CN106810875A - A kind of thermal conductivity composite of graphene-containing and its preparation method and application - Google Patents
A kind of thermal conductivity composite of graphene-containing and its preparation method and application Download PDFInfo
- Publication number
- CN106810875A CN106810875A CN201510873045.4A CN201510873045A CN106810875A CN 106810875 A CN106810875 A CN 106810875A CN 201510873045 A CN201510873045 A CN 201510873045A CN 106810875 A CN106810875 A CN 106810875A
- Authority
- CN
- China
- Prior art keywords
- thermal conductivity
- graphene
- composite
- filler
- particle diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Thermal conductivity composite the invention discloses a kind of graphene-containing and its preparation method and application, belongs to new material and its applied technical field.The organic elastomeric polymer materials such as the thermal conductivity filler that silver powder etc. and Graphene are mixed and vinyl silicone oil uniformly mix, acted synergistically by the Graphene of the large particle size fillers such as silver powder and high heat-conductivity conducting, more more unimpeded thermal conductivity networks are built in organic polymer matrix, so as to obtain the organic polymer composite with excellent heat conducting electric conductivity, favorable elasticity and flexibility.The composite material preparation process is simple, and thermal conductivity, with good elasticity and compressibility energy, can well fill hot interfacial gap up to 500S/m, capability of electromagnetic shielding up to 12W/mK, conductance up to 45dB.This composite can be used as a kind of high performance heat-conducting interface material or thermal conductivity macromolecular material or electromagnetic shielding material.
Description
Technical field
The present invention relates to new material and its applied technical field, and in particular to a kind of thermal conductivity of graphene-containing is answered
Condensation material and its preparation method and application.
Background technology
With the development of science and technology, polymer composite is increasingly widely applied in every field, such as
Heat-conducting interface material, conductive rubber material and electromagnetic shielding material etc..Because compared with metal material, it is high
The advantage such as molecular composite material itself lightweight, flexibility, compressible, corrosion-resistant.In general, macromolecule is combined
Material is the filler system of performance (such as heat conduction, conduction, electromagnetic shielding) needed for by being added in polymer base material
Standby.Thermal conductivity macromolecule theory thinks (Fig. 1), to reach heat conduction higher, electric conductivity, fills out
The addition volume fraction of material will reach more than 60%, thus contacted with each other between ensureing filler constitute connection heat conduction,
Conductive network.The addition of a large amount of heat fillings not only increases cost and weight, and under making the elasticity of material
Drop, hardness increase, but heat conductivility is hardly resulted in and is obviously improved.
Graphene is since being found because it has many excellent properties (such as excellent electric conductivity, mechanics
Performance etc.) and receive significant attention, the thermal conductivity (~5000W/mK) of its superelevation causes Graphene in heat pipe
Reason field has huge application prospect.But at present can the Graphene raw material of scale of mass production be all powder state,
The piece footpath of Graphene is general, and piece footpath is excessively tiny below 20 μm, is used alone as thermal conductivity filler
It is difficult to a large amount of additions.Therefore Graphene is used alone as filler and is unfavorable for the structure of thermal conductivity network,
Production cost in view of current high-quality graphene powder is still higher, and high-performance is prepared individually with Graphene
Thermal conductivity composite is unsatisfactory.
The content of the invention
In order to solve the above problems, the thermal conductivity organic polymer the invention provides a kind of graphene-containing is combined
Material and its preparation method and application.In prepared composite filler have be uniformly distributed with it is closelypacked
Arrangement feature.Acted synergistically by the big particle diameter thermal conductivity filler such as aluminium powder and the Graphene of high heat-conductivity conducting,
More more unimpeded thermal conductivity networks are built in organic polymer matrix, the thermal conductivity of material is relatively added
The situation of single filler is obviously improved.
To achieve the above object, the technical solution adopted in the present invention is as follows：
A kind of thermal conductivity composite of graphene-containing, the thermal conductivity composite is by thermal conductivity filler
Formation in high-molecular organic material matrix is uniformly distributed in, wherein：The thermal conductivity filler is for Graphene and greatly
Particle diameter thermal conductivity material, the high-molecular organic material matrix is organic elastomeric polymer material, described filler
50-90% is accounted in the composite.
