CN106827717A - A kind of high dielectric property flexibility coat copper plate and preparation method thereof - Google Patents
A kind of high dielectric property flexibility coat copper plate and preparation method thereof Download PDFInfo
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- CN106827717A CN106827717A CN201710013041.8A CN201710013041A CN106827717A CN 106827717 A CN106827717 A CN 106827717A CN 201710013041 A CN201710013041 A CN 201710013041A CN 106827717 A CN106827717 A CN 106827717A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
- B32B2038/168—Removing solvent
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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Abstract
The invention discloses a kind of high dielectric property flexibility coat copper plate and preparation method thereof.The flexibility coat copper plate is by the common up of three layers of polymer insulation basement membrane, liquid crystal polymer adhesive layer and metal foil.Wherein, the dielectric constant of prepared flexibility coat copper plate is 2.8 3.2, and dielectric loss is 0.003 0.008.Preparation method is to synthesize epoxy resin by using liquid crystal first, then prepares epoxy resin by using liquid crystal adhesive, and then adhesive is coated uniformly on polyimide film, and is continuously pressed with rolled copper foil hot-rolling, and final high temperature solidification obtains high dielectric property flexibility coat copper plate.Flexibility coat copper plate prepared by us not only has flexible high, thickness is small and the advantages of high-termal conductivity, simultaneously also relatively low dielectric constant and dielectric loss, therefore the characteristics of there is high-frequency high-speed, electronic applications can be widely used in, such as 4G smart mobile phones, radar, aerospace equipment, navigation equipment, aircraft instrument, military guidance system etc..
Description
Technical field
A kind of high dielectric property flexibility coat copper plate the present invention relates to flexibility coat copper plate technical field and preparation method thereof, more
Refer specifically to a kind of with high flexibility, high-termal conductivity, while the flexibility coat copper plate of also relatively low dielectric constant and dielectric loss.
Background technology
Flexibility coat copper plate refers to, in the single or double of the flexible insulating material such as polyester film or Kapton, to pass through
Certain PROCESS FOR TREATMENT, bonds together formed copper-clad plate with Copper Foil.Flexibility coat copper plate be widely used in aerospace equipment,
Navigation equipment, aircraft instrument, military guidance system and mobile phone, digital camera, DV, vehicle satellite direction positioning dress
Put, in the electronic product such as LCD TV, notebook computer.With the big great development of high-frequency communication so that mobile phone, automobile electricity
Words, radio communication develops to high frequency, and frequency of use is shifted from MHz to ghz band, and information transmission enters high frequency field.Electronics
Information products high frequency, high speed propose requirement higher to the high frequency characteristics of flexibility coat copper plate.High frequency flexibility coat copper plate
Fundamental characteristics must reach following two requirements：(1) dielectric constant (Dk) must be small and very stable.It is typically the smaller the better,
The transfer rate of signal is inversely proportional with the square root of material dielectric constant, and high-k easily causes signal transmission delay.(2)
Dielectric loss (Df) must be small.Dielectric loss (Df) mainly has influence on the quality of signal transmission, and dielectric loss is smaller so that signal
Loss is also smaller.The technology of current high-frequency high-speed flexibility coat copper plate is mainly monopolized by the company in the U.S. and Japan, such as Japan
The flexibility coat copper plate kind of Asahi Kasei Corporation's production is more, and performance is more excellent, with Tg high (255~330 DEG C), heat resistance
The advantages of (160~230 DEG C), moisture resistance, low Dk and low Df.The ROGERS (Rogers) of ROGERS CORPORATION of U.S. production covers copper
The series such as plate, such as RO3200, RO3210, RO4003, lowest dielectric constant even can reach 2.2.Compared with foreign countries, China
High-frequency high-speed flexibility coat copper plate also in the starting stage, species is rare.
The content of the invention
For above-mentioned the deficiencies in the prior art, the purpose of the present invention, be to provide a kind of high dielectric property flexibility coat copper plate and
Its preparation method, the flexibility coat copper plate not only has flexible high, and thickness is small and the advantages of high-termal conductivity, while also relatively low Jie
Electric constant and dielectric loss, therefore the characteristics of with high-frequency high-speed, can apply in extensive field.In order to realize above-mentioned mesh
, technical scheme is as follows：
By 100 parts of P-hydroxybenzoic acid of quality, the hydroquinones of 50-80 mass parts, 260-300 mass parts toluene,
The 0.5-0.8 mass parts concentrated sulfuric acids, add and are equipped with the reactor of water knockout drum and nitrogen device.Under nitrogen protection, it is heated to reflux
Reaction about 8-10h, cold filtration.Product is vacuum dried 5-10h at 60-80 DEG C, obtains P-hydroxybenzoic acid hydroquinones ester.So
150-200 mass parts epoxychloropropane, 0.2-0.5 mass parts tetramethyl ammonium chlorides is added under nitrogen protection, to be warmed up to afterwards
70-80 DEG C, about 10-12h is reacted, be cooled to 60 DEG C, be slowly added to the NaOH that 20-70 mass parts concentration is 30%-60% water-soluble
Liquid, continues to react 5-8h, stops reaction.Cold filtration, product is vacuum dried 5-10h at 60-80 DEG C, obtains P-hydroxybenzoic acid
Hydroquinones ester diglycidyl ether.The organic solvent of 80-150 mass parts is added to the P-hydroxybenzoic acid of 100 mass parts
In hydroquinones ester diglycidyl ether, the curing agent of 2-8 mass parts is added, 30Min is to system substantially uniformity for stirring, that is, make
Obtain epoxy resin by using liquid crystal adhesive.Adhesive is coated uniformly on polyimide film, then rapid draing removal solvent, then
By polyimide film and rolled copper foil hot-rolling in 150 DEG C or so continuous pressings, finally it is placed in 150-180 DEG C of baking oven and solidifies
1-3h, you can prepare high dielectric property flexibility coat copper plate.
Described polyimide film, thickness is 5-100 μm, and liquid crystal polymer adhesive layer thickness is 5-50 μm, rolled copper foil
Thickness is 5-100 μm.
Described P-hydroxybenzoic acid is 1 than scope with the quality of hydroquinones and toluene：0.5-0.8：2.6-3.0,
Preferred value is 1：0:5-0.6：2.7-2.9.
Described P-hydroxybenzoic acid is 1 than scope with the quality of epoxychloropropane and tetramethyl ammonium chloride：1.5-
2.0：0.002-0.005, preferred value is 1：1.6-1.8：0.003-0.004.
Described P-hydroxybenzoic acid is 1 than scope with the quality of the NaOH aqueous solution：0.2-0.7, preferred value is 1：0.3-
0.5。
The concentration range of the described NaOH aqueous solution is 30%-60%, and preferred value is 40%-50%.
Described P-hydroxybenzoic acid hydroquinones ester diglycidyl ether is 1 than scope with the quality of organic solvent：
0.8-1.5, preferred value is 1：0.9-1.1.
Described organic solvent can be acetone, chloroform, tetrahydrofuran, petroleum ether, ether, dichloromethane, acetic acid second
One kind in ester, ethanol, dioxane, dimethylformamide.
Described P-hydroxybenzoic acid hydroquinones ester diglycidyl ether is 1 than scope with the quality of curing agent：0.02-
0.08, preferred value is 1：0.04-0.06.
Described curing agent is one or two the mixture in MDA and DADPS.
Compared with prior art, its advantage is the present invention：Synthesize a kind of containing virtue with P-hydroxybenzoic acid and hydroquinones
The epoxy resin by using liquid crystal of esters crystallization unit, and it is prepared for adhesive with it.Because the adhesive solidifies in liquid crystal temperature range, make
Molecular ordered arrangement forms Mesomorphic domain, and its heat conductivility and peel strength can be significantly improved.The copper-clad plate prepared with the adhesive
Also there is good flexural property and relatively low dielectric constant and dielectric loss, can be widely applied to require high-frequency high-speed
Electronic applications.
Brief description of the drawings
Fig. 1 is the structure chart of high dielectric property flexibility coat copper plate, wherein, 1.PI films, 2. epoxy resin by using liquid crystal adhesive layer, 3.
Rolled copper foil.
Specific embodiment：
Embodiment 1
The P-hydroxybenzoic acid of 100kg, the hydroquinones of 50kg, 270kg toluene, the 0.6kg concentrated sulfuric acids are added to be equipped with and divided
In the reactor of hydrophone and nitrogen device.Under nitrogen protection, heating reflux reaction about 8h, cold filtration.Product is true at 70 DEG C
Sky dries 10h, obtains P-hydroxybenzoic acid hydroquinones ester.It is subsequently adding 160kg epoxychloropropane, 0.3kg tetramethyl chlorinations
Ammonium, under nitrogen protection, is warmed up to 80 DEG C, reacts about 12h, is cooled to 60 DEG C, and it is 40% to be slowly added to 40kg mass concentrations
The NaOH aqueous solution, continues to react 7h, stops reaction.Cold filtration, product is vacuum dried 10h at 80 DEG C, obtains para hydroxybenzene first
Sour hydroquinones ester diglycidyl ether.The acetone of 100kg is added to the contracting of P-hydroxybenzoic acid hydroquinones ester two of 100kg
In water glycerin ether, the MDA of 6kg is added, stirring 30Min to system substantially uniformity is obtained liquid crystalline epoxy tree
Fat adhesive.Adhesive is coated uniformly on polyimide film, then rapid draing removal solvent, then by 30 μm of polyamides Asias
Amine film and 30 μm of rolled copper foil hot-rollings are finally placed in 150 DEG C of baking oven and solidify 3h in 150 DEG C or so continuous pressings, you can
Prepare high dielectric property flexibility coat copper plate.
Embodiment 2
The P-hydroxybenzoic acid of 100kg, the hydroquinones of 60kg, 280kg toluene, the 0.8kg concentrated sulfuric acids are added to be equipped with and divided
In the reactor of hydrophone and nitrogen device.Under nitrogen protection, heating reflux reaction about 9h, cold filtration.Product is true at 70 DEG C
Sky dries 10h, obtains P-hydroxybenzoic acid hydroquinones ester.It is subsequently adding 190kg epoxychloropropane, 0.4kg tetramethyl chlorinations
Ammonium, under nitrogen protection, is warmed up to 70 DEG C, reacts about 12h, is cooled to 60 DEG C, and it is 40% to be slowly added to 50kg mass concentrations
The NaOH aqueous solution, continues to react 8h, stops reaction.Cold filtration, product is vacuum dried 8h at 80 DEG C, obtains P-hydroxybenzoic acid
Hydroquinones ester diglycidyl ether.The tetrahydrofuran of 90kg is added to the P-hydroxybenzoic acid hydroquinones ester two of 100kg
In glycidol ether, the DADPS of 6kg is added, stirring 30Min to system substantially uniformity is obtained liquid crystalline epoxy tree
Fat adhesive.Adhesive is coated uniformly on polyimide film, then rapid draing removal solvent, then by 50 μm of polyamides Asias
Amine film and 50 μm of rolled copper foil hot-rollings are finally placed in 160 DEG C of baking oven and solidify 2h in 150 DEG C or so continuous pressings, you can
Prepare high dielectric property flexibility coat copper plate.
Embodiment 3
The P-hydroxybenzoic acid of 100kg, the hydroquinones of 70kg, 290kg toluene, the 0.8kg concentrated sulfuric acids are added to be equipped with and divided
In the reactor of hydrophone and nitrogen device.Under nitrogen protection, heating reflux reaction about 10h, cold filtration.Product is true at 80 DEG C
Sky dries 5h, obtains P-hydroxybenzoic acid hydroquinones ester.It is subsequently adding 170kg epoxychloropropane, 0.3kg tetramethyl chlorinations
Ammonium, under nitrogen protection, is warmed up to 80 DEG C, reacts about 10h, is cooled to 60 DEG C, and it is 30% to be slowly added to 50kg mass concentrations
The NaOH aqueous solution, continues to react 7h, stops reaction.Cold filtration, product is vacuum dried 8h at 80 DEG C, obtains P-hydroxybenzoic acid
Hydroquinones ester diglycidyl ether.The chloroform of 110kg is added to the shrink of P-hydroxybenzoic acid hydroquinones ester two of 100kg
In glycerin ether, it is the MDA of 8kg and the mixture of DADPS to add gross mass, and stirring 30Min is extremely
System substantially uniformity, that is, be obtained epoxy resin by using liquid crystal adhesive.Adhesive is coated uniformly on polyimide film, then quickly
Removal solvent is dried, then 10 μm of polyimide films and 10 μm of rolled copper foil hot-rollings is continuously pressed at 150 DEG C or so, finally
It is placed in 180 DEG C of baking oven and solidifies 1h, you can prepares high dielectric property flexibility coat copper plate.
The performance of the high dielectric property flexibility coat copper plate of table one
Claims (8)
1. a kind of high dielectric property flexibility coat copper plate, it is characterised in that the copper-clad plate is by polymer insulation basement membrane, liquid crystal polymer
Adhesive layer and the common up of three layers of metal foil, polymer insulation basement membrane is polyimide film, and thickness is 5-100 μm, liquid crystal polymer
Adhesive layer is the adhesive that epoxy resin by using liquid crystal is matrix, and thickness is 5-50 μm, and metal foil is rolled copper foil, and thickness is 5-100 μ
m。
2. the preparation method of the high dielectric property flexibility coat copper plate described in claim 1, it is characterised in that specific preparation method is such as
Under：
（1）Synthesis epoxy resin by using liquid crystal, by P-hydroxybenzoic acid, hydroquinones, toluene, the concentrated sulfuric acid, add equipped with water knockout drum and
In the reactor of nitrogen device, under nitrogen protection, heating reflux reaction 8-10h, cold filtration, product is in 60-80 DEG C of vacuum
5-10h is dried, P-hydroxybenzoic acid hydroquinones ester is obtained, epoxychloropropane is subsequently adding, tetramethyl ammonium chloride is protected in nitrogen
Under shield, 70-80 DEG C is warmed up to, reacts 10-12h, be cooled to 60 DEG C, add the NaOH aqueous solution, continue to react 5-8h, stopped
Reaction, cold filtration, product is vacuum dried 5-10h at 60-80 DEG C, obtains P-hydroxybenzoic acid hydroquinones ester 2-glycidyl
Ether；
（2）Epoxy resin by using liquid crystal adhesive is prepared, by P-hydroxybenzoic acid hydroquinones ester diglycidyl ether obtained above
Dissolved with organic solvent, be subsequently adding curing agent, stirring 30min to system substantially uniformity is obtained epoxy resin by using liquid crystal gluing
Agent；
（3）Adhesive is coated uniformly on polyimide film, then rapid draing removal solvent, then by polyimide film with
Rolled copper foil hot-rolling is finally placed in 150-180 DEG C of baking oven and solidifies 1-3h, you can obtain Gao Jie in 150 DEG C of continuous pressings
Electrical property flexibility coat copper plate.
3. the preparation method of the high dielectric property flexibility coat copper plate described in claim 2, it is characterised in that P-hydroxybenzoic acid,
Hydroquinones, toluene, epoxychloropropane, tetramethyl ammonium chloride, the quality of the NaOH aqueous solution are 1 than scope：0.5-0.8：2.6-
3.0：1.5-2.0：0.002-0.005：0.2-0.7.
4. the preparation method of the high dielectric property flexibility coat copper plate described in claim 2, it is characterised in that P-hydroxybenzoic acid,
Hydroquinones, toluene, epoxychloropropane, tetramethyl ammonium chloride, the quality of the NaOH aqueous solution are 1 than scope：0:5-0.6：2.7-
2.9：1.6-1.8：0.003-0.004：0.3-0.5.
5. the preparation method of the high dielectric property flexibility coat copper plate described in claim 2, it is characterised in that the NaOH aqueous solution it is dense
Degree scope is 30%-60%, and preferred value is 40%-50%.
6. the preparation method of the high dielectric property flexibility coat copper plate described in claim 2, it is characterised in that P-hydroxybenzoic acid pair
Benzenediol ester diglycidyl ether is 1 than scope with the quality of organic solvent：0.8-1.5, preferred value is 1：0.9-1.1.
7. the preparation method of the high dielectric property flexibility coat copper plate described in claim 2, it is characterised in that selected is organic molten
Agent is acetone, chloroform, tetrahydrofuran, petroleum ether, ether, dichloromethane, ethyl acetate, ethanol, dioxane, dimethyl formyl
One kind in amine.
8. the preparation method of the high dielectric property flexibility coat copper plate described in claim 2, it is characterised in that P-hydroxybenzoic acid pair
Benzenediol ester diglycidyl ether is 1 than scope with the quality of curing agent：0.02-0.08, preferred value is 1：0.04-0.06, institute
The curing agent stated is one or two the mixture in MDA and DADPS.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| WO2021259030A1 (en) * | 2020-06-22 | 2021-12-30 | 深圳市信维通信股份有限公司 | Production method for liquid crystal polymer flexible copper-clad laminate |
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|---|---|
| CN106827717B (en) | 2019-05-28 |
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