dielectric material film.
The material that capacitor of the invention uses is common soft board (FPC) baseplate material, and material source is extensive.
Manufacturing process of the invention uses soft board (FPC) manufacturing process, is very suitable for batch micro operations and production, is conducive to
It reduces cost and improves product quality consistency.In the fabrication process, it is plated respectively by the tow sides in polyimide substrate
Copper film and ceramic dielectric material film form the laminated structure of " copper film-polyimides-ceramic dielectric material film ", as capacitor
Positive plate；As the cathode of capacitor (in fact, negative plate and positive plate after the laminated structure is planar rotated 180 °
Shape it is just the same).Anode and cathode intersection are stacked together, presses and is bonded and be integrally formed.After pressing, by leading
All positive plates are connected in parallel by electric through-hole, while all negative plates being connected in parallel by conductive through hole, i.e., complete
At the manufacture of the capacitor.Therefore, the capacitor manufacture which is related to is very simple, and it is raw to be suitable for high-volume, low cost
Produce manufacture.Moreover, because copper film, polyimide film and ceramic dielectric material film can be controlled in tens um~several hundred um thickness
Degree, therefore, the overall thickness of the capacitor can control in submillimeter rank.In addition to this, by increasing positive plate and negative plate
Quantity, the capacity of capacitor can be improved, widened its scope of application significantly.
Detailed description of the invention
Fig. 1 is the section structure diagram of ultra-thin impulse capacitor；
Fig. 2 is the front schematic view of positive plate；
Fig. 3 is the schematic rear view of positive plate；
Fig. 4 is the diagrammatic cross-section of positive plate.
Specific embodiment
The present invention will be further described below with reference to the drawings.
As shown in attached drawing 1-4, a kind of ultra-thin impulse capacitor includes positive plate 1, negative plate 2 and conductive through hole 6.Wherein,
Positive plate 1 includes polyimide substrate 3, copper plating film 4 and ceramic dielectric material film 5.Polyimide substrate 3 with a thickness of tens μm,
Copper plating film 4 is overlayed on polyimide substrate 3 by modes such as pressings, and thickness can be several μm to tens μm；Ceramic dielectric material
Material 5 material thickness of film is similarly several microns to several hundred microns.Conductive through hole 6 be can be seen that from attached drawing 2 with copper plating film 4 is
Connection, by conductive through hole, all positive plates can be formed into conductive path.
A kind of ultra-thin impulse capacitor is put together by positive plate 1 and the intersection of negative plate 2,
Positive plate 1 and negative plate 2 include three-decker, respectively 4 He of FPC substrate 3 and the copper membrane of substrate front side
The ceramic dielectric material film 5 of substrate back；
On positive plate and negative plate, there is the conductive through hole 6 through copper membrane, FPC substrate and dielectric material film；
The copper membrane one of positive plate and negative plate faces upward, and is fixed together by way of pressurization bonding；
The copper plating film of all positive plates is connected by the conductive through hole on positive plate；
The copper plating film of all negative plates is connected by the conductive through hole on negative plate；
Further scheme is: the quantity of the positive plate and negative plate is no less than 2 pieces, and positive plate and negative plate
Quantity it is identical；
The conductive through hole is beaten in the side of copper plating film；
The dielectric material is corresponding with the position of copper plating film, and the size of dielectric material is complete by the corresponding position of copper plating film
All standing.
Ultra-thin impulse capacitor preparation method citing:
1) one layer of copper film is covered by way of pressing on 4 front of FPC substrate form copper membrane；
2) ceramic dielectric material film 6 is formed at 4 back side of FPC substrate, to complete the production of pole plate；
3) use and step (1) and (2) identical technique, complete the production of multiple pole plates；
4) according to demand, several positive plates and negative plate are intersected and are placed, in placement process, the plating of positive plate and negative plate
Copper film is upward；
5) by way of pressurization bonding, positive plate and negative plate are fixed together；
6) conductive through hole is made on positive plate, and the copper plating film of all positive plates is connected；
7) conductive through hole is made on negative plate, and the copper plating film of all negative plates is connected.
Although reference be made herein to invention has been described for explanatory embodiment of the invention, and above-described embodiment is only this hair
Bright preferable embodiment, embodiment of the present invention are not limited by the above embodiments, it should be appreciated that those skilled in the art
Member can be designed that a lot of other modification and implementations, these modifications and implementations will fall in principle disclosed in the present application
Within scope and spirit.