The Graphene and big particle diameter thermal conductivity material are tightly packed in high-molecular organic material matrix, build
The thermal conductivity network of multiple closely overlap joints, so as to form the thermal conductivity composite.The thermal conductivity
In filler, Graphene is 1 with the part by weight of big particle diameter thermal conductivity material：(10~50).
The big particle diameter thermal conductivity material is three-dimensional spherical structure, specially aluminium powder, copper powder, silver powder, squama
One or more in piece graphite and spherical graphite.
The high-molecular organic material be vinyl silicone oil, methyl vinyl silicone rubber, dimethyl silicone polymer,
Polyurethane etc. has favorable elasticity and flexible organic elastomeric polymer material.
In the thermal conductivity filler, the piece footpath scope of the Graphene with two-dimensional slice structure is 0.1~20 μm；
The particle size range of the big particle diameter thermal conductivity material with three-dimensional spherical structure is 20~180 μm.
The thermal conductivity of composite of the present invention can reach 12W/mK, and conductance can reach 500S/m, electromagnetism
Shielding properties can reach 45dB, and with good flexibility and compressibility.
The thermal conductivity composite of above-mentioned graphene-containing is prepared in accordance with the following steps：
(1) thermal conductivity filler, high-molecular organic material and curing agent are sufficiently mixed, make filler organic high
It is dispersed in molecular material, obtain mixed material；Charging sequence in the step is：First curing agent is added
In high-molecular organic material, thermal conductivity filler is added after being well mixed；In the step, using high-speed stirred
One or more in machine, emulsification pretreatment machine, kneader or two-roll mill are by described filler, organic polymer
Material and curing agent are sufficiently mixed, it is ensured that filler is dispersed in the base.The curing agent be containing hydrogen silicone oil,
2,4- dichlorobenzoperoxides or 2,5- dimethyl -2,5- two (t-butylperoxy) hexane etc..
(2) step (1) gained mixed material is further mixed by way of extruding using two-roll mill,
Material after extruding is molded by heat-pressure curing, that is, obtains the thermal conductivity composite wood of the graphene-containing
Material.
The thermal conductivity composite of prepared graphene-containing can be used as heat-conducting interface material, thermal conductivity high score
Sub- material or electromagnetic shielding material are used.
The invention has the advantages that：
1st, the present invention utilizes the big particle diameter thermal conductivity filler and two-dimensional slice structure with three-dimensional structure such as silver powder
Graphene proportion optimizing is used cooperatively, and in filler is largely made an addition to matrix, and filler in matrix has
Be uniformly distributed with closelypacked arrangement feature, by the big particle diameter thermal conductivity filler such as aluminium powder and high heat-conductivity conducting
Graphene synergy, more more unimpeded thermal conductivity networks are built in organic polymer matrix.Material
Thermal conductivity be obviously improved compared with the situation for adding single filler.
2nd, the present invention prepares the polymer composite with excellent heat conducting electric conductivity, the letter of preparation technology flow
Single, required raw material is cheap and easy to get, amplifies easily by technique and realizes industrial volume production, and cost is led compared with related application
The traditional product in domain has significant advantage.
3rd, the present invention prepared by composite thermal conductivity up to 12W/mK, conductance up to 500S/m,
Capability of electromagnetic shielding up to 45dB, and with good elastic and flexibility.It is provided simultaneously with heat conduction, conductive and electromagnetism
Shielding properties.Can be used as a kind of high performance heat-conducting interface material or thermal conductivity macromolecular material or electromagnetic shielding
Materials'use.
Brief description of the drawings
Fig. 1 is polymer composite heat conduction, conductivity principle figure.
Fig. 2 is the thermal conductivity composite preparation process schematic diagram of graphene-containing.
Fig. 3 is the thermal conductivity composite structure schematic diagram of graphene-containing.
Fig. 4 is the optical photograph of the thermal conductivity composite of graphene-containing.
Fig. 5 is the stereoscan photograph of the thermal conductivity composite of graphene-containing.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment describe in detail the present invention.
Fig. 2 is the preparation process schematic diagram of the thermal conductivity composite of graphene-containing of the present invention, by institute in figure
The simple technical process shown can be prepared by the composite in the present invention.
The fillers such as the silver powder of high heat-conductivity conducting characteristic and graphite are had concurrently while the present invention is by different-grain diameter/piece footpath
Alkene optimized proportion is used cooperatively.Give full play to the large particle size fillers such as silver powder and graphene nano filler cooperates with work
With, and filler three-dimensional spherical structure is complementary so as to realize that filler is tightly packed with two-dimensional slice structure in shape.
