CN106833482A - A kind of multifunction electronic component Special heat dissipating fluid sealant - Google Patents
A kind of multifunction electronic component Special heat dissipating fluid sealant Download PDFInfo
- Publication number
- CN106833482A CN106833482A CN201611244068.XA CN201611244068A CN106833482A CN 106833482 A CN106833482 A CN 106833482A CN 201611244068 A CN201611244068 A CN 201611244068A CN 106833482 A CN106833482 A CN 106833482A
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- Prior art keywords
- parts
- fluid sealant
- electronic component
- heat dissipating
- multifunction electronic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
A kind of multifunction electronic component Special heat dissipating fluid sealant, it is prepared from the following raw materials in parts by weight：8 15 parts of attapulgite powder, 69 parts of barium sulfate, 0.4 0.7 parts of catalyst, 35 parts of hydroxy silicon oil, 15 35 parts of polyurethane, 1.2 2.4 parts of vinyl tributyl ketoximyl silane, 0.8 1.2 parts of triphenylphosphine, 0.2 0.8 parts of Tea Polyphenols, 12 20 parts of vinyl silicone oil, 10 16 parts of heat filling, 0.2 0.5 parts of ethynylcyclohexanol etc..Meanwhile, present invention additionally comprises following component：The mixture of sodium bicarbonate particle and carbon dust, and the particle diameter of the mixture is less than 0.1mm.When the fluid sealant is just packed into position to be sealed, fluid sealant is heated to more than 50 DEG C by the hot blast blown out by hair-dryer, and heating is stopped after continuing 30S.The present invention provides a kind of novel seal gum for possessing good heat radiating function.
Description
Technical field
The present invention relates to a kind of multifunction electronic component Special heat dissipating fluid sealant.
Background technology
The use of electronic product is more and more in life, big and small electronic product be all to be combined by all kinds of components and
Into, and component fluid sealant is an indispensable part in component assembling process, the development of component fluid sealant is also from most
Start simple auxiliary fixing function and expand to sealing now, fixed, bonding, protection, insulation, fire-retardant.With electronic equipment to
Miniaturization, high power capacity and high performance direction are developed, and highly integrated and ultrathinization of electronic component has turned into trend, especially
Electronic component operationally under the condition of high temperature, if heat-resisting quantity is unstable, may result in electronic component bad seals,
Failure.The progress of electronic component, just increases the requirement to fluid sealant performance, and being badly in need of one kind has insulating properties, anti-flammability, prevents
The multi-functional fluid sealant such as corruption, thermal diffusivity, heat resistance caters to current market demand.
Meanwhile, existing fluid sealant is used primarily in electronic component, and electronic component is often in the work shape of high temperature
State, when the heat dispersion of fluid sealant is not good, can cause electronic component to be failed because local heating is too high, damaged, and existing
Fluid sealant in technology often only serve sealing and fixation, not only can not heat conduction well, also because of its thermal insulation more not
Beneficial to radiating；Therefore, existing fluid sealant how is improved, preferable heat dispersion is reached, is this area urgent need to resolve
Technical barrier.
The content of the invention
1. the invention technical problem to be solved
In view of the shortcomings of the prior art, the problem to be solved in the present invention is to provide a kind of multifunction electronic component Special heat dissipating
Fluid sealant, with splendid sealing, fixation, bonding, corrosion-resistant performance, heat dispersion is excellent, good stability, and service life
It is long.
2. technical scheme
In order to solve the above technical problems, the technical scheme is that, a kind of multifunction electronic component Special heat dissipating fluid sealant,
It is prepared from the following raw materials in parts by weight：
Attapulgite powder 8-15 parts, barium sulfate 6-9 parts, catalyst 0.4-0.7 parts, hydroxy silicon oil 3-5 parts, polyurethane 15-
35 parts, vinyl tributyl ketoximyl silane 1.2-2.4 parts, triphenylphosphine 0.8-1.2 parts, Tea Polyphenols 0.2-0.8 parts, ethene
12-20 parts of base silicone oil, heat filling 10-16 parts, ethynylcyclohexanol 0.2-0.5 parts, coupling agent 2-7 parts, bis-phenol H types
Epoxy resin 15-30 parts, alkyl phthalates 7-21 parts, defoamer 0.1-0.3 parts.
