CN106808357A - Idiosome surface grinding device and method - Google Patents
Idiosome surface grinding device and method Download PDFInfo
- Publication number
- CN106808357A CN106808357A CN201710042221.9A CN201710042221A CN106808357A CN 106808357 A CN106808357 A CN 106808357A CN 201710042221 A CN201710042221 A CN 201710042221A CN 106808357 A CN106808357 A CN 106808357A
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- Prior art keywords
- polishing
- idiosome
- idiosome surface
- pressure
- grinding head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
Abstract
The present invention relates to a kind of idiosome surface grinding device and method, described device includes：Workpiece polishing mechanism, travel mechanism and pressure provide mechanism.The workpiece polishing mechanism is used to carry out grinding process to idiosome surface.The travel mechanism provides mechanism driving and is connected with the pressure, and the travel mechanism is used to drive the pressure offer mechanism to be moved according to default polishing track.The pressure provides mechanism and is connected with the workpiece polishing mechanism, and the pressure provides mechanism to be used to cause that the workpiece polishing mechanism produces preset pressure to the idiosome surface.Above-mentioned idiosome surface grinding device and method, mechanism can be provided with pressure by travel mechanism drives workpiece polishing mechanism to be polished idiosome surface according to default polishing track, sanding operation is carried out to idiosome surface so as to replace hand-held grinder structure, so that automaticity is higher, improve grinding efficiency, and the polishing quality on ceramic idiosome surface is ensure that, reduce human cost.
Description
Technical field
The present invention relates to a kind of sanding apparatus, more particularly to idiosome surface grinding device and method.
Background technology
The polishing of traditional ceramic idiosome is mainly artificial manual grinding and completes, and the experience of the workman that polishes directly determines pottery
The polishing quality and speed of porcelain idiosome.The workload of the polishing of other ceramic idiosome is larger, working environment is more severe so that beat
Mill is relatively costly, and grinding efficiency is relatively low.
The content of the invention
Based on this, it is necessary to for the defect for overcoming prior art, there is provided a kind of idiosome surface grinding device and method, it
The polishing quality on ceramic idiosome surface is ensure that, and grinding efficiency is higher.
Its technical scheme is as follows：A kind of idiosome surface grinding device, including：Workpiece polishing mechanism, it is right that the workpiece polishing mechanism is used for
Idiosome surface carries out grinding process；Travel mechanism provides mechanism with pressure, and the travel mechanism provides mechanism and passes with the pressure
Dynamic to be connected, the travel mechanism is used to drive the pressure offer mechanism to be moved according to default polishing track, the pressure
There is provided mechanism to be connected with the workpiece polishing mechanism, the pressure provides mechanism to be used to cause the workpiece polishing mechanism to the idiosome
Surface produces preset pressure.
A kind of idiosome surface polishing process, employs described idiosome surface grinding device, comprises the following steps：Determine embryo
The polishing track in body surface face；Multiple cutter locations are determined on the idiosome surface according to the polishing track；Travel mechanism will polish
Mechanism is moved to the idiosome surface, and pressure offer mechanism causes that the buffed surface of the workpiece polishing mechanism oppresses an institute wherein
State that cutter location is corresponding to treat polishing region, buffed surface is waited to polish in the way of pre-set velocity is rotated or is vibrated back and forth to described
Polished in region；When one of them described cutter location is corresponding after polishing region polishing is finished, by the travel mechanism
The workpiece polishing mechanism is moved to another described cutter location is corresponding to treat that polishing region is polished.
Above-mentioned idiosome surface grinding device and method, can provide mechanism and drive sander by travel mechanism and pressure
Structure is polished idiosome surface according to default polishing track, and idiosome surface is beaten so as to replace hand-held grinder structure
Mill operation so that automaticity is higher, improves grinding efficiency, and the polishing quality on ceramic idiosome surface is ensure that, subtract
Human cost is lacked.
Wherein in one embodiment, the workpiece polishing mechanism includes grinding head and polishing part, and the grinding head is installed in institute
The drive end that pressure provides mechanism is stated, the grinding head is connected with the polishing part, and the grinding head is for driving
The Plane Rotation type grinding head of polishing part rotation is stated, or is the oscillating mode polishing for driving the polishing part to swing back and forth
Head.