Large particle size filler sets up main heat conduction, conductive path, and graphene nano filler realizes more preferably microcosmic connections,
Interface resistance, resistance are reduced, so as to prepare the high-performance thermal conductivity composite of graphene-containing.
The thermal conductivity of material is hot using the materials of TIM Tester 1400 of ANALYSIS TECH companies of the U.S.
Resistance heat conduction coefficient tester is tested.The electrical conductivity of material utilizes the RTS-9 types of the probe scientific ＆ technical corporation of Guangzhou four
Double electrical measurement four-point probes are tested.Simultaneously using WILTRON 54169A Network Analyzers to thick 1.5
The sample of mm is tested in the capability of electromagnetic shielding of 8-12GHz frequency ranges.
Embodiment 1：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
60 μm and 20 μm of two kinds of particle diameters press 3：The ball aluminum powder 250g of 1 weight proportion mixing, graphene powder 10
G, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken
Go out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described containing stone
The high-performance thermal conductivity composite of black alkene.
By SEM (SEM) to the cross-section morphology of the composite of obtained graphene-containing
Observed, it is possible to find more obvious uniform filling distribution and closelypacked arrangement feature.Large particle size filler
Main heat conduction, conductive path are set up, graphene nano filler realizes more preferably microcosmic connections, reduces interface
Thermal resistance, resistance, as shown in Figure 3.
As shown in the optical photograph in Fig. 4, the material has the macro morphology of the composite of obtained graphene-containing
There is flexible well and elasticity.
The microscopic appearance of the composite of obtained graphene-containing is as shown in the stereoscan photograph in Fig. 5.From photograph
As can be seen that ball aluminum powder and graphene uniform are distributed in silica gel matrix in piece.Ball aluminum powder and Graphene
Microplate is tightly packed, and the two-dimensional nano lamellar structure collaboration of the big particle diameter three-dimensional spherical structure and Graphene of aluminium powder is made
With forming more more unimpeded high-efficiency heat conduction conductive networks in organic polymer matrix.
Using instrument described in explanation and method, sample thermal conductivity is measured for 4.6W/mK, conductance is 100
S/m, capability of electromagnetic shielding is up to 25dB.Pattern, method of testing phase due to other embodiment with this example sample
Closely, repeated no more behind.
Embodiment 2：
First 100g methyl vinyl silicone rubbers are mixed with 1g 2,4- dichlorobenzoperoxides in kneader
Close, then sequentially add 60 μm and 20 μm of two kinds of particle diameters by 3：The ball aluminum powder 250 of 1 weight proportion mixing
G, graphene powder 10g, mix 2h.Mixture is taken out, it is thin to mixture logical using two-roll mill etc.
10 times.Mixture is taken out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 160 DEG C,
Can obtain the high-performance thermal conductivity composite of described graphene-containing.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 4.5W/mK, conductance is 105
S/m, capability of electromagnetic shielding is up to 25dB.
Embodiment 3：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
60 μm and 20 μm of two kinds of particle diameters press 2：The ball aluminum powder 400g of 1 weight proportion mixing, graphene powder 10
G, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken
Go out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described containing stone
The high-performance thermal conductivity composite of black alkene.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 5.4W/mK, conductance is up to 150
S/m, capability of electromagnetic shielding is up to 29dB.
Embodiment 4：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
60 μm and 20 μm of two kinds of particle diameters press 3：The ball aluminum powder 400g of 1 weight proportion mixing, graphene powder 20
G, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken
Go out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described containing stone
The high-performance thermal conductivity composite of black alkene.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 7.1W/mK, conductance is up to 180
S/m, capability of electromagnetic shielding is up to 33dB.
Embodiment 5：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
60 μm and 20 μm of two kinds of particle diameters press 4：The ball aluminum powder 500g of 1 weight proportion mixing, graphene powder 20
G, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken
Go out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described containing stone
The high-performance thermal conductivity composite of black alkene.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 8.2W/mK, conductance is up to 240
S/m, capability of electromagnetic shielding is up to 38dB.
Embodiment 6：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
60 μm and 20 μm of two kinds of particle diameters press 3：The spherical copper powder 700g of 1 weight proportion mixing, graphene powder 20
G, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken
Go out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described containing stone
The high-performance thermal conductivity composite of black alkene.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 8.6W/mK, conductance is up to 320
S/m, capability of electromagnetic shielding is up to 40dB.