Optimization, a kind of multifunction electronic component Special heat dissipating fluid sealant, it is prepared from the following raw materials in parts by weight：
11 parts of attapulgite powder, 7.5 parts of barium sulfate, 0.5 part of catalyst, 4 parts of hydroxy silicon oil, 25 parts of polyurethane, the fourth of vinyl three
1.8 parts of ketoximinosilanes, 1 part of triphenylphosphine, 0.5 part of Tea Polyphenols, 16 parts of vinyl silicone oil, 13 parts of heat filling, acetylene
0.4 part of cyclohexanol, 4.5 parts of coupling agent, 23 parts of bis-phenol H types epoxy resin, 15 parts of alkyl phthalates, froth breaking
0.2 part of agent.
Optimization, also including following component：The mixture of sodium bicarbonate particle and carbon dust, and the particle diameter of the mixture is less than
0.1mm。
Optimization, when the fluid sealant is just packed into position to be sealed, the hot blast blown out by hair-dryer is added fluid sealant
Heat stops heating to more than 50 DEG C after continuing 30S.
3. beneficial effect
The beneficial effects of the invention are as follows, multifunction electronic component Special heat dissipating fluid sealant of the invention, with splendid sealing,
Fixed, bonding, corrosion-resistant performance, heat dispersion are excellent, good stability, and long service life.
Specific embodiment
Embodiment 1
A kind of multifunction electronic component Special heat dissipating fluid sealant, it is prepared from the following raw materials in parts by weight：Attapulgite powder 8
Part, 6 parts of barium sulfate, 0.4 part of catalyst, 3 parts of hydroxy silicon oil, 15 parts of polyurethane, vinyl tributyl ketoximyl silane 1.2
Part, 0.8 part of triphenylphosphine, 0.2 part of Tea Polyphenols, 12 parts of vinyl silicone oil, 10 parts of heat filling, ethynylcyclohexanol 0.2
Part, 2 parts of coupling agent, 15 parts of bis-phenol H types epoxy resin, 7 parts of alkyl phthalates, 0.1 part of defoamer.
Embodiment 2
A kind of multifunction electronic component Special heat dissipating fluid sealant, it is prepared from the following raw materials in parts by weight：Attapulgite powder
15 parts, 9 parts of barium sulfate, 0.7 part of catalyst, 5 parts of hydroxy silicon oil, 35 parts of polyurethane, vinyl tributyl ketoximyl silane
2.4 parts, 1.2 parts of triphenylphosphine, 0.8 part of Tea Polyphenols, 20 parts of vinyl silicone oil, 16 parts of heat filling, ethynylcyclohexanol
0.5 part, 7 parts of coupling agent, 30 parts of bis-phenol H types epoxy resin, 21 parts of alkyl phthalates, 0.3 part of defoamer.
Embodiment 3
A kind of multifunction electronic component Special heat dissipating fluid sealant, it is prepared from the following raw materials in parts by weight：Attapulgite powder
11 parts, 7.5 parts of barium sulfate, 0.5 part of catalyst, 4 parts of hydroxy silicon oil, 25 parts of polyurethane, vinyl tributyl ketoximyl silane
1.8 parts, 1 part of triphenylphosphine, 0.5 part of Tea Polyphenols, 16 parts of vinyl silicone oil, 13 parts of heat filling, ethynylcyclohexanol
0.4 part, 4.5 parts of coupling agent, 23 parts of bis-phenol H types epoxy resin, 15 parts of alkyl phthalates, 0.2 part of defoamer.
Meanwhile, in the present embodiment, also including following component：The mixture of sodium bicarbonate particle and carbon dust, and the mixture
Particle diameter be less than 0.1mm.When the fluid sealant is just packed into position to be sealed, the hot blast blown out by hair-dryer is added fluid sealant
Heat stops heating to more than 50 DEG C after continuing 30S.Because solid sodium bicarbonate starts gradually to decompose generation dioxy more than 50 DEG C
Change carbon, generation of the carbon dioxide inside fluid sealant causes that fluid sealant is internally formed porous small ventilating structure, be conducive to close
The heat convection of sealing（Because above-mentioned ventilating structure is small, considerable influence can't be formed to the watertightness performance of fluid sealant）；Together
When, while fluid sealant internal porous ventilating structure is formed, a part of carbon dust can automatically be packed into the hole inside fluid sealant
In, toner passage is formed, so as to be internally formed the heat conduction via based on toner passage in fluid sealant, be conducive to fluid sealant
Heat transfer.By the addition of sodium bicarbonate particle above and toner mixture, the radiating mould inside fluid sealant can be effectively improved
Formula, significantly improves the radiating effect of fluid sealant, so as to provide a kind of novel seal gum for possessing good heat radiating function.（The present invention
It is directed to Application No.：The patent of CN 201511007280 is further improved）.