Wherein in one embodiment, the buffed surface of the polishing part is plane, and the polishing part is flexible piece or elasticity
Part.Specifically, the polishing part is sand paper, abrasive band, sand sponge or industrial scouring pad.
Wherein in one embodiment, the workpiece polishing mechanism also includes flexible transition pad, and the grinding head is by described soft
Property transition pad is connected with the polishing part.In this way, grinding head can be well adapted in the idiosome surface of different curvature so that embryo
The polishing effect in body surface face is preferable.Specifically, the hardness of flexible transition pad can elect 20HA~80HA as.
Wherein in one embodiment, it is for making the workpiece polishing mechanism to the idiosome surface that the pressure provides mechanism
Keep the floating constant force device of constant pressure.Floating constant force device enables to workpiece polishing mechanism to apply constant pressure to idiosome surface
Power, it is constant to the polishing power on idiosome surface to ensure workpiece polishing mechanism, can be adjusted by controlling floating constant force device beat in addition
Grinding machine structure changes polishing power size to idiosome surface pressure applied size.In this way, workpiece polishing mechanism is beaten idiosome surface
Mill power size is adjustable, and polishing when workpiece polishing mechanism to idiosome surface try hard to keep card it is constant in the case of, can be so that idiosome surface
Polishing effect is preferable.
Wherein in one embodiment, the polishing track is S types, and the cutter location is set along the polishing track
Put.Workpiece polishing mechanism is polished the corresponding polishing region of each cutter location successively along the polishing track of S types, such sander
Structure is higher to the grinding efficiency on idiosome surface.
Wherein in one embodiment, the idiosome is ceramic idiosome, and the polishing part is with 600rpm~10000rpm's
Velocity of rotation treats that polishing region is polished to described, or with the vibration velocity back and forth of 3000opm~30000opm to described
Treat that polishing region is polished.
Wherein in one embodiment, described idiosome surface polishing process also includes step：Obtain the idiosome surface
The curvature value for treating polishing region, when determining the curvature value whne polishing region and being more than preset curvature value, then by shaking
Ejector half grinding head treats that polishing region carries out grinding process to described；When determining the curvature value for treating polishing region less than default
During curvature value, then treat that polishing region carries out grinding process to described by Plane Rotation type grinding head.
Wherein in one embodiment, when by oscillating mode grinding head to described when polishing region carries out grinding process,
30%~80% of the working width at intervals of the oscillating mode grinding head between the adjacent cutter location；By Plane Rotation
Type grinding head treats that polishing region carries out grinding process to described, between the adjacent cutter location at intervals of the Plane Rotation type
The 50%~90% of the working width of grinding head.
Brief description of the drawings
Fig. 1 for idiosome surface grinding device described in the embodiment of the present invention ceramic pedestal pan idiosome outer surface is polished when
Working state schematic representation；
Fig. 2 for idiosome surface grinding device described in the embodiment of the present invention ceramic pedestal pan idiosome inner surface is polished when
Working state schematic representation one；
Fig. 3 for idiosome surface grinding device described in the embodiment of the present invention ceramic pedestal pan idiosome outer surface is polished when
Working state schematic representation two.
10th, workpiece polishing mechanism, 11, grinding head, 12, polishing part, 13, flexible transition pad, 20, travel mechanism, 21, corner installs
Handle, 30, pressure mechanism is provided, 40, ceramic pedestal pan, 50, rotating mechanism, 60, polishing track.
Specific embodiment
To enable the above objects, features and advantages of the present invention more obvious understandable, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.Elaborate many details in order to fully understand this hair in the following description
It is bright.But the present invention can be implemented with being much different from other manner described here, and those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
In the description of the invention, it is to be understood that term " first ", " second " are only used for describing purpose, and can not
It is interpreted as indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " the
One ", at least one this feature can be expressed or be implicitly included to the feature of " second ".In the description of the invention, " multiple "
It is meant that at least two, such as two, three etc., unless otherwise expressly limited specifically.