Embodiment 7：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
80 μm and 30 μm of two kinds of particle diameters press 2.5：The crystalline flake graphite 300g of 1 weight proportion mixing, graphene powder
20g, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Will mixing
Thing is taken out and carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can described in obtaining
The high-performance thermal conductivity composite of graphene-containing.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 9.3W/mK, conductance is up to 370
S/m, capability of electromagnetic shielding is up to 42dB.
Embodiment 8：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
80 μm and 30 μm of two kinds of particle diameters press 3：The spherical graphite 300g of 1 weight proportion mixing, graphene powder 20
G, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken
Go out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described containing stone
The high-performance thermal conductivity composite of black alkene.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 10.0W/mK, conductance is up to 390
S/m, capability of electromagnetic shielding is up to 43dB.
Embodiment 9：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, is then sequentially added
60 μm and 20 μm of two kinds of particle diameters press 3：The ball shape silver powder 700g of 1 weight proportion mixing, graphene powder 20
G, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken
Go out carries out compressing tablet by required thickness, and institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described containing stone
The high-performance thermal conductivity composite of black alkene.
The macroscopic view and microscopic appearance of the composite of obtained graphene-containing are same as Example 1, and material has very
Good flexible and elasticity, being distributed in silica gel matrix for uniform filling is tightly packed, synergy, forms high
Effect thermal conductivity network.
Using instrument described in explanation and method, sample thermal conductivity is measured for 12.0W/mK, conductance is up to 500
S/m, capability of electromagnetic shielding is up to 45dB.
Comparative example 1：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, Graphene is subsequently adding
Powder 30g, mixes 2h.Mixture is taken out, it is thin to mixture logical 10 times using two-roll mill etc..Will
Mixture takes out and carries out compressing tablet by required thickness, institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain stone
Composite of the black alkene separately as filler.
Using instrument described in explanation and method, sample thermal conductivity is measured for 2.0W/mK, conductance is 40S/m,
Capability of electromagnetic shielding is up to 15dB.
Comparative example 2：
First 100g vinyl silicone oils are mixed with 1g containing hydrogen silicone oils in kneader, 60 μm are subsequently adding
3 are pressed with 20 μm of two kinds of particle diameters：The ball aluminum powder 800g of 1 weight proportion mixing, mixes 2h.By mixture
Take out, it is thin to mixture logical 10 times using two-roll mill etc..Mixture is taken out carries out compressing tablet by required thickness,
Institute's compressing tablet body is solidified into 5min at 140 DEG C, you can obtain described comparative example material.
Using instrument described in explanation and method, sample thermal conductivity is measured for 3.0W/mK, conductance is 70S/m,
Capability of electromagnetic shielding is up to 18dB.
Examples provided above is only the mode for illustrating, and is not considered as limiting the scope of the present invention,
The method that any technology according to the present invention scheme and its inventive concept are subject to equivalent or change, should all cover
Within protection scope of the present invention.
Claims (10)
1. the thermal conductivity composite of a kind of graphene-containing, it is characterised in that：The thermal conductivity composite is
It is distributed in high-molecular organic material matrix by thermal conductivity uniform filling and is formed, wherein：The thermal conductivity is filled out
Expect to be Graphene and big particle diameter thermal conductivity material, the high-molecular organic material matrix is organic elastomeric polymer
Material, described filler accounts for 50-90% in the composite.
2. the thermal conductivity composite of graphene-containing according to claim 1, it is characterised in that：It is described
Graphene and big particle diameter thermal conductivity material are tightly packed in high-molecular organic material matrix, build multistage tight
The thermal conductivity network of overlap joint, so as to form the thermal conductivity composite；In the thermal conductivity filler,
Graphene is 1 with the part by weight of big particle diameter thermal conductivity material：(10~50).
3. the thermal conductivity composite of graphene-containing according to claim 1, it is characterised in that：It is described
Big particle diameter thermal conductivity material is the one kind or several in aluminium powder, copper powder, silver powder, crystalline flake graphite and spherical graphite
Kind.
4. the thermal conductivity composite of graphene-containing according to claim 1, it is characterised in that：It is described
High-molecular organic material is vinyl silicone oil, methyl vinyl silicone rubber, dimethyl silicone polymer, polyurethane etc.
