CN106827580A - The forming method of electronic product casing - Google Patents

The forming method of electronic product casing Download PDF

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Publication number
CN106827580A
CN106827580A CN201611237763.3A CN201611237763A CN106827580A CN 106827580 A CN106827580 A CN 106827580A CN 201611237763 A CN201611237763 A CN 201611237763A CN 106827580 A CN106827580 A CN 106827580A
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CN
China
Prior art keywords
mould
fiber
glass
fabric
electronic product
Prior art date
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Pending
Application number
CN201611237763.3A
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Chinese (zh)
Inventor
欧阳丽娟
陈柏凤
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Hezhou Stone Information Technology Co Ltd
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Hezhou Stone Information Technology Co Ltd
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Priority to CN201611237763.3A priority Critical patent/CN106827580A/en
Publication of CN106827580A publication Critical patent/CN106827580A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
    • B29C70/34—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
    • B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
    • B29B15/10—Coating or impregnating independently of the moulding or shaping step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones

Abstract

The invention discloses a kind of forming method of electronic product casing, including：Step one, take carbon cloth use thermosetting resin soak 3~7 hours, take glass-fiber-fabric use thermoplastic resin soak 3~9 hours；Step 2,2~4 layers of carbon cloth and 1 layer of glass-fiber-fabric are taken, be staggeredly stacked successively to certain height is reached, obtain the folded structure of composite；Step 3, above-mentioned composite is folded and is set up in the die cavity of a mould, the mould includes die face and the projection being formed in the die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes is correspondingly arranged with the projection, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, obtain shell mechanism, and by the colloid removal on the shell mechanism, wherein, it is 2~4 × 10 to the mould pressurizing5Pa, the temperature of heating is 190~250 DEG C.