It should be noted that in embodiment described above, when an element is considered as " connection " another element, can be with
It is directly to another element or may be simultaneously present intermediary element.Conversely, when element for be referred to as " direct " with it is another
When element is connected, in the absence of intermediary element.
As shown in Fig. 1 or Fig. 2 or Fig. 3, a kind of idiosome surface grinding device, including：Workpiece polishing mechanism 10, travel mechanism 20 with
Pressure provides mechanism 30.The workpiece polishing mechanism 10 is used to carry out grinding process to idiosome surface.The travel mechanism 20 with it is described
Pressure provides the transmission of mechanism 30 and is connected, and the travel mechanism 20 is used to drive the pressure to provide mechanism 30 according to default polishing rail
Mark is moved.The pressure provides mechanism 30 and is connected with the workpiece polishing mechanism 10, and the pressure provides mechanism 30 to be used for
So that the idiosome surface of the workpiece polishing mechanism 10 pairs produces preset pressure.
Above-mentioned idiosome surface grinding device, can provide mechanism 30 and drive workpiece polishing mechanism by travel mechanism 20 and pressure
10 polish idiosome surface according to default polishing track, and idiosome surface is carried out so as to replace hand-held grinder structure 10
Sanding operation so that automaticity is higher, improves grinding efficiency, and ensure that the polishing quality on ceramic idiosome surface,
Reduce human cost.
Fig. 1 and Fig. 2 is referred to, in the present embodiment, the workpiece polishing mechanism 10 includes grinding head 11 and polishing part 12.It is described to beat
Bistrique 11 is installed in the drive end that the pressure provides mechanism 30, and the grinding head 11 is connected with the polishing part 12.Institute
It is the Plane Rotation type grinding head 11 for driving the polishing part 12 to carry out high speed rotation in the plane to state grinding head 11, or
It is the oscillating mode grinding head 11 for driving the polishing part 12 to be swung back and forth along predetermined trajectory.
Additionally, the buffed surface of the polishing part 12 is plane, the polishing part 12 is flexible piece or elastic component.Specifically,
The polishing part 12 is sand paper, abrasive band, sand sponge or industrial scouring pad.Wherein, travel mechanism 20 can use six-shaft industrial machine
Device people, can control workpiece polishing mechanism 10 to be moved according to default polishing track by six-shaft industrial robot.Pressure provides machine
Structure 30 can be arranged on the driving shaft end of six-shaft industrial robot by corner installing handle 21, and by corner installing handle 21
Pressure can be adjusted angle of the mechanism 30 relative to the drive shaft of six-shaft industrial robot is provided, and enable to workpiece polishing mechanism 10
Buffed surface is 5 °~150 ° with the angle of the drive shaft of six-shaft industrial robot.Preferably, the buffed surface of workpiece polishing mechanism 10 and six axles
The angle of the drive shaft of industrial robot is 45 °.
Idiosome surface grinding device also includes rotating mechanism 50.Rotating mechanism 50 is used to for idiosome to carry out rotation process, right
After idiosome is rotated, allow the buffed surface of idiosome towards robot body, facilitate robot to polish, reduce to robot sheet
The requirement of body brachium.In addition, rotating mechanism can be fixed on bottom surface, while fixation can be played to idiosome, can so keep away
In exempting from workpiece polishing mechanism 10 and carrying out bruting process to idiosome, idiosome is moved phenomenon such that it is able to ensure the polishing on idiosome surface
Effect.
In addition, the workpiece polishing mechanism 10 also includes flexible transition pad 13.The grinding head 11 is by the flexible transition pad
13 are connected with the polishing part 12.In this way, grinding head 11 can be well adapted in the idiosome surface of different curvature so that idiosome
The polishing effect on surface is preferable.Specifically, the hardness of flexible transition pad 13 can elect 20HA~80HA as.