With favorable elasticity and flexible organic elastomeric polymer material.
5. the thermal conductivity composite of graphene-containing according to claim 1, it is characterised in that：It is described
In thermal conductivity filler, the piece footpath scope of Graphene is 0.1~20 μm；The particle diameter model of big particle diameter thermal conductivity material
Enclose is 20~180 μm.
6. the thermal conductivity composite of graphene-containing according to claim 1, it is characterised in that：This is answered
The thermal conductivity of condensation material can reach 12W/mK, and conductance can reach 500S/m, and capability of electromagnetic shielding can reach
To 45dB.
7. the preparation method of the thermal conductivity composite of graphene-containing according to claim 1, its feature
It is：The method comprises the following steps：
(1) thermal conductivity filler, high-molecular organic material and curing agent are sufficiently mixed, make filler organic high
It is dispersed in molecular material, obtain mixed material；
(2) step (1) gained mixed material is further mixed by way of extruding using two-roll mill,
Material after extruding is molded by heat-pressure curing, that is, obtains the thermal conductivity composite wood of the graphene-containing
Material.
8. the preparation method of the thermal conductivity composite of graphene-containing according to claim 7, its feature
It is：Charging sequence in step (1) is：First by curing agent addition high-molecular organic material, it is well mixed
After add thermal conductivity filler；In step (1), using homogenizer, emulsification pretreatment machine, kneader or
Be sufficiently mixed for described filler, high-molecular organic material and curing agent by one or more in two-roll mill, protects
Card filler is dispersed in the base.
9. the preparation method of the thermal conductivity composite of the graphene-containing according to claim 7 or 8, its
It is characterised by：The curing agent is containing hydrogen silicone oil, 2,4- dichlorobenzoperoxides or 2,5- dimethyl -2,5- two
(t-butylperoxy) hexane etc..
10. the application of the thermal conductivity composite of graphene-containing according to claim 1, its feature exists
In：The composite is applied to heat-conducting interface material, thermal conductivity macromolecular material or electromagnetic shielding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510873045.4A CN106810875B (en) | 2015-12-02 | 2015-12-02 | Graphene-containing heat-conducting and electricity-conducting composite material and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510873045.4A CN106810875B (en) | 2015-12-02 | 2015-12-02 | Graphene-containing heat-conducting and electricity-conducting composite material and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106810875A true CN106810875A (en) | 2017-06-09 |
| CN106810875B CN106810875B (en) | 2020-01-24 |
Family
ID=59105750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510873045.4A Active CN106810875B (en) | 2015-12-02 | 2015-12-02 | Graphene-containing heat-conducting and electricity-conducting composite material and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106810875B (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107365456A (en) * | 2017-09-15 | 2017-11-21 | 厦门万新橡胶有限公司 | A kind of novel graphite alkene is modified heat conductive rubber |
| CN107618123A (en) * | 2017-09-30 | 2018-01-23 | 华中科技大学 | A kind of preparation method and product of polyethylene crystalline flake graphite composite |
| CN108003612A (en) * | 2017-12-13 | 2018-05-08 | 江西伟普科技有限公司 | A kind of preparation method of the multifunctional composite with thermal conductivity electromagnetic shielding |
| CN108299830A (en) * | 2018-02-07 | 2018-07-20 | 杭州白熊科技有限公司 | Silicon rubber base Flexible graphene heating film and preparation method thereof, heating device and application |
| CN108753123A (en) * | 2018-05-29 | 2018-11-06 | 西安建筑科技大学 | A kind of composite graphite alkene prepares the preparation method of electrically conductive intumescent paints |
| CN108841182A (en) * | 2018-05-25 | 2018-11-20 | 国网江苏省电力有限公司电力科学研究院 | A kind of graphene conductive thermally conductive silicone rubber composite material and preparation method |
| CN109082123A (en) * | 2018-06-28 | 2018-12-25 | 上海电缆研究所有限公司 | Modified electromagnetic shielding silastic material of graphene and preparation method thereof |
