CN106811599A - A kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed - Google Patents
A kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed Download PDFInfo
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- CN106811599A CN106811599A CN201510857296.3A CN201510857296A CN106811599A CN 106811599 A CN106811599 A CN 106811599A CN 201510857296 A CN201510857296 A CN 201510857296A CN 106811599 A CN106811599 A CN 106811599A
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- copper
- leachate
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- interfacial tension
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0084—Treating solutions
- C22B15/0089—Treating solutions by chemical methods
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/44—Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
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Abstract
The invention discloses a kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed.The technique is comprised the following steps：(1) interfacial tension of wet method metallurgy of copper leachate is determined；(2) clay is added to precipitate in the wet method metallurgy of copper leachate to interfacial tension less than or equal to 12.66mN/m, stand, take supernatant and adjust pH value to 1.3-1.5, the interfacial tension to leachate is monitored, so repeatedly, until the interfacial tension of leachate is more than 12.66mN/m；(3) wet method metallurgy of copper leachate of the interfacial tension more than 12.66mN/m directly carries out follow-up back extraction and electrolytic deposition process.Technological process of the invention is short, equipment simple, it is high to invest small, low cost, the pollution-free, rate of recovery, the interphase impurity that can be formed Lean Copper Ores wet copper metallurgical process is effectively controlled, so as to expand utilization of resources scope, the rate of recovery of copper metal is improved；Difficult Lean Copper Ores can be comprehensively utilized, good economic benefit is obtained.
Description
Technical field
The present invention relates to a kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed, belong to wet method smelting
Technology for gold field.
Background technology
Modern wet method metallurgy of copper includes the part of leaching-extracting back extraction-electrodeposition three, due to the continuous hair of abstraction technique
Exhibition, raising, modern copper hydrometallurgy present more and more prosperous situation, often produce the millions of tons of copper per year, its
Development speed is far above global copper industrial expansion speed, it has also become an independent industrial system.Particularly
Operation wet type copper smelting factory in succession of many great Kuang factories, had more pushed the speed of wet type copper smelting to a new peak in recent years
Tide.
But in actual applications also along with some problems, such as formation of interphase impurity, this is to extracting system
Operation brings many troubles, such as reduces extraction efficiency and split-phase speed, loses organic phase, pollutes electrolyte,
Product quality, aggravating laboring environment etc. are reduced, once its formation speed is out of control, plant downtime is most caused at last
Rectify, it is impossible to normal operation.
Can effectively control wet method metallurgy of copper leachate extraction process median surface dirty therefore, it is necessary to provide one kind
The method that thing is formed.
The content of the invention
It is an object of the invention to provide a kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed,
Can be used to wet method metallurgy of copper leachate reclaim copper.
To achieve the above object, the present invention uses following technical scheme：
A kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed, comprises the following steps：
(1) interfacial tension of wet method metallurgy of copper leachate is determined；
(2) clay is added in the wet method metallurgy of copper leachate to interfacial tension less than or equal to 12.66mN/m
Precipitation, stands, and takes supernatant and adjusts pH value to 1.3-1.5, and the interfacial tension to leachate is monitored, such as
This repeatedly, until leachate interfacial tension be more than 12.66mN/m；
(3) wet method metallurgy of copper leachate of the interfacial tension more than 12.66mN/m directly carries out follow-up back extraction
And electrolytic deposition process.
In the present invention, described wet method metallurgy of copper leachate is to contain Cu2+、TFe、Mg2+、Al3+With
Cl-The Treating Low-grade Copper Ores wet method metallurgy of copper leachate of ion.
The interfacial tension of wet method metallurgy of copper leachate is closely related with the formation of interphase impurity, when interfacial tension compared with
When big, wet method metallurgy of copper leachate is not in interphase impurity in extraction process, and interfacial tension is bigger, more
Do not allow to be also easy to produce interphase impurity, therefore, the interfacial tension for increasing wet method metallurgy of copper leachate can reduce interface
The generation of dirt.Inventor's research finds, when the interfacial tension of wet method metallurgy of copper leachate is less than or equal to 12.66
During mN/m, interphase impurity will be formed in extraction process, so, as long as control wet method metallurgy of copper leachate
Interfacial tension be more than this value.In the present invention, the interfacial tension of wet method metallurgy of copper leachate is controlled to be more than
The foundation of 12.66mN/m ways is mainly by multigroup (n >=72 group) wet method metallurgy of copper leachate interface
What the measure of power was determined.When the interfacial tension of wet method metallurgy of copper leachate is less than or equal to 12.66mN/m,
Need to process wet method metallurgy of copper leachate.Interface by controlling wet method metallurgy of copper leachate of the invention
Tension force controls the formation of extraction process median surface dirt.