It should be noted that it is for protecting the idiosome surface of the workpiece polishing mechanism 10 pairs that the pressure provides mechanism 30
Hold the floating constant force device of constant pressure.Floating constant force device enables to workpiece polishing mechanism 10 to apply constant pressure to idiosome surface
Power, it is constant to the polishing power on idiosome surface to ensure workpiece polishing mechanism 10, in addition can be by controlling floating constant force device to adjust
Workpiece polishing mechanism 10 changes polishing power size to idiosome surface pressure applied size.In this way, workpiece polishing mechanism 10 is to idiosome table
The polishing power size in face is adjustable, and polishing when workpiece polishing mechanism 10 to idiosome surface try hard to keep card it is constant in the case of, can be so that embryo
The polishing effect in body surface face is preferable.
A kind of idiosome surface polishing process described in the embodiment of the present invention, employs above-mentioned idiosome surface grinding device,
Comprise the following steps：
Step S101, the polishing track 60 for determining idiosome surface；It is understood that the polishing track 60 is moving machine
The circuit of the portable grinder structure 10 of structure 20.
Step S102, multiple cutter locations are determined on the idiosome surface according to the polishing track 60；Wherein, cutter location pair
Should be in the central point of the buffed surface of workpiece polishing mechanism 10.Workpiece polishing mechanism 10 is corresponding to one of cutter location on idiosome surface to be waited to beat
Before mill region carries out polishing step, can be according to the position of cutter location, it is right that the central point of its buffed surface and cutter location are carried out
Standard, then provides the buffed surface that mechanism 30 drives workpiece polishing mechanism 10 and oppresses and treat polishing region cutter location is corresponding by pressure,
Treating polishing region by way of vibrating high-speed rotation or back and forth carries out grinding process.
Workpiece polishing mechanism 10 is moved to the idiosome surface by step S103, travel mechanism 20, and pressure provides mechanism 30 and makes
The buffed surface compressing of the workpiece polishing mechanism 10 cutter location is corresponding wherein treats polishing region, buffed surface is with default
Speed is rotated or the mode vibrated back and forth treats that polishing region is polished to described；
Step S104, when one of them described cutter location it is corresponding after polishing region polishing finish after, by the movement
The workpiece polishing mechanism 10 is moved to another described cutter location is corresponding to treat that polishing region is polished for mechanism 20.
Above-mentioned idiosome surface polishing process, can provide mechanism 30 and drive workpiece polishing mechanism by travel mechanism 20 and pressure
10 treat that polishing region is polished according to default polishing track 60 to the cutter location correspondence on idiosome surface, so as to replace hand-held beating
Grinding machine structure 10 carries out sanding operation to idiosome surface so that automaticity is higher, improve grinding efficiency, and ensure that
The polishing quality on ceramic idiosome surface, reduces human cost.
Additionally, referring to Fig. 3, the polishing track 60 is S types, and the cutter location is set along the polishing track 60
Put.Workpiece polishing mechanism 10 is polished the corresponding polishing region of each cutter location successively along the polishing track 60 of S types, is so beaten
Grinding machine structure 10 is higher to the grinding efficiency on idiosome surface.
Wherein, the idiosome is ceramic idiosome, and the polishing object that Fig. 1 to Fig. 3 is illustrated is the idiosome of ceramic pedestal pan 40.
For ceramic embryoid, if being polished idiosome surface from Plane Rotation type grinding head 11, polishing part 12 should be with
The velocity of rotation of 600rpm~10000rpm treats that polishing region is polished to described, it is possible to the friction system according to idiosome surface
Number and pressure provide mechanism 30 make workpiece polishing mechanism 10 to idiosome surface pressure applied by polishing part 12 to idiosome surface
The control of polishing power in 1N~100N, so ensure that the idiosome surface of ceramic idiosome has preferably polishing effect；And if
Idiosome surface is polished from oscillating mode grinding head 11, polishing part 12 should be with the vibration back and forth of 3000opm~30000opm
Speed treats that polishing region is polished to described, and same can provide mechanism according to the coefficient of friction on idiosome surface and pressure
30 make workpiece polishing mechanism 10 to idiosome surface pressure applied by polishing part 12 to the control of the polishing power on idiosome surface 1N~
100N, so ensure that the idiosome surface of ceramic idiosome has preferably polishing effect.
In addition, described idiosome surface polishing process also includes step：Obtain the polishing region for the treatment of on the idiosome surface
Curvature value, when determining the curvature value whne polishing region and being more than preset curvature value, then by oscillating mode grinding head 11 pairs
It is described to treat that polishing region carries out grinding process；When the curvature value whne polishing region is determined less than preset curvature value, then
By treating that polishing region carries out grinding process described in Plane Rotation type grinding head 11 pairs.Wherein, preset curvature value can be according to shaking
The buffed surface size of ejector half grinding head 11, the buffed surface size of Plane Rotation type grinding head 11 and idiosome surface
The actual conditions relative set of polishing region size is treated, so be ensure that and the idiosome surface of ceramic idiosome is preferably beaten
Mill effect.For example, the inner surface of ceramic pedestal pan 40 each treat that the curvature value of polishing region is larger, typically can all compare preset curvature
Value is big, so can carry out grinding process (see Fig. 2) to the inner surface of ceramic pedestal pan 40 by oscillating mode grinding head 11；
Certainly, if the inner surface of ceramic pedestal pan 40 some treat that the curvature value of polishing region is smaller, it would however also be possible to employ Plane Rotation type is beaten
Bistrique 11 carries out grinding process to the inner surface of ceramic pedestal pan 40.In addition, the outer surface of ceramic pedestal pan 40 each wait to polish
The curvature value in region is smaller, typically all can be smaller than preset curvature value, so often through 11 pairs of ceramics of Plane Rotation type grinding head
The outer surface of toilet seat 40 carries out grinding process (see Fig. 1)；Certainly, if the outer surface of ceramic pedestal pan 40 some wait to polish
The curvature value in region is larger, it would however also be possible to employ oscillating mode grinding head 11 carries out grinding process to the outer surface of ceramic pedestal pan 40.
It should be noted that when by described in oscillating mode grinding head 11 pairs when polishing region carries out grinding process, it is adjacent
30%~80% of the working width at intervals of the oscillating mode grinding head 11 between the cutter location；It is understood that
The buffed surface that the working width of oscillating mode grinding head 11 refers to oscillating mode grinding head 11 is once polished idiosome surface institute
The transverse width of corresponding polishing region is longitudinally wide.Wherein, the buffed surface of oscillating mode grinding head 11 is carried out to idiosome surface
The polishing effect at the middle part of corresponding polishing region of once polishing is preferable relative to the polishing effect of periphery, due to adjacent cutter spacing
30%~80% of the working width at intervals of oscillating mode grinding head 11 between point, so two polishings of adjacent cutter location correspondence
Region has overlapping region, and the overlapping region is the periphery of the corresponding polishing region of cutter location, i.e., to cutter location correspondence
The periphery of polishing region carry out repeating polishing, enabling ensure the polishing effect of idiosome outer surface.
In addition, when by treating that polishing region carries out grinding process, the adjacent knife described in Plane Rotation type grinding head 11 pairs
50%~90% of the working width at intervals of the Plane Rotation type grinding head 11 between site.It is understood that flat
The buffed surface that the working width of the rotary-type grinding head 11 in face refers to Plane Rotation type grinding head 11 is carried out once to idiosome surface
The circle diameter of the corresponding polishing region of polishing.Wherein, the buffed surface of oscillating mode grinding head 11 is carried out once to idiosome surface
The polishing effect at the middle part of the corresponding polishing region of polishing is preferable relative to the polishing effect of periphery, between adjacent cutter location
At intervals of the 50%~90% of the working width of Plane Rotation type grinding head 11.So adjacent corresponding two polishing regions of cutter location
With overlapping region, the overlapping region is the periphery of the corresponding polishing region of cutter location, i.e., corresponding to cutter location to beat
Grinding the periphery in region carries out repeating polishing, enabling ensure the polishing effect of idiosome outer surface.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of idiosome surface grinding device, it is characterised in that including：
Workpiece polishing mechanism, the workpiece polishing mechanism is used to carry out grinding process to idiosome surface；
Travel mechanism provides mechanism with pressure, and the travel mechanism provides mechanism driving and is connected with the pressure, the moving machine
Structure is used to drive the pressure offer mechanism to be moved according to default polishing track, and the pressure provides mechanism and the polishing
Mechanism driving is connected, and the pressure provides mechanism to be used to cause that the workpiece polishing mechanism produces preset pressure to the idiosome surface.
2. idiosome surface grinding device according to claim 1, it is characterised in that the workpiece polishing mechanism include grinding head with
Polishing part, the grinding head is installed in the drive end that the pressure provides mechanism, and the grinding head is driven with the polishing part and connects
Connect, the grinding head is the Plane Rotation type grinding head for driving the polishing part to rotate, or be for driving described beating
The oscillating mode grinding head that mill part swings back and forth.
3. idiosome surface grinding device according to claim 2, it is characterised in that the buffed surface of the polishing part is flat
Face, the polishing part is flexible piece or elastic component.
4. idiosome surface grinding device according to claim 2, it is characterised in that the workpiece polishing mechanism also includes flexible mistake
Pad is crossed, the grinding head is connected by the flexible transition pad with the polishing part.
5. the idiosome surface grinding device according to any one of Claims 1-4, it is characterised in that the pressure provides machine
Structure is the floating constant force device for making the workpiece polishing mechanism that constant pressure is kept to the idiosome surface.
6. a kind of idiosome surface polishing process, it is characterised in that employ the idiosome table as described in any one of claim 1 to 5
Face sanding apparatus, comprise the following steps：
Determine the polishing track on idiosome surface；
Multiple cutter locations are determined on the idiosome surface according to the polishing track；
Workpiece polishing mechanism is moved to the idiosome surface by travel mechanism, and pressure provides the polishing that mechanism causes the workpiece polishing mechanism
Face pressure compels that cutter location is corresponding wherein treats polishing region, and buffed surface is rotated with pre-set velocity or vibrated back and forth
Mode treat that polishing region is polished to described；
When one of them described cutter location is corresponding after polishing region polishing is finished, by the travel mechanism by the polishing
Mechanism is moved to that another described cutter location is corresponding to treat that polishing region is polished.
7. idiosome surface according to claim 6 polishing process, it is characterised in that the polishing track is S types, the knife
Site is configured along the polishing track.
8. idiosome surface according to claim 6 polishing process, it is characterised in that the idiosome is ceramic idiosome, described
Polishing part treats that polishing region is polished with the velocity of rotation of 600rpm~10000rpm to described, or with 3000opm~
The vibration velocity back and forth of 30000opm treats that polishing region is polished to described.
9. the idiosome surface polishing process according to any one of claim 6 to 8, it is characterised in that also including step：Obtain
The curvature value for treating polishing region on the idiosome surface, preset curvature value is more than when the curvature value for treating polishing region is determined
When, then treat that polishing region carries out grinding process to described by oscillating mode grinding head；When determining the song for treating polishing region
When rate value is less than preset curvature value, then treat that polishing region carries out grinding process to described by Plane Rotation type grinding head.
10. idiosome surface according to claim 9 polishing process, it is characterised in that when by oscillating mode grinding head to institute
State when polishing region carries out grinding process, the work at intervals of the oscillating mode grinding head between the adjacent cutter location is wide
The 30%~80% of degree；
Treat that polishing region carries out grinding process, the interval between the adjacent cutter location to described by Plane Rotation type grinding head
It is the 50%~90% of the working width of the Plane Rotation type grinding head.
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| CN201710042221.9A CN106808357A (en) | 2017-01-20 | 2017-01-20 | Idiosome surface grinding device and method |
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| CN107756145A (en) * | 2017-09-11 | 2018-03-06 | 南宁宇立仪器有限公司 | A kind of intelligent polishing process |
| CN108177028A (en) * | 2017-12-27 | 2018-06-19 | 广东省智能制造研究所 | Ceramic grinding technique |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107756145A (en) * | 2017-09-11 | 2018-03-06 | 南宁宇立仪器有限公司 | A kind of intelligent polishing process |
| CN108177028A (en) * | 2017-12-27 | 2018-06-19 | 广东省智能制造研究所 | Ceramic grinding technique |
| CN109015124A (en) * | 2018-09-28 | 2018-12-18 | 邢台钢铁有限责任公司 | A kind of method of billet surface reconditioning |
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Application publication date: 20170609 |