| CN109354729A (en) * | 2018-07-24 | 2019-02-19 | 黄山市尚义橡塑制品有限公司 | Graphene enhances rubber and preparation method thereof |
| CN110328724A (en) * | 2019-07-24 | 2019-10-15 | 北京林业大学 | A kind of energy storage timber is coated using graphene quantum dot carries silver-colored titanium dioxide as heat filling |
| CN110527298A (en) * | 2019-08-28 | 2019-12-03 | 东莞市新懿电子材料技术有限公司 | A kind of High thermal-conductive silicone grease and preparation method thereof |
| CN110903652A (en) * | 2019-12-13 | 2020-03-24 | 深圳市中金岭南科技有限公司 | Flexible stretchable conductive composite material of fishing net structure and preparation method and application thereof |
| CN111434747A (en) * | 2019-01-11 | 2020-07-21 | 北京大学 | Three-dimensional graphene/elastomer thermal interface material and preparation method thereof |
| CN111548765A (en) * | 2020-05-09 | 2020-08-18 | 浙江祥隆科技有限公司 | Organosilicon system conductive adhesive and preparation method thereof |
| CN112118708A (en) * | 2020-09-10 | 2020-12-22 | 安徽工业大学 | Heat-conducting film and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080099368A (en) * | 2007-05-09 | 2008-11-13 | 연세대학교 산학협력단 | Method for manufacturing conductive composites |
| CN104327515A (en) * | 2014-10-20 | 2015-02-04 | 中国科学院金属研究所 | Graphene-containing silicon rubber heat-conducting composite material and preparation method thereof |
| CN104910625A (en) * | 2014-03-12 | 2015-09-16 | 江苏麒祥高新材料有限公司 | Preparation method of heat conduction silicone rubber interface material containing graphene |
| CN105062076A (en) * | 2015-08-13 | 2015-11-18 | 深圳市国创珈伟石墨烯科技有限公司 | Heat-conducting graphene silicone grease and preparation method thereof |
-
2015
- 2015-12-02 CN CN201510873045.4A patent/CN106810875B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080099368A (en) * | 2007-05-09 | 2008-11-13 | 연세대학교 산학협력단 | Method for manufacturing conductive composites |
| CN104910625A (en) * | 2014-03-12 | 2015-09-16 | 江苏麒祥高新材料有限公司 | Preparation method of heat conduction silicone rubber interface material containing graphene |
| CN104327515A (en) * | 2014-10-20 | 2015-02-04 | 中国科学院金属研究所 | Graphene-containing silicon rubber heat-conducting composite material and preparation method thereof |
| CN105062076A (en) * | 2015-08-13 | 2015-11-18 | 深圳市国创珈伟石墨烯科技有限公司 | Heat-conducting graphene silicone grease and preparation method thereof |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107365456A (en) * | 2017-09-15 | 2017-11-21 | 厦门万新橡胶有限公司 | A kind of novel graphite alkene is modified heat conductive rubber |
| CN107618123A (en) * | 2017-09-30 | 2018-01-23 | 华中科技大学 | A kind of preparation method and product of polyethylene crystalline flake graphite composite |
| CN108003612A (en) * | 2017-12-13 | 2018-05-08 | 江西伟普科技有限公司 | A kind of preparation method of the multifunctional composite with thermal conductivity electromagnetic shielding |
| CN108299830A (en) * | 2018-02-07 | 2018-07-20 | 杭州白熊科技有限公司 | Silicon rubber base Flexible graphene heating film and preparation method thereof, heating device and application |
| CN108299830B (en) * | 2018-02-07 | 2021-02-23 | 杭州白熊科技有限公司 | Silicone rubber-based flexible graphene heating film, preparation method thereof, heating device and application |
| CN108841182A (en) * | 2018-05-25 | 2018-11-20 | 国网江苏省电力有限公司电力科学研究院 | A kind of graphene conductive thermally conductive silicone rubber composite material and preparation method |
| CN108753123A (en) * | 2018-05-29 | 2018-11-06 | 西安建筑科技大学 | A kind of composite graphite alkene prepares the preparation method of electrically conductive intumescent paints |
| CN109082123A (en) * | 2018-06-28 | 2018-12-25 | 上海电缆研究所有限公司 | Modified electromagnetic shielding silastic material of graphene and preparation method thereof |
| CN109354729A (en) * | 2018-07-24 | 2019-02-19 | 黄山市尚义橡塑制品有限公司 | Graphene enhances rubber and preparation method thereof |
| CN111434747A (en) * | 2019-01-11 | 2020-07-21 | 北京大学 | Three-dimensional graphene/elastomer thermal interface material and preparation method thereof |
| CN111434747B (en) * | 2019-01-11 | 2021-02-02 | 北京大学 | Three-dimensional graphene/elastomer thermal interface material and preparation method thereof |