Description

The forming method of electronic product casing
Technical field
The invention belongs to Electronic products manufacturing method and technology field, it is related to a kind of forming method of electronic product casing.
Background technology
Such as mobile phone, panel computer, PC etc. electronic product is in the more new period at full speed, various new technologies, New opplication etc. emerges in an endless stream, and the shell to electronic product there has also been requirement higher.The material one of traditional electronic product casing As be metal or plastics.The shell of metal is laid particular stress on, and plastic casing is then more crisp, and general all thicker, with electronic product industry Development, not only light but also thin product increasingly welcome by everybody, therefore, use intensity is higher, can be made thinner answering Condensation material makes electronic product casing, selection as many producers and personal user.
The content of the invention
It is an object of the invention to solve at least the above and/or defect, and provide at least will be described later excellent Point.
The present invention has designed and developed a kind of forming method of electronic product casing.
The present invention provide technical scheme be：
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 3~7 hours, the carbon cloth and the thermosetting The mass volume ratio of resin is 1:5~6, take glass-fiber-fabric use thermoplastic resin soak 3~9 hours, the glass-fiber-fabric with it is described The mass volume ratio of thermoplastic resin is 1:4~6；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2~4 layers of carbon cloth and 1 layer of glass Cloth, is staggeredly stacked to certain height is reached, to obtain the folded structure of composite successively；
Step 3, above-mentioned composite is folded and is set up in the die cavity of a mould, the mould includes die face and formation Projection in the die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the pre-formed holes Position is correspondingly arranged with the projection, and the folded fusion of the composite is made to mould pressurizing heating, quick afterwards to reduce mould temperature And molding, obtain shell mechanism, and by the colloid removal on the shell mechanism, wherein, be 2~4 to the mould pressurizing × 105Pa, the temperature of heating is 190~250 DEG C.
Preferably, in the forming method of described electronic product casing, in the step one, carbon cloth uses thermosetting Property resin soak 5 hours, the mass volume ratio of the carbon cloth and the thermosetting resin is 1:5.5.
Preferably, in the forming method of described electronic product casing, in the step one, take glass-fiber-fabric and use thermoplastic Property resin soak 6 hours, the mass volume ratio of the glass-fiber-fabric and the thermoplastic resin is 1:5.
Preferably, in the forming method of described electronic product casing, in the step 2, the carbon cloth and glass The number of plies ratio of fine cloth is 3:1.
Preferably, in the forming method of described electronic product casing, certain height is 1~5cm.
Preferably, in the forming method of described electronic product casing, in the step 3, the mould pressurizing is added Heating rate when hot is 15~20 DEG C/s, and rate of pressure rise is 0.4~0.6 × 105Pa/s。
Preferably, in the forming method of described electronic product casing, in the step 3, the quick reduction mould temperature In molding, the speed for reducing mould temperature is 10~15 DEG C/s, and the speed for reducing molding is 0.2~0.4 × 105Pa/s。
The present invention at least includes following beneficial effect：
The present invention causes its toughness and intensity to the pre-treatment method of carbon cloth and glass-fiber-fabric more preferably, bearing temperature, Pressure and deformability are significantly improved.
The present invention is staggeredly stacked using carbon cloth and glass-fiber-fabric so that the intensity of the shell being made is big and good toughness, no Frangibility.
The intensity of the shell prepared using the method for the present invention improves 5~10%, and toughness improves 2~8%, uses effect Fruit is good.
The carbon cloth and the treated glass-fiber-fabric of thermoplastic resin that the present invention is treated using thermosetting resin are answered Prepared by condensation material, it is integrated, and then fast cooling obtains solidification outer cover body, is integrally formed outside the electronic product Shell, it is ensured that the uniformity of product, yield is further enhanced.
There is projection, while the position painting of pre-formed holes is spread on the folded structure of composite on the mould of shell of the invention Colloid, so, the colloid can make the raised position for being fixed on the pre-formed holes really, beneficial to the formation in hole, in shell mechanism After shaping, the colloid is removed so that the shell with hole is integrally formed, and reduces job step, shorten the production cycle, also can Enough ensure the uniformity of product, yields is further improved, product qualification rate reaching 99.9%.
Each electronic product of the invention can save 10~30min of process time, cost-effective 2~3 yuan, shorten life In the product cycle, production cost is significantly reduced, and improve operating efficiency.
Further advantage of the invention, target and feature embody part by following explanation, and part will also be by this The research and practice of invention and be understood by the person skilled in the art.
Specific embodiment
The present invention is described in further detail below, with make those skilled in the art with reference to specification word being capable of evidence To implement.
It should be appreciated that it is used herein such as " have ", "comprising" and " including " term do not allot one or many The presence or addition of individual other elements or its combination.
The present invention provides a kind of forming method of electronic product casing, including：
Step one, take carbon cloth and use thermosetting resin to soak 3~7 hours, the carbon cloth and the thermosetting The mass volume ratio of resin is 1:5~6, take glass-fiber-fabric use thermoplastic resin soak 3~9 hours, the glass-fiber-fabric with it is described The mass volume ratio of thermoplastic resin is 1:4~6；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2~4 layers of carbon cloth and 1 layer of glass Cloth, is staggeredly stacked to certain height is reached, to obtain the folded structure of composite successively；
Step 3, above-mentioned composite is folded and is set up in the die cavity of a mould, the mould includes die face and formation Projection in the die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the pre-formed holes Position is correspondingly arranged with the projection, and the folded fusion of the composite is made to mould pressurizing heating, quick afterwards to reduce mould temperature And molding, obtain shell mechanism, and by the colloid removal on the shell mechanism, wherein, be 2~4 to the mould pressurizing × 105Pa, the temperature of heating is 190~250 DEG C.
The present invention causes its toughness and intensity to the pre-treatment method of carbon cloth and glass-fiber-fabric more preferably, bearing temperature, Pressure and deformability are significantly improved.
The present invention is staggeredly stacked using carbon cloth and glass-fiber-fabric so that the intensity of the shell being made is big and good toughness, no Frangibility.
The intensity of the shell prepared using the method for the present invention improves 5~10%, and toughness improves 2~8%, uses effect Fruit is good.
The carbon cloth and the treated glass-fiber-fabric of thermoplastic resin that the present invention is treated using thermosetting resin are answered Prepared by condensation material, it is integrated, and then fast cooling obtains solidification outer cover body, is integrally formed outside the electronic product Shell, it is ensured that the uniformity of product, yield is further enhanced.
There is projection, while the position painting of pre-formed holes is spread on the folded structure of composite on the mould of shell of the invention Colloid, so, the colloid can make the raised position for being fixed on the pre-formed holes really, beneficial to the formation in hole, in shell mechanism After shaping, the colloid is removed so that the shell with hole is integrally formed, and reduces job step, shorten the production cycle, also can Enough ensure the uniformity of product, yields is further improved, product qualification rate reaching 99.9%.
Each electronic product of the invention can save 10~30min of process time, cost-effective 2~3 yuan, shorten life In the product cycle, production cost is significantly reduced, and improve operating efficiency
In one of embodiment of the invention, preferably, in the step one, carbon cloth uses thermosetting tree Fat soaks 5 hours, and the carbon cloth is 1 with the mass volume ratio of the thermosetting resin:5.5.
In one of embodiment of the invention, preferably, in the step one, taking glass-fiber-fabric and using thermoplastic resin Fat soaks 6 hours, and the glass-fiber-fabric is 1 with the mass volume ratio of the thermoplastic resin:5.
In one of embodiment of the invention, preferably, in the step 2, the carbon cloth and glass-fiber-fabric Number of plies ratio be 3:1.
In one of embodiment of the invention, preferably, certain height is 1~5cm.
In one of embodiment of the invention, preferably, in the step 3, when being heated to the mould pressurizing Heating rate be 15~20 DEG C/s, rate of pressure rise be 0.4~0.6 × 105Pa/s。
In one of embodiment of the invention, preferably, in the step 3, the quick gentle mould of reduction mould In pressure, the speed for reducing mould temperature is 10~15 DEG C/s, and the speed for reducing molding is 0.2~0.4 × 105Pa/s
Embodiment 1
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 3 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:5, take glass-fiber-fabric and use thermoplastic resin immersion 3 hours, the glass-fiber-fabric and the thermoplastic resin Mass volume ratio be 1:4；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 1cm.
Step 3, above-mentioned composite is folded and is set up in the die cavity of a mould, the mould includes die face and shape Projection in die face described in Cheng Yu, colloid, the pre-formed holes are smeared in the position of pre-formed holes on the folded structure of the composite Position be correspondingly arranged with the projection, the folded fusion of the composite is made to mould pressurizing heating, it is quick afterwards to reduce mould Gentle molding, obtains shell mechanism, and by the colloid removal on the shell mechanism, wherein, be 2 to the mould pressurizing × 105Pa, the temperature of heating is 190 DEG C.
Each electronic product of the invention can save process time 10min, cost-effective 2 yuan, shorten the production cycle, Production cost is significantly reduced, and improves operating efficiency.
Embodiment 2
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 3~7 hours, the carbon cloth and the thermosetting The mass volume ratio of resin is 1:5~6, take glass-fiber-fabric use thermoplastic resin soak 3~9 hours, the glass-fiber-fabric with it is described The mass volume ratio of thermoplastic resin is 1:4~6；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2~4 layers of carbon cloth and 1 layer of glass Cloth, is staggeredly stacked to certain height is reached, to obtain the folded structure of composite successively；Certain height is 1~5cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 4 × 10 to the mould pressurizing5Pa, heating Temperature is 250 DEG C.
Each electronic product of the invention can save process time 20min, cost-effective 2.5 yuan, shorten production week Phase, production cost is significantly reduced, and improve operating efficiency
Embodiment 3
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 5 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:5.5, take glass-fiber-fabric and use thermoplastic resin immersion 6 hours, the glass-fiber-fabric and the thermoplastic resin The mass volume ratio of fat is 1:5；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 3 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 3cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 3 × 10 to the mould pressurizing5Pa, heating Temperature is 220 DEG C.Heating rate when being heated to the mould pressurizing is 15 DEG C/s, and rate of pressure rise is 0.4 × 105Pa/s.Institute State in the quick gentle molding of reduction mould, the speed for reducing mould temperature is 12.5 DEG C/s, the speed that reduction is molded is 0.3 × 105Pa/s。
Embodiment 4
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 4 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:5.1, take glass-fiber-fabric and use thermoplastic resin immersion 4 hours, the glass-fiber-fabric and the thermoplastic resin The mass volume ratio of fat is 1:4.5；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 1cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 2.5 × 10 to the mould pressurizing5Pa, heating Temperature be 200 DEG C.Heating rate when being heated to the mould pressurizing is 20 DEG C/s, and rate of pressure rise is 0.6 × 105Pa/s。 Gently in molding, the speed for reducing mould temperature is 10 DEG C/s to the quick reduction mould, and the speed for reducing molding is 0.2 × 105Pa/s。
As described above, according to the present invention, each electronic product of the invention can save process time 15min, save into This 2.2 yuan, the production cycle is shortened, significantly reduce production cost, and improve operating efficiency.
Embodiment 5
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 6 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:5.3, take glass-fiber-fabric and use thermoplastic resin immersion 5 hours, the glass-fiber-fabric and the thermoplastic resin The mass volume ratio of fat is 1:4.5；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 4 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 12cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 2.2 × 10 to the mould pressurizing5Pa, heating Temperature be 210 DEG C.Heating rate when being heated to the mould pressurizing is 16 DEG C/s, and rate of pressure rise is 0.5 × 105Pa/s。 Gently in molding, the speed for reducing mould temperature is 15 DEG C/s to the quick reduction mould, and the speed for reducing molding is 0.4 × 105Pa/s。
As described above, according to the present invention, each electronic product of the invention can save process time 18min, save into This 2.3 yuan, the production cycle is shortened, significantly reduce production cost, and improve operating efficiency.
Embodiment 6
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 7 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:5.7, take glass-fiber-fabric and use thermoplastic resin immersion 6 hours, the glass-fiber-fabric and the thermoplastic resin The mass volume ratio of fat is 1:4.6；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 4 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 4cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 4 × 10 to the mould pressurizing5Pa, heating Temperature is 220 DEG C.Heating rate when being heated to the mould pressurizing is 170 DEG C/s, and rate of pressure rise is 0.45 × 105Pa/s。 Gently in molding, the speed for reducing mould temperature is 11 DEG C/s to the quick reduction mould, and the speed for reducing molding is 0.23 × 105Pa/ s。
As described above, according to the present invention, each electronic product of the invention can save process time 20min, save into This 2.4 yuan, the production cycle is shortened, significantly reduce production cost, and improve operating efficiency.
Embodiment 7
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 3.7 hours, the carbon cloth and the thermosetting tree The mass volume ratio of fat is 1:5.6, take glass-fiber-fabric and use thermoplastic resin immersion 8 hours, the glass-fiber-fabric and the thermoplasticity The mass volume ratio of resin is 1:4.9；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 1.5cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 2.4 × 10 to the mould pressurizing5Pa, heating Temperature be 230 DEG C.Heating rate when being heated to the mould pressurizing is 18 DEG C/s, and rate of pressure rise is 0.55 × 105Pa/s。 Gently in molding, the speed for reducing mould temperature is 12 DEG C/s to the quick reduction mould, and the speed for reducing molding is 0.24 × 105Pa/ s。
As described above, according to the present invention, each electronic product of the invention can save process time 25min, save into This 2.6 yuan, the production cycle is shortened, significantly reduce production cost, and improve operating efficiency.
Embodiment 8
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 5.5 hours, the carbon cloth and the thermosetting tree The mass volume ratio of fat is 1:5.4, take glass-fiber-fabric and use thermoplastic resin immersion 8.5 hours, the glass-fiber-fabric and the thermoplastic Property resin mass volume ratio be 1:5.6；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 3 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 3.5cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 3.6 × 10 to the mould pressurizing5Pa, heating Temperature be 240 DEG C.Heating rate when being heated to the mould pressurizing is 19 DEG C/s, and rate of pressure rise is 0.56 × 105Pa/s。 Gently in molding, the speed for reducing mould temperature is 14 DEG C/s to the quick reduction mould, and the speed for reducing molding is 0.35 × 105Pa/ s。
As described above, according to the present invention, each electronic product of the invention can save process time 25min, save into This 2.8 yuan, the production cycle is shortened, significantly reduce production cost, and improve operating efficiency.
Embodiment 9
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 3 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:5, take glass-fiber-fabric and use thermoplastic resin immersion 3 hours, the glass-fiber-fabric and the thermoplastic resin Mass volume ratio be 1:4；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 1cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 4 × 10 to the mould pressurizing5Pa, heating Temperature is 250 DEG C.Heating rate when being heated to the mould pressurizing is 15.5 DEG C/s, and rate of pressure rise is 0.56 × 105Pa/s。 Gently in molding, the speed for reducing mould temperature is 15 DEG C/s to the quick reduction mould, and the speed for reducing molding is 0.4 × 105Pa/s。
As described above, according to the present invention, each electronic product of the invention can save process time 30min, save into This 3 yuan, the production cycle is shortened, significantly reduce production cost, and improve operating efficiency.
Embodiment 10
A kind of forming method of electronic product casing, comprises the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 7 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:6, take glass-fiber-fabric and use thermoplastic resin immersion 9 hours, the glass-fiber-fabric and the thermoplastic resin Mass volume ratio be 1:6；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 4 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；Certain height is 5cm.
Step 3, set up above-mentioned composite is folded in a mould, the mould includes die face and is formed at described Projection in die face, colloid is smeared in the position of pre-formed holes on the folded structure of the composite, the position of the pre-formed holes with The projection is correspondingly arranged, and the folded fusion of the composite is made to mould pressurizing heating, and the quick mould that reduces gently is molded afterwards, Shell mechanism is obtained, and by the colloid removal on the shell mechanism, wherein, it is 2 × 10 to the mould pressurizing5Pa, heating Temperature is 190 DEG C.Heating rate when being heated to the mould pressurizing is 16 DEG C/s, and rate of pressure rise is 0.52 × 105Pa/s.Institute State in the quick gentle molding of reduction mould, the speed for reducing mould temperature is 10 DEG C/s, the speed that reduction is molded is 0.2 × 105Pa/s。
As described above, according to the present invention, each electronic product of the invention can save process time 10min, save into This 2 yuan, the production cycle is shortened, significantly reduce production cost, and improve operating efficiency.
Comparative example
According to existing traditional method, it is necessary to after electronic product casing shaping, then carry out stepped construction treatment, coating is not Easily attachment, production cost is high, complex process, and the production cycle is long.
Module number described herein and treatment scale are for simplifying explanation of the invention.Electronics of the invention is produced The application of the forming method of product shell, modifications and variations will be readily apparent to persons skilled in the art.
As described above, according to the present invention, each electronic product of the invention can save 10~30min of process time, section 2~3 yuan of cost-saving, shortens the production cycle, significantly reduces production cost, and improve operating efficiency.
Although embodiment of the present invention is disclosed as above, it is not restricted to listed in specification and implementation method With, it can be applied to various suitable the field of the invention completely, for those skilled in the art, can be easily Other modification is realized, therefore under the universal limited without departing substantially from claim and equivalency range, the present invention is not limited In specific details.

Claims (7)

1. a kind of forming method of electronic product casing, it is characterised in that comprise the following steps：
Step one, take carbon cloth and use thermosetting resin to soak 3~7 hours, the carbon cloth and the thermosetting resin Mass volume ratio be 1:5~6, take glass-fiber-fabric and use thermoplastic resin immersion 3~9 hours, the glass-fiber-fabric and the thermoplastic Property resin mass volume ratio be 1:4~6；
Step 2, carbon cloth and glass-fiber-fabric for being treated in step one, take 2~4 layers of carbon cloth and 1 layer of glass-fiber-fabric, It is staggeredly stacked successively to certain height is reached, to obtain the folded structure of composite；
Step 3, above-mentioned composite is folded and is set up in the die cavity of a mould, the mould includes die face and is formed at institute The projection in die face is stated, colloid, the position of the pre-formed holes are smeared in the position of pre-formed holes on the folded structure of the composite It is correspondingly arranged with the projection, the folded fusion of the composite is made to mould pressurizing heating, it is quick afterwards to reduce the gentle mould of mould Pressure, obtains shell mechanism, and by the colloid removal on the shell mechanism, wherein, it is 2~4 × 10 to the mould pressurizing5Pa, The temperature of heating is 190~250 DEG C.
2. the forming method of electronic product casing as claimed in claim 1, it is characterised in that in the step one, carbon fiber Cloth is soaked 5 hours using thermosetting resin, and the carbon cloth is 1 with the mass volume ratio of the thermosetting resin:5.5.
3. the forming method of electronic product casing as claimed in claim 1, it is characterised in that in the step one, take glass Cloth is soaked 6 hours using thermoplastic resin, and the glass-fiber-fabric is 1 with the mass volume ratio of the thermoplastic resin:5.
4. the forming method of electronic product casing as claimed in claim 1, it is characterised in that in the step 2, the carbon The number of plies ratio of fiber cloth and glass-fiber-fabric is 3:1.
5. the forming method of electronic product casing as claimed in claim 1, it is characterised in that certain height is 1~ 5cm。
6. the forming method of electronic product casing as claimed in claim 1, it is characterised in that in the step 3, to described Heating rate when mould pressurizing is heated is 15~20 DEG C/s, and rate of pressure rise is 0.4~0.6 × 105Pa/s。
7. the forming method of electronic product casing as claimed in claim 1, it is characterised in that in the step 3, it is described fast The low mould of prompt drop gently molding in, reduce mould temperature speed be 10~15 DEG C/s, reduce molding speed be 0.2~0.4 × 105Pa/s。
CN201611237763.3A 2016-12-28 2016-12-28 The forming method of electronic product casing Pending CN106827580A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010041239A1 (en) * 2000-01-20 2001-11-15 Fredrik Palmqvist Electronic equipment provided with a shell element
CN102615888A (en) * 2012-04-09 2012-08-01 昆山帆宏表面处理有限公司 Electronic product shell material laminating structure and manufacture method thereof
CN205521663U (en) * 2015-12-29 2016-08-31 深圳市志凌伟业技术股份有限公司 Outer casing of electronic product

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010041239A1 (en) * 2000-01-20 2001-11-15 Fredrik Palmqvist Electronic equipment provided with a shell element
CN102615888A (en) * 2012-04-09 2012-08-01 昆山帆宏表面处理有限公司 Electronic product shell material laminating structure and manufacture method thereof
CN205521663U (en) * 2015-12-29 2016-08-31 深圳市志凌伟业技术股份有限公司 Outer casing of electronic product

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