The advantage of the invention is that：
Technological process of the invention is short, equipment simple, it is high to invest small, low cost, the pollution-free, rate of recovery,
The interphase impurity that can be formed Lean Copper Ores wet copper metallurgical process is effectively controlled, so as to expand
Large resource utilization scope, improves the rate of recovery of copper metal；Difficult Lean Copper Ores can be comprehensively utilized,
Obtain good economic benefit.
Brief description of the drawings
Fig. 1 is process chart of the invention.
Fig. 2 is the structural representation that the present invention determines the drop volume measure pipe that interfacial tension is used.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and examples, but embodiments of the present invention are not limited
In this.
As shown in figure 1, being process chart of the invention.According to the present invention, determine wet method metallurgy of copper and leach
The interfacial tension of liquid；Wet method metallurgy of copper leachate of the interfacial tension more than 12.66mN/m is thought qualified and is directly entered
The follow-up back extraction of row and electrolytic deposition process.Wet method metallurgy of copper of the interfacial tension less than or equal to 12.66mN/m is leached
Liquid is considered as unqualified, it is necessary to be added thereto to clay precipitation, stands, and takes supernatant regulation pH value and arrives
1.3-1.5, determines interfacial tension, so repeatedly, until the interfacial tension of leachate is more than 12.66mN/m again
Carry out follow-up back extraction and electrolytic deposition process.
As shown in Fig. 2 the drop volume measure pipe that interfacial tension is used is determined in the present invention, including supervisor 1,
Sleeve pipe 2；One end of supervisor 1 is connected by emulsion tube with rubber pipette bulb 3, and there is the other end spherical capillary to drip
First 4.When determining the interfacial tension of leachate, drop volume is determined into pipe and is cleaned, drying is cooled to room temperature, then
Emulsion tube is enclosed within supervisor 1, in supervisor's plug-in-sleeve 2, drop volume is determined with iron stand clip is managed
Vertical to fix and be put into water bath with thermostatic control, the mixing speed of thermostat stirring motor should be adjusted properly, will not be produced
Raw strenuous vibration, influences the result for determining.Concrete operation method：Drop volume is washed with solution to be measured and determines pipe
2-3 times, test solution is then filled, the less liquid phase of density is instilled from capillary water dropper with the larger liquid phase of density,
The capillary water dropper (determine drop volume with reading microscope in advance and determine pipe capillary water dropper diameter) of supervisor hangs down
3mm or so under straight immersion sleeve pipe liquid level, constant temperature 10-30min accurately writes down the initial scale a of liquid level of test solution,
Then allow drop to drip, when being down to b to liquid level, write down whole drops number (integral drip number) of drippage, so,
Just the volume of drop can be calculated.Interfacial tension formula is substituted into after having measured and can obtain interfacial tension.
Interfacial tension formula is：γ=(ρ1-ρ2)Vg/2πrΦ
In formula, γ is the interfacial tension between the larger liquid phase of density and the less liquid phase of density, mN/m；ρ is
Fluid density, kg/m3；V is volume, m3；G is acceleration of gravity, 9.80665m/s2；π is constant,
3.1416；R is capillary dropping tip radius, cm；Φ is r/V1/3Function, its interfacial tension with liquid,
Dropper material, fluid density and viscosity etc. are unrelated.
Embodiment 1
Selection Xinjiang Treating Low-grade Copper Ores, it is main based on atacamite and malachite that Gold in Ores belongs to mineral, its
Secondary is bornite, covellite and chalcopyrite.Gold in Ores belongs to average grade Cu 0.38%, S 0.56%, Fe 5.01%.
The wet method metallurgy of copper leachate for taking this ore is standby.
Leachate is containing Cu2+, TFe (full iron, including ferrous iron and ferric iron), Mg2+、Al3+And Cl-
The solution of ion, Cu2+Ion concentration is 1-7g/L；TFe concentration is 20-40g/L；Mg2+Concentration is 6-12g/L；
Al3+Ion concentration is 0-40g/L；Cl-Ion concentration is 2-6g/L.
Drop volume is installed and determines pipe device, notice that drop volume determines pipe and must thoroughly clean before the experiments, put
Dry in an oven, then cover an emulsion tube in supervisor upper end.Regulating thermostatic water bath is to 25 DEG C.Drop body
Product determines pipe and is vertically put into thermostat, makes pipe 4/5 submerged in water, at this moment can be to wet method according to preceding method
The interfacial tension of metallurgy of copper leachate is measured.Determination data is as shown in table 1.
Table 1
When the interfacial tension of wet method metallurgy of copper leachate is less than or equal to 12.66mN/m, it can be seen that in extraction
There is crud formation during taking, now need, to adding clay precipitation in leachate, standing, to take supernatant
Liquid adjusts pH value to 1.3-1.5, repeats 1-2 times；Then return again to after extraction system extracted, it is complete
It is complete qualified.
When the interfacial tension of wet method metallurgy of copper leachate is more than 12.66mN/m, more than 96% wet copper smelting
Gold leaching liquid does not form interphase impurity more than this interfacial tension, and 4% can also form a little interphase impurity, leads to
Cross to adding clay to precipitate in this leachate, stand, take supernatant and adjust pH value to 1.3-1.5, so weight
It is multiple 1-2 times；Then return again to after extraction system extracted, it is completely qualified.
Therefore, PROCESS FOR TREATMENT effect of the invention is more satisfactory, repeatedly repeatedly after wet method metallurgy of copper leachate
Interfacial tension 100% is qualified, and interphase impurity will not be formed in extraction process, can directly carry out follow-up
The techniques such as extraction, back extraction and electrodeposition.
Claims (2)
1. a kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed, it is characterised in that including with
Lower step：
(1) interfacial tension of wet method metallurgy of copper leachate is determined；
(2) clay is added in the wet method metallurgy of copper leachate to interfacial tension less than or equal to 12.66mN/m
Precipitation, stands, and takes supernatant and adjusts pH value to 1.3-1.5, and the interfacial tension to leachate is monitored, such as
This repeatedly, until leachate interfacial tension be more than 12.66mN/m；
(3) wet method metallurgy of copper leachate of the interfacial tension more than 12.66mN/m directly carries out follow-up back extraction
And electrolytic deposition process.
2. the technique that control wet method metallurgy of copper leachate interphase impurity according to claim 1 is formed, its
It is characterised by, described wet method metallurgy of copper leachate is to contain Cu2+、TFe、Mg2+、Al3+And Cl-Ion
Treating Low-grade Copper Ores wet method metallurgy of copper leachate.
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| CN201510857296.3A CN106811599A (en) | 2015-11-30 | 2015-11-30 | A kind of technique for controlling wet method metallurgy of copper leachate interphase impurity to be formed |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020020252A1 (en) * | 2000-08-10 | 2002-02-21 | Dorlac Jerome P. | Interfacial crud removal system for solvent extraction |
| CN101457294A (en) * | 2007-12-10 | 2009-06-17 | 北京有色金属研究总院 | Method for eliminating interface emulsification during copper biochemical lixivium extraction process |
| CN101665870A (en) * | 2008-09-02 | 2010-03-10 | 中国科学院过程工程研究所 | Method for preventing interfacial crud during vanadium-chromium extraction and separation |
| CN103305693A (en) * | 2013-06-26 | 2013-09-18 | 中国科学院过程工程研究所 | Method of preventing interphase impurity in vanadium-chromium extraction separation process |
-
2015
- 2015-11-30 CN CN201510857296.3A patent/CN106811599A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020020252A1 (en) * | 2000-08-10 | 2002-02-21 | Dorlac Jerome P. | Interfacial crud removal system for solvent extraction |
| CN101457294A (en) * | 2007-12-10 | 2009-06-17 | 北京有色金属研究总院 | Method for eliminating interface emulsification during copper biochemical lixivium extraction process |
| CN101665870A (en) * | 2008-09-02 | 2010-03-10 | 中国科学院过程工程研究所 | Method for preventing interfacial crud during vanadium-chromium extraction and separation |
| CN103305693A (en) * | 2013-06-26 | 2013-09-18 | 中国科学院过程工程研究所 | Method of preventing interphase impurity in vanadium-chromium extraction separation process |
Non-Patent Citations (4)
| Title |
|---|
| 周桂英等: ""铜溶剂萃取过程界面乳化的原因分析"", 《稀有金属》 * |
| 朱㻉瑶: ""液体表（界）面张力的测定-滴体积法介绍"", 《化学通报》 * |
| 杨承志等: "《化学驱油理论与实践》", 31 May 1996, 北京：石油工业出版社 * |
| 江玉明等: ""液-液萃取中界面乳化现象的研究"", 《化学工报》 * |
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Application publication date: 20170609 |