| CN110328724A (en) * | 2019-07-24 | 2019-10-15 | 北京林业大学 | A kind of energy storage timber is coated using graphene quantum dot carries silver-colored titanium dioxide as heat filling |
| CN110527298A (en) * | 2019-08-28 | 2019-12-03 | 东莞市新懿电子材料技术有限公司 | A kind of High thermal-conductive silicone grease and preparation method thereof |
| CN110903652A (en) * | 2019-12-13 | 2020-03-24 | 深圳市中金岭南科技有限公司 | Flexible stretchable conductive composite material of fishing net structure and preparation method and application thereof |
| CN111548765A (en) * | 2020-05-09 | 2020-08-18 | 浙江祥隆科技有限公司 | Organosilicon system conductive adhesive and preparation method thereof |
| CN112118708A (en) * | 2020-09-10 | 2020-12-22 | 安徽工业大学 | Heat-conducting film and preparation method thereof |
| CN112118708B (en) * | 2020-09-10 | 2023-03-21 | 安徽工业大学 | Heat-conducting film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106810875B (en) | 2020-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106810875A (en) | A kind of thermal conductivity composite of graphene-containing and its preparation method and application | |
| CN103436027B (en) | A kind of heat-conduction electric insulation silicon rubber thermal interface material and preparation method thereof | |
| Tolvanen et al. | Biodegradable multiphase poly (lactic acid)/biochar/graphite composites for electromagnetic interference shielding | |
| Guo et al. | Simultaneous improvement of thermal conductivities and electromagnetic interference shielding performances in polystyrene composites via constructing interconnection oriented networks based on electrospinning technology | |
| CN106810877B (en) | Heat-conducting interface material and application thereof | |
| CN110951254A (en) | Boron nitride composite high-thermal-conductivity insulating polymer composite material and preparation method thereof | |
| CN106810876B (en) | Composite material with directionally arranged fillers and preparation method thereof | |
| Fu et al. | Thermal conductivity enhancement with different fillers for epoxy resin adhesives | |
| Liu et al. | The flexible film of SCF/BN/PDMS composites with high thermal conductivity and electrical insulation | |
| CN105175842B (en) | It is a kind of to have efficient heat-conductive characteristic and the polymer-based insulating heat-conductive composite of excellent mechanical performance concurrently | |
| Chunhui et al. | The effect of particle size gradation of conductive fillers on the conductivity and the flexural strength of composite bipolar plate | |
| Yin et al. | Significantly improved thermal conductivity of silicone rubber and aligned boron nitride composites by a novel roll-cutting processing method | |
| Zong et al. | Dual-functional carbonized loofah@ GNSs-CNTs reinforced by cyanate ester composite with highly efficient electromagnetic interference shielding and thermal management | |
| CN103834127A (en) | Micro nanocomposite material with high thermal conductivity and preparation method thereof | |
| CN109206961A (en) | A kind of graphene conductive heat-conductive coating and preparation method thereof | |
| Zhang et al. | Enhanced thermal conductivity of polyvinyl alcohol insulation composites with m-BN@ CNW hybrid materials | |
| CN102876044A (en) | Magnetic metal power/silicone rubber heat conduction composite material and preparation method thereof | |
| CN107163710A (en) | A kind of graphene fluorine carbon metal paint and preparation method thereof | |
| Li et al. | Boron nitride whiskers and nano alumina synergistically enhancing the vertical thermal conductivity of epoxy-cellulose aerogel nanocomposites | |
| CN103665875A (en) | Preparation method of electroconductive silicone rubber | |
| Li et al. | Preparation of polypropylene-based thermally conductive composites via multiple injection compression molding method | |
| CN103435971B (en) | A kind of preparation method of high-heat-conductionepoxy epoxy resin for IGBT insulation substrate | |
| Li et al. | Enhanced thermal conductivity of epoxy composites with ternary particle size through the use of hybrid polyhedral α-alumina oxide and aluminum nitride | |
| CN109734976A (en) | A kind of antistatic and high thermal conductivity rubber and preparation method thereof | |
| CN109825014B (en) | High-elasticity-modulus polytetrafluoroethylene friction material and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |