CN106793568A - The preparation method of circuit board - Google Patents
The preparation method of circuit board Download PDFInfo
- Publication number
- CN106793568A CN106793568A CN201510799629.1A CN201510799629A CN106793568A CN 106793568 A CN106793568 A CN 106793568A CN 201510799629 A CN201510799629 A CN 201510799629A CN 106793568 A CN106793568 A CN 106793568A
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- CN
- China
- Prior art keywords
- micro
- structural
- circuit board
- preparation
- ink droplet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of preparation method of circuit board, including：One substrate is provided；An ink-jet printing technique is carried out, in the multiple micro-structurals arranged along a first direction of formation on substrate, and multiple grooves extended along a second direction is formed between micro-structural, second direction is different from first direction；And carry out an ink-jet printing technique, in being coated with multiple conduction ink droplets in micro-structural, and groove between micro-structural is filled up by conductive ink droplet.By implementing the present invention, the adhesion stability between circuit and substrate can be improved, and then lift reliability and the life-span of integrated circuit plate.
Description
Technical field
The present invention is, on a kind of preparation method of circuit board, can to improve between circuit and substrate in particular to one kind
Adhesion stability circuit board preparation method.
Background technology
Printed circuit board (printed circuit board, PCB) is widely used in various electronic equipments.Printing
In addition to it can be used to fix various electronic components, its major function is that the mutual electric current for providing each electronic component connects to circuit board
Connect.
In recent years due to the rise of circuit of prining (printed electronics) technology, industry is also sought for by ink-jet printing
(inkjet printing) technology makes printed circuit board, and the phase can further reduce production cost and improve circuit board making
Caused problem of environmental pollution.
However, in ink-jet printing circuit, often producing circuit to be difficult to adhere to the problem of substrate, and influence overall
The reliability of printed circuit board and life-span.Therefore, above mentioned problem how is improved, it is real-valued to obtain the deep thinking of person skilled institute.
The content of the invention
According to a kind of above-mentioned, present invention method with ink-jet printing fabrication techniques circuit board of offer, circuit and base can be improved
Adhesion stability between plate, and then lift reliability and the life-span of integrated circuit plate.
The present invention provides a kind of preparation method of circuit board in an embodiment, including：One substrate is provided；Carry out a spray
Ink is printd technique, in forming multiple micro-structurals arranged along a first direction on substrate, and is formed between micro-structural
Multiple grooves extended along a second direction, second direction is different from first direction；And carry out an ink-jet printing work
Skill, in being coated with multiple conduction ink droplets in micro-structural, and groove between micro-structural is filled up by conductive ink droplet.
In an embodiment, foregoing second direction is perpendicular to first direction.
In an embodiment, foregoing micro-structural is substantially rectangular structure, and its longer axis parallel is in second direction.
In an embodiment, foregoing micro-structural is less than the size of conductive ink droplet in the length on first direction.
In an embodiment, the arrangement period of foregoing micro-structural is same with the coating cycle phase of conductive ink droplet.
In an embodiment, the section of foregoing micro-structural is T-shaped.
In an embodiment, foregoing micro-structural is upwardly formed dislocation more in interval setting in second direction in first party
Arrangement.
In an embodiment, foregoing micro-structural is in the size for being smaller than conductive ink droplet in second direction.
In an embodiment, foregoing micro-structural includes the material of high adhesion force.
In an embodiment, foregoing micro-structural includes nonconducting material.
By implementing the present invention, the adhesion stability between circuit and substrate can be improved, and then lift integrated circuit plate
Reliability and life-span.
Brief description of the drawings
Figure 1A to Figure 1B shows the profile in preparation method each stage of circuit board according to an embodiment of the invention.
Fig. 2A shows the plane that micro-structural and conductive ink droplet are formed with ink-jet printing technique according to an embodiment of the invention
Figure；Fig. 2 B show the stereogram of the circuit board made with ink-jet printing technique according to an embodiment of the invention.
Fig. 3 A show according to another embodiment of the present invention flat with conductive ink droplet with ink-jet printing technique formation micro-structural
Face schematic diagram；Fig. 3 B show the stereogram of the micro-structural in Fig. 3 A.
Fig. 4 to show and form micro-structural with conductive ink droplet with ink-jet printing technique according to still another embodiment of the present invention
Plan.
Drawing reference numeral
100th, 200 substrate
102nd, 108 ink-spraying-head
104th, 204,304,404 micro-structural
106th, 206,306,406 groove
110th, 210,310,410 conductive ink droplet
212 circuits
304A lower portion
304B upper portions
D1 first directions
D2 second directions
G, Sp spacing
L length
The P cycles
S sizes
W width
Specific embodiment
It is that above and other objects, features and advantages of the invention can be become apparent, it is cited below particularly to go out preferably to implement
Example, and coordinate institute's accompanying drawings, it is described in detail below.
Figure 1A to Figure 1B shows the profile in preparation method each stage of circuit board according to an embodiment of the invention.
Figure 1A is refer to, a substrate 100 is provided first.In certain embodiments, substrate 100 includes copper clad laminate, glass
Glass substrate or plastic substrate etc..
Then, an ink-jet printing technique is carried out, by an at least ink-spraying-head 102, spray printing multiple ink drop is in base
On plate 100.Thereafter, by uniform temperature, the baking of time, foregoing ink drop can form multiple solid shapes
Micro-structural 104.Wherein, ink drop (that is, micro-structural 104) includes nonconducting material, such as plastic cement polymerization
Thing and oxide, and can produce high adhesion force with substrate 100.Additionally, being formed with multiple microns between micro-structural 104
(micrometer) groove 106 of grade.
Then, Figure 1B is refer to, is formed on the substrate 100 after multiple micro-structurals 104, carry out an ink-jet printing
Technique, by least another ink-spraying-head 108, the multiple conduction ink droplets 110 of spray printing in foregoing micro-structural 104, its
In the multiple conduction ink droplets 110 that are dropped in micro-structural 104 can tend to flow into and fill up it is recessed between micro-structural 104
Groove 106, is then joined to each other.Thereafter, by uniform temperature, the baking of time, aforesaid conductive ink droplet 110
Connected circuit can be formed.In certain embodiments, the material of conductive ink droplet 110 include for example gold, silver, nickel,
The metallics such as copper, aluminium, dispersant (dispersant).In other embodiments, the material of conductive ink droplet 110 can be more
Including sticker (binder).
The preparation method of the circuit board provided according to above-described embodiment, can be by ink-jet printing technology, first in substrate 100
It is upper to form multiple micro-structurals 104 with high adhesion force, then conductive ink droplet 110 is coated in micro-structural 104, such as
Equivalent to a surface treatment has been carried out in advance to substrate 100, (micro-structural 104 can increase the coarse of the surface of substrate 100 for this
Degree), thus obtain the circuit (that is, conductive ink droplet 110) and substrate 100 for significantly improving and subsequently putting on substrate 100
Between adhesion stability
Further, since the conductive ink droplet 110 being dropped in micro-structural 104 can automatically be flowed into and fill up micro-structural 104
Between groove 106, and be joined to each other, so also can effectively increase the continuous of circuit on substrate 100
Property.
Meanwhile, forming micro-structural 104 is and forms circuit (that is, conductive ink droplet 110) using identical ink-jet printing work
Skill and equipment, are so not required to by extra process (such as oxygen plasma or the roughening of other chemical surfaces
Method) and equipment, and production cost and process complexity can be reduced.
The preparation method for further describing the circuit board of different embodiments of the invention further according to Fig. 2A to Fig. 4 below.
Fig. 2A is refer to, its display is according to an embodiment of the invention to form micro-structural with conduction with ink-jet printing technique
The plan (being concise schema, only omit the substrate portion of circuit board) of ink droplet.As shown in Figure 2 A, multiple micro-structurals
204 are formed on substrate in the way of a fixed cycle the distance between (that is, the center of micro-structural 204) P, and along
One first direction D1 is arranged.For substantially rectangular structure, (its section is also rectangle to foregoing micro-structural 204, can refer to figure
2B), and its longer axis parallel is in a second direction D2, different from first direction D1.In the present embodiment, second party
To D2 perpendicular to first direction D1, but it is not limited thereto.The shape of micro-structural 204 can be by the shape of ink-spraying-head
Shape is determined.In certain embodiments, the arrangement period P of micro-structural 204 is about 10 microns to 250 microns.
Thereafter, multiple conduction ink droplets 210 equally D1 along a first direction, and with the arrangement period with micro-structural 204
The distance between the P identical cycles (that is, the conductive center of ink droplet 210) coat in micro-structural 204.
As shown in Figure 2 A, micro-structural 204 is smaller than the chi of conductive ink droplet 210 in the length L on first direction D1
Very little S, and micro-structural 204 can be equal to or more than the size of conductive ink droplet 210 in the width W on second direction D2
(wherein, conductive ink droplet 210 is spherical ink droplet, that is, the size S on D1 and second direction D2 in a first direction to S
It is identical).In certain embodiments, the length L of micro-structural 204 be about the size S of conductive ink droplet 210 two/
3/1sts to four (that is, L=0.5S~0.75S), and the width W of micro-structural 204 is about the chi of conductive ink droplet 210
One to the twice (that is, W=S~2S) of very little S, such as the size S of conductive ink droplet 210 be about 20 microns to 300 it is micro-
Rice, the length L of micro-structural 204 is about 10 microns to 225 microns, and width W is about 20 microns to 600 microns.
Furthermore, multiple grooves 206 between micro-structural 204 also extend along second direction D2, and groove 206 in
Spacing G on first direction D1 is approximately equal to micro-structural 204 in the length L on first direction D1 and micro-structural 204
Arrangement period P difference (that is, G=P-L).In certain embodiments, to be about 5 micro- for the spacing G of groove 206
Rice is to 100 microns.
By above-mentioned design, conductive ink droplet 210 in the scope that can exceed micro-structural 204 on first direction D1, and from
The groove 206 for flowing into dynamicly and filling up between micro-structural 204, and then be joined to each other.Thereafter, by one
After constant temperature degree, the baking of time (conductive ink droplet 210), you can complete board structure of circuit as shown in Figure 2 B, including
The good circuit 212 of the continuity of substrate 200 and its top.
Fig. 3 A show according to another embodiment of the present invention flat with conductive ink droplet with ink-jet printing technique formation micro-structural
Face figure (being concise schema, only omit the substrate portion of circuit board).Fig. 3 B show the stereogram of the micro-structural in Fig. 3 A.
Fig. 3 A and Fig. 3 B are refer to, the present embodiment is with the difference of earlier figures 2A, Fig. 2 B illustrated embodiments, each micro-
Structure 304 has a T-shaped structure (its section be T-shaped, as shown in Figure 3 B), including connecting substrate is once
The side part 304A and upper portion 304B being located on the 304A of lower portion, wherein upper portion 304B is substantially
It is square structure, and lower portion 304A substantially rectangular structure and its longer axis parallel is in second direction D2.
In the present embodiment, upper and lower side the part 304A and 304B of micro-structural 304 can be by same or different ink
Shower nozzle is formed by multiple spray printing.Additionally, the groove 306 between micro-structural 304 also prolongs along second direction D2
Stretch.
As shown in Figure 3A, micro-structural 304 is smaller than the chi of conductive ink droplet 310 in the length L on first direction D1
Very little S, and the size S that micro-structural 304 is also smaller than conductive ink droplet 310 in the width W on second direction D2 is (wherein,
Conductive ink droplet 310 is spherical ink droplet, that is, size S-phase in a first direction on D1 and second direction D2 is same),
The length L and width W of such as micro-structural 304 be each about the size S of conductive ink droplet 310 1/2nd (that is,
L=W=0.5S).
Similarly, by above-mentioned design, conductive ink droplet 310 is in the model that can also exceed micro-structural 304 on first direction D1
Enclose, and tend to the groove 306 for flowing into and filling up between micro-structural 304, and then be joined to each other.It is worth note
Meaning, because micro-structural 304 is with more the design of T-shaped structure, can so avoid the circuit being subsequently formed easily
It is located away from micro-structural 304, and the adhesion stability between accentuator and substrate.
Fig. 4 to show and form micro-structural with conductive ink droplet with ink-jet printing technique according to still another embodiment of the present invention
Plan (being concise schema, only omit the substrate portion of circuit board).Refer to Fig. 4, the present embodiment and earlier figures 2A,
The difference of Fig. 2 B illustrated embodiments is, micro-structural 404 more can be in interval setting on second direction D2, and in
Heterogeneous Permutation is formed on one direction D1.
Specifically, by above-mentioned design, conductive ink droplet 410 can be also effectively prevented from along micro-structural 404
Between groove 406 on second direction D2 beyond micro-structural 404 scope when the adjacent conductive ink droplet of directly contact
410, cause the circuit being subsequently formed to be short-circuited, so contribute to the minimum spacing for reducing base on-board circuitry (to improve electricity
Road layout density), such as micro-structural 404 on second direction D2 interval S p (equivalent to conductive ink droplet 410 and after
The continuous spacing for forming circuit) it is smaller than size S (that is, the Sp of conductive ink droplet 410<S).
In sum, the present invention provides a kind of method with ink-jet printing fabrication techniques circuit board, including：One base is provided
Plate；An ink-jet printing technique is carried out, in the multiple micro-structurals arranged along a first direction of formation on substrate, and micro- knot
Multiple grooves extended along a second direction are formed between structure, second direction is different from first direction；And carry out
One ink-jet printing technique, in being coated with multiple conduction ink droplets in micro-structural, and groove between micro-structural is filled out by conductive ink droplet
It is full.Thereby, the continuity of the circuit being subsequently formed can be increased, and can effectively improves the adhesion between circuit and substrate
Stability, and then lift reliability and the life-span of integrated circuit plate.
Although the present invention is disclosed above with foregoing embodiment, so it is not limited to the present invention.Skill belonging to of the invention
Have usually intellectual in art field, without departing from the spirit and scope of the present invention, when can do a little change with profit
Decorations.Therefore protection scope of the present invention is worked as and is defined depending on the claim person of defining.
Claims (10)
1. a kind of preparation method of circuit board, it is characterised in that the preparation method of the circuit board includes：
One substrate is provided；
An ink-jet printing technique is carried out, in the multiple micro-structurals arranged along a first direction of formation on the substrate, and institute
State and multiple grooves extended along a second direction are formed between micro-structural, the second direction is different from the first party
To；And
An ink-jet printing technique is carried out, in the multiple conduction ink droplets of coating in the micro-structural, and between the micro-structural
The groove is filled up by the conductive ink droplet.
2. the preparation method of circuit board as claimed in claim 1, it is characterised in that the second direction is perpendicular to this
First direction.
3. the preparation method of circuit board as claimed in claim 1, it is characterised in that the micro-structural is substantially square
The structure of shape, and its longer axis parallel is in the second direction.
4. the preparation method of circuit board as claimed in claim 1, it is characterised in that the micro-structural in this first
Size of the length less than the conductive ink droplet on direction.
5. the preparation method of circuit board as claimed in claim 1, it is characterised in that the arrangement week of the micro-structural
Phase is same with the coating cycle phase of the conductive ink droplet.
6. the preparation method of circuit board as claimed in claim 1, it is characterised in that the section of the micro-structural is
It is T-shaped.
7. the preparation method of circuit board as claimed in claim 1, it is characterised in that the micro-structural more in this
Interval setting on two directions, and it is upwardly formed Heterogeneous Permutation in the first party.
8. the preparation method of circuit board as claimed in claim 7, it is characterised in that the micro-structural in this second
The size for being smaller than the conductive ink droplet on direction.
9. the preparation method of the circuit board as described in any claim in claim 1 to 8, it is characterised in that
The micro-structural includes the material of high adhesion force.
10. the preparation method of the circuit board as described in any claim in claim 1 to 8, it is characterised in that
The micro-structural includes nonconducting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510799629.1A CN106793568B (en) | 2015-11-19 | 2015-11-19 | Method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510799629.1A CN106793568B (en) | 2015-11-19 | 2015-11-19 | Method for manufacturing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793568A true CN106793568A (en) | 2017-05-31 |
| CN106793568B CN106793568B (en) | 2020-03-13 |
Family
ID=58914700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510799629.1A Active CN106793568B (en) | 2015-11-19 | 2015-11-19 | Method for manufacturing circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN106793568B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11237103B2 (en) | 2018-05-31 | 2022-02-01 | Socovar Sec | Electronic device testing system, electronic device production system including same and method of testing an electronic device |
| CN114435458A (en) * | 2022-01-27 | 2022-05-06 | 廊坊市金色时光科技发展有限公司 | Sensor pad and manufacturing method thereof |
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| CN102280582A (en) * | 2005-12-13 | 2011-12-14 | 三星电子株式会社 | Display device and manufacturing method therefor |
| US20150104562A1 (en) * | 2013-10-10 | 2015-04-16 | Omega Optics, Inc. | Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems |
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| JP2007049186A (en) * | 2002-09-30 | 2007-02-22 | Seiko Epson Corp | Method for forming thin film pattern |
| CN1573493A (en) * | 2003-05-30 | 2005-02-02 | 精工爱普生株式会社 | Parts and preparation method thereof, active matrix substrate preparing method, electro-optic device, and electronic instrument |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11237103B2 (en) | 2018-05-31 | 2022-02-01 | Socovar Sec | Electronic device testing system, electronic device production system including same and method of testing an electronic device |
| CN114435458A (en) * | 2022-01-27 | 2022-05-06 | 廊坊市金色时光科技发展有限公司 | Sensor pad and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106793568B (en) | 2020-03-13 |
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