Claims (5)
1. a kind of preparation method of ultra-thin impulse capacitor, it is characterised in that include the following steps:
1) one layer of copper film is covered by way of pressing in FPC substrate front side and forms copper membrane；
2) ceramic dielectric material film is formed in FPC substrate back, to complete the production of pole plate；
3) use and step (1) and (2) identical technique, complete the production of multiple pole plates；
4) according to demand, several positive plates and negative plate are intersected and are placed, in placement process, the copper plating film of positive plate and negative plate
Upward；
5) by way of pressurization bonding, positive plate and negative plate are fixed together；
6) conductive through hole is made on positive plate, and the copper plating film of all positive plates is connected；
7) conductive through hole is made on negative plate, and the copper plating film of all negative plates is connected.
2. the ultra-thin impulse capacitor that one kind makes method according to claim 1, including intersecting the anode being stacked together
Plate and negative plate, it is characterised in that:
The positive plate and negative plate include three-decker, respectively the copper membrane and substrate of FPC substrate and substrate front side
The ceramic dielectric material film at the back side；
On positive plate and negative plate, there is the conductive through hole through copper membrane, FPC substrate and ceramic dielectric material film；
The copper plating film of all positive plates is connected by the conductive through hole on positive plate；
The copper plating film of all negative plates is connected by the conductive through hole on negative plate；
The copper membrane one side for intersecting the positive plate and negative plate that stack is upward, and is connected in one by way of pressurization bonding
It rises；
Wherein, the positive plate is identical with the structure of negative plate, positive plate rotate 180 ° in FPC base plan after i.e. be in
Intersect the structure of negative plate when stacking.
3. ultra-thin impulse capacitor according to claim 2, it is characterised in that: the quantity phase of the positive plate and negative plate
Together.
4. ultra-thin impulse capacitor according to claim 2, it is characterised in that: the conductive through hole is in position in copper plating film
Side.
5. ultra-thin impulse capacitor according to claim 2, it is characterised in that: the position phase of the dielectric material and copper plating film
It is corresponding, and the corresponding position of copper plating film is completely covered the size of dielectric material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710174417.3A CN106847507B (en) | 2017-03-22 | 2017-03-22 | A kind of ultra-thin impulse capacitor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710174417.3A CN106847507B (en) | 2017-03-22 | 2017-03-22 | A kind of ultra-thin impulse capacitor and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106847507A CN106847507A (en) | 2017-06-13 |
| CN106847507B true CN106847507B (en) | 2019-04-23 |
Family
ID=59129932
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710174417.3A Active CN106847507B (en) | 2017-03-22 | 2017-03-22 | A kind of ultra-thin impulse capacitor and preparation method thereof |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215649B1 (en) * | 1998-11-05 | 2001-04-10 | International Business Machines Corporation | Printed circuit board capacitor structure and method |
| CN101651044A (en) * | 2008-08-13 | 2010-02-17 | Tdk株式会社 | Layered ceramic electronic component and manufacturing method therefor |
| CN204741611U (en) * | 2015-05-06 | 2015-11-04 | 浙江万正电子科技有限公司 | Hard and soft combination circuit board of high temperature resistant polyimide |
| CN205846132U (en) * | 2016-07-19 | 2016-12-28 | 浙江超威创元实业有限公司 | A kind of porous polyimide negative pole lithium ion battery with high energy density battery core |
| CN206711763U (en) * | 2017-03-22 | 2017-12-05 | 中国工程物理研究院化工材料研究所 | A kind of ultra-thin impulse capacitor |
-
2017
- 2017-03-22 CN CN201710174417.3A patent/CN106847507B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215649B1 (en) * | 1998-11-05 | 2001-04-10 | International Business Machines Corporation | Printed circuit board capacitor structure and method |
| CN101651044A (en) * | 2008-08-13 | 2010-02-17 | Tdk株式会社 | Layered ceramic electronic component and manufacturing method therefor |
| CN204741611U (en) * | 2015-05-06 | 2015-11-04 | 浙江万正电子科技有限公司 | Hard and soft combination circuit board of high temperature resistant polyimide |
| CN205846132U (en) * | 2016-07-19 | 2016-12-28 | 浙江超威创元实业有限公司 | A kind of porous polyimide negative pole lithium ion battery with high energy density battery core |
| CN206711763U (en) * | 2017-03-22 | 2017-12-05 | 中国工程物理研究院化工材料研究所 | A kind of ultra-thin impulse capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106847507A (en) | 2017-06-13 |
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