Claims (4)
1. a kind of multifunction electronic component Special heat dissipating fluid sealant, it is characterised in that：Its by following parts by weight raw material system
Into：Attapulgite powder 8-15 parts, barium sulfate 6-9 parts, catalyst 0.4-0.7 parts, hydroxy silicon oil 3-5 parts, polyurethane 15-35
Part, vinyl tributyl ketoximyl silane 1.2-2.4 parts, triphenylphosphine 0.8-1.2 parts, Tea Polyphenols 0.2-0.8 parts, vinyl
Silicone oil 12-20 parts, heat filling 10-16 parts, ethynylcyclohexanol 0.2-0.5 parts, coupling agent 2-7 parts, bis-phenol H type rings
15-30 parts, alkyl phthalates 7-21 parts, defoamer 0.1-0.3 parts of oxygen tree fat.
2. the multifunction electronic component Special heat dissipating fluid sealant according to claim 1, it is characterised in that：It is by following
The raw material of parts by weight is made：
11 parts of attapulgite powder, 7.5 parts of barium sulfate, 0.5 part of catalyst, 4 parts of hydroxy silicon oil, 25 parts of polyurethane, vinyl
1.8 parts of tributanoximo silane, 1 part of triphenylphosphine, 0.5 part of Tea Polyphenols, 16 parts of vinyl silicone oil, 13 parts of heat filling,
0.4 part of ethynylcyclohexanol, 4.5 parts of coupling agent, 23 parts of bis-phenol H types epoxy resin, 15 parts of alkyl phthalates,
0.2 part of defoamer.
3. the multifunction electronic component Special heat dissipating fluid sealant according to claim 1, it is characterised in that also including with
Lower composition：The mixture of sodium bicarbonate particle and carbon dust, and the particle diameter of the mixture is less than 0.1mm.
4. the multifunction electronic component Special heat dissipating fluid sealant according to claim 3, it is characterised in that：When the sealing
When glue is just packed into position to be sealed, fluid sealant is heated to more than 50 DEG C by the hot blast blown out by hair-dryer, is stopped after continuing 30S
Only heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244068.XA CN106833482A (en) | 2016-12-29 | 2016-12-29 | A kind of multifunction electronic component Special heat dissipating fluid sealant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244068.XA CN106833482A (en) | 2016-12-29 | 2016-12-29 | A kind of multifunction electronic component Special heat dissipating fluid sealant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106833482A true CN106833482A (en) | 2017-06-13 |
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ID=59113576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611244068.XA Pending CN106833482A (en) | 2016-12-29 | 2016-12-29 | A kind of multifunction electronic component Special heat dissipating fluid sealant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106833482A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109370198A (en) * | 2018-10-31 | 2019-02-22 | 江苏伊顿航天材料股份有限公司 | A kind of space flight sealing ring sealant |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812280A (en) * | 2010-04-09 | 2010-08-25 | 连云港昭华科技有限公司 | Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method |
| CN104629671A (en) * | 2015-02-25 | 2015-05-20 | 孙高雷 | Modified polyurethane sealant |
| CN105385403A (en) * | 2015-12-30 | 2016-03-09 | 王丽萍 | Sealant special for multifunctional electronic parts and components |
| CN105733488A (en) * | 2015-02-25 | 2016-07-06 | 孙高雷 | Preparation method of modified polyurethane sealant |
-
2016
- 2016-12-29 CN CN201611244068.XA patent/CN106833482A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812280A (en) * | 2010-04-09 | 2010-08-25 | 连云港昭华科技有限公司 | Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method |
| CN104629671A (en) * | 2015-02-25 | 2015-05-20 | 孙高雷 | Modified polyurethane sealant |
| CN105733488A (en) * | 2015-02-25 | 2016-07-06 | 孙高雷 | Preparation method of modified polyurethane sealant |
| CN105385403A (en) * | 2015-12-30 | 2016-03-09 | 王丽萍 | Sealant special for multifunctional electronic parts and components |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109370198A (en) * | 2018-10-31 | 2019-02-22 | 江苏伊顿航天材料股份有限公司 | A kind of space flight sealing ring sealant |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |