CN106793563B - Cooling device for surface mounting and welding of PCB - Google Patents
Cooling device for surface mounting and welding of PCB Download PDFInfo
- Publication number
- CN106793563B CN106793563B CN201611154151.8A CN201611154151A CN106793563B CN 106793563 B CN106793563 B CN 106793563B CN 201611154151 A CN201611154151 A CN 201611154151A CN 106793563 B CN106793563 B CN 106793563B
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- Prior art keywords
- cavity
- heat exchanger
- pcb
- cooling
- air outlet
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
- F27D2009/007—Cooling of charges therein
- F27D2009/0072—Cooling of charges therein the cooling medium being a gas
- F27D2009/0075—Cooling of charges therein the cooling medium being a gas in direct contact with the charge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a cooling device for surface mounting and welding of a PCB (printed Circuit Board), which comprises a hearth, wherein a closed cavity is arranged in the hearth, a baffle plate is arranged in the cavity and divides the cavity into a cooling cavity and a reflux cavity which are mutually independent, the reflux cavity is of an n-type structure and is covered at the upper end of the cooling cavity, and the PCB is positioned in the cooling cavity; a blower; a heat exchanger; and a filter. Because separate the cavity of furnace into two independent cavities, the fan is located the upper end, the heat exchanger is located the lower extreme, two independent cavities are connected respectively to fan and heat exchanger's air intake and air outlet, form a hot-blast decurrent, cold wind ascending circulation wind channel, the hot-blast that has the scaling powder can only flow downwards, filter by the filter of heat exchanger air intake department at last, simultaneously, the cooling chamber is located the backward flow intracavity for have the combustion-supporting agent hot-blast to be kept apart, the stroke is short, the combustion-supporting agent can filter fast and deposit to the furnace bottom, the combustion-supporting agent can not cause large tracts of land to condense the pollution, the clearance maintenance of being convenient for.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a cooling device for surface mounting and welding of a PCB.
Background
At present, in SMT (surface mounting technology) nitrogen reflow soldering and nitrogen wave soldering, combustion improver (rosin) is mixed in the air after soldering, so that the combustion improver in the air is easy to condense during cooling. In the prior art, cooling mainly adopts an air convection mode, and in order to keep the sealing of a hearth and the low oxygen content in the furnace, a refrigerant (usually water) medium is generally adopted for heat exchange between the inside and the outside of the furnace. The traditional practice in the industry is: 1. the heat exchanger is arranged in the upper air channel, air heat exchange is realized through rotation of the wind wheel, the PCB is directly cooled, the heat exchange of the structure is fast, the efficiency is high, the defect is that the structure is complex and maintenance is troublesome, the scaling powder contained in the air in the furnace is easy to pre-cool and condense through the cavity of the whole hearth from bottom to top, and the condensed scaling powder (rosin) can pollute the heat exchanger and the upper air channel and drop onto the PCB to cause pollution risk. 2. The heat exchanger is arranged outside the furnace, and the air in the furnace is led to the outside of the furnace by a pipeline for heat exchange and then returned. Although the structure has no risk of dripping rosin (soldering flux), the structure is complex and occupies large space; the conveying pipeline is longer, the soldering flux can be condensed and deposited in the pipeline, and the conveying pipeline can be blocked when the soldering flux is not maintained in time, so that the air supply efficiency of the pipeline is low, and the unbalanced airflow of the air duct is easy to generate channeling; the air flow is led out of the furnace, the sealing difficulty is increased, and the like.
Disclosure of Invention
The application provides a PCB board surface dress of effectively preventing solder resist condensation pollution PCB board and furnace pastes welded cooling device.
One embodiment provides a cooling device for surface mount soldering of a PCB board, comprising:
the furnace chamber is internally provided with a closed cavity, the cavity is provided with a baffle plate, the baffle plate divides the cavity into a cooling cavity and a reflux cavity which are mutually independent, the reflux cavity is of an n-type structure and is covered at the upper end of the cooling cavity, and the PCB is positioned in the cooling cavity;
the fan is provided with an air inlet and an air outlet, the air inlet of the fan is positioned at the upper end of the backflow cavity, and the air outlet of the fan extends into the cooling cavity and is positioned above the PCB;
the heat exchanger is provided with an air inlet and an air outlet, is arranged in the cavity of the hearth and positioned below the PCB, the middle part of the heat exchanger is positioned in the cooling cavity, and two ends of the heat exchanger penetrate through the partition plate and are positioned in the backflow cavity; the air inlet of the heat exchanger is positioned at the lower end of the heat exchanger and in the cooling cavity, the air outlet of the heat exchanger is positioned at the two ends of the heat exchanger and in the reflux cavity, and a hot air channel is reserved around the heat exchanger in the cooling cavity;
and a filter installed on the air inlet of the heat exchanger for filtering the flux in the air.
Further, a tunnel cover is arranged in the cooling cavity, two ends of the tunnel cover are connected with the partition plate, two ends of the tunnel cover are communicated with the backflow cavity, the heat exchanger and the filter are arranged in the tunnel cover, a hot air channel is reserved around the tunnel cover, and an opening is formed in the lower end of the tunnel cover.
Further, a cold air duct is arranged between the upper end of the heat exchanger and the tunnel cover.
Further, the upper end of the cooling cavity is provided with a rectifying box for pressurization and rectification, an air outlet of the fan extends into the rectifying box, a primary rectifying plate is arranged on the air outlet of the fan, and a secondary rectifying plate is arranged at the air outlet of the rectifying box.
Further, a recovery groove is arranged at the bottom of the cavity of the hearth, and a waste liquid nozzle for conducting the recovery groove is further arranged at the lower end of the outer side of the hearth.
Further, the recovery tank is arranged obliquely, and the waste liquid nozzle is arranged at the lowest end of the recovery tank.
Further, the fan comprises a double air outlet volute, a wind wheel and a motor, wherein the double air outlet volute is arranged at the upper end of the cooling cavity, an air inlet is formed in the lower end of the double air outlet volute, an air outlet extending into the rectifying box is formed in two sides of the double air outlet volute respectively, the wind wheel is arranged in the double air outlet volute, the motor is arranged at the upper end of the outer side of the hearth, and an output shaft of the motor extends into the cooling cavity to be connected with the wind wheel.
Further, the hearth comprises an upper box body and a lower box body, the upper box body and the lower box body enclose a cavity in the middle, the partition plate is divided into an upper partition plate and a lower partition plate, the upper partition plate is arranged in the upper box body, and the lower partition plate is arranged in the lower box body.
Further, sealing rubber strips are arranged between the upper box body and the lower box body and between the upper partition plate and the lower partition plate.
Further, a sliding rail is arranged in the tunnel cover, the heat exchanger and the filter are arranged on the sliding rail, an opening and a cover plate which is arranged on the opening and is detachable are arranged on the side wall of the lower box body, and the opening is arranged corresponding to the heat exchanger and the filter and is used for taking out the heat exchanger and the filter.
According to the PCB surface mounting and welding cooling device, as the cavity of the hearth is divided into two independent cavities, the fan is located at the upper end, the heat exchanger is located at the lower end, the air inlets and the air outlets of the fan and the heat exchanger are respectively connected with the two independent cavities, so that a hot air downward circulation air duct is formed, hot air with soldering flux can only flow downward, and finally is filtered out by the filter at the air inlet of the heat exchanger, meanwhile, the cooling cavity is located in the backflow cavity, so that hot air with the combustion improver is isolated, the travel is short, the combustion improver can be rapidly filtered out and deposited to the bottom of the hearth, the combustion improver cannot cause large-area condensation pollution, and the cleaning and maintenance are convenient.
Drawings
FIG. 1 is a schematic cross-sectional view of a cooling device for PCB surface mount soldering in one embodiment;
fig. 2 is a schematic longitudinal section of a cooling device for surface mount soldering of a PCB in an embodiment.
Detailed Description
The invention will be described in further detail below with reference to the drawings by means of specific embodiments.
In this embodiment, a cooling device for surface mounting and welding of a PCB is provided, the cooling device is a ring for surface mounting and welding of the whole PCB, and the surface mounting and welding of the PCB is then transferred into the cooling device for cooling. The cooling device is also used for cooling other products.
As shown in fig. 1, the cooling device for surface mounting and welding of the PCB board in this embodiment mainly includes a furnace chamber 1, a fan 2, a heat exchanger 3 and a filter 4.
The hearth 1 comprises an upper box body 11 and a lower box body 12, and when the hearth is cooled, the upper box body 11 and the lower box body 12 are combined and sealed together, and a closed cavity is formed by combining the upper box body 11 and the lower box body 12. The upper partition plate 13 is installed in the upper box body 11, the lower partition plate 14 is installed in the lower box body 12, after the upper box body 11 and the lower box body 12 are combined, the upper partition plate 13 and the lower partition plate 14 are in butt joint, the cavity is divided into two independent cavities, the two independent cavities are a cooling cavity 15 and a backflow cavity 16, and the backflow cavity 16 is of an n-type structure and covers the upper end of the cooling cavity 15.
For better sealing, sealing rubber strips 17 are embedded at the joint of the upper box 11 and the lower box 12 and the joint of the upper partition 13 and the lower partition 14, and the sealing rubber strips 17 seal gaps at the joint to play a role in sealing.
The cooling cavity 15 is used for cooling the PCB 5, the backflow cavity 16 is used for guiding cold air back into the cooling cavity 15, and the PCB 5 is placed in the middle of the cooling cavity 15 through the guide rail.
The fan 2 comprises a double air outlet volute 21, a wind wheel 22 and a motor 23, wherein the double air outlet volute 21 is arranged at the upper end in the upper box 11, namely at the upper end of the backflow cavity 16, the double air outlet volute 21 is provided with an air inlet and two air outlets, the air inlet is positioned at the lower end of the double air outlet volute 21, the two air outlets extend into the cooling cavity 15, and the two air outlets are positioned at the upper end of the PCB 5. The wind wheel 22 is arranged in the double-wind outlet volute 21, the main body of the motor 23 is arranged at the upper end of the outer side of the upper box 11, the output shaft of the motor 23 penetrates through the upper box 11 to extend to be connected with the wind wheel 22, the motor 23 drives the wind wheel 22 to rotate, and cold air in the backflow cavity 16 is blown into the cooling cavity 15 for cooling.
In order to pressurize and rectify the wind blown by the fan 2, a rectifying box 6 is installed at the lower end of the fan 2, namely at the upper end of the cooling cavity 15, two outlets of the fan 2 extend into the rectifying box 6, the rectifying box 6 can replace part of the upper partition plate 13, and the rectifying box 6 separates the upper end cooling cavity 15 and the reflux cavity 16. Be equipped with one-level rectification board 61 and second grade rectification board 62 in the rectifier box 6, one-level rectification board 61 has two, installs respectively on two exports of fan 2, and the exit at rectifier box 6 is installed to second grade rectification board 62, and the two-stage rectification board can be realized pressurizing and rectification the cold air that fan 2 blown out, and the play is blown out again on PCB board 5 for it is more even powerful to blow, has improved the cooling effect.
The heat exchanger 3 is installed in the lower case 12, the middle most part of the heat exchanger 3 is located in the cooling chamber 15, both ends extend into the reflow chamber 16 through the lower partition 14, and the air inlet of the heat exchanger 3 is located at the lower end of the middle part of the heat exchanger 3 in the cooling chamber 15, while the air outlet is located at both ends of the heat exchanger 3 in the reflow chamber 16, that is, the air inlet is located at the lower end of the heat exchanger 3 and is located in the cooling chamber 15, while the air outlet is located at both ends of the heat exchanger 3 and is located in the reflow chamber 16, so that the heat exchanger 3 can suck and cool the hot air of the cooling chamber 15 and then discharge the hot air into the reflow chamber 16. The fan 2 and the heat exchanger 3 are respectively positioned at the upper end and the lower end of the hearth 1, and the air outlet and the air inlet of the fan 2 and the heat exchanger are respectively positioned in different cavities, so that the cooling cavity 15 and the backflow cavity 16 form a circulating air channel.
Because volatilize combustion improver (rosin) in the air after the PCB board 5 welds, in order to prevent that the combustion improver from entering into heat exchanger 3 and backward flow intracavity 16, install filter 4 in the air inlet department of heat exchanger 3, install filter 4 promptly in the lower extreme of heat exchanger 3, filter 4 is the filter screen subassembly, can effectual combustion improver of filtered air.
A tunnel cover 7 is arranged in the lower box body 12, the tunnel cover 7 is arranged between the lower partition plates 14 of the lower box body 12, two ends of the tunnel cover 7 are communicated with the backflow cavity 16, and an opening is formed in the lower end of the tunnel cover 7 and used for air intake. The heat exchanger 3 and the filter 4 are arranged on the tunnel cover 7, the middle part of the heat exchanger 3 is positioned in the tunnel cover 7, the left end and the right end of the heat exchanger extend into the backflow cavity 16, the upper end of the heat exchanger 3 and the tunnel cover 7 have a certain gap, the gap forms a cold air duct, and the cold air duct can drain the air after heat exchange into the backflow cavity 16 from the two ends. The tunnel cover 7 is mounted in a suspended manner, namely, gaps are formed on the upper surface, the lower surface, the front surface and the rear surface of the tunnel cover 7 in the cooling cavity 15, so that the tunnel cover 7, the lower partition 14 and the bottom surface of the lower box 12 enclose a hot air duct, and hot air at the upper end passing through the PCB 5 can be led into the heat exchanger 3 from top to bottom.
For better cleaning and maintenance, the sliding rail 71 is arranged in the tunnel cover 7, the heat exchanger 3 and the filter 4 are arranged on the sliding rail 71, an opening is formed in the side face of the lower box body 12, the opening is arranged corresponding to the heat exchanger 3 and the filter 4 and is larger than the sum of the sections of the heat exchanger 3 and the filter 4, the heat exchanger 3 and the filter 4 can penetrate through the opening, the detachable cover plate 121 is further arranged on the opening, when cleaning and maintenance are needed, the cover plate 121 can be opened, the heat exchanger 3 and the filter 4 are pulled out along the sliding rail 71, the heat exchanger 3 and the filter 4 can be cleaned and maintained independently, and cleaning and maintenance of the inside of the lower box body 12 are also facilitated.
In order to collect the filtered and condensed combustion improver conveniently, a recovery tank 18 is arranged on the bottom plate of the lower box body 12, the recovery tank 18 is inclined, a through hole is arranged at the inclined bottom of the recovery tank 18, a waste liquid nozzle 19 is arranged at the through hole on the outer side of the lower box body 12, the waste liquid nozzle 19 is communicated with the inner side and the outer side of the lower box body 12, and the combustion improver in the recovery tank 18 can be discharged.
The cooling device for surface mounting and welding of the PCB in the embodiment has the following working principle: the fan 2 blows cold air in the reflux cavity 16 into the cooling cavity 15 from the upper end, the blown cold air is pressurized and rectified through the rectifying box 6, then blown onto the PCB 5, the cold air passing through the PCB takes away heat on the PCB and the volatilized combustion improver mixed with the heat on the PCB to become hot air, the hot air enters the heat exchanger 3 from the air inlet at the lower end of the heat exchanger 3 along the hot air channel from top to bottom, the hot air passes through the filter 4 before entering, the combustion improver in the hot air is filtered by the filter 4 and condensed and falls into the recovery groove 18, the hot air without the combustion improver becomes cold air after passing through the heat exchanger 3, the cold air is led into the reflux cavity 16 from two sides of the cold air channel at the upper end of the heat exchanger 3, and the cold air finally enters the air inlet of the fan 2 at the upper end from bottom to top to form a circulation.
According to the cooling device for surface-mounted welding of the PCB, the cavity of the hearth 1 is divided into two independent cavities, the fan 2 is located at the upper end, the heat exchanger 3 is located at the lower end, the air inlets and the air outlets of the fan 2 and the heat exchanger 3 are respectively connected with the two independent cavities, so that a hot air downward circulation duct is formed, cold air upward circulation duct is formed, hot air with soldering flux can only flow downward and is filtered out by the filter 4 at the air inlet of the heat exchanger 3, meanwhile, the cooling cavity is located in the backflow cavity, hot air with the combustion improver is isolated, the travel is short, the combustion improver can be rapidly filtered out and deposited to the bottom of the hearth 1, the combustion improver cannot cause large-area condensation pollution, cleaning and maintenance are facilitated, the cooling device is compact in structure, and the use space is saved.
The foregoing description of the invention has been presented for purposes of illustration and description, and is not intended to be limiting. Several simple deductions, modifications or substitutions may also be made by a person skilled in the art to which the invention pertains, based on the idea of the invention.
Claims (10)
1. A PCB board surface dress pastes welded cooling device, its characterized in that includes:
the furnace chamber is internally provided with a closed cavity, the cavity is provided with a baffle plate, the baffle plate divides the cavity into a cooling cavity and a reflux cavity which are mutually independent, the reflux cavity is of an n-type structure and is covered at the upper end of the cooling cavity, and the PCB is positioned in the cooling cavity;
the air inlet of the fan is positioned at the upper end of the backflow cavity, and the air outlet of the fan extends into the cooling cavity and is positioned above the PCB;
the heat exchanger is provided with an air inlet and an air outlet, is arranged in the cavity of the hearth and positioned below the PCB, the middle part of the heat exchanger is positioned in the cooling cavity, and two ends of the heat exchanger penetrate through the partition plate and are positioned in the backflow cavity; the air inlet of the heat exchanger is positioned at the lower end of the heat exchanger and in the cooling cavity, the air outlet of the heat exchanger is positioned at the two ends of the heat exchanger and in the reflux cavity, and hot air channels are reserved around the heat exchanger in the cooling cavity;
and a filter installed on the air inlet of the heat exchanger for filtering the flux in the air.
2. The cooling device for surface mount soldering of a PCB board according to claim 1, wherein a tunnel cover is installed in the cooling cavity, two ends of the tunnel cover are connected with the partition board, two ends of the tunnel cover are communicated with the reflow cavity, the heat exchanger and the filter are installed in the tunnel cover, a hot air duct is reserved around the tunnel cover, and an opening is provided at the lower end of the tunnel cover.
3. The cooling device for surface mount soldering of a PCB of claim 2, wherein a cool air duct is provided between the upper end of the heat exchanger and the tunnel cover.
4. The cooling device for surface mount soldering of a PCB board according to claim 3, wherein a rectifying box for pressurizing and rectifying is provided at an upper end of the cooling chamber, an air outlet of the fan extends into the rectifying box, a primary rectifying plate is installed at an air outlet of the fan, and a secondary rectifying plate is installed at an air outlet of the rectifying box.
5. The cooling device for surface mount soldering of a PCB of claim 4, wherein a recycling groove is provided at a bottom of the cavity of the furnace, and a waste liquid nozzle for conducting the recycling groove is further provided at a lower end of an outside of the furnace.
6. The cooling device for surface mount soldering of a PCB of claim 5, wherein the recovery tank is disposed obliquely, and the waste nozzle is disposed at a position of a lowermost end of the recovery tank.
7. The cooling device for surface mount welding of a PCB of claim 6, wherein the fan comprises a double air outlet volute, a wind wheel and a motor, the double air outlet volute is mounted at the upper end of the cooling cavity, an air inlet is formed in the lower end of the double air outlet volute, an air outlet extending into the rectifying box is formed in two sides of the double air outlet volute, the wind wheel is mounted in the double air outlet volute, the motor is mounted at the upper end of the outer side of the hearth, and an output shaft of the motor extends into the cooling cavity to be connected with the wind wheel.
8. The cooling device for surface mount soldering of a PCB of claim 7, wherein the furnace comprises an upper case and a lower case, the upper case and the lower case enclose the cavity therebetween, the partition is divided into an upper partition and a lower partition, the upper partition is installed in the upper case, and the lower partition is installed in the lower case.
9. The cooling device for surface mount soldering of a PCB of claim 8, wherein sealing strips are provided between the upper case and the lower case and between the upper partition and the lower partition.
10. The cooling device for surface mounting and welding of a PCB board according to claim 9, wherein a slide rail is provided in the tunnel cover, the heat exchanger and the filter are mounted on the slide rail, an opening is provided on a side wall of the lower case and a cover plate detachably mounted on the opening is provided, and the opening is disposed corresponding to the heat exchanger and the filter, and is used for taking out the heat exchanger and the filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611154151.8A CN106793563B (en) | 2016-12-14 | 2016-12-14 | Cooling device for surface mounting and welding of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611154151.8A CN106793563B (en) | 2016-12-14 | 2016-12-14 | Cooling device for surface mounting and welding of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793563A CN106793563A (en) | 2017-05-31 |
| CN106793563B true CN106793563B (en) | 2023-07-28 |
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ID=58888663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611154151.8A Active CN106793563B (en) | 2016-12-14 | 2016-12-14 | Cooling device for surface mounting and welding of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793563B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11865645B2 (en) | 2020-11-12 | 2024-01-09 | Senju Metal Industry Co., Ltd. | Soldering apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003181682A (en) * | 2001-12-20 | 2003-07-02 | Tamura Seisakusho Co Ltd | Cooling device for soldering |
| CN2819719Y (en) * | 2005-08-04 | 2006-09-20 | 日东电子科技(深圳)有限公司 | Boosted air cooler |
| CN103074480A (en) * | 2011-10-26 | 2013-05-01 | 苏州新长光热能科技有限公司 | Controllable internal circulation cooling system used in heat treatment furnace |
| CN206260154U (en) * | 2016-12-14 | 2017-06-16 | 深圳市新迪精密科技有限公司 | The cooling device of the surface mounted welding of pcb board |
-
2016
- 2016-12-14 CN CN201611154151.8A patent/CN106793563B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003181682A (en) * | 2001-12-20 | 2003-07-02 | Tamura Seisakusho Co Ltd | Cooling device for soldering |
| CN2819719Y (en) * | 2005-08-04 | 2006-09-20 | 日东电子科技(深圳)有限公司 | Boosted air cooler |
| CN103074480A (en) * | 2011-10-26 | 2013-05-01 | 苏州新长光热能科技有限公司 | Controllable internal circulation cooling system used in heat treatment furnace |
| CN206260154U (en) * | 2016-12-14 | 2017-06-16 | 深圳市新迪精密科技有限公司 | The cooling device of the surface mounted welding of pcb board |
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| CN106793563A (en) | 2017-05-